WO2019097864A1 - Laser machining apparatus - Google Patents

Laser machining apparatus Download PDF

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Publication number
WO2019097864A1
WO2019097864A1 PCT/JP2018/036723 JP2018036723W WO2019097864A1 WO 2019097864 A1 WO2019097864 A1 WO 2019097864A1 JP 2018036723 W JP2018036723 W JP 2018036723W WO 2019097864 A1 WO2019097864 A1 WO 2019097864A1
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WO
WIPO (PCT)
Prior art keywords
transparent substrate
top plate
laser beam
laser
beam irradiation
Prior art date
Application number
PCT/JP2018/036723
Other languages
French (fr)
Japanese (ja)
Inventor
浩光 和田
幸一 村尾
Original Assignee
東レエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Priority to KR1020207013363A priority Critical patent/KR20200081392A/en
Priority to CN201880057913.3A priority patent/CN111107958A/en
Publication of WO2019097864A1 publication Critical patent/WO2019097864A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00—Work clamping
    • B23Q2703/02—Work clamping means
    • B23Q2703/04—Work clamping means using fluid means or a vacuum

Definitions

  • the present invention relates to a laser processing apparatus for performing pattern processing on a thin film on a transparent substrate.
  • a laser beam passing through the transparent substrate is absorbed by the surface of the mounting table on which the transparent substrate is mounted, and is processed on the surface of the mounting table Scars may occur. Occurrence of processing marks on the mounting table causes adhesion of scratches and dust on the back surface of the transparent substrate, which affects the quality.
  • Patent Document 1 describes a configuration in which a transparent substrate is supported by needle-like support pins made of a large number of molybdenum or the like to suppress the influence of a laser beam.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 63-52790
  • Patent Document 1 it takes time to adjust the height of each of a large number of support pins, and if the distance between the support pins and the support pins is roughened, the substrate may be bent to affect the quality of laser processing. there were.
  • the present invention solves the above problems, and easily improves the quality of the substrate by suppressing the generation of processing marks on the mounting table by the laser beam while easily securing the flatness of the mounting table. I assume.
  • the present invention is a laser processing apparatus for patterning a thin film on a transparent substrate by laser beam irradiation, A laser beam irradiation unit, And a mounting table formed of a top plate and a base plate on which the transparent substrate is mounted,
  • the top plate is made of a member that transmits the laser beam emitted from the laser beam irradiation unit, and has a transparent substrate suction path that vacuum-sucks the transparent substrate.
  • the base plate is provided with a top plate support portion for supporting the top plate, and an opening portion dug down from the surface and a top plate suction path connected to the opening portion. .
  • the top plate may have a transparent substrate support portion for supporting the transparent substrate, and a grooved portion excavated from the surface and connected to the transparent substrate suction path.
  • the transparent substrate can be reliably held by suction by the groove portion.
  • the bottom surface of the groove portion may be rougher than the surface of the transparent substrate support portion in contact with the transparent substrate.
  • the laser beam transmitted through the transparent substrate is attenuated by the diffusion of the laser beam by the rough surface on the bottom of the groove portion, and the generation of processing marks on the mounting table can be further suppressed.
  • the bottom surface of the groove portion may be in a positional relationship in which at least a part of the surface of the top plate support portion overlaps as viewed from the laser beam irradiation direction.
  • the base plate may be configured to hold a plurality of the top plates.
  • This configuration also enables pattern processing on a large transparent substrate.
  • the flatness of the mounting table can be easily secured, and the generation of processing marks on the mounting table by the laser beam can be suppressed.
  • Example 1 of this invention It is a figure explaining the laser processing apparatus in Example 1 of this invention. It is a figure explaining the laser processing apparatus in Example 2 of this invention. It is a figure explaining the laser processing apparatus in Example 3 of this invention.
  • FIG. 1 is a view for explaining a laser processing apparatus according to a first embodiment of the present invention.
  • the laser beam L is emitted perpendicularly from the Z direction to the thin film on the transparent substrate B spreading in the XY plane from the Z direction to form a thin film on the transparent substrate B. It is a pattern processing to a thin film.
  • the first embodiment is directed to a transparent substrate B having a size of about 200 mm ⁇ 300 mm and a thickness of about 0.3 mm to 0.7 mm.
  • the laser beam irradiation unit 1 is configured to emit a laser beam L having a wavelength of 532 nm, and is moved to an arbitrary position in the X and Y directions by a drive mechanism (not shown) to process the entire surface of the transparent substrate B. Can.
  • the transparent substrate B is mounted on the mounting table 3 and fixed and held by vacuum suction.
  • the mounting table 3 includes a top plate 4 supporting the transparent substrate B and a base plate 5 supporting the top plate 4.
  • the top plate 4 is made of glass that is a member that transmits the laser beam L emitted from the laser beam irradiation unit 1, and can vacuum-suck the transparent substrate B via the transparent substrate suction path 43.
  • the transparent substrate suction passage 43 is provided to penetrate the top plate 4 and the base plate 5, one end thereof is a suction port of the transparent substrate B, and the other end is connected to a first vacuum suction device (not shown).
  • the first vacuum suction device can be controlled on-off, and the suction is turned on when the transparent substrate B is fixed and held, and the suction is turned off when the transparent substrate B is removed, and the transparent substrate B is attached and detached and fixed. It is easy to hold and hold.
  • the surface 45 of the top plate 4 is a surface in contact with the transparent substrate B, and is processed flat so that vacuum suction does not leak from the contact surface when the transparent substrate B is supported.
  • the base plate 5 is made of aluminum and has a thickness of about 15 mm, and has a top plate support portion 51 for supporting the top plate 4 and an opening portion 52 dug about 5 mm from the surface 55 of the top plate support portion 51. .
  • the size of the opening 52 can be appropriately selected according to the thickness and size of the top plate 4.
  • one end of the top plate suction passage 53 is provided near the center of the bottom surface of the opening 52.
  • the top plate suction passage 53 is provided through the base plate 5 and the other end is connected to a second vacuum suction device (not shown).
  • the second vacuum suction device can be controlled on-off, the suction is turned on when holding the top plate 4 fixedly, the suction is turned off when the top plate 4 is removed, and the top plate 4 is attached and removed and fixedly held. And make it easy.
  • the transparent substrate suction passage 43 in the first vacuum suction device and the top plate suction passage 53 in the second vacuum suction device are configured as separate systems.
  • the separate suction paths make it easy to attach and detach only the transparent substrate B without attaching and detaching the top plate 4, and even if the top plate 4 is processed by the laser beam L, the top plate may be damaged 4 can be easily replaced.
  • the laser beam L emitted from the laser beam irradiation unit 1 is absorbed by the thin film on the surface of the transparent substrate B and used for pattern processing, but a part of the laser beam L passes through the transparent substrate B.
  • the laser beam L that has passed through reaches the top plate 4, but since the top plate 4 is made of glass and does not absorb the laser beam L, it does not have a processing mark because it is transmitted. Therefore, the quality of the transparent substrate B can be improved without causing scratches or dust to adhere to the back surface of the transparent substrate B.
  • the transparent substrate B made of glass is subjected to the laser processing.
  • the present invention is not necessarily limited to this, and appropriate changes can be made.
  • a transparent substrate B made of a transparent film-like resin or the like may be a target of laser processing.
  • top plate 4 was comprised with glass, it is not necessarily limited to this and can be changed suitably.
  • it may be made of ground glass or quartz.
  • Example 1 although the base plate 5 was comprised with aluminum, it is not necessarily limited to this and can be changed suitably. For example, it may be made of any metal other than aluminum.
