KR101490322B1 - Laser Champering Apparatus for Substrate - Google Patents

Abstract

The present invention relates to a substrate-chamfering apparatus using a laser, in which a laser beam is irradiated along a chamfering line to a corner of a substrate to perform a chamfering operation of a higher quality with a more accurate and smooth state of a cut surface, The chamfering line can be formed into a straight line or a curved line by performing the chamfering process using the substrate and the chamfering line so that various types of chamfering lines of a suitable shape can be formed according to the type and use of the substrate, The present invention also provides a substrate-chamfering apparatus using a laser, which can reduce the defective rate in the manufacturing process, secure a clearance space due to chamfering, and enable more various types of designs to be implemented.

Description

[0001] The present invention relates to a laser chamfering apparatus for substrate,

The present invention relates to a substrate-chamfering apparatus using a laser. More specifically, it is possible to perform a chamfering process using a laser by irradiating a laser beam along a chamfering line to a corner portion of the substrate, thereby performing a chamfering process with a more accurate and smooth cut surface, The chamfering line can be formed into a straight line or a curved line. Accordingly, it is possible to form various chamfering lines of a suitable shape according to the type and use of the substrate, and to further improve the strength of the substrate, The present invention also relates to a laser abrasive substrate abrading apparatus capable of ensuring a free space due to chamfering and realizing more various types of designs.

2. Description of the Related Art Recently, various electronic devices such as a mobile phone, a PDA, a computer, and a large-sized TV have been developed.

Such a flat display device has been actively studied for a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED), a vacuum fluorescent display (VFD), and an organic light emitting diode (OLED) Liquid crystal displays (LCDs) have been widely used for reasons of ease of driving means and high image quality. However, recently, due to the development of technology, various devices are being used more and more.

The substrate used for such a flat panel display device is generally configured in the form of a lower panel on which various devices and the like are mounted and a composite substrate on which an upper panel is coupled to the upper panel. The composite panel is configured such that the lower panel is larger in size than the upper panel, so that the lower panel protrudes from one side of the upper panel, and a separate part for electrical connection with an external device is formed on one side of the protruded lower panel. Are disposed.

According to such a structure, there is a problem that the protruded portion of the lower panel of the composite substrate is relatively weak in the manufacturing process due to the relatively low strength. Particularly, such breakage occurred at the corner portion of the lower panel.

In recent years, display devices and composite substrates used therefor have been required to be more slim and compact in design due to the trend of ultra-thinness of various electronic devices. Therefore, There is a problem that it occurs more frequently in the whole process such as a process.

In addition, in recent years, studies have been made to apply a substrate used for a display device or the like to a single substrate composed of only a lower substrate instead of a composite substrate composed of a top substrate and a lower substrate. In this case, .

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a high-quality chamfering work by accurately irradiating a laser beam along a chamfering line to a corner of a substrate, And to provide a substrate-chamfering device using the laser that can be performed.

It is another object of the present invention to provide a method and apparatus for forming a chamfering line by forming a chamfering line in a straight line or a curved line by performing a chamfering process on a corner portion of a substrate by using a laser, It is possible to variously form the furring line and further improve the strength of the substrate, thereby reducing the defect rate in the manufacturing process, securing the space for chamfering, And to provide a substrate chucking apparatus using the same.

It is still another object of the present invention to provide a laser processing apparatus and a laser processing method which can irradiate a laser beam along a chamfering line while fixing a laser unit, Thereby providing a furring device.

According to the present invention, there is provided a substrate chamfering apparatus for chamfering a corner portion of a substrate, comprising: an index table for rotating the substrate by 360 degrees; A loading unit for placing the substrate on the index table; An aligning unit for inspecting the position of the substrate placed on the index table through the loading unit; A laser unit capable of cutting a corner portion of a substrate by irradiating a laser beam along a chamfering line to a corner portion of the substrate; And an unloading unit for unloading the chamfered substrate from the index table by cutting the edge portions of the substrate.

At this time, the chamfering line irradiated with the laser beam of the laser unit may be formed as a straight line or a curved line.

At this time, when the chamfering line is formed into a curve, the laser unit may be controlled to be operated to irradiate a laser beam along the chamfering line to cut a corner portion with respect to the substrate.

Further, when the chamfering line is formed in a straight line, the laser unit is controlled to operate a laser beam along the chamfering line to form a scribing line at a corner portion with respect to the substrate, And a braking cutting unit for braking and cutting the edge portion of the substrate along the formed scribing line.

