JP2007230818A - Method of dividing work and method of dividing lamination substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly divide a work by a simple structure without causing chipping, crack-off or the like. <P>SOLUTION: The work WS is divided by forming a scribe groove 2 on the thin plate-like work WS having brittleness to position on a dividing line 1, applying a paste like break medium 3 having higher thermal expansion coefficient than that of the work WS on the formed scribe groove 2, curing the applied break medium 3 and heating the cured break medium 3 to utilize the expansion force of the break medium 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for dividing a thin plate-like workpiece having brittleness and a method for dividing a laminated substrate.

Conventionally, a so-called scribe / break method has been performed as a method for dividing a thin plate-like workpiece such as a glass substrate. That is, after a scribe groove is formed on the workpiece surface along a dividing line (scheduled cutting line) with a diamond cutter, etc., the workpiece is pressed from the back side by a break jig made of a rubber roller or the like to apply bending stress, This is to be divided (for example, Patent Document 1).
JP 2003-34543 A

  However, the conventional scribing / breaking method has a problem that defects such as chipping and chipping due to impact during pressing occur. On the other hand, it is conceivable to adjust the pressing conditions such as the pressing force and the pressing amount of the rubber roller. However, the appropriate pressing conditions differ depending on the material of the workpiece, the thickness, the depth of the scribe groove, etc. It was difficult to adjust. In particular, in the case of bonding two substrates, after applying bending stress from one side to divide one substrate, bending stress is applied to the substrate from the other side to divide the other substrate. Therefore, chipping and chipping were more likely to occur and productivity was low.

  An object of the present invention is to provide a method for dividing a workpiece and a method for dividing a bonded substrate that can appropriately divide a workpiece with a simple configuration without causing chipping or chipping.

  The work dividing method of the present invention includes a step of forming a scribe groove on a dividing line for a thin plate-like work having brittleness, and a paste form having a higher thermal expansion coefficient than the work in the formed scribe groove. A coating process for coating the break medium, a curing process for curing the applied break medium, and a dividing process for heating the cured break medium and dividing the workpiece by the expansion force of the break medium. It is characterized by that.

According to this configuration, when a break medium having a higher coefficient of thermal expansion than the work is applied (adhered) to the scribe groove and heated after curing, the break medium expands more than the work. Due to the expansion force of the break medium, a strain stress is generated at the application site (scribe groove). Since the strain stress acts uniformly on the scribe groove, the workpiece is stably divided at the dividing line. Therefore, the work can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium coated and cured in the scribe groove is heated.
The break medium may be applied to the entire scribe groove, or may be applied partially (for example, at a plurality of positions at equal intervals or at both ends). Furthermore, it can be applied to the entire surface of the workpiece.

  In this case, it is preferable that the scribe grooves are formed on both the front and back surfaces of the workpiece on the dividing line.

  According to this configuration, when the break medium is applied to the scribe grooves formed on both the front and back surfaces of the workpiece and heated after curing, the break medium expands more than the workpiece. Due to the expansion force of the break medium, strain stress is generated at the application site (scribe grooves on both the front and back surfaces). Since the strain stress uniformly acts on the scribe grooves on both the front and back surfaces, the workpiece is more stably divided. Therefore, it is possible to more reliably prevent chipping or chipping from being generated due to the division.

  Another method of dividing the workpiece according to the present invention includes a groove forming step of forming a scribe groove on one side of the front and back sides of the workpiece, and a surface on the other side of the workpiece, on the dividing line for a thin plate-like workpiece having brittleness In addition, a pasting break medium having a higher coefficient of thermal expansion than the workpiece is applied along the formed scribe grooves, a curing process for curing the applied break medium, and the cured break medium is heated. And a dividing step of dividing the workpiece by the expansion force of the break medium.

