KR101913579B1 - Apparatus for etching substrates - Google Patents

Abstract

A top-down substrate etching apparatus is disclosed. A top-down type substrate etching apparatus according to the present invention includes a stage unit having a chucking module disposed inside a vacuum chamber in which an etching process for a substrate is performed and attaching a substrate loaded into the vacuum chamber, A flip unit supported by the unit and flipping the chucking module; a clamping unit supported on the chucking module and clamping an edge region of the substrate; a clamping unit supported on the chucking module and supporting a central region of the substrate in a flipping process of the chucking module And a central zone support unit.

Description

[0001] Apparatus for etching substrates [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a top-down type substrate etching apparatus, and more particularly, to a top-down substrate etching apparatus capable of easily chucking a substrate having a large area.

As a result of the rapid development of information and communication technology and the expansion of the market, a flat panel display is attracting attention as a display device.

Such flat panel display devices include a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (PDP) display.

Among them, the organic light emitting diode (OLED) display has advantages such as a fast response speed, lower power consumption than a conventional liquid crystal display (LCD), light weight, no need for a separate backlight device, And has a very good merit such as high brightness.

Organic light emitting diode displays (OLED displays) can be divided into passive PMOLEDs and active AMOLEDs depending on the driving method. In particular, AMOLED is a self-emissive display that has a faster response speed than conventional displays, has a natural color and has low power consumption. In addition, if AMOLED is applied to film, not substrate, it can implement the technology of flexible display.

The organic light emitting diode display (OLED display) is manufactured through a pattern forming process, an organic thin film deposition process, an etching process, a sealing process, and a deposition process in which an organic thin film is deposited and a substrate is subjected to a sealing process. Can be produced.

On the other hand, among the various processes, the etching process is a process of obtaining a desired shape by etching or etching an unnecessary portion of the surface of the substrate by a physical or chemical method.

In the etching process, various methods such as physical or chemical methods are used like semiconductor, and one of them is a laser etching method. The etching method of the substrate by the laser is simpler in structure and reduces the etching time compared to other methods, and is widely adopted in recent years.

FIG. 1 is a schematic view of a general top-down type substrate etching apparatus, and FIG. 2 is a view showing a state where deflection occurs in a central region of a substrate when chucking a large area substrate.

As shown in these drawings, in the case of a general top down type substrate etching apparatus, a structure in which a substrate to be etched is disposed on an upper portion and a laser module 10 for irradiating a laser beam to a lower portion of the substrate is disposed .

The substrate is disposed inside the vacuum chamber, while the laser module 10 is disposed outside the vacuum chamber, and irradiates the laser beam onto the substrate at that position. At this time, a transparent chamber window (20) through which the laser beam passes is interposed in the wall surface of the vacuum chamber where the laser module (10) is disposed.

When the laser module 10 positioned outside the chamber window 20 irradiates the laser beam, the laser beam is irradiated onto the substrate through the chamber window 20, thereby etching an unnecessary portion of the substrate.

On the other hand, the substrate loaded in the vacuum chamber is chucked to the electrostatic chuck 30 before the etching process is performed through the top-down substrate etching apparatus. At this time, the substrate is lifted by the lifting pin (40) which is in contact with the lower surface of the substrate and is chucked to the electrostatic chuck (30).

The lift pins 40 are brought into contact with the edge areas of the substrate, as shown in Fig. 2, in order to prevent contamination of organic substances deposited on the substrate.

However, when the large-area substrate is used, when the lift pin 40 contacts only the edge region of the substrate, sagging occurs due to the load in the central region of the substrate, as shown in Fig. Such sagging of the central region of the substrate weakens the adhesion of the electrostatic chuck 30, so that the substrate is not attached to the electrostatic chuck 30.

Therefore, it is possible to attach the large area substrate to the electrostatic chuck 30 easily by attaching the central area of the large area substrate to the electrostatic chuck 30 while using the downward etching method, It is necessary to develop a top-down type substrate etching apparatus capable of preventing the substrate from being damaged by an impact in the process of adhering it to the substrate.

Korean Patent Publication No. 10-2007-0013776, (2008.08.13.)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a chucking method capable of easily chucking a substrate having a large area by preventing a central area of the substrate from being sagged when chucking a large area substrate, Type substrate etching apparatus capable of preventing a substrate from being deteriorated.

According to an aspect of the present invention, there is provided a stage unit including a chucking module disposed inside a vacuum chamber in which an etching process for a substrate is performed, the chucking module attaching a substrate loaded into the vacuum chamber; A flip unit supported by the stage unit, the flip unit flipping the chucking module; A clamping unit supported by the chucking module and clamping an edge region of the substrate; And a central area support unit supported by the chucking module and supporting a central region of the substrate in the flipping process of the chucking module.

The flip unit includes: a flip center shaft coupled to the chucking module; And a flip driver connected to the flip center axis for rotating the flip center axis.

The flip unit may further include an encoder for a central axis connected to the flip center axis and recognizing a rotation angle of the flip center axis.

The central region supporting unit includes: a central region supporting module for supporting the substrate; And a transfer module for the support module, which is connected to the central area support module and moves the central area support module in a direction in which the central area support module is moved toward and away from the substrate.

The central region supporting module includes: a central region supporting portion contacting the substrate; And a frame part for the support part coupled to the center area support part and connected to the movement module for the support module.

The central region supporting portion includes: a supporting body coupled to the frame portion for the supporting portion; And a support pin coupled to the support body and contacting the substrate.

The central region support portions may be provided in a plurality of locations spaced apart from each other, and the central region support portions may be formed in a shape that the length from the central region of the substrate to the edge region of the substrate becomes smaller with reference to the frame portion for the support portion have.

The moving module for the supporting module includes a guide frame part for the moving module, which is connected to the frame part for the supporting part, and guides the movement of the frame part for the supporting part; And a driving part for the supporting part, which is supported by the guide frame part for the moving module and is connected to the frame part for the supporting part to move the frame part for the supporting part.

Wherein the guide frame part for the mobile module comprises: a support plate for the mobile module to which the driving part for the support part is connected; A guide shaft for the transfer module coupled to the support plate for the transfer module; And a ball bush for a moving module, which is slidably connected to the guide shaft for the moving module, and to which the frame part for the supporting part is coupled.

The driving unit for the supporting unit includes: a moving nut for the supporting unit coupled to the frame unit for the supporting unit; A ball screw for a support part engaged with the moving nut for the support part; And a driving motor for rotating the ball screw for the supporting part.

