KR102584726B1 - laser processing apparatus - Google Patents

Abstract

The present invention relates to a laser processing device, and more specifically, to a laser processing device that processes a substrate using a laser.
The present invention includes a chamber 100 in which a processing space (S) for substrate processing using a laser is formed; a carrier 200 that supports the substrate 10 so that the processing surface of the substrate 10 faces downward and is installed to be linearly movable along the longitudinal direction (hereinafter, the first direction) of the chamber 100; A laser module ( 300) and; a viewport protection unit 400 installed at intervals above the viewport 102 to prevent the viewport 102 from being contaminated by particles in the processing space (S); A support frame unit that supports the viewport protection unit 400 and is movably installed along the width direction (hereinafter, second direction) of the chamber 100, where the viewport protection unit 400 is perpendicular to the first direction. (500) and; a first driving unit 600 installed inside the chamber 100 and configured to move the support frame unit 500 in the first direction; It moves along the first direction together with the support frame part 500 by the first driving part 600, and moves the viewport protection part 400 along the second direction with respect to the support frame part 500. Disclosed is a laser processing device comprising a second driving unit 700 for relative movement.

Description

Laser processing apparatus

The present invention relates to a laser processing device, and more specifically, to a laser processing device that processes a substrate using a laser.

In general, substrates for OLED display panels are classified according to their light-emitting structure into a top emission method and a bottom emission method, of which the back emission method is mainly used.

In the case of the mainly used back-emitting method, light passes through the thin film transistor and is emitted, so the light is emitted from the remaining part of the pixel excluding the thin film transistor. As a result, even while the pixel size is becoming smaller for high resolution, the thin film transistor Since there is a limit to reducing the size, there is a problem in that the area where light is emitted becomes narrow.

Accordingly, in the case of the back-emitting method, there is a problem in that the aperture ratio is lower than that of the front-emitting method.

On the other hand, in the case of the front emission method, light is not emitted through the thin film transistor but is emitted into the encapsulation area, so a higher aperture ratio can be secured and has recently been in the spotlight as a substrate for OLED display panels.

However, in the case of the front emission method, the front cathode electrode must be made as thin as possible and transparency must be increased at the same time, but in the process, the resistance of the cathode electrode increases, which causes uneven luminance due to an increase in electrode length.

To solve this problem, a technology was used to lower the resistance of the cathode electrode by forming a contact hole in the substrate using a conventional laser and connecting the cathode electrode and the auxiliary electrode.

Meanwhile, in the process of forming a contact hole in a substrate using a laser, in the case of a substrate in a face-up state with the processing surface of the substrate facing upward, a large amount of floating foreign matter is generated at the processing location due to irradiation of the laser light. There is a problem in that foreign substances are re-adsorbed to the substrate and contaminate the substrate.

To solve this problem, conventional flip-type laser processing equipment is used to perform laser processing on a face-down substrate with the processing surface of the substrate facing downward.

In the case of this flip-type laser processing device, a substrate (glass) is supported in a face-down state within a chamber in a vacuum atmosphere, and a laser outside the chamber passes through the viewport of the chamber to process the substrate.

Since the flip-type laser processing device emits laser light upward, particles generated from the substrate may fall into the viewport at the bottom of the chamber and contaminate the viewport.

If the viewport is contaminated by particles, the transmittance (power) of the laser light passing through the viewport decreases. To prevent this, a member (protection window) that filters particles from falling into the viewport is usually installed on the upper side of the viewport.

However, even in the case where a protective window is installed, as substrate processing is performed, particles continue to accumulate in a certain area of the protective window and the power of the transmitted laser light decreases, so the protective window cannot be used for a long time and must be replaced frequently. There is a problem.

The purpose of the present invention is to effectively utilize the unused area of the viewport protector by variously adjusting the position on the The aim is to provide a laser processing device that can maximize the replacement interval of the viewport protection part.

The present invention was created to achieve the object of the present invention as described above, and includes a chamber 100 in which a processing space S is formed for substrate processing using a laser; a carrier 200 that supports the substrate 10 so that the processing surface of the substrate 10 faces downward and is installed to be linearly movable along the longitudinal direction (hereinafter, the first direction) of the chamber 100; A laser module ( 300) and; a viewport protection unit 400 installed at intervals above the viewport 102 to prevent the viewport 102 from being contaminated by particles in the processing space (S); A support frame unit that supports the viewport protection unit 400 and is movably installed along the width direction (hereinafter, second direction) of the chamber 100, where the viewport protection unit 400 is perpendicular to the first direction. (500) and; a first driving unit 600 installed inside the chamber 100 and configured to move the support frame unit 500 in the first direction; It moves along the first direction together with the support frame part 500 by the first driving part 600, and moves the viewport protection part 400 along the second direction with respect to the support frame part 500. Disclosed is a laser processing device comprising a second driving unit 700 for relative movement.

