201217094 六、發明說明： 【發明所屬之技術領域】 本發明係有關雷射割斷震置。 【先前技術】 以在，玻璃基板4脆性材料基板係例如藉由以下方法 割斷。首先，將切刀輪（cutter wheel)等一邊壓接於基板 一邊並使其轉動’從而於基板形成由垂直裂紋（crack)構成 之刻劃線（s c r i b e 1 i n e )。其後沿著刻劃線，對基板於垂直 方向施加外力。藉此，沿刻劃線割斷基板。 如同以上，使用切刀輪對脆性基板材料形成刻劃線 時，因對脆性材料基板賦予機械性的應力，使基板容易產 生缺陷。因此，於施加外力割斷基板之際，有起因於缺陷 而產生破損等情況。 因此，近年來，使用雷射割斷脆性材料基板的方法已 被實際應用。在此方法中，雷射光束（laser beam)照射於 基板，而將基板加熱至不到熔化溫度。其後，藉由冷卻介 質冷卻基板，並藉此於基板產生熱應力。藉由此熱應力由 基板表面於大致垂直方向形成裂紋（以下，會有記載為「垂 直裂紋」之情況）。在此種使用雷射光束之脆性材料基板的 割斷方法中，因利用熱應力，故工具不直接接觸基板。因 此，基板之割斷面成為缺損少之平滑面，而維持基板之強 度。 在如同以上之雷射割斷方法中，為了要加深垂直裂 紋，而有加大雷射光束的照射輸出、或放慢掃描速度的必 323385 4 201217094 要。但是，若加大雷射光束的照射輸出，則會於基板表面 產生因加熱而造成的損傷。而且，若放慢雷射光束的掃描 速度，則加工效率會降低。 因此便有一種技術提案，使基板彎曲，並在該狀態下 照射雷射而加深垂直裂紋。例如在專利文獻1中，藉由在 平台（stage)上將基板吸著固定而使基板彎曲。而且在專利 文獻2中，使支持構件的高度改變，並藉由自體重量使基 板·彎曲。 [先前技術文獻] (專利文獻） [專利文獻1]日本特開平7 — 323384號公報 [專利文獻2]日本特開2007— 191363號公報 【發明内容】 (發明所欲解決之課題） 在揭不於專利文獻1之方法中，因將基板保持在成形 有預定高度之突條或預定之曲面的平台上，故若要使基板 幫曲成期望之形狀，有必要使用對應錄板之曲面狀態的 平台。再加上，在基板厚的情況’會有基板無法充分彎曲， 基板固定於平台之虞。而且，在專利文獻2的方 有在基板厚的情況，基板不會因自體重量而充分 彎曲之虞。 1本Γ目的係為提供一種雷射割斷裝置’即使在不 父奥工作台（table)’且基板厚的情况，亦能將基板彎曲成 預期之形狀，且能予以固定。 323385 5 201217094 (解決課題之手段） 有關第1發明之雷射割斷裝置，係為沿著脆性材料基 板的H預&線照射雷射光束，而|彳斷脆性基板材料的裝 置並八備載置脆性材料基板的工作台、基板手段、按壓 手段^射照料段與冷卻手段。基㈣持手段係將載置 於工作台之紐材料基板的關預定線兩側按壓於工作台， 並將脆丨生材料基板保持於工作台上。按壓手段係從雷射光 束照射方向之相反側按壓包含_預定線的脆性材料基板 之-部分’使基板的__部分彎曲。雷射照射手段係沿著刻 劃預定線㈣射光束關㈣性㈣基板，而將脆性材料 基板加熱至不到熔化溫度。冷卻手段係對以雷射照射手段 加熱過之脆性材料基板，喷附冷卻媒介使其冷卻，並藉由 產生於脆性材料基板的熱應力，沿著刻劃預定線形成垂直 裂紋。 有關第2發明之雷射割斷裝置，係在第1發明中，按 壓手段具有沿著刻劃預定線延伸之按壓構件。按壓構件在 由工作台的基板栽置面朝向基板之雷射照射面側突出之突 出位置、與由基板載置面朝向基板之雷射照射面的相反側 沉入之沉入位置之間自由移動，在移動到突出位置時，使 脆性基板材料的包含刻劃預定線的一部分f曲。 有關第3發明之雷射割斷裝置，係在第2發明之裝置 中’工作台具有：第1載置部，支持脆性材料基板之刻劃 預定線的一側；以及第2載置部，與第丨载置部間隔一個 空間而配置，並將脆性材料基板之刻劃預定線的另一側予 323385 6 201217094 :=的3 :按壓構件係配置於第1载置部與第2载置 有=4發明的雷射割斷裝置，係在第 中’工作台具有.笛 κ衣置 預定線的—側；以支持紐材料基板之刻劃 ^ , ^ g » 載置部’與第1載置部間隔-個 7 H ’、支持脆性材料基板之刻劃預定線的另一側。 :載=件係隔著配置於工作台的脆性材料基板二 ，、第2載置部之間的空間相對向。 有關第5發明的雷射割斷裝置，係在由第2至第4發 I: ^置中’按壓構件係能獲得由卫作台的基板載置 土！之雷射照設面側突出達第1量之第1突出位置， 與犬出達較第1量大之第2量之第2突出位置。 有關第6發明的雷射割斷裝置，係在由第i到第5發 月的裝置中，復於卫作台具備用以固定脆性材料構件之吸 引固定手段。 (發明效果） 在有關本發明之雷射割斷裝置中，因在以基板保持手 ，將基板保持於工作台上之狀態下，藉由按壓手段使基板 考故即使在不交換工作台且基板厚的情況，亦能使基 板脅曲達期望之量。然後藉由對彎曲狀態的基板照射雷射 光束，而能於基板形成深的垂直裂紋。 【實施方式】 (實施方式1) 以下’雖就本發明之—實施方式之雷射割斷裝置進行 7 323385 201217094 第1圖俜ϋΓ 於此等實施方式者。 明之—實施方式的雷射割斷裝置之 概略構成。在此圖之雷射裝置中，在 定脆性材—㈣為「基板」之情H固 工作台11係具有左右2個载置Wla、llb，第 置部na係設置為於左右方向自由移動。而且，各載2 11a、lib之表面形成複數個吸氣孔（吸著固定手段， 等複數個吸氣孔14連結於真线浦ρβ藉由驅動真空 Ρ吸引空氣，而將基板50吸著固定於工作台丨丨上。工作 台η之中央部，亦即u載置部lla與第°2載置部吡 之間’在相對於紙面的垂直方向（前後方向），長棒狀構件 (按壓構件）12係設置成在由玉作台^突出之位置與沉入 於工作台11的位置之間移動自如。若棒狀構件12由工作 桌11向突出位置移動，則基板50之雷射光束⑶照射面側 以成為凸的方式被彎曲。關於此，將在後段詳述。 於工作台11的上方，以與工作台u分離且相對向的 方式’設置有支持台31。在支持台31，於前後方向排列而 設有用以於基板50之表面形成觸發裂紋（trigger crack) 的切刀輪（不圖示）、用以使雷射光束LB照射至基板50的 開口、與用以冷卻基板50的表面之冷卻嘴（n〇zzie)37(圖 示於第4圖）。 切刀輪係能昇降於壓接於基板50之位置與非接觸之 位置間，且僅在將成為刻劃線之開始起點的觸發裂紋予以 形成時，才下降至壓接基板50之位置。關於觸發裂紋之形 8 323385 201217094201217094 VI. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to a laser cut-off. [Prior Art] The glass substrate 4 brittle material substrate is cut by, for example, the following method. First, a cutter wheel or the like is pressed against the substrate and rotated to form a scribe line (s c r i b e 1 i n e ) formed of a vertical crack on the substrate. Thereafter, an external force is applied to the substrate in the vertical direction along the scribe line. Thereby, the substrate is cut along the score line. As described above, when the brittle substrate material is scored with a cutter wheel, mechanical stress is applied to the brittle material substrate, and the substrate is liable to cause defects. Therefore, when an external force is applied to cut the substrate, damage may occur due to defects. Therefore, in recent years, a method of cutting a brittle material substrate by laser has been put to practical use. In this method, a laser beam is irradiated onto the substrate, and