Wherein the clamping unit comprises a detachable clamping unit for depressing the substrate attached to the chucking module to detach the substrate from the chucking module, the detachable clamping unit comprising: A support module for clamping; And a clamping pressure module for pressing the substrate with a clamping support module.

Wherein the clamping pressing module includes: a clamping pressing part connected to the substrate and pressing the substrate; And a driving unit for the pressing module, which is connected to the clamping pressing unit and moves the clamping pressing unit in a direction in which the clamping pressing unit approaches and separates from the substrate.

Wherein the clamping pressurizing portion includes: a pressing contact portion contacting the substrate; And a contact portion frame portion connected to the pressing contact portion and connected to the driving portion for the pressing module.

Wherein the pressing contact portion comprises: a contact portion body which is movably coupled to the frame portion for the contact portion; A contact pin coupled to the contact body and contacting the substrate; And an elastic body supported by the frame portion for the contact portion and connected to the contact portion body to elastically bias the contact portion body toward the substrate.

Wherein the driving unit for the pressing module includes a guide frame part for the pressing module, the frame part for the contact part being connected to the frame part for guiding movement of the frame part for the contact part; And a clamping pressure driver supported by the guide frame part for the pressing module and connected to the frame part for the contact part to move the frame part for the contact part.

Wherein the guide frame portion for the pressing module includes: a supporting plate for the pressing module to which the pressing driving portion for clamping is connected; For the pressure module A guide shaft for the pressure module coupled to the support plate; And a ball bush for a pressure module, which is slidably connected to the guide shaft for the pressure module, and to which the frame part for the contact part is coupled.

Wherein the clamping pressure driver includes: a moving nut for a pressing module coupled to the frame portion for the contact portion; A ball screw for a pressing module engaged with the moving nut for the pressing module; And a driving motor for the pressing module for rotating the ball screw for the pressing module.

Wherein the clamping support module comprises: a clamping holder part arranged to be spaced apart from the chucking module by a predetermined distance, the clamping holder part contacting the substrate to support the substrate; And a bracket part for supporting the clamping holder part and connected to the chucking module.

Embodiments of the present invention include a flip unit that flips the chucking module to remove sag generated in the central region of the substrate through the flip of the chucking module and includes a clamping unit for clamping the edge region of the substrate, A process for preventing the substrate from falling in the process of flipping the module and having a central area supporting unit for supporting the central area of the substrate on which the deflection is generated so that the deflection generated in the central area of the substrate is removed by the flip of the chucking module It is possible to prevent the substrate from being damaged by an impact caused by a change in deflection direction.

1 is a schematic view of a general top down type substrate etching apparatus.
2 is a view showing a state in which a deflection occurs in a central region of the substrate when chucking a large area substrate.
3 is a diagram illustrating a top down substrate etching apparatus according to an embodiment of the present invention.
Fig. 4 is a side view of the top-down substrate etching apparatus of Fig. 3 taken in another direction.
5 is a perspective view of the stage unit of Fig.
Fig. 6 is a plan view of Fig. 5. Fig.
Fig. 7 is a view showing the central area support unit of Fig. 5. Fig.
Fig. 8 is a sectional view of Fig. 7. Fig.
Fig. 9 is a sectional view showing the pressing module for clamping in the detachable clamping unit of Fig. 5; Fig.
10 is a view showing a positioning unit provided in the stage unit of FIG.
11 and 12 are operation state diagrams showing a process in which the substrate is attached to the chucking module.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in order to avoid unnecessary obscuration of the present invention.

Meanwhile, the substrate described below may be a glass substrate for an organic light emitting diode display (OLED display).

FIG. 3 is a view showing a top-down type substrate etching apparatus according to an embodiment of the present invention, FIG. 4 is a view showing the top-down type substrate etching apparatus of FIG. 3 from another direction, Fig. 6 is a plan view of Fig. 5, Fig. 7 is a view showing the central area support unit of Fig. 5, Fig. 8 is a sectional view of Fig. 7, and Fig. 9 is a cross- Fig. 10 is a view showing a positioning unit provided in the stage unit of Fig. 3, and Figs. 11 and 12 are operational state diagrams showing the process of attaching the substrate to the chucking module. In FIG. 3, the illustration of the stage moving unit 150 is omitted for convenience of explanation.

3 to 12, the top-down type substrate etching apparatus according to the present embodiment includes a vacuum chamber 110 in which an etching process for a substrate is performed, a substrate 110 mounted inside the vacuum chamber 110, A flip unit 200 which is supported on the stage unit 120 and flips the chucking module 121, and a chucking module 120 which is attached to the stage unit 120 and flips the chucking module 121. The chucking module 121 includes a chucking module 121, A central region support unit 400 supported by the chucking module 121 and supporting a central region of the substrate in the flipping process of the chucking module 121; A positioning unit 500 which is supported on the stage unit 120 and is connected to the chucking module 121 to fix the chucking module 121 to the reference position, A stage moving unit 150 for moving the vacuum chamber 110, And a laser beam irradiating the substrate in the vacuum chamber 110 through a first chamber window 111 provided in the vacuum chamber 110 to perform an etching process, (160).

The substrate of this embodiment is a single-sided substrate provided with a non-effective area (not shown) in the edge region of the substrate. The ineffective area is a portion where the substrate subjected to the etching process is removed in the course of processing into the display panel.

Other regions of the substrate other than the ineffective region correspond to an effective area, and an organic material is deposited in the effective region. This effective area is provided on one side of both sides of the substrate. In the case of the substrate of this embodiment shown in Fig. 3, the effective area is provided on the lower surface of the substrate facing the laser unit 160. [

The vacuum chamber 110 is a box-like structure as shown in FIGS. 3 and 4, in which the etching process for the substrate proceeds. A gate valve (not shown) is provided on one side wall of the vacuum chamber 110 to allow the substrate to enter and exit.

A first chamber window 111 is provided on a bottom surface of the vacuum chamber 110 and a second chamber window 112 is provided on an upper surface of the vacuum chamber 110. The first chamber window 111 is a window through which a laser beam of a specific wavelength can pass and a laser beam from a laser unit 160 disposed outside the vacuum chamber 110 is transmitted into the vacuum chamber 110 It is a place.

