TWI615365B - Cracking device - Google Patents

Abstract

The invention provides a cracking device, which can stack a layer of a brittle material substrate formed by laminating a layer including a resin or a metal on the main surface of the brittle material substrate, and the chip can be appropriately and easily broken without requiring a previous step.

A layer of a brittle material substrate including a resin or metal dissimilar material layer attached to one main surface of the brittle material substrate and a scribe line formed on the other main surface is broken along the scribe line from the dissimilar material layer side. The breaking device includes the cutting edge of the breaking rod which is in contact with the laminated brittle material substrate when breaking. The cutting edge includes two cutting surfaces forming an angle of 50 ° or less, and between the two cutting surfaces, and further includes a radius of curvature. A curved surface having an arc-shaped cross section of 5 μm or less or a flat surface having a linear cross-section having a width of 10 μm or less is another blade surface.

Description

Breaking device

The present invention relates to a substrate breaking device, and more particularly to a device for breaking a substrate including a layer of a brittle material including a resin or metal layer.

A semiconductor element is manufactured by a mother substrate formed by repeatedly forming a plurality of element regions on a brittle material substrate such as a ceramic substrate in a two-dimensional manner, along a boundary position (predetermined division) of each element region formed in advance. Position). As a starting point of the rupture, there are a scribe line formed by scribing a substrate surface with a scribing wheel, a scribe groove obtained by cutting the substrate surface in a line shape with a cutting tool such as a diamond cutter, or a thunder line. Ablation processing line obtained by ablating the substrate surface in a linear shape by radiating light, or processing line obtained by locally melting the substrate surface by laser light to linearly deteriorate the structure of the substrate (melt modification) Wait.

A rupture device capable of performing a rupture along the predetermined division position is known (for example, refer to Patent Document 1). In this previously known cracking device, it is possible to have a structure in which one pair of substrate supporting members (also referred to as a substrate holding portion in Patent Document 1) are separately arranged in a horizontal plane, and is also called a supporting blade. The mother substrate is supported by the substrate support member such that the predetermined dividing position is located between the substrate supporting members, and the breaking lever (blade in Patent Document 1) is pressed along the predetermined dividing position from above the mother substrate, thereby moving the mother substrate. The substrate is broken.

In addition, the above-mentioned mother substrate for manufacturing a semiconductor element includes a thermosetting resin such as glass epoxy to protect circuit patterns and the like formed on the main surface of a brittle material substrate. A mother substrate attached to the main surface, or a mother substrate having a metal layer attached to the main surface. In the case where the mother substrate is to be broken by the above-mentioned method, since the material of the resin or metal and the brittle material substrate is different, a problem arises that a part of the layer containing the resin or metal is not completely broken.

In order to cope with the above-mentioned problems, as a method of brittle material substrate with resin formed by dividing the resin perpendicularly to the main surface and attaching the resin to one of the main surface sides of the brittle material substrate, a known method is as follows. A step of forming a groove portion at a predetermined division position on the resin side of the brittle material substrate with resin; a scribe formation step of forming a scribe line at a predetermined division position on the brittle material substrate side of the brittle material substrate with resin; and a crack In step, a resin-containing brittle material substrate is divided along the scribe line (for example, refer to Patent Document 2).

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2004-39931

[Patent Document 2] Japanese Patent Laid-Open No. 2012-66479

Although the method disclosed in Patent Document 2 can reliably divide a brittle material substrate with resin at a predetermined division position and divide it vertically with respect to its main surface with excellent dimensional accuracy, it must be performed before the substrate breaking step. Since the groove part is formed in a step, there is a problem in that the number of working steps increases and the breaking operation cannot be performed efficiently. From the standpoint of manufacturing efficiency, it is desirable that good cracking can be performed only by the cracking step in a cracking device.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a cracking device capable of laminating a layer of a brittle material substrate including a layer of a resin or a metal on the main surface of the brittle material substrate. The premature step is suitable without the need for a previous step And easily break.

