TWI763943B - Laser processing equipment - Google Patents

Abstract

The subject of this invention is to ensure the flatness of a mounting table easily, and to suppress generation|occurrence|production of the processing mark of a mounting table by a laser beam. The laser processing apparatus of the present invention is characterized in that: it processes the thin film pattern on the transparent substrate by irradiating a laser beam, and includes: a laser beam irradiating part; The transparent substrate is placed; the top plate is composed of a member that transmits the laser beam irradiated from the laser beam irradiation part, and has a transparent substrate suction path for vacuum suction of the transparent substrate; the bottom plate has a top plate support part for supporting the top plate, and an opening part dug from the surface and a ceiling suction path connected to the opening part.

Description

Laser processing equipment

The present invention relates to a laser processing device for patterning a thin film on a transparent substrate.

In the case of laser processing a thin film pattern on a transparent substrate such as a glass substrate, the laser beam passing through the transparent substrate is absorbed by the surface of the mounting table on which the transparent substrate is placed, and processing marks are produced on the surface of the mounting table. Happening. When a processing mark is produced on the mounting table, it will cause a flaw or dirt to adhere to the back surface of the transparent substrate, and the quality will be affected. In order to suppress the occurrence of processing marks on the mounting table, when the processing part of the transparent substrate is fixed, drill tap processing is performed at the position corresponding to the processing part of the mounting table to reduce the influence of the laser beam, or the mounting table is provided with It is detachable and the mounting table with processing marks is periodically replaced, or 1000 to 2000 support pins are used to support the transparent substrate, thereby reducing the influence of the laser beam.

Patent Document 1 describes a configuration in which the transparent substrate is supported by a plurality of needle-shaped support pins made of molybdenum or the like, and the influence of the laser beam is suppressed. [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 63-52790

[Problems to be Solved by Invention]

However, the structure described in Patent Document 1 has the following problems: the height adjustment of each of the plurality of support pins is troublesome, and if the space between the support pins is made large, the substrate is bent and the laser beam is irradiated. The quality of processing is affected.

The subject of the present invention is to solve the above-mentioned problems, to easily ensure the flatness of the mounting table, and to suppress the generation of machining marks on the mounting table due to the laser beam, thereby improving the quality of the substrate. [Technical means to solve problems]

In order to solve the above-mentioned problems, the present invention provides a laser processing apparatus, which is characterized in that: it processes a thin film pattern on a transparent substrate by irradiating a laser beam; and includes: a laser beam irradiating part; including a top plate and a bottom plate, on which the transparent substrate is placed; the top plate is composed of a member that transmits a laser beam irradiated from the laser beam irradiating part, and has a transparent substrate suction path for vacuum sucking the transparent substrate, and the bottom plate has a support for the A top plate support part of the top plate, an opening part dug from the surface, and a top plate suction path connected to the opening part.

With this configuration, the flatness of the mounting table can be easily ensured, and the production of processing traces on the mounting table due to the laser beam can be suppressed, thereby improving the quality of the substrate.

The top plate may have a transparent substrate support portion for supporting the transparent substrate, and a slot portion dug from the surface and connected to the transparent substrate suction path.

With this configuration, the transparent substrate can be surely adsorbed and held by the slot portion.

The bottom surface of the said slot-hole part can also be set as a structure which is rougher than the surface which contacts the said transparent board|substrate in the said transparent board|substrate support part.

With this configuration, the laser beam transmitted through the transparent substrate is attenuated due to diffusion of the laser beam through the rough surface of the bottom surface of the slot portion, thereby further suppressing the generation of processing marks on the mounting table.

The bottom surface of the slotted portion may be in a positional relationship that overlaps with at least a part of the surface of the top plate support portion when viewed from the laser beam irradiation direction.

With this configuration, the effect of diffusing the laser beam on the bottom surface of the slotted hole portion is imparted to the surface of the top plate support portion, so that the generation of processing marks on the mounting table can be further suppressed.

The above-mentioned bottom plate may be configured to hold a plurality of the above-mentioned top plates.

With this configuration, a large transparent substrate can also be patterned. [Effect of invention]

With the laser processing apparatus of the present invention, the flatness of the mounting table can be easily ensured, and the generation of processing marks on the mounting table by the laser beam can be suppressed.

[Example 1]

Embodiment 1 of the present invention will be described with reference to FIG. 1 . FIG. 1 is a diagram illustrating a laser processing apparatus according to Embodiment 1 of the present invention.