The second chamber window 112 is a window through which a laser beam of a specific wavelength can pass as in the case of the first chamber window 111. A laser beam passed through the inside of the vacuum chamber 110 is emitted outside the vacuum chamber 110 And the laser beam inside the vacuum chamber 110 is transmitted to the outside of the vacuum chamber 110 so as to be transmitted to the arranged laser output measurement unit S. [

A plurality of first chamber windows 111 may be provided on the bottom surface of the vacuum chamber 110 and a plurality of second chamber windows 112 may be provided on the top surface of the vacuum chamber 110.

A chamber window protecting portion 113 having a protection window (not shown) for blocking the first chamber window 111 is provided on the bottom surface of the vacuum chamber 100.

On the other hand, the stage unit 120 is disposed inside the vacuum chamber 110. The stage unit 120 includes a chucking module 121 for attaching a substrate loaded into the vacuum chamber 110. The chucking module 121 is disposed in the lower end region of the stage unit 120 and contacts the upper surface portion of the substrate.

In this embodiment, an electrostatic chuck (ESC) is used as the chucking module 121, and the scope of the present invention is not limited thereto. Various chucking devices capable of attaching the substrate are provided in the chucking module 121).

A substrate is attached to the lower end of the chucking module 121 and a through hole is formed at the lower end of the chucking module 121 so that the contact pin 333 and the support pin 413, .

On the other hand, the flip unit 200 is supported by the stage unit 120 and flips the chucking module 121. In this embodiment, the chucking module 121 is flipped at a 180 degree angle. Therefore, the substrate arranged in the downward direction as shown in Fig. 11 is arranged in the upward direction as shown in Figs. 12 (a) and 12 (b) by the flip of the chucking module 121, And is arranged again in the downward direction as shown in FIG. 12 (c) by re-inversion of the chucking module 121.

The flip of the chucking module 121 by the flip unit 200 is a phenomenon that the adhesion force of the chucking module 121 is weakened due to sag generated in the central region of the substrate and the substrate is not attached to the chucking module 121 .

When the upper surface of the substrate is attached to the chucking module 121 in order to etch a large area substrate downward, deflection occurs in the central region of the substrate due to the load of the substrate, Thereby weakening the adherence force.

As described above, since the effective area is disposed on the lower surface of the substrate, it is possible to use a method of pressing a central region of the substrate with the chucking module 121 by bringing another lift pin (not shown) into contact with the central area of the substrate none.

The flip unit 200 of the present embodiment inverts the chucking module 121 so that the central region of the substrate on which deflection is generated is brought into close contact with the chucking module 121 in a non-contact manner.

That is, as shown in FIG. 11, when the substrate on which the deflection is generated in the central region of the substrate is disposed in the upward direction by the inversion of the chucking module 121, as shown in FIG. 12 (b) The central region of the substrate is brought into close contact with the chucking module 121 so that the substrate is completely attached to the chucking module 121. [

12 (c) due to the re-inversion of the chucking module 121, the substrate is completely attached to the chucking module 121, so that the center of the substrate No deflection occurs in the area.

As described above, the top-down type substrate etching apparatus according to the present embodiment includes the flip unit 200 that flips the chucking module 121 so that deflection generated in the central region of the substrate during chucking of the large- The substrate can be removed through the flip of the substrate 121, and thus the large-area substrate can be easily attached to the chucking module 121.

In this embodiment, the flip units 200 are provided in pairs as shown in Figs. 5 and 6, and are disposed apart from each other with the chucking module 121 interposed therebetween.

The flip unit 200 according to the present embodiment includes a flip center shaft 210 coupled to the chucking module 121 and a flip driving unit connected to the flip center shaft 210 and rotating the flip center shaft 210 And an encoder 230 for a central axis connected to the flip center axis 210 and recognizing a rotation angle of the flip center axis 210.

The flip driving unit 220 is supported by the stage unit 120 and rotates the flip center axis 210. In this embodiment, the flip driving unit 220 includes a rotation driving motor 221. [ The rotation drive motor 221 is disposed inside the atmospheric pressure box portion AB which is disposed inside the vacuum chamber 110 in the vacuum atmosphere and can keep the interior thereof at atmospheric pressure.

The motors 349 and 429 as well as the motors 349 and 429 to be described below as well as the rotation drive motor 221 can not be used in a vacuum atmosphere, As will be understood by those skilled in the art.

The center axis encoder 230 is connected to the flip center axis 210 and recognizes the rotation angle of the flip center axis 210. The center axis encoder 230 is electrically connected to a control unit (not shown) electrically connected to the rotation drive motor 221.

The central axis encoder 230 detects the rotation angle of the flip center axis 210 and transmits a detection signal to the control unit. The control unit, which receives the sensing signal from the central axis encoder 230, controls the rotation driving motor 221 according to the information of the sensing signal so that the central axis 210 of the flip is rotated at an accurate angle (for example, ).

As described above, the top-down type substrate etching apparatus according to the present embodiment uses the self-encoder (not shown) of the rotation drive motor 221 to control the operation of the rotation drive motor 221, The operation of the rotation drive motor 221 is controlled through the center axis encoder 230 capable of directly sensing the rotation angle so that the rotation of the rotation center of the flip center axis 210 ) Can be rotated at an accurate angle.

Since the substrate on which the central region is stuck in the flipping process of the chucking module 121 is not completely attached to the chucking module 121, the substrate is separated from the chucking module 121 in the flipping process of the chucking module 121 And can fall.

Therefore, in order to prevent the substrate from falling down during the flipping process of the chucking module 121, the downward type substrate etching apparatus according to this embodiment is provided with the clamping unit 300

The clamping unit 300 according to the present embodiment is supported by the chucking module 121 and clamps the edge region of the substrate. The clamping unit 300 according to the present embodiment also comprises a detachable clamping unit 300 for depressing the substrate attached to the chucking module 121 and detaching the substrate from the chucking module 121 .

The detachable clamping unit 300 clamps the substrate in the flipping process of the chucking module 121 to prevent the substrate from falling in the flipping process of the chucking module 121. Here, the detachable clamping unit 300 clamps the substrate in the process that the chucking module 121 reverses from Fig. 11 (b) to Fig. 12 (a), and the chucking module 121 12 (c), the substrate is not completely clamped since the substrate is completely attached to the chucking module 121. [

When the substrate is to be separated from the chucking module 121 after completion of the etching process or the like, the detachable clamping unit 300 depresses the substrate to detach the substrate from the chucking module 121.