the substrate is heated to a temperature below the melting temperature. Thereafter, the substrate is cooled by the cooling medium, and thereby thermal stress is generated in the substrate. The thermal stress causes cracks to form in the substantially vertical direction from the surface of the substrate (hereinafter, there is a case where it is described as "vertical crack"). In such a cutting method of a brittle material substrate using a laser beam, since the thermal stress is utilized, the tool does not directly contact the substrate. Therefore, the cut surface of the substrate becomes a smooth surface with less defects, and the strength of the substrate is maintained. In the laser cutting method like the above, in order to deepen the vertical crack, the irradiation output of the laser beam is increased, or the scanning speed is slowed down. However, if the irradiation output of the laser beam is increased, damage due to heating occurs on the surface of the substrate. Moreover, if the scanning speed of the laser beam is slowed down, the processing efficiency is lowered. Therefore, there is a technical proposal to bend the substrate and irradiate the laser in this state to deepen the vertical crack. For example, in Patent Document 1, the substrate is bent by absorbing and fixing the substrate on a stage. Further, in Patent Document 2, the height of the supporting member is changed, and the substrate is bent by the weight of the body. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. In the method of Patent Document 1, since the substrate is held on a platform formed with a protrusion of a predetermined height or a predetermined curved surface, it is necessary to use the curved state of the corresponding recording plate in order to bend the substrate into a desired shape. platform. Further, in the case where the substrate is thick, the substrate may not be sufficiently bent, and the substrate is fixed to the top of the stage. Further, in Patent Document 2, when the substrate is thick, the substrate is not sufficiently bent by the weight of the body. One object of the present invention is to provide a laser cutting device which can bend a substrate into a desired shape and can be fixed even when the substrate is thick and does not have a thick substrate. 323385 5 201217094 (Means for Solving the Problem) The laser cutting device according to the first aspect of the invention is a device for irradiating a laser beam along a H pre-amplifier line of a brittle material substrate, and a device for breaking a brittle substrate material. The table, the substrate means, the pressing means, the irradiation section and the cooling means for the brittle material substrate. The base (4) holding means presses the two sides of the predetermined line of the material substrate placed on the table to the table, and holds the substrate of the brittle raw material on the table. The pressing means presses a portion - of the brittle material substrate including the predetermined line from the opposite side of the laser beam irradiation direction to bend the __ portion of the substrate. The laser irradiation means irradiates the (four) (four) substrate along the scribed line (4), and heats the brittle material substrate to less than the melting temperature. The cooling means cools the substrate of the brittle material heated by the laser irradiation means, sprays the cooling medium to cool it, and forms a vertical crack along the predetermined line by the thermal stress generated on the substrate of the brittle material. According to a first aspect of the invention, in the laser cutting device of the second aspect of the invention, the pressing means has a pressing member extending along a line to be scribed. The