TW201605750A - Methods for separating a glass sheet - Google Patents

Abstract

A method of separating a glass sheet comprises providing a glass sheet including a first major surface opposing a second major surface. A layer of adhesive material bonds the second major surface of the glass sheet to a support surface of a carrier substrate and a thickness between the first and second major surfaces of the glass sheet is equal to or less than about 300 [mu]m. The method comprises providing a first defect in the glass sheet and separating the glass sheet into a plurality of sub-sheets by traversing a beam of electromagnetic radiation over the first major surface along a first predetermined path to (a) transform the first defect into a first full body crack and (b) propagate the first full body crack along the first predetermined path, thereby producing a full body separation of the glass sheet while the glass sheet remains bonded to the support surface.

Description

Method for separating glass sheets

The present invention is based on the priority of U.S. Provisional Application No. 62/022,394, filed on Jul. 9, 2014, the disclosure of which is hereby incorporated by reference in its entirety in its entirety.

The present invention relates generally to a method for separating glass sheets, and more particularly to a method for separating thin glass sheets.

Glass sheets are commonly used, for example, in display applications such as liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), and the like. Sometimes the glass sheet is separated into a plurality of daughter boards, each of which is removed for use in a particular application.

The cutting of glass sheets has traditionally been accomplished by the use of mechanical tools. In general, the glass sheet is first scribed, for example by using a scribing tool, such as, for example, a sharp carbide cutter wheel, which produces scratches or central cracks in the glass sheet, and Concomitantly, the glass sheet is substantially destroyed at the cutting edge. However, there are alternative processes that use CO ₂ laser radiation to heat the glass sheet and generate tensile stress via a temperature gradient to create scratches. During laser scribing, an initial defect is created on the glass sheet to create a central crack (also known as a partial crack, or simply a split). The breach is then propagated by laser light that is formed as a beam of light across the entire surface of the glass sheet, followed by a cooling zone that creates a cooling zone. The glass plate is heated with a laser beam and immediately quenched with a coolant and a sink, which creates a thermal gradient and a corresponding stress field for the propagation of the crack. When the scribing is completed, then the glass sheet is subjected to bending or shearing stress so that the crack completes its propagation and penetrates the thickness of the glass sheet.

While the laser scribing technique described above produces less damage than the mechanical scribing process, the laser scribing process can still cause damage to the glass sheet, for example, particularly in mechanical separation processes involving the application of bending or shear stress. This may result in a difference in edge strength when evaluating the relationship between tensile stress and compressive stress on the incident side of the laser. Furthermore, for both laser and mechanical scribing techniques, the separation of the glass sheets requires at least two steps, including the creation of scratches, which are then stressed (eg, bending stress) to separate along the score line. glass plate. In addition, scribing techniques typically produce debris that can contaminate the daughterboard. Accordingly, it would be advantageous to provide a simplified separation process that provides minimal edge damage to the daughterboard and minimal debris contamination during the separation process.

A method for separating glass sheets is proposed which provides a simplified separation process and further provides a daughterboard with minimal edge damage and minimal debris contamination during the separation process.

In a first concept, a method for separating a glass sheet includes: step (I) providing a glass sheet, the glass sheet including a first major surface and a second major surface opposite the first major surface; An adhesive material layer bonding the second major surface of the glass sheet to a carrier substrate a support surface, and a thickness between the first major surface and the second major surface is equal to or less than about 300 microns. The method further includes the step (II) of providing a first defect in the glass sheet; and the step (III) separating the glass sheet into a plurality of daughter boards. Step (III) is performed by reciprocating a beam of electromagnetic radiation on the first major surface along a first predetermined path to: (a) convert the first defect to the first with the glass sheet a first complete body crack interleaved between the major surface and the second major surface; and (b) propagating the first intact body crack along the first predetermined path, thereby generating the glass sheet along the first predetermined path One of the complete bodies separates while the second major surface of the glass sheet remains bonded to the support surface of the carrier substrate.

In an example of the first concept, the step (II) further includes providing a second defect in the glass sheet, and the step (III) of separating the glass sheet into the plurality of sub-boards further comprises: causing an electromagnetic radiation beam to be Reciprocating along a second predetermined path on the first major surface to: (a) convert the second defect into a second complete body crack interleaved with the first major surface and the second major surface; and b) propagating the second complete body crack along the second predetermined path, thereby producing a complete body separation of the glass sheet along the second predetermined path, while the second major surface of the glass sheet remains bonded To the support surface of the carrier substrate. In one example, the second predetermined path is interleaved with the first predetermined path.

In another example of this first concept. The method further includes the step (IV) of generating a curvature from at least one of the second major surface of the glass sheet and the support surface of the carrier substrate, from the carrier base The board releases at least a portion of at least one of the daughter boards. In one example, step (IV) includes completely releasing at least one daughterboard from the carrier glass while maintaining the curvature. In another example, step (IV) includes creating a double bend curvature in the second major surface of the glass sheet by raising an edge portion of one of the plurality of daughter boards away from the carrier glass .