The detachable clamping unit 300 includes a clamping support module 310 for supporting a substrate and a clamping support module 310 for clamping the substrate to the clamping support module 310. [ And a clamping pressure module 320 for pressing the clamping force.

The support module for clamping 310 supports the substrate. The clamping support module 310 for clamping includes a clamping holder portion 311 which is disposed at a predetermined distance from the chucking module 121 and contacts the substrate to support the substrate and a clamping holder portion 311 that supports the clamping holder portion 311 And a bracket part 312 for the holder part connected to the chucking module 121.

11 and 12, the clamping holder portion 311 is spaced apart from the chucking module 121 and disposed in a lower region of the chucking module 121, and the holder portion bracket portion 312 is fixed to the clamping holder portion 121. [ (311) and the chucking module (121).

The pressing module 320 for clamping presses the substrate to the supporting module 310 for clamping. The clamping pressing module 320 includes a clamping pressing part 330 connected to the substrate to press the substrate, a clamping pressing part 330 connected to the clamping pressing part 330 and having a clamping pressing part 330, And a driving unit 340 for the pressing module which moves the pressing unit in a direction away from the pressing unit.

The clamping pressing portion 330 is connected to the substrate to press the substrate. 11 (b) to 12 (a), the substrate supported by the clamping holder 311 is clamped by the clamping holder 311 in the process of reversing the chucking module 121 When the substrate is clamped by pressing and the substrate is completely attached to the chucking module 121 as shown in FIG. 12 (c), and the substrate needs to be released from the chucking module 121 after completion of the etching process or the like, 121 are pressed by the clamping holder portion 311 to detach the substrate from the chucking module 121.

The clamping pressing portion 330 includes a pressing contact portion 331 contacting the substrate and a frame portion 336 for contact portion connected to the pressing module driving portion 340 and connected to the pressing contact portion 331 do. The contact portion frame portion 336 is connected to the chucking module 121 in a relative moveable manner.

In this embodiment, a plurality of pressing contact portions 331 are provided and spaced apart from each other. The pressing contact portion 331 includes a contact portion body 332 that is movably coupled to the contact portion frame portion 336, a contact pin 333 that is coupled to the contact portion body 332 and contacts the substrate, And an elastic body 334 which is supported on the use frame portion 336 and connected to the contact portion body 332 to elastically bias the contact portion body 332 toward the substrate.

The contact portion body 332 is movably coupled to the contact portion frame portion 336 so as to absorb a shock applied to the substrate in contact with the substrate.

The contact pin 333 is coupled to the contact body 332 and contacts the substrate. The tip of the contact pin 333 or the entire contact pin 333 is made of a resin material so that the impact applied to the substrate when the contact pin 333 is in contact with the substrate can be minimized.

9, the elastic body 334 is supported by the contact portion frame portion 336 and is connected to the contact portion body 332 to elastically bias the contact portion body 332 in the direction of the substrate.

In this embodiment, a coil spring is used as the elastic body 334, and the scope of the present invention is not limited thereto, and various elastic constructions can be used as the elastic body 334 of the present embodiment.

Such an elastic body 334 is compressed by the relative movement of the contact portion body 332 with respect to the contact portion frame portion 336 in the process of contact of the contact pin 333 with the substrate and pressing the substrate, And presses the contact portion body 332 with an elastic force to release the contact portion body 332 when the pressure on the substrate is released.

As described above, the top-down type substrate etching apparatus according to the present embodiment can press the substrate supported by the clamping holder unit 311 to clamp the substrate, press the substrate attached to the chucking module 121 to the clamping holder unit 311 The clamping structure and the detachment structure do not need to be separately formed, so that it is possible to downsize the device and reduce the component cost There is an advantage.

In addition, the top-down type substrate etching apparatus according to the present embodiment includes an elastic body 334 capable of absorbing an impact generated when the substrate is in contact with the clamping pressing portion 330, so that the clamping pressing portion 330 It is possible to prevent the substrate from being damaged by the impact during the pressing process.

The driving unit 340 for the pressing module is connected to the pressing unit 330 for clamping. The driving unit 340 for the pressing module moves the clamping pressing unit 330 in a direction in which the clamping pressing unit 330 approaches and separates from the substrate.

The driving unit 340 for the pressing module of the present embodiment includes a guide frame portion 341 for the pressing module which is connected to the contact portion frame portion 336 and guides the movement of the contact portion frame portion 336, And a clamping pressure driver 346 that is supported by the frame 341 and connected to the frame unit 336 for the contact unit to move the frame unit 336 for contact.

The frame portion for contact portion 336 is connected to the guide frame portion 341 for the pressure module. The guide frame portion 341 for the pressing module guides the movement of the contact portion frame portion 336.

The guide frame portion 341 for the pressurizing module includes a support plate 342 for the pressurizing module to which the clamping pressurizing driver 346 is connected, A ball bushing 344 for a pressure module, to which a guide shaft 343 for the pressure module, which is coupled to the support plate 342, and a frame portion 336 for the contact portion, which is slidably connected to the guide shaft 343 for the pressure module, ).

A clamping pressure driver 346 is connected to the support plate 342 for the pressure module. The support plate 342 for the pressing module is supported by the chucking module 121.

The ball bush 344 for the pressurizing module is slidably connected to the guide shaft 343 for the pressurizing module. The contact portion frame portion 336 is engaged with the ball bushing 344 for the pressing module. A ball bushing 344 for the pressure module of this embodiment is provided with a through hole (not shown) through which the guide shaft 343 for the pressurizing module passes, and a plurality of ball rotating bodies (not shown) And is rotatably coupled.

The pressing driving portion 346 for clamping is supported by the guide frame portion 341 for the pressing module. The pressing driving portion 346 for clamping is connected to the contact portion frame portion 336 to move the contact portion frame portion 336.

The pressing driving portion 346 for clamping includes a moving nut 347 for the pressing module coupled to the frame portion of the contact portion frame portion 336 and a ball screw 348 for pressing module engaged with the moving nut 347 for the pressing module. And a driving motor 349 for the pressing module for rotating the ball screw 348 for the pressing module. The drive motor 349 for the pressure module is disposed inside the atmospheric pressure box portion AB.

When the substrate is clamped to the detachable clamping unit 300, deflection occurs in the central region of the substrate as shown in FIG. 11 (b). In this state, the chucking module 121 is reversed, The central region is sagged toward the chucking module 121, and this deflection is opposite to the deflection of the substrate in Fig. 11 (b). That is, since the deflection of the central region of the substrate is reversed as well as the inversion of the chucking module 121, an impact may be generated in the substrate during the change of deflection direction of the substrate, thereby damaging the substrate.

