JP2012066480A - Method of splitting brittle material substrate with resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of highly reliably splitting a brittle material substrate with a resin provided with a V-shaped groove part.SOLUTION: The method of splitting the brittle material substrate with the resin which is made by sticking the resin onto one principal surface of the brittle material substrate and by disposing the V-shaped groove part on the other principal surface of the brittle material substrate, vertically to the principal surface with the tip part of the V-shaped groove part as the starting point, includes: a groove part forming process of forming a second groove part on the predetermined position of splitting of the resin side of the brittle material substrate with the resin; and a breaking process of splitting the brittle material substrate with the resin along the V-shaped groove part (for example, the breaking process of splitting the brittle material substrate with the resin by energizing two positions symmetrical to the V-shaped groove part, on the principal surface of the brittle material substrate and a position on the extension line of the tip part of the V-shaped groove part, on the principal surface of the resin side, by the use of a prescribed energizing member).

Description

  The present invention relates to a method for dividing a brittle material substrate, and more particularly to a method for dividing a ceramic substrate to which a resin is bonded.

  A brittle material substrate made of ceramics or other brittle materials such as LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics) There are various methods for dividing the image into a plurality of divided pieces. For example, by forming a scribe line at a planned division position of the brittle material substrate using a scribing wheel or the like, a vertical crack is formed in the thickness direction of the brittle material substrate along the scribe line, and then external force (load) A mode in which a brittle material substrate is broken by applying a vertical crack in the thickness direction of the brittle material substrate by applying is known (for example, see Patent Document 1). In such a case, the vertical crack formed along the scribe line extends in the thickness direction of the brittle material substrate and reaches the back surface, whereby the brittle material substrate is broken. Alternatively, in the process of manufacturing the brittle material substrate, a V-shaped groove (referred to as a V-groove or the like) is formed in advance at a position to be divided, and a break may occur along the V-groove. The V-groove is generally formed at the stage of a ceramic precursor (ceramic green sheet laminate).

JP 2010-173251 A

  There is a brittle material substrate in which a thermosetting resin such as glass epoxy is attached to the main surface (brittle material substrate with resin) for the purpose of protecting a circuit formed on the main surface. When the brittle material substrate with resin is broken from the side of the brittle material substrate by the above-described method, the vertical crack does not extend to the resin portion because the material is different between the brittle material substrate and the resin, or the resin portion is The problem of not penetrating may occur. Alternatively, the crack may not extend vertically, and an oblique crack called soge may occur.

  In addition, when the brittle material substrate with the V-groove is used as the brittle material substrate with resin, an effect is obtained that warpage generated in the brittle material substrate in the process of attaching the thermosetting resin is alleviated by the V-groove. However, on the other hand, when the brittle material substrate with resin is divided, the tip of the V-groove (the lowest point), which is less sharp than the tip of the scribe line, becomes the starting point of the break, so that cracks are further generated. There is a problem that it is difficult to extend vertically.

  This invention is made | formed in view of the said subject, and it aims at providing the method of dividing | segmenting the brittle material board | substrate with resin in which the V-groove was formed in the brittle material board | substrate with higher certainty than before. .

  In order to solve the above-mentioned problem, the invention of claim 1 is characterized in that a resin is attached to one main surface of a brittle material substrate and a V-shaped groove is provided on the other main surface of the brittle material substrate. A method of dividing a material substrate perpendicularly to a main surface starting from a tip portion of the V-shaped groove, wherein a second groove is formed at a planned dividing position on the resin side of the brittle material substrate with resin. And a breaking step of dividing the brittle material substrate with resin along the V-shaped groove.

  Invention of Claim 2 is the division | segmentation method of the brittle material board | substrate with resin of Claim 1, Comprising: The said break process is on the main surface of the said brittle material board | substrate, and is symmetrical with respect to the said V-shaped groove part. The brittle material substrate with resin is urged by a predetermined urging member with respect to two positions and a position on an extension line of the front end portion of the V-shaped groove on the resin side. And a breaking step for dividing the above.

  Invention of Claim 3 is the division | segmentation method of the brittle material board | substrate with resin of Claim 1 or Claim 2, Comprising: The said breaking process is a crack from the front-end | tip part of the said V-shaped groove part to the said 2nd groove part. It is a step of dividing the brittle material substrate with resin by extending the substrate.

  Invention of Claim 4 is the division | segmentation method of the brittle material board | substrate with resin in any one of Claim 1 thru | or 3, Comprising: The said groove part formation process is a process of forming the said 2nd groove part with a dicer, It is characterized by that.

  A fifth aspect of the present invention is the method for dividing a brittle material substrate with a resin according to any one of the first to fourth aspects, wherein the brittle material substrate is LTCC or HTCC.