In another example of the first concept, the method further includes the step (IV) of providing a second defect in the carrier substrate; and the step (V) of causing a beam of electromagnetic radiation to be relatively along a second predetermined path The carrier substrate is reciprocated to separate the carrier substrate into a plurality of sub-carrier substrates. In one example, the first predetermined path is aligned with the second predetermined path. In another example, reciprocating the laser beam in step (V) produces a scribe line in the carrier substrate along a second predetermined path. In one particular example, step (V) further applies a bending force to the carrier substrate to separate the carrier substrate along the scribe line into a plurality of sub-carrier substrates. In a further example, reciprocating the electromagnetic radiation in step (V) converts the second defect into a second complete body crack extending through one of the carrier substrates and causing the second crack to propagate along the second predetermined path A complete body separation of the carrier substrate is produced along the second predetermined path. In another example, each of the sub-carrier substrates provided in step (V) is bonded to a single one of the plurality of daughter boards. In one particular example, the method further includes the step (IV) of releasing one of the daughter boards from the corresponding sub-carrier substrate.

The foregoing first concept may be provided separately or in combination with any one or more of the above-described first concepts.

In a second concept, a method for separating a glass sheet includes the step (I) of providing a glass sheet, the glass sheet including a first major surface, a second major surface opposite the first major surface, and The thickness between the first major surface and the second major surface is equal to or less than about 300 microns. The second major surface of the glass sheet is bonded to a support surface of a carrier substrate. The method further includes the step (II) of providing a first defect in the glass sheet; and the step (III): separating the glass sheet into a plurality of daughter boards. Step (III) is performed by reciprocating the electromagnetic radiation beam on the first major surface along a first predetermined path to: (a) convert the first defect into a first major surface with the glass sheet And a first complete body crack interleaved with the second major surface; and (b) propagating the first complete body crack along the first predetermined path, thereby generating a complete body of the glass sheet along the first predetermined path Separating while the second major surface of the glass sheet remains bonded to the support surface of the carrier substrate. The method further includes the step (IV) of releasing at least a portion of the at least one daughterboard from the carrier substrate by creating a curvature in at least one of the second major surface of the glass sheet and the support surface of the carrier substrate .

In one example of the second concept, step (IV) further comprises: completely releasing at least one daughterboard from the carrier glass while still maintaining the curvature.

In another example of the second concept, the step (IV) includes, by causing an edge portion of one of the plurality of daughter boards to rise away from the carrier glass, in the second major surface of the glass sheet Produces a double curvature.

In still another example of the second concept, the step (IV) moves at least one pair of facing edge surfaces of the adjacent pair of daughter boards away from each other in a direction of the first major surface, so that the team faces the edge surface A lateral gap is created.

In another example of the second concept, the step (II) further includes providing a second defect in the glass sheet, and the step (III) of separating the glass sheet into the plurality of sub-plates further comprises: causing an electromagnetic radiation beam Reciprocating over the first major surface along a second predetermined path to: (a) convert the second defect into a second interlaced with the first major surface and the second major surface of the glass sheet a complete body crack; and (b) propagating the second complete body crack along the second predetermined path. Thus, step (III) produces a complete body separation of the glass sheet along the second predetermined path while the second major surface of the glass sheet remains bonded to the support surface of the carrier substrate. In one example, the second predetermined path can be interleaved with the first predetermined path.

In another example of the second concept, step (I) includes the step of bonding the second major surface of the glass sheet to the support surface of the carrier substrate using an adhesive layer.

The foregoing second concept may be provided separately or in combination with any one or more of the above-described second concepts.