Thus, the central area support unit 400 of the present embodiment supports the central area of the substrate in the flipping process of the chucking module 121, thereby changing the deflection direction of the central area of the substrate in the flipping process of the chucking module 121 prevent.

The central region supporting unit 400 is supported by the chucking module 121. [ The central area support unit 400 of this embodiment includes a central area support module 410 for supporting a substrate and a central area support module 410 connected to the central area support module 410, And a movement module 420 for the support module which moves the support module in a direction.

The central zone support module 410 supports the substrate. The central region supporting module 410 includes a central region supporting portion 411 contacting the substrate and a supporting portion frame portion 415 coupled to the central region supporting portion 411 and connected to the supporting module moving module 420 . The supporting frame portion 415 is connected to the chucking module 121 movably.

In the present embodiment, a plurality of central region support portions 411 are provided and spaced apart from each other. The central region supporting portions 411 are provided in such a shape that the length from the central region of the substrate to the edge region of the substrate becomes smaller with reference to the frame portion 415 for supporting portion so as to correspond to the deflection shape of the central region of the substrate.

That is, as shown in FIG. 8, the central region support portion 411 located closest to the center of the substrate has the longest length, and the centers of the central region support portions 411 located on both sides of the central region support portion 411 The length of the region supporting portion 411 is smaller than the length of the central region supporting portion 411 in the middle.

The central region support portion 411 includes a support body 412 coupled to the frame portion 415 for the support portion and support pins 413 coupled to the support body 412 and contacting the substrate.

The support pins 413 are coupled to the support body 412 and contact the substrate. The tip of the support pin 413 or the entire support pin 413 is made of a resin material so that the impact applied to the substrate when the support pin 413 contacts the substrate can be minimized.

The transfer module 420 for the support module is connected to the central area support module 410. The transfer module 420 for the support module moves the central area support module 410 in a direction that approaches and separates from the substrate.

The moving module 420 for the supporting module in the present embodiment includes a guide frame part 421 for the moving module which is connected to the frame part 415 for the supporting part and guides the movement of the frame part 415 for the supporting part, And a driving part 426 supported by the guide frame part 421 and connected to the supporting part frame part 415 to move the frame part 415 for supporting part.

The support frame part 415 is connected to the guide frame part 421 for the moving module. The guide frame portion 421 for the mobile module guides the movement of the frame portion 415 for the support portion.

The guide frame part 421 for the moving module according to the present embodiment includes a supporting plate 422 for the moving module to which the driving part 426 for the supporting part is connected, And a ball bushing 424 for the moving module, which is connected to the shaft 423 and the guide shaft 423 for the moving module so as to be slidable and connected to the frame part 415 for the supporting part.

A drive part 426 for the support part is connected to the support plate 422 for the transfer module. The supporting plate 422 for the moving module is supported and fixed to the chucking module 121.

The ball bush 424 for the moving module is slidably connected to the guide shaft 423 for the moving module. The frame portion 415 for the support portion is engaged with the ball bushing 424 for the moving module. A ball bushing 424 for the moving module of this embodiment is formed with a through hole (not shown) through which the guide shaft 423 for the moving module passes, and a plurality of ball rotating bodies (not shown) And is rotatably coupled.

The driving part 426 for the supporting part is supported by the guide frame part 421 for the moving module. The supporting portion driving portion 426 is connected to the supporting portion frame portion 415 to move the supporting portion frame portion 415.

The supporting portion drive portion 426 includes a moving nut 427 for the supporting portion to be engaged with the frame portion 415 for the supporting portion, a ball screw 428 for the supporting portion to be engaged with the moving nut 427 for the supporting portion, And a drive motor 429 for the support portion that rotates the support shaft 428. The drive motor 429 for the support portion is disposed inside the atmospheric pressure box portion AB.

Meanwhile, in the process of attaching the substrate to the chucking module 121 in the present embodiment, the chucking module 121 is rotated 360 degrees by the flip unit 200 as shown in FIGS. 11 and 12, The rotated chucking module 121 must be properly positioned at the reference position.

Here, the reference position refers to a position where the chucking module 121 is horizontal without being inclined. If the chucking module 121 is tilted at a very small angle without being horizontal, the etching process is performed in a state where the substrate attached to the chucking module 121 is inclined. The etching process is performed in a state in which the substrate is not formed in a horizontal state, thereby causing an etching failure)

Although the central axis encoder 230 is used to correctly position the chucking module 121 at the reference position, an error may occur in the central axis encoder 230, and during the movement of the stage unit 120 The positioning unit 500 of the present embodiment is used because it can be slightly tilted to the chucking module 121 by the shaking.

This positioning unit 500 is supported on the stage unit 120 and is connected to the chucking module 121 to position the chucking module 121 in the reference position.

The positioning unit 500 of the present embodiment presses the chucking module 121 so that the chucking module 121 can be maintained in a fixed position even when the stage unit 120 is moved. And a positioning unit 500 for positioning the positioning unit.

The pushing type positioning unit 500 is connected to a reference position guiding part 122 protruding from the outer wall of the chucking module 121 to press the chucking module 121.

The reference position guiding portion 122 includes an upper inclined side wall 123 provided in a shape that the length becomes smaller toward the upper side and a lower inclined side wall 123 connected to the upper inclined side wall 123, And a side wall 124.

The upper inclined sidewall 123 and the lower inclined sidewall 124 are provided symmetrically with respect to the center of the reference position guiding portion 122 in the vertical direction.

10, the reference position guiding portion 122 of the present embodiment is formed in a triangular shape, and the scope of the present invention is not limited thereto. The reference guiding portion 122 of the present embodiment includes the upper inclined side wall 123, And a lower inclined sidewall 124, as shown in FIG.

The pressing type positioning unit 500 includes a positioning pressing portion 510 connected to the upper inclined side wall 123 and the lower inclined side wall 124 and a positioning pressing portion 510 connected to the positioning pressing portion 510 And a positioning pressure driver 520 for moving the reference position guide 122 in the direction in which the reference guide 122 approaches and separates from the reference position guide 122,

The positioning pressing portion 510 is connected to the upper inclined side wall 123 and the lower inclined side wall 124 to press the chucking module 121. The positioning pressing portion 510 includes an upper roller 511 contacting the upper inclined sidewall 123, a lower roller 512 contacting the lower inclined sidewall 124, a lower roller 511 contacting the lower inclined sidewall 124, And a roller bracket 513 that is rotatably coupled to the roller 512 and connected to the positioning pressure drive unit 520.