The viewport protection unit 400 includes a protective glass 410 through which the laser light can pass, and an outer frame 420 installed at the edge of the protective glass 410 to support the protective glass 410. It can be included.

The first driving part 600 includes a first driving shaft part 610 installed in the chamber 100 along the first direction and having threads formed on the outer peripheral surface, and the first driving shaft part 610 rotates. A first moving block that can be inserted and moves linearly in the first direction according to the rotation of the first driving shaft part 610 and is coupled to the support frame part 500, and a linear movement of the first moving block It may include a moving block guide unit 620 for guidance.

The second driving part 700 includes a second driving shaft part 720 installed along the second direction and having a thread formed on an outer peripheral surface, and the second driving shaft part 720 is rotatably inserted into the second driving shaft part 720. 2. The support frame is supported by a second moving block 710 that moves linearly in the second direction according to the rotation of the driving shaft part 720 and is coupled to the viewport protection part 400, and the first driving part 600. It may include a second rotation drive unit 740 that moves linearly along the first direction together with the unit 500 and drives rotation of the second drive shaft unit 720.

The second driving unit 700 is coupled to the second rotation driving unit 740 to transmit driving force and has a rotation axis 730 parallel to the first direction, and the rotation axis (730) from the second rotation driving unit 740. It may additionally include a cross-axis power transmission unit 750 for transmitting the driving force transmitted to 730) to the second driving shaft unit 720.

The second drive unit 700 may further include a second rotary drive unit housing that is isolated from the processing space S, maintains the internal space at atmospheric pressure, and accommodates the second rotary drive unit 740.

The second driving unit 700 is coupled to the support frame unit 500 and guides the linear movement of the second moving block 710 in the first direction with respect to the support frame unit 500. It may additionally include a block guide part.

The laser processing device is configured to adjust the position of at least one of the first direction and the second direction of the viewport protection unit 400 so that the transmittance of the laser light through the viewport protection unit 400 does not decrease. It may further include a control unit that controls at least one of the first driving unit 600 and the second driving unit 700.

The laser processing device according to the present invention can effectively utilize the unused area of the viewport protection unit by variously adjusting the position of the viewport protection unit on the There is an advantage in that the replacement interval of the protective part can be maximized.

Specifically, the laser processing device according to the present invention includes a first driving part that linearly moves the viewport protection part in the longitudinal direction (first direction) of the chamber on a plane, and a first driving part that linearly moves the viewport protection part in the width direction (second direction) of the chamber. In constructing the second driving unit, the second driving unit is coupled to the first driving unit, so that when driven in the first direction by the first driving unit, the second driving unit moves in the first direction together and drives the movement of the viewport protection unit in the second direction. By adopting the structure, there is an advantage that the second direction position control of the viewport protection part can be performed more smoothly.

In addition, the laser processing device according to the present invention includes a first driving part that linearly moves the viewport protection part in the longitudinal direction (first direction) of the chamber on a plane, and a first driving part that linearly moves the viewport protection part in the width direction (second direction) of the chamber. In constructing the second driving unit, the second driving unit is installed to be movable in the first direction by the first driving unit and a cross-axis gear (bevel gear) is applied to transmit the driving force through the second driving unit, thereby forming the second driving unit. There is an advantage that linear movement in the second direction of the viewport protection part can be realized by installing it without being limited to a narrow space in the width direction (second direction) of the chamber.

Figure 1 is a perspective view showing a laser processing device according to the present invention.
FIG. 2 is a plan view showing part of the configuration of the laser processing device of FIG. 1.
FIGS. 3A to 3D are plan views showing the particle stacking area on the upper surface of the viewport protection unit according to the position of the viewport protection unit of the laser processing device of FIG. 1.
FIG. 4 is a plan view showing part of the configuration of the laser processing device of FIG. 1.

Hereinafter, the laser processing device according to the present invention will be described with reference to the attached drawings.