pressing member is freely movable between a protruding position that protrudes toward the laser irradiation surface side of the substrate from the substrate mounting surface of the table, and a sinking position that is sunk on the opposite side of the laser irradiation surface from the substrate mounting surface toward the substrate. When moving to the protruding position, a part of the fragile substrate material including the predetermined line of scribed is curved. According to a third aspect of the invention, in the apparatus of the second aspect of the invention, the apparatus includes: a first mounting portion, a side supporting a predetermined line of the brittle material substrate; and a second mounting portion; The second mounting portion is disposed with one space therebetween, and the other side of the predetermined line of the brittle material substrate is 323385 6 201217094 := 3 : The pressing member is disposed on the first mounting portion and the second mounting portion =4 Invented laser cutting device, which is on the side of the middle 'workbench with a predetermined line of flute κ clothes; to support the marking of the material substrate ^ , ^ g » the mounting portion 'and the first mounting Part spacing - 7 H ', supporting the other side of the scribed line of the brittle material substrate. The load-bearing member is opposed to the space between the second placing portions via the brittle material substrate 2 disposed on the table. In the laser cutting device according to the fifth aspect of the invention, the substrate is placed on the substrate of the guard table by the second to the fourth ones. The laser irradiation surface side protrudes to the first protruding position of the first amount, and the second protruding position of the second amount larger than the first amount is generated with the dog. The laser cutting device according to the sixth aspect of the invention is characterized in that, in the apparatus from the i-th to the fifth month, the washing machine is provided with an suction fixing means for fixing the brittle material member. (Effect of the Invention) In the laser cutting device according to the present invention, in the state in which the substrate is held by the substrate and the substrate is held on the table, the substrate is taken up by the pressing means even if the table is not exchanged and the substrate is thick. In the case of the substrate, the substrate can be shaken up to the desired amount. Then, by irradiating the laser beam to the substrate in a curved state, a deep vertical crack can be formed on the substrate. [Embodiment] (Embodiment 1) Hereinafter, the laser cutting device according to the embodiment of the present invention is carried out in the manner of 7 323 385 201217094, the first embodiment. A schematic configuration of a laser cutting device of the embodiment. In the laser apparatus of the figure, in the case where the constant brittle material - (4) is the "substrate", the H-solid table 11 has two left and right mountings Wla and 11b, and the first portion na is provided to be freely movable in the left-right direction. Further, a plurality of suction holes are formed on the surfaces of the respective carriers 2 11a and lib (the suction fixing means, and the plurality of suction holes 14 are connected to the true line ρβ to suck the air by driving the vacuum, thereby absorbing and fixing the substrate 50. On the table 。. The central portion of the table η, that is, between the u placement portion 11a and the θ2 placement portion, is in the vertical direction (front-rear direction) with respect to the paper surface, and the long rod-shaped member (presses The member 12 is arranged to be movable between a position