JP2003321233A - Device and method for cutting glass board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for cutting a glass board capable of forming a straight cutting line and a cutting surface perpendicular to the glass board without being affected by warps and deflections of the glass board. <P>SOLUTION: The device for cutting the glass board comprises a cutter 2 for forming an initial crack in an end face of the glass board 1, a heater 9 having multiple probes 10 for progressing the crack from the initial crack, a cooled air nozzle 4 for controlling the progressing speed of the crack, and an optical sensor 5 for detecting the front edge of the crack. The device is further provided with a slider 3 capable of moving along the line to be cut 7 and a board holding mechanism 6 for holding the crack ending side of the glass board opposite to the initial crack. The heater 9 is thermally coupled to the rear surface of the board 1 via the multiple probes 10. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate cutting device and a cutting method, and more particularly to a glass substrate cutting device and a cutting method for cutting a glass substrate using thermal stress.

[0002]

2. Description of the Related Art Conventionally, a method of cutting a glass substrate for forming a display screen such as a color liquid crystal display by using a heating means or a cooling means and advancing a crack of the glass substrate by the generated thermal stress is adopted. Has been done.
For example, a glass substrate cleaving device using such thermal stress is disclosed in Japanese Patent Application Laid-Open No. 2000-281375, FIGS. 3A and 3B, respectively, for explaining such a conventional example. It is a top view and a front view showing a schematic structure of a glass substrate cutting device. As shown in FIGS. 3 (a) and 3 (b), the conventional glass substrate cutting apparatus has a glass substrate 1
Cutter 2 for introducing initial cracks on the end face (side face) of
A heater 9 for propagating the crack, a heater unit 8a having a mechanism for moving the heater 9 up and down, a cooling air nozzle 4 for controlling the crack growth speed, and an optical type for detecting the tip of the crack. The sensor 5 and these cooling air nozzles 4 (cooling mechanism) and the optical sensor 5 are adjusted according to the progress of cracks in the glass substrate 1, that is, the planned cutting line 7a.
The glass substrate 1 is provided with a slider portion 3 that moves in parallel with the substrate holding mechanism 6, and a substrate holding mechanism 6 that holds down the end portion of the crack in the glass substrate 1.

The procedure for cutting the glass substrate 1 using this glass substrate cutting device is as follows.

First, the cutter 2 is pressed against the end surface (side surface portion) of the glass substrate 1 to make an initial crack. Next, the heater 9 heated to about 100 to 200 ° C. in the heater unit 8 a is raised, and the top of the heater 9 is brought into contact with the back surface of the glass substrate 1. As a result, thermal stress is generated in the glass substrate 1, and the crack propagates from the initial crack portion formed on the end face.

On the other hand, on the back side of the glass substrate 1,
Since the cooling air nozzle 4 moves by the slider portion 3 while cooling the periphery of the rear side of the crack opening, it is possible to promote crack growth due to thermal stress on the glass substrate 1. At the same time as the crack progresses, the position of the crack tip is detected by the optical sensor 5, and the cooling air nozzle 4 is aligned with the crack tip position.
Control the cooling position of.

However, the crack that has propagated from the initial crack side of the glass substrate 1 along the planned cutting line 7a sharply decreases the stress in the crack opening direction due to the thermal stress immediately before the completion of cutting, so the crack further progresses. do not do.

Finally, the slider portion 3 is cut to the end of cutting.
When the crack propagates due to the movement of the cooling air nozzle 4 of the glass substrate 1 from the crack end side by the substrate holding mechanism 6.
Press to push the cracks by external force and complete the cutting.

[0008]

According to the above-mentioned conventional glass substrate cutting apparatus and cutting method, when the glass substrate is slightly warped or bent, a difference occurs in the distance between the heater and the glass substrate. There are drawbacks in that the cut surface due to thermal stress is not perpendicular to the glass substrate, or the cutting line is not aligned. In other words, the cut surface becomes oblique, or the cut line is bent.

It is an object of the present invention to form a cutting line in a straight line without affecting such warpage and bending of the glass substrate and to make the cutting surface substantially vertical to the glass substrate. A substrate cutting device and a cutting method are provided.