As shown in FIGS. 1 to 4, the laser processing device according to the present invention includes a chamber 100 in which a processing space (S) for substrate processing using a laser is formed; a carrier 200 that supports the substrate 10 so that the processing surface of the substrate 10 faces downward and is installed to be linearly movable along the longitudinal direction (hereinafter, the first direction) of the chamber 100; A laser module ( 300) and; a viewport protection unit 400 installed at intervals above the viewport 102 to prevent the viewport 102 from being contaminated by particles in the processing space (S); A support frame unit that supports the viewport protection unit 400 and is movably installed along the width direction (hereinafter, second direction) of the chamber 100, where the viewport protection unit 400 is perpendicular to the first direction. (500) and; a first driving unit 600 installed inside the chamber 100 and configured to move the support frame unit 500 in the first direction; It moves along the first direction together with the support frame part 500 by the first driving part 600, and moves the viewport protection part 400 along the second direction with respect to the support frame part 500. It includes a second driving unit 700 for relative movement.

Here, the substrate 10, which is the subject of substrate processing, is a component on which substrate processing such as etching and deposition is performed, and is used to process substrates such as semiconductor manufacturing substrates, LCD manufacturing substrates, OLED manufacturing substrates, solar cell manufacturing substrates, and transparent glass substrates through laser processing. Any substrate is possible as long as it requires one.

In particular, the substrate 10 is a substrate for OLED manufacturing, and can be processed to form contact holes using a laser to lower the resistance of the cathode electrode by connecting the cathode electrode and the auxiliary electrode, and can be a large-area substrate. there is.

The chamber 100 is configured to form a processing space (S) for substrate processing using a laser, and various configurations are possible.

For example, the chamber 100 includes a chamber body forming the processing space S, and a ceiling portion installed at the top of the chamber body and formed with a curvature corresponding to the rotation radius so that the substrate 10 can be rotated. may include.

The interior of the chamber 100 may be in various conditions depending on process conditions, such as a vacuum state or an atmospheric pressure state, and more preferably, it may be maintained in a vacuum state.

The chamber main body forms the processing space (S), and various configurations are possible.

The chamber main body includes a region where the substrate 10, which is introduced with the processing surface facing upward, is flipped so that the processing surface faces downward, and the flipped substrate 10 is supported by the carrier 200 into the chamber. The area to be laser processed by the laser module 300 may be formed by linear movement along the longitudinal direction of the main body.

The carrier 200 supports the substrate 10 so that the processing surface of the substrate 10 faces downward and is installed to be linearly movable along the longitudinal direction (hereinafter, the first direction) of the chamber 100. Various configurations are possible.

Here, the first direction is the linear movement direction of the carrier 200 and may be defined as the longitudinal direction of the chamber 100 (based on the drawing, X-axis direction).

At this time, the present invention may include a traveling axis (not shown) installed in the processing space (S) so that the carrier 200 can move linearly within the processing space (S).

The traveling axis is installed in the processing space (S) so that the carrier 200 can move linearly, and various configurations are possible.

For example, the traveling axes may be installed as a pair and combined with the carrier 200 may allow the carrier 200 to move stably.

Additionally, the driving shaft may be made of INVAR material with a low thermal expansion coefficient to maintain durability in a vacuum environment and a high temperature environment.

Meanwhile, the carrier 200 may be capable of moving in at least one of the X, Y, and Θ directions.

For example, the carrier 200 may be an XYΘ table with a three-stage structure, and more preferably, a UVW table with a two-stage structure.

Meanwhile, through this, the carrier 200 enables precise positioning of the supported substrate 10, and more specifically, as a UVW table, it has one linear motor installed in the first stage and two motors installed in the second stage. Using two linear motors, it may be possible to move in at least one of the X, Y, and Θ directions.

As a result, the carrier 200, which linearly moves on a pre-installed traveling axis, can be moved in at least one of the X, Y, and Θ directions, allowing substrate processing through the fixedly installed laser module 300 to be performed at a more precise position. .

For example, the carrier 200 may be equipped with an electrostatic chuck that electrostatically adsorbs the substrate 10.

As another example, it goes without saying that the substrate 10 can be fixed to the carrier 200 by adsorbing it through vacuum adsorption, or by using other physical members.

The laser module 300 is installed outside the chamber 100 and transmits laser light to the processing surface of the substrate 10 transported by the carrier 200 through the viewport 102 provided on the lower side of the chamber 100. Various configurations are possible with the configuration being investigated.