protruding from the jade table and a position sunk on the table 11. If the rod member 12 is moved from the work table 11 to the protruding position, the laser beam of the substrate 50 (3) The irradiation surface side is curved so as to be convex. This will be described in detail later. The support table 31 is provided on the upper side of the table 11 so as to be separated from the table u. Arranged in the front-rear direction, a cutter wheel (not shown) for forming a trigger crack on the surface of the substrate 50, an opening for irradiating the laser beam LB to the substrate 50, and a substrate for cooling the substrate are provided. 50 surface cooling nozzle (n〇zzie) 37 (illustrated in Fig. 4) The cutter wheel train can be raised and lowered between the position where it is pressed against the substrate 50 and the non-contact position, and only when the trigger crack which will become the starting point of the score line is formed, it is lowered to the crimp substrate. Position of 50. About the shape of the trigger crack 8 323385 201217094
Ml m卩㈣觸發裂紋朝向無法 ::先行現象，一 5〇-表面侧4:::: 由雷射輸出裝置34所射出之雷射光束 射鏡片（时咖）44向下方反射，透過不圖’係藉由反 由形成於支持台31的開π照射至固定於乍^系統， 板50。 乍台11上的基 而且’冷卻嘴37係設置於支持台31中 射出m料冷㈣介的水係光束LB 卻嘴37朝向基板50喷出。冷卻媒介所喷出^一同由此冷 位置’係在刻劃預定線51上且在雷射光束lb，上的 的後側（參考第4圖）。 之照射區域 於支持台31之左右方向兩側，設置有沿前大 之長方體狀保持構件13a、13b。此等保持構件向細長 係藉由不圖示之驅動手段而於左右方向及上a、13b’ 動如同後述，當基板50固定於工作台π時°由移 構件作為中心，按壓基板5()的左右兩側:_棒狀 於工作台11的上方設置有一對電荷耦合元件（ch打狀 Coupled Device ;簡稱⑽相機38、39，以辨識預先刻印 於基板50上的對位標記（ai丨叩脱以贴以）。藉由此等ccd 相機38、39，以令基板50的刻劃預定線51 (圖示於第4 圖）與棒狀構件12在平面觀視為重 疊的方式惨正位置。具 體而言’藉由CCD相機38、39檢測出安裝時之基板5〇的 位置偏移，例如基板50偏移角度0的情況，使工作台^ 9 323385 201217094 旋轉達一0，基板50偏移γ時，使工作台u移動達—γ。 第2圖及第3圖係顯示使用此種構成之割斷裝置割斷 基板50之情況的工程圖。再者，關於使基板5〇吸著固定 於工作台11的吸著固定手段及雷射光束照射手段、冷卻手 段，為了使圖面簡潔，係由此等圖省略。 首先，將基板50載置於工作台11上，並趨動真空i 浦P(圖示於第1圖），藉由吸氣孔14(圖示於第丨圖）將基 板50吸著固定於工作台丨丨。而後，藉由CCD相機38、39 拍攝设於基板50的對位標記，如同前述，基於拍攝資料， 使工作台11移動以使基板5 〇的刻劃預定線51 (圖示於第4 圖）與棒狀構件12在平面觀視為重疊，而將基板50定位於 預定的位置（第2圖（a))。 接著將保持構件13a、13b往中央部移動後’使其下 降，將基板50按壓固定於工作台丨丨（同圖（b))。保持構件 13a ' 13b所進行之基板5〇的按壓固定之蘀度，係以藉由 感測器（sensor)偵測而成為預定之按壓力的方式進行控制 較為理想。而且’保持構件13a、13b固定基板50的位置， 係可根據基板50的材質及厚度等適當決定’惟較為理想的 是設定成藉由棒狀構件12的突出而彎曲基板50之際，基 板50的曲率半徑成為4000mm以下。因此，棒狀構件12 的突出量為5mm以下之範圍的情況，由棒狀構件12到保持 構件13a 13b為止之距離l宜設定為1〇〇娜以上30〇咖 以下。而且，保持構件13a、13b雖以按壓基板的前後 方向之整體較為理想，惟亦可於前後方向以預定間隔按壓 10 323385 201217094 基板50。 而後，使棒狀構件12移位至由工作台u突出之第i 突出位置。藉此，使基板50彎曲（同圖（〇)。以棒狀構件 12的突出量而言，如同前述，較為理想的是設定為使基板 50彎曲之際，基板50的曲率半徑成為4〇〇〇mffl以下，通常 為0· 1mm至5mm之範圍。 接著，如同前述，藉由切刀輪於基板5〇形成觸發裂 紋。而後，由雷射輸出裝置34射出雷射光束lb(同圖（〇〇)。 雷射光束LB係藉由反射鏡片44’如同第4圖所示，大致 垂直地照射於基板50表面。而且，同時地於雷射光束照射 區域之後端附近，由冷卻嘴37喷出水作為冷卻媒介。藉由 將雷射光束LB照射於基板50，基板50於厚度方向被加熱 至不到熔化溫度，基板50雖欲熱膨脹，惟因局部加熱之故 無法膨脹，而以照射點為中心產生壓縮應力。於加熱瞬後， 基板50之表面藉由水被冷卻，藉此令基板5〇收縮而產生 拉伸應力。藉由此拉伸應力之作用，以觸發裂紋作為開始 點，沿著刻劃預定線51 ’於基板50形成垂直裂紋53。再 加上，在本震置中，因於基板50的雷射光束照射面側，附 加有因基板50之彎曲導致之拉伸張力，故垂直裂紋53形 成為較通常為深，視情況不同，垂直裂紋5〇會延伸至基板 50的反對面側。 而後’藉由將雷射光束LB及冷卻嘴37沿著刻劃預定 線51於前後方向相對性地移動，使垂直裂紋53於前後方 向進展，並於基板50形成刻劃線52。 323385 201217094 以此處使用之雷射光束LB而言’並無特別限〜， 基板之材質及厚度、所欲形成之垂直裂紋的深度等依據 定即可。當脆性材料基板為玻璃基板的情況，適當決 玻璃基板表面的吸收大之波長9至丨丨以m的雷使用在 此種雷射光束而言，可舉例二氧化碳雷射丨&“束。以 雷射光束的照射點之形狀而言，以在雷射光束。以 方向為細長之橢圓形較為理想，以相對移動方^目對移動 度為10至60mm的範圍，照射寬度為1 °之照射長 適當。 则1之範圍較為 嘴37喷出之冷卻媒介而言，可舉例水或酒精 Ulc〇h〇l)4。而且，在不會對使用割斷 之基板条括八Χη 軍射光束所加熱 水-同噴射之所謂水喷注(Wa ( 二)二 而且冷左右的圓形或_形較為理想。 動方向後方°= 射光束所導致^熱區域之相對移 的輯成為數：域與力1區域之中心點間 特別限根卩嘴37的相對移動速度而言並無 一般而言，彳mi纽㈣❹適#決定即可。 通常，::==?靡越深。 323385 \7 201217094 接著，使棒狀構件12更突出至第2突出 (e))藉此’形成於基板5〇的垂直裂紋53 某 請之反對面’以將基板5。割斷。再者，在 光束LB的照射而形成垂直裂紋旧的前步驟中垂 板5g的反對面側之情況’不需要此_示 展复美;^η構件12的突出量只要是能使垂直裂紋53進 展至土板50之反對面侧者則並無特別限定，通常以 突出位置算起〇.lmn^lmm左右之突出量便足夠。再者， 在將棒狀構件12由第i突出位置移位至第2移動位置之 可同時使棒狀構件12的後方向兩端同時突出，亦可如 第5圖所示，先使棒狀構件12的前後方向一方端側先突 出，而延遲突出另一方端側 當基板50的割斷完成時，一方之保持構件13a上昇， 而解除基板50a的按壓，且第i載置部…盘美板服一 同朝向遠離棒狀構件12的方向移動(第3圖⑴土)。藉此被 :離被割斷為2個的基板5〇a、5〇b’而防止割斷面二缺損 =生。接著’棒狀構件12由第2突出位置朝向沉入位置 圖(g))。再者’第3圖⑴及同圖ω所示之步驟， 亦可同時進行。 / 第1載置部lia㈣著固定，並將基板德 ==(「_))。接著，保持構…昇而 解除基板50b的按壓’並且解除笛 今而你Z栽置部lib的吸著固 疋。而後，基板50b移動越過棒狀 重覆進行前述-連串之麟處裡。 達至]預疋距離 323385 13 201217094 對於作為有關本發明之雷射割斷裝置的脆性基板材料 50，並無特別限定，可舉例玻璃、陶究（ceram j c)、發、藍 寶石（sapphire)等以牲周知之脆性材料基板。本發明特別 有用於此等之中表面壓縮應力大、劃線困難之化學強化坡 璃及風冷強化玻璃等強化玻璃基板之割斷。而且，以本發 明之雷射割斷裝置能割斷之脆性材料基板5〇的厚度而 言，雖因脆性材料基板50的材質等而相異，惟於脆性材料 基板50為玻璃基板的情況’大體上能達到2mm左右的厚度。 第6圖係為顯示有關本發明之雷射割斷裝置之其他實 施方式。顯示於此圖之雷射割斷裝置與前述之實施方式的 裝置之不同點，在於棒狀構件12係按壓基板5〇之與保持 構件13a、13b所按壓的面為相同之面而彎曲基板5〇之點， 及基板50之由工作台側照射雷射光束LB之點。以下，關 於使用此裝置之基板5G的割斷程序，主要就與前述實施方 式之裝置的不同點予以概略說明。 首先將基板50吸著固定於工作台5〇(第6圖⑷）。 而後’移動保持構件13a、13b，並以棒狀構件12為中心， 縣板5〇之兩側以保持構件…、咖按壓固定（同圖叫 接著使棒狀構件12下降，並使基板5〇彎曲（同圖⑹）。 :由工：台u之表面往下方之棒狀構件12的突出量而 e，此處亦例示與前述相同之範圍。 妨接Γ 士如同則述’藉由切刀輪於基板5〇形成觸發裂 而4雷射輸出裝置34射出雷射光束LB(同圖（d))。 而且，同時於雷射光束照射區域之後端附近 ，由冷卻 323385 201217094 嘴37(圖示於第4圖）喷出水作為冷卻媒介，沿著刻劃預定 線51(圖示於第4圖），於基板50形成垂直裂紋。在此實 施方式之裝置中，因亦於基板50之雷射光束照射面側附加 因基板50之彎曲導致之拉伸應力，故垂直裂紋53形成為 較通常深。以下，亦在此實施方式之裝置進行與第3圖所 示之處理步驟相同之處理。 (產業上之可利用性） 有關本發明之雷射割斷裝置，因係在基板被保持於工 作台之後，使基板彎曲，故即使在不交換工作台且基板厚 的情況，亦能使基板彎曲為期望之形狀。而後藉由對處於 已彎曲狀態之基板照射雷射光束，能將深的垂直裂紋形成 於基板，而為有用者。 【圖式簡單說明】 第1圖係為顯示有關本發明之雷射割斷裝置之一實施 方式的概略說明圖。 第2圖（a)至（d)係為使用第1圖之雷射割斷裝置以割 斷基板之情況的步驟圖。 第3圖（e)至（h)係為使用第1圖之雷射割斷裝置以割 斷基板之情況的步驟圖。 第4圖係為說明雷射刻劃之操作狀態的斜視圖。 第5圖（a)至（c)係為棒狀構件由第1突出位置移動至 第2突出位置之際之移動狀態之說明圖。 第6圖（a)至（d)係為使用有關本發明之其他雷射割斷 裝置以割斷基板的情況之步驟圖。 15 323385 201217094 【主要元件符號說明】 11 工作台 11a 第1載置部 lib 第2載置部 12 按壓構件 13a、13b 保持構件 14 吸氣孔 31 支持台 34 雷射輸出裝置 37 冷卻嘴 38、39 CCD相機 44 反射鏡片 50 脆性材料基板 51 刻劃預定線 52 刻劃線 53 垂直裂紋 LB 雷射光束 P 真空泵浦 16 323385Ml m卩(4) Trigger crack orientation cannot:: First phenomenon, one 5〇-surface side 4:::: The laser beam emitted by the laser output device 34 is reflected downward, and the reflection is not shown. 'The illumination is fixed to the 系统^ system, the plate 50 by the opening π formed on the support table 31. The base on the platform 11 and the 'cooling nozzle 37' are disposed in the support table 31 to emit a water-cooled light beam LB, but the nozzle 37 is ejected toward the substrate 50. The cooling medium is ejected together with the cold position 'on the scoring line 51 and on the rear side of the laser beam lb (refer to Fig. 4). The irradiation area is provided on the both sides of the support table 31 in the left-right direction, and the rectangular parallelepiped holding members 13a and 13b are provided along the front. The holding members are moved to the elongated direction in the left-right direction and the upper a, 13b' by a driving means (not shown) as will be described later. When the substrate 50 is fixed to the table π, the substrate 5 is pressed by the moving member as the center. Left and right sides: _ rods are arranged above the table 11 with a pair of charge coupled components (ch-shaped Coupled Device; referred to as (10) cameras 38, 39 to identify the alignment mark pre-marked on the substrate 50 (ai丨叩By the ccd camera 38, 39, the scribe line 51 (shown in Fig. 4) of the substrate 50 and the rod member 12 are considered to be overlapped in a plan view. Specifically, the positional deviation of the substrate 5〇 at the time of mounting is detected by the CCD cameras 38 and 39. For example, when the substrate 50 is offset by an angle of 0, the table 0 323385 201217094 is rotated by one to zero, and the substrate 50 is biased. When γ is shifted, the table u is moved up to γ. Fig. 2 and Fig. 3 are views showing a state in which the substrate 50 is cut by the cutting device having such a configuration. Further, the substrate 5 is sucked and fixed to Suction fixing means of the table 11, laser beam irradiation means, cooling In order to make the drawing simple, it is omitted from the drawings. First, the substrate 50 is placed on the table 11, and the vacuum pump P (shown in Fig. 1) is driven by the suction hole 14 (The figure is shown in the