[0010]

A glass substrate cutting apparatus of the present invention is provided with a cutter for forming an initial crack on an end face of a glass substrate and a multiple probe for advancing a crack subsequent to the initial crack. Equipped with a heater, a cooling mechanism for controlling the growth rate of the crack, and an optical sensor for detecting the tip of the crack, and a slider part that moves in accordance with a planned cutting line, and the initial crack of the glass substrate And a substrate holding mechanism that presses the crack termination side on the opposite side.

Further, the multiple probes according to the present invention can be formed on the heater at equal intervals.

Further, the multiple probe according to the present invention includes a spring mechanism and is formed so as to thermally couple the glass substrate and the heater.

The multiple probe according to the present invention can be formed on the top of the heater.

Further, the cooling mechanism in the present invention is formed by using cooling air nozzles for ejecting air for cooling the tip heating peripheral portion of the crack from both sides of the planned cutting line.

Further, the glass substrate cutting method of the present invention is
A step of forming an initial crack on the end surface of the glass substrate with a cutter, and arranging multiple probes,
A step of raising a heater that generates heat of about 00 ° C. to bring the tip of the multiple probes into contact with the back surface of the glass substrate, and a thermal stress generated in the glass substrate cause a crack to propagate from the initial crack portion. In doing so, the step of moving the slider opening while cooling the periphery of the crack opening with a cooling air nozzle, and at the same time as the crack progress, the position of the crack tip is detected by an optical sensor, and the position is adjusted to the crack tip position. A step of controlling the cooling position of the cooling air nozzle, and at the time when the crack progresses by the movement of the cooling air nozzle until just before the completion of the cutting of the glass substrate, the glass substrate is pressed from the crack end side by the substrate holding mechanism, and external force is applied. And a step of advancing a crack to complete cutting.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The glass substrate cutting apparatus and the cutting method of the present invention are used for chamfering a display screen of a color PDP (plasma display panel), etc., in the manufacturing process of dividing the glass substrate. A probe, especially a heater equipped with multiple probes (hereinafter referred to as probe heater) is brought into contact along the back surface of the glass substrate without introducing an initial crack in the end face and forming a groove or the like on the glass substrate surface. By so doing, a crack is propagated from the initial crack to a succeeding crack, and the growth rate of the crack is controlled by the cooling air nozzle and the optical sensor, so that the glass substrate is accurately cut in a straight line.

Embodiments of the present invention will be described below with reference to the drawings.

1 (a) and 1 (b) are a top view and a front view, respectively, showing the outline of a glass substrate cutting apparatus for explaining an embodiment of the present invention. Figure 1 (a),
As shown in (b), the probe heater type glass substrate cutting device according to the present embodiment advances a cutter 2 for introducing an initial crack into the end surface (side surface) of the glass substrate 1 and a crack subsequent to the initial crack. For multiple probes 10 and linear heaters 9, a heater unit 8 in which these probes 10 and heaters 9 are combined, a mechanism section (not shown) for moving the heater unit 8 up and down, and a crack growth rate. Cooling mechanism, that is, an optical sensor 5 and a cooling air nozzle 4 for detecting the tip of a crack
And a slider portion 3 for moving the cooling air nozzle 4 and the optical sensor 5 in accordance with the progress of cracks, that is, the planned cutting line 7, and a substrate holding mechanism 6 for holding the end of the cracks. The cooling air nozzle 4 ejects air for cooling the tip heating peripheral portion of the crack from both sides across the planned cutting line 7, and moves from the initial crack side to the crack end side by the slider portion 3 together with the optical sensor 5. Then, when the cutting is completed, it is controlled to return to the initial crack side again.

FIG. 2 is a perspective view showing a part of the heater unit shown in FIG. As shown in FIG. 2, this multiple probe 10 is provided at equal intervals on the top of the heater 9 for ensuring the contact between the glass substrate 1 and the heater 9 and for thermal coupling. Moreover, the structure is such that the tip end is pressed against the back surface of the glass substrate 1 by the spring mechanism. The spring mechanism in the probe 10 can eliminate the distance (interval) between the glass substrate 1 and the tip of the probe 10, that is, the heater 9, even if the surface of the glass substrate 1 is warped.

The procedure for cutting the glass substrate 1 using this glass substrate cutting device is as follows.