For example, the laser module 300 may be configured to form a contact hole for connecting the cathode electrode and the auxiliary electrode on the processing surface of the substrate 10 in order to lower the resistance of the cathode electrode.

On the other hand, in the case of processing in a face-up state where the processing surface of the substrate 10 faces upward, there may be a problem in which the processed floating material re-adheres to the processing surface of the substrate 10 due to gravity, so the substrate 10 ) can be processed in a face-down state with the processing surface facing downward.

To this end, the laser module 300 is located on the outer lower side of the chamber 100 and can be flipped to irradiate laser light upward toward the processing surface of the substrate 10 facing downward.

Additionally, the laser module 300 may include a plurality of irradiation units (not shown) that irradiate laser light, and a laser body (not shown) in which the plurality of irradiation units are formed.

The viewport protection unit 400 is installed at intervals on the upper side of the viewport 102 to prevent the viewport 102 from being contaminated by particles in the processing space (S), and can be configured in various ways.

The viewport 102 is a window provided on the lower side of the chamber 100 and can be installed in the opening 104 formed on the lower side of the chamber 100.

Laser light emitted from the laser module 300 may be irradiated onto the processing surface of the substrate 10 through the viewport 102.

The viewport protection unit 400 is a member installed at intervals on the upper part of the viewport 102 to prevent particles generated in the processing space (S) from accumulating on the upper side of the viewport 102, and is a glass member through which laser light can pass. It may be made of material.

For example, the viewport protection unit 400 includes a protective glass 410 through which laser light can pass through, and an outer frame 420 installed at the edge of the protective glass 410 to support the protective glass 410. It can be included.

The protective glass 410 is a plate made of glass, and can have various planar shapes as long as it covers the viewport 102, and can be formed at various thicknesses depending on the design.

The outer frame 420 is a frame that is coupled to the edge of the protective glass 410 and supports the protective glass 410, and can be configured in various ways. It can be made of various materials as long as it has rigidity.

The support frame unit 500 supports the viewport protection unit 400, and the viewport protection unit 400 moves along the width direction (hereinafter, the second direction) of the chamber 100 perpendicular to the first direction. A variety of configurations are possible with possible installation configurations.

Here, the second direction is the direction in which the viewport protection unit 400 linearly moves with respect to the support frame unit 500, and the direction of the chamber 100 perpendicular to the first direction (linear movement direction of the carrier 200) It can be defined in the width direction.

The support frame unit 500 supports the viewport protection unit 400 and has various shapes if the viewport protection unit 400 can be installed to be movable relative to the support frame unit 500 in a second direction. and materials.

The first driving unit 600 is installed inside the chamber 100, and is a driving unit for moving the support frame unit 500 in the first direction and can be configured in various ways.

For example, the first driving part 600 includes a first driving shaft part 610 installed along a first direction in the chamber 100 and having threads formed on the outer peripheral surface, and a first driving shaft part 610 that rotates. A first movable block that can be inserted and linearly moves in the first direction according to the rotation of the first drive shaft portion 610 and is coupled to the support frame portion 500, and a first movable block that guides the linear movement of the first movable block. It may include a moving block guide unit 620.

The first drive shaft unit 610 is a screw shaft installed along a first direction in the chamber 100 and has threads formed on the outer peripheral surface, and can have various configurations.

As shown in FIG. 2, the first drive shaft unit 610 may be installed as a pair on both sides of the chamber 100.

The first drive shaft unit 610 is coupled to the first rotation drive unit 612 at one end and can be rotated by the rotation drive of the first rotation drive unit 612.

The first moving block is a configuration in which the first driving shaft part 610 is rotatably inserted and moves linearly in the first direction according to the rotation of the first driving shaft part 610, and is connected to the female thread of the ball screw or lead screw. It can correspond to absence.

The first movable block is coupled to the support frame 500, so that the support frame 500 can be linearly moved along the first direction (X-axis direction based on the drawing) together with the first movable block.

At this time, since the viewport protection unit 400 is coupled to the support frame unit 500, it can be linearly moved along the first direction (X-axis direction based on the drawing) together with the support frame unit 500.

The first moving block guide unit 620 is a linear guide that guides the linear movement of the first moving block and can have various configurations.

Of course, the first moving block guide unit 620 can also be installed as a pair in correspondence with the first driving shaft unit 610.