figure) The substrate 50 is affixed and fixed to the table 丨丨. Then, the alignment marks provided on the substrate 50 are taken by the CCD cameras 38 and 39, and the table 11 is made based on the photographing data as described above. The substrate 50 is moved to a predetermined position (Fig. 2(a)) by moving so that the scribe line 51 (shown in Fig. 4) of the substrate 5 is overlapped with the rod member 12 in plan view. Next, after the holding members 13a and 13b are moved to the center portion, the lowering is performed, and the substrate 50 is pressed and fixed to the table 丨丨 (Fig. (b)). The pressing of the substrate 5 is performed by the holding members 13a' 13b. The degree of twist is preferably controlled by a sensor to be a predetermined pressing force, and the position of the holding member 13a, 13b to fix the substrate 50 can be determined according to the material and thickness of the substrate 50. And so on, it is preferable to set it to be protruded by the rod member 12 In the curved substrate 50, the radius of curvature of the substrate 50 is 4000 mm or less. Therefore, when the protruding amount of the rod-shaped member 12 is in the range of 5 mm or less, the distance l from the rod-shaped member 12 to the holding member 13a 13b is preferably set to 1. Further, it is preferable that the holding members 13a and 13b are integrally pressed in the front-rear direction of the pressing board, but the 10 323385 201217094 substrate 50 may be pressed at a predetermined interval in the front-rear direction. Then, the rod-shaped member is made. 12 is shifted to the i-th protruding position highlighted by the table u. Thereby, the substrate 50 is bent (the same as the drawing). In terms of the amount of protrusion of the rod-shaped member 12, as described above, it is preferable to set the radius of curvature of the substrate 50 to 4 when the substrate 50 is bent. 〇mffl or less, usually in the range of 0·1 mm to 5 mm. Next, as described above, a trigger crack is formed on the substrate 5 by the cutter wheel. Then, the laser beam lb is emitted by the laser output device 34 (the same figure (〇雷) The laser beam LB is irradiated substantially perpendicularly to the surface of the substrate 50 by the reflecting mirror 44' as shown in Fig. 4, and is simultaneously ejected by the cooling nozzle 37 near the rear end of the laser beam irradiation region. Water is used as a cooling medium. By irradiating the laser beam LB to the substrate 50, the substrate 50 is heated to a temperature less than the melting temperature, and the substrate 50 is intended to be thermally expanded, but cannot be expanded due to local heating, and the irradiation point is The center generates a compressive stress. After the heating instant, the surface of the substrate 50 is cooled by water, thereby causing the substrate 5 to shrink and generate tensile stress. By the action of the tensile stress, the trigger crack is used as a starting point. Scratch The alignment 51' forms a vertical crack 53 in the substrate 50. In addition, in the present reflection, the tensile stress caused by the bending of the substrate 50 is added due to the laser beam irradiation surface side of the substrate 50, so the vertical crack 53 It is formed to be deeper than usual, and depending on the case, the vertical crack 5 延伸 will extend to the opposite side of the substrate 50. Then, the relative direction of the laser beam LB and the cooling nozzle 37 along the scribe line 51 in the front-rear direction The ground is moved so that the vertical crack 53 progresses in the front-rear direction, and the scribe line 52 is formed on the substrate 50. 