  According to this configuration, when the break medium having a higher thermal expansion coefficient than the work is applied to the back side of the scribe groove and heated after curing, the break medium expands more than the work. Due to the expansion force of the break medium, a strain stress is generated at the application site (opposite side of the scribe groove). Since the strain stress acts uniformly on the scribe groove, the workpiece is stably divided at the dividing line. Therefore, the work can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium coated and cured in the scribe groove is heated.

  Another method of dividing the workpiece according to the present invention is a modified portion forming step of forming a deteriorated portion by a laser beam located on a dividing line for a thin plate-like workpiece having brittleness, and the formed deteriorated portion is more thermally expanded than the workpiece. An application process for applying a paste break medium having a high coefficient, a curing process for curing the applied break medium, and a work for dividing the work by the expansion force of the break medium by heating the break medium after curing. And a process.

  According to this configuration, when the break medium having a higher coefficient of thermal expansion than the workpiece is applied to the altered portion whose strength has been lowered (becomes brittle) by the laser beam and heated after curing, the break medium expands more than the workpiece. Due to the expansion force of the break medium, a strain stress is generated at the application site (deformed portion). Since the strain stress acts uniformly on the affected part, the work is stably divided at the dividing line. Therefore, the work can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium applied and cured to the altered portion is heated.

  In these cases, it is preferable that the break medium is either a molten metal or a metal paste.

  According to this configuration, the break medium has appropriate adhesion to the work after being cured. For this reason, when thermal expansion is performed, strain stress can be applied to the workpiece accurately, and the workpiece can be divided reliably and stably.

  Another method of dividing the workpiece according to the present invention includes a through-hole forming step of forming a pair of through-holes located at both ends on a dividing line for a thin plate-like workpiece having brittleness, and a pair of formed through-holes. A medium fitting step for fitting a break medium having a higher thermal expansion coefficient than the workpiece, and a dividing step for heating the pair of break media fitted to divide the workpiece by the expansion force of the pair of break media. It is characterized by having.

  According to this configuration, when the break medium having a higher thermal expansion coefficient than that of the work is fitted into the pair of through holes and heated, the break medium expands more than the work. Due to the expansion force of the break medium, strain stress is generated in the pair of through holes. Since the strain stress acts uniformly on the parting line of the work, the work is stably divided at the parting line. Therefore, the workpiece can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium fitted in the pair of through holes is heated. Furthermore, if the break medium is directly heated by a heating head or the like, the influence of heat on the workpiece can be minimized.

  Another method of dividing the workpiece according to the present invention includes a wedge-shaped groove forming step in which a pair of wedge-shaped grooves are formed at both ends on a dividing line, and a pair of wedge-shaped grooves formed on a thin plate-shaped workpiece having brittleness. A medium fitting step in which a break medium having a thermal expansion coefficient higher than that of the workpiece and having a wedge-shaped groove and a complementary wedge shape is fitted, and a pair of break mediums heated to expand the pair of break media And a dividing step of dividing the workpiece by the above.

  According to this configuration, when the break medium having a higher thermal expansion coefficient than that of the workpiece is fitted in the pair of wedge-shaped grooves and heated, the break medium expands more than the work. Due to the expansion force of the break medium, strain stress is generated in the pair of wedge-shaped grooves. Since the strain stress acts uniformly on the parting line of the work, the work is stably divided at the parting line. Therefore, the workpiece can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium fitted in the pair of wedge-shaped grooves is heated. Furthermore, if the break medium is directly heated by a heating head or the like, the influence of heat on the workpiece can be minimized.

  In these cases, it is preferable to further include a deteriorated portion forming step of forming a deteriorated portion by a laser beam located on the dividing line with respect to the workpiece before the medium fitting step.

  According to this configuration, by forming the altered portion on the dividing line in advance, the strain stress due to the expansion of the break medium acts on the altered portion having a low strength. For this reason, a workpiece | work is divided | segmented more stably. Therefore, it is possible to more reliably prevent chipping or chipping from being generated due to the division.

  In these cases, the pair of break media is preferably held integrally with the holding member.