10‧‧‧ glass plate

12‧‧‧ first major surface

14‧‧‧ second major surface

16‧‧‧ edge

18‧‧‧ edge

20‧‧‧ edge

22‧‧‧ edge

24‧‧‧ Carrier substrate

26‧‧‧First major surface

28‧‧‧ second major surface

30‧‧‧ edge

32‧‧‧ edge

34‧‧‧ edge

36‧‧‧ edge

40‧‧‧Adhesive material layer

42‧‧‧Glass-carrier assembly

44‧‧‧First defect

46‧‧‧second defect

48‧‧‧Electromagnetic radiation beam

50‧‧‧First scheduled path

52‧‧‧Laser radiation device

54‧‧‧heating area

56‧‧‧Cooling device

58‧‧‧Cooling fluid

60‧‧‧Cooling area

64‧‧‧First complete body crack

68‧‧‧Slate board

70‧‧‧ daughter board

78‧‧‧second scheduled path

82‧‧‧Second complete body crack

86‧‧‧Slate board

88‧‧‧Slate board

90‧‧‧ daughter board

92‧‧‧Slate board

102‧‧‧ third defect

112‧‧‧ third scheduled path

116‧‧‧ crack

118‧‧‧Scratch line

120‧‧‧Subcarrier substrate

122‧‧‧Subcarrier substrate

124‧‧‧Subcarrier substrate

126‧‧‧Subcarrier substrate

130‧‧‧Subcomponents

132‧‧‧Subcomponents

134‧‧‧Subcomponents

136‧‧‧Subcomponents

142‧‧‧Edge section

144‧‧‧Edge surface

146‧‧‧Edge surface

150‧‧‧ edge

152‧‧‧ edge

156‧‧‧ gap

Read with reference to the appended drawings the present invention detailed below, to better understand the present invention, the above-described features, and advantages contemplated, in which: FIG. 1 is a perspective view of a first glass plate; FIG. 2 is a second carrier substrate perspective view; FIG. 3 is bonded to a carrier substrate to form a glass - a perspective view of the carrier assembly of the glass sheet; Fig. 4 illustrates the step of providing the first and second defects in the glass plate; FIG. 5 illustrates the pair a step of reciprocating the beam of electromagnetic radiation along the first predetermined path on the glass sheet; Figure 6 illustrates the complete body cutting in the glass sheet along the first predetermined path; and Figure 7 illustrates the beam of electromagnetic radiation along a second predetermined path of reciprocating movement on a glass plate shows an example of the step; FIG. 8 illustrate a second glass plate is cut along the predetermined path of the complete body; FIG. 9 shows an example of the steps described a third defects formed in the carrier substrate; 10 FIG explaining a laser beam to reciprocate on the carrier substrate to form a complete embodiment shown the body of a crack along a third predetermined path step; FIG. 11 described so that the laser beam is moved reciprocally along a predetermined path in a third substrate on the carrier Forms part of the cracking step illustrated embodiment; FIG. 12 is a description of glass separated plurality of sub-components - carrier assembly; FIG. 13 illustrates the steps from one of the plurality of subassemblies in the release of a daughter board; FIG. 14 illustrates a glass sheet a step of generating second main surface of curvature; FIG. 15 illustrates the step of generating the curvature of the surface of the carrier on a supporting substrate; and FIG. 16 is a glass in the first step of FIG. 15 - carrier assembly Magnified view.

The invention will now be described more fully hereinafter with reference to the accompanying drawings, in which FIG. Whenever possible, the same component symbols are used to denote the same or similar components. However, the claimed invention may be embodied in many different forms and should not be construed as being limited to the specific embodiments set forth herein. These exemplary embodiments are provided to provide a thorough and complete description of the invention and the scope of the invention as disclosed herein.

As shown in FIG. 1, an exemplary method comprises providing a glass sheet 10, the glass plate 12 and 10 includes the first major surface 12 a first major surface opposite a second major surface 14. The thickness T1 between the first major surface 12 and the second major surface 14 of the glass sheet 10 can be equal to or less than about 300 microns, such as equal to or less than about 280 microns, such as equal to or less than about 230 microns, such as equal to or less than about 180 microns, for example equal to or less than about 100 microns, such as equal to or less than about 50 microns. The glass sheet 10 can include at least one edge to provide a polygonal shape (e.g., a rectangle such as a square or the like) that is curved (e.g., elliptical, circular, etc.). For example, as shown, the glass sheet 10 can further include four edges 16 , 18 , 20 , 22 that define the boundaries of the first major surface 12 that are arranged in the square, although in other examples, Other rectangular shapes are also available.

Referring to Figure 2 , the exemplary method further includes providing a carrier substrate 24 that can be provided by a wide range of materials, such as glass, ceramic, glass ceramic or other materials. Depending on the process technology or other needs, the carrier substrate 24 can be light transmissive or opaque, and thus exhibits at least partially transparent or completely transparent, translucent or opaque. The carrier substrate 24 includes a first major surface 26 , an opposing second major surface 28, and a thickness T2 between the first and second major surfaces 26 , 28 . In some examples, the thickness T2 is optionally greater than or equal to 500 microns.

As further illustrated in FIG. 2 , carrier substrate 24 further includes edges 30 , 32 , 34 , 36 that define the boundaries of second major surface 28 . In some examples, carrier substrate 24 has a perimeter shape that is similar or identical to the geometry of glass sheet 10 . For example, the carrier substrate 24 has the same outer square shape as the outer square of the glass sheet 10 . In other examples, although not identical, the carrier substrate 24 will have a shape that is geometrically similar to the glass sheet 10 . For example, the carrier substrate 24 has a shape that is slightly larger but geometrically similar to the shape of the glass sheet 10 . Providing a larger carrier substrate 24 helps protect the edges of the glass sheet 10 from damage. In some examples, the carrier substrate 24 also has a shape that is substantially larger than the glass sheet 10 . In other examples, the carrier substrate 24 also has a shape that is smaller than the glass sheet 10 .

As shown in FIG . 3 , the second major surface 14 of the glass sheet 10 is bonded to a support surface (e.g., the first major surface 26 ) of the carrier substrate 24 , thereby forming a glass-carrier assembly 42 . Adhesive material layer 40 is used to bond second major surface 14 of second glass sheet 10 to support surface 26 of carrier substrate 24 . In addition, other bonding techniques (eg, hydrogen bonding) may also be used to bond the second major surface 14 of the glass sheet 10 to the support surface 26 of the carrier substrate 24 .