The braking and cutting unit may include a cutting pin for bending and cutting a corner portion of the substrate downward; A pin driving module for vertically moving the cutting pin; A braking pad disposed at a lower portion of the cutting pin so as to support a corner portion of the substrate cut by the cutting pin so as to be elastically movable upward and downward; And an air blower that blows air to remove a cutting piece seated on the breaking pad.

Further, the loading unit and the unloading unit may include a compression pad for attaching or detaching a substrate in a vacuum press or a press release state of the substrate through vacuum pressure; A cylinder module for vertically moving the pressing pad; And a horizontal transfer module for linearly moving the cylinder module in a horizontal direction.

The laser unit may further include a laser generator for generating a laser beam; A galvanometer which reflects the laser beam generated from the laser generator and adjusts the path of the laser beam to be irradiated along the chamfering line; And a telecentric lens for focusing the laser beam such that the laser beam reflected from the galvanometer is irradiated in a direction perpendicular to the substrate.

Meanwhile, the laser beam irradiated by the laser unit is applied as a microwave laser beam, and the microwave laser beam may have a wavelength of 500 nm to 1100 nm, a pulse width of 100 fs to 20 ps, and a frequency of 200 kHz to 2000 kHz.

According to the present invention, a laser beam is irradiated along a chamfering line to a corner portion of a substrate, thereby achieving a more accurate and high-quality chamfering work with a smooth cutting surface.

Further, by chamfering the corners of the substrate by using a laser, the chamfering line can be formed into a straight line or a curved line, so that chamfering lines of a suitable shape can be variously In addition, it is possible to further improve the strength of the substrate, to reduce the defective rate in the manufacturing process, to secure a clearance space due to chamfering, and to realize more various forms of design implementation.

Further, by allowing the laser beam to be irradiated along the chamfering line in a state where the laser unit is fixed, it is possible to perform a more rapid process, and the structure of the entire device can be simplified and miniaturized.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view schematically showing the configuration of a substrate-chamfering apparatus according to an embodiment of the present invention;
FIG. 2 and FIG. 3 are schematic views illustrating a procedure of a chamfering process using a substrate-chamfering apparatus according to an embodiment of the present invention. FIG.
FIG. 4 is an exemplary illustration of the shape of a chamfering line through a substrate-chamfering apparatus according to an embodiment of the present invention;
5 is a schematic view illustrating a configuration of a loading unit and an unloading unit of a substrate-chamfering apparatus according to an embodiment of the present invention;
6 is a schematic view illustrating a configuration of a laser unit of a substrate-chamfering apparatus according to an embodiment of the present invention;
7 is a view schematically showing a configuration of a breaking cutting unit of a substrate-chamfering apparatus according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

FIG. 1 is a schematic view schematically showing the configuration of a substrate-chamfering apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 illustrate a procedure of a chamfering process using a substrate-chamfering apparatus according to an embodiment of the present invention FIG. 4 is an exemplary view showing the shape of a chamfering line through a substrate-chamfering apparatus according to an embodiment of the present invention. FIG.

First, the composite substrate 10 may be a substrate used for various flat display devices as described in the related art. Such a composite substrate 10 may include an upper panel 11, And the lower panel 12 is formed to be larger than the upper panel 11 and protruded from the upper panel 11. [ A separate connection terminal 13 for electrical connection with an external device is mounted on the protruding portion of the lower panel 12.

The apparatus for chamfering a substrate using a laser according to an embodiment of the present invention includes a device for chamfering a corner portion of a lower panel 12 protruding from the upper panel 11 with respect to the composite substrate 10 using a laser beam And a braking cutting unit 500. The braking cutting unit 500 includes an index table 100, a loading unit 300a, an aligning unit 200, a laser unit 400 and an unloading unit 300b. .

The index table 100 is configured to rotate 360 degrees in a divided manner. On the upper surface of the index table 100, a plurality of substrate seating parts 110 are formed along the circumferential direction corresponding to the split rotation angle, And the composite substrate 10 is supplied and placed on the substrate 110.

The loading unit 300a is configured to receive the composite substrate 10 from a separate supply unit (not shown) and seat the composite substrate 10 on the substrate seating unit 110 of the index table 100. The composite substrate 10 And then transferring the composite substrate 10 to a predetermined position of the index table 100. [0034] FIG.

The alignment unit 200 has a configuration for inspecting the position of the composite substrate 10 whether the composite substrate 10 seated on the index table 100 is seated in the correct position through the loading unit 300a, (Not shown) may be used to check the positional state of the composite substrate 10. The alignment unit 200 includes two mirrors for linearly movably mounting two cameras, which can be applied to composite substrates 10 of various sizes, a mirror for adjusting the angle of view of the camera, and a backlight for illumination And may be configured in various manners in which the position of the composite substrate 10 can be inspected.