  According to this configuration, if the pair of break media is heated via the holding member by a heating head or the like, the influence of heat on the workpiece can be reduced as much as possible, and the pair of break media can be uniformly heated and expanded. It is possible to divide the work appropriately.

  Another method of dividing the workpiece according to the present invention includes a groove forming step of forming a scribe groove located on a dividing line for a thin plate-like workpiece having brittleness, and the formed scribe groove has a higher thermal expansion coefficient than the workpiece. And a medium fitting step of fitting a break medium having a shape complementary to the scribe groove, and a dividing step of heating the fitted break medium to divide the workpiece by the expansion force of the break medium. Features.

  According to this configuration, when the break medium having a higher thermal expansion coefficient than the work is fitted into the scribe groove and heated, the break medium expands more than the work. Due to the expansion force of the break medium, strain stress is generated in the scribe groove. When the strain stress acts on the scribe groove, the workpiece is stably divided along the dividing line. Therefore, the work can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium fitted in the scribe groove is heated. Furthermore, if the break medium is directly heated by a heating head or the like, the influence of heat on the workpiece can be minimized.

  In this case, it is preferable that the break medium is held by the holding member.

  According to this configuration, when the plurality of break media are heated, if the plurality of break media are heated via the holding member by a heating head or the like, the influence of heat on the workpiece can be reduced as much as possible, and the plurality of break media can be reduced. The break medium can be uniformly heated and expanded, and the work can be appropriately divided.

  In these cases, the break medium is made of a magnetic material, and in the dividing step, the break medium is preferably heated by electromagnetic induction.

  According to this configuration, the break medium can be selectively heated without heating the substrate. For this reason, it is particularly useful when it is desired to minimize the influence of heat on the workpiece.

  In these cases, the work is preferably a glass substrate in which a plurality of panels are formed.

  According to this configuration, a panel free from defects such as chipping and chipping can be obtained. Further, since a plurality of divisions can be performed at a time, productivity is improved. The panel is, for example, a flat panel display (FPD) such as a liquid crystal panel.

  In these cases, the work is preferably a semiconductor wafer in which a plurality of chips are formed.

  According to this configuration, a chip free from defects such as chipping and chipping can be obtained. Further, since a plurality of divisions can be performed at a time, productivity is improved. Moreover, dicing tape (expanded type) is usually used for semiconductor wafer splitting (dicing) to hold the wear being cut by a diamond cutter, etc., but according to this configuration, this is not necessary and the running cost is reduced. Can be reduced.

  The method for dividing a bonded substrate according to the present invention is a groove in which scribe grooves are formed on both front and back surfaces of a bonded substrate obtained by bonding two thin substrates having brittleness on the dividing line of each substrate. A forming step, a coating step in which a paste-like break medium having a higher thermal expansion coefficient than the workpiece is applied to the formed scribe groove, a curing step in which the applied break medium is cured, and both breaks after curing A dividing step of heating the medium at the same time to divide the bonded substrate by the expansion force of both break media.

  According to this configuration, when a break medium having a higher coefficient of thermal expansion than each substrate is applied (adhered) to the scribe groove and heated after curing, the break medium expands more than the workpiece. Due to the expansion force of the break medium, strain stress is generated at the application site (each scribe groove). Since the strain stress uniformly acts on each scribe groove, each substrate is stably divided along the dividing line. Therefore, the bonded substrate can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium applied and cured in the scribe groove is heated. In addition, unlike the configuration in which bending stress is applied from both the front and back sides, the two substrates can be divided at the same time, so that productivity can be improved.

  Hereinafter, a substrate dividing system to which a workpiece dividing method and a bonded substrate dividing method according to the present invention are applied will be described with reference to the accompanying drawings. This substrate dividing system is incorporated in a liquid crystal panel production line, and is for dividing a glass substrate (mother substrate) on which a plurality of liquid crystal panels are made into individual liquid crystal panels. The glass substrate has brittleness made of quartz, borosilicate, soda glass or the like, and is configured in a thin plate shape.

