JP2017014032A - Scribe method and scribe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribe method and a scribe device, that is a laser scribe means with a resin sheet between a glass substrate and an adsorptive table, the glass substrate is easily peeled off from the resin sheet after processing.SOLUTION: After heating a surface of the glass substrate M on the adsorptive table 1 along a scribe planned line L1, a heated region is quickly cooled by coolant, to progress a trigger T of a tip of the glass substrate M, to create a crack S for segmentation along a scribe planned line L1 on the glass substrate M, in the scribe method and scribe device. The resin sheet 20 is adsorbed and held by the adsorptive table 1 at the state that a street region R for scanning the laser B is left, and scribe of a surface of the glass substrate M is performed while the scribe planned line L1 of the glass substrate M is positioned on the street region R, and the glass substrate M is adsorbed and held by the resin sheet 20, and thereby, the crack S for segmentation is formed.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a scribing method and a scribing apparatus for processing a splitting crack in a thin glass substrate made of alkali-free glass or the like. In particular, the present invention relates to a scribing method and a scribing apparatus for scribing a thin glass substrate used in a flat panel display (FPD) such as a liquid crystal display or a plasma display.

  Conventionally, using a laser scribing method that scans while irradiating a laser beam and generates a thermal stress distribution on the substrate to perform scribing, for example, as in Patent Document 1, a split crack (crack) is formed, Or the technique of carrying out complete parting (full cut processing) like patent document 2 is known.

In the conventional laser scribing method, as shown in FIG. 8A, a glass substrate M is mounted and fixed on a suction table 21 having a large number of air suction holes, and laser light 22 such as a CO ₂ laser is used. The surface vicinity of the glass substrate M is scanned and heated along the scheduled scribe line L1, and the refrigerant 23 is jetted from the nozzle of the cooling mechanism to the heating region following this. In addition, the code | symbol E1 shows the heating area | region by the laser beam 22, and the code | symbol E2 shows the quenching area | region by the refrigerant | coolant 23. FIG. As a result, as shown in FIG. 8B, the trigger (initial crack) T is developed by the thermal stress distribution due to the compressive stress P1 generated by the preceding heating and the tensile stress P2 generated by the subsequent rapid cooling, so that the glass substrate M A crack S for cutting is generated on the surface, or the full thickness is processed by infiltrating the crack S in the entire thickness.

  The adsorption table for adsorbing and holding the glass substrate during scribing is made of a metal plate having a large number of suction holes made by machining on a metal plate and a porous plate such as a ceramic having a large number of pores. Some of them are formed and sucked with air during laser scribing to hold the glass substrate. However, in recent years, the thinning of the glass substrate has progressed due to the reduction in the weight and thickness of video display devices such as smartphones, and thus, for example, a thin film-like glass substrate of 0.2 mm or less has been required. If such a thin glass substrate is adsorbed by an adsorption table, the following problems occur and laser scribing becomes difficult.

  In general, the hole diameter of the suction holes provided in the metal table is about 1 to 2 mm, and the hole diameter of the pores of the porous plate table is smaller than that and is about 50 to 60 μm. When laser scribing is performed by directly adsorbing the glass substrate to the openings of the suction holes and pores, the heat dissipation due to the presence or absence of contact with the adsorption table between the vicinity of the opening and the flat part without the opening is caused. A difference will arise in the thermal stress in a glass substrate. This difference in thermal stress becomes even more pronounced with thin glass substrates of 0.2 mm or less, and it becomes impossible to generate thermal stress evenly over the entire length of the scribe line, resulting in incomplete cracks or unevenness. Therefore, laser scribing with high accuracy cannot be performed. Further, in the case of a thin glass substrate, heat is taken away by direct contact with the table surface, and there is a problem that thermal stress cannot be sufficiently exhibited in the substrate and cracks become insufficient.

International Publication WO2003 / 008352 JP 2001-170786 A

  Therefore, as shown in FIG. 9, the present applicant attaches the resin sheet 20 ′ to the glass substrate M with an adhesive or the like, and places the resin sheet 20 ′ on the lower surface on the suction table 1 made of a porous plate. A method for laser scribing by placing was filed earlier.

  According to this method, the unevenness of the thermal stress caused by the suction holes can be solved, and the formation of the crack S is promoted by interposing the resin sheet 20 ′ between the suction table 1 and the glass substrate M. .