In order to solve the above problems, the invention of claim 1 is a cracking device, which is characterized in that a dissimilar material layer containing resin or metal is attached to one main surface of a brittle material substrate, and a scribe line is formed on the other main surface. The laminated brittle material substrate is fractured along the scribe line from the side of the dissimilar material layer; and the edge of the fracture rod which abuts the laminated brittle material substrate at the time of fracture includes two blades forming an angle of 50 ° or less And another curved surface having a circular arc-shaped cross section with a curvature radius of 5 μm or less between the two cutting surfaces.

The invention according to claim 2 is the breaking device according to claim 1, wherein the other cutting surface is a curved surface having an arc-shaped cross section with a curvature radius of 2 μm or more and 3 μm or less.

The invention of claim 3 is a cracking device, which is characterized in that a laminated brittle material substrate including a resin or metal dissimilar material layer is formed on one main surface of the brittle material substrate and a scribe line is formed on the other main surface. , Breaking along the above-mentioned scribing line from the side of the dissimilar material layer; and the edge of the breaking rod which abuts the substrate of the laminated brittle material at the time of breaking includes two cutting surfaces having an angle of 50 ° or less, and Between the two cutting surfaces, a flat surface having a straight cross section with a width of 10 μm or less is further included, that is, another cutting surface.

The invention according to claim 4 is the breaking device according to claim 3, wherein the other cutting edge surface is a flat surface having a cross section with a width of 1 μm or more and 5 μm or less.

The invention according to claim 5 is the splitting device according to any one of claims 1 to 4, characterized in that the angle formed by the two blade surfaces is 10 ° or more and 30 ° or less.

According to the inventions of the technical scheme 1 to the technical scheme 5, the prefabricated brittle material substrate can be well fractured without performing the pretreatment on the grooves for forming the dissimilar material layer, and without generating a gap.

1‧‧‧ Adhesive film

2‧‧‧ ring parts

2e‧‧‧Inner periphery

10‧‧‧ support parts

11‧‧‧ rotating parts

12‧‧‧ horizontal movable table

13‧‧‧Support

13h‧‧‧Opening

14‧‧‧ split

14a‧‧‧Main body

14b‧‧‧Blade

14h‧‧‧through hole

15‧‧‧ Rupture rod mounting section

15a‧‧‧ holder

15b‧‧‧ flange

15c‧‧‧base

15d, 15e‧‧‧Fixing bolts

16‧‧‧lifting platform

17‧‧‧ base

18‧‧‧ axis

19‧‧‧foot

21‧‧‧stand

22‧‧‧Support parts

23, 34, 36‧‧‧‧stepping motor

24‧‧‧Column Lifting Guide

25, 33, 38‧‧‧ Ball Screw

35‧‧‧CCD camera

37‧‧‧rail

39‧‧‧Track support board

41‧‧‧Support Department

61, 62‧‧‧ support blade

100‧‧‧ Splitting device

114‧‧‧ Previous split

114b‧‧‧ (previously cracked)

AR1, AR2, AR3, AR4, AR5 ‧‧‧ arrows

CR‧‧‧Crack

c1, c2, c3, c4‧‧‧ blade surface

F‧‧‧heterogeneous material layer

L‧‧‧ full length

S1‧‧‧One main face

S2‧‧‧ the other main face

SL‧‧‧ crossed

TH1 ~ TH4‧‧‧Screw holes

W‧‧‧ Substrate (Laminated Brittle Material Substrate)

W1, W2, W3, W4‧‧‧ Single

Wa‧‧‧ Brittle Material Substrate

We‧‧‧ Outer periphery

X, Y, Z‧‧‧ directions

θ‧‧‧ acute angle

FIG. 1 is a perspective view of a breaking device 100 according to this embodiment.

FIG. 2 is a perspective view of the breaking device 100 according to this embodiment.

FIG. 3 is a plan view showing a holding form of the substrate W when the supply and breaking device 100 is broken.

