JP6268917B2 - Break device - Google Patents

Description

  The present invention relates to an apparatus for breaking a substrate, and more particularly, to a breaking apparatus for breaking a laminated brittle material substrate provided with a layer made of resin or metal.

  A semiconductor element is a starting point in which a mother substrate, in which a plurality of element regions are repeatedly formed two-dimensionally on a brittle material substrate such as a ceramic substrate, is formed in advance at the boundary position (division position) of each element region. It is manufactured by breaking along. The starting point of the break is a scribe line formed by scribing the substrate surface with a scribing wheel, a scribe groove formed by cutting the substrate surface into a linear shape with a cutting tool such as a diamond cutter, or ablating the substrate surface with laser light. In other words, there are ablation processing lines that have been removed linearly, and processing lines in which the substrate structure has been linearly altered (melted and modified) by locally melting the substrate surface with laser light.

  A break apparatus capable of performing a break along such a planned division position is already known (see, for example, Patent Document 1). In such a known break device, a pair of substrate support members (substrate holding portions in Patent Document 1), which are also called receiving blades, are arranged apart from each other in the horizontal plane, and the mother substrate is scheduled to be divided. However, in a state where the mother board is supported by the board supporting member so as to be positioned between the board supporting members, a break bar (blade in Patent Document 1) is pushed along the planned division position from above the mother board. By hitting, the mother board can be broken.

  In addition, a thermosetting resin such as glass epoxy is attached to the main surface of the mother substrate for manufacturing a semiconductor element described above for the purpose of protecting a circuit pattern formed on the main surface of the brittle material substrate. Some have a metal layer attached to the main surface. When such a base substrate is to be broken by the above-described method, a part of the resin or metal layer is not completely divided because the resin or metal and the brittle material substrate are made of different materials. Will occur.

  In order to cope with such a problem, as a method of dividing a resin-attached brittle material substrate by attaching a resin to one main surface side of the brittle material substrate perpendicularly to the main surface, a planned division position on the resin side of the resin-containing brittle material substrate A groove forming step for forming a groove in the substrate, a scribe line forming step for forming a scribe line at a position to be divided on the brittle material substrate side of the brittle material substrate with resin, and a break for dividing the brittle material substrate with resin along the scribe line. What performs a process is already well-known (for example, refer patent document 2).

JP 2004-39931 A JP 2012-66479 A

  The method disclosed in Patent Document 2 is excellent in that a brittle material substrate with resin can be divided vertically with respect to its main surface reliably at an expected division position and with excellent dimensional accuracy. However, since it is necessary to execute the groove forming step before the substrate breaking step, there is a problem that the number of working steps increases and the breaking operation cannot be performed efficiently. From the viewpoint of manufacturing efficiency, it is desirable that a good break is performed only by the break process in one break apparatus.

  The present invention has been made in view of the above problems, and a laminated brittle material substrate obtained by laminating a layer made of resin or metal on the main surface of a brittle material substrate can be suitably and easily obtained without requiring a pre-process. It is an object of the present invention to provide a break device that can break.

In order to solve the above problems, the invention of claim 1 is a laminated brittle material substrate in which a dissimilar material layer made of resin or metal is attached to one main surface of a brittle material substrate and a scribe line is formed on the other main surface. A breaking device that breaks along the scribe line from the side of the different material layer, wherein the cutting edge of a break bar that directly contacts the laminated brittle material substrate at the time of breaking has two blade surfaces that form an angle of 50 ° or less. And having another blade surface which is a curved surface having an arc-shaped cross section with a curvature radius of 5 μm or less between the two blade surfaces.

  A second aspect of the present invention is the breaking device according to the first aspect, wherein the another blade surface is a curved surface having an arc-shaped cross section with a radius of curvature of 2 μm to 3 μm.