  As shown in FIG. 1, the substrate dividing system 10 includes a transport device 11 that transports a glass substrate WS from a supply position to a material removal position, and three devices that face the transport path, that is, the glass substrates WS in the order of processes. After the scribing device 12 for forming the scribe groove 2 with respect to (work), the coating device 13 for applying the silver paste 3 (break medium) to the formed scribe groove 2, and the applied break medium 22 are cured. And a heating device 14 for heating the break medium 22.

  The conveyance device 11 is configured by a belt conveyor using a metal mesh belt. Although not shown, the scribing device 12 and the coating device 13 are additionally provided with a transfer device for transferring the glass substrate WS between them and the transport device 11. Note that the transport device 11 may have another configuration, for example, a roller transport of the glass substrate WS.

  The scribing device 12 includes a diamond cutter 16 and a moving mechanism (not shown) that moves the diamond cutter 16 relative to the set glass substrate WS. Thus, linear scribe grooves 2 are formed vertically and horizontally (in the form of ruled lines) along the dividing line 1 (division line) on the glass substrate WS.

  The coating device 13 includes a dispenser 17 that discharges the silver paste 3 from the nozzle at the tip, a moving mechanism (not shown) that moves the dispenser 17 relative to the set glass substrate WS, and the like. As a result, the silver paste 3 is applied (applied) to the entire surface of each scribe groove 2. Silver paste 3 may be applied to each scribe groove 2 at a plurality of positions at equal intervals, or may be applied to both ends of each scribe groove 2. Although the dispenser 17 is used here, the silver paste 3 may be pattern-coated by other methods, for example, a screen printing method can be used. Furthermore, the silver paste 3 may be applied to the entire surface of the glass substrate WS so as to be applied to each scribe groove 2. In this case, pattern application is not necessary, so that it can be easily performed.

  The break medium to be applied to the scribe groove 2 is a material (aluminum, silver, gold, chromium, zinc, iron, etc.) having a higher thermal expansion coefficient than the material of the glass substrate WS (quartz, borosilicate, soda glass, etc.). Any material such as a metal such as nickel or a resin may be used. Further, it is preferable to have an appropriate adhesion to the glass substrate WS after curing, and to cause a strain stress to act on the glass substrate WS accurately when it is thermally expanded. Therefore, in addition to silver paste, metal paste such as copper paste and solder paste can be preferably used. Alternatively, a solid metal may be melted with a flame and applied.

  The silver paste 3 applied by the applying device 13 evaporates the solvent by the time it reaches the heating device 14 (if it is a molten metal, it is cooled) and hardens. Thereby, the glass substrate WS will be in the state which the silver paste 3 contact | adhered to the scribe groove | channel 2 moderately. In addition, you may provide a non-heating-type drying apparatus between the coating device 13 and the heating apparatus 14 so that the silver paste 3 may harden | cure quickly.

  The heating device 14 includes an infrared heater 18 and the like, and heats the glass substrate WS being conveyed. Thereby, although the glass substrate WS is thermally expanded, the silver paste 3 having a higher thermal expansion coefficient than that expands further. As the heating device 14, a hot air heater, a halogen heater, or the like may be used. Further, when a magnetic material is used as a break medium as in the silver paste 3 of the present embodiment, an electromagnetic induction heating type may be used. According to this, the hardened silver paste 3 can be selectively heated without heating the glass substrate WS. For this reason, it is particularly useful when it is desired to minimize the influence of heat on the glass substrate WS.

  The glass substrate WS is divided into a plurality of liquid crystal panels P by the substrate dividing system 10 configured as described above. That is, first, the scribe device 12 forms a plurality of scribe grooves 2 on the glass substrate WS. Next, the silver paste 3 is applied to each scribe groove 2 by the applying device 13. The applied silver paste 3 is cured before reaching the heating device 14. Then, the cured silver paste 3 is heated by the heating device 14.

