KR20140138420A - Laser Edge Healing Apparatus for Substrate - Google Patents

Abstract

The present invention relates to a substrate edge heeling apparatus using a laser, configured to bevel-process the outer edge part of a composite panel using a laser beam without using a grinder by irradiating the laser beam along an upper edge line of an upper panel and a lower edge line of a lower panel. It is possible to improve the accuracy of bevelling, the smoothness state of the bevelling process surface, improve intensity and quality of the composite substrate, and simplify the process. The provided substrate edge heeling apparatus using the laser can uniformly and accurately bevel-process the entire edge line since the tools do not interfere when bevel-processing the upper edge line of the upper panel.

Description

Technical Field [0001] The present invention relates to a laser edge healing apparatus using laser,

The present invention relates to a substrate edgehearing apparatus using a laser. More particularly, the laser beam is irradiated along the upper edge line of the upper panel and the lower edge line of the lower panel to chamfer the outer edge of the composite panel using a laser beam without using a grinder, It is possible to improve the strength and quality of the composite substrate and to simplify the process operation and to prevent the occurrence of tool interference during chamfering of the upper edge line to the upper panel, And more particularly, to a substrate edge healing apparatus using a laser capable of accurately and uniformly chamfering a substrate edge.

2. Description of the Related Art Recently, various electronic devices such as a mobile phone, a PDA, a computer, and a large-sized TV have been developed.

Such a flat display device has been actively studied for a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED), a vacuum fluorescent display (VFD), and an organic light emitting diode (OLED) Liquid crystal displays (LCDs) have been widely used for reasons of ease of driving means and high image quality. However, recently, due to the development of technology, various devices are being used more and more.

The substrate used for such a flat panel display device is generally configured in the form of a lower panel on which various devices and the like are mounted and a composite substrate on which an upper panel is coupled to the upper panel. The composite panel is configured such that the lower panel is larger in size than the upper panel, so that the lower panel protrudes from one side of the upper panel, and a separate part for electrical connection with an external device is formed on one side of the protruded lower panel. Are disposed.

Such a composite substrate is generally made of tempered glass to increase its strength. Nevertheless, in the course of cutting a composite substrate, microcracks or the like are generated on a machined surface due to a mechanical cutting process by a wheel There was a problem that the strength dropped. Particularly, these micro cracks are mainly generated along the edge line of the composite substrate. In order to prevent this, recently, the edge line portion of the composite substrate is chamfered.

The chamfering of such an edge line is generally carried out by grinding the edge line using a grinder. Such a chamfering operation of the grinding method not only proceeds to a WET process in which moisture is supplied to a work site, There is a problem that productivity is deteriorated due to complicated work such as periodical grinder replacement work.

Particularly, in the process of chamfering the upper edge line of the upper panel, interference occurs between the lower panel protruding from the upper panel and the grinder, so that the upper edge line of the upper panel can not be chamfered accurately. There has been a problem in that the strength is remarkably deteriorated.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a composite panel by irradiating a laser beam along an upper edge line of an upper panel and a lower edge line of a lower panel, By using a laser beam to perform chamfering without using a laser beam, it is possible to improve the accuracy of the chamfering process, to smooth the state of the chamfered surface, to improve the strength and quality of the composite substrate, Device.

Another object of the present invention is to chamfer the edge line of the composite substrate using a laser beam without using a separate grinder, so that no tool interference occurs during chamfering of the upper edge line to the upper panel, Which can accurately and uniformly perform chamfering with respect to the substrate edge healing apparatus using a laser.

It is still another object of the present invention to provide a reverse unit capable of reversing the vertical alignment state of the composite substrate so that both the upper edge line and the lower edge line can be chamfered through one laser unit and the reverse unit, And to provide a substrate edgehearing apparatus using a laser capable of easily performing a chamfering operation.

It is still another object of the present invention to provide a laser processing method and apparatus that can irradiate a laser beam along a chamfering line while fixing a laser unit, Thereby providing a healing apparatus.

The present invention relates to a substrate edge heeling apparatus for chamfering the edge of an outer edge of a composite substrate composed of an upper panel and a lower panel, comprising: an index table for rotating 360 degrees; A loading unit that seats the composite substrate at a predetermined position of the index table; An aligning unit for inspecting the position of the composite substrate placed on the index table through the loading unit; A first healing operation for chamfering an upper edge by irradiating a laser beam along an upper edge line of the upper panel and a second healing operation for chamfering a lower edge by irradiating a laser beam along a lower edge line of the lower panel A laser unit to be operated; A reverse unit for changing the vertical arrangement state of the composite substrate so that the arrangement state of the composite substrate seated on the index table is reversed; And an unloading unit for ejecting the composite substrate having chamfered edges formed by the laser unit from the index table.