The upper roller 511 and the lower roller 512 are arranged symmetrically with respect to the center of the reference position guiding portion 122 in the vertical direction.

The upper inclined sidewall 123 and the lower inclined sidewall 124 are symmetrical with respect to the center of the reference position guiding portion 122 in the vertical direction and the upper roller 511 and the lower roller 512 Even if the chucking module 121 is not positioned at the reference position (horizontal position), the pressing force of the positioning pressing portion 510 is not affected by the pressing force of the positioning pressing portion 510 The upper roller 511 and the lower roller 512 can not be positioned at the reference position and the minute rotation of the flip center shaft 210 The upper inclined sidewall 123 or the lower inclined sidewall 124 of the rotated reference position guiding portion 122 is rotated to rotate the chucking module 121 to the reference position)

The positioning pressure drive part 520 is connected to the positioning pressing part 510 and moves the positioning pressing part 510 in a direction in which the positioning pressing part 510 approaches and separates from the reference position guiding part 122. [

The positioning pressure drive unit 520 includes a pressure cylinder body 511 fixed to the stage unit 120 and a cylinder 511 connected to the pressure cylinder body 511 so as to be movable relative thereto and to which the positioning pressure unit 510 is coupled And a bellows pipe 513 which is connected to the pressurizing cylinder main body 511 and the cylinder rod 512 and shields a region where the pressurizing cylinder main body 511 and the cylinder rod 512 are connected.

The pressurizing cylinder body 511 is fixed to the stage unit 120 and disposed in a direction opposite to the reference position guiding portion 122.

The cylinder rod 512 is connected to the pressurizing cylinder body 511 in a relative movement. A roller bracket 513 is coupled to the cylinder rod 512.

The cylinder rod 512 is moved forward and backward. The length of the cylinder rod 512 relative to the pressure cylinder body 511 is the distance when the chucking module 121 reaches the reference position. That is, after the chucking module 121 reaches the reference position, the advance distance of the cylinder rod 512 relatively moved in the pressurizing cylinder body 511 is checked in advance, the cylinder rod 512 is advanced by the determined distance, So that the chucking module 121 is positively positioned at the reference position.

One end of the bellows pipe 513 is connected to the pressure cylinder body 511 and the other end is connected to the cylinder rod 512. The bellows pipe 513 is formed in a shape that allows the bellows tube 513 to be stretched in length so as to cover a region where the pressurizing cylinder main body 511 and the cylinder rod 512 are connected during the movement of the cylinder rod 512.

The inside of the vacuum chamber 110 is in a vacuum atmosphere so that the bellows tube 513 is pressed against the pressure cylinder body 511 and the cylinder rod 512 so that the inside of the pressure cylinder body 511 is not exposed to the vacuum atmosphere It shields the connected area.

In this embodiment, the reference position guiding portion 122 is provided on each side wall (opposite side wall) of the chucking module 121, and the pair of pressurizing positioning units 500 are provided to press each reference guiding portion 122 .

On the other hand, the stage moving unit 150 is connected to the stage unit 120 and moves the stage unit 120. The stage moving unit 150 supports the stage unit 120 and moves the stage unit 120. In this embodiment, the stage moving unit 150 moves the stage unit 120 in a linear motor manner.

The stage moving unit 150 includes a guide rail (not shown) connected to the stage unit 120 and guiding the movement of the stage unit 120 and a driving unit (not shown) for moving the stage unit 120 by an electromagnetic force ). Here, the driving unit (not shown) interacts with the first magnetic body (not shown) provided in the stage unit 120 to generate a driving force by the electromagnetic force in the stage unit 120 And a second magnetic body (not shown) disposed along the second magnetic body.

Here, the first magnetic body is provided as a permanent magnet and the second magnetic body is provided as an electromagnet.

The laser unit 160 is disposed outside the vacuum chamber 110 and transmits a laser beam to the substrate in the vacuum chamber 110 through the first chamber window 111 provided in the vacuum chamber 110 And an etching process is performed by irradiation.

The laser unit 160 irradiates a laser beam onto the substrate in the vacuum chamber 110 through the first chamber window 111 to advance the etching process. In this embodiment, the laser unit 160 is disposed outside the vacuum chamber 110, that is, in the lower region. It is not preferable that the configurations other than the substrate are disposed inside the vacuum chamber 110 because a vacuum is formed inside the vacuum chamber 110.

Accordingly, the laser unit 160 is disposed in a lower region of the vacuum chamber 110, and irradiates a laser beam onto the substrate through the first chamber window 111 at the position to perform an etching process.

At this time, since the laser unit 160 is disposed in the lower region of the substrate, the laser beam emitted from the laser unit 160 can be irradiated to the lower portion of the substrate, whereby an unnecessary portion deposited on the lower surface of the substrate is etched And the particles may fall toward the first chamber window 111 during the etching process.

In this embodiment, a plurality of laser units 160 are provided, and each of the plurality of laser units 160 can simultaneously perform an etching operation through each of the first chamber windows 111, Since the etching operation is performed in a large area, the range in which the particles are scattered is widened. Accordingly, the top-down type substrate etching apparatus according to the present embodiment includes a particle collecting unit (not shown) disposed between the substrate and the first chamber window 111 for collecting particles separated from the substrate during the etching process by the laser unit 160 ).

On the other hand, the output of the laser beam emitted from the laser unit 160 must be constant for the uniformity of the etching. Therefore, the top-down type substrate etching apparatus according to the present embodiment includes a laser output measuring unit S that can monitor the output of the laser beam in real time.

The laser output measurement unit S is disposed outside the vacuum chamber 110 and includes a laser beam passing through the inside of the vacuum chamber 110 through the second chamber window 112 provided in the vacuum chamber 110 And the output of the laser beam is measured.

In the present embodiment, a laser power meter for receiving a laser beam emitted from a laser light source and converting the laser beam into an electric signal and displaying the laser signal is used.

Since the inside of the vacuum chamber 110 is formed in a vacuum atmosphere as described above, it is not preferable that the structures other than the substrate are disposed inside the vacuum chamber 110, And receives the laser beam passing through the interior of the vacuum chamber 110 through the second chamber window 112 at that position.