The laser unit 400 is configured to irradiate a laser beam L along a chamfering line C to an edge portion of the lower panel 12 by irradiating the laser beam L Cutting the corner portions of the lower panel 12 along the chamfering line C or forming a scribing line. If the laser unit 400 is controlled so as to form a scribing line at a corner of the lower panel 12, the edge of the lower panel 12 may be separately cut to be cut along the scribing line The braking / cutting unit 500 may be further provided.

2, the laser unit 400 irradiates the laser beam L along the chamfering line C to the edge of the lower panel 12 with respect to the composite substrate 10, And the edge portion C1 of the lower panel 12 is pulled and cut by the beam L. [ The laser unit 400 irradiates the laser beam L along the chamfering line C to the edge of the lower panel 12 with respect to the composite substrate 10 as shown in Fig. The scribing line is formed along the chamfering line C by the bending cutting unit 500 and the edge portion C1 of the lower panel 12 is cut by the breaking cutting unit 500 in the state where the scribing line is formed May be configured to be cut along the crying line.

As described above, the laser unit 400 may be configured to cut the edges of the lower panel 12 to a full cut or to form scribe lines, which may be variously set according to the needs of the user. For example, to speed up the chamfering process, the laser unit 400 may be configured to form a scribe line and perform a cutting operation using the braking cut unit 500, and the accuracy of the chamfering process and / It can be configured to be pull-cut by the laser unit 400 for high quality of the cut surface.

Particularly, in the present invention, since the chamfering operation is performed using the laser unit 400, the chamfering line C formed at the corner of the lower panel 12 can be formed into a straight line or a curved line, Depending on the type of the furring line C, the laser unit 400 can be configured to be either full-cut or to form a scribe line.

For example, in the case where the chamfering line C is formed in a straight line, since the braking cutting operation can be performed relatively precisely, the laser unit 400 can be moved to the chamfering line C It is preferable to form the scribing line in a straight line shape and cut the edge portion of the lower panel 12 through the breaking cutting unit 500. On the other hand, when the chamfering line C is formed as a curved line, the accuracy of the breaking cutting operation is relatively reduced, so that the edge portion of the lower panel 12 along the chamfering line is cut by the laser unit 400, .

The chamfering line C may be formed in various shapes, such as a straight line and a curved line, as shown in FIG. 4. In addition, the chamfering line C may be changed into various other forms according to the needs of the user. Since the various types of chamfering lines C are possible in this way, it is possible to form chamfering lines C of a suitable shape according to the type of the composite substrate 10, thereby further improving the strength, By chamfering the unnecessary portions, it is possible to secure a clearance space and realize more various component mounting arrangement state and design.

Meanwhile, the laser beam irradiated by the laser unit 400 is preferably applied with a microwave laser beam according to an embodiment of the present invention. The microwave laser has the advantage of being able to cut the material instantaneously with minimal thermal effects on the material, and to cut the cutting surface smoothly and with high quality. According to an embodiment of the present invention, the microwave laser preferably has a wavelength of 500 nm to 1100 nm, a pulse width of 100 fs to 20 ps, and a frequency of 200 kHz to 2000 kHz.

The unloading unit 300b is configured to remove the edge of the lower panel 12 by the laser unit 400 or the breaking cutting unit 500 and discharge the chamfered composite substrate 10 from the index table 100 (Not shown) positioned outside the index table 100. The index plate 100 may be configured in various manners, such as the above-described method of holding the composite substrate 10 held on the index table 100, And may be configured in the same manner as the loading unit 300a.

1, the loading unit 300a, the aligning unit 200, the laser unit 400, the braking cutting unit 500, and the unloading unit 300b are disposed in the rotational direction of the index table 100 A separate inspection unit 600 may be provided between the breaking cutting unit 500 and the unloading unit 300b and may be separately provided between the unloading unit 300b and the loading unit 300a. A cleaning unit 700 may be further provided. The composite substrate 10 having the edge portions of the lower panel 12 cut by the laser unit 400 or the breaking cutting unit 500 and subjected to the chamfering treatment is removed from the index table 100 by the unloading unit 300b. And the chamfered state is checked through the inspection unit 600 before being discharged from the index table 100. After the composite substrate 10 is discharged by the unloading unit 300b, Is cleaned by the unit (700).

Next, the detailed configuration will be described in more detail with reference to Figs. 5 to 7.

