201214541 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種對脆性材料基板進行分割之方法，尤 其係關於一種對接著有樹脂之陶瓷基板進行分割之方法。 【先前技術】 關於對使用 LTCC(Low Temperature Co-fired Ceramics， 低溫共燒陶莞）或HTCC(High Temperature Co-fired Ceramics, 高溫共燒陶瓷）等之陶瓷及其他脆性材料而構成之脆性材 料基板（包括於主面或内部形成有電氣電路等之基板）進行 分割並切出多個分割單片之方法，有各種各樣之方法。例 如，有如下公知之形態：使用劃線輪等於脆性材料基板之 分割預定位置形成劃線，藉此沿著劃線而於脆性材料基板 之厚度方向形成垂直裂痕，然後，藉由施加外力（負載）而 使垂直裂痕於脆性材料基板之厚度方向上伸展，由此使脆 性材料基板分斷（例如，參照專利文獻丨）。於該情形時，沿 著劃線所形成之垂直裂痕於脆性材料基板之厚度方向上伸 展並到達背面，藉此使脆性材料基板分斷。或者亦存在如 下情況：於脆性材料基板之製造過程中於分割預定位置預 先形成V字形槽（稱為V槽等），沿著V槽而進行分斷。一般 而s ’ V槽係於陶瓷之前驅物（陶瓷生胚片之積層體）之階 段形成。 [先行技術文獻1 [專利文獻】 [專利文獻1]日本專利特開2010-173251號公報 155156.doc 201214541 【發明内容】 [發明所欲解決之問題】 於脆性材料基板中，為了對形成於主面之電路進行保護 等’有使玻璃環氧化物等之熱硬化性樹脂附著於該主面之 脆性材料基板（具有樹脂之脆性材料基板）^於使該具有樹 脂之脆性材料基板以上述方法自脆性材料基板側分斷之情 形時’會因為脆性材料基板與樹脂之材質不同，財產生垂 直裂痕未伸展至樹脂部分、或未貫通樹脂部分之瑕疵。或 者’亦有裂痕未垂直伸展而產生被稱為倒刺等之斜裂之情 形。 又’於將形成有v槽之脆性材料基板作為具有樹脂之脆 性材料基板之情形時’可取得如下效果：於使熱硬化性樹 脂附著之過程中產生於脆性材料基板上之翹曲會藉由v槽 而得到緩和。但是，其另一方面，於分割該具有樹脂之脆 性材料基板之情形時，與劃線之前端部相比尖銳度較弱之 V槽之前端部（最下點）成為分斷之起點，因此存在裂痕難 以進一步垂直伸展之問題。 本發明係有蓥於上述課題而完成者，其目之在於提供一 種以與先前相比更高之確實性而分割於脆性材料基板上形 成有V槽之具有樹脂之脆性材料基板之方法。 [解決問題之技術手段] 為解決上述課題，技術方案1之發明係一種具有樹脂之 脆性材料基板之分割方法’其特徵在於：其係將於脆性材 料基板之一主面上附著有樹脂、且於上述脆性材料基板之 155156.doc 201214541 另一主面上設置有v字形槽 。卩之具有樹脂之脆性材料基 板，以上述V字形槽部之 何针丞 W 碼°卩作為起點而對主面垂直分 割之方法，其包括··槽部彡 性柑料其# , 成步驟，於上述具有樹脂之脆 a材枓基板之樹脂側之分 斷步驟，沿著上述V字形槽二： 材料基板。 p而分割上述具有樹脂之脆性 ^㈣案2之發明係如技術方案！之具有樹脂之脆性㈣ 土之刀口 J方法，其中上述分斷步驟包括如下之步驟：分 斷以特定之施力構件對上述脆性材料基板之主面上且相對 於上述V字形槽部而對稱之2個位置、及上述樹脂側之主面 且上述V字形槽部之前端部之延長線上之位置施力，而分 割上述具有樹脂之脆性材料基板。 技術方案3之發明係、如技術方案1或2之具有樹脂之脆性 材料基板之分割方法，纟中上述分斷步驟係藉由使裂痕自 上述V字形槽部之前料向上述第2槽部伸展而分割上述具 有樹爿曰之脆性材料基板之步驟。 技術方案4之發明係如技術方案丨至3 _任一技術方案之 具有樹脂之脆性材料基板之分割方法’其中上述槽部形成 步驟係藉由切割機而形成上述第2槽部之步驟。 技術方案5之發明係如技術方案丨至4中任一技術方案之 具有樹脂之脆性材料基板之分割方法，其中上述脆性材料 基板為LTCC或HTCC。 【發明之效果】 根據技術方案1至5之發明，可將具有樹脂之脆性材料基 155156.doc 201214541 板於相對於其主面垂直之分割預定位置確實地進行分割。 【實施方式】 〈具有樹脂之脆性材料基板> 圖1係表示本實施形態中成為分割對象之具有樹脂之脆 性材料基板10之模式圖》具有樹脂之脆性材料基板1〇係使 玻璃環氧化物等之熱硬化_脂（以下，亦僅稱為樹脂）2, 附著於使用 LTCC(Low Temperature Co-fired Ceramics，低 溫共燒陶究）或HTCC(High Temperature co-fired Ceramics，_ 高溫共燒陶究）等之陶究及其他脆性材料所構成之脆性材 料基板1之一主面13上。再者，於本實施形態中，脆性材 料基板1包括於主面或内部形成有電氣電路等之基板。樹 脂2係例如基於對形成於主面之電路進行保護等之目的而 設置。 於脆性材料基板1之另一主面比側，與具有樹脂之脆性 材料基板10之分割預定位置對應地預先設置有V字形槽部 G1。槽部G1係於附著樹脂2之前，於脆性材料基板丨之製 造時所形成。例如，藉由於煅燒前之脆性材料基板丨（更具 體而言’將包含陶瓷成分與有機成分之陶瓷生胚片積層壓 接而成之積層體）上藉由衝壓等預先設置凹部等而形成槽 部G1。槽部G1具有緩和伴隨樹脂2硬化時之收縮而作用於 脆性材料基板1之主面la上之壓縮應力之效果。 又’於圖1中’將表示具有樹脂之脆性材料基板1〇之分 割預定位置之分割預定線L以虛線表示。分割預定線l之脆 性材料基板1側之端部與槽部G1之前端部P1 一致。如下所 155156.doc • 6 - 201214541 述月Ί p 1成4分割具有樹脂之脆性材料基板i f无。i 土 』〜7¾ .’再者’於本實施形·態中“分割預定位置係言免定為與脆 性材料基板i之主面la、lb垂直。又，將分割财社之樹 脂2側之端部（與主面h之交又位置）稱為分割預定位置ρ2β 於該情形時，前端部PM分割就位置叫於與紙面垂直 之方向延伸之直線。 再者圖1中之脆性材料基板1與樹脂2之尺寸、或樹脂2 之附者形態僅為例示。脆性材料基板!及樹脂2均可按照各 自之目的而選擇適當之尺寸。雖無特別限定，但可為例 如，具有樹脂之脆性材料基板1〇之厚度為〇 3〜3 mm左右， 脆性材料基板1之厚度為0.^2 mm左右，樹脂2之厚度為 0.1〜2 mm左右。又，於圖1中（以下之圖中亦相同），表示 處之分割預定位置（5條分割預定線L)，但此亦僅為例示 5 再者，關於槽部G1之尺寸或形狀，亦可選擇各種形態。 <具有樹脂之材料基板之分割> 圖2係表示對本實施形態中具有樹脂之脆性材料基板ι〇 進行分割之處理順序之圖。以下，按照圖2所示之順序， 對本實施$態之具有樹脂之脆性材縣板 <分割處理之詳 情進行說明。 首先，準備具有樹脂之脆性材料基板1〇(步驟S1)。於該 具有樹脂之脆性材料基板10上，如圖i所示，形成有槽部 G1，並且設定與脆性材料基板丨之主面u、比垂直之分割 預疋位置。然後，於所準備之具有樹脂之脆性材料基板ι〇 之樹脂2側之分割預定位置p2，進行槽部形成加工（步驟 155156.doc 201214541 52) °槽部形成加工係可自切割機（口卜匕吕Saw)、雷射光束 及其他公知之加工方法中選擇適當之加工方法而進行。 圖3係表示使用切割機100進行槽部形成加工之情形之模 式圖。圖4係表示藉由該槽部形成加工而形成有槽部〇2之 具有樹脂之脆性材料基板丨〇之圖。 於使用切割機1 〇〇進行槽部形成加工之情形時，首先， 將具有樹脂之脆性材料基板1〇以使樹脂2之主面2a成為被 加工面之方式，將脆性材料基板1之主面lb作為載置面而 載置固疋於切割機1 〇〇之平台i 〇丨上。然後，將外周部分以 材質為金鋼石等之研削用之刀尖之圓板狀之刀片1〇2調整 至與槽部G2之深度相稱之高度位置。然後，藉由未圖示之 驅動機構使刀片102以軸i〇2a為中心如箭頭AR1所示一面 旋轉，一面沿著分割預定位置P2使平台1〇1如箭頭AR2所 示移動或者使刀片102如箭頭AR3所示移動，由此形成槽 部G2。