At this time, the composite substrate is rotated together with the index table in the state where the primary healing operation is completed by the laser unit, and then the vertical arrangement state is reversed by the reverse unit. Then, the composite substrate is rotated together with the index table, May be configured to be a secondary healing operation by the unit.

In addition, the reverse unit may include a lift module positioned below the index table and transferring the composite substrate upward and downward from the index table; And a reversing module for rotating the composite substrate raised by the lift module up and down to reverse the vertical arrangement state.

The lift module supports the lower surface of the composite substrate and moves up and down through the index table at a lower portion of the index table to vertically transfer the composite substrate. And a lift driver coupled to the lift pins to move the lift pins up and down.

The reversing module may further include: a reverse fork capable of gripping the composite substrate transported upward by the lift pins; A rotation driving unit for rotating the reverse fork so that the composite substrate held by the reverse fork is reversed in a vertical direction; A horizontal feed drive unit for linearly moving the reverse fork in a horizontal direction; And a vertical feed driving unit for linearly moving the reverse fork in a vertical direction.

The laser unit may be configured to focus the laser beam so that the focal point of the laser beam is positioned at the upper or lower edge line of the composite panel and irradiate the laser beam in a direction perpendicular to the composite substrate.

The laser unit may include a laser generator for generating a laser beam; A galvanometer for reflecting a laser beam generated from the laser generator and adjusting a path of the laser beam to be irradiated along an upper or lower edge line of the composite panel; And a telecentric lens for focusing the laser beam such that the laser beam reflected from the galvanometer is irradiated in a direction perpendicular to the composite substrate.

The loading unit and the unloading unit may include a compression pad for attaching or detaching a composite substrate by vacuum pressing or squeezing the composite substrate through vacuum pressure; A cylinder module for vertically moving the pressing pad; And a horizontal transfer module for linearly moving the cylinder module in a horizontal direction.

Meanwhile, the laser beam irradiated by the laser unit is applied as an ultra-violet laser beam, and the ultra-violet laser beam may have a wavelength of 200 nm to 800 nm, a pulse width of 100 fs to 20 ps, and a frequency of 200 kHz to 2000 kHz.

According to the present invention, a laser beam is irradiated along the upper edge line of the upper panel and the lower edge line of the lower panel to chamfer the edge of the outer edge of the composite panel using a laser beam without using a grinder, Thereby improving the strength and quality of the composite substrate and simplifying the process operation.

Further, since the edge line of the composite substrate is chamfered by using a laser beam without using a separate grinder, tool interference does not occur during chamfering of the upper edge line to the upper panel, So that uniform chamfering can be performed.

Further, by providing the reverse unit capable of reversing the vertical arrangement state of the composite substrate, it is possible to chamfer both the upper edge line and the lower edge line through one laser unit and the reverse unit, and furthermore, There is an effect that can be performed.

Further, by allowing the laser beam to be irradiated along the chamfering line in a state where the laser unit is fixed, it is possible to perform a more rapid process, and the structure of the entire device can be simplified and miniaturized.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view schematically illustrating the configuration of a substrate edgehearing apparatus according to an embodiment of the present invention;
FIG. 2 is a process diagram schematically showing an edge line chamfering process sequence using a substrate edgehearing apparatus according to an embodiment of the present invention; FIG.
FIG. 3 is a process flow chart showing the process flow of the substrate edgehearing apparatus according to one embodiment of the present invention,
FIG. 4 is a schematic view illustrating a configuration of a loading unit and an unloading unit of a substrate edgehearing apparatus according to an embodiment of the present invention; FIG.
5 is a schematic view illustrating a configuration of a laser unit of a substrate edgehearing apparatus according to an embodiment of the present invention;
6 is a view schematically showing a configuration of a reverse unit of a substrate edgehearing apparatus according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

FIG. 1 is a schematic view schematically showing the configuration of a substrate edge healing apparatus according to an embodiment of the present invention. FIG. 2 schematically shows an edge line chamfering process sequence using a substrate edge hearing apparatus according to an embodiment of the present invention. And FIG. 3 is a process flow chart showing the process flow of the substrate edgehearing apparatus according to an embodiment of the present invention, centering on an index table.