FIG. 5 is a schematic view illustrating a configuration of a loading unit and an unloading unit of a substrate-chamfering apparatus according to an embodiment of the present invention, and FIG. 6 is a cross- FIG. 7 is a view schematically showing a configuration of a breaking cutting unit of a substrate-chamfering apparatus according to an embodiment of the present invention. FIG.

The loading unit 300a and the unloading unit 300b according to an embodiment of the present invention may be configured in the same manner as each other for gripping and transferring the composite substrate 10 as described above, A pressing pad 310 for attaching or detaching the composite substrate 10 in such a manner that the composite substrate 10 is vacuum-pressed or uncompressed through vacuum pressure, a cylinder module 320 for moving the pressing pad 310 up and down And a horizontal transfer module 330 for linearly moving the cylinder module 320 in the horizontal direction.

A separate pneumatic hose (not shown) is connected to the vacuum pipe 312 to supply or supply the vacuum pressure through the pneumatic hose 312. The vacuum pneumatic hose 310 is connected to one end of the vacuum pipe 312, The pressing pad 310 can be configured to attach or detach the composite substrate 10 by the vacuum pressure. The compression pad 310 and the vacuum pipe 312 may be connected to a separate support bracket 311 and the cylinder module 320 may be configured to move the support bracket 311 up and down. The cylinder module 320 is configured in a manner using air pressure or hydraulic pressure. The horizontal transfer module 330 moves the cylinder module 320 in the horizontal direction toward the index table 100 in the close or remote direction.

According to this structure, the pressing pad 310 is vertically or horizontally moved with the composite substrate 10 attached thereto, and the composite substrate 10 is supplied to the index table 100 from a separate storage bin 20, And is discharged from the index table 100 to a separate storage bin 20.

The laser unit 400 includes a laser generator 410 for generating a laser beam L as shown in FIG. 6, a laser beam generator 400 for reflecting the laser beam L generated from the laser generator 410, And a laser beam L reflected from the galvanometer 420 is irradiated in a direction perpendicular to the lower panel 12 so that the laser beam L reflected from the galvanometer 420 is irradiated And a telecentric lens 430 for focusing the laser beam L. [

That is, the laser beam L generated from the laser generator 410 is reflected by the reflection mirror 421 inside the galvanometer 420, the path of the laser beam is adjusted, and the laser beam L reflected by the reflection mirror 421 (L) is configured to pass through the telecentric lens 430 and to be irradiated in a direction perpendicular to the lower panel 12. At this time, the reflecting mirror 421 of the galvanometer 420 is rotatably mounted so as to adjust the traveling path of the laser beam L, and a plurality of the telecentric lenses 430 are arranged, The laser beam L is focused along the chamfering line C so that the laser beam L is always irradiated in a direction perpendicular to the lower panel 12. [

Since the laser beam L is irradiated in a direction perpendicular to the lower panel 12 as described above, as shown in the enlarged view of FIG. 6, the lower panel 12 is provided with uniformity One type of cutting line can be formed. At this time, by adjusting the focal position of the laser beam L, the edge portion of the lower panel 12 can be cut by a full cut or a scribing line can be formed.

According to this structure, the laser unit 400 is kept in a fixed state without moving along the chamfering line C in the process of irradiating the laser beam L along the chamfering line C, The laser beam L is irradiated in a direction perpendicular to the chamfering line C using the laser beam 420 and the telecentric lens 430. [ Therefore, the chamfering process can be performed without moving the laser unit 400 as a whole, so that the work can be performed more quickly, and the configuration of the whole apparatus can be simplified and miniaturized.

The braking cutting unit 500 is a device for breaking the edge portions of the lower panel 12 formed with the scribing lines along the chamfering line C by the laser unit 400 as shown in Fig. A pin driving module 520 for vertically and linearly moving the cutting pin 510 and a cutting pin 510 for cutting and cutting the edge of the lower panel 12 by a cutting pin 510. [ A breaking pad 530 disposed on the lower portion of the cutting pin 510 to vertically and elastically movably disposed to support a corner portion of the lower panel 12 to be cut, And an air blower 540 that blows air.

The cutting pin 510 is coupled to a separate movable block 511, and the pin driving module 520 is configured to move the movable block 511 up and down. The pin drive module 520 may be configured in various forms such as a cylinder type or a lead screw type by a motor. The breaking pad 530 is mounted so as to be vertically and elastically movable with an elastic spring 531 mounted thereunder and is arranged to support the corner portion of the lower panel 12 upward in a state in which the cutting pin 510 is not pressed downward The cutting pin 510 moves downward together with the corner of the lower panel 12 as the lowering pin 510 is pressed downward to assist smooth and stable cutting of the corner of the lower panel 12. [ The air blower 540 is configured to blow air onto the upper surface of the breaking pad 530 such that the corner of the lower panel 12 is not left on the upper surface of the breaking pad 530 in a cut state.