圖4係表示對所有之分割預定位置p2進行相同加工 後之狀態。 槽部G2之深度可根據脆性材料基板丨及樹脂2之材質、硬 度、厚度等而適當設定。雖無特別限定，但槽部〇2之深度 例如可為樹脂2之厚度之3〇〜90%左右。再者，於圖4_將 槽部G2形成為剖面觀察時成矩形狀，但槽部⑺之剖面形 狀未必限定於矩形。 於完成槽部G2之形成後，繼而，進行將具有樹脂之脆性 材料基板10沿著分割預定線L而分斷之分斷加工（步驟 53) 。 155156.doc 201214541 圖5係表示進行分斷加工之分斷裝置300之情形之模式剖 面圖°圖6係表示沿著槽部⑴而於脆性材料基板之厚度方 向上形成有裂痕。尺之分斷加工後之具有樹脂之脆性材料 基板10之圖。 分斷裝置300主要具備：將黏著固定有被加工物之彈性 膜301於其端緣部水平張開並保持之框架;於較被加工 物更上側進行上下移動之2個上側分斷棒3〇3(3、 3〇3b广及於較被加工物更下側進行上下移動之丨個下側分 斷棒304 2個上側分斷棒3〇3a、303b於水平方向（圖面觀 察為左右方向）上分開配置。較佳為可調節兩者之分開距 離。另外，下側分斷棒304配置於水平方向上與2個上側分 斷棒303a、3 03b相隔等距離之位置。 於使用分斷裝置300而進行具有樹脂之脆性材料基板1〇 之分斷之情形時，首先，將樹脂2之主面2a作為固定面， 將具有樹脂之脆性材料基板10黏著固定於彈性膜3〇1之黏 著面3 〇 1 a。然後，於以黏著面3 01 a為上方之狀態下，將彈 性膜301於框架3〇2上張開。 繼而，將下側分斷棒304以與彈性膜301分開之狀態而配 置於成為分斷對象之分割預定線L(以下，稱為對象分割預 定線）之延長線上之位置。然後，將2個上侧分斷棒3〇3&、 303b以與脆性材料基板丨分開之狀態並相對於該分割預定 線L而對稱之方式、且夾著槽部〇 1之方式，以特定之間隔 分開配置。於該狀態下，使2個上側分斷棒3〇3下降而使各 自之前端303e抵接於脆性材料基板1之主面lb，並且使下 155156.doc 201214541 側分斷棒3 04上升而使其前端304e經由彈性膜3 〇 1而抵接於 樹脂2之主面2a。由此’具有樹脂之脆性材料基板1 〇藉由 上側分斷棒303而鉛垂朝下地受到施力，並藉由下側分斷 棒304而鉛垂朝上地受到施力。於是，於具有樹脂之脆性 材料基板10上，3點之彎曲應力作用於對象分割預定線之 位置。當該應力作用時，會以設置於該位置之槽部G1之前 端部P1為起點，產生沿著該對象分割預定線之裂痕伸展， 而形成到達正下方之槽部G2之垂直之裂痕CR。藉由該裂 痕CR之形成而完成對象分割預定線之位置之分斷。 再者’於圖5中，例示出上側分斷棒303之前端303e與下 側分斷棒304之前端304e於剖面觀察時成銳角，並與脆性 材料基板1或彈性膜301線接觸（於圖5所示之剖面中為點接 觸）之形態，但並非必需如此，亦可為前端303e及前端 304e於剖面觀察時成矩形狀，並與脆性材料基板1或彈性 膜301面接觸之形態。 圖6係表示對所有之分割預定線l進行相同加工後之狀 態。於使用本實施形態之分割方法之情形時，裂痕自 設置於脆性材料基板1上之槽部G1之前端部P1、沿著分割 預定線L而向樹脂2之槽部G2垂直且確實地（再現性良好地） 伸展。另外，於分斷加工之後，如圖6所示，複數個分割 單片11彼此成為於裂痕CR處大致接觸之狀態，但當然，各 個分割單片11於物理上為不同之個體，可進行個別處理。 圖7係表示用於對比所示之、關於除了未進行槽部形成 加工之外、其餘以與上述相同之順序進行加工後之具有樹 155156.doc -10· 201214541 脂之脆性材料基板1G之分斷加工後之情形之圖。於該情形 時’：圖7所示’有時亦會出現如下情況：樹脂2中藉由形 成自分割預定線L偏離之歪斜裂痕（裂痕CR1或裂痕CR2)而 產生斜裂’或者形成有僅伸展到樹脂2之中途之裂痕（裂痕 CR3或裂痕CR4)，或僅於脆性材料基板1之範圍内伸展之 ^痕（裂痕CR5) »又，假設即便已進行良好之分割，但於 刀斷時，仍必需對具有樹脂之脆性材料基板10賦予較本實 施瓜態更大之力。這意味著，如本實施形態所述，於樹脂 2上預先形成槽部G2 ’能有效地將具有樹脂之脆性材料基 板10良好地分斷。 、 如所說明般，根據本實施形態，對包含於一主面 上°又置有V子形槽部（V槽）之脆性材料基板之具有樹脂之脆 I·生材料基板進行分割時，於樹脂側之分割預定位置形成槽 部之後進行分斷加卫，由此能以與先前相比更高之確實性 將/、有樹知之脆性材料基板於相對於其主面而垂直之分割 預定位置進行分割。 t變形例> 刀斷加工之形態並不限定於上述之實施形態。例如，亦 可為使用如下分斷裝置之形態：下側分斷棒之構成與上述 刀斷裝置3GG為相fg]，但上側分斷棒具有以較寬幅而與脆 性材料基板1之主面lb進而與彈性膜3〇1以充分之接觸面積 觸之形狀，且作為與主面lb之接觸面含有橡膠等之彈 牛之支樓構件而設置。該分斷裝置中，於使上述支樓 構件預先接觸到形成有V字形槽部G1之主面lb之狀態下， 155156.doc 201214541 將配置於對象分割預定線之延長線上之下側分斷棒經由彈 性膜301而對樹脂側之主面2a進行線接觸，並對具有樹脂 之脆性材料基板1 〇施力，由此實現分斷。 或者，亦可使用如下形式之分斷裝置：取代藉由分斷棒 進行分斷之分斷裝置，利用輥來按壓樹脂2側之主面2a， 由此使垂直裂痕於具有樹脂之脆性材料基板10之厚度方向 上伸展。或者，亦可不使用分斷裝置，而利用人之手來折 斷形成有V字形槽部G1之具有樹脂之脆性材料基板1〇。 【圖式簡單說明】 圖1係表示本實施形態中成為分割對象之具有樹脂之脆 性材料基板10之模式圖； 圖2係表示對本實施形態中具有樹脂之脆性材料基板1〇 進行分割之處理順序之圖； 圖3係表示使用切割機1〇〇進行槽部形成加工之情形之模 式圖； 圖4係表示藉由槽部形成加工而形成有槽部G2之具有樹 脂之脆性材料基板1〇之圖； 圖5係表不進行分斷加工之分斷裝置300之情形之模式剖 面圖； 圖6係表7F 著槽部G1 *於脆性材料基板之厚度方向上 形成有裂痕CR之分斷加工後之具有樹脂之脆性材料基板 之圖；及 丁表不關於未進行槽部形成加工之具有樹脂之脆性 材料基板1〇之分斷加工後之情形之圖。 155156.doc -12- 201214541 【主要元件符號說明】 1 脆性材料基板 la' lb (脆性材料基板之）主面 2 樹脂 2a 樹脂側之主面 10 具有樹脂之脆性材料基板 11 分割單片 100 切割機 101 平台 102 刀片 300 分斷裝置 301 彈性膜 301a 黏著面 302 框架 303(303a、303b) 上側分斷棒 303e (上側分斷棒之）前端 304 下側分斷棒 304e 前端 CR、CR1-CR5 裂痕 G1 (脆性材料基板側之）槽部 G2 (樹脂側之）槽部 L 分割預定線 PI (槽部之）前端部 P2 (樹脂側之）分割預定位置 155156.doc 13·201214541 SUMMARY OF THE INVENTION [Technical Field] The present invention relates to a method of dividing a brittle material substrate, and more particularly to a method of dividing a ceramic substrate followed by a resin. [Prior Art] A brittle material substrate composed of ceramics and other brittle materials such as LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics) There are