As can be seen from Figures 1 to 3 , the major surfaces 12 , 14 , 26 , 28 of the glass sheet 10 and the carrier substrate 24 are all square in shape and have the same area. However, as described above with respect to the edges, the major surfaces 12 , 14 , 26 , 28 may have different shapes, such as rectangular, curved (e.g., circular, elliptical, etc.) in addition to square. Moreover, as previously described, the first and second major surfaces 12 , 14 of the glass sheet 10 can have a different shape or area than the first and second major surfaces 26 , 28 of the carrier substrate 24 . For example, the first and second major surfaces 26 , 28 of the carrier substrate 24 can be rectangular and have a larger area than the first and second major surfaces 12 , 14 of the square glass sheet 10 . Therefore, the first encounter with the external object is the carrier substrate 24 , whereby the edge of the glass sheet 10 can be protected. The first and second major surfaces 26 , 28 of the carrier substrate 24 may also be rectangular and have a smaller area than the first and second major surfaces 12 , 14 of the square glass sheet 10 .

It illustrates a method may further comprise providing a first defect a second defect 46 and 44, as shown in FIG. 4, the glass sheet 10. The first and second defects 44 , 46 can be produced using a variety of methods. For example, the first and second defects 44 , 46 may be generated by laser pulses or by mechanical means such as dicing, scribing cutter wheels, diamond sharpeners, indenters, and the like. The first and second defects 44 , 46 are formed on either edge 16 , 18 , 20 , 22 of the glass sheet 10 , or the first and second defects 44 , 46 may be formed away from the edges 16 , 18 , 20 , The first major surface 12 of the glass sheet 10 of 22 . In this example, the first defect 44 is formed on the edge 16 of the glass sheet 10 and the second defect 46 is formed on the edge 22 of the glass sheet 10 .

The exemplary method can further include separating the glass sheet 10 into a plurality of daughter boards. For example, by moving the electromagnetic radiation beam 48 over the first major surface 12 along a first predetermined path 50 , as shown in FIG . 5 , the glass sheet 10 is separated into a plurality of daughter boards. In the present example, a first predetermined path 50 includes a first defect 44 extends from an edge of the glass sheet 16 to the edge 10 of glass sheet 10, one 20 in a straight line. However, in other examples, the first predetermined path 50 will include a curve. Furthermore, the first predetermined path 50 is extended to any other edge of the glass 10 from the edge 16 of glass sheet 10 at a position 44 of the first defect. Still further, the first predetermined path 50 can include a closed path that is completely confined within the boundaries of the first major surface 12 such that the closed path can be staggered with any edge of the glass sheet 10 . The first predetermined path 50 includes any path that extends along or across the first major surface 12 of the glass sheet 10 .

The movable laser radiation device 52 can be used to generate the electromagnetic radiation beam 48 and to reciprocate the electromagnetic radiation beam 48 along the first predetermined path 50 . As the beam of electromagnetic radiation 48 reciprocates along the first predetermined path 50 , a heated region 54 is formed on the first major surface 12 . After the beam of electromagnetic radiation 48 optionally connected to a cooling device 56, cooling device 56 based on the heating electromagnetic radiation beam 48, 58, as further shown in FIG. 5 along a first cooling fluid 10 is administered a predetermined path 50 to the glass sheet . Cooling fluid 58 can be a liquid or a gas or a combination of liquid and gas. Cooling fluid administration system 58 is to generate a cooling zone 12 on the first major surface 60, 60 in the cooling area is less than a temperature of the heating zone 54. As a result of this temperature difference, a thermal stress is generated in the glass sheet 10 that converts the first defect 44 into a first complete body crack 64 that is interleaved with the first major surface 12 and the second major surface 14 of the glass sheet 10 . . The first complete body crack 64 then propagates along the first predetermined path 50 as the electromagnetic radiation beam 48 and the cooling fluid 58 reciprocate along the first predetermined path 50 . As shown, the first complete body crack 64 is generated but not propagated into the carrier substrate 24 , as appropriate. As shown in FIG . 6 , once the electromagnetic radiation beam 48 and the cooling fluid 58 completely traverse the first predetermined path 50 , i.e., from the first major surface 12 to the second major surface 14 , along the first predetermined path 50, the glass sheet 10 is produced. The complete body separation thus separates the glass sheet 10 into two daughter boards 68 , 70 . Moreover, because the second major surface 14 of the glass sheet 10 remains bonded to the support surface 26 of the carrier substrate 24 during and after separation, the two daughter boards 68 , 70 remain substantially along their separation line. Get in touch with each other or close to each other.

The glass plate 10 is a step of separating the plurality of sub-plate system further comprises an electromagnetic radiation beam 48 to move along a second predetermined path 78 to reciprocate above the first major surface 12, as shown in FIG. 7. In the present example the second predetermined path 78 includes second defect 46 extending from the edge of the glass to the edge of the glass 10 10 22 18 linear one. Moreover, as shown, the second predetermined path 78 can be interleaved with the first predetermined path 50 . As shown, the second predetermined path 78 can also be oriented perpendicular to the first predetermined path 50 . However, the second predetermined path 78 does not need to be perpendicular to the first predetermined path 50 ; instead, the second predetermined path 78 can form any angle with the first predetermined path 50 . Moreover, in some examples, the second predetermined path 78 will include a curve rather than a straight line. Further, the second predetermined path 78 may extend to any other edge of the glass 10 from the edge 22 of glass sheet 10 at a position 46 of the second defect. Still further, the second predetermined path 78 can include a closed path that is completely confined within the boundaries of the first major surface 12 such that the closed path can be staggered with any edge of the glass sheet 10 . The second predetermined path 78 can include any path that extends along or across the first major surface 12 of the glass sheet 10 and that is interleaved with the first predetermined path 50 .