As shown in FIGS. 1 and 2, the composite substrate 10 may include a top panel 11 and a top substrate 11, And the lower panel 12 is formed to be larger than the upper panel 11 and protruded from the upper panel 11. [ A separate connection terminal 13 for electrical connection with an external device is mounted on the protruding portion of the lower panel 12.

A substrate edge healing apparatus using a laser according to an embodiment of the present invention irradiates a laser beam L to the upper edge line E1 of the upper panel 11 and the lower edge line E2 of the lower panel 12 An indexing table 100, a loading unit 300a, an aligning unit 200, a laser unit 400, a reverse unit 800, and an unloading unit 800. The indexing table 100, (300b).

The index table 100 is configured to rotate 360 degrees in a divided manner. On the upper surface of the index table 100, a plurality of substrate seating parts 110 are formed along the circumferential direction corresponding to the split rotation angle, And the composite substrate 10 is supplied and placed on the substrate 110.

The loading unit 300a is configured to receive the composite substrate 10 from a separate supply unit (not shown) and seat the composite substrate 10 on the substrate seating unit 110 of the index table 100. The composite substrate 10 And then transferring the composite substrate 10 to a predetermined position of the index table 100. [0034] FIG.

The alignment unit 200 has a configuration for inspecting the position of the composite substrate 10 whether the composite substrate 10 seated on the index table 100 is seated in the correct position through the loading unit 300a, (Not shown) may be used to check the positional state of the composite substrate 10. The alignment unit 200 includes two mirrors for linearly movably mounting two cameras, which can be applied to composite substrates 10 of various sizes, a mirror for adjusting the angle of view of the camera, and a backlight for illumination . ≪ / RTI > Of course, in addition to this method, it can be configured in various ways to check the position of the composite substrate 10. For example, four corner information on the composite substrate 10 can be obtained by using four cameras fixed in position So that it can be obtained quickly.

The laser unit 400 irradiates the laser beam L along the upper edge line E1 of the upper panel 11 to irradiate the composite substrate 10 with laser beams L, And a secondary healing operation for irradiating the laser beam L along the lower edge line E2 of the lower panel 12 to face the lower edge. The first healing operation and the second healing operation are controlled to be sequentially performed before and after the process of reversing the arrangement state of the composite substrate 10 by the reverse unit 800 described later.

Meanwhile, the laser beam irradiated by the laser unit 400 is preferably applied with a microwave laser beam according to an embodiment of the present invention. The microwave laser has the advantage of being able to cut the material instantaneously with minimal thermal effects on the material, and to cut the cutting surface smoothly and with high quality. According to an embodiment of the present invention, the microwave laser preferably has a wavelength of 200 nm to 800 nm, a pulse width of 100 fs to 20 ps, and a frequency of 200 kHz to 2000 kHz.

The reverse unit 800 is configured to change the vertical arrangement state of the composite substrate 10 so that the arrangement state of the composite substrate 10 mounted on the substrate seating portion 110 of the index table 100 is reversed upside down.

The laser unit 400 and the reverse unit 800 are thus provided to chamfer both the upper edge line E1 and the lower edge line E2 of the composite substrate 10.

For example, as shown in FIG. 2, the laser unit 400 may be configured to irradiate a laser beam L that is spaced apart from the upper portion of the composite substrate 10 and travels downward toward the composite substrate 10 2 (a), when the composite panel 10 is placed in the upper part of the upper panel 11 and the lower panel 12 is in the lower part of the reference state, the upper edge line E1 of the upper panel 11 is chamfered by the laser unit 400 and the primary healing operation is performed as shown in Fig. At this time, the laser unit 400 irradiates the laser beam L in a direction perpendicular to the composite substrate 10, and is controlled to be irradiated with the laser beam L along the upper edge line E1. Thereafter, as shown in FIG. 2 (c), the arrangement of the composite substrate 10 is reversed by the reverse unit 800. That is, the vertically arranged state is reversed by 180 degrees such that the lower panel 12 is positioned on the upper side and the upper panel 11 is positioned on the lower side. When the arrangement state of the composite substrate 10 is reversed in this way, the lower edge line E2 of the lower panel 12 is arranged at the upper end. Thus, as shown in FIG. 2 (d) The lower edge line E2 of the lower panel 12 is chamfered and a secondary healing operation is performed. At this time, the laser unit 400 irradiates the laser beam L in a direction perpendicular to the composite substrate 10, and is controlled to be irradiated with the laser beam L along the lower edge line E2.