FIG. 4 is a cross-sectional view showing an arrangement relationship when the substrate W is fractured in the fracture apparatus 100.

FIG. 5 is a schematic cross-sectional view of the cracked rod mounting portion 15 in a state where the cracked rod 14 is installed.

6 (a) and 6 (b) are schematic configuration diagrams of the rupture lever 14.

Fig. 7 is a cross-sectional view showing the detailed structure of the cutting edge 14b.

FIG. 8 is a cross-sectional view showing the detailed structure of the cutting edge 14b.

FIGS. 9 (a) to 9 (c) are diagrams schematically showing a case where the substrate W is cracked by laminating a brittle material substrate, which is a laminated substrate 14, using the fracture bar 14.

FIGS. 10 (a) to (c) are diagrams of the case where the substrate W is laminated and fractured by using the previous cracking rod 114 to laminate a brittle material substrate.

<Outline of the breaking device>

Fig. 1 and Fig. 2 are perspective views of a breaking device 100 according to this embodiment. The breaking device 100 is for brittleness formed by using ceramics such as LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics) and other brittle materials. A material substrate, or a layer of a brittle material substrate such as a multilayer brittle material substrate formed by forming a layer containing a resin or a metal on one of the main surfaces of the brittle material substrate (hereinafter, also simply referred to as a substrate) W is set in advance at A device for breaking (cutting) a linear predetermined division position (a predetermined division line) on the substrate W. Furthermore, in Figs. 1 and 2, a right-handed XYZ coordinate system is attached. The XYZ coordinate system will set two directions orthogonal to each other in the horizontal plane as the X direction and the Y direction, and set the vertical direction as the Z direction. . More specifically, the direction in which the predetermined division position is extended when the fracture is performed is set to the X direction.

FIG. 3 is a plan view showing a holding state of the substrate W when the breaking and breaking device 100 is broken. FIG. 4 is a cross-sectional view showing an arrangement relationship when the substrate W is fractured in the fracture apparatus 100. FIG. 4 shows a case where the substrate W is a laminated brittle material substrate formed by disposing a dissimilar material layer F including a resin or metal on one main surface S1 of the brittle material substrate Wa, and on the other main surface S2 of the brittle material substrate Wa In the predetermined division position, a scribe line SL is set in advance by scribing a substrate surface with a scribing wheel or the like in order to form a starting point of a crack.

In addition, in FIG. 4, only one scribe line SL is shown for simplicity of illustration, but a plurality of scribe lines SL are formed on the actual substrate W.

In addition to the starting point of the fracture, in addition to the above-mentioned scribing lines, scribing grooves obtained by cutting the surface of the substrate in a linear shape by a cutting tool such as a diamond cutter, or by ablating the surface of the substrate by laser light can be used. An ablation processing line obtained by linearly removing the surface of the substrate, or a processing line obtained by locally melting the substrate surface by using laser light to linearly modify the structure of the substrate (melt modification).

As shown in FIGS. 3 and 4, the substrate W is supplied to the breaking device 100 when one main surface S1 side is attached and fixed to an adhesive film 1 also called a dicing tape. More specifically, the adhesive film 1 has a peripheral portion attached to the ring-shaped ring member 2, and the substrate W is attached to the adhesive film 1 at a central portion of the ring member 2. In addition, FIG. 3 illustrates a state in which the surface on the opposite side of the adhesive surface of the adhesive film 1 faces the front side of the drawing. In order to show that the substrate W and the ring member 2 are present on the adhesive surface side, the substrate W is shown by a dotted line. The outer periphery We and the inner periphery 2e of the ring member 2.

The breaking device 100 includes: a supporting member 10 that supports the substrate W from below when it is broken; a rotating member 11 that rotatably supports the ring member 2 holding the substrate W in a horizontal plane; a horizontal movable table 12 including an optically transparent The component supports the rotating component 11 from below and moves freely in the Y direction; and the support platform 13 supports the horizontal movable platform 12.