According to a third aspect of the present invention, there is provided a laminated brittle material substrate in which a dissimilar material layer made of resin or metal is attached to one main surface of a brittle material substrate and a scribe line is formed on the other main surface from the dissimilar material layer side. A breaking device that breaks along the scribe line, wherein the edge of a break bar that directly contacts the laminated brittle material substrate at the time of breaking has two blade surfaces that form an angle of 50 ° or less, and the two blades It further has another blade surface which is a flat surface having a linear cross section with a width of 10 μm or less between the surfaces.

  A fourth aspect of the present invention is the breaking device according to the third aspect, wherein the another blade surface is a flat surface having a cross section with a width of 1 μm to 5 μm.

  A fifth aspect of the present invention is the breaking device according to any one of the first to fourth aspects, characterized in that an angle formed by the two blade surfaces is not less than 10 ° and not more than 30 °.

  According to the first to fifth aspects of the present invention, the laminated brittle material substrate can be satisfactorily broken without causing a blade spill without performing a pretreatment such as forming a groove in a different material layer.

It is a perspective view of the break device 100 concerning this Embodiment. It is a perspective view of the break device 100 concerning this Embodiment. It is a top view which shows the holding | maintenance aspect of the board | substrate W at the time of using for a break in the break apparatus 100. FIG. FIG. 3 is a cross-sectional view showing an arrangement relationship when a substrate W is broken in the breaking device 100. It is a schematic cross section of the break bar attaching part 15 in the state where the break bar 14 is attached. 2 is a schematic configuration diagram of a break bar 14. FIG. It is sectional drawing which shows the detailed structure of the blade edge | tip 14b. It is sectional drawing which shows the detailed structure of the blade edge | tip 14b. It is a figure which shows typically a mode in the case of performing the break of the board | substrate W which is a laminated brittle material board | substrate using the break bar. It is a figure which shows a mode in the case of performing the break of the board | substrate W which is a laminated brittle material board | substrate using the break bar 114 conventionally.

<Outline of break device>
1 and 2 are perspective views of break device 100 according to the present embodiment. The break device 100 includes a brittle material substrate configured using ceramics, glass, or other brittle materials such as LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics), or the brittle material. A break target substrate (hereinafter also simply referred to as a substrate) W such as a laminated brittle material substrate formed by forming a layer made of resin or metal on one main surface of a substrate is a linear shape that is set in advance on the substrate W. This is for breaking along the scheduled division position (division planned line). 1 and 2 have a right-handed XYZ coordinate system in which two directions orthogonal to each other in the horizontal plane are the X direction and the Y direction, and the vertical direction is the Z direction. More specifically, the X direction is the direction in which the planned division position is extended when the break is performed.

  FIG. 3 is a plan view showing how the substrate W is held when the break is applied to the breaker 100. FIG. 4 is a cross-sectional view showing an arrangement relationship when the substrate W is broken in the breaking device 100. In FIG. 4, the substrate W is a laminated brittle material substrate in which a different material layer F made of resin or metal is provided on one main surface S1 of the brittle material substrate Wa, and the other main surface S2 of the brittle material substrate Wa. The case where the scribe line SL is provided by scribing the surface of the substrate with a scribing wheel or the like in advance to be the starting point of the break at the scheduled division position is illustrated.

  In FIG. 4, only one scribe line SL is shown for simplicity of illustration, but a large number of scribe lines SL are formed on the actual substrate W.

  In addition to the scribe line described above, the starting point of the break is a scribe groove obtained by cutting the substrate surface into a linear shape with a cutting tool such as a diamond cutter, or an ablation process in which the substrate surface is ablated with a laser beam and removed in a linear shape. It is possible to apply a line or a processing line in which the structure of the substrate is linearly altered (melted and modified) by locally melting the substrate surface with laser light.

  As shown in FIGS. 3 and 4, the substrate W is provided to the breaking device 100 after the one main surface S <b> 1 side is pasted and fixed to the adhesive film 1, which is also called a dicing tape. More specifically, the adhesive film 1 has a peripheral portion attached to the annular ring member 2, and the substrate W is attached to the adhesive film 1 at the center portion of the ring member 2. 3 illustrates a state in which the surface opposite to the adhesive surface of the adhesive film 1 faces the front side of the drawing, and the substrate W and the ring member 2 are both present on the adhesive surface side. In order to show that the outer peripheral edge We of the substrate W and the inner peripheral edge 2e of the ring member 2 are indicated by broken lines.