  According to invention of Claim 1 thru | or 5, a brittle material board | substrate with resin can be reliably divided | segmented in the division | segmentation plan position perpendicular | vertical with respect to the main surface.

It is a schematic diagram which shows the brittle material board | substrate 10 with resin used as the object of a division | segmentation in this Embodiment. It is a figure which shows the procedure of the process which divides | segments the brittle material board | substrate 10 with resin in this Embodiment. It is a schematic diagram which shows a mode that a groove part formation process is performed using the dicer 100. FIG. It is a figure which shows the brittle material board | substrate 10 with resin in which the groove part G2 was formed by the groove part formation process. It is a schematic cross section which shows the mode of the break apparatus 300 which performs a break process. It is a figure which shows the brittle material board | substrate 10 with a resin after the break process by which the crack CR was formed in the thickness direction of the brittle material board | substrate along the groove part G1. It is a figure which shows the mode after a break process about the brittle material board | substrate 10 with a resin which did not perform a groove part formation process.

<Brittle substrate with resin>
FIG. 1 is a schematic diagram showing a brittle material substrate 10 with resin that is an object of division in the present embodiment. The brittle material substrate 10 with resin is one main surface 1a of the brittle material substrate 1 formed using ceramics or other brittle materials such as LTCC (Low Temperature Co-fired Ceramics) and HTCC (High Temperature Co-fired Ceramics). Further, a thermosetting resin (hereinafter, also simply referred to as a resin) 2 such as glass epoxy is adhered to the substrate. In the present embodiment, the brittle material substrate 1 includes a substrate in which an electric circuit or the like is formed on the main surface or inside. The resin 2 is provided for the purpose of protecting a circuit formed on the main surface, for example.

  On the other main surface 1b side of the brittle material substrate 1, a V-shaped groove G1 is provided in advance so as to correspond to the planned division position of the brittle material substrate 10 with resin. The groove part G1 is formed at the time of manufacturing the brittle material substrate 1 prior to the adhesion of the resin 2. For example, by providing a concave portion with a press or the like in the brittle material substrate 1 before firing (more specifically, a laminate formed by laminating and pressing a ceramic green sheet containing a ceramic component and an organic component) The groove part G1 is formed. The groove part G1 has an effect of relaxing the compressive stress acting on the main surface 1a of the brittle material substrate 1 with the shrinkage of the resin 2 during curing.

  Moreover, in FIG. 1, the division | segmentation planned line L showing the division | segmentation planned position of the brittle material board | substrate 10 with resin is shown with the broken line. An end portion of the planned dividing line L on the brittle material substrate 1 side coincides with the front end portion P1 of the groove portion G1. As will be described later, the tip end portion P1 becomes a starting point when the brittle material substrate 10 with resin is divided. In the present embodiment, it is assumed that the planned division positions are set perpendicular to the main surfaces 1a and 1b of the brittle material substrate 1. Further, the end of the planned dividing line L on the resin 2 side (intersection with the main surface 2a) will be referred to as a planned divided position P2. In such a case, the front end portion P1 and the planned division position P2 are straight lines extending in a direction perpendicular to the paper surface.

  In addition, the size of the brittle material substrate 1 and the resin 2 in FIG. 1 and the adhesion mode of the resin 2 are merely examples. For each of the brittle material substrate 1 and the resin 2, an appropriate size may be selected in light of the respective purposes. Although not particularly limited, for example, the thickness of the brittle material substrate 10 with resin is about 0.3 to 3 mm, the thickness of the brittle material substrate 1 is about 0.1 to 2 mm, and the thickness of the resin 2 is 0.1 to 3 mm. It can be about 2 mm. In FIG. 1 (the same applies to the following drawings), five division positions (five division lines L) are shown, but this is only an example. Furthermore, various aspects may be selected for the size and shape of the groove G1.

<Division of material substrate with resin>
FIG. 2 is a diagram showing a processing procedure for dividing the brittle material substrate 10 with resin in the present embodiment. Hereinafter, the details of the division processing of the brittle material substrate with resin according to the present embodiment will be described along the procedure shown in FIG.

  First, a brittle material substrate 10 with resin is prepared (step S1). In the brittle material substrate 10 with resin, as shown in FIG. 1, a groove G1 is formed, and a planned division position perpendicular to the main surfaces 1a and 1b of the brittle material substrate 1 is set. To do. Then, a groove forming process is performed at the planned division position P2 on the resin 2 side of the prepared brittle material substrate with resin 10 (step S2). The groove forming process can be performed by selecting an appropriate one from a dicer (dicing saw), a laser beam and other known processing means.