More specifically, as shown in FIG. 4, the support member 10 includes a pair of support blades 61 and 62 each having a long side direction in the X direction and separated from each other in the Y direction. Again, as shown in Figure 2 As shown, the horizontal movable table 12 is driven by the ball screw 32 rotated by the driving of the stepping motor 31 and moves back and forth in the Y direction on the support table 13. Furthermore, the rotation angle position of the rotating member 11 can be adjusted by rotating the ball screw 33 with the stepping motor 34. According to the above configuration, in the breaking device 100, by rotating the rotating member 11 in the horizontal plane by supporting the ring member 2 holding the substrate W, the scribe line SL can be made between the supporting blades 61 and 62. The posture of the substrate W in the horizontal plane is adjusted by extending in the X direction.

On the other hand, four column-shaped lifting guides 24 are erected on the upper surface of the support table 13 and at four positions on the outer side of the rotating member 11. The stand 21 is fixed in such a manner as to be erected on the upper ends of the four column-shaped lifting guides 24. In addition, between the support table 13 and the stand 21, a lifting table 16 is provided which can be raised and lowered by a column-shaped lifting guide 24.

A stepping motor 23 is provided on the stand 21 via a support member 22. A ball screw 25 penetrating the stand 21 in a freely rotatable state is connected to a rotation axis of the stepping motor 23. The ball screw 25 is screwed to a female screw portion formed on the lifting table 16. The ball screw 25 is rotated by the driving of the stepping motor 23, and the lifting table 16 is raised and lowered in the Z direction.

As shown in FIG. 2, on the lower surface of the lifting platform 16, a breaking rod mounting portion 15 for fixing and fixing the breaking rod 14 is provided. The rupture lever 14 is also called a blade or a rupture blade, and is installed in a form in which the long side direction extends in the X direction. In the breaking device 100, as shown in FIG. 4 in general, the main surface with the scribe line SL formed on the substrate W faces downward, and the scribe line SL is located between the support blades 61 and 62 and extends along the X-axis direction. In the state of the arrangement, the substrate W is pressed by the breaking rod 14 from the side where the dissimilar material layer F is formed along the formation position of the scribe line SL, thereby realizing the breaking of the substrate W. The details of the rupture lever 14 and the rupture lever mounting portion 15 will be described later.

On the other hand, the support stand 13 is installed on the ground via four shafts 18 standing on the base 17 and feet 19 extending downward from the base 17.

Further, as shown in FIG. 2, a CCD camera 35 is provided below the support stand 13. As shown by arrow AR1 in FIG. 4, the CCD camera 35 can observe the positional relationship between the substrate W and the breaking rod 14 through the opening 13 h provided in the central portion of the support table 13 and the horizontal movable table 12.

The CCD camera 35 is attached to a support portion 41 provided on the base 17. The support portion 41 is guided in the X direction along a pair of guide rails 37 provided on the track support plate 39, and extends in the X direction and is screwed with a ball screw 38 rotated by the driving of the stepping motor 36. The track The support plate 39 is erected on the base 17. With such a configuration, the CCD camera 35 can be driven back and forth in the X direction by being driven by the stepping motor 36.

<Cracked Rod>

Next, the detailed structure of the rupture lever 14 and its surroundings will be described. FIG. 5 is a schematic cross-sectional view of the cracked rod mounting portion 15 in a state where the cracked rod 14 is installed. FIG. 6 is a schematic configuration diagram of the rupture lever 14. More specifically, FIG. 6 (a) is a side view in the longitudinal direction of the rupture lever 14, and FIG. 6 (b) is a schematic cross-sectional view near the edge 14 b of the rupture lever 14.