The primary healing operation and the secondary healing operation may be performed while the index table 100 is stopped. However, after the primary healing operation, the composite substrate 10 is rotated once with the index table 100 It is preferable that the secondary healing operation is performed in a state where the position of the laser unit 400 is reached again. In this case, the reverse operation of the composite substrate 10 by the reverse unit 800 is configured to be performed in the interval between the primary healing operation and the secondary healing operation. That is, after the composite substrate 10 rotates together with the index table 100 after the primary healing operation by the laser unit 400, the arrangement state is reversed by the reverse unit 800, And is configured to be secondarily healed by the laser unit 400 after rotating together.

The composite substrate 10 is rotated together with the index table 100 in a state where the primary edge healing operation in which the upper edge line E1 is chamfered by the laser unit 400 is completed, And the secondary heeling operation in which the lower edge line E2 is chamfered by the laser unit 400 is completed after the upper and lower placement state is reversed and then rotated together with the index table 100. [

The unloading unit 300b includes a laser unit 400 for mounting the composite substrate 10 in a state where the upper edge line E1 of the upper panel 11 and the lower edge line E2 of the lower panel 12 are chamfered, From the index table (100). The unloading unit 300b may be configured in various ways to grip the composite substrate 10 seated on the index table 100 and to transfer the composite substrate 10 to a separate discharge unit (not shown) located outside the index table 100 , Which can be configured in the same manner as the loading unit 300a described above.

FIG. 3 shows a process chart of an edge healing operation for the composite substrate 10. As shown in FIG. 3, eight substrate seating parts 110 are formed at intervals of 45 degrees on the index table 100 , And the loading unit 300a may be configured to feed and place a new composite substrate 10 on the index table 100 at intervals of 90 degrees, respectively.

The composite substrate 10 supplied in this way is rotated 90 degrees along the index table 100 and its seating position is inspected by the aligning unit 200. Thereafter, when the laser unit 400 is rotated 90 degrees, A first-order heeling operation is performed in which the upper-edge line E1 is chamfered. Thereafter, the composite substrate 10 is further rotated by 135 degrees so that the arrangement of the composite substrate 10 is reversed by the reverse unit 800. At this time, the index table 100 is further rotated by 45 degrees during the reversing operation of the composite substrate 10 by the reverse unit 800, so that the composite substrate 10 is moved to the rear substrate mounting portion 110, respectively. In this state, the position of the composite substrate 10 reversed by the aligning unit 200 is again checked by a 135 ° rotation, and then the laser unit 400 is rotated 90 degrees again. E2) are subjected to the second healing operation. When the secondary healing operation is completed, the wafer is rotated 90 ° in this state and then discharged from the index table 100 by the unloading unit 300b.

The process flow using the index table 100 described above is exemplary and may be changed to various process flows differently according to the needs of the user.

FIG. 4 is a schematic view illustrating a configuration of a loading unit and an unloading unit of a substrate edgehearing apparatus according to an embodiment of the present invention, and FIG. 5 is a cross- 6 is a view schematically showing a configuration of a reverse unit of a substrate edge healing apparatus according to an embodiment of the present invention.

The loading unit 300a and the unloading unit 300b according to an embodiment of the present invention may be configured in the same manner as each other for gripping and transferring the composite substrate 10 as described above, A pressing pad 310 for attaching or detaching the composite substrate 10 in such a manner that the composite substrate 10 is vacuum-pressed or uncompressed through vacuum pressure, a cylinder module 320 for moving the pressing pad 310 up and down And a horizontal transfer module 330 for linearly moving the cylinder module 320 in the horizontal direction.

A separate pneumatic hose (not shown) is connected to the vacuum pipe 312 to supply or supply the vacuum pressure through the pneumatic hose 312. The vacuum pneumatic hose 310 is connected to one end of the vacuum pipe 312, The pressing pad 310 can be configured to attach or detach the composite substrate 10 by the vacuum pressure. The compression pad 310 and the vacuum pipe 312 may be connected to a separate support bracket 311 and the cylinder module 320 may be configured to move the support bracket 311 up and down. The cylinder module 320 is configured in a manner using air pressure or hydraulic pressure. The horizontal transfer module 330 moves the cylinder module 320 in the horizontal direction toward the index table 100 in the close or remote direction.

According to this structure, the pressing pad 310 is vertically or horizontally moved with the composite substrate 10 attached thereto, and the composite substrate 10 is supplied to the index table 100 from a separate storage bin 20, And is discharged from the index table 100 to a separate storage bin 20.