  According to this, the silver paste 3 having a high thermal expansion coefficient expands more than the glass substrate WS. Due to the expansion force of the silver paste 3, strain stress is generated in each scribe groove 2. When the strain stress acts uniformly on each scribe groove 2, the glass substrate WS is stably divided at the dividing line 1. Therefore, the glass substrate WS is appropriately divided without causing chipping or chipping by a simple configuration in which the silver paste 3 applied and cured in the scribe groove 2 is heated, and the liquid crystal panel P having a clean dividing surface is obtained. Can be obtained. After the division, the silver paste 3 is removed from each liquid crystal panel P.

  As shown in FIG. 2, a plurality of scribe grooves 2 are formed on the front and back surfaces of the glass substrate WS on the dividing line 1, and a silver paste 3 is applied to each of the scribe grooves 2 on both the front and back surfaces, and heated after curing. May be. Due to the expansion of the silver paste 3, strain stress is generated in the scribe grooves 2 on both the front and back surfaces. The strain stress acts uniformly on the scribe grooves 2 on both the front and back surfaces, so that the glass substrate WS is more stably divided. Therefore, it is possible to more reliably prevent chipping or chipping from being generated due to the division. In this case, it is preferable that the heating device 14 has a configuration capable of heating uniformly from both the front and back surfaces of the glass substrate WS.

  As shown in FIG. 3, a plurality of scribe grooves 2 are formed on the surface of the glass substrate WS so as to be positioned on the dividing line 1 with respect to the glass substrate WS, and along each scribe groove 2 formed on the back surface of the glass substrate WS. Alternatively, the silver paste 3 may be applied and heated after curing. According to this, the silver paste 3 expands more than the glass substrate WS. Due to the expansion force of the silver paste 3, strain stress is generated on the back side of each scribe groove 2. When the strain stress acts uniformly on each scribe groove 2, the glass substrate WS is stably divided at the dividing line 1. Therefore, also in this case, the glass substrate WS can be appropriately divided without causing chipping or chipping by a simple configuration in which the silver paste 3 applied and cured in the scribe groove 2 is heated.

  As shown in FIG. 4, the glass substrate WS may be divided using a break unit 21 instead of the coating device 13 and the heating device 14 described above. The break unit 21 includes a plurality of break media 22 having a shape complementary to the scribe groove 2, a holding member 23 that holds the plurality of break media 22, and a heating head (not shown) that heats the holding member 23. Each break medium 22 is made of a metal having a higher thermal expansion coefficient than that of the glass substrate WS, and a plurality of break media 22 can be heated uniformly by heating the holding member 23 with a heating head. is there.

  When the break media 22 are respectively fitted in the plurality of scribe grooves 2 and heated, each break media 22 expands more than the glass substrate WS. Due to the expansion force of each break medium 22, strain stress is generated in each scribe groove 2. When the strain stress acts uniformly on each scribe groove 2, the glass substrate WS is stably divided at the dividing line 1. Therefore, also in this case, the glass substrate WS can be appropriately divided without causing chipping or chipping by a simple configuration in which the break medium 22 fitted in the scribe groove 2 is heated.

  In addition, in this case, by heating the plurality of break media 22 through the holding member 23 by the heating head, the influence of heat on the glass substrate WS can be reduced as much as possible, and the plurality of break media 22 can be uniformly heated. The glass substrate WS can be appropriately divided.

  Such a substrate dividing method by the substrate dividing system 10 is particularly effective when dividing a bonded substrate obtained by bonding two substrates. As shown in FIG. 5, this bonded substrate WW is obtained by bonding an array substrate Wa (TFT array substrate) and a CF substrate Wc (color filter substrate), and these two substrates are each brittle. And a thin glass substrate or the like.

