KR102003229B1 - A laser etching machine combined with drilling - Google Patents

Abstract

A laser drilling combined etching apparatus is disclosed. A laser drilling and etching apparatus according to the present invention includes a vacuum chamber in which an etching and a drilling process are performed on a substrate, a laser beam (Laser) is provided through a chamber window disposed outside the vacuum chamber and provided in a vacuum chamber, A laser unit connected to the laser unit and adjusting a distance between the laser processing head and the substrate to adjust a beam size for forming an etching line beam and a drilling spot beam on the substrate, Unit.

Description

Technical Field [0001] The present invention relates to a laser etching machine combined with drilling,

The present invention relates to an etching apparatus for both laser drilling, and more particularly, to a laser drilling and etching apparatus capable of performing laser drilling and etching processing on a substrate in one equipment.

BACKGROUND ART [0002] Substrates that are widely used for portable terminals, monitors for TVs and computers are widely used, including LCDs (Liquid Crystal Displays) and OLEDs (Organic Light Emitting Diodes).

Among them, an organic light emitting diode display (hereinafter referred to as an organic light emitting diode) refers to a self-emitting organic material that emits light by using an electroluminescent phenomenon that emits light when a fluorescent organic compound is energized. Organic light emitting diode displays (OLEDs) can be driven at low voltages and can be made thin and thin, have a wide viewing angle and fast response speed, and are currently being applied to various products.

Organic light emitting diode displays (OLEDs) can be divided into passive PMOLEDs and active AMOLEDs depending on the driving method. In particular, AMOLED is a self-emissive display that has a faster response speed than conventional displays, has a natural color and has low power consumption. In addition, if AMOLED is applied to film, not substrate, it can implement the technology of flexible display.

This organic light-emitting diode display (OLED) is manufactured through a pattern forming process, an organic thin film deposition process, an etching process, a sealing process, and a deposition process in which a substrate with an organic thin film deposited thereon and a sealing process .

Among the various processes described above, the etching process is a process of obtaining a desired shape by etching, i.e., drilling or etching, an unnecessary portion of the surface of the substrate by a physical or chemical method.

There are various physical and chemical methods used in the etching process as well as semiconductors. One of them is the laser etching method. The etching method of a substrate using a laser is simpler in structure and can reduce an etching time compared with other methods, and is widely used in recent years.

However, since the laser etching apparatus according to the prior art has a structure capable of performing only one process of drilling and etching, if both the drilling process and the etching process are required on the substrate, both the drilling equipment and the etching equipment must be installed, Print (foot-print) increases, installation costs increase, and tact time and logistics costs increase.

Korea Patent Office Domestic Patent Publication No. 10-2005-0083540

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide an apparatus and a method for laser drilling and laser etching of a substrate, And to provide a laser drilling combined etching apparatus capable of reducing time and logistics costs.

According to an aspect of the present invention, there is provided a plasma processing apparatus comprising: a vacuum chamber in which an etching and drilling process is performed on a substrate; And a laser processing head disposed outside the vacuum chamber and having a laser processing head for irradiating a laser beam onto the substrate through a chamber window provided in the vacuum chamber; And a beam size adjusting unit connected to the laser unit and configured to form an etching line beam and a drilling spot beam on the substrate by adjusting an interval between the laser processing head and the substrate, .

The beam size adjusting unit may include a head up / down moving part connected to the laser processing head and moving the laser processing head in a direction in which the laser processing head approaches and separates from the substrate.

The head up / down may include an LM block for a head to which the laser machining head is coupled; An LM guide for a head for guiding the movement of the head-use EL block; And a head electromotive force driving unit connected to the head electromotive force block for moving the head electromotive force block.

The head LM driver includes: a moving nut coupled to the laser processing head; A ball screw engaged with the moving nut; And a rotation motor connected to the ball screw for rotating the ball screw.

The laser processing head comprises: a plurality of multi-heads having a plurality of linear slots in which the laser beam is irradiated in a linear shape, the plurality of multi-heads being adjacent to each other; A supporting case integrally supporting the plurality of heads; And a head position individual adjustment unit coupled to the supporting case and connected to the multi-heads, respectively, for individually adjusting the positions of the multi-heads with respect to the supporting case.

The head position individual adjusting unit may include a tilting degree adjusting unit for adjusting a tilting degree of the multi-head with respect to the supporting case.

The tilting degree adjusting unit may include a pair of first and second tilting degree adjusting bolts arranged in pairs for each of the multi-head units and spaced from each other and rotatably coupled to the supporting case.

A folding hook for a handle may be coupled to an exposed end of the first and second tilting degree adjusting bolts.

The head position individual adjusting unit may further include a height adjuster for adjusting the height of the multi-head with respect to the supporting case.

The height adjusting portion includes a rail block coupled to the multi-head and having a rail groove formed at one side thereof; A rail flange having one side connected to the supporting case and the other side connected to the rail groove of the rail block in a rail-like manner to guide the height movement of the multi-head; And a block presser connected to the rail block to press the rail block such that the rail block is moved along the longitudinal direction of the rail flange.