Example 1 is as shown in FIG. 1 , for the thin film on the transparent substrate B extended in the X-Y plane, the laser beam L is irradiated vertically from the Z direction from the laser beam irradiation section 1 to pattern the thin film on the transparent substrate B. processing. In Example 1, the transparent substrate B with a size of about 200 mm×300 mm and a thickness of about 0.3 mm to 0.7 mm was used as the object. The laser beam irradiation section 1 is configured to irradiate a laser beam L with a wavelength of 532 nm, and can be moved to any position in the X and Y directions by a drive mechanism (not shown) to cover the entire surface of the transparent substrate B. processing.

The transparent substrate B is placed on the mounting table 3, and is fixed and held by vacuum suction. The stage 3 includes a top plate 4 supporting the transparent substrate B and a bottom plate 5 supporting the top plate 4 .

The top plate 4 is made of glass as a member that transmits the laser beam L irradiated from the laser beam irradiation unit 1 , and the transparent substrate B can be vacuum adsorbed through the transparent substrate suction path 43 . The transparent substrate suction path 43 is provided through the top plate 4 and the bottom plate 5, and one end portion serves as a suction port for the transparent substrate B, and the other end portion is connected to a first vacuum suction machine (not shown). The first vacuum suction machine can be controlled on/off, and the suction is turned on when the transparent substrate B is fixed and held, and the suction is turned off when the transparent substrate B is removed, so that the transparent substrate B can be easily attached, removed, and held. In addition, the surface 45 of the top plate 4 is a surface which is in contact with the transparent substrate B, and is processed flat so as not to leak vacuum suction from the contact surface when the transparent substrate B is supported.

The bottom plate 5 is made of aluminum, has a thickness of about 15 mm, and has a top plate support portion 51 that supports the top plate 4 , and an opening portion 52 dug down about 5 mm from the surface 55 of the top plate support portion 51 . The size of the opening portion 52 can be appropriately selected according to the thickness or size of the top plate 4 . Moreover, in the vicinity of the center of the bottom surface of the opening part 52, one end part of the top plate suction path 53 is provided. The top plate suction path 53 is provided through the bottom plate 5, and the other end is connected to a second vacuum suction machine (not shown). The second vacuum suction machine can be controlled to open/close. When the top plate 4 is fixed and held, the suction is turned on, and when the top plate 4 is removed, the suction is closed, so that the top plate 4 can be easily attached, detached, and fixed.

In this way, the transparent substrate suction path 43 in the first vacuum suction machine and the top plate suction path 53 in the second vacuum suction machine are configured as different systems. By setting each suction path as a different system, only the transparent substrate B can be easily attached and detached without attaching and detaching the top plate 4 , and the top plate 4 can also be easily replaced even if the top plate 4 has processing marks due to the laser beam L.

Here, the laser beam L irradiated from the laser beam irradiating section 1 is absorbed by the thin film on the surface of the transparent substrate B and used for patterning, but a part thereof passes through the transparent substrate B. As shown in FIG. The passed laser beam L reaches the top plate 4, but since the top plate 4 is made of glass, it does not absorb the laser beam L but transmits it, so that no processing marks are left. Therefore, the quality of the transparent substrate B can be improved without causing scratches or dirt on the back surface of the transparent substrate B. As shown in FIG.

In addition, in Example 1, although the transparent board|substrate B which consists of glass was the object of laser processing, it is not necessarily limited to this, It can change suitably. For example, the transparent substrate B composed of a transparent film-like resin or the like may be the object of laser processing.

In addition, in Example 1, although the top plate 4 was made of glass, it is not necessarily limited to this, and it can change suitably. For example, it may consist of frosted glass or quartz.

Furthermore, in Example 1, although the baseplate 5 was made of aluminum, it is not necessarily limited to this, and it can change suitably. For example, it may consist of arbitrary metals other than aluminum.

In addition, in Example 1, although it comprised so that the laser beam L may be irradiated perpendicularly to the transparent substrate B from the Z direction, it is not necessarily limited to this, It can change suitably. For example, the laser beam L may be irradiated in an oblique direction with respect to the transparent substrate B, or the mounting table 3 may be arranged in the Z direction, the transparent substrate B may be held in the vertical direction, and the laser irradiation unit 1 may be The laser beam L is irradiated in the horizontal direction by being arranged in the Y direction.

In addition, in Example 1, although the wavelength of the laser beam L was made into 532 nm, it is not necessarily limited to this, It can change suitably. For example, the laser beam irradiation unit 1 may be configured to irradiate the laser beam L with a wavelength of 355 nm, or the laser beam irradiation unit 1 may be configured to emit the laser beam L of other wavelengths.