In this embodiment, a plurality of laser units 160 are provided, and each laser output measurement unit S measures the output of the laser beam passing through each of the second chamber windows 112.

In this way, the laser output measuring unit S receives the laser beam passing through the inside of the vacuum chamber 110 through the second chamber window 112 and outputs the laser beam It is possible to monitor the output of the laser beam in the vacuum chamber 110, which is a machining area, so that it is possible to recognize whether the device is malfunctioning or to prevent the generation of defective products.

On the other hand, when the etching process is performed, the angle at which the laser unit 160 emits the laser beam toward the substrate can be changed by the flatness, alignment, or the like of the substrate. The laser beam is not easily reached to the laser output measuring unit S disposed in the upper region of the vacuum chamber 110 in accordance with the laser beam emitting angle of the laser unit 160 disposed in the lower region of the vacuum chamber 110 It is possible.

Therefore, the top-down type substrate etching apparatus according to this embodiment further includes a beam delivery unit (not shown) which is supported on the stage unit 120 and transfers the laser beam emitted from the laser unit 160 to the laser output measurement unit S .

Further, as described above, the etching operation of the substrate is performed inside the vacuum chamber 110, and the laser beam emitted from the laser unit 160 is focused at the height at which the substrate is disposed. When the laser beam set to be focused on the substrate position directly irradiates the laser output measurement unit S, the laser output measurement unit S disposed in the upper region of the vacuum chamber 110 and the laser output measurement unit S placed in the vacuum chamber 110 The laser beam irradiating the laser output measuring unit S can not be focused on the laser output measuring unit S due to the difference in position between the laser output measuring unit S and the laser output measuring unit S, May be different from the output of the laser beam irradiated on the substrate.

Thus, the beam transmitting unit (not shown) according to the present embodiment includes a focusing module (not shown) for focusing the laser beam on the laser output measuring unit S.

The focusing module (not shown) extends the path of the laser beam reaching the laser output measurement unit S beyond the path of the laser beam reaching the substrate, so that the laser beam reached to the laser output measurement unit S (S). That is, the focusing module (not shown) focuses the laser beam emitted from the laser unit 160 and supplies the laser beam to the laser output measuring unit S. The focusing module (not shown) may be provided with a plurality of mirror portions (not shown) reflecting the laser beam.

Hereinafter, the operation of the top-down type substrate etching apparatus according to the present embodiment will be described with reference to FIGS. 3 to 12 with reference to FIG. 10 to FIG.

The substrate is loaded into the vacuum chamber 110 by a robot arm (not shown) or the like. After the substrate is placed between the chucking module 121 and the clamping holder part 311 by the start of the robot arm or the movement of the stage unit 120, the robot arm is started by avoiding interference with the stage unit 120, To the clamping holder portion 311 as shown in Fig. 11 (a). At this time, in the case of a large area substrate, deflection occurs in the central region of the substrate as shown in FIG. 11 (a).

11 (b), the contact pin 333 presses the substrate against the clamping holder portion 311 to clamp the substrate.

At this time, the support pins 413 of the central area support unit 400 are moved toward the substrate, and the moved support pins 413 contact the substrate to support the substrate.

Next, the chucking module 121 is inverted 180 degrees by the flip unit 200 as shown in Fig. 12 (a). Thereafter, the support pins 413 of the central area support unit 400 are moved in the direction in which they are spaced apart from the substrate (downward in Fig. 12 (a)). Along with the movement of the support pin 413, the contact pin 333 is also moved in a direction away from the substrate (downward in Fig. 12 (a)).

The substrate is lowered toward the chucking module 121 by the movement of the support pins 413 and the contact pins 333 so that the substrate is brought into close contact with the chucking module 121 as shown in FIG. As shown in FIG. 12 (b), since the substrate is positioned on the upper portion of the chucking module 121 by the inversion of the chucking module 121, deflection can not occur in the substrate adhered to the chucking module 121, The substrate is completely attached to the chucking module 121.

Thereafter, the substrate is again arranged in the downward direction as shown in Fig. 12 (c) by the reversion of the chucking module 121. [ In this case, since the substrate is completely attached to the chucking module 121 in Fig. 12C, even if the chucking module 121 is re-inverted, no sag occurs in the central region of the substrate.

As described above, the top-down type substrate etching apparatus according to the present embodiment includes the flip unit 200 that flips the chucking module 121 so that deflection generated in the central region of the substrate during chucking of the large- The substrate can be removed through the flip of the substrate 121, and thus the large-area substrate can be easily attached to the chucking module 121.

On the other hand, the chucking module 121, which is re-inverted as shown in 12 (c), should be positioned at the reference position. As described above, the reference position refers to a position where the chucking module 121 is horizontal without being inclined. If an etching process is performed in a state where the chucking module 121 is inclined without being horizontal, an etching failure occurs.

Accordingly, the pressing type positioning unit 500 of this embodiment presses the reference position guiding portion 122 of the chucking module 121 to position the chucking module 121 in position.

The upper inclined sidewall 123 and the lower inclined sidewall 124 are provided symmetrically with respect to the center of the reference position guiding portion 122 in the vertical direction and the upper roller 511, And the lower roller 512 are disposed symmetrically with respect to the center of the reference position guiding part 122 in the vertical direction so that the positioning pressing part (not shown) 510, the chucking module 121 can be rotated to establish the chucking module 121 at the reference position.

After the chucking module 121 is positioned at the reference position, the stage unit 120 is moved by the stage moving unit 150 and an etching operation is performed.

When the substrate is to be separated from the chucking module 121 after the completion of the etching process or the like, the contact pin 333 presses the substrate and detaches from the chucking module 121, with the chucking function of the chucking module 121 being released.

That is, even if the chucking module 121 releases the chucking function, the chucking module 121 may not be separated from the chucking module 121 by residual static electricity. In this case, the contact pin 333 may move in the direction So that the substrate can be easily detached from the chucking module 121.

As described above, the top-down type substrate etching apparatus according to the present embodiment includes the flip unit 200 that flips the chucking module 121, thereby removing the deflection generated in the central region of the substrate through the flip of the chucking module 121 And it is possible to prevent the substrate from falling during the flipping process of the chucking module 121 by providing the detachable clamping unit 300 for clamping the edge region of the substrate, The center region supporting unit 400 prevents the substrate from being damaged by the impact caused by the deflection direction change during the process of removing the deflection generated in the central region of the substrate by the flip of the chucking module 121 .