  • Example 1 although it comprised so that the laser beam L might be perpendicularly
  • the laser beam L may be configured to be irradiated obliquely to the transparent substrate B, or the mounting table 3 may be provided in the Z direction to hold the transparent substrate B in the vertical direction. May be arranged in the Y direction, and the laser beam L may be irradiated in the horizontal direction.
  • Example 1 although the wavelength of the laser beam L was 532 nm, it is not necessarily limited to this and can be changed suitably.
  • the laser beam irradiator 1 may be configured to emit a laser beam L having a wavelength of 355 nm, or the laser beam irradiator 1 may be configured to emit a laser beam L having a wavelength other than this. .
  • the laser processing apparatus performs pattern processing on a thin film on a transparent substrate by laser beam irradiation, and includes a laser beam irradiation unit, a top plate, and a base plate, and mounts the transparent substrate.
  • a mounting table the top plate is made of a member that transmits the laser beam emitted from the laser beam irradiation unit, and has a transparent substrate suction path that vacuum-sucks the transparent substrate, and the base plate is
  • a laser processing apparatus characterized by comprising: a top plate support portion for supporting the top plate; and an opening portion dug down from the surface and a top plate suction path connected to the opening portion.
  • the top plate absorbs the laser beam by transmitting it while easily securing it. Since no, it is possible to suppress the occurrence of processing marks on the placing table by a laser beam to improve the quality of the substrate.
  • the second embodiment of the present invention is different from the first embodiment particularly in that the top plate has a transparent substrate supporting portion for supporting the transparent substrate, and a groove portion dug from the surface and connected to the transparent substrate suction path. There is.
  • FIG. 2 is a view for explaining a laser processing apparatus according to a second embodiment of the present invention.
  • the mounting table 103 in the second embodiment includes a top table 104 for holding the transparent substrate B by suction and a base table 5 for holding the top table 104 by suction.
  • the configuration of the base table 5 is the same as that of the first embodiment.
  • the top plate 104 has a transparent substrate support portion 141 for supporting the transparent substrate B, and a groove portion 142 dug about 0.5 mm from the surface 45 near the center of the top plate 104.
  • the shape of the groove portion 142 as viewed from the Z direction is a substantially circular shape. Further, the size of the groove portion 142 can be appropriately selected depending on the thickness and the size of the target transparent substrate B.
  • Example 2 although the shape seen from the Z direction of the groove hole part 142 was made into substantially circular shape, it is not necessarily limited to this and can be changed suitably. For example, it may be a square, a hexagon or any shape. Further, the position of the groove portion 142 may not be near the center of the top plate 104, and can be provided at any position. Furthermore, the groove portion 142 may be provided in a plurality of places instead of staying in one place.
  • One end of the transparent substrate suction passage 43 is provided near the center of the bottom of the groove 42.
  • the transparent substrate B can be reliably held on the top plate 104 by vacuum suction via the transparent substrate suction passage 43 and the groove portion 142.
  • the bottom surface 144 of the groove portion 142 in the top plate 104 is rougher than the surface 45 of the transparent substrate support portion 41 (the surface on which the back surface of the transparent substrate B is in contact).
  • the surface 45 of the transparent substrate support portion 141 is processed flat to prevent vacuum leakage.
  • the bottom surface 144 of the grooved portion 142 may be roughened as it is without flattening like the surface 45 of the transparent substrate support portion 141 or may be roughened by a method such as sand blasting. At least the bottom surface 144 of the groove portion 142 in the top plate 104 may be rougher than the surface 45 of the transparent substrate support portion 141.
  • the top plate 104 By forming the top plate 104 with a member through which the laser beam L passes, it is possible to prevent the generation of processing marks on the top plate 104. However, the laser beam L that has passed through the top plate 104 may leave processing marks on the base plate 5. Therefore, as described above, by making the bottom surface 144 of the groove portion 142 in the top plate 104 rougher than the surface 45 of the transparent substrate support portion 141, the generation of processing marks on the base plate 5 can be suppressed. That is, the laser beam L which has passed the transparent substrate B and is incident on the groove portion 142 and reaches the bottom surface 144 is diffused and attenuated by the rough surface, and the generation of processing marks on the base plate 5 can be suppressed.
  • the bottom surface 54 of the opening 52 of the base plate 5 is a place where there is no problem even if a machining mark is generated by the laser beam L.
  • the bottom surface 54 of the opening 52 of the base plate 5 may be rougher than the surface 55 of the base plate support 51. As a result, the laser beam L that has passed through the top plate 4 and is incident on the opening 52 and reaches the bottom surface 54 is diffused and attenuated by the rough surface, and the generation of processing marks on the base plate 5 can be further suppressed.
  • the base plate 5 does not immediately become a problem even if the laser beam L causes a machining mark.
  • the vacuum leak may gradually occur or the adsorption may become unstable, making it difficult to fix and hold the transparent substrate B and the top plate 104. May be Therefore, as shown in FIG. 2, as viewed from the laser beam irradiation direction (that is, the Z direction), the groove portion 142 overlaps with the surface 55 of the top plate support portion 51 (surface on which the back surface of the top plate 4 contacts). There is. Further, although not shown, the groove portion 142 also has a positional relationship of overlapping with the surface 55 of the top plate support portion 51 also in the X direction.
  • the laser beam L having passed through the transparent substrate B is diffused and attenuated at the bottom surface 144 of the groove portion 142 in the top plate 104.
  • the groove portion 142 is in a positional relationship of overlapping with the surface 55 of the top plate support 51 as viewed from the laser beam irradiation direction, so the surface 55 of the top plate support 51 is directly affected by the laser beam L. It is possible to suppress the generation of processing marks.
  • the groove portion 142 has a positional relationship overlapping with the surface 55 in the X and Y directions of the top plate support portion 51 as viewed from the laser beam irradiation direction, but the present invention is not necessarily limited thereto. Is possible.
  • the positional relationship may be such that it overlaps with the surface 55 of the top plate support portion 51 only in a particularly important portion of the groove portion 142 when viewed from the laser beam irradiation direction. That is, the overlapping positional relationship can be set arbitrarily depending on the shape of the base plate 5 and the degree of damage by the laser beam L, and at least one of the groove portions 142 is at least one of the surfaces 55 of the top plate support 51 when viewed from the laser beam irradiation direction. It is sufficient if the positional relationship overlaps with the part.
  • the top plate has the transparent substrate support portion for supporting the transparent substrate, and the grooved portion excavated from the surface and connected to the transparent substrate suction path.
  • the transparent substrate can be securely held by suction.
  • the bottom surface of the groove portion is rougher than the surface of the transparent substrate support portion in contact with the transparent substrate, so that the laser beam transmitted through the transparent substrate is roughened at the bottom surface of the groove portion.
  • the laser beam is diffused and attenuated, and the generation of processing marks on the mounting table can be further suppressed.
  • the bottom surface of the groove portion is in a positional relationship in which at least a part of the surface of the top plate support portion overlaps as viewed from the laser beam irradiation direction, thereby diffusing the laser beam on the bottom surface of the groove portion. Since the effect of the above is given to the surface of the top plate support portion, the generation of processing marks on the mounting table can be further suppressed.
  • the third embodiment of the present invention is different from the first or second embodiment in that the base plate is configured to hold a plurality of top plates.
  • a second embodiment of the present invention will be described with reference to FIG.
  • FIG. 3 is a view for explaining a laser processing apparatus according to a second embodiment of the present invention.