In this way, the laser processing apparatus in Embodiment 1 is characterized in that it processes the thin film pattern on the transparent substrate by irradiating a laser beam; and includes: a laser beam irradiating part; and a stage including a top plate and a a bottom plate on which the transparent substrate is placed; the top plate is composed of a member that transmits a laser beam irradiated from the laser beam irradiation part, and has a transparent substrate suction path for vacuum suction of the transparent substrate; the bottom plate has a top plate that supports the top plate The support part, the opening part dug from the surface, and the suction path of the top plate connected to the opening part; by the laser processing device, the flatness of the mounting table can be easily ensured, and the laser beam can be transmitted through the top plate. It does not absorb the laser beam, so it can suppress the generation of processing marks of the mounting table caused by the laser beam, thereby improving the quality of the substrate. [Example 2]

Embodiment 2 of the present invention is different from Embodiment 1 in particular in that the top plate has a transparent substrate support portion for supporting the transparent substrate, and a slot portion dug from the surface and connected to the transparent substrate suction path.

Embodiment 2 will be described with reference to FIG. 2 . FIG. 2 is a diagram illustrating a laser processing apparatus according to Embodiment 2 of the present invention.

The mounting table 103 of the second embodiment includes a top table 104 for sucking and holding the transparent substrate B, and a bottom table 5 for sucking and holding the top table 104 . The structure of the bottom table 5 is the same as that of the first embodiment.

The top plate 104 has a transparent substrate support portion 141 for supporting the transparent substrate B, and a slot portion 142 formed by digging down about 0.5 mm from the surface 45 near the center of the top plate 104 . The shape of the slotted hole portion 142 viewed from the Z direction is a substantially circular shape. In addition, the size of the slotted hole portion 142 can be appropriately selected according to the thickness and size of the transparent substrate B to be targeted.

Furthermore, in Example 2, the shape of the slotted hole portion 142 viewed from the Z-direction was made into a substantially circular shape, but it is not necessarily limited to this, and can be appropriately changed. For example, a quadrangle may be sufficient, a hexagon may be sufficient, and an arbitrary shape may be used. In addition, the position of the slot portion 142 may not be near the center of the top plate 104, and may be provided at any position. Furthermore, the slot portion 142 is not limited to one location, and may be provided at a plurality of locations.

One end of the transparent substrate suction path 43 is provided in the vicinity of the center of the bottom surface of the slot portion 42 . Furthermore, the transparent substrate B can be surely held on the top plate 104 by vacuum suction through the transparent substrate suction path 43 and the slot portion 142 .

In addition, the bottom surface 144 of the slot portion 142 in the top plate 104 is made rougher than the surface 45 of the transparent substrate support portion 41 (the surface to which the back surface of the transparent substrate B is connected). The surface 45 of the transparent substrate support portion 141 is processed flat to prevent vacuum leakage. The bottom surface 144 of the slotted hole portion 142 may not be subjected to flat processing such as the surface 45 of the transparent substrate support portion 141 to maintain a rough surface state, or the rough surface processing may be performed by methods such as sandblasting. As long as at least the bottom surface 144 of the slot portion 142 in the top plate 104 is rougher than the surface 45 of the transparent substrate support portion 141 .

By forming the top plate 104 with a member through which the laser beam L is transmitted, it is possible to prevent the occurrence of processing marks on the top plate 104 . However, the laser beam L passing through the top plate 104 may leave processing marks on the bottom plate 5 . In this regard, by making the bottom surface 144 of the slot portion 142 in the top plate 104 rougher than the surface 45 of the transparent substrate support portion 141 as described above, the occurrence of processing marks on the bottom plate 5 can be suppressed. That is, the laser beam L that enters the slot portion 142 after passing through the transparent substrate B and then reaches the bottom surface 144 is attenuated by the rough surface diffusion, thereby suppressing the generation of processing marks on the bottom plate 5 .

The bottom surface 54 of the opening portion 52 of the base plate 5 is a site where there is no problem even if machining marks are formed by the laser beam L. As shown in FIG. However, the bottom surface 54 of the opening portion 52 of the bottom plate 5 may be formed to be rougher than the surface 55 of the bottom plate support portion 51 . As a result, the laser beam L incident on the opening 52 after passing through the top plate 4 and then reaching the bottom surface 54 is attenuated by the rough surface diffusion, thereby further suppressing the generation of processing marks on the bottom plate 5 .