In the case of the above-described first driving part 600, the support frame part 500 can be directly driven by a ball screw motor or lead screw motor, and accordingly, the support frame part 500 moves in the longitudinal direction of the chamber 100 ( It can be linearly moved in all areas within the chamber 100 along the first direction.

The second driving unit 700 moves along the first direction together with the support frame unit 500 by the first driving unit 600, and moves the viewport protection unit 400 in a second direction with respect to the support frame unit 500. Various configurations are possible for relative movement along a direction.

The second driving part 700 can be moved in the first direction together with the support frame 500 by the first driving part 600 by being coupled to the first driving part 600 or the support frame part 500. there is.

The second driving part 700 includes a second driving shaft part 720 installed along a second direction and having threads formed on the outer peripheral surface, and the second driving shaft part 720 is rotatably inserted to form a second driving shaft. The second moving block 710, which linearly moves in the second direction according to the rotation of the unit 720 and is coupled to the viewport protection unit 400, is moved together with the support frame unit 500 by the first driving unit 600. It may include a second rotation drive unit 740 that moves linearly in one direction and drives rotation of the second drive shaft unit 720.

As shown in FIG. 4, the second drive shaft unit 720 is a screw shaft installed along the second direction and having threads formed on the outer peripheral surface, and can be configured in various ways.

The second driving shaft unit 720 is installed on the first driving unit 600 or the support frame 500 and is moved in the first direction by the first driving unit 600, and is used as a second rotation driving unit 740 to be described later. It can be rotated by rotational drive.

The second moving block 710 is configured to rotatably insert the second driving shaft part 720 and move linearly in the second direction according to the rotation of the second driving shaft part 720, using a ball screw or lead. It can correspond to the female thread member of the screw.

The second moving block 710 may be combined with the viewport protection unit 400, and accordingly, when the second moving block 710 linearly moves in the second direction, the viewport protection unit 400 also moves in the second direction. It can be moved linearly in any direction.

At this time, the second driving unit 700 may include a second moving block guide unit (not shown) that is coupled to the support frame unit 500 and guides the linear movement of the second moving block 710 in the second direction. there is.

The second moving block guide part is a linear guide that guides the linear movement of the second moving block 720 in the second direction and can be configured in various ways.

The second moving block guide part is installed at least one of between the second moving block 720 and the support frame part 500 or between the outer frame 420 and the support frame part 500 of the viewport protection part 400. It can be.

The second rotation drive unit 740 is linearly moved along the first direction together with the support frame unit 500 by the first drive unit 600, and serves as a driving source that drives the rotation of the second drive shaft unit 720. Configuration is possible.

The second rotation drive unit 740 is coupled to the first drive unit 600 or the support frame unit 500, so that the second rotation drive unit 740 is linear along the first direction together with the support frame unit 500 by the first drive unit 600. can be moved

In one embodiment, the second driving unit 700 is coupled to the second rotation driving unit 740 to transmit driving force and is connected to a rotation axis 730 parallel to the first direction and a second rotation driving unit 740. It may additionally include a cross-axis power transmission unit 750 for transmitting the driving force transmitted to the rotation shaft 730 to the second driving shaft unit 720.

The rotation axis 730 may be installed in a direction parallel to the first direction in consideration of the space in the width direction of the chamber 100.

At this time, the rotation axis 730 and the second drive shaft unit 720 may intersect each other perpendicularly.

The cross-axis power transmission unit 750 is configured to transmit the driving force transmitted to the rotation shaft 730 by the second rotation drive unit 740 to the second drive shaft unit 720, and can have various configurations.

For example, the cross-axis power transmission unit 750 is a bevel installed at the end coupling portion of the rotation axis 730 of the second rotation drive unit 740 and the second drive shaft unit 720, as shown in FIG. It may include gears 752 and 754.

Through this, the second rotation drive unit 740 for driving the viewport protection unit 400 in the second direction can be installed by utilizing the internal space of the existing chamber 100 without increasing the size of the chamber 100 in the width direction. there is.

As another example, although not shown, the second rotation drive unit 740 may be directly connected to one end of the second drive shaft unit 720 and drive the rotation of the second drive shaft unit 720.

In this case, it goes without saying that a separate power transmission structure for transmitting power from the rotation shaft 730 of the second rotation drive unit 740 to the second drive shaft toe 720 is unnecessary.