  • the third embodiment is directed to pattern processing on a large transparent substrate B of about 3 m ⁇ . Therefore, as shown in FIG. 3, the large base plate 205 is configured to hold a plurality of top plates 104.
  • the large base plate 205 is provided with a plurality of top plate support portions 251 in the Y direction so as to be able to hold a plurality of top plates 104, and is provided with a plurality of openings 252. Further, the base plate 205 is configured to be able to hold a plurality of top plates 104 (that is, arrange them in a tile shape) also in the X direction (not shown).
  • the top plate when processing a pattern on a large-sized transparent substrate B, it is conceivable to use a top plate as large as the transparent substrate B, but in that case, the top plate is 3 m ⁇ , which is large. Detachment is not easy. Therefore, in the third embodiment, a plurality of small top plates 104 are held on the large base plate 5. Thereby, even if a specific top plate 104 has a machining mark generated by the laser beam L, it is possible to easily replace only the specific top plate 104 (that is, a part of the tile-like arrangement). it can.
  • the plurality of transparent substrate suction paths 43 are all connected to the same first vacuum suction machine, and the plurality of top plate suction paths 253 are each connected to another second vacuum suction machine.
  • the first vacuum suction device controls the first vacuum suction device, the large-sized transparent substrate B can be easily attached and detached and fixed and held.
  • each second vacuum suction device only a specific top plate 104 can be easily attached and detached.
  • the plurality of top plate suction paths 253 are configured to be connected to different second vacuum suction machines, but the present invention is not necessarily limited thereto, and can be appropriately modified.
  • the plurality of top plate suction paths 253 may all be configured to connect to the same second vacuum suction device. Thereby, the laser processing apparatus can be configured compactly.
  • each groove portion 142 is roughened from the surface 45 of the transparent substrate support portion 141, passes through the transparent substrate B, enters the groove portion 142, and is made to the bottom surface 144.
  • the laser beam L thus reached is diffused by the rough surface to suppress the generation of processing marks on the base plate 205.
  • the groove portion 142 overlaps with the top plate support portion 251 in the Y direction by the diffusion effect of the laser beam L by the bottom surface 144 of the groove portion 142.
  • the surface 255 of the top plate support portion 251 is configured to suppress the generation of processing marks without being directly affected by the laser beam L.
  • Example 3 although it comprised so that the transparent substrate B might be hold
  • the transparent substrate B may be configured to be held by using a plurality of the top plates 4 described above.
  • the base plate is configured to hold a plurality of the top plates, it is also possible to pattern a large transparent substrate.
  • the laser processing apparatus in the present invention can be widely used in the field of processing a thin film pattern on a transparent substrate.
  • Laser beam irradiation unit 3 Mounting table 4: Top plate 5: Base plate 45: Surface 43: Transparent substrate suction path 51: Top plate support 52: Opening 53: Top plate suction path 54: Bottom surface 55: Surface 103 : Mounting table 104: Top plate 141: Transparent substrate support portion 142: Grooved portion 144: Bottom surface 205: Base plate 251: Top plate support portion 252: Opening 253: Top plate suction path 255: Surface L: Laser beam B: Transparent substrate

Abstract

The present invention addresses the problem of suppressing generation of machining marks by laser beams on a placement table while easily ensuring flatness of a placement table. Specifically, the present invention provides a laser machining apparatus that performs pattern processing of a thin film on a transparent substrate by use of laser beam irradiation. The laser machining apparatus is characterized by being provided with a laser beam irradiation part, and a placement table which comprises a top plate and a base plate and on which the transparent substrate is placed, wherein: the top plate is formed from a member for transmitting laser beams emitted from the laser beam irradiation part and has a transparent substrate suction path for performing vacuum sucking on the transparent substrate; and the base plate has a top plate supporting part that supports the top plate, an opening recessed from the surface, and a top plate suction path connected to the opening.

Description

レーザ加工装置Laser processing equipment
　本発明は、透明基板上の薄膜にパターン加工を行うレーザ加工装置に関するものである。 The present invention relates to a laser processing apparatus for performing pattern processing on a thin film on a transparent substrate.
　ガラス基板のような透明基板上に薄膜パターンをレーザ加工する場合、当該透明基板を通過したレーザビームが当該透明基板を載置する載置テーブルの表面に吸収され、当該載置テーブルの表面に加工痕が発生する場合がある。載置テーブルに加工痕が発生すると、透明基板裏面に傷やゴミを付着させる原因になり品質に影響することとなる。載置テーブルへの加工痕の発生を抑制するために、従来は、透明基板における加工箇所が固定である場合は載置テーブルの当該加工箇所に対応する位置に座繰り加工を施してレーザビームの影響を少なくしたり、載置テーブルを脱着式にして加工痕の発生した載置テーブルを定期的に交換したり、１０００～２０００本という多数の支持ピンで透明基板を支持したりしてレーザビームの影響を少なくしていた。 When a thin film pattern is laser-processed on a transparent substrate such as a glass substrate, a laser beam passing through the transparent substrate is absorbed by the surface of the mounting table on which the transparent substrate is mounted, and is processed on the surface of the mounting table Scars may occur. Occurrence of processing marks on the mounting table causes adhesion of scratches and dust on the back surface of the transparent substrate, which affects the quality. In order to suppress the generation of processing marks on the mounting table, conventionally, when the processing position on the transparent substrate is fixed, spot processing is performed on the position of the mounting table corresponding to the processing position and the laser beam is The laser beam is used to reduce the influence, make the mounting table detachable, replace the mounting table on which processing marks are generated regularly, or support the transparent substrate with a large number of support pins of 1000 to 2000. Less impact.
　特許文献１には、透明基板を多数のモリブデン等からなる針状の支持ピンで支持して、レーザビームの影響を抑制する構成が記載されている。 Patent Document 1 describes a configuration in which a transparent substrate is supported by needle-like support pins made of a large number of molybdenum or the like to suppress the influence of a laser beam.
特許文献１：特開昭６３－５２７９０号公報 Patent Document 1: Japanese Patent Application Laid-Open No. 63-52790
　しかしながら、特許文献１記載のものは、多数の支持ピン各々の高さ調整に手間がかかり、支持ピンと支持ピンとの間を粗くすると基板のたわみが発生しレーザ加工の品質に影響を与えるという問題があった。 However, in the method described in Patent Document 1, it takes time to adjust the height of each of a large number of support pins, and if the distance between the support pins and the support pins is roughened, the substrate may be bent to affect the quality of laser processing. there were.
本発明は、上記問題点を解決して、載置テーブルの平坦度を容易に確保しつつ、レーザビームによる載置テーブルへの加工痕の発生を抑制して基板の品質を向上することを課題とする。 The present invention solves the above problems, and easily improves the quality of the substrate by suppressing the generation of processing marks on the mounting table by the laser beam while easily securing the flatness of the mounting table. I assume.
上記課題を解決するために本発明は、レーザビーム照射により透明基板上の薄膜をパターン加工するレーザ加工装置であって、
　レーザビーム照射部と、
　トッププレートとベースプレートとからなり、前記透明基板を載置する載置テーブルと、を備え、
　前記トッププレートは、前記レーザビーム照射部から照射されたレーザビームを透過させる部材からなるとともに、前記透明基板を真空吸着する透明基板吸引路を有し、
　前記ベースプレートは、前記トッププレートを支持するトッププレート支持部、及び表面から掘り下げた開口部と当該開口部と接続するトッププレート吸引路とを有することを特徴とするレーザ加工装置を提供するものである。 In order to solve the above problems, the present invention is a laser processing apparatus for patterning a thin film on a transparent substrate by laser beam irradiation,
A laser beam irradiation unit,
And a mounting table formed of a top plate and a base plate on which the transparent substrate is mounted,
The top plate is made of a member that transmits the laser beam emitted from the laser beam irradiation unit, and has a transparent substrate suction path that vacuum-sucks the transparent substrate.