various methods for dividing and cutting out a plurality of divided single pieces (including a main surface or a substrate on which an electric circuit or the like is formed). For example, there is a well-known form in which a scribing wheel is used to form a scribe line equal to a predetermined position of the brittle material substrate, whereby a vertical crack is formed along the scribe line in the thickness direction of the brittle material substrate, and then, by applying an external force (load The vertical crack is stretched in the thickness direction of the brittle material substrate, thereby breaking the brittle material substrate (for example, refer to Patent Document). In this case, the vertical crack formed along the scribe line extends in the thickness direction of the brittle material substrate and reaches the back surface, thereby breaking the brittle material substrate. Alternatively, there is a case where a V-shaped groove (referred to as a V-groove or the like) is formed in advance at a predetermined division position in the manufacturing process of the brittle material substrate, and is divided along the V-groove. Typically, the s' V-groove is formed at the stage of the ceramic precursor (the layer of the ceramic green sheets). [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open No. 2010-173251, No. 155156.doc 201214541 [Disclosure] [Problems to be Solved by the Invention] In a brittle material substrate, in order to form a main The circuit of the surface is protected, etc., a brittle material substrate (a brittle material substrate having a resin) on which a thermosetting resin such as glass epoxy is adhered to the main surface, and the brittle material substrate having the resin is self-made by the above method. When the side of the brittle material substrate is broken, it is because the material of the brittle material substrate and the resin is different, and the vertical crack does not extend to the resin portion or the resin portion is not penetrated. Or 'there is also a crack that does not extend vertically and produces a shape called a barb. Further, when the brittle material substrate having the v-groove is formed as the substrate of the brittle material having the resin, the following effect can be obtained: the warpage generated on the brittle material substrate during the process of attaching the thermosetting resin is caused by The v-slot is moderated. However, on the other hand, in the case of dividing the resin-containing brittle material substrate, the front end portion (lowest point) of the V-groove having a weaker sharpness than the end portion before the scribing becomes the starting point of the breaking, There is a problem that cracks are difficult to extend further vertically. The present invention has been made in view of the above problems, and an object thereof is to provide a method of forming a brittle material substrate having a V-groove formed on a brittle material substrate by a higher degree of reliability than before. [Means for Solving the Problems] In order to solve the above problems, the invention of claim 1 is a method for dividing a substrate of a brittle material having a resin, characterized in that a resin is adhered to one main surface of a brittle material substrate, and A v-shaped groove is provided on the other main surface of the above-mentioned brittle material