However, this method still has a problem that a very troublesome process of peeling the glass substrate M from the resin sheet 20 ′ occurs after the processing of the crack S by laser scribing.
Adhesives with weak adhesive strength are used for bonding the glass substrate and the resin sheet, but in the case of a thin film-like glass substrate of 0.2 mm or less, the glass substrate may be bent at the time of peeling. It may be bent and damaged. In particular, when the crack is processed with a goal of half-cut (a crack with a depth of 70 to 90% of the total thickness of the glass substrate), the half-cut crack penetrates due to bending or bending when the resin sheet is peeled off. In some cases, it was completely broken or cracked in an unexpected direction, resulting in a defective product.

  Therefore, the present invention is a laser scribing means in which a resin sheet is interposed between a glass substrate to be processed and an adsorption table, and the glass substrate can be easily peeled off from the resin sheet after the cracking process. An object of the present invention is to provide a scribing method and a scribing apparatus that can reliably and accurately form a crack.

  In order to achieve the above object, the present invention takes the following technical means. That is, according to the present invention, the surface of the glass substrate adsorbed on the adsorption table is heated along a scribe line using a laser, and the heating region is rapidly cooled with a refrigerant, thereby generating heat generated in the glass substrate. A scribing method in which a trigger formed at a head portion of the planned scribe line by stress is advanced to generate a crack for dividing along the planned scribe line on the surface of the glass substrate, the street scanning the laser The resin sheet provided with a large number of air suction holes with the area remaining is sucked and held on the suction table, and the scribe line of the glass substrate is positioned on the street area of the resin sheet. The substrate is adsorbed and held on the resin sheet, and in this state, the surface of the glass substrate is moved forward. By scribing along said scribed by irradiating a laser, and forming cracks along said scribed on the glass substrate.

  The resin sheet has a thickness of 50 to 200 μm, and is preferably formed of a resin material selected from polyvinyl chloride, polyethylene, polyethylene terephthalate, polyvinylidene chloride, polyvinylidene fluoride, silicon rubber, polyurethane resin, and the like.

  In addition, the present invention heats the surface of the glass substrate adsorbed on the adsorption table along a scheduled scribe line using a laser, and rapidly cools the heating region with a refrigerant, thereby generating thermal stress in the glass substrate. A scribing device that develops a trigger formed at the top of the planned scribe line in order to generate a splitting crack along the planned scribe line on the surface of the glass substrate, the street area scanning the laser The glass substrate is provided with a plurality of air suction holes in a state where the glass substrate is left and held by the suction table, and the scribe line of the glass substrate is positioned on the street region of the resin sheet. Adsorbed and held on the resin sheet, and the laser is placed on the scribe line on the glass substrate. Scribing device that is configured to be scanned also as its features.

  According to the present invention, when the glass substrate is placed on the resin sheet, the planned scribing line of the glass substrate is positioned in the middle of the street region having no air suction hole of the resin sheet. The difference in the downward heat dissipation between the opening (air suction hole) and the portion without the opening can be eliminated, and uneven generation of thermal stress in the glass substrate can be eliminated. In addition, this makes it possible to generate thermal stress evenly over the entire length of the scribe line, and to form cracks cleanly without unevenness.

  Furthermore, as a part of the resin sheet heated by the heat of a part of the laser transmitted through the glass substrate rises due to thermal expansion, the portion of the glass substrate in contact with this rises upward and is generated on the glass substrate surface side. The tensile stress of the material itself promotes the tensile stress of the thermal stress, so that cracks can be reliably formed.

  In particular, in the present invention, the glass substrate is only adsorbed and held in the air suction holes of the resin sheet, and after the laser scribing, the glass substrate can be easily separated from the resin sheet and taken up. Thus, there are effects that it is possible to eliminate troublesome peeling process when the glass sheet is attached to the resin sheet and damage to the glass substrate at the time of peeling.

1 is a schematic front view showing an embodiment of a scribing apparatus according to the present invention. Sectional drawing which shows the adsorption | suction table in this invention. Sectional drawing which shows the state which has arrange | positioned the resin sheet and the glass substrate on the adsorption | suction table. The top view of the resin sheet in this invention. Explanatory drawing which shows the scribing method of this invention. Explanatory drawing which expands and shows the crack part formed by this invention. The table | surface which shows the laser scribe experiment result in the case of no resin sheet. The table | surface which shows the experimental result obtained by the scribing method of this invention. Explanatory drawing which shows the conventional laser scribing method. Explanatory drawing at the time of sticking a resin sheet on the substrate lower surface at the time of laser scribing.

  Hereinafter, the details of the present invention will be described based on the embodiments shown in the drawings. In this embodiment, a film-like non-alkali glass plate having a thickness of 0.03 to 0.2 mm is used as the glass substrate to be processed.

