CN105643819B - Sapphire wafer sliver apparatus and method based on laser scribing processing technology - Google Patents
Sapphire wafer sliver apparatus and method based on laser scribing processing technology Download PDFInfo
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- CN105643819B CN105643819B CN201610155578.3A CN201610155578A CN105643819B CN 105643819 B CN105643819 B CN 105643819B CN 201610155578 A CN201610155578 A CN 201610155578A CN 105643819 B CN105643819 B CN 105643819B
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- sapphire wafer
- closed
- laser scribing
- processing technology
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of sapphire wafer sliver apparatus and method based on laser scribing processing technology, for carrying out sliver operation to the sapphire wafer that closed figure is machined with by laser scribing, including a base, multiple columns are which is provided with, column is corresponding with the closed figure position in sapphire wafer；One pressure head, is oppositely arranged with base, and its correspondence column is provided with multiple holes；Base can linearly produce relative motion with pressure head, and the sapphire wafer that closed figure is machined with to the process laser scribing being placed therein produces shear action so that the closed figure in sapphire wafer comes off from base material.The sliver apparatus and method of the present invention can replace the manual sliver operation of traditional closed figure, sliver efficiency high.
Description
Technical field
The present invention relates to a kind of sapphire wafer sliver apparatus and method based on laser scribing processing technology, especially one
Plant sapphire wafer sliver apparatus and method that line is machined with closed figure.
Background technology
Manually sapphire is being risen in current 3C industries and is replacing traditional glass manufacture electronic product such as mobile phone
The trend of button and cover plate.The method that the production of sapphire button and panel mainly uses optical-fiber laser cutting at present, should
Method is larger so the product processed has certain defect due to heat affecting, thus introduces the method for line and come to blue precious
Stone wafer carries out cutting processing, but because this method only causes crackle in the material in cutting rather than directly makes material point
From, therefore also need to carry out sliver operation to the sapphire wafer after line.Wherein, existing sliver operation generally uses breaking machine
Complete, and breaking machine in the market can only be by the method for splitting come to non-closed figure（Major part is straight line）Added
Work, for the also no more suitable method of sliver of closed figure, generally using manual sliver, but due to manual sliver efficiency
Low, this method does not obtain engineering application.
Therefore, it is necessary to design a kind of new sliver apparatus and method to solve the above problems.
The content of the invention
The technical problems to be solved by the invention are to provide the sliver apparatus and method of a kind of closed figure, solve to split by hand
The problem of piece efficiency is low.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：
A kind of sapphire wafer sliver apparatus based on laser scribing processing technology, for being machined with by laser scribing
The sapphire wafer of closed figure carries out sliver operation, it is characterised in that including：One base, which is provided with multiple columns, institute
State column corresponding with the closed figure position in the sapphire wafer；One pressure head, is oppositely arranged with the base, its correspondence
The column is provided with multiple holes；The base can linearly produce relative motion with the pressure head, and to being positioned over it
In process laser scribing be machined with closed figure sapphire wafer produce shear action so that in the sapphire wafer
Closed figure comes off from base material.
Further, the column is hollow, so as to sapphire wafer described in vacuum suction.
Further, the pressure head is run through in the hole.
Further, the shape of the column and the closed figure in the sapphire wafer matches.
Further, the closed figure in the sapphire wafer can be circular or square or other special-shaped Closed Graphs
Shape.
Further, including a drive device, relative motion is produced for driving the base with the pressure head.
Further, the drive device can be cylinder or motorized precision translation stage or rely solely on weight-driven.
Further, including a guider, for guiding the relatively described base motions of the pressure head.
Further, the guider can be guide rod or guide rail.
A kind of sapphire wafer splinter method based on laser scribing processing technology, it is characterised in that using as above any
The sapphire wafer that sliver apparatus described in is machined with closed figure to laser scribing carries out sliver operation, including following step
Suddenly：It is positioned over the sapphire wafer of closed figure is machined with by laser scribing on the base, and causes the sapphire
Closed figure on wafer is corresponding with the position of the column；Control the pressure head to move straight down, the column with
The hole cooperates and shear action is produced to the closed figure in the sapphire wafer so that in the sapphire wafer
Closed figure come off from base material.
The beneficial effects of the invention are as follows：The sliver apparatus and method of the present invention passes through on the column and pressure head on base
Coordinating for hole to carry out sliver operation to the closed figure in sapphire wafer, traditional manual sliver can be replaced to operate, sliver
Efficiency high.
Brief description of the drawings
The present invention is further illustrated with specific embodiment below in conjunction with the accompanying drawings.