When the electromagnetic radiation beam 48 reciprocates along the second predetermined path 78 , the heating region 54 is again formed on the first major surface 12 . The beam of electromagnetic radiation 48 may optionally be coupled to a cooling device 56 to apply a cooling fluid 58 to the glass sheet 10 along a second predetermined path 78 after heating of the beam of electromagnetic radiation 48 , thereby forming a cooling zone 60 . Thermal stress is generated in the glass sheet 10 to convert the second defect 46 into a second complete body crack 82 that is interleaved with the first major surface 12 and the second major surface 14 of the glass sheet 10 . The second complete body crack 82 then propagates along the second predetermined path 78 as the electromagnetic radiation beam 48 and the cooling fluid 58 reciprocate along the second predetermined path 78 .

As shown, the second complete body crack 82 is generated but not propagated into the carrier substrate 24 , as appropriate. Finally, the second complete body crack 82 propagates along the second predetermined path 78 to the separation line of the two daughter boards 68 , 70 . Because the two daughter boards 68 , 70 are still held substantially in contact with each other or close to each other along their separation line, the second complete body crack 82 will continue to propagate through the separation lines of the two daughter boards 68 , 70 without Need to have additional defects. Thus, as shown in FIG . 8 , once the electromagnetic radiation beam 48 and the cooling fluid 58 have completely traversed the second predetermined path 78 , a second predetermined path 78 is created along the second predetermined path 78 from the first major surface 12 to the second major surface 14. The complete body of the glass sheet 10 is separated, thereby separating the glass sheet 10 into four sub-boards 86 , 88 , 90 , 92 . This separation along the second predetermined path 78 may also be referred to as cross-cutting because the separation along the second predetermined path 78 may intersect the separation of the glass sheet 10 along the first predetermined path 50 . Since the second major surface 14 of the glass sheet 10 remains bonded to the support surface 26 of the carrier substrate 24 during or after separation, the four daughter boards 86 , 88 , 90 , 92 remain substantially separate on the separation line. Get in touch with each other or close to each other. In this example, the formation of daughter boards 86 , 88 , 90 , 92 requires half or less of the number of initial defects. As the number of daughter boards increases, the relative amount of initial defects required decreases.

While the illustrated method separates the glass sheets 10 along two predetermined separation paths, in other examples, the method can separate the glass sheets 10 along any number of predetermined separation paths. In these examples, a defect can be similarly formed for each predetermined path, and a beam of electromagnetic radiation 48 and optionally a cooling fluid 58 are applied similarly to the glass sheet 10 to convert the defect into a crack and cause the crack to follow The scheduled path is spread. If the predetermined path happens to intersect the separation line between the two daughter boards of the glass sheet 10 , the crack will continue to propagate through the separation line because the daughter board remains in thermal contact due to the bonding of the glass sheet 10 and the carrier substrate 24 . The reason.

When the glass sheet 10 has been separated into the desired number of daughter boards, one or more daughter boards can be released from the glass-carrier assembly 42 in a variety of ways. For example, Figures 9 through 13 illustrate one manner of releasing one or more daughter boards from the glass-carrier assembly 42 . As shown in FIG. 9 , after the glass sheet 10 has been separated into four sub-boards 86 , 88 , 90 , 92 , the method can include the step of providing a third defect 102 in the carrier substrate 24 . Third defect 102 is formed based on either edge 30 of the carrier substrate 24, 32, 34, 36, or the third defect 102 may be formed away from the edge 30 in the second primary, 32, carriers 34, 36 of the substrate 24 On the surface 28 . For purposes of illustration, the third defect 102 is presented as being formed on the edge 30 of the carrier substrate 24 .

After the third defect 102 has been formed, the electromagnetic radiation by the beam 48 with respect to the carrier substrate 24 reciprocates, the carrier substrate 24 is separated into a plurality of sub-based carrier substrate, as shown in FIG. 10 along a third predetermined path 112. Preferably, the third predetermined path 112 is aligned with the first predetermined path 50 and includes a line extending from the edge 30 of the carrier substrate 24 to the edge 34 of the carrier substrate 24 at the location of the third defect 102 . However, the third predetermined path 112 can include any path that extends over the second major surface 28 of the carrier substrate 24 .

As the beam of electromagnetic radiation 48 reciprocates along the third predetermined path 112 , a heated region 54 is formed on the second major surface 28 of the carrier substrate 24 . The electromagnetic radiation beam 48 can be coupled to a cooling device 56 to apply a cooling fluid 58 to the carrier substrate 24 along the third predetermined path 112 after heating of the electromagnetic radiation beam 48 , thereby forming a cooling region 60 . In the carrier substrate 24 generates heat stress, the third defect 102 into a crack 116, 116 will then crack with an electromagnetic beam of radiation 48 and 112 spread the cooling fluid 58 is reciprocated along a third predetermined path. In the present embodiment, the crack 116 is a complete body crack extending through one of the overall thicknesses T2 of the carrier substrate 24 , thus creating a complete body separation of the carrier substrate 24 along the third predetermined path 112 . However, in other embodiments, a portion of crack 116 based cracks which propagate only partially through the thickness T2 of the carrier substrate 24, thereby forming a scratch 118, as shown in FIG. 11 along a third predetermined path 112. In such embodiments, the bending force is then applied to the carrier substrate 24, the substrate 24 so that the carrier scratches formed along the separated plurality of sub-carrier substrate 118 is. In addition to the use of electromagnetic radiation, the carrier substrate 24 can also be separated by using mechanical scribing techniques or other means. The method for separating the carrier substrate 24 from the glass sheet 10 need not be the same.