The base plate is provided with a top plate support portion for supporting the top plate, and an opening portion dug down from the surface and a top plate suction path connected to the opening portion. .
この構成により、載置テーブルの平坦度を容易に確保しつつ、レーザビームによる載置テーブルへの加工痕の発生を抑制して基板の品質を向上することができる。 According to this configuration, it is possible to improve the quality of the substrate by suppressing the occurrence of processing marks on the mounting table by the laser beam while easily securing the flatness of the mounting table.
前記トッププレートは、前記透明基板を支持する透明基板支持部、及び表面から掘りさげられ前記透明基板吸引路と接続する溝孔部を有する構成としてもよい。 The top plate may have a transparent substrate support portion for supporting the transparent substrate, and a grooved portion excavated from the surface and connected to the transparent substrate suction path.
この構成により、透明基板を溝孔部によって確実に吸着保持することができる。 With this configuration, the transparent substrate can be reliably held by suction by the groove portion.
前記溝孔部における底面は、前記透明基板支持部における前記透明基板と接する面よりも粗面である構成としてもよい。 The bottom surface of the groove portion may be rougher than the surface of the transparent substrate support portion in contact with the transparent substrate.
この構成により、透明基板を透過したレーザビームが溝孔部の底面における粗面によりレーザビームが拡散することで減衰し、載置テーブルにおける加工痕の発生をさらに抑制することができる。 With this configuration, the laser beam transmitted through the transparent substrate is attenuated by the diffusion of the laser beam by the rough surface on the bottom of the groove portion, and the generation of processing marks on the mounting table can be further suppressed.
前記溝孔部の底面は、前記レーザビーム照射方向から視て前記トッププレート支持部の表面の少なくとも一部が重なる位置関係にある構成としてもよい。 The bottom surface of the groove portion may be in a positional relationship in which at least a part of the surface of the top plate support portion overlaps as viewed from the laser beam irradiation direction.
この構成により、溝孔部の底面におけるレーザビーム拡散の効果をトッププレート支持部表面に与えることになるため、載置テーブルにおける加工痕の発生をさらに抑制することができる。 With this configuration, the effect of laser beam diffusion on the bottom surface of the groove portion is given to the surface of the top plate support portion, so that the generation of processing marks on the mounting table can be further suppressed.
前記ベースプレートは、前記トッププレートを複数保持する構成としてもよい。 The base plate may be configured to hold a plurality of the top plates.
この構成により、大型の透明基板に対するパターン加工も可能になる。 This configuration also enables pattern processing on a large transparent substrate.
本発明のレーザ加工装置により、載置テーブルの平坦度を容易に確保しつつ、レーザビームによる載置テーブルへの加工痕の発生を抑制することができる。 According to the laser processing apparatus of the present invention, the flatness of the mounting table can be easily secured, and the generation of processing marks on the mounting table by the laser beam can be suppressed.
本発明の実施例１におけるレーザ加工装置を説明する図である。It is a figure explaining the laser processing apparatus in Example 1 of this invention. 本発明の実施例２におけるレーザ加工装置を説明する図である。It is a figure explaining the laser processing apparatus in Example 2 of this invention. 本発明の実施例３におけるレーザ加工装置を説明する図である。It is a figure explaining the laser processing apparatus in Example 3 of this invention.
本発明の実施例１について、図１を参照して説明する。図１は、本発明の実施例１におけるレーザ加工装置を説明する図である。 A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a view for explaining a laser processing apparatus according to a first embodiment of the present invention.
実施例１は、図１に示すように、Ｘ－Ｙ平面に広がる透明基板Ｂ上の薄膜に対して、レーザビーム照射部１からレーザビームＬをＺ方向から垂直に照射し透明基板Ｂ上の薄膜にパターン加工するものである。実施例１においては、２００ｍｍ×３００ｍｍ程度の大きさで厚さが０．３ｍｍ～０．７ｍｍ程度の透明基板Ｂを対象としている。レーザビーム照射部１は、波長が５３２ｎｍのレーザビームＬを照射するように構成され、図示しない駆動機構によりＸ，Ｙ方向の任意の位置に移動して透明基板Ｂの全面に亘って加工することができる。 In the first embodiment, as shown in FIG. 1, the laser beam L is emitted perpendicularly from the Z direction to the thin film on the transparent substrate B spreading in the XY plane from the Z direction to form a thin film on the transparent substrate B. It is a pattern processing to a thin film. The first embodiment is directed to a transparent substrate B having a size of about 200 mm × 300 mm and a thickness of about 0.3 mm to 0.7 mm. The laser beam irradiation unit 1 is configured to emit a laser beam L having a wavelength of 532 nm, and is moved to an arbitrary position in the X and Y directions by a drive mechanism (not shown) to process the entire surface of the transparent substrate B. Can.
透明基板Ｂは、載置テーブル３に載置されるとともに、真空吸引により固定保持される。載置テーブル３は、透明基板Ｂを支持するトッププレート４とトッププレート４を支持するベースプレート５から構成されている。 The transparent substrate B is mounted on the mounting table 3 and fixed and held by vacuum suction. The mounting table 3 includes a top plate 4 supporting the transparent substrate B and a base plate 5 supporting the top plate 4.
トッププレート４は、レーザビーム照射部１から照射されたレーザビームＬを透過させる部材であるガラスからなるとともに、透明基板吸引路４３を介して透明基板Ｂを真空吸着することができる。透明基板吸引路４３はトッププレート４及びベースプレート５を貫通して設けられ、一方の端部は透明基板Ｂの吸引口となり他方の端部は図示しない第１の真空吸引機に接続されている。第１の真空吸引機は、オン－オフが制御可能で、透明基板Ｂを固定保持するときは吸引をオンにし、透明基板Ｂを取り外すときは吸引をオフにして、透明基板Ｂの着脱と固定保持とを容易にしている。また、トッププレート４の表面４５は、透明基板Ｂと接触する面であり、透明基板Ｂを支持したときに接触面から真空吸引が漏れないように平坦に加工されている。 The top plate 4 is made of glass that is a member that transmits the laser beam L emitted from the laser beam irradiation unit 1, and can vacuum-suck the transparent substrate B via the transparent substrate suction path 43. The transparent substrate suction passage 43 is provided to penetrate the top plate 4 and the base plate 5, one end thereof is a suction port of the transparent substrate B, and the other end is connected to a first vacuum suction device (not shown). The first vacuum suction device can be controlled on-off, and the suction is turned on when the transparent substrate B is fixed and held, and the suction is turned off when the transparent substrate B is removed, and the transparent substrate B is attached and detached and fixed. It is easy to hold and hold. Further, the surface 45 of the top plate 4 is a surface in contact with the transparent substrate B, and is processed flat so that vacuum suction does not leak from the contact surface when the transparent substrate B is supported.