Even if machining marks are produced by the laser beam L on the base plate 5 , there will not be an immediate problem. However, in some cases, if scratches are formed in the bottom plate 5, especially on the surface 55 of the top plate support portion 51, vacuum leakage will gradually occur, or the adsorption may become unstable, making it difficult to fix and hold the transparent substrate B or the top plate 104. In this regard, as shown in FIG. 2 , when viewed from the irradiation direction of the laser beam (ie, the Z direction), the slotted hole portion 142 is in a positional relationship that overlaps with the surface 55 of the top plate supporting portion 51 (the surface that is in contact with the back surface of the top plate 4 ). . In addition, although not shown, in the X direction, the slotted hole portion 142 is also set in a positional relationship to overlap with the surface 55 of the top plate support portion 51 .

Thereby, the laser beam L passing through the transparent substrate B is diffused and attenuated on the bottom surface 144 of the slot portion 142 in the top plate 104 . At this time, since the slot portion 142 is in a positional relationship with the surface 55 of the top plate supporting portion 51 when viewed from the irradiation direction of the laser beam, the surface 55 of the top plate supporting portion 51 will not be directly affected by the laser beam L, thereby It can suppress the generation of processing marks.

As described above, if machining marks are formed on the surface 55 of the top plate support portion 51, it may cause vacuum leakage or unstable adsorption, which makes it difficult to fix and hold the top plate 104. However, by directing the laser beam to the slot hole The bottom surface 144 of the portion 142 is diffused to prevent machining marks (ie, vacuum leakage or unstable adsorption) from being produced on the surface 55 of the top plate support portion 51 .

Furthermore, in Embodiment 2, the slotted hole portion 142 is in a positional relationship that overlaps with the surface 55 in the X and Y directions of the top plate support portion 51 when viewed from the irradiation direction of the laser beam, but it is not necessarily limited to this, and may be appropriately change. For example, it may be in a positional relationship in which only a particularly important part of the slotted hole portion 142 overlaps with the surface 55 of the top plate support portion 51 when viewed from the irradiation direction of the laser beam. That is, the overlapping positional relationship can be arbitrarily set according to the shape of the bottom plate 5 or the degree of damage caused by the laser beam L, etc., as long as the slot portion 142 and the top plate support portion 51 are at least as viewed from the irradiation direction of the laser beam. A positional relationship in which at least a part of the surface 55 overlaps may be sufficient.

As described above, in Example 2, the transparent substrate can be reliably adsorbed and held by providing the top plate with the transparent substrate support portion for supporting the transparent substrate, and the slot portion dug from the surface and connected to the transparent substrate suction path.

In addition, by making the bottom surface of the slotted hole portion rougher than the surface of the transparent substrate support portion that is in contact with the transparent substrate, the laser beam passing through the transparent substrate passes through the bottom surface of the slotted hole portion. The rough surface is diffused and attenuated by the laser beam, thereby further suppressing the generation of processing marks on the mounting table.

Furthermore, by placing the bottom surface of the slotted hole portion in a positional relationship that overlaps with at least a part of the surface of the top plate support portion when viewed from the laser beam irradiation direction, the effect of diffusing the laser beam in the bottom surface of the slotted hole portion Since it is given to the surface of the top plate support portion, it is possible to further suppress the occurrence of processing marks on the mounting table. [Example 3]

Embodiment 3 of the present invention is different from Embodiment 1 or 2 in that the bottom plate is configured to hold a plurality of top plates. Embodiment 2 of the present invention will be described with reference to FIG. 3 . FIG. 3 is a diagram illustrating a laser processing apparatus according to Embodiment 2 of the present invention.

As a specific example, Example 3 is aimed at pattern processing on a large transparent substrate B of about 3 m square. Therefore, as shown in FIG. 3, it is comprised so that the several top board 104 may be hold|maintained by the large bottom board 205. As shown in FIG.

The large base plate 205 includes a plurality of top plate support portions 251 in the Y direction and a plurality of opening portions 252 so as to be able to hold the plurality of top plates 104 . In addition, the bottom plate 205 is configured to hold a plurality of top plates 104 (that is, arranged in a tile shape) also in the X direction (not shown).

Here, when processing a pattern on a large transparent substrate B, it is also considered to use a top plate of approximately the same size as the transparent substrate B, but in this case, the top plate is a large size of 3 m square, so it is not easy to install and remove . Therefore, in Example 3, it is set as the structure which hold|maintained several small top plates 104 on the large bottom plate 5. As shown in FIG. Therefore, if a specific top plate 104 has processing marks due to the laser beam L, only a specific top plate 104 (ie, a part of the tile-like configuration) can be easily replaced.