  The breaking device 100 includes a support member 10 that supports the substrate W from below during a break, a rotating member 11 that rotatably supports the ring member 2 that holds the substrate W in a horizontal plane, and an optically transparent member. It comprises a horizontal movable table 12 that supports the rotary member 11 from below and is movable in the Y direction, and a support table 13 that supports the horizontal movable table 12.

  More specifically, as shown in FIG. 4, the support member 10 includes a pair of receiving blades 61 and 62 each having a longitudinal direction in the X direction and spaced apart from each other in the Y direction. Further, as shown in FIG. 2, the horizontal movable table 12 is reciprocated in the Y direction on the support table 13 under the driving of the ball screw 32 that is rotated by the driving of the stepping motor 31. Further, the rotational angle position of the rotating member 11 can be adjusted by rotating the ball screw 33 by the stepping motor 34. By having the above configuration, in the breaking device 100, the rotating member 11 is rotated in a horizontal plane while supporting the ring member 2 that holds the substrate W, so that the receiving blades 61 and 62 can be rotated. It is possible to adjust the posture of the substrate W in the horizontal plane so that the scribe line SL extends in the X direction.

  On the other hand, four columnar elevating guides 24 are provided upright on the upper surface of the support table 13 and at the four positions outside the rotating member 11. The gantry 21 is fixed so as to bridge the upper ends of these four columnar lifting guides 24. In addition, an elevating table 16 is provided between the support table 13 and the gantry 21 so as to be guided up and down by a columnar elevating guide 24.

  A stepping motor 23 is installed on the gantry 21 via a support member 22. A ball screw 25 that penetrates the gantry 21 in a rotatable state is connected to the rotation shaft of the stepping motor 23. The ball screw 25 is screwed into a female screw portion formed on the lifting table 16. When the ball screw 25 is rotated by driving the stepping motor 23, the lifting table 16 is lifted and lowered in the Z direction.

  As shown in FIG. 2, a break bar attaching portion 15 to which the break bar 14 is attached and fixed is provided on the lower surface of the lift table 16. The break bar 14 is also called a blade or a break blade, and is attached in such a manner that its longitudinal direction extends in the X direction. In the breaking device 100, as schematically shown in FIG. 4, the scribe line SL extends in the X-axis direction between the receiving blades 61 and 62 with the main surface on which the scribe line SL is formed facing down. The substrate W is pressed by the break bar 14 along the formation position of the scribe line SL from the side of the surface on which the dissimilar material layer F is formed with respect to the substrate W arranged to extend. Break is realized. Details of the break bar 14 and the break bar mounting portion 15 will be described later.

  On the other hand, the support table 13 is installed on the ground via four shafts 18 erected on the base 17 and legs 19 extending downward from the base 17.

  Furthermore, as shown in FIG. 2, a CCD camera 35 is installed below the support table 13. The CCD camera 35 observes the positional relationship between the substrate W and the break bar 14 through the opening 13h provided in the center portion of the support table 13 and the horizontal movable table 12, as indicated by an arrow AR1 in FIG. It is possible to do.

  The CCD camera 35 is attached on a support portion 41 provided on the base 17. The support portion 41 is guided in the X direction along a pair of guide rails 37 provided on a rail support plate 39 erected on the base 17, extends in the X direction, and extends to the stepping motor 36. And a ball screw 38 which is rotated by the driving of. With these configurations, the CCD camera 35 is driven by the stepping motor 36 and can reciprocate in the X direction.

<Break bar>
Next, the detailed structure of the break bar 14 and its peripheral part will be described. FIG. 5 is a schematic cross-sectional view of the break bar attachment portion 15 with the break bar 14 attached. FIG. 6 is a schematic configuration diagram of the break bar 14. More specifically, FIG. 6A is a side view in the longitudinal direction of the break bar 14, and FIG. 6B is a schematic sectional view in the vicinity of the cutting edge 14 b of the break bar 14.