substrate 155156.doc 201214541. A method for vertically dividing a main surface by using a V-shaped groove portion of the V-shaped groove portion as a starting point, comprising: a groove portion, a citrus material, and a step, The step of breaking the resin side of the resin-containing brittle a-material substrate is along the V-shaped groove 2: material substrate. p is divided into the above-mentioned invention with the brittleness of the resin ^ (4) Case 2 is a technical solution! The brittleness of the resin (4) the method of cutting the blade J, wherein the step of dividing comprises the steps of: severing the symmetry of the main surface of the brittle material substrate with respect to the V-shaped groove portion by a specific urging member The two positions and the main surface of the resin side and the position on the extension line of the front end portion of the V-shaped groove portion are biased to divide the resin-containing brittle material substrate. The invention of claim 3 is the method for dividing a substrate of a brittle material having a resin according to claim 1 or 2, wherein the step of breaking is performed by causing a crack to extend from the front surface of the V-shaped groove portion to the second groove portion And the step of dividing the above-mentioned substrate having a brittle material of the tree shrew. The invention of claim 4 is the method of dividing a substrate of a brittle material having a resin according to any one of the aspects of the invention, wherein the step of forming the groove portion is a step of forming the second groove portion by a cutter. The invention of claim 5, wherein the brittle material substrate is LTCC or HTCC. [Effect of the Invention] According to the inventions of claims 1 to 5, the brittle material base 155156.doc 201214541 having a resin can be surely divided at a predetermined predetermined position perpendicular to the main surface thereof. [Embodiment] <Crystal material substrate with resin> Fig. 1 is a schematic view showing a brittle material substrate 10 having a resin to be divided in the present embodiment. Thermosetting _lipid (hereinafter, also referred to as resin) 2, attached to LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics) A main surface 13 of one of the brittle material substrates 1 composed of ceramics and other brittle materials. Further, in the present embodiment, the brittle material substrate 1 includes a substrate on which an electric circuit or the like is formed on the main surface or inside. The resin 2 is provided, for example, for the purpose of protecting a circuit formed on the main surface. On the other main surface side of the brittle material substrate 1, a V-shaped groove portion G1 is provided in advance in correspondence with a predetermined predetermined position of the resin-containing brittle material substrate 10. The groove portion G1 is formed before the resin 2 is attached, and is formed at the time of manufacture of the brittle material substrate. For example, a groove is formed by preliminarily providing a recess or the like by press or the like on a brittle material substrate 煅 before calcination (more specifically, a laminate obtained by laminating a ceramic green sheet containing a ceramic component and an organic component) Department G1. The groove portion G1 has an effect of alleviating the compressive stress