Meanwhile, while the processing space (S) inside the chamber 100 must maintain a vacuum atmosphere, the second rotation drive unit 740 is installed in an atmospheric pressure environment (ATM), and the second rotation drive unit 740 is installed in the processing space ( S) needs to be isolated.

To this end, the second driving unit 700 is isolated from the processing space (S), maintains the internal space at atmospheric pressure, and may additionally include a second rotating driving unit housing that accommodates the second rotating driving unit 740. .

Meanwhile, as shown in FIG. 1, the laser processing device may additionally include a viewport protection unit replacement module 900 for replacing the viewport protection unit 400 coupled to one side of the chamber 100. there is.

The viewport protection unit replacement module 900 accommodates the viewport protection units 400 and can be replaced from the chamber 100 through a gate (G) installed between the viewport protection unit replacement module 900 and the chamber 100. By receiving the necessary viewport protection unit 400 and delivering a new viewport protection unit 400 to the chamber 100, various configurations are possible to enable replacement of the viewport protection unit 400.

Meanwhile, the laser processing device including the above-described configuration adjusts the position of at least one of the first direction and the second direction of the viewport protection unit 400 so that the transmittance of the laser light through the viewport protection unit 400 does not decrease. It may further include a control unit that controls at least one of the first driving unit 600 and the second driving unit 700.

Hereinafter, the operation of the control unit will be described in detail in relation to the movement of the laser processing device, particularly the viewport protection unit 400, in the first and second directions.

When the substrate 10 is introduced through one side of the chamber 100, it is flipped so that the processing surface faces downward and is then linearly moved along a first direction toward the other side of the chamber 100 by the carrier 200. .

The control unit operates the viewport 102 to prevent contamination of the viewport 102 as substrate processing is performed through the laser light emitted from the laser module 300 on the processing surface of the substrate 10 that is linearly moved along the first direction. By adjusting the position of the protection unit 400 in the first direction, the first driving unit 600 can be controlled to be located directly above the viewport 102.

When the position of the viewport protection view 400 is adjusted in the first direction by the first driving unit 600, the second driving unit 700 is also moved in the first direction together with the viewport protection unit 400.

At this time, the viewport protection unit 400 may be positioned as shown in FIG. 3A, and as substrate processing is performed, particles will be stacked in area A (particle stacking area) arranged along line g on the protective glass 410. You can.

As substrate processing continues, particles gradually accumulate in area A, and the power of the laser light passing through area A may gradually decrease.

At this time, the control unit may linearly move the viewport protection unit 400 in either the first direction or the second direction so that the power of the laser light passing through the protective glass 410 does not fall below a preset reference value. there is.

For example, while performing substrate processing with the viewport protection unit 400 positioned as shown in FIG. 3A, if particles are excessively stacked in area A, the control unit operates the first driving unit 600 as shown in FIG. 3B. By linearly moving the support frame unit 500 in the first direction, the position of the viewport protection unit 400 in the first direction can be adjusted by +△X.

Through this, area A arranged along line g can be re-corresponded to the unused area of the protective glass 410, and substrate processing can be performed by reusing the protective glass 410 without replacing the protective glass 410. You can.

As substrate processing continues, particles gradually accumulate in area A of FIG. 3B, and the power of the laser light passing through area A may gradually decrease.

At this time, the control unit linearly moves the viewport protection unit 400 again in either the first direction or the second direction so that the power of the laser light passing through the protective glass 410 does not fall below a preset reference value. You can.

For example, the control unit performs substrate processing with the viewport protection unit 400 positioned as shown in FIG. 3B, and if particles are excessively stacked in area A, the second driving unit 700 is operated as shown in FIG. 3C. By linearly moving the viewport protection unit 400 in the second direction with respect to the support frame unit 500, the position of the viewport protection unit 400 in the second direction can be adjusted by +△Y.

Through this, area A located on line p is adjusted to deviate from line p, so area A can be re-corresponded to the unused area of the protective glass 410, and the protective glass ( 410) can be used again to perform substrate processing.

As substrate processing continues, particles gradually accumulate in area A of FIG. 3C, and the power of the laser light passing through area A may gradually decrease.

At this time, the control unit linearly moves the viewport protection unit 400 again in either the first direction or the second direction so that the power of the laser light passing through the protective glass 410 does not fall below a preset reference value. You can.