Although the present invention has been described in detail with reference to the above drawings, the scope of the scope of the present invention is not limited to the above-described drawings and description.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

110: vacuum chamber 111: first chamber window
112: second chamber window 113: chamber window protection part
120: stage unit 121: chucking module
122: reference position guiding portion 123: upper inclined side wall
124: lower inclined side wall 150: stage moving unit
160: laser unit 200: flip unit
210: Flip center shaft 220: Flip driving part
221: Driving motor for rotation 230: Encoder for center axis
300: a detachable clamping unit 310: a supporting module for clamping
311: Clamping holder part 312: Bracket part for holder part
320: Pressing module for clamping 330: Pressing part for clamping
331: pressing contact portion 332: contact body
333: contact pin 334: elastic body
336: Frame part for contact part 340: Driving part for pressing module
341: Guide frame part for pressurizing module
342: Support plate for pressure module
343: Guide shaft for pressure module
344: Ball bushing for pressurizing module 346: Pressure actuating part for clamping
347: Move nut for pressure module 348: Ball screw for pressurized module
349: Driving motor for pressurizing module 400: Central area support unit
410: central zone support module 411: central zone support
412: Support body 413: Support pin
415: frame part for supporting part 420: moving module for supporting module
421: guide frame part for mobile module
422: Support plate for transfer module
423: Guide shaft for mobile module
424: ball bush for moving module 426: driving part for supporting part
427: moving nut for supporting part 428: ball screw for supporting part
429: Driving motor for support part 500: Positioning unit
510: pressing portion for positioning 511: upper roller
512: Lower roller 513: Roller bracket
520: Positioning pressure driver 511: Pressure cylinder body
512: cylinder rod 513: bellows tube
150: stage moving unit 160: laser unit
G: substrate S: laser output measuring unit
AB: Atmospheric pressure box section

Claims (18)

A stage unit disposed inside the vacuum chamber in which an etching process for the substrate is performed and having a chucking module for attaching a substrate loaded into the vacuum chamber;
A flip unit supported by the stage unit, the flip unit flipping the chucking module;
A clamping unit supported by the chucking module and clamping an edge region of the substrate; And
And a central area support unit supported by the chucking module and supporting a central region of the substrate in a flipping process of the chucking module,
The central region supporting unit includes:
A central area support module supporting the substrate; And
And a transfer module for the support module, connected to the central area support module, for moving the central area support module in a direction approaching and separating from the substrate,
The central zone support module comprises:
A central region support contacting the substrate; And
And a frame part for the support part connected to the center module supporting part and connected to the moving module for the supporting module,
The movement module for the support module comprises:
A guide frame part for the mobile module, to which the frame part for the support part is connected and guides the movement of the frame part for the support part; And
And a driving part for the support part, which is supported by the guide frame part for the moving module and is connected to the frame part for the supporting part to move the frame part for the supporting part,
The guide frame part for the mobile module includes:
A supporting plate for the moving module to which the driving unit for the supporting unit is connected;
A guide shaft for the transfer module coupled to the support plate for the transfer module; And
And a ball bushing for a moving module, which is slidably connected to the guide shaft for the moving module, and to which the frame part for the supporting part is coupled. The method according to claim 1,
The flip-
A flip center axis coupled to the chucking module; And
And a flip driver connected to the flip center axis for rotating the flip center axis. 3. The method of claim 2,
The flip-
Further comprising a center axis encoder coupled to the flip center axis for recognizing the rotational angle of the flip center axis. delete delete The method according to claim 1,
Wherein the central region supporting portion comprises:
A support body coupled to the frame part for the support part; And
And a support pin coupled to the support body and contacting the substrate. The method according to claim 1,
The central region support portions are provided in a plurality of spaced-
Wherein the central region supporting portions are formed in a shape that the length from the center region of the substrate to the edge region of the substrate becomes smaller with reference to the frame portion for the supporting portion. delete delete The method according to claim 1,
The driving unit for the supporting unit includes:
A moving nut for the supporting part coupled to the frame part for the supporting part;
A ball screw for a support part engaged with the moving nut for the support part; And
And a drive motor for the support portion for rotating the ball screw for the support portion. The method according to claim 1,
Wherein the clamping unit comprises:
And a detachable clamping unit for depressing the substrate attached to the chucking module to detach the substrate from the chucking module,
The detachable clamping unit includes:
A clamping support module for supporting the substrate; And
And a clamping pressure module for pressing the substrate to a clamping support module. 12. The method of claim 11,
The clamping pressurizing module includes:
A clamping pressure unit connected to the substrate to press the substrate; And
And a driving unit for the pressing module connected to the clamping pressing unit and moving the clamping pressing unit in a direction in which the clamping pressing unit approaches and separates from the substrate. 13. The method of claim 12,
Wherein the clamping-
A pressing contact portion contacting the substrate; And
And a contact portion frame portion connected to the pressing contact portion and connected to the driving portion for the pressing module. 14. The method of claim 13,
The pressing contact portion
A contact portion body which is movably coupled to the frame portion for the contact portion;
A contact pin coupled to the contact body and contacting the substrate; And
And an elastic body supported by the frame portion for the contact portion and connected to the contact portion body to elastically bias the contact portion body toward the substrate. 14. The method of claim 13,
The driving unit for the pressure module includes:
A guide frame part for the press module connected to the frame part for the contact part and guiding the movement of the frame part for the contact part; And
And a clamping pressure driving part supported by the guide frame part for the pressing module and connected to the frame part for the contact part to move the frame part for the contact part. 16. The method of claim 15,
The guide frame part for the pressure module includes:
A supporting plate for the pressing module to which the pressing driving unit for clamping is connected;
For the pressure module A guide shaft for the pressure module coupled to the support plate; And
And a ball bushing for a pressurizing module, the ball bushing being slidably connected to the guide shaft for the pressurizing module and to which the frame part for the contact part is coupled. 16. The method of claim 15,
Wherein the clamping pressure driver comprises:
A moving nut for a pressing module coupled to the frame portion for the contact portion;
A ball screw for a pressing module engaged with the moving nut for the pressing module; And
And a driving motor for the pressing module for rotating the ball screw for the pressing module. 12. The method of claim 11,
Wherein the clamping support module comprises:
A clamping holder disposed at a predetermined distance from the chucking module, the clamping holder contacting the substrate to support the substrate; And
And a bracket portion for supporting the clamping holder portion and connected to the chucking module.

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