First, the cutter 2 is pressed against the end surface (side surface portion) of the glass substrate 1 to make an initial crack. Then 5 mm
Multiple probes 10 are arranged at equal intervals and
The heater 9, which has been heated to about 200 ° C., is raised to bring the probe 10 into contact with the back surface of the glass substrate 1. As a result,
Thermal stress is generated in the glass substrate 1, and the crack propagates from the initial crack portion formed on the end face.

On the other hand, on the back side of the glass substrate 1,
Since the cooling air nozzle 4 moves by the slider portion 3 while cooling the periphery of the rear side of the crack opening, it is possible to promote crack growth due to thermal stress on the glass substrate 1. At the same time as the crack progresses, the position of the crack tip is detected by the optical sensor 5, and the cooling air nozzle 4 is aligned with the crack tip position.
Control the cooling position of.

However, the crack that has propagated from the initial crack side of the glass substrate 1 along the planned cutting line 7 sharply decreases the stress in the crack opening direction due to thermal stress immediately before the completion of cutting, and therefore the crack further progresses. do not do.

Finally, the slider portion 3 is cut to the completion of cutting.
When the crack propagates due to the movement of the cooling air nozzle 4 of the glass substrate 1 from the crack end side by the substrate holding mechanism 6.
Press to push the cracks by external force and complete the cutting.

Therefore, according to the present embodiment, the heater 9
By disposing the probe 10 on the glass substrate 1,
Even if there is a warp, a bend, etc., the probe 10, that is, the heater 9 can be evenly contacted with the glass back surface without being affected by them, so that the crack can be made vertical without applying a mechanical external force. Moreover, it can be formed in a straight line and can be cut accurately.

[0026]

As described above, in the glass substrate cutting apparatus of the present invention, by disposing the multiple probes on the heater, even if the glass substrate is warped or bent,
Since the heaters can be evenly contacted without being affected by them, the cracks following the initial cracks can be formed vertically and in a straight line on the glass substrate without applying external mechanical force, and the cutting can be accurately cut. There is an effect.

[Brief description of drawings]

FIG. 1 is a schematic view of a glass substrate cutting device for explaining an embodiment of the present invention as seen from a top surface and a front surface.

FIG. 2 is a perspective view showing a part of the heater unit shown in FIG.

FIG. 3 is a schematic view of a glass substrate cutting device for explaining an example of the related art as seen from the top and the front.

[Explanation of symbols]

1 glass substrate 2 cutter 3 Slider section 4 Cooling air nozzle 5 Optical sensor 6 Substrate holding mechanism 7 planned cutting line 8 heater unit 9 heater 10 probes

Claims (6)

[Claims] 1. A cutter for forming an initial crack on an end face of a glass substrate, a heater provided with a multiple probe for expanding a crack subsequent to the initial crack, and a crack growth speed control unit. Of the cooling mechanism and an optical sensor for detecting the tip of the crack, and a substrate holding mechanism for holding a slider part that moves in accordance with a planned cutting line and a crack end side of the glass substrate opposite to the initial crack. An apparatus for cutting a glass substrate, comprising: 2. The glass substrate cutting device according to claim 1, wherein the multiple probes are formed on the heater at equal intervals. 3. The glass substrate cutting device according to claim 1, wherein the multiple probe includes a spring mechanism to thermally couple the glass substrate and the heater. 4. The glass substrate cutting apparatus according to claim 1, wherein the multiple probes are formed on the top of the heater. 5. The cooling mechanism uses a cooling air nozzle for ejecting air for cooling the peripheral portion of the crack tip heated from both sides of the planned cutting line. Glass substrate cutting device. 6. A step of forming an initial crack by a cutter on an end surface of a glass substrate, a multiple probe is disposed, and a heater for generating heat of about 150 to 200 ° C. is raised to raise the tip of the multiple probe. And a step of contacting the back surface of the glass substrate, by the thermal stress generated in the glass substrate, in developing a crack from the initial crack portion, by the slider portion while cooling the rear periphery of the crack opening with a cooling air nozzle. At the same time as the step of moving and the crack growth, the position of the crack tip is detected by an optical sensor,
A step of controlling the cooling position of the cooling air nozzle in accordance with the position of the crack tip, and at the time when the crack propagates due to the movement of the cooling air nozzle until just before the completion of cutting the glass substrate, the substrate holding mechanism from the crack end side. And a step of pressing the glass substrate by the method to develop a crack by an external force to complete the cutting, and the glass substrate cutting method.