FIG. 1 shows a scribing apparatus A used in the method of the present invention, and includes a suction table 1 on which a glass substrate M is placed and sucked and held.
As shown in FIG. 2, the suction surface of the suction table 1 is formed of a porous plate 3 made of ceramic or carbon having a large number of pores. The porous plate 3 is held by a frame member 4, and a suction force is generated in the pores (openings) by sucking the chamber 5 formed below with a suction pump P so that the glass substrate M is sucked and held. Is formed.
The porous plate 3 is preferably formed with a pore diameter of 1 to 10 μm and a porosity of 10 to 40%. In this embodiment, the porous plate 3 is formed with a pore diameter of 5 μm and a porosity of 35%.
The suction table 1 can be moved in the Y direction (front-rear direction in FIG. 1) along a horizontal rail 6 and is driven by a screw shaft 7 that is rotated by a motor (not shown). Further, the suction table 1 can be rotated in a horizontal plane by a rotation drive unit 8 incorporating a motor.

A bridge 11 provided with support columns 9 and 9 on both sides of the suction table 1 and a beam (horizontal beam) 10 extending horizontally in the X direction is provided so as to straddle the suction table 1. Yes. The beam 10 is provided with a guide 12 extending horizontally in the X direction. A scribe head 15 including a laser irradiation unit 13 that irradiates the laser B and a refrigerant injection nozzle 14 that rapidly cools the heated portion immediately after the laser irradiation is attached to the guide 12. Further, the guide 12 is provided with a scribe head 17 that holds a cutter wheel 16 for processing a trigger (initial crack) T at a leading portion of a scribe line L1 of the glass substrate M. The scribe heads 15 and 17 can be moved in the X direction along the guide 12 by a moving mechanism (not shown) using the motor 18 as a drive source.
As the laser B emitted from the laser irradiation unit 13, a laser beam that is easily absorbed by glass such as a CO ₂ laser is used.

As shown in FIG. 3, a resin sheet 20 is held by suction on the suction table 1.
The resin sheet 20 is formed with a thickness of 50 to 200 μm, for example, 100 μm. As the material thereof, for example, a resin material such as polyvinyl chloride, polyethylene terephthalate, polyvinylidene chloride, silicon rubber, polyurethane or the like can be used.
As shown in FIG. 4A, the resin sheet 20 is provided with a plurality of rows of elongated air suction holes 20a in parallel with a street region R having a predetermined width. An intermediate position of the street region R is a street L2 where the laser B is scanned. The pitch of the street L2 is formed at the same pitch as the planned scribe line L1 of the glass substrate M. In the case of the present embodiment, the pitch of the scribe line L1 of the glass substrate M is 16 mm, and the width of the street region R of the resin sheet 20 is 15 mm and the short diameter (width diameter) of the air suction hole 20a is corresponding to this. It is formed with 1 mm. The width C of the street region R can be formed to be 0.5 mm or more according to the pitch of the scribe line L1 of the glass substrate M.
In the above embodiment, the air suction hole 20a is formed by one elongated hole. However, as shown in FIG. 4B, a large number of small holes 20a ′ may be formed in a straight line.

Next, the scribing method of the present invention using the above apparatus will be described.
First, as shown in FIGS. 3 and 5, the resin sheet 20 is placed on the suction table 1 and held by suction. Then, the glass substrate M is placed on the resin sheet 20 so that the planned scribe line L1 of the glass substrate M is positioned in the middle of the street region R, and is sucked and held through the air suction hole 20a.

  Prior to the laser scribing, the trigger T is processed by the cutter wheel 16 at the front end of the scheduled scribe line L1 on the surface of the glass substrate M. The processing of the trigger T is formed by lowering the cutter wheel 16 toward the surface of the glass substrate M at a position slightly inside from the edge of the glass substrate M. As the cutter wheel 16 for processing the trigger T, for example, a grooved cutter wheel in which grooves (notches) and cutting edges are alternately formed along a circumferential ridgeline may be used.

  Next, starting from the trigger T as a starting point, the laser irradiation unit 13 scans and heats the laser B along the scheduled scribe line L1, and the refrigerant is jetted from the refrigerant jet nozzle 14 to the heating region following this. As a result, as shown in FIG. 6, the split crack S starting from the trigger T is scheduled to be scribed by the thermal stress distribution caused by the compressive stress P1 generated by the preceding heating and the tensile stress P2 generated by the next rapid cooling. It is formed along L1.