  FIG. 3 is a schematic diagram showing a state in which the groove forming process is performed using the dicer 100. FIG. 4 is a view showing the brittle material substrate 10 with resin in which the groove part G2 is formed by the groove part forming process.

  When the groove forming process is performed using the dicer 100, first, the brittle material substrate 10 with resin has the main surface 1b of the brittle material substrate 1 as a mounting surface so that the main surface 2a of the resin 2 becomes a processed surface. It is placed and fixed on the stage 101 of the dicer 100. Then, the disk-shaped blade 102 whose outer peripheral portion is a cutting edge for grinding made of diamond or the like is adjusted to a height position corresponding to the depth of the groove portion G2. Then, the stage 102 is moved along the scheduled division position P2 as indicated by the arrow AR2 while the blade 102 is rotated as indicated by the arrow AR1 about the shaft 102a by a driving means (not shown), or the blade 102 is moved as indicated by the arrow AR3. The groove part G2 is formed by moving as shown in FIG. FIG. 4 shows a state in which the same processing is performed on all the planned division positions P2.

  The depth of the groove G2 may be appropriately determined depending on the material, hardness, thickness, and the like of the brittle material substrate 1 and the resin 2. Although not particularly limited, for example, the depth of the groove G <b> 2 can be about 30 to 90% of the thickness of the resin 2. In FIG. 4, the groove part G2 is formed in a rectangular shape in cross-section, but the cross-sectional shape of the groove part G2 is not necessarily limited to a rectangle.

  When the formation of the groove portion G2 is completed, a break process is performed to break the brittle material substrate 10 with resin along the planned division line L (step S3).

  FIG. 5 is a schematic cross-sectional view showing a state of the breaking device 300 that performs the breaking process. FIG. 6 is a diagram illustrating the brittle material substrate 10 with a resin after the break processing in which the crack CR is formed in the thickness direction of the brittle material substrate along the groove portion G1.

  The break device 300 includes a frame 302 that holds an elastic film 301 to which a work piece is adhesively fixed while being horizontally opened at the edge thereof, and two upper break bars 303 that move up and down above the work piece. (303a, 303b) and one lower break bar 304 that moves up and down below the workpiece. The two upper break bars 303a and 303b are spaced apart in the horizontal direction (left and right direction in the drawing). Preferably, the distance between the two is adjustable. Further, the lower break bar 304 is arranged at a position equidistant from the two upper break bars 303a and 303b in the horizontal direction.

  In the case where the brittle material substrate 10 with resin is broken using the break device 300, first, the brittle material substrate 10 with resin is adhesively fixed to the adhesive surface 301 a of the elastic film 301 using the main surface 2 a of the resin 2 as a fixing surface. Then, the elastic film 301 is opened by the frame 302 with the adhesive surface 301a facing upward.

  Subsequently, the lower break bar 304 is disposed at a position on the extension line of the planned division line L (hereinafter, the target division planned line) to be broken in a state of being separated from the elastic film 301. Then, the two upper break bars 303a and 303b are separated from the brittle material substrate 1 so as to be symmetric with respect to the planned dividing line L and at a predetermined interval so as to sandwich the groove portion G1. Deploy. In this state, the two upper break bars 303 are lowered to bring the respective leading ends 303e into contact with the main surface 1b of the brittle material substrate 1, and the lower break bar 304 is raised so that the leading end 304e is attached to the elastic film 301. Via the main surface 2a of the resin 2. Thereby, the brittle material substrate 10 with resin is urged vertically downward by the upper break bar 303 and vertically upward by the lower break bar 304. Then, a three-point bending stress acts on the brittle material substrate 10 with resin at the position of the target division planned line. When such stress acts, crack extension along the target division planned line starts from the tip portion P1 of the groove portion G1 provided at the position, and a vertical crack CR reaching the groove portion G2 directly below is formed. By the formation of the crack CR, a break is made at the position of the target division planned line.

  In FIG. 5, the tip 303e of the upper break bar 303 and the tip 304e of the lower break bar 304 form an acute angle in cross section, and are in line contact with the brittle material substrate 1 or the elastic film 301 (shown in FIG. 5). This is not essential, but the tip 303e and the tip 304e have a rectangular shape in cross section, and are in surface contact with the brittle material substrate 1 or the elastic film 301. It is also possible to use this mode.

  FIG. 6 shows a state in which the same processing has been performed on all the division lines L. When the dividing method according to the present embodiment is used, the crack CR is perpendicular to the groove portion G2 of the resin 2 along the predetermined dividing line L from the tip portion P1 of the groove portion G1 provided in the brittle material substrate 1 and surely. (Excellent reproducibility) In addition, after the break processing, as shown in FIG. 6, the plurality of divided pieces 11 are substantially in contact with each other in the crack CR, but naturally, each divided piece 11 is physically They are separate and can be handled individually.