The laser unit 400 includes a laser generator 410 for generating a laser beam L as shown in FIG. 5, a laser generator 410 for reflecting the laser beam L generated from the laser generator 410, A galvanometer 420 for adjusting the traveling path of the laser beam L to be irradiated along the lower edge line E2 and a laser beam L reflected from the galvanometer 420, And a telecentric lens 430 for focusing the laser beam L so as to be irradiated in the vertical direction with respect to the laser beam L. [

That is, the laser beam L generated from the laser generator 410 is reflected by the reflection mirror 421 inside the galvanometer 420, the path of the laser beam is adjusted, and the laser beam L reflected by the reflection mirror 421 (L) passes through the telecentric lens 430 and is configured to be irradiated in a direction perpendicular to the composite substrate 10. At this time, the reflecting mirror 421 of the galvanometer 420 is rotatably mounted so as to adjust the traveling path of the laser beam L, and a plurality of the telecentric lenses 430 are arranged, The laser beam L is always focused along the edge lines E1 and E2 so that the laser beam L is always irradiated to the composite substrate 10 in the vertical direction.

5, since the laser beam L is irradiated in a direction perpendicular to the composite substrate 10, the upper edge line E1 is formed on the upper panel 11 and the lower panel 12, And the lower edge line (E2) can be formed uniformly. The chamfered surface may be shaped in such a manner that its inclination angle is changed as the focal position of the laser beam L is adjusted.

According to this structure, in the course of irradiating the laser beam L along the upper edge line E1 and the lower edge line E2, the laser unit 400 is arranged so that the upper edge line E1 and the lower edge line E2 And the laser beam L is held at a right angle to the upper edge line E1 and the lower edge line E2 by using the galvanometer 420 and the telecentric lens 430. [ Direction. Therefore, the healing process can be performed without moving the laser unit 400 as a whole, so that the work can be performed more quickly, and the overall configuration of the apparatus can be simplified and miniaturized.

6, the reverse unit 800 includes a lift module 810 which is positioned below the index table 100 and feeds the composite substrate 10, which is placed on the index table 100, up and down from the index table 100, And a reversing module 820 for rotating the composite substrate 10 lifted by the lift module 810 up and down to reverse the vertical arrangement state.

The lift module 810 supports the lower surface of the composite substrate 10 and supports the lower surface of the index table 100 so that the composite substrate 10 can be moved up and down. And a lift driving unit 813 coupled to the lift pins 811 to move the lift pins 811 up and down. At this time, the lift pin 811 is supported by a separate supporting bracket 812, and the lift driving unit 813 can move the lift pin 811 up and down by moving the supporting bracket 812 up and down . In addition, the lift driving unit 813 may be formed in a cylinder shape using pneumatic or hydraulic pressure, or may be formed in various forms such as a movable screw type using a motor (not shown) or the like so that the lift pins 811 can be linearly moved in the vertical direction you can change it.

The reversing module 820 includes a reverse fork 821 capable of gripping the composite substrate 10 transported upward by the lift pins 811 and a reverse fork 821 for holding the composite substrate 10 held by the reverse fork 821, A horizontal drive unit 824 for linearly moving the reverse fork 821 in the horizontal direction and a horizontal drive unit 824 for moving the reverse fork 821 in a linear direction And a vertical transfer driving unit 825 for driving the vertical transfer unit 825.

The reverse fork 821 is rotatably coupled to a separate moving block 821-1, and a vacuum compression pad 822 is mounted on one side thereof. The vacuum pressure pad 822 is formed to be able to hold the composite substrate 10 by vacuum pressure and supplies or releases vacuum pressure through an air pressure hose (not shown) (Not shown). The rotation driving unit 823 may be configured as a rotary cylinder using pneumatic or hydraulic pressure and is configured to rotate the reverse fork 821 coupled to the moving block 821-1 by 180 °. The horizontal movement driving unit 824 and the vertical movement driving unit 825 can be configured in various ways such as a cylinder or a motor type so that the moving block 821-1 can be horizontally and vertically conveyed.