The breaking rod 14 includes a super-steel alloy or a partially stabilized zirconia, as shown in FIG. 6 (a), and has a configuration in which a cutting edge 14b is provided on one long side of a main body portion 14a having a rectangular shape in a side view. As the rupture lever 14, a rupture lever having a total length L of, for example, about 60 mm to 300 mm and a blade width W of, for example, about 15 mm to 30 mm is used. As shown in FIG. 6 (b), the cutting edge 14b has two cutting surfaces c1 and c2 forming an acute angle θ. The cutting surfaces c1 and c2 are formed by grinding, but this grinding is preferably performed in the short-side direction of the breaking rod 14 (in the case of FIG. 6 (a), the up-down direction). In this case, the machinability of the fractured rod 14 to the dissimilar material layer F is further improved.

The breaking rod 14 is fixed to the breaking device 100 by being attached to the breaking rod mounting portion 15. Furthermore, a plurality of (two in FIG. 6 (a)) through-holes 14h used in the installation are provided in the main body portion 14a of the breaking rod 14 in a form separated from each other in the longitudinal direction.

As shown in FIG. 5, the breaking rod mounting portion 15 includes a retainer 15 a, a flange 15 b, and a mounting plate. Attach the base 15c. The holder 15a and the flange 15b are detachable. On the other hand, the mounting base 15 c is fixed on the lower surface of the lifting platform 16.

When fixing the breaking rod 14 to the breaking device 100, first, the through holes 14h provided in the breaking rod 14 and the screw holes TH1 and TH2 respectively provided on the holder 15a and the flange 15b are located on a straight line. In the state, the breaking rod 14 is sandwiched between the holder 15a and the flange 15b, and the fixing bolt 15d is screwed into the screw holes TH1 and TH2. Thereby, the rupture lever 14 is integrated with the holder 15a and the flange 15b. Furthermore, the fixing bolt 15e is screwed into the screw hole TH3 provided in the mounting base 15c and the screw hole TH4 provided in the holder 15a, so that the breaking rod 14 is fixed with the blade point 14b facing vertically downward and extending in the X direction.于 断断 装置 100。 In cracking device 100. In other words, it can be said that the breaking rod 14 is detachably provided in the breaking device 100. This makes it easy to replace due to damage or deterioration, or to change the material corresponding to the substrate W.

Next, the cutting edge 14b will be described in more detail. The shape of the cutting edge 14b in the breaking device 100 of this embodiment is a characteristic part. 7 and 8 are sectional views showing the detailed structure of the cutting edge 14b.

The cutting edge 14b is roughly the same as the cutting edge of a conventional cracking rod, and has two cutting surfaces c1 and c2 forming an angle θ as shown in FIG. 6 (b), but in more detail, the angle θ The value is set to 50 ° or less, preferably 10 ° or more and 30 ° or less. Further, as shown in FIGS. 7 and 8, it is provided at the foremost end of the cutting edge 14 b between the cutting surfaces c1 and c2. There is another cutting edge. FIG. 7 illustrates a case where a cross-sectional arc-shaped (curvature radius r) curved surface is provided between the cutting surfaces c1 and c2, that is, the cutting surface c3, and FIG. 8 illustrates a cutting line provided between the cutting surfaces c1 and c2 In the case of the flat surface, that is, the cutting surface c4.

The blade surface c3 shown in FIG. 7 preferably has a curvature radius r of 5 μm or less, more preferably 2 μm or more and 3 μm or less. On the other hand, the blade surface c4 shown in FIG. 8 preferably has a width of 10 μm or less, more preferably 1 μm or more and 5 μm or less.

In this way, the cutting edge 14b of the breaking rod 14 provided in the breaking device 100 of the present embodiment The shape of the blade tip is significantly different from the shape of the blade tip of a conventional cracking rod (hereinafter, referred to as a previous cracking rod) that directly intersects two blade surfaces forming an angle of about 90 °. Further, since the cutting edge 14b of the breaking rod 14 has the above-mentioned shape, in the breaking device 100 of this embodiment, even when the substrate W to be broken is a laminated brittle material substrate as shown in FIG. 4 , Can also achieve the appropriate break.