acting on the main surface 1a of the brittle material substrate 1 in association with shrinkage upon curing of the resin 2. Further, in Fig. 1, a predetermined dividing line L indicating a predetermined predetermined position of the resin brittle material substrate 1 is indicated by a broken line. The end portion on the brittle material substrate 1 side of the division planned line 1 coincides with the front end portion P1 of the groove portion G1. The following is 155156.doc • 6 - 201214541 述月Ί p 1 into 4 divided brittle material substrate with resin i f none. i soil 』 73 ⁄ ' ' ' ' ' ' ' ' ' ' ' ' “ “ “ 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 分割 预定 预定The end portion (position with the main surface h) is referred to as a division predetermined position ρ2β. In this case, the position at which the front end portion PM is divided is called a straight line extending in a direction perpendicular to the plane of the paper. Further, the brittle material substrate 1 in Fig. 1 The size of the resin 2 or the form of the resin 2 is merely exemplified. The brittle material substrate and the resin 2 may each have an appropriate size for each purpose. Although not particularly limited, it may be, for example, brittleness of the resin. The thickness of the material substrate 1〇 is about 3 to 3 mm, the thickness of the brittle material substrate 1 is about 0.2 mm, and the thickness of the resin 2 is about 0.1 to 2 mm. Further, in Fig. 1 (in the following figure) The same applies to the predetermined position (5 divided lines L), but this is also merely an example. Further, various shapes may be selected for the size or shape of the groove portion G1. Subdivision of the substrate> Fig. 2 is a view showing the present embodiment. The processing procedure of dividing the resin brittle material substrate ι 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情 详情a resin brittle material substrate 1 (step S1). On the resin-containing brittle material substrate 10, as shown in FIG. 1, a groove portion G1 is formed, and is set to be perpendicular to the main surface u of the brittle material substrate 、. The pre-twisting position is divided. Then, the groove forming process is performed on the predetermined predetermined position p2 on the resin 2 side of the prepared brittle material substrate ι (step 155156.doc 201214541 52) A cutting machine (porter), a laser beam, and other known processing methods are selected to select an appropriate processing method. Fig. 3 is a schematic view showing a state in which the groove forming process is performed using the cutter 100. A diagram showing a resinous brittle material substrate 形成 in which the groove portion 〇2 is formed by the groove portion forming process. When the groove forming process is performed using the cutter 1 First, the main surface 2b of the brittle material substrate 1 is placed on the cutting machine 1 so that the main surface 2a of the resin material 2 becomes the surface to be processed, so that the main surface 2a of the resin material 1 is placed on the cutting surface. Then, the outer peripheral portion is adjusted to a height position commensurate with the depth of the groove portion G2 by a circular plate-shaped blade 1〇2 of a cutting edge made of diamond or the like. The blade 102 is rotated about the axis i〇2a as indicated by an arrow AR1 by a driving mechanism (not