  For the bonded substrate WW, first, the scribe device 12 forms the scribe groove 2 on the dividing line 1 of the array substrate Wa, and after inversion, the scribe groove is positioned on the dividing line 1 of the CF substrate Wc. 2 is formed. Next, the silver paste 3 is applied to the scribe grooves 2 formed on the CF substrate Wc by the applying device 13. After curing, the silver paste 3 is applied to the scribe grooves 2 formed in the array substrate Wa after being inverted. The silver paste 3 applied to the array substrate Wa is also cured before reaching the heating device 14. And the silver paste 3 after hardening is heated with the heating apparatus 14, and it expand | swells. The formation of the scribe groove 2 and the application of the silver paste 3 may be performed from either the array substrate Wa or the CF substrate Wc.

  According to this, the silver paste 3 expands more than the array substrate Wa and the CF substrate Wc. Due to the expansion force of the silver paste 3, strain stress is generated in each scribe groove 2. Since the strain stress uniformly acts on each scribe groove 2, the array substrate Wa and the CF substrate Wc are stably and simultaneously divided at the dividing line 1. Therefore, the bonded substrate WW can be appropriately divided without causing chipping or chipping by a simple configuration in which the silver paste 3 applied and cured in the scribe groove 2 is heated. In addition, unlike the configuration in which bending stress is applied from both the front and back sides, the array substrate Wa and the CF substrate Wc can be divided at the same time, so that productivity can be improved. The dividing line 1 of the array substrate Wa and the dividing line 1 of the CF substrate Wc may coincide with each other in plan view or may be shifted from each other.

  Subsequently, another embodiment of the substrate dividing system will be described. The substrate dividing system according to the second embodiment is configured in substantially the same manner as the substrate dividing system according to the first embodiment. However, in the first embodiment, a scribing device for forming a scribe groove in the glass substrate is provided. On the other hand, it is different in that an altered portion forming device for forming an altered portion by laser light on a glass substrate is provided. Hereinafter, the difference will be mainly described.

  As shown in FIG. 6, the substrate dividing system 30 of the second embodiment includes a coating device 33, a heating device 34, and a transfer device 31, as in the first embodiment, and instead of the scribe device, An altered portion forming device 32 is provided. That is, the altered portion forming device 32, the coating device 33, and the heating device 34 face the transport path in this order.

  The altered portion forming apparatus 32 includes a laser irradiation head 36 that irradiates a femtosecond laser or the like, a moving mechanism (not shown) that moves the laser irradiation head 36 relative to the set glass substrate WS, and the like. . When the glass substrate WS is irradiated with laser light, the irradiated portion becomes the altered portion 6 with reduced strength. Thereby, the linear quality change part 6 is formed vertically and horizontally along the dividing line 1 (division planned line) with respect to the glass substrate WS.

  The glass substrate WS is divided into a plurality of liquid crystal panels P by the substrate dividing system 30 configured as described above. That is, first, the altered portion 6 is formed on the glass substrate WS by the altered portion forming apparatus 32. Next, the silver paste 3 is applied to the altered portion 6 so as to be wider than the altered portion 6 by the coating device 33. The applied silver paste 3 is cured before reaching the heating device 34. Then, the cured silver paste 3 is heated by the heating device 34.

  According to this, the silver paste 3 having a high thermal expansion coefficient expands more than the glass substrate WS. Due to the expansion force of the silver paste 3, a strain stress is generated in the altered portion 6. Since the strain stress acts uniformly on the altered portion 6, the glass substrate WS is stably divided at the dividing line 1. Therefore, the glass substrate WS can be appropriately divided without causing chipping or chipping by a simple configuration in which the silver paste 3 applied and cured to the altered portion 6 is heated.

  As shown in FIGS. 7 and 8, a pair of through holes 7 and a pair of wedge-shaped grooves 8 are formed in the glass substrate WS in advance, and a break unit 41 is used instead of the coating device 33 and the heating device 34. The glass substrate WS may be divided. The break unit 41 includes a pair of penetration break media 42 having a shape complementary to the pair of through holes 7, or a pair of wedge break media 43 having a shape complementary to the pair of wedge-shaped grooves 8, and a pair of penetration breaks. It has a holding member 44 that holds the medium 42 or a pair of wedge break media 43, and a heating head (not shown) that heats the holding member 44. In the break unit 41, each penetration break medium 42 or each wedge break medium 43 is made of a metal having a higher thermal expansion coefficient than that of the glass substrate WS, and the holding member 44 is heated by a heat source. The penetrating break medium 42 or the pair of wedge break media 43 is configured to be able to be heated uniformly.