During this laser scribing, the glass substrate M is placed on the resin sheet 20 so that the scribe line L1 of the glass substrate M is positioned in the middle of the street region R that does not have the air suction holes 20a of the resin sheet 20. That is, since the air suction hole 20a does not exist on the street L2 of the laser B, inside the glass substrate M due to the difference in heat dissipation downward between the opening near the air suction hole 20a and the portion without the opening. The unevenness of thermal stress generation is eliminated. As a result, thermal stress can be generated uniformly over the entire length of the scribe line L1, and the crack S can be formed cleanly without unevenness.
Further, as a part of the resin sheet 20 heated by the heat of the laser irradiated to the glass substrate M is thermally expanded, the portion of the glass substrate M in contact with the resin sheet 20 also rises upward, and the surface of the glass substrate M is raised. The tensile stress of the material itself generated on the side promotes the tensile stress P2 of the thermal stress, and the crack S can be formed reliably.

  In particular, in the present invention, the glass substrate M is merely held by suction in the air suction holes 20a of the resin sheet 20, and the glass substrate M is easily separated from the resin sheet 20 by releasing the suction force after laser scribing. Thus, it is possible to eliminate a troublesome peeling process as in the case where the glass substrate M is attached to the resin sheet 20 with an adhesive, and damage to the glass substrate M at the time of peeling.

FIG. 7 shows an experiment in which the glass substrate M is directly adsorbed on the adsorption table 1 having a porous plate 3 having a pore diameter of 5 μm (FIG. 7a), and in the case where laser scribing is performed by the method of the present invention (FIG. 7b). It is a table | surface which shows a result. The inventors conducted experiments by setting the thickness of the glass substrate M to 0.145 mm, 0.1 mm, and 0.07 mm, and changing the laser output and the scanning speed, respectively. The glass substrate M was made of alkali-free glass, and the laser was a CO ₂ laser. In the figure, hatched portions indicate regions where cracks are normally formed.
As a result of the experiment, in the case of FIG. 7a, there are few normal regions indicated by hatching, and particularly, cracks were not normally formed at a thickness of 0.07 mm, whereas in the case of FIG. In all experiments, including those of 07 mm, cracks could be formed normally in a wide range.

  In this embodiment, the crack S formed by laser scribing is not completely divided, but the target value is 70 to 90% of the entire thickness of the glass substrate M. However, the crack S penetrates the entire thickness. Of course, it is possible to divide completely.

  While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and can be appropriately modified and changed within the scope of achieving the object and not departing from the scope of the claims. Is possible.

  The present invention is mainly used for laser scribing for forming a splitting crack in a thin glass substrate having a thickness of 0.03 to 0.2 mm.

A scribe device B laser L1 scribe line L2 street M glass substrate P1 compression stress P2 tensile stress R street area S crack T trigger 1 adsorption table 13 laser irradiation part 14 refrigerant injection nozzle 20 resin sheet 20a air suction hole

Claims (4)

The surface of the glass substrate adsorbed on the adsorption table is heated along the planned scribe line using a laser, and the heating region is rapidly cooled with a refrigerant, whereby the planned scribe line is generated by the thermal stress generated in the glass substrate. A scribe method in which a trigger formed at the top of the glass substrate is advanced to generate a crack for cutting along the scribe line on the surface of the glass substrate,
The resin sheet provided with a number of air suction holes in the state where the street area for scanning the laser is left is held by suction on the suction table, and the scribe line of the glass substrate is positioned on the street area of the resin sheet. In this state, the glass substrate is adsorbed and held on the resin sheet, and in this state, the surface of the glass substrate is irradiated with the laser and scribed along the planned scribe line. A scribing method comprising forming a crack along the scribe line.   2. The resin sheet according to claim 1, wherein the resin sheet has a thickness of 50 to 200 μm, and the material is selected from polyvinyl chloride, polyethylene, polyethylene terephthalate, polyvinylidene chloride, polyvinylidene fluoride, silicon rubber, and polyurethane resin. Scribe method.   The scribing method according to claim 1 or 2, wherein the glass substrate has a thickness of 0.03 to 0.2 mm. The surface of the glass substrate adsorbed on the adsorption table is heated along the planned scribe line using a laser, and the heating region is rapidly cooled with a refrigerant, whereby the planned scribe line is generated by the thermal stress generated in the glass substrate. A scribing device that develops a trigger formed at the top of the glass substrate and generates a crack for cutting along the planned scribe line on the surface of the glass substrate,
A resin sheet provided with a number of air suction holes in a state of leaving a street area for scanning the laser is held by suction on the suction table,
The glass substrate is adsorbed and held on the resin sheet so that the scribe line of the glass substrate is located on the street area of the resin sheet,
A scribing apparatus configured to scan the laser on the planned scribe line of the glass substrate.

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