The carrier substrate 24 can be separated into any number of sub-carrier substrates using dicing and/or the above-described complete body cutting technique. For example, Figure 12 illustrates the glass-carrier assembly 42 after the carrier substrate 24 has been separated along two predetermined paths from the first and second predetermined paths 50 , 78 (to which the glass sheet 10 is separated). . As shown, the carrier substrate 24 has been separated into four sub-carrier substrates 120 , 122 , 124 , 126 . Therefore, the glass - based carrier assembly 42 is separated into four sub-assemblies 130, 132, 134, 136, wherein each sub-carrier substrate 120, 122, 124, 126 lines and a plurality of daughter boards 86, 88, 90, 92 in a single The corresponding daughter boards are joined to form one of the four sub-assemblies 130 , 132 , 134 , 136 . Each of these sub-components 130 , 132 , 134 , 136 is for an individual application. Moreover, since each of the daughter boards 86 , 88 , 90 , 92 is part of one of the other sub-components 130 , 132 , 134 , 136 , each of the daughter boards 86 , 88 , 90 , 92 can be from its corresponding sub-carrier The substrates 120 , 122 , 124 , 126 are released without the risk of damaging the edges of the daughterboard edges in contact with the remaining daughterboards. For example, Figure 13 illustrates the steps of releasing the daughter board 86 of the subassembly 130 from the subcarrier substrate 120 . Sub-assembly 130 has 132, 134, 136 isolated from the rest of the subassembly, thus, may be born without edge sub-plate 86 makes contact with the remaining sub-plate 88, the sub-plate 86 is released at risk 90, 92.

Although the above releasing step involves separating the carrier substrate 24 into a plurality of sub-carriers after the glass sheet 10 has been separated, in other examples, the releasing step may also separate the carrier substrate 24 into plural numbers before the glass sheet 10 is separated. Subcarrier. Further, in other examples, first scribe line is formed in the carrier substrate 24, the glass plate 10 is then separated, bending stress is then applied to the carrier substrate 24 so that the carrier substrate 24 is separated into a plurality of sub carrier along the score line.

Figures 14 through 16 illustrate an alternative step of releasing one or more daughter plates from the glass-carrier assembly 42 but without separating the carrier substrate 24 into sub-carrier substrates. For example, after the glass sheet 10 of the glass-carrier assembly 42 has been separated into a plurality of daughter boards, the method can include at least one of the second major surface 14 of the glass sheet 10 and the support surface 26 of the carrier substrate 24 . The step of separating at least a portion of the at least one daughterboard from the carrier substrate 24 is produced in a curvature. For example, Figures 14 and 15 illustrate the glass-carrier assembly 42 after the glass sheet 10 has been separated into four daughter sheets 86 , 88 , 90 , 92 . As shown in Figure 14, by making a plurality of sub-sub-plate wherein a plate portion 142 rising edge 86 away from the carrier substrate 24, to produce a double curvature in the bent glass sheet 10 of the second major surface 14. In just one example, the edge portions 142 are raised away such that the opposing edge surfaces 144 , 146 of the adjacent daughter boards 86 , 92 begin to move away from each other as the edge portions 142 are lifted off. For example, in one example, the double bend curvature is such that the opposing edge surfaces 144 , 146 can remain substantially parallel to each other as the edge portion 142 is lifted off. Since the opposing edge surfaces remain substantially parallel, the opposing edge surfaces 144 , 146 can begin to move away from each other as soon as the edge portion 142 is lifted off. However, there may be specific embodiments in which the opposing edge surfaces 144 , 146 appear slightly non-parallel when the edge portion 142 is lifted off. The double bend curvature causes the edge surfaces 144 , 146 to remain substantially parallel or slightly non-parallel when the edge portion 142 is lifted away to tear the daughterboard 86 away from the carrier substrate 24 . In this manner, by raising the edge portion 142 away from the carrier substrate 24 , the edges 150 , 152 of the daughterboard 86 can be prevented from rubbing against the edge surface 146 . Therefore, damage to the edge surface 146 by other release techniques is avoided. The daughter board 86 is completely released from the carrier substrate 24 while maintaining this double bending curvature. However, there may be specific embodiments for maintaining the double bend curvature only when a portion of the daughter board 86 is released from the carrier substrate 24 . At the same time, other single curved geometries can be used as appropriate, and the geometry of the daughterboard 86 can be released from the outer edge (rather than the inner edge surface 144 as shown in FIG . 14 ) to release the daughterboard 86 from the carrier substrate 24 .