  The pair of through holes 7 are formed at both ends on the dividing line 1 of the glass substrate WS by, for example, a laser processing apparatus (not shown). Similarly, the pair of wedge-shaped grooves 8 are formed at both end portions on the dividing line 1.

  First, a pair of through-holes 7 or a pair of wedge-shaped grooves 8 are formed by a laser processing device or the like, and the altered portion 6 is formed by the altered portion forming device 32 at the same time. After that, when a pair of penetration break media 42 is fitted into the pair of through holes 7 or a pair of wedge break media 43 is fitted into the pair of wedge-shaped grooves 8 and heated, the pair of penetration break media 42 or The pair of wedge break media 43 expands more than the glass substrate WS. Due to the expansion force of the pair of penetrating break media 42 or the pair of wedge break media 43, a distortion stress is generated in each altered portion 6. The glass substrate WS is stably divided at the dividing line 1 by the strain stress acting uniformly on each altered portion 6. Therefore, in this case as well, chipping, chipping, or the like is achieved by a simple configuration in which the pair of penetration break media 42 or the pair of wedge break media 43 fitted in the pair of through holes 7 or the pair of wedge-shaped grooves 8 is heated. The glass substrate WS can be appropriately divided without causing the above.

  Moreover, in this case, by heating the pair of penetration break media 42 or the pair of wedge break media 43 via the holding member 44 by the heating head, the influence of heat on the glass substrate WS can be reduced as much as possible. The pair of penetration break media 42 or the pair of wedge break media 43 can be uniformly heated and expanded, and the glass substrate WS can be appropriately divided.

  Even if the altered portion 6 is not formed by the altered portion forming device 32, the pair of penetration break media 42 or the pair of wedge break media 43 fitted in the pair of through holes 7 or the pair of wedge-shaped grooves 8. It is possible to divide the glass substrate WS simply by heating. However, by forming the altered portion 6 on the dividing line 1 in advance, the strain stress due to the expansion of the pair of penetration break media 42 or the pair of wedge break media 43 acts on the altered portion 6 having low strength. It will be. For this reason, the glass substrate WS is more stably divided. Therefore, it is possible to more reliably prevent chipping or chipping from being generated due to the division.

(A) is a front schematic diagram of the board | substrate division | segmentation system which concerns on one Embodiment of this invention, (b) is the plane schematic diagram. It is the figure which showed the division | segmentation state at the time of forming a scribe groove | channel on the front and back both surfaces of a glass substrate. It is the figure which showed the division | segmentation state at the time of forming a scribe groove | channel on the surface of a glass substrate, and apply | coating silver paste on the back surface. It is the figure which showed the division | segmentation state at the time of fitting a break medium to the scribe groove | channel of a glass substrate. It is the figure which showed the division | segmentation state at the time of forming a scribe groove | channel in each board | substrate of a bonding board | substrate. (A) is a front schematic diagram of the board | substrate division | segmentation system which concerns on other embodiment of this invention, (b) is the plane schematic diagram. It is the figure which showed the division | segmentation state at the time of forming a pair of through-hole on the dividing line of a glass substrate. It is the figure which showed the division | segmentation state at the time of forming a pair of wedge-shaped groove | channel on the dividing line of a glass substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Dividing line 2 ... Scribe groove 3 ... Silver paste 6 ... Alteration part 7 ... Through-hole 8 ... Wedge-shaped groove 22 ... Break medium 23 ... Holding member 42 ... Break medium for penetration 43 ... Break medium for wedge 44 ... Holding member