Fig. 1 is placed with the schematic diagram of the sliver apparatus of sapphire wafer for the present invention；
Fig. 2 is placed with the other direction schematic diagram of the sliver apparatus of sapphire wafer for the present invention；
Fig. 3 is the schematic diagram of sliver apparatus base of the present invention and pressure head.
1- bases, 11- columns, 2- pressure heads, 21- holes, 3- drive devices, 4- guiders, 5- sapphire wafers in figure.
Embodiment
The principle and feature of the present invention are described below in conjunction with accompanying drawing, example is served only for explaining invention, not
Scope for limiting invention.
Such as Fig. 1 and Fig. 2, the sapphire wafer sliver apparatus of the invention based on laser scribing processing technology include base 1,
Pressure head 2, drive device 3 and guider 4, for entering to the sapphire wafer 5 that closed figure is machined with by laser scribing
Row sliver is operated.The closed figure that the line processing of sapphire wafer 5 of sliver is treated in the present embodiment is circle.
Such as Fig. 1 and Fig. 3, the base 1 is securable to frame or other positions, and it is provided with multiple columns upwardly extended
11, the column 11 is hollow cylinder, can vacuum suction treat the sapphire wafer 5 of sliver, in other embodiments, institute
It can also be square or other special-shaped closed figures cylinders to state column 11, according to the envelope in the sapphire wafer for treating sliver
Depending on the shape for closing figure.
Such as Fig. 2 and Fig. 3, the pressure head 2 be located at the top of base 1 and can relatively described base 1 move straight down,
In other embodiment, the pressure head 2 can also produce relative motion, the pressure head 2 with the base 1 in level or other directions
Provided with multiple holes 21 through the pressure head 2, the hole 21 is corresponding with the position of the column 11 and form fit, with to putting
The sapphire wafer 5 that the line being placed in one is machined with closed figure carries out shear action.
Such as Fig. 1 and Fig. 2, the drive device 3 is a cylinder, described so as to drive to produce pressure to the pressure head 2
Pressure head 2 is moved downward, in other embodiments, and the drive device 3 can be motorized precision translation stage or rely solely on the pressure head 2
Itself gravity drives.
Such as Fig. 1 and Fig. 2, the guider 4 is guide rod, and it is integrated with cylinder, with preferable directionality
It is again compact.The guider 4 is moved straight down for guiding the pressure head 2, prevents the pressure head 2 and the base
1 relative position produces skew, in other embodiments, the guider 4 can also be guide rod or other have to be oriented to and make
Device.
The sapphire wafer sliver apparatus based on laser scribing processing technology of the present invention when in use, will pass through laser scribing
Line is machined with the sapphire wafer 5 of circular pattern and is positioned on the base 1, and causes the circle in the sapphire wafer 5
Pattern is corresponding with the position of the column 11, and the column 11 is evacuated so that the sapphire wafer 5 is adsorbed in
The base 1；The drive device 3 is controlled to drive the pressure head 2 downwards so that the leading in the guider 4 of pressure head 2
Moved straight down under the effect of drawing, the column 11 and the hole 21 cooperate and to the circle in the sapphire wafer 5
The circular pattern that shape pattern is produced in shear action, the sapphire wafer 5 is supported in the column 11, and other positions exist
Dropped downwards under the pressure effect of the pressure head 2, so that the circular pattern in the sapphire wafer 5 takes off from base material
Fall.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (9)
1. a kind of sapphire wafer sliver apparatus based on laser scribing processing technology, for being machined with envelope by laser scribing
The sapphire wafer for closing figure carries out sliver operation, it is characterised in that including：One base, which is provided with multiple columns, described
Column is corresponding with the closed figure position in the sapphire wafer, and the column is hollow, so as to vacuum suction institute
State sapphire wafer；One pressure head, is oppositely arranged with the base, and its described column of correspondence is provided with multiple holes；The base with
The pressure head can linearly produce relative motion, and be machined with closed figure to the process laser scribing being placed therein
Sapphire wafer produces shear action so that the closed figure in the sapphire wafer comes off from base material.
2. the sapphire wafer sliver apparatus according to claim 1 based on laser scribing processing technology, it is characterised in that：
The pressure head is run through in the hole.
3. the sapphire wafer sliver apparatus according to claim 1 based on laser scribing processing technology, it is characterised in that：
The shape of the column and the closed figure in the sapphire wafer matches.
4. the sapphire wafer sliver apparatus according to claim 1 based on laser scribing processing technology, it is characterised in that：
Closed figure in the sapphire wafer can be circular or square or other special-shaped closed figures.
5. the sapphire wafer sliver apparatus according to claim 1 based on laser scribing processing technology, it is characterised in that：
Further comprise a drive device, for driving the base and pressure head generation relative motion.