ベースプレート５はアルミからなり１５ｍｍ程度の厚さを有し、トッププレート４を支持するトッププレート支持部５１と、トッププレート支持部５１の表面５５から５ｍｍほど掘り下げた開口部５２とを有している。開口部５２の大きさは、トッププレート４の厚さや大きさにより適宜選択することができる。また、開口部５２の底面における中央付近には、トッププレート吸引路５３の一方の端部が設けられている。トッププレート吸引路５３はベースプレート５を貫通して設けられ、他方の端部は図示しない第２の真空吸引機に接続されている。第２の真空吸引機はオン－オフが制御可能で、トッププレート４を固定保持するときは吸引をオンにし、トッププレート４を取り外すときは吸引をオフにして、トッププレート４の着脱と固定保持とを容易にしている。 The base plate 5 is made of aluminum and has a thickness of about 15 mm, and has a top plate support portion 51 for supporting the top plate 4 and an opening portion 52 dug about 5 mm from the surface 55 of the top plate support portion 51. . The size of the opening 52 can be appropriately selected according to the thickness and size of the top plate 4. Further, one end of the top plate suction passage 53 is provided near the center of the bottom surface of the opening 52. The top plate suction passage 53 is provided through the base plate 5 and the other end is connected to a second vacuum suction device (not shown). The second vacuum suction device can be controlled on-off, the suction is turned on when holding the top plate 4 fixedly, the suction is turned off when the top plate 4 is removed, and the top plate 4 is attached and removed and fixedly held. And make it easy.
このように、第１の真空吸引機における透明基板吸引路４３と第２の真空吸引機におけるトッププレート吸引路５３とは別系統に構成している。それぞれの吸引路を別系統としたことにより、トッププレート４を着脱することなく透明基板Ｂのみの着脱を容易にするとともに、仮にトッププレート４がレーザビームＬにより加工痕が発生したとしてもトッププレート４を容易に交換することができる。 As described above, the transparent substrate suction passage 43 in the first vacuum suction device and the top plate suction passage 53 in the second vacuum suction device are configured as separate systems. The separate suction paths make it easy to attach and detach only the transparent substrate B without attaching and detaching the top plate 4, and even if the top plate 4 is processed by the laser beam L, the top plate may be damaged 4 can be easily replaced.
ここで、レーザビーム照射部１から照射されたレーザビームＬは、透明基板Ｂの表面にある薄膜に吸収されてパターン加工に用いられるが、一部は透明基板Ｂを通過する。通過したレーザビームＬはトッププレート４に達するが、トッププレート４はガラスで構成されていることからレーザビームＬを吸収することなく透過させるため加工痕を付けることがない。そのため、透明基板Ｂの裏面に傷やゴミを付着させることがなく、透明基板Ｂの品質を向上させることができる。 Here, the laser beam L emitted from the laser beam irradiation unit 1 is absorbed by the thin film on the surface of the transparent substrate B and used for pattern processing, but a part of the laser beam L passes through the transparent substrate B. The laser beam L that has passed through reaches the top plate 4, but since the top plate 4 is made of glass and does not absorb the laser beam L, it does not have a processing mark because it is transmitted. Therefore, the quality of the transparent substrate B can be improved without causing scratches or dust to adhere to the back surface of the transparent substrate B.
なお、実施例１においては、ガラスからなる透明基板Ｂをレーザ加工の対象としたが、必ずしもこれに限定されず適宜変更が可能である。例えば、透明のフィルム状の樹脂等からなる透明基板Ｂをレーザ加工の対象としてもよい。 In the first embodiment, the transparent substrate B made of glass is subjected to the laser processing. However, the present invention is not necessarily limited to this, and appropriate changes can be made. For example, a transparent substrate B made of a transparent film-like resin or the like may be a target of laser processing.
また、実施例１においては、トッププレート４をガラスで構成したが、必ずしもこれに限定されず適宜変更が可能である。例えば、すりガラスや石英で構成してもよい。 Moreover, in Example 1, although the top plate 4 was comprised with glass, it is not necessarily limited to this and can be changed suitably. For example, it may be made of ground glass or quartz.
さらに、実施例１においては、ベースプレート５をアルミで構成したが、必ずしもこれに限定されず適宜変更が可能である。例えば、アルミ以外の任意の金属で構成するようにしてもよい。 Furthermore, in Example 1, although the base plate 5 was comprised with aluminum, it is not necessarily limited to this and can be changed suitably. For example, it may be made of any metal other than aluminum.
また、実施例１においては、レーザビームＬをＺ方向から透明基板Ｂに垂直に照射するように構成したが、必ずしもこれに限定されず適宜変更が可能である。例えば、レーザビームＬを透明基板Ｂに対して斜め方向から照射するように構成してもよいし、載置テーブル３をＺ方向に設けて透明基板Ｂを鉛直方向に保持し、レーザ照射部１をＹ方向に配置して水平方向にレーザビームＬを照射するようにしてもよい。 Moreover, in Example 1, although it comprised so that the laser beam L might be perpendicularly | vertically irradiated to the transparent substrate B from Z direction, it is not necessarily limited to this and can be changed suitably. For example, the laser beam L may be configured to be irradiated obliquely to the transparent substrate B, or the mounting table 3 may be provided in the Z direction to hold the transparent substrate B in the vertical direction. May be arranged in the Y direction, and the laser beam L may be irradiated in the horizontal direction.
また、実施例１においては、レーザビームＬの波長を５３２ｎｍとしたが、必ずしもこれに限定されず適宜変更が可能である。例えば、波長３５５ｎｍのレーザビームＬを照射するようにレーザビーム照射部１を構成してもよいし、これ以外の波長のレーザビームＬを照射するようにレーザビーム照射部１を構成してもよい。 Moreover, in Example 1, although the wavelength of the laser beam L was 532 nm, it is not necessarily limited to this and can be changed suitably. For example, the laser beam irradiator 1 may be configured to emit a laser beam L having a wavelength of 355 nm, or the laser beam irradiator 1 may be configured to emit a laser beam L having a wavelength other than this. .
このように実施例１においては、レーザビーム照射により透明基板上の薄膜をパターン加工するレーザ加工装置であって、　レーザビーム照射部と、　トッププレートとベースプレートとからなり、前記透明基板を載置する載置テーブルと、を備え、　前記トッププレートは、前記レーザビーム照射部から照射されたレーザビームを透過させる部材からなるとともに、前記透明基板を真空吸着する透明基板吸引路を有し、　前記ベースプレートは、前記トッププレートを支持するトッププレート支持部、及び表面から掘り下げた開口部と当該開口部と接続するトッププレート吸引路とを有することを特徴とするレーザ加工装置により、載置テーブルの平坦度を容易に確保しつつ、トッププレートがレーザビームを透過させることにより吸収することがないため、レーザビームによる載置テーブルにおける加工痕の発生を抑制して基板の品質を向上させることができる。 As described above, in the first embodiment, the laser processing apparatus performs pattern processing on a thin film on a transparent substrate by laser beam irradiation, and includes a laser beam irradiation unit, a top plate, and a base plate, and mounts the transparent substrate. A mounting table, the top plate is made of a member that transmits the laser beam emitted from the laser beam irradiation unit, and has a transparent substrate suction path that vacuum-sucks the transparent substrate, and the base plate is And a laser processing apparatus characterized by comprising: a top plate support portion for supporting the top plate; and an opening portion dug down from the surface and a top plate suction path connected to the opening portion. The top plate absorbs the laser beam by transmitting it while easily securing it. Since no, it is possible to suppress the occurrence of processing marks on the placing table by a laser beam to improve the quality of the substrate.
本発明の実施例２は、特に、トッププレートが透明基板を支持する透明基板支持部、及び表面から掘りさげられ透明基板吸引路と接続する溝孔部を有する点で、実施例１と異なっている。 The second embodiment of the present invention is different from the first embodiment particularly in that the top plate has a transparent substrate supporting portion for supporting the transparent substrate, and a groove portion dug from the surface and connected to the transparent substrate suction path. There is.