  The break bar 14 is made of a super steel alloy, partially stabilized zirconia, or the like, and has a configuration in which a blade edge 14b is provided on one long side of a rectangular main body portion 14a as shown in FIG. 6A. Have. As the break bar 14, a bar having a total length L of, for example, about 60 mm to 300 mm and a blade width W of, for example, about 15 mm to 30 mm is used. As shown in FIG. 6B, the blade edge 14b has two blade surfaces c1 and c2 forming an acute angle θ. The blade surfaces c1 and c2 are formed by grinding, but such grinding is preferably performed in the short direction of the break bar 14 (up and down direction in the case of FIG. 6A). In such a case, the machinability of the different material layer F by the break bar 14 is further improved.

  The break bar 14 is fixed to the break device 100 by being attached to the break bar attaching portion 15. The main body portion 14a of the break bar 14 is provided with a plurality of (two in FIG. 6A) through-holes 14h used at the time of attachment in such a manner that they are separated from each other in the longitudinal direction. .

  As shown in FIG. 5, the break bar mounting portion 15 includes a holder 15a, a flange 15b, and a mounting base 15c. The holder 15a and the flange 15b are detachable. On the other hand, the mounting base 15 c is fixed to the lower surface of the lifting table 16.

  In fixing the break bar 14 to the break device 100, first, in a state where the through holes 14h provided in the break bar 14 and the screw holes TH1 and TH2 respectively provided in the holder 15a and the flange 15b are positioned in a straight line, After the break bar 14 is sandwiched between the holder 15a and the flange 15b, the fixing bolt 15d is screwed into the screw holes TH1 and TH2. Thereby, the break bar 14 becomes integral with the holder 15a and the flange 15b. Further, by screwing the fixing bolt 15e into the screw hole TH3 provided in the mounting base 15c and the screw hole TH4 provided in the holder 15a, the break bar 14 has the cutting edge 14b directed vertically downward and in the X direction. It is fixed to the break device 100 in an extended posture. In other words, in the break device 100, it can be said that the break bar 14 is detachably provided. This facilitates replacement due to breakage and deterioration, and changes according to the material of the substrate W.

  Next, the blade edge 14b will be described in more detail. In the breaking device 100 according to the present embodiment, the shape of the blade edge 14b is characteristic. 7 and 8 are cross-sectional views showing the detailed configuration of the blade edge 14b.

  The cutting edge 14b schematically has two cutting surfaces c1 and c2 forming an angle θ as shown in FIG. 6B, as in the conventional cutting edge of a general break bar. More specifically, the value of the angle θ is 50 ° or less, preferably 10 ° or more and 30 ° or less. Further, as shown in FIG. 7 and FIG. , Another blade surface is provided between the blade surfaces c1 and c2. FIG. 7 illustrates a case where a blade surface c3 that is a curved surface having a circular arc shape (curvature radius r) in cross section is provided between the blade surfaces c1 and c2, and FIG. The case where the blade surface c4 which is a flat flat surface in a cross-sectional view is provided between c2 is illustrated.

  The blade surface c3 shown in FIG. 7 preferably has a radius of curvature r of 5 μm or less, more preferably 2 μm or more and 3 μm or less. On the other hand, the blade surface c4 shown in FIG. 8 preferably has a width of 10 μm or less, more preferably 1 μm or more and 5 μm or less.

  As described above, the shape of the cutting edge 14b of the break bar 14 provided in the break device 100 according to the present embodiment is a conventional general break bar (hereinafter, referred to as two blade surfaces that form an angle of about 90 °). The shape of the cutting edge of the conventional break bar) is clearly different. And since the cutting edge 14b of the break bar 14 has the shape as described above, in the break device 100 according to the present embodiment, the substrate W to be broken is a laminated brittle material substrate as shown in FIG. Even in some cases, a suitable break can be realized.