For example, the control unit performs substrate processing with the viewport protection unit 400 positioned as shown in FIG. 3C, and if particles are excessively stacked in area A, the first driving unit 600 is operated as shown in FIG. 3D. By linearly moving the support frame unit 500 in the first direction, the position of the viewport protection unit 400 in the first direction can be adjusted by -△X.

Through this, area A arranged along line g can be re-corresponded to the unused area of the protective glass 410, and substrate processing can be performed by reusing the protective glass 410 without replacing the protective glass 410. You can.

In the present invention, the control unit appropriately adjusts the first and second direction positions of the viewport protection unit 400 through the first driving unit 600 and the second driving unit 700, thereby preventing the use of the protective glass 410. This has the advantage of minimizing the area and allowing the protection glass 410 to be used for a long time without replacement, thereby maximizing the replacement cycle of the viewport protection unit 400.

Since the above is only a description of some of the preferred embodiments that can be implemented by the present invention, as is well known, the scope of the present invention should not be construed as limited to the above embodiments, and the scope of the present invention described above Both the technical idea and the technical idea underlying it will be said to be included in the scope of the present invention.

10: substrate 100: chamber
200: Carrier 300: Laser module

Claims (8)

a chamber 100 in which a processing space (S) for substrate processing using a laser is formed;
a carrier 200 that supports the substrate 10 so that the processing surface of the substrate 10 faces downward and is installed to be linearly movable along the longitudinal direction (hereinafter, the first direction) of the chamber 100;
A laser module ( 300) and;
a viewport protection unit 400 installed at intervals above the viewport 102 to prevent the viewport 102 from being contaminated by particles in the processing space (S);
A support frame unit that supports the viewport protection unit 400 and is movably installed along the width direction (hereinafter, second direction) of the chamber 100, where the viewport protection unit 400 is perpendicular to the first direction. (500) and;
a first driving unit 600 installed inside the chamber 100 and configured to move the support frame unit 500 in the first direction; It moves along the first direction together with the support frame part 500 by the first driving part 600, and moves the viewport protection part 400 along the second direction with respect to the support frame part 500. A laser processing device comprising a second driving unit 700 for relative movement. In claim 1,
The viewport protection unit 400,
A laser processing device comprising a protective glass 410 through which the laser light can pass, and an outer frame 420 installed at an edge of the protective glass 410 to support the protective glass 410. . In claim 1,
The first driving unit 600,
A first driving shaft part 610 is installed in the chamber 100 along the first direction and has threads formed on the outer peripheral surface, and the first driving shaft part 610 is rotatably inserted to form the first driving shaft. A first movable block that moves linearly in the first direction according to the rotation of the unit 610 and is coupled to the support frame portion 500, and a movable block guide portion 620 that guides the linear movement of the first movable block. A laser processing device comprising: In claim 2,
The second driving unit 700,
A second drive shaft portion 720 installed along the second direction and having threads formed on the outer peripheral surface,
A second moving block in which the second driving shaft part 720 is rotatably inserted and moves linearly in the second direction according to the rotation of the second driving shaft part 720 and is coupled to the viewport protection part 400. (710) and,
It is linearly moved along the first direction together with the support frame part 500 by the first driving part 600 and includes a second rotation driving part 740 that drives rotation of the second driving shaft part 720. A laser processing device characterized in that. In claim 4,
The second driving unit 700,
A rotation axis 730 that is coupled to the second rotation drive unit 740 to transmit driving force and is parallel to the first direction, and a driving force transmitted from the second rotation drive unit 740 to the rotation shaft 730 A laser processing device characterized in that it additionally includes a cross-axis power transmission unit (750) for transmitting it to the second drive shaft unit (720). In claim 4,
The second driving unit 700 is isolated from the processing space (S), maintains the internal space at atmospheric pressure, and further includes a second rotating driving unit housing that accommodates the second rotating driving unit 740. A laser processing device. In claim 4,
The second driving unit 700,
It is coupled to the support frame part 500 and further includes a second moving block guide part that guides the linear movement of the second moving block 710 in the first direction with respect to the support frame part 500. A laser processing device that uses The method of any one of claims 1 to 7,
The laser processing device,
The first driving unit 600 to adjust the position of at least one of the first direction and the second direction of the viewport protection unit 400 so that the transmittance of the laser light through the viewport protection unit 400 does not decrease. and a control unit that controls at least one of the second driving units (700).

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