The plurality of transparent substrate suction paths 43 are all connected to the same first vacuum suction machine, and the plurality of top plate suction paths 253 are respectively connected to different second vacuum suction machines. Thereby, by controlling the first vacuum suction machine, the large transparent substrate B can be easily attached, detached, and fixed and held. Moreover, by separately controlling each second vacuum suction machine, only a specific top plate 104 can be easily attached and detached.

In addition, in Example 3, although the some top plate suction path 253 is comprised so that it may be connected to each different 2nd vacuum suction machine, it is not necessarily limited to this, It can change suitably. For example, the plurality of top plate suction passages 253 may be all connected to the same second vacuum suction machine. Thereby, the laser processing apparatus can be configured in a small size.

Furthermore, in the third embodiment, the bottom surface 144 of each slotted hole portion 142 is made rougher than the surface 45 of the transparent substrate support portion 141, so that the transparent substrate B enters the slotted hole portion 142 and then reaches the The laser beam L of the bottom surface 144 is diffused by the rough surface, thereby suppressing the generation of processing marks on the bottom plate 205 .

Furthermore, when viewed from the irradiation direction of the laser beam (ie, the Z direction), the slotted hole portion 142 is in a positional relationship with the top plate support portion 251 in the Y direction. Due to the diffusion effect of the laser beam L, the surface 255 of the top plate support portion 251 is not directly affected by the laser beam L, thereby suppressing the generation of processing marks.

In addition, in Example 3, although it comprised so that the transparent board|substrate B was hold|maintained by the some top plate 104, it is not necessarily limited to this, It can change suitably. For example, the transparent substrate B may be held by using a plurality of the above-mentioned top plates 4 .

In this way, in Example 3, the above-mentioned bottom plate is constituted so as to hold a plurality of the above-mentioned top plates, so that patterning can also be performed on a large-sized transparent substrate. [Industrial Availability]

The laser processing apparatus of the present invention can be widely used in the field of processing thin film patterns on transparent substrates.

1‧‧‧Laser beam irradiation part 3‧‧‧Mounting table 4‧‧‧Top plate 5‧‧‧Bottom plate 43‧‧‧Transparent substrate suction path 45‧‧‧Surface 51‧‧‧Top plate supporting part 52‧‧‧Opening Section 53‧‧‧Top Plate Suction Path 54‧‧‧Bottom 55‧‧‧Surface 103‧‧‧Place 104‧‧‧Top Plate 141‧‧‧Transparent Substrate Supporting Part 142‧‧‧Slotted Hole 144‧‧‧Bottom 205 ‧‧‧Bottom plate 251‧‧‧Top plate supporting part 252‧‧‧Opening part 253‧‧‧Top plate suction path 255‧‧‧Surface B‧‧‧Transparent substrate L‧‧‧Laser beam

FIG. 1 is a diagram illustrating a laser processing apparatus according to Embodiment 1 of the present invention. FIG. 2 is a diagram illustrating a laser processing apparatus according to Embodiment 2 of the present invention. FIG. 3 is a diagram illustrating a laser processing apparatus according to Embodiment 3 of the present invention.

1‧‧‧Laser beam irradiation part

3‧‧‧Place

4‧‧‧Top Plate

5‧‧‧Bottom

43‧‧‧Transparent substrate attraction path

45‧‧‧Surface

51‧‧‧Top plate support

52‧‧‧Opening

53‧‧‧Roof Attraction Road

54‧‧‧Bottom

55‧‧‧Surface

B‧‧‧Transparent substrate

L‧‧‧Laser Beam

Claims (5)

A laser processing device is characterized in that: it processes a thin film pattern on a transparent substrate by irradiating a laser beam; and comprising: a laser beam irradiating part; a transparent substrate; the top plate is composed of a member that transmits the laser beam irradiated from the laser beam irradiation part, and has a transparent substrate suction path for vacuum suction of the transparent substrate; the bottom plate has a top plate support part for supporting the top plate, and a self-contained transparent substrate; An opening part dug under the surface and a ceiling suction path connected to the opening part. The laser processing apparatus of claim 1, wherein the top plate has a transparent substrate support portion for supporting the transparent substrate, and a slot portion dug from the surface and connected to the transparent substrate suction path. The laser processing apparatus according to claim 2, wherein the bottom surface of the slot portion is rougher than the surface of the transparent substrate support portion that is in contact with the transparent substrate. The laser processing apparatus of claim 3, wherein the bottom surface of the slot portion is in a positional relationship overlapping with at least a part of the surface of the top plate support portion when viewed from the laser beam irradiation direction. The laser processing apparatus according to any one of claims 1 to 4, wherein the bottom plate holds a plurality of the top plates.

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