  FIG. 9 is a diagram schematically showing a state in which the breakage of the substrate W, which is a laminated brittle material substrate, is performed using the break bar 14 having the cutting edge 14b having the shape as described above. FIG. 10 is a diagram showing a state in which the substrate W, which is a laminated brittle material substrate, is broken using the conventional break bar 114 shown for comparison. Note that the blade edge 114b of the conventional break bar 114 has a shape in which two blade surfaces forming an angle of about 90 ° directly intersect. However, the components of the break device 100 other than the break bar 14 and the conventional break bar 114 and the detailed configuration of the cutting edge 14b are not shown.

  First, as shown in FIG. 9A and FIG. 10A, the substrate W has a side on which the dissimilar material layer F is formed as an upper surface, and a side on which the scribe line SL of the brittle material substrate Wa is formed. Is placed on the receiving blades 61 and 62 of the support member 10 in such a manner as to be the lower surface. At that time, the substrate W is placed in a posture in which the scribe line SL extends in the X direction at a position between the receiving blades 61 and 62.

  Subsequently, the scribe line SL formed on the substrate W is photographed by the CCD camera 35. At the time of photographing the scribe line SL, the stepping motor 36 is driven to perform imaging while moving the CCD camera 35 in the X direction so that the entire scribe line SL extending in the X direction is imaged.

  Then, based on the obtained captured image, the horizontal posture of the substrate W is adjusted, and the break bar 14 is positioned (the same applies to the conventional break bar 114). That is, by adjusting the rotation angle position of the rotating member 11 by driving the stepping motor 34, the horizontal posture of the substrate W is adjusted, and the extending direction of the scribe line SL is accurately matched with the X direction. Then, by driving the stepping motor 31, the horizontal movable table 12 is moved in the Y direction so that the scribe line SL is arranged vertically below the break bar 14.

  When the positioning is completed, the substrate W is broken. That is, by lowering the lifting table 16 by driving the stepping motor 23, the break bar 14 and the conventional break bar 114 are lowered as shown by arrows AR2 and AR4 in FIGS. 9A and 10A, respectively. . Eventually, the cutting edge 14b of the break bar 14 and the cutting edge 114b of the conventional break bar 114 come into contact with the dissimilar material layer F on the upper surface of the substrate W, and force is applied to the upper surface of the dissimilar material layer F. FIG. ) And FIG. 10B, as indicated by arrows AR3 and AR5, respectively, the break bar 14 and the conventional break bar 114 continue to descend after such contact.

  Then, when the break bar 14 according to the present embodiment is used, as shown in FIG. 9B, the break bar 14 descends to cut the dissimilar material layer F (of the dissimilar material layer F). The dissimilar material layer F is divided in such a manner that it enters the inside. When the cutting edge 14b reaches the upper surface of the brittle material substrate Wa, the break bar 14 and the receiving blades 61 and 62 support the substrate W at three points. As shown in FIG. The extended crack CR reaches the cutting edge 14b. Thereby, the substrate W is preferably divided into two pieces W1 and W2.

  On the other hand, when the conventional break bar 114 is used, as shown in FIG. 10B, before the blade edge 114b enters the dissimilar material layer F, the crack from the scribe line SL in the lower brittle material substrate Wa. Although the extension of CR occurs and the dissimilar material layer F is not divided, only the brittle material substrate Wa is divided into two pieces W3 and W4. Once such division occurs, even if the conventional break bar 114 is lowered as shown by the arrow AR5, the force applied by the conventional break bar 114 escapes due to the movement of the individual pieces W3 and W4. As shown in (c), the dissimilar material layer F is preferably not divided or, at best, only divided at an incorrect position.

  The reason why such a difference occurs between the case where the break bar 14 according to the present embodiment is used and the case where the conventional break bar 114 is used is as follows.

  First, in the former case, since the angle θ formed by the blade surfaces c1 and c2 is relatively small and the contact area with the different material layer F including the blade surface c3 or c4 is small, the elasticity of the different material layer F is improved. Since the resisting force (repulsive force) caused by this is difficult to be received, and as a result, the pressing force per unit area becomes relatively large, the dissimilar material layer F is formed before the crack CR extends in the brittle material substrate Wa. Is divided.