実施例２について、図２を参照して説明する。図２は、本発明の実施例２におけるレーザ加工装置を説明する図である。 The second embodiment will be described with reference to FIG. FIG. 2 is a view for explaining a laser processing apparatus according to a second embodiment of the present invention.
実施例２における載置テーブル１０３は、透明基板Ｂを吸着保持するトップテーブル１０４とトップテーブル１０４を吸着保持するベーステーブル５を備えている。ベーステーブル５の構成は、実施例１と同じである。 The mounting table 103 in the second embodiment includes a top table 104 for holding the transparent substrate B by suction and a base table 5 for holding the top table 104 by suction. The configuration of the base table 5 is the same as that of the first embodiment.
トッププレート１０４は、透明基板Ｂを支持する透明基板支持部１４１と、トッププレート１０４の中央付近に表面４５から０．５ｍｍ程度掘り下げた溝孔部１４２とを有している。溝孔部１４２のＺ方向から視た形状は略円形状である。また、溝孔部１４２の大きさは対象となる透明基板Ｂの厚さや大きさにより適宜選択することができる。 The top plate 104 has a transparent substrate support portion 141 for supporting the transparent substrate B, and a groove portion 142 dug about 0.5 mm from the surface 45 near the center of the top plate 104. The shape of the groove portion 142 as viewed from the Z direction is a substantially circular shape. Further, the size of the groove portion 142 can be appropriately selected depending on the thickness and the size of the target transparent substrate B.
なお、実施例２においては、溝孔部１４２のＺ方向から視た形状を略円形状としたが、必ずしもこれに限定されず適宜変更が可能である。例えば、四角形としてもよいし、六角形としてもよく、任意の形状とすることができる。また、溝孔部１４２の位置はトッププレート１０４の中央付近でなくてもよく、任意の位置に設けることができる。さらに、溝孔部１４２は１ヶ所にとどまらず複数の箇所に設けてもよい。 In addition, in Example 2, although the shape seen from the Z direction of the groove hole part 142 was made into substantially circular shape, it is not necessarily limited to this and can be changed suitably. For example, it may be a square, a hexagon or any shape. Further, the position of the groove portion 142 may not be near the center of the top plate 104, and can be provided at any position. Furthermore, the groove portion 142 may be provided in a plurality of places instead of staying in one place.
溝孔部４２の底面における中央付近には透明基板吸引路４３の一方の端部が設けられている。そして、透明基板吸引路４３及び溝孔部１４２を介して真空吸引することにより、確実に透明基板Ｂをトッププレート１０４に保持することができる。 One end of the transparent substrate suction passage 43 is provided near the center of the bottom of the groove 42. The transparent substrate B can be reliably held on the top plate 104 by vacuum suction via the transparent substrate suction passage 43 and the groove portion 142.
また、トッププレート１０４における溝孔部１４２の底面１４４が透明基板支持部４１の表面４５（透明基板Ｂの裏面が接する面）より粗面にされている。透明基板支持部１４１の表面４５は、真空漏れを防ぐために平坦に加工されている。溝孔部１４２の底面１４４においては、透明基板支持部１４１の表面４５のような平坦加工を施さずに粗面のままとしてもよいし、サンドブラスト等の方法により粗面加工を施してもよい。少なくともトッププレート１０４における溝孔部１４２の底面１４４が透明基板支持部１４１の表面４５より粗面であればよい。 Further, the bottom surface 144 of the groove portion 142 in the top plate 104 is rougher than the surface 45 of the transparent substrate support portion 41 (the surface on which the back surface of the transparent substrate B is in contact). The surface 45 of the transparent substrate support portion 141 is processed flat to prevent vacuum leakage. The bottom surface 144 of the grooved portion 142 may be roughened as it is without flattening like the surface 45 of the transparent substrate support portion 141 or may be roughened by a method such as sand blasting. At least the bottom surface 144 of the groove portion 142 in the top plate 104 may be rougher than the surface 45 of the transparent substrate support portion 141.
トッププレート１０４をレーザビームＬが透過する部材で構成することで、トッププレート１０４に加工痕の発生を防ぐことができる。しかしながら、トッププレート１０４を通過したレーザビームＬがベースプレート５に加工痕を残す可能性がある。そこで、上述のように、トッププレート１０４における溝孔部１４２の底面１４４が透明基板支持部１４１の表面４５より粗面にすることで、ベースプレート５に対する加工痕の発生を抑制することができる。つまり、透明基板Ｂを通過して溝孔部１４２に入射し、底面１４４に達したレーザビームＬは粗面によって拡散して減衰し、ベースプレート５に対する加工痕の発生を抑制することができる。 By forming the top plate 104 with a member through which the laser beam L passes, it is possible to prevent the generation of processing marks on the top plate 104. However, the laser beam L that has passed through the top plate 104 may leave processing marks on the base plate 5. Therefore, as described above, by making the bottom surface 144 of the groove portion 142 in the top plate 104 rougher than the surface 45 of the transparent substrate support portion 141, the generation of processing marks on the base plate 5 can be suppressed. That is, the laser beam L which has passed the transparent substrate B and is incident on the groove portion 142 and reaches the bottom surface 144 is diffused and attenuated by the rough surface, and the generation of processing marks on the base plate 5 can be suppressed.
ベースプレ－ト５の開口部５２の底面５４は、レーザビームＬにより加工痕が発生しても問題ない箇所である。しかし、ベースプレ－ト５の開口部５２の底面５４をベースプレート支持部５１の表面５５よりも粗面であるように構成してもよい。これにより、トッププレート４を通過して開口部５２に入射し、底面５４に達したレーザビームＬは粗面によって拡散して減衰し、ベースプレート５に対する加工痕の発生をさらに抑制することができる。 The bottom surface 54 of the opening 52 of the base plate 5 is a place where there is no problem even if a machining mark is generated by the laser beam L. However, the bottom surface 54 of the opening 52 of the base plate 5 may be rougher than the surface 55 of the base plate support 51. As a result, the laser beam L that has passed through the top plate 4 and is incident on the opening 52 and reaches the bottom surface 54 is diffused and attenuated by the rough surface, and the generation of processing marks on the base plate 5 can be further suppressed.
ベースプレート５は、レーザビームＬによって加工痕が発生してもすぐに問題になるわけではない。しかし、ベースプレート５の中でもトッププレート支持部５１の表面５５に傷が付くと、徐々に真空漏れが起きたり、吸着が不安定になったりして、透明基板Ｂやトッププレート１０４の固定保持が困難になる場合がある。そこで、図２に示すように、レーザビーム照射方向（すなわちＺ方向）から視て、溝孔部１４２はトッププレート支持部５１の表面５５（トッププレート４の裏面が接する面）と重なる位置
関係としている。また、図示しないが、Ｘ方向においても溝孔部１４２はトッププレート支持部５１の表面５５と重なる位置関係としている。 The base plate 5 does not immediately become a problem even if the laser beam L causes a machining mark. However, if the surface 55 of the top plate support portion 51 is damaged among the base plate 5, the vacuum leak may gradually occur or the adsorption may become unstable, making it difficult to fix and hold the transparent substrate B and the top plate 104. May be Therefore, as shown in FIG. 2, as viewed from the laser beam irradiation direction (that is, the Z direction), the groove portion 142 overlaps with the surface 55 of the top plate support portion 51 (surface on which the back surface of the top plate 4 contacts). There is. Further, although not shown, the groove portion 142 also has a positional relationship of overlapping with the surface 55 of the top plate support portion 51 also in the X direction.