shown), and the stage 1〇1 is moved as indicated by an arrow AR2 along the divided predetermined position P2 or the blade 102 is rotated by an arrow AR3. The movement is shown, thereby forming the groove portion G2. Fig. 4 shows a state in which all of the divided predetermined positions p2 are processed in the same manner. The depth of the groove portion G2 can be appropriately set depending on the material, hardness, thickness, and the like of the brittle material substrate 丨 and the resin 2. Although not particularly limited, the depth of the groove portion 例如2 may be, for example, about 3 to 90% of the thickness of the resin 2. Further, in Fig. 4, the groove portion G2 is formed in a rectangular shape when viewed in cross section, but the cross-sectional shape of the groove portion (7) is not necessarily limited to a rectangular shape. After the formation of the groove portion G2 is completed, the breaking process of dividing the brittle material substrate 10 having the resin along the dividing line L is performed (step 53). 155156.doc 201214541 Fig. 5 is a schematic cross-sectional view showing a state in which the breaking device 300 for dividing processing is performed. Fig. 6 is a view showing a crack formed in the thickness direction of the brittle material substrate along the groove portion (1). A diagram of the resinous brittle material substrate 10 after the cutting process. The breaking device 300 mainly includes a frame that horizontally opens and holds the elastic film 301 to which the workpiece is adhered and fixed to the edge portion thereof, and two upper dividing bars that move up and down on the upper side of the workpiece. 3 (3, 3〇3b is wider than the lower side of the workpiece to move up and down the lower side breaking bar 304 2 upper side breaking bars 3〇3a, 303b in the horizontal direction (the left side of the drawing is observed It is preferably arranged separately. It is preferable to adjust the separation distance between the two. Further, the lower breaking bar 304 is disposed at a position equidistant from the two upper dividing bars 303a and 303b in the horizontal direction. When the device 300 is used to break the brittle material substrate 1 of the resin, first, the main surface 2a of the resin 2 is used as a fixing surface, and the resin-containing brittle material substrate 10 is adhered and fixed to the elastic film 3〇1. The surface 3 〇 1 a. Then, the elastic film 301 is opened on the frame 3〇2 with the adhesive surface 310a as the upper side. Then, the lower side breaking bar 304 is separated from the elastic film 301. In the state, it is placed on the division line L to be the object to be divided (hereinafter, Positioning the extension line on the predetermined line of the object. Then, the two upper side breaking bars 3〇3&, 303b are separated from the brittle material substrate 并 in a state of being symmetrical with respect to the dividing line L, In this state, the two upper side breaking bars 3〇3 are lowered and the respective front ends 303e are brought into contact with the main surface lb of the brittle material substrate 1 in such a manner that the groove portion 〇1 is interposed therebetween. And the lower portion 155156.doc 201214541 side split bar 3 04 is raised so that the front end 304e abuts against the main surface 2a of the resin 2 via the elastic film 3 。