FIG. 9 is a diagram schematically showing a case where the laminated substrate of brittle material, that is, the substrate W is fractured by using the fractured rod 14 having the above-mentioned blade tip 14b. In addition, FIG. 10 is a diagram showing a case where the substrate W is laminated and fractured by using the previous fractured rod 114 to laminate the fragile material substrate 114 for comparison. Furthermore, the cutting edge 114b of the previous rupture lever 114 has a shape in which two cutting surfaces which form an angle of approximately 90 ° directly intersect. However, the detailed illustrations of the constituent elements of the breaking device 100 and the cutting edge 14b other than the breaking rod 14 and the previous breaking rod 114 are omitted.

First, as shown in FIGS. 9 (a) and 10 (a), the substrate W is formed so that the side on which the dissimilar material layer F is formed is the upper surface and the side on which the brittle material substrate Wa is formed with the scribe line SL is lowered. The surface form is placed on the supporting blades 61 and 62 of the supporting member 10. At this time, the substrate W is placed in a posture where the scribe line SL extends substantially in the X direction at a position between the support blades 61 and 62.

Then, the scribe line SL formed on the substrate W is captured by the CCD camera 35. When the scribe line SL is photographed, the stepping motor 36 is driven to move the CCD camera 35 in the X direction for shooting, thereby capturing the entire scribe line SL extending in the X direction.

Then, the horizontal posture of the substrate W is adjusted based on the captured image, and the positioning of the breaking rod 14 is performed (the same is true of the previous breaking rod 114). That is, the rotation angle position of the rotating member 11 is adjusted by driving the stepping motor 34, thereby adjusting the horizontal posture of the substrate W to make the extending direction of the scribe line SL exactly coincide with the X direction, and by making the stepping motor 31 The horizontal movable table 12 is driven to move in the Y direction, so that the scribe line SL is arranged vertically below the breaking rod 14.

When the positioning is completed, the substrate W is fractured. That is, by the driving of the stepping motor 23 As shown in FIGS. 9 (a) and 10 (a), as shown by arrows AR2 and AR4, respectively, the breaking bar 14 and the previous breaking bar 114 are lowered. Finally, the cutting edge 14b of the breaking rod 14 and the cutting edge 114b of the previous breaking rod 114 are in contact with the heterogeneous material layer F on the upper surface of the substrate W, and a force is exerted on the upper surface of the heterogeneous material layer F, but as shown in FIG. 9 (b) and FIG. 10 (b) are shown by arrows AR3 and AR5, respectively. After this contact, the breaking rod 14 and the previous breaking rod 114 also continue to descend.

In this way, in the case of using the fractured rod 14 of this embodiment, as shown in FIG. 9 (b), the fractured rod 14 is lowered to cut the dissimilar material layer F (into the dissimilar material layer F). Morphology cuts off the heterogeneous material layer F. Then, when the blade tip 14b reaches the upper surface of the brittle material substrate Wa, the substrate W is supported at three points by the breaking rod 14 and the supporting blades 61 and 62, as shown in FIG. 9 (c), from the scribe line SL The extended crack CR reaches the edge 14b. Thereby, the substrate W is appropriately divided into two single pieces W1 and W2.

On the other hand, in the case of using the previous cracking rod 114, as shown in FIG. 10 (b), before the cutting edge 114b enters the heterogeneous material layer F, the lower brittle material substrate Wa is cracked. The situation where CR extends from the scribe line SL is generated, so that although the dissimilar material layer F is not divided, only the brittle material substrate Wa is divided into two single pieces W3, W4. Once this breaking occurs, even if the previous breaking lever 114 is lowered as shown by arrow AR5, the force exerted by the previous breaking lever 114 is avoided due to the movement of the single pieces W3 and W4, as shown in FIG. 10 ( c) The heterogeneous material layer F as shown is not properly divided, or is finally not divided at the correct position.

The reason for the difference between the case where the split lever 14 of this embodiment is used and the case where the previous split lever 114 is used is as follows.