6. the sapphire wafer sliver apparatus according to claim 5 based on laser scribing processing technology, it is characterised in that：
The drive device can be cylinder or motorized precision translation stage or rely solely on weight-driven.
7. the sapphire wafer sliver apparatus according to claim 1 based on laser scribing processing technology, it is characterised in that：
Further comprise a guider, for guiding the relatively described base motions of the pressure head.
8. the sapphire wafer sliver apparatus according to claim 7 based on laser scribing processing technology, it is characterised in that：
The guider can be guide rod or guide rail.
9. a kind of sapphire wafer splinter method based on laser scribing processing technology, it is characterised in that using as any in weighed 1-8
The sapphire wafer that sliver apparatus described in is machined with closed figure to laser scribing carries out sliver operation, including following step
Suddenly：It is positioned over the sapphire wafer of closed figure is machined with by laser scribing on the base, and causes the sapphire
Closed figure on wafer is corresponding with the position of the column；Control the pressure head to move straight down, the column with
The hole cooperates and shear action is produced to the closed figure in the sapphire wafer so that in the sapphire wafer
Closed figure come off from base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610155578.3A CN105643819B (en) | 2016-03-18 | 2016-03-18 | Sapphire wafer sliver apparatus and method based on laser scribing processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610155578.3A CN105643819B (en) | 2016-03-18 | 2016-03-18 | Sapphire wafer sliver apparatus and method based on laser scribing processing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105643819A CN105643819A (en) | 2016-06-08 |
| CN105643819B true CN105643819B (en) | 2017-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610155578.3A Active CN105643819B (en) | 2016-03-18 | 2016-03-18 | Sapphire wafer sliver apparatus and method based on laser scribing processing technology |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112846530A (en) * | 2020-12-29 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Curved thick glass cutting and splitting method and system |
| CN112701066B (en) * | 2021-01-07 | 2021-07-20 | 深圳市粤海翔精密科技有限公司 | Splitting knife equipment for wafer splitting and use method thereof |
| CN117055147B (en) * | 2023-10-11 | 2023-12-19 | 上海鲲游科技有限公司 | Splitting method of diffraction optical waveguide |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437468A (en) * | 1977-08-29 | 1979-03-19 | Toshiba Corp | Breaking device for semiconductor wafer |
| US6277711B1 (en) * | 2001-01-08 | 2001-08-21 | Jiahn-Chang Wu | Semiconductor matrix formation |
| CN101128294A (en) * | 2005-02-23 | 2008-02-20 | 东丽工程株式会社 | Method and device for cutting fragile material plate |
| CN201881206U (en) * | 2010-11-30 | 2011-06-29 | 金华金锐科技发展有限公司 | Numerical control marking, punching and drilling integrated machine |
| CN102380713A (en) * | 2010-08-27 | 2012-03-21 | 三星钻石工业股份有限公司 | Laser cutting apparatus |
| CN103586985A (en) * | 2012-08-17 | 2014-02-19 | 佳友科技有限公司 | Method and system for processing fragile material |
| CN104576460A (en) * | 2014-12-31 | 2015-04-29 | 苏州凯锝微电子有限公司 | Wafer cutting and separating device |
| CN105161461A (en) * | 2015-09-14 | 2015-12-16 | 圆融光电科技股份有限公司 | Ram-type splitting system |
-
2016
- 2016-03-18 CN CN201610155578.3A patent/CN105643819B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437468A (en) * | 1977-08-29 | 1979-03-19 | Toshiba Corp | Breaking device for semiconductor wafer |
| US6277711B1 (en) * | 2001-01-08 | 2001-08-21 | Jiahn-Chang Wu | Semiconductor matrix formation |
| CN101128294A (en) * | 2005-02-23 | 2008-02-20 | 东丽工程株式会社 | Method and device for cutting fragile material plate |
| CN102380713A (en) * | 2010-08-27 | 2012-03-21 | 三星钻石工业股份有限公司 | Laser cutting apparatus |
| CN201881206U (en) * | 2010-11-30 | 2011-06-29 | 金华金锐科技发展有限公司 | Numerical control marking, punching and drilling integrated machine |
| CN103586985A (en) * | 2012-08-17 | 2014-02-19 | 佳友科技有限公司 | Method and system for processing fragile material |
| CN104576460A (en) * | 2014-12-31 | 2015-04-29 | 苏州凯锝微电子有限公司 | Wafer cutting and separating device |
| CN105161461A (en) * | 2015-09-14 | 2015-12-16 | 圆融光电科技股份有限公司 | Ram-type splitting system |
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| Publication number | Publication date |
|---|---|
| CN105643819A (en) | 2016-06-08 |
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