Transfected with reference to FIG. 15 to FIG. 16, in another example, based on the generated surface of the carrier 26 supports the curvature of substrate 24, at least a portion of the carrier substrate 24 from the sub-plate 86 is released. As can be seen from Figures 15 and 16 , the resulting curvature causes the pair of opposing edge surfaces 144 , 146 of adjacent pairs of daughter plates 86 , 92 to translate away from each other along the direction D of the first major surface 12 . A lateral gap 156 is created between the pair of opposing edge surfaces 144 , 146 . The presence of the gap 156 to avoid edge sub-plate 86 may be 150, 152 at the edge portion 142 of the sub-plate 86 is lifted off the edge 24 when the friction surface 146 of the carrier substrate. In addition, a double or single bending curvature may be created in the second major surface 14 of the glass sheet 10 as the edge portion 142 is raised away from the carrier substrate 24 to help further avoid the edges 150 , 152 of the daughterboard 86 in the daughterboard. The edge portion 142 of the 86 is raised away from the friction edge surface 146 . The daughter board 86 is completely released from the carrier substrate 24 while still maintaining the curvature in the support surface 26 of the carrier substrate 24 . However, there may be specific embodiments for maintaining the curvature in the support surface 26 of the carrier substrate 24 only when a portion of the daughter board 86 is released from the carrier substrate 24 .

Although Figures 14 through 16 illustrate the release of one or more daughter boards from the glass-carrier assembly 42 , but do not include the step of separating the carrier substrate 24 into sub-carrier substrates, there may be a release from the glass-carrier assembly 42. Or a plurality of daughter boards, and including the above-described embodiment of separating the carrier substrate 24 into the sub-carrier substrate and producing a curvature in at least one of the second major surface 14 of the glass sheet 10 and the support surface 26 of the carrier substrate 24 . For example, after the glass sheet 10 of the glass-carrier assembly 42 has been separated into four daughter boards 86 , 88 , 90 , 92 , the carrier substrate 24 is separated along a single predetermined path to produce two sub-assemblies, wherein Each subassembly includes two daughter boards joined to a subcarrier. A curvature is then produced in at least one of the second major specific face 14 of the glass sheet 10 and the support surface 26 of the carrier substrate 24 to remove one of the daughter boards from one of the subassemblies.

The above exemplary method can provide several advantages over the general laser scribing technique. For example, a typical laser scribing technique for a glass sheet requires at least two steps, including creating a scratch, and then applying a stress to the glass sheet to separate the glass sheet along the score line. At the same time, mechanical defects can occur during mechanical separation processes involving the application of bending or shear stress. This may result in a difference in edge strength when evaluating the relationship between tensile stress and compressive stress on the incident side of the laser. However, by the method described above to produce a complete body of cracks in the glass sheet 1064, 82 (which need not tied to the glass sheet 10 applied to the glass plate 10 an additional separation step in stress) simplifies the separation process. Another advantage is that the above method minimizes the amount of edge damage generated during cross-cutting applications with staggered separation lines. Because the glass sheets 10 in the exemplary method are bonded (e.g., with an adhesive) to the carrier substrate 24 , any of the daughter sheets formed will remain substantially in contact with or in close proximity along their separation lines. Thus, when any crack is propagated across an existing separation line, there is no need to create any edge defects in order for the crack to continue to propagate across the split line. Indeed, as shown in Figure 8 , the daughterboard 90 is formed without the need to create any edge defects along its circumference. Another advantage is that the above method facilitates the separation of the glass-carrier assembly 42 into a plurality of individual sub-assemblies (each of which has a single sub-plate) or by the glass sheet 10 two support surfaces 14 and the major surface 26 of the carrier substrate 24 wherein at least one of the curvature generated when the carrier substrate 24 and removing the glass from the sub-plate, to avoid damage to the edge of the daughter board glass.

An example of an experiment that the inventors have performed using the above method will now be described.

Example 1

In one example, a glass sheet is bonded to a carrier glass substrate comprising Corning® Willow® Glass available from Corning Incorporated, Corning, NY, and having a thickness of 130 microns; the carrier glass substrate includes Corning® EAGLE XG® Glass, available from Corning Incorporated, Corning, NY, and has a thickness of 700 microns. The carrier glass substrate is coated with a plasma polymerized Teflon (-PPT) to enhance bonding and peeling. Defects are then created in the edge regions of the glass sheets using diamond sharpeners or scribing cutter wheels. The CO ₂ laser cross-cut of the glass sheets was then performed using a 400 W RF-excited CO ₂ laser. The laser beam is expanded and focused using an asymmetric spherical lens to create a rectangular footprint on the surface of the glass sheet that is approximately 45 mm long and 1.5 mm wide. The laser beam has an upper hat-type intensity distribution on both its long axis (45 mm) and short axis (1.5 mm). The cutting is done along the long axis of the footprint. A spray is applied after the laser beam, and deionized water is used as a coolant to quench the glass plate. During cross-cutting, the laser beam and spray are operated under the following conditions

Laser power: 160W

Water flow: 10sccm

Air flow: 3lpm

Cutting speed: 250mm

The first cut was performed using a CO ₂ laser and then a second cut was made interleaving with the first cut. Complete bulk cracks were observed for both the first and second cut marks. It was observed that the second cut line propagated unimpeded through the first cut mark. The glass sub-board produced by the above cross-cutting process can be easily extracted from the carrier substrate.