First, in the former case, the angle θ formed by the cutting surfaces c1 and c2 is relatively small, and also includes the cutting surface c3 or c4. The contact area with the dissimilar material layer F is small, so it is not easily affected by the dissimilar material layer F. As a result of the elastic resistance (reaction force), as a result, the pressing force per unit area is relatively large, thereby causing crack CR extension in the brittle material substrate Wa. Before the exhibition, the heterogeneous material layer F is divided.

In contrast, in the latter case, since the angle formed by the two cutting surfaces is greater than 90 °, the contact area with the heterogeneous material layer F is large, so that it is strongly affected by the resistance from the heterogeneous material layer F. When the tip 114b does not enter the heterogeneous material layer F, a force is applied to the brittle material substrate Wa underneath it, so that it is difficult to divide the laminated brittle material substrate well.

In addition, in the case of the rupture lever 14 of this embodiment, although the angle θ formed by the cutting surfaces c1 and c2 is small, there is a cutting edge c3 because there is a cutting surface c3 or c4 between them. Therefore, even in the case of repeated use, the occurrence frequency of the edge gap is at least suppressed to the same degree as that of the previous breaking rod 114.

In addition, although a detailed description is omitted, it is needless to say that the fractured rod 14 of this embodiment can be appropriately divided even for a brittle material substrate having no dissimilar material layer F.

As described above, in the breaking device of this embodiment, as the breaking rod, the cutting edge includes two cutting surfaces forming an angle of 50 ° or less, and further includes a cross section between the two cutting surfaces. An arc-shaped curved surface or a straight flat surface in cross-section is the other blade surface. Therefore, even if the substrate to be fractured is formed by disposing a material layer containing a resin or metal on one of the main surfaces of a brittle material substrate, In the case where the brittle material substrate is laminated and the cracking rod is brought into contact with the dissimilar material layer for cracking, the pretreatment of forming the grooves of the dissimilar material layer can be eliminated, and the cracking can be performed well without generating sharp edges.

<Modifications>

In the above-mentioned embodiment, the support members (supporting blades 61 and 62) provided on the horizontal movable table 12 are fractured from below to support the substrate W. However, the support form of the substrate in the fracture device 100 is not limited. herein. For example, a transparent rubber plate may be laid on the horizontal movable table 12, and a substrate W may be placed on the transparent rubber plate to perform breaking. In this case, it is also possible to appropriately use the rupture bar 14 to perform the rupture of the laminated brittle material substrate.

14b‧‧‧Blade

c1, c2, c3‧‧‧ blade surface

θ‧‧‧ acute angle

Claims (5)

A cracking device is characterized in that: a laminated brittle material substrate including a resin or metal dissimilar material layer is formed on one main surface of the brittle material substrate and a scribing line is formed on the other main surface; The edge is split along the above-mentioned scribe line; and the edge of the split rod which abuts the substrate of the laminated brittle material at the time of the split includes two blade surfaces forming an angle of 50 ° or less, and between the two blade surfaces Furthermore, another curved surface including a curved surface having an arc-shaped cross section with a curvature radius of 5 μm or less is included. According to the breaking device of claim 1, wherein the other edge surface is a curved surface having an arc-shaped cross section with a curvature radius of 2 μm or more and 3 μm or less. A cracking device is characterized in that: a laminated brittle material substrate including a resin or metal dissimilar material layer is formed on one main surface of the brittle material substrate and a scribing line is formed on the other main surface; The edge breaks along the above-mentioned scribe line; and the edge of the rupture rod which is in contact with the laminated brittle material substrate at the time of the break has two blade faces forming an angle of 50 ° or less, and is between the two blade faces Furthermore, it includes another flat surface, that is, a flat surface having a linear cross section with a width of 10 μm or less. The breaking device according to claim 3, wherein the other cutting edge surface is a flat surface having a cross section having a width of 1 μm or more and 5 μm or less. According to the breaking device of any one of claims 1 to 4, wherein the angle formed by the two blade surfaces is 10 ° or more and 30 ° or less.