Claims (15)

For a thin plate-like workpiece having brittleness, a groove forming step for forming a scribe groove located on the dividing line;
An application step of applying a paste-like break medium having a higher coefficient of thermal expansion than the workpiece to the formed scribe groove;
A curing step of curing the applied break medium;
A dividing step of heating the break medium after curing and dividing the workpiece by an expansion force of the break medium;
A method for dividing a workpiece, comprising:   2. The work dividing method according to claim 1, wherein the scribe grooves are formed on both front and back surfaces of the work on the dividing line. For a thin plate-like workpiece having brittleness, a groove forming step for forming a scribe groove on one side of the front and back surfaces of the workpiece, which is located on a dividing line;
An application step of applying a paste-like break medium having a higher coefficient of thermal expansion than the work along the scribe grooves formed on the other surface of the work;
A curing step of curing the applied break medium;
A dividing step of heating the break medium after curing and dividing the workpiece by an expansion force of the break medium;
A method for dividing a workpiece, comprising: For a thin plate-like workpiece having brittleness, an altered part forming step for forming an altered part by a laser beam located on the dividing line,
An application step of applying a paste-like break medium having a higher coefficient of thermal expansion than the workpiece to the altered portion formed;
A curing step of curing the applied break medium;
A dividing step of heating the break medium after curing and dividing the workpiece by an expansion force of the break medium;
A method for dividing a workpiece, comprising:   5. The work dividing method according to claim 1, wherein the break medium is any one of a molten metal and a metal paste. For a thin plate-like workpiece having brittleness, a through hole forming step for forming a pair of through holes located at both ends on the dividing line;
A medium fitting step of fitting a break medium having a higher coefficient of thermal expansion than the workpiece into the pair of formed through holes,
A dividing step of heating the pair of break media fitted together and dividing the workpiece by the expansion force of the pair of break media;
A method for dividing a workpiece, comprising: A wedge-shaped groove forming step for forming a pair of wedge-shaped grooves located at both ends on the dividing line for a thin plate-like workpiece having brittleness,
A medium fitting step of fitting a break medium having a thermal expansion coefficient higher than that of the workpiece and having a wedge shape complementary to the wedge-shaped groove to the pair of wedge-shaped grooves formed,
A dividing step of heating the pair of break media fitted together and dividing the workpiece by the expansion force of the pair of break media;
A method for dividing a workpiece, comprising:   8. The altered part forming step of forming an altered part by a laser beam located on the dividing line with respect to the workpiece before the medium fitting process is further provided. How to divide the workpiece.   9. The work dividing method according to claim 6, wherein the pair of break media are integrally held by a holding member. For a thin plate-like workpiece having brittleness, a groove forming step for forming a scribe groove located on the dividing line;
A medium fitting step of fitting a break medium having a thermal expansion coefficient higher than that of the workpiece and having a shape complementary to the scribe groove into the formed scribe groove,
A dividing step of heating the fitted break medium and dividing the workpiece by an expansion force of the break medium;
A method for dividing a workpiece, comprising:   The work dividing method according to claim 10, wherein the break medium is held by a holding member. The break medium is made of a magnetic material,
12. The work dividing method according to claim 1, wherein in the dividing step, the break medium is heated by electromagnetic induction.   The work dividing method according to claim 1, wherein the work is a glass substrate in which a plurality of panels are formed.   The work dividing method according to claim 1, wherein the work is a semiconductor wafer in which a plurality of chips are formed. A groove forming step of forming scribe grooves on both the front and back surfaces of the bonded substrate obtained by bonding the two thin plate-like substrates having brittleness, on the dividing line of each substrate;
An application step of applying a paste-like break medium having a higher coefficient of thermal expansion than the workpiece to each of the formed scribe grooves;
A curing step of curing each of the applied break media;
A splitting step in which the both break media after curing are heated at the same time, and the bonded substrate is split by the expansion force of the both break media;
A method for dividing a laminated substrate, comprising:

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