これにより、透明基板Ｂを通過したレーザビームＬはトッププレート１０４における溝孔部１４２の底面１４４で拡散されて減衰する。そのとき、溝孔部１４２はレーザビーム照射方向から視てトッププレート支持部５１の表面５５と重なる位置関係にあるため、トッププレート支持部５１の表面５５がレーザビームＬの直接の影響を受けることなく、加工痕の発生を抑制することができる。 Thus, the laser beam L having passed through the transparent substrate B is diffused and attenuated at the bottom surface 144 of the groove portion 142 in the top plate 104. At that time, the groove portion 142 is in a positional relationship of overlapping with the surface 55 of the top plate support 51 as viewed from the laser beam irradiation direction, so the surface 55 of the top plate support 51 is directly affected by the laser beam L. It is possible to suppress the generation of processing marks.
上述したように、トッププレート支持部５１の表面５５に加工痕が発生すると、真空漏れや吸着不安定がおきてトッププレート１０４を固定保持することが困難になる場合があるが、溝孔部１４２の底面１４４でレーザビームを拡散させることにより、トッププレート支持部５１の表面５５に加工痕が生じること（つまり、真空漏れや吸着不安定）を防ぐことができる。 As described above, if processing marks are generated on the surface 55 of the top plate support portion 51, vacuum leakage or adsorption instability may occur, which may make it difficult to fix and hold the top plate 104. By diffusing the laser beam on the bottom surface 144 of the surface of the top plate support portion 51, it is possible to prevent the formation of processing marks on the surface 55 of the top plate support portion 51 (that is, vacuum leakage or adsorption instability).
なお、実施例２においては、溝孔部１４２はレーザビーム照射方向から視てトッププレート支持部５１のＸ、Ｙ方向において表面５５と重なる位置関係にあるしたが、必ずしもこれに限定されず適宜変更が可能である。例えば、レーザビーム照射方向から視て、溝孔部１４２の特に重要な部分においてのみトッププレート支持部５１の表面５５と重なる位置関係としてもよい。すなわち、ベースプレート５の形状やレーザビームＬによる損傷の程度等により重なる位置関係は任意に設定でき、少なくともレーザビーム照射方向から視て、溝孔部１４２はトッププレート支持部５１の表面５５の少なくとも一部と重なる位置関係であればよい。 In the second embodiment, the groove portion 142 has a positional relationship overlapping with the surface 55 in the X and Y directions of the top plate support portion 51 as viewed from the laser beam irradiation direction, but the present invention is not necessarily limited thereto. Is possible. For example, the positional relationship may be such that it overlaps with the surface 55 of the top plate support portion 51 only in a particularly important portion of the groove portion 142 when viewed from the laser beam irradiation direction. That is, the overlapping positional relationship can be set arbitrarily depending on the shape of the base plate 5 and the degree of damage by the laser beam L, and at least one of the groove portions 142 is at least one of the surfaces 55 of the top plate support 51 when viewed from the laser beam irradiation direction. It is sufficient if the positional relationship overlaps with the part.
このように、実施例２においては、トッププレートが、透明基板を支持する前記透明基板支持部、及び表面から掘りさげられ前記透明基板吸引路と接続する溝孔部を有するようにしたことで、透明基板を確実に吸着保持することができる。 As described above, in the second embodiment, the top plate has the transparent substrate support portion for supporting the transparent substrate, and the grooved portion excavated from the surface and connected to the transparent substrate suction path. The transparent substrate can be securely held by suction.
また、前記溝孔部における底面は、前記透明基板支持部における前記透明基板と接する面よりも粗面であるようにしたことで、透明基板を透過したレーザビームが溝孔部の底面における粗面によりレーザビームが拡散して減衰し、載置テーブルにおける加工痕の発生をさらに抑制することができる。 Further, the bottom surface of the groove portion is rougher than the surface of the transparent substrate support portion in contact with the transparent substrate, so that the laser beam transmitted through the transparent substrate is roughened at the bottom surface of the groove portion. Thus, the laser beam is diffused and attenuated, and the generation of processing marks on the mounting table can be further suppressed.
さらに、前記溝孔部の底面は、前記レーザビーム照射方向から視て前記トッププレート支持部の表面の少なくとも一部が重なる位置関係にあるようにしたことで、溝孔部の底面におけるレーザビーム拡散の効果をトッププレート支持部表面に与えることになるため、載置テーブルにおける加工痕の発生をさらに抑制することができる。 Furthermore, the bottom surface of the groove portion is in a positional relationship in which at least a part of the surface of the top plate support portion overlaps as viewed from the laser beam irradiation direction, thereby diffusing the laser beam on the bottom surface of the groove portion. Since the effect of the above is given to the surface of the top plate support portion, the generation of processing marks on the mounting table can be further suppressed.
本発明の実施例３は、ベースプレートがトッププレートを複数保持するように構成された点で実施例１又は２と異なっている。本発明の実施例２について、図３を参照して説明する。図３は、本発明の実施例２におけるレーザ加工装置を説明する図である。 The third embodiment of the present invention is different from the first or second embodiment in that the base plate is configured to hold a plurality of top plates. A second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a view for explaining a laser processing apparatus according to a second embodiment of the present invention.
実施例３は、具体例として、およそ３ｍ□という大型の透明基板Ｂ上のパターン加工を対象にしている。そのため、図３に示すように、大型のベースプレート２０５がトッププレート１０４を複数保持するように構成している。 As a specific example, the third embodiment is directed to pattern processing on a large transparent substrate B of about 3 m □. Therefore, as shown in FIG. 3, the large base plate 205 is configured to hold a plurality of top plates 104.
大型のベースプレート２０５は、複数のトッププレート１０４を保持できるようにトッププレート支持部２５１をＹ方向に複数備え、また、複数の開口部２５２を備えている。また、図示しないＸ方向にもトッププレート１０４を複数（つまり、タイル状に配置して）保持できるようにベースプレート２０５は構成されている。 The large base plate 205 is provided with a plurality of top plate support portions 251 in the Y direction so as to be able to hold a plurality of top plates 104, and is provided with a plurality of openings 252. Further, the base plate 205 is configured to be able to hold a plurality of top plates 104 (that is, arrange them in a tile shape) also in the X direction (not shown).
ここで、大型の透明基板Ｂ上のパターンを加工する場合に、透明基板Ｂと同じくらいの大きさのトッププレートを使用することも考えられるが、その場合はトッププレートが３ｍ□という大型ゆえにその着脱が容易ではない。そのため、実施例３においては、大型のベースプレート５に、小型のトッププレート１０４を複数保持する構成としている。これにより、仮に、特定のトッププレート１０４がレーザビームＬによって加工痕が発生したとしても、容易に特定のトッププレート１０４のみ（つまり、タイル状に配置されたうちの一部）を交換することができる。 Here, when processing a pattern on a large-sized transparent substrate B, it is conceivable to use a top plate as large as the transparent substrate B, but in that case, the top plate is 3 m □, which is large. Detachment is not easy. Therefore, in the third embodiment, a plurality of small top plates 104 are held on the large base plate 5. Thereby, even if a specific top plate 104 has a machining mark generated by the laser beam L, it is possible to easily replace only the specific top plate 104 (that is, a part of the tile-like arrangement). it can.