  On the other hand, in the latter case, since the angle formed by the two blade surfaces is as large as 90 °, the contact area with the different material layer F is large, so that the resistance force from the different material layer F is strongly received. Since the force is applied to the brittle material substrate Wa under the state where the blade edge 114b cannot enter the dissimilar material layer F, it is difficult to perform good division on the laminated brittle material substrate. .

  Further, in the case of the break bar 14 according to the present embodiment, although the angle θ formed by the blade surfaces c1 and c2 is small, the blade surface c3 or c4 exists between them, so that the blade spills are less likely to occur. . Therefore, even in the case of repeated use, the frequency of occurrence is suppressed at least as high as that of the conventional break bar 114.

  Although a detailed description is omitted, naturally, the break bar 14 according to the present embodiment can be suitably divided even for a brittle material substrate that does not have the different material layer F.

  As described above, in the break device according to the present embodiment, as a break bar, the cutting edge has two blade surfaces having an angle of 50 ° or less, and a cross-sectional view between these two blade surfaces. By using another one having an arcuate curved surface or a flat surface that is a straight line in cross section, the substrate to be broken has a different material layer made of resin or metal on one main surface of the brittle material substrate. Even if it is a laminated brittle material substrate provided and a break bar is brought into contact with the dissimilar material layer to break, no pretreatment such as groove formation in the dissimilar material layer is required, It is possible to break well without causing blade spillage.

<Modification>
In the above-described embodiment, the substrate W is supported by the support members (receiving blades 61 and 62) provided on the horizontal movable table 12, and the break is performed. The support mode is not limited to this. For example, a mode may be adopted in which a transparent rubber plate is laid on the horizontal movable table 12, and the substrate W is placed thereon to break. Even in such a case, the breakage of the laminated brittle material substrate using the break bar 14 can be suitably performed.

DESCRIPTION OF SYMBOLS 1 Adhesive film 2 Ring member 10 Support member 11 Rotating member 12 Horizontal movable table 13 Support table 13h Opening part 14 Break bar 14a Body part 14b Blade edge 14h Through-hole 15 Break bar attaching part 15a Holder 15b Flange 15c Base 15d, 15e Fixing bolt 16 Elevating table 35 CCD camera 61, 62 Receiving blade 100 Break device 114 Conventional break bar 114b Cutting edge c1 to c4 Blade surface CR Crack F Dissimilar material layer SL Scribe line TH1 to TH4 Screw hole W Substrate (lamination brittleness) Material substrate)
Wa Brittle material substrate

Claims (5)

Breaking a laminated brittle material substrate having a different material layer made of resin or metal on one main surface of a brittle material substrate and a scribe line formed on the other main surface along the scribe line from the side of the different material layer Break device
The edge of the break bar that is in direct contact with the laminated brittle material substrate at the time of break has two blade surfaces that form an angle of 50 ° or less, and an arc shape with a radius of curvature of 5 μm or less between the two blade surfaces. Further having another blade surface that is a curved surface having a cross section,
Break device characterized by the above. The breaking device according to claim 1,
The another blade surface is a curved surface having an arc-shaped cross section with a radius of curvature of 2 μm to 3 μm.
Break device characterized by the above. Breaking a laminated brittle material substrate having a different material layer made of resin or metal on one main surface of a brittle material substrate and a scribe line formed on the other main surface along the scribe line from the side of the different material layer Break device
The cutting edge of the break bar that is in direct contact with the laminated brittle material substrate at the time of breaking has two blade surfaces forming an angle of 50 ° or less, and a linear cross section having a width of 10 μm or less between the two blade surfaces. Further having another blade surface that is a flat surface having
Break device characterized by the above. The break device according to claim 3,
The another blade surface is a flat surface having a cross section with a width of 1 μm or more and 5 μm or less.
Break device characterized by the above. A break device according to any one of claims 1 to 4,
The angle formed by the two blade surfaces is 10 ° or more and 30 ° or less,
Break device characterized by the above.

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