According to this structure, when the lift module 810 lifts the composite substrate 10 mounted on the index table 100, the reverse fork 821 is horizontally conveyed by the horizontal feed driving unit 824 in this state, And the lower surface of the composite substrate 10 is gripped through the vacuum compression pad 822. Thereafter, after the reverse fork 821 is moved upward by the vertical feed driving unit 825, the reverse fork 821 is rotated 180 ° by the rotation driving unit 823, The reverse fork 821 is moved downward by the vertical transfer driving unit 825 to move the composite substrate 10 back to the lift pins 811 of the lift module 810 And the lift pins 811 are moved downward and the composite substrate 10 is placed in the inverted position on the index table 100.

The foregoing description is merely illustrative of the technical idea of the present invention and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

10: composite substrate 11: upper panel
12: lower panel 100: index table
200: alignment unit 300a: loading unit
300b: Unloading unit 310: Crimp pad
320: Cylinder module 330: Horizontal feed module
400: laser unit 410: laser generator
420: Galvanometer 430: Telecentric lens
800: Reverse unit 810: Lift module
811: Lift pin 813: Lift driving part
820: Inversion module 821: Reverse fork
823: rotation drive part 824: horizontal feed drive part
825: Vertical feed drive part

Claims (9)

A substrate edge heeling apparatus for chamfering an edge edge portion of a composite substrate composed of an upper panel and a lower panel,
An index table for rotating 360 ° in a divided manner;
A loading unit that seats the composite substrate at a predetermined position of the index table;
An aligning unit for inspecting the position of the composite substrate placed on the index table through the loading unit;
A first healing operation for chamfering an upper edge by irradiating a laser beam along an upper edge line of the upper panel and a second healing operation for chamfering a lower edge by irradiating a laser beam along a lower edge line of the lower panel A laser unit to be operated;
A reverse unit for changing the vertical arrangement state of the composite substrate so that the arrangement state of the composite substrate seated on the index table is reversed; And
And an unloading unit for ejecting the composite substrate having the outer edge portion chamfered by the laser unit from the index table,
Wherein the substrate edge heeling apparatus comprises:
The method according to claim 1,
The composite substrate is rotated together with the index table in a state where the primary healing operation is completed by the laser unit, and then the up-down arrangement state is reversed by the reverse unit. Then, the composite substrate is rotated together with the index table, Wherein the second healing operation is performed by the laser beam.
3. The method of claim 2,
The reverse unit
A lift module positioned below the index table for vertically moving the composite substrate from the index table; And
A reversing module for reversing the vertical arrangement state by rotating the composite substrate raised by the lift module up and down,
Wherein the substrate edge heeling apparatus comprises:
The method of claim 3,
The lift module
A lift pin supporting the lower surface of the composite substrate and moving up and down through the index table at a lower portion of the index table so as to vertically transfer the composite substrate;
A lift driving unit coupled to the lift pins for moving the lift pins up and down,
Wherein the substrate edge heeling apparatus comprises:
5. The method of claim 4,
The inversion module
A reverse fork capable of gripping the composite substrate transported upward by the lift pins;
A rotation driving unit for rotating the reverse fork so that the composite substrate held by the reverse fork is reversed in a vertical direction;
A horizontal feed drive unit for linearly moving the reverse fork in a horizontal direction; And
A vertical feed driving unit for linearly moving the reverse fork in the vertical direction,
Wherein the substrate edge heeling apparatus comprises:
3. The method of claim 2,
The laser unit
Wherein the laser beam is focused in such a way that the focus of the laser beam is positioned at the upper or lower edge line of the composite panel and the laser beam is irradiated in a direction perpendicular to the composite substrate.
The method according to claim 6,
The laser unit
A laser generator for generating a laser beam;
A galvanometer for reflecting a laser beam generated from the laser generator and adjusting a path of the laser beam to be irradiated along an upper or lower edge line of the composite panel; And
A telecentric lens for focusing the laser beam so that the laser beam reflected from the galvanometer is irradiated in a direction perpendicular to the composite substrate;
Wherein the substrate edge heeling apparatus comprises:
The method according to claim 1,
The loading unit and the unloading unit
A pressing pad for attaching or detaching the composite substrate by vacuum pressing or pressing off the composite substrate through vacuum pressure;
A cylinder module for vertically moving the pressing pad; And
A horizontal feed module for linearly moving the cylinder module in a horizontal direction,
Wherein the substrate edge heeling apparatus comprises:
The method according to claim 1,
Wherein the laser beam irradiated by the laser unit is applied as an ultra-violet laser beam, and the laser beam is formed in a wavelength range of 200 nm to 800 nm, a pulse width of 100 fs to 20 ps, and a frequency of 200 kHz to 2000 kHz. A substrate edge healing device used.

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