複数の透明基板吸引路４３は全て同じ第１の真空吸引機に接続され、複数のトッププレート吸引路２５３はそれぞれ別の第２の真空吸引機に接続されている。これにより、第１の真空吸引機を制御することにより容易に大型の透明基板Ｂを着脱し固定保持することができる。また、それぞれの第２の真空吸引機を別々に制御することにより、特定のトッププレート１０４のみを容易に着脱することができる。 The plurality of transparent substrate suction paths 43 are all connected to the same first vacuum suction machine, and the plurality of top plate suction paths 253 are each connected to another second vacuum suction machine. Thus, by controlling the first vacuum suction device, the large-sized transparent substrate B can be easily attached and detached and fixed and held. In addition, by separately controlling each second vacuum suction device, only a specific top plate 104 can be easily attached and detached.
なお、実施例３においては、複数のトッププレート吸引路２５３はそれぞれ別の第２の真空吸引機に接続するように構成したが、必ずしもこれに限定されず適宜変更が可能である。例えば、複数のトッププレート吸引路２５３は全て同じ第２の真空吸引機に接続するように構成してもよい。これにより、コンパクトにレーザ加工装置を構成できる。 In the third embodiment, the plurality of top plate suction paths 253 are configured to be connected to different second vacuum suction machines, but the present invention is not necessarily limited thereto, and can be appropriately modified. For example, the plurality of top plate suction paths 253 may all be configured to connect to the same second vacuum suction device. Thereby, the laser processing apparatus can be configured compactly.
また、実施例３においても、それぞれの溝孔部１４２の底面１４４が透明基板支持部１４１の表面４５より粗面にして、透明基板Ｂを通過して溝孔部１４２に入射し、底面１４４に達したレーザビームＬを粗面によって拡散して、ベースプレート２０５に対する加工痕の発生を抑制するように構成している。 Also in the third embodiment, the bottom surface 144 of each groove portion 142 is roughened from the surface 45 of the transparent substrate support portion 141, passes through the transparent substrate B, enters the groove portion 142, and is made to the bottom surface 144. The laser beam L thus reached is diffused by the rough surface to suppress the generation of processing marks on the base plate 205.
さらに、レーザビーム照射方向（すなわちＺ方向）から視て、溝孔部１４２はＹ方向においてトッププレート支持部２５１と重なる位置関係として、溝孔部１４２の底面１４４によるレーザビームＬの拡散効果により、トッププレート支持部２５１の表面２５５がレーザビームＬの直接の影響を受けることなく加工痕の発生を抑制するように構成している。 Furthermore, as viewed from the laser beam irradiation direction (that is, the Z direction), the groove portion 142 overlaps with the top plate support portion 251 in the Y direction by the diffusion effect of the laser beam L by the bottom surface 144 of the groove portion 142. The surface 255 of the top plate support portion 251 is configured to suppress the generation of processing marks without being directly affected by the laser beam L.
なお、実施例３においては、複数のトッププレート１０４で透明基板Ｂを保持するように構成したが、必ずしもこれに限定されず適宜変更が可能である。例えば、上述したトッププレート４を複数用いて透明基板Ｂを保持するように構成してもよい。 In addition, in Example 3, although it comprised so that the transparent substrate B might be hold | maintained with the several top plate 104, it is not necessarily limited to this and can be changed suitably. For example, the transparent substrate B may be configured to be held by using a plurality of the top plates 4 described above.
このように、実施例３においては、前記ベースプレートは、前記トッププレートを複数保持するように構成したことにより、大型の透明基板に対するパターン加工も可能になる。 As described above, in the third embodiment, since the base plate is configured to hold a plurality of the top plates, it is also possible to pattern a large transparent substrate.
　本発明におけるレーザ加工装置は、透明基板上の薄膜パターンを加工する分野に広く用いることができる。 The laser processing apparatus in the present invention can be widely used in the field of processing a thin film pattern on a transparent substrate.
１：レーザビーム照射部　　３：載置テーブル　　４：トッププレート　　５：ベースプレート　　４５：表面　　４３：透明基板吸引路　　５１：トッププレート支持部　　５２：開口部　　５３：トッププレート吸引路　　５４：底面　　５５：表面　　１０３：載置テーブル　　１０４：トッププレート　　１４１：透明基板支持部　　１４２：溝孔部　　１４４：底面　　２０５：ベースプレート　　２５１：トッププレート支持部　　２５２：開口部　　２５３：トッププレート吸引路　　２５５：表面　　Ｌ：レーザビーム　　Ｂ：透明基板 1: Laser beam irradiation unit 3: Mounting table 4: Top plate 5: Base plate 45: Surface 43: Transparent substrate suction path 51: Top plate support 52: Opening 53: Top plate suction path 54: Bottom surface 55: Surface 103 : Mounting table 104: Top plate 141: Transparent substrate support portion 142: Grooved portion 144: Bottom surface 205: Base plate 251: Top plate support portion 252: Opening 253: Top plate suction path 255: Surface L: Laser beam B: Transparent substrate

Claims (5)

  1. 　レーザビーム照射により透明基板上の薄膜をパターン加工するレーザ加工装置であって、
    　レーザビーム照射部と、
    　トッププレートとベースプレートとからなり、前記透明基板を載置する載置テーブルと、を備え、
    　前記トッププレートは、前記レーザビーム照射部から照射されたレーザビームを透過させる部材からなるとともに、前記透明基板を真空吸着する透明基板吸引路を有し、
    　前記ベースプレートは、前記トッププレートを支持するトッププレート支持部、及び表面から掘り下げた開口部と当該開口部と接続するトッププレート吸引路とを有することを特徴とするレーザ加工装置。     A laser processing apparatus for patterning a thin film on a transparent substrate by laser beam irradiation, comprising:
    A laser beam irradiation unit,
    And a mounting table formed of a top plate and a base plate on which the transparent substrate is mounted,
    The top plate is made of a member that transmits the laser beam emitted from the laser beam irradiation unit, and has a transparent substrate suction path that vacuum-sucks the transparent substrate.
    The laser processing apparatus according to claim 1, wherein the base plate has a top plate support portion for supporting the top plate, and an opening portion dug down from the surface and a top plate suction path connected to the opening portion.
  2. 　前記トッププレートは、前記透明基板を支持する透明基板支持部、及び表面から掘りさげられ前記透明基板吸引路と接続する溝孔部を有することを特徴とする請求項１に記載のレーザ加工装置。 The laser processing apparatus according to claim 1, wherein the top plate has a transparent substrate support portion for supporting the transparent substrate, and a groove portion excavated from the surface and connected to the transparent substrate suction path.
  3. 　前記溝孔部における底面は、前記透明基板支持部における前記透明基板と接する面よりも粗面であることを特徴とする請求項２に記載のレーザ加工装置。 The laser processing apparatus according to claim 2, wherein a bottom surface of the groove portion is rougher than a surface of the transparent substrate support in contact with the transparent substrate.
  4. 　前記溝孔部の底面は、前記レーザビーム照射方向から視て前記トッププレート支持部の表面の少なくとも一部が重なる位置関係にあることを特徴とする請求項３に記載のレーザ加工装置。 4. The laser processing apparatus according to claim 3, wherein a bottom surface of the groove portion is in a positional relationship in which at least a part of a surface of the top plate support portion overlaps when viewed from the laser beam irradiation direction.
  5. 　前記ベースプレートは、前記トッププレートを複数保持することを特徴とする請求項１～４のいずれかに記載のレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 4, wherein the base plate holds a plurality of the top plates.
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TWI763943B (en) 2022-05-11
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JP6916718B2 (en) 2021-08-11
KR20200081392A (en) 2020-07-07
JP2019089103A (en) 2019-06-13

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