323385 201217094 For the laser beam LB used herein, 'there is no special limit~, the material and thickness of the substrate, and the desired The depth of the vertical crack formed can be determined according to the definition. When the brittle material substrate is a glass substrate, it is suitable to use a laser having a large wavelength of 9 to m in the surface of the glass substrate. For example, a carbon dioxide laser 丨 & "beam. In terms of the shape of the irradiation spot of the laser beam, it is preferable that the laser beam is elongated in the direction of the elliptical shape, and the relative movement is 10 degrees. Up to 60m For the range of m, the irradiation length is 1 °, and the irradiation length is appropriate. The range of 1 is more than the cooling medium ejected from the nozzle 37, and water or alcohol Ulc〇h〇l) 4 can be exemplified. The substrate strip includes the water heated by the Χ 军 射 光束 - - - 同 同 同 ( ( ( W W W W W W W W W W W W W W W W W W W W W W W 军 军 军 军 军 军 军 军 军 军 军The relative movement of the number is the number: the relative movement speed between the center point of the region and the force 1 region is not limited in general, and the 彳mi neo (4) ❹ # 决定 决定 。 。 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常 通常323385 \7 201217094 Next, the rod-shaped member 12 is further protruded to the second protrusion (e)), thereby forming a vertical crack 53 formed on the substrate 5 to face the substrate 5. Cut off. Furthermore, in the previous step of forming the vertical crack in the irradiation of the light beam LB, the case of the opposite side of the vertical plate 5g is not required to be displayed; the protrusion amount of the ?n member 12 is such that the vertical crack 53 can be made. The progress to the opposite side of the soil plate 50 is not particularly limited, and it is usually sufficient to calculate the amount of protrusion of about lmn^lmm from the protruding position. Further, when the rod-shaped member 12 is displaced from the i-th protruding position to the second moving position, both ends of the rod-shaped member 12 in the rear direction can be simultaneously protruded, and as shown in FIG. 5, the rod shape can be first made. One end side of the member 12 in the front-rear direction protrudes first, and the other end side is delayed. When the cutting of the substrate 50 is completed, one of the holding members 13a is lifted, and the pressing of the substrate 50a is released, and the i-th mounting portion is ... The clothes are moved together in a direction away from the rod-shaped member 12 (Fig. 3 (1) soil). In this way, the substrate 5〇a, 5〇b' which is cut into two pieces is prevented from being cut into two defects. Next, the rod member 12 is directed from the second projecting position toward the sinking position (g). Furthermore, the steps shown in Fig. 3 (1) and the same figure ω can also be performed simultaneously. / The first mounting portion lia (4) is fixed, and the substrate is de == ("_)). Then, the structure is lifted and the pressing of the substrate 50b is released, and the squirting of the Z-planting portion lib is released. Then, the substrate 50b is moved over the rod to repeat the above-mentioned series of stitches. Up to the pre-twist distance 323385 13 201217094 There is no special brittle substrate material 50 as the laser cutting device according to the present invention. The invention can be exemplified by glass, ceram jc, hair, sapphire, etc., which are known as brittle material substrates. The invention is particularly useful for chemically strengthened glass having large surface compressive stress and difficult scribing. And the tempered glass substrate is cut by the air-cooled tempered glass, and the thickness of the brittle material substrate 5 能 which can be cut by the laser cutting device of the present