1. Thus, the 'brittle material substrate 1 having resin is used The upper side breaking bar 303 is biased downward, and is biased upward by the lower side breaking bar 304. Thus, the bending stress at 3 points on the resin-containing brittle material substrate 10 Acting on the position where the object is divided by the predetermined line. When the stress acts, the end portion P1 of the groove portion G1 disposed at the position is used as a starting point, and the crack extending along the predetermined line of the object is generated, and the formation is directly below. The vertical crack CR of the groove portion G2. The division of the position of the object division planned line is completed by the formation of the crack CR. Further, in Fig. 5, the front end portion 303e of the upper side breaking rod 303 and the front end portion 304e of the lower side breaking rod 304 are observed in the cross section. An acute angle and a line contact with the brittle material substrate 1 or the elastic film 301 (point contact in the cross section shown in FIG. 5), but this need not be the case, and the front end 303e and the front end 304e may be rectangular when viewed in cross section. The shape is in contact with the brittle material substrate 1 or the elastic film 301. Fig. 6 shows a state in which all the predetermined dividing lines 1 are processed in the same manner. When the dividing method of the present embodiment is used, the crack is self-set. The end portion P1 of the groove portion G1 on the brittle material substrate 1 extends perpendicularly and surely (reproducibly) to the groove portion G2 of the resin 2 along the line dividing line L. Further, after the breaking process, as shown in FIG. 6, the plurality of divided individual pieces 11 are in a state of being substantially in contact with each other at the crack CR, but of course, each of the divided pieces 11 is physically different from each other, and individual deal with. Fig. 7 is a view showing a portion of a brittle material substrate 1G having a tree 155156.doc -10·201214541 fat, which is processed in the same order as described above except for the groove forming process. A picture of the situation after processing. In this case, ': as shown in FIG. 7, 'there may also be a case where the resin 2 is formed by the occurrence of a skew crack (the crack CR1 or the crack CR2) which is deviated from the division planned line L, or is formed only with a crack that spreads to the middle of the resin 2 (crack CR3 or crack CR4), or a stretch that extends only within the range of the brittle material substrate 1 (crack CR5) » Again, even if a good division has been made, at the time of the knife break It is still necessary to impart a greater force to the substrate of the brittle material having the resin than to the present embodiment. This means that, as described in the present embodiment, the groove portion G2' is formed in advance on the resin 2, and the brittle material substrate 10 having the resin can be effectively separated. As described above, according to the present embodiment, when the resin-containing brittle I·green material substrate is included in a brittle material substrate including a V-shaped groove portion (V-groove) on one main surface, The predetermined side position of the resin side is formed by forming the groove portion, and then the cutting is performed, whereby the substrate