Example 2

In another example, a glass sheet comprising one of Corning® Willow® Glass is bonded to a glass sheet comprising one of Corning® EAGLE XG® Glass to produce a glass-carrier assembly. The carrier glass substrate is coated with PPT to promote bonding and peeling. Defects are then created in the edge regions of the glass sheets using diamond sharpeners or scribing cutter wheels. The glass sheets were cut using the same parameters as described in Example 1. However, a scribe line is formed on the carrier substrate using a laser beam prior to dicing. A bending stress is then applied to the glass-carrier assembly to propagate the cracks in the score line and to rupture the carrier substrate along the score line. Cracks do not propagate into the glass sheet. A complete bulk crack is then initiated in the glass sheet and propagated to separate the glass sheets.

Example 3

In another example, a glass sheet comprising one of Corning® Willow® Glass is bonded to a glass sheet comprising one of Corning® EAGLE XG® Glass to produce a glass-carrier assembly. The carrier glass substrate is coated with PPT to promote bonding and peeling. Defects are then created in the edge regions of the glass sheets using diamond sharpeners or scribing cutter wheels. The glass sheets were then cut using the same parameters as described in Example 1. Then, a laser cross-hatch process is performed on the carrier glass substrate. Carefully align the laser scratch line with the cut marks on the glass. A bending stress is then applied to the glass-carrier assembly to cause the carrier glass to rupture along the score line.

It will be understood by those skilled in the art that various modifications and changes may be made without departing from the spirit and scope of the invention. Therefore, the present invention is intended to cover various modifications and variations of the present invention as set forth in the appended claims.

10‧‧‧ glass plate

12‧‧‧ first major surface

14‧‧‧ second major surface

16‧‧‧ edge

20‧‧‧ edge

22‧‧‧ edge

24‧‧‧ Carrier substrate

42‧‧‧Glass-carrier assembly

46‧‧‧second defect

48‧‧‧Electromagnetic radiation beam

50‧‧‧First scheduled path

52‧‧‧Laser radiation device

54‧‧‧heating area

56‧‧‧Cooling device

58‧‧‧Cooling fluid

60‧‧‧Cooling area

64‧‧‧First complete body crack

Claims (10)

A method for separating a glass sheet, comprising the steps of: (I) providing a glass sheet, the glass sheet comprising a first major surface and a second major surface opposite the first major surface, wherein an adhesive material Laminating the second major surface of the glass sheet to a support surface of a carrier substrate, and a thickness between the first major surface and the second major surface is equal to or less than about 300 microns; (II) Providing a first defect in the glass sheet; and (III) separating the glass sheet into a plurality of daughter boards by reciprocating a beam of electromagnetic radiation along the first predetermined path along the first predetermined path to: ( a) converting the first defect into a first complete body crack interleaved with the first major surface and the second major surface of the glass sheet; and (b) causing the first complete body crack along the first A predetermined path propagates whereby a complete body separation of the glass sheet is created along the first predetermined path while the second major surface of the glass sheet remains bonded to the support surface of the carrier substrate. The method of claim 1, wherein the step (II) further comprises the steps of: providing a second defect in the glass sheet, and separating the glass sheet into a plurality of sub-plate systems in the step (III) further comprises the following steps : causing a beam of electromagnetic radiation to follow the first predetermined path along the second Reciprocatingly moving over the major surface to: (a) convert the second defect into a second complete body crack interleaved with the first major surface and the second major surface; and (b) cause the second complete body crack Propagating along the second predetermined path whereby a complete body separation of the glass sheet is produced along the second predetermined path while the second major surface of the glass sheet remains bonded to the support surface of the carrier substrate. The method of claim 2, wherein the second predetermined path is interleaved with the first predetermined path. The method of claim 1, further comprising the step (IV) of releasing from the carrier substrate by generating a curvature in at least one of the second major surface of the glass sheet and the support surface of the carrier substrate At least a portion of at least one daughter board. The method of claim 4, wherein the step (IV) further comprises the step of completely releasing at least one daughterboard from the carrier glass while maintaining the curvature. The method of claim 4, wherein the step (IV) comprises the step of: lifting an edge portion of one of the plurality of daughter boards away from the carrier glass, the second major surface of the glass sheet Produces a double bending curvature. The method of claim 1, further comprising the steps of: (IV) providing a second defect in the carrier substrate; (V) separating the carrier substrate into a plurality of sub-carrier substrates by reciprocating the electromagnetic radiation beam relative to the carrier substrate along a second predetermined path. The method of claim 7, wherein the first predetermined path is aligned with the second predetermined path. The method of claim 7, wherein causing the electromagnetic radiation beam to reciprocate in step (V) converts the second defect into a second complete body crack extending through the carrier substrate, and causing the second A propagation along the second predetermined path along the second predetermined path produces a complete body separation of the carrier substrate. The method of claim 4, wherein the step (IV) is to translate at least one pair of opposing edge surfaces of a pair of adjacent daughterboards away from each other along a direction of the first major surface to the opposite edges A lateral gap is created between the surfaces.