invention differs depending on the material of the brittle material substrate 50, etc. In the case where the brittle material substrate 50 is a glass substrate, the thickness can be substantially 2 mm or so. Fig. 6 is a view showing another embodiment of the laser cutting device according to the present invention. The laser cutting device shown in this figure The difference between the devices of the above-described embodiments is that the rod-shaped member 12 presses the substrate 5 to the same surface as the surfaces on which the holding members 13a and 13b are pressed, and the substrate 50 is bent, and the substrate 50 is pressed by the table. The point at which the laser beam LB is irradiated to the side. Hereinafter, the cutting procedure of the substrate 5G using the device will be mainly described in terms of differences from the device of the above-described embodiment. First, the substrate 50 is affixed and fixed to the table 5 ( Fig. 6 (4)). Then, 'moving the holding members 13a, 13b, and centering on the rod-shaped member 12, the two sides of the county plate 5 are held by the holding member, and the coffee is pressed and fixed (the same figure is called to lower the rod-shaped member 12). And the substrate 5 is bent (the same as in the figure (6)). : The amount of protrusion of the rod-shaped member 12 below the surface of the table u is e, and the same range as described above is also exemplified here. The laser beam output device 34 emits a laser beam LB (the same figure (d)) by the cutter wheel on the substrate 5, and simultaneously, near the rear end of the laser beam irradiation region, by cooling 323385 201217094 mouth 37 (pictured in Figure 4) The effluent as a cooling medium forms a vertical crack on the substrate 50 along the scribe line 51 (shown in Fig. 4). In the apparatus of this embodiment, the laser beam is also incident on the surface of the substrate 50. The bending stress caused by the bending of the substrate 50 causes the vertical crack 53 to be formed to be deeper than usual. Hereinafter, the apparatus of this embodiment performs the same processing as the processing procedure shown in Fig. 3. (Industrial Applicability) According to the laser cutting device of the present invention, since the substrate is bent after the substrate is held on the stage, the substrate can be bent into a desired shape even when the substrate is not exchanged and the substrate is thick. It is then useful to form a deep vertical crack on the substrate by irradiating the substrate in the bent state with a laser beam. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic explanatory view showing an embodiment of a laser cutting device according to the present invention. Fig. 2 (a) to (d) are process diagrams showing a case where the substrate is cut by using the laser cutting device of Fig. 1. Fig. 3 (e) to (h) are process diagrams for the case where the substrate is cut by using the laser cutting device of Fig. 1. Fig. 4 is a perspective view showing the operational state of the laser scribing. Fig. 5 (a) to (c) are explanatory views of a movement state when the rod-shaped member is moved from the first projecting position to the second projecting position. Fig. 6 (a) to (d) are process diagrams showing a case where another laser cutting device according to the present invention is used to cut a substrate. 15 323385 201217094 [Description of main components] 11 Table 11a First mounting part lib Second mounting part 12 Pressing members 13a, 13b Holding member 14 Suction hole 31 Support table 34 Laser output device 37 Cooling nozzles 38, 39 CCD camera 44 reflective lens 50 brittle material substrate 51 scribing line 52 scribe line 53 vertical crack LB laser beam P vacuum pump 16 323385