At this time, the breaking pad 530 may be formed in a simple block shape so that the horizontal surface supports the edge portion of the lower panel 12, but otherwise, the breaking pad 530 may be formed in a cylindrical shape, Or may be formed in a shape that supports the corner portion. At this time, when the breaking pad 530 is formed in a cylindrical shape, the breaking pad 530 may be mounted to rotate about a longitudinal axis, that is, the circumferential surface of the breaking pad 530 may be rotated, The cut edge portion of the lower panel 12 can be easily separated from the breaking pad 530 in contact with the breaking pad 530. [

Although the chamfering apparatus according to an embodiment of the present invention has been described as cutting the corner of the lower panel 12 of the composite substrate 10 as described above, the chamfering apparatus according to the present invention is not limited to the composite substrate 10 The same method can be applied to a single substrate. That is, a corner portion of a single substrate can be cut using a laser beam in the same manner as the above-described cutting method. For example, in the case of a single substrate in the form of a quadrangle, chamfering may be performed by cutting all four corner portions along a straight or curved chamfering line. Of course, either a full cut using a laser beam or a laser beam to form a scribing line and cutting through a breaking cutting unit can be applied.

The foregoing description is merely illustrative of the technical idea of the present invention and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

10: composite substrate 11: upper panel
12: lower panel 100: index table
200: alignment unit 300a: loading unit
300b: Unloading unit 310: Crimp pad
320: Cylinder module 330: Horizontal feed module
400: laser unit 410: laser generator
420: Galvanometer 430: Telecentric lens
500: breaking cutting unit 510: cutting pin
520: pin drive module 530: breaking pad
540: Air blower 600: Inspection unit
700: Cleaning unit

Claims (8)

A substrate chamfering apparatus for chamfering corner portions of a substrate,
An index table for rotating 360 ° in a divided manner;
A loading unit for placing the substrate on the index table;
An aligning unit for inspecting the position of the substrate placed on the index table through the loading unit;
A fixed laser unit for irradiating a laser beam along a chamfering line to a corner portion of the substrate in a direction perpendicular to the substrate to form a scribing line at an edge portion of the substrate;
A braking cutting unit braking and cutting a corner portion of the substrate along a scribe line formed by the one laser unit; And
And an unloading unit for discharging the chamfered substrate from the index table,
The braking and cutting unit
A cutting pin for bending and cutting the edge portion of the substrate downward;
A pin driving module for vertically moving the cutting pin;
A braking pad formed in a cylindrical shape and arranged to be movable up and down under the cutting pin so as to support a corner portion of the substrate cut by the cutting pin at a lower portion of the substrate; And
And an air blower for blowing air to remove a cutting piece seated on the breaking pad,
Wherein the breaking pad is rotatable about a longitudinal axis of the cylindrical shape.
The method according to claim 1,
Wherein the chamfering line to which the laser beam of the one laser unit is irradiated is formed in a straight line or a curved line.
3. The method of claim 2,
Wherein when the chamfering line is formed into a curved line, the one laser unit is controlled to irradiate a laser beam along the chamfering line to cut a corner portion with respect to the substrate.
3. The method of claim 2,
Wherein the one laser unit is operatively controlled to irradiate a laser beam along the chamfering line to form a scribe line at a corner of the substrate when the chamfering line is formed in a straight line, Furring device.
delete 5. The method according to any one of claims 1 to 4,
The loading unit and the unloading unit
A pressing pad for attaching or detaching the substrate by vacuum pressing or pressing off the substrate through vacuum pressure;
A cylinder module for vertically moving the pressing pad; And
A horizontal feed module for linearly moving the cylinder module in a horizontal direction,
Wherein the substrate is a substrate.
5. The method according to any one of claims 1 to 4,
The one laser unit
A laser generator for generating a laser beam;
A galvanometer which reflects the laser beam generated from the laser generator and adjusts the path of the laser beam to be irradiated along the chamfering line; And
And a telecentric lens for focusing the laser beam such that the laser beam reflected from the galvanometer is directed in a direction perpendicular to the substrate.
5. The method according to any one of claims 1 to 4,
Wherein the laser beam irradiated by the one laser unit is applied as a microwave laser beam and the microwave laser beam is formed in a range of a wavelength of 500 nm to 1100 nm, a pulse width of 100 fs to 20 ps, and a frequency of 200 kHz to 2000 kHz Substrate chamfering device.

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