of the brittle material can be vertically divided with respect to the main surface thereof with higher accuracy than before. Split. t Modified Example The form of the cutting process is not limited to the above embodiment. For example, the configuration may be such that the lower breaking bar is formed in the same phase as the cutting device 3GG, but the upper dividing bar has a wider width and a main surface of the brittle material substrate 1. Further, lb is provided in a shape in which the elastic film 3〇1 is in contact with a sufficient contact area, and is provided as a truss member including a rubber or the like on the contact surface with the main surface lb. In the breaking device, in a state where the branch member is brought into contact with the main surface lb in which the V-shaped groove portion G1 is formed in advance, 155156.doc 201214541 is disposed on the lower side of the extension line of the target division line. The main surface 2a on the resin side is brought into line contact via the elastic film 301, and the brittle material substrate 1 having the resin is biased to thereby achieve the breaking. Alternatively, a breaking device of a form in which a main portion 2a on the side of the resin 2 is pressed by a roller instead of a breaking device by means of a breaking bar may be used, thereby causing a vertical crack in a substrate having a brittle material having a resin 10 is stretched in the thickness direction. Alternatively, the resin-containing brittle material substrate 1A having the V-shaped groove portion G1 formed thereon may be broken by a human hand without using a breaking device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a resin-containing brittle material substrate 10 to be divided in the present embodiment. Fig. 2 is a view showing a processing procedure for dividing a brittle material substrate 1 having a resin in the present embodiment. Fig. 3 is a schematic view showing a state in which a groove portion forming process is performed using a cutter 1; Fig. 4 is a view showing a resinous brittle material substrate 1 having a groove portion G2 formed by a groove portion forming process. Figure 5 is a schematic cross-sectional view showing the case where the breaking device 300 is not subjected to the breaking process; Figure 6 is a groove portion G1 of the table 7F * After the breaking process is formed in the thickness direction of the brittle material substrate A diagram of a substrate having a brittle material of a resin; and a diagram showing a state after the breaking process of the resin-containing brittle material substrate 1 without performing the groove forming process. 155156.doc -12- 201214541 [Description of main components] 1 The main surface of the brittle material substrate la' lb (the brittle material substrate) 2 Resin 2a The main surface of the resin side 10 The resin brittle material substrate 11 The split single piece 100 cutting machine 101 platform 102 blade 300 breaking device 301 elastic film 301a adhesive surface 302 frame 303 (303a, 303b) upper side breaking bar 303e (upper side breaking bar) front end 304 lower side breaking bar 304e front end CR, CR1-CR5 crack G1 (groove material side) groove portion G2 (resin side) groove portion L division predetermined line PI (groove portion) front end portion P2 (resin side) division predetermined position 155156.doc 13·