  FIG. 7 is a view showing a state after the break processing of the brittle material substrate 10 with resin that was processed in the same procedure as described above except that the groove forming process was not performed. In such a case, as shown in FIG. 7, an oblique crack (crack CR <b> 1 or crack CR <b> 2) that is shifted from the planned dividing line L is formed in the resin 2, and an oblique crack occurs, or the resin 2 extends only halfway. In some cases, a crack (crack CR3 or crack CR4) or a crack (crack CR5) extending only in the range of the brittle material substrate 1 is formed. Even if good division can be performed, it is necessary to apply a greater force to the brittle material substrate 10 with resin in the case of the break than in the case of the present embodiment. These means that the formation of the groove G2 in the resin 2 in advance as in the present embodiment is effective in favorably breaking the brittle material substrate 10 with resin.

  As described above, according to the present embodiment, in dividing a brittle material substrate with a resin made of a brittle material substrate having a V-shaped groove (V groove) on one main surface, Splitting the brittle material substrate with resin perpendicular to its main surface with higher certainty by making a break after forming the groove at the planned split position on the side It can be divided at the planned position.

<Modification>
The mode of the break processing is not limited to that of the above-described embodiment. For example, the configuration of the lower break bar is the same as that of the above-described break device 300, but the upper break bar is in contact with the main surface 1b of the brittle material substrate 1 and the elastic film 301 with a sufficient contact area. It is also possible to use a break device that has a shape that is provided and that has a contact surface with the main surface 1b as a receiving member made of an elastic member such as rubber. In such a break device, the lower break bar disposed on the extension line of the target division planned line in the state in which the receiving member is in contact with the main surface 1b on which the V-shaped groove portion G1 is formed in advance, is an elastic film. A break is realized by making a line contact with the main surface 2a on the resin side via 301 and urging the brittle material substrate 10 with resin.

  Alternatively, instead of a break device that breaks with a break bar, a break device of a type that extends a vertical crack in the thickness direction of the brittle material substrate 10 with resin by pressing the main surface 2a on the resin 2 side with a roller is used. May be. Alternatively, the brittle material substrate with resin 10 on which the V-shaped groove G1 is formed may be folded by a human hand without using a break device.

DESCRIPTION OF SYMBOLS 1 Brittle material substrate 1a, 1b Main surface of 2 brittle material substrate Resin 10 Brittle material substrate with resin 11 Divided piece 100 Dicer 101 Stage 102 Blade 300 Break device 301 Elastic film 301a Adhesive surface 302 Frame 303 (303a, 303b) Upper break bar 303e (Upper break bar) tip 304 Lower break bar 304e Tip CR, CR1 to CR5 Crack G1 Groove part (brittle material substrate side) Groove part G2 (Resin side) Groove part L Divided line P1 (Groove part) tip Part P2 (resin side) planned division position

Claims (5)

Resin is adhered to one main surface of the brittle material substrate, and the brittle material substrate with resin having a V-shaped groove portion provided on the other main surface of the brittle material substrate, starting from the tip of the V-shaped groove portion. As a method of dividing perpendicularly to the main surface,
A groove portion forming step of forming a second groove portion at a planned division position on the resin side of the brittle material substrate with resin;
A breaking step of dividing the brittle material substrate with resin along the V-shaped groove,
A method for dividing a brittle material substrate with resin, characterized in that: A method for dividing a brittle material substrate with resin according to claim 1,
The breaking step is
Two positions on the main surface of the brittle material substrate that are symmetric with respect to the V-shaped groove, and a position on the resin-side main surface on the extension line of the tip of the V-shaped groove. On the other hand, it is a step of dividing the brittle material substrate with resin by energizing with a predetermined energizing member.
A method for dividing a brittle material substrate with resin, characterized in that: A method for dividing a brittle material substrate with a resin according to claim 1 or 2,
The breaking step is a step of dividing the brittle material substrate with resin by extending a crack from the tip of the V-shaped groove to the second groove.
A method for dividing a brittle material substrate with resin, characterized in that: A method for dividing a brittle material substrate with a resin according to any one of claims 1 to 3,
The groove portion forming step is a step of forming the second groove portion by a dicer.
A method for dividing a brittle material substrate with resin, characterized in that: A method for dividing a brittle material substrate with a resin according to any one of claims 1 to 4,
The method for dividing a brittle material substrate with resin, wherein the brittle material substrate is LTCC or HTCC.

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