Wherein the block presser includes a protruding bracket protruding outward from an outer wall of the supporting case; A seesection member having one side disposed in the protruding bracket and the other side connected to the rail block on the inside of the supporting case; A pivoting portion coupled to the supporting case in which the protruding bracket is located to allow the seesection member to seesaw; And a pressurizing plunger rotatably coupled to the protruding bracket and pressing one end of the seesaw member.

The pressing plunger is rotatably coupled to a partition wall formed on the protruding bracket and a fixing member for fixing the position of the seesection member is rotatably coupled to the partition wall adjacent to the pressing plunger.

The height adjuster may further include a buffer member coupled to an end of the seesection member that is in contact with the rail block.

According to the present invention, there is provided a laser processing apparatus including: a laser unit having a laser processing head for irradiating a laser beam; a laser beam processing unit for adjusting a distance between the laser processing head and the substrate, By providing the sizing unit, laser drilling and etching of the substrate can be performed by a single device, which can reduce the device foot-print, reduce the installation cost of the device, and reduce the tact time and the cost of logistics It is possible to provide a laser-drilling combined etching apparatus capable of reducing the etching rate.

1 is a structural view of a laser drilling etching apparatus according to an embodiment of the present invention.
Fig. 2 is a view showing the beam size adjusting unit of Fig. 1. Fig.
Fig. 3 is a perspective view showing the laser processing head of Fig. 1;
4 is a rear perspective view of FIG. 3. FIG.
Figs. 5 and 6 are views showing the state in which the side wall plates are removed in Figs. 3 and 4, respectively.
7 is an enlarged view of the area B in Fig.
8 is an enlarged view of the area C in Fig.
9 is a view for explaining the tilting operation structure of the laser machining head.
Figs. 10 and 11 are views for explaining a height operation structure of the laser machining head. Fig.
12 and 13 are operation state diagrams showing changes in beam size according to the operation of the etching apparatus for both laser drilling in Fig.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

Before describing the drawings, any substrate of LCD (Liquid Crystal Display), PDP (Plasma Display Panel) and OLED (Organic Light Emitting Diodes) may be used as a substrate to be described below. In this embodiment, Light Emitting Diodes) will be referred to as a " substrate ". Here, the term " large size " may refer to a size having a length of about 2 m or more.

FIG. 1 is a structural view of a laser drilling and etching apparatus according to an embodiment of the present invention, FIG. 2 is a view showing a beam size adjusting unit of FIG. 1, FIG. 3 is a perspective view of the laser processing head of FIG. 1 FIG. 4 is a rear perspective view of FIG. 3, FIGS. 5 and 6 are views of the state in which the side wall plates are removed in FIGS. 3 and 4, 9 is a view for explaining the tilting operation structure of the laser machining head, FIGS. 10 and 11 are views for explaining the height operation structure of the laser machining head, and FIGS. 12 and 12 13 is an operational state view showing a change in beam size according to the operation of the etching apparatus for both laser drilling in Fig.

1 to 13, a laser drilling and etching apparatus according to the present embodiment includes a vacuum chamber 110 in which an etching and drilling process is performed on a substrate G, a vacuum chamber 110, And a laser processing head 300 disposed outside the vacuum chamber 110 and irradiating a laser beam L onto a substrate G through a chamber window 111 provided in the vacuum chamber 110. [ And a laser beam generator 120 connected to the laser unit 120 and adjusting the distance between the laser processing head 300 and the substrate G to apply an etching line beam and a spot beam for drilling and a inspection unit 140 which is disposed outside the vacuum chamber 110 and inspects a processing region of the substrate G processed by the laser unit 120 do.

The vacuum chamber 110 is a box-shaped structure as shown in detail in FIG. 1, and a drilling process and an etching process for the substrate G are performed therein.

A gate valve (not shown) is provided on one side wall of the vacuum chamber 110 to allow the substrate G to go in and out. In the vacuum chamber 110, a substrate adsorption carrier (not shown) for holding and moving the substrate G is provided. An electrostatic chuck (not shown) or a magnetic force chuck (not shown) for chucking the substrate G may be provided on the substrate adsorption carrier (not shown).

The substrate adsorption carrier (not shown) is moved in the direction of the arrow in Fig. 1 with the substrate G chucked.

A chamber window 111 is provided on the bottom surface of the vacuum chamber 110. The chamber window 111 is a window through which the laser beam L of a specific wavelength can be passed and a laser beam L from the laser unit 120 disposed outside the vacuum chamber 110 is passed through the vacuum chamber 110, So that it is allowed to pass through the inside. In the present embodiment, a plurality of chamber windows 111 may be provided on the bottom surface of the vacuum chamber 110.

Further, on the bottom surface of the vacuum chamber 110, an inspection window 112 for inspection of the inspection unit 140 is provided, as shown in detail in FIG. The inspection window 112 is provided with a material having excellent light transmittance as a window for inspection unit 140.

The laser unit 120 irradiates the laser beam L to the substrate G in the vacuum chamber 110 through the chamber window 111 to advance the drilling process and the etching process. In this embodiment, the laser unit 120 is disposed outside the vacuum chamber 110, that is, in the lower region. It is not preferable that the configurations other than the substrate G are disposed inside the vacuum chamber 110 because a high-pressure vacuum is formed in the inside of the vacuum chamber 110.

The laser unit 120 of this embodiment is disposed in the lower region of the vacuum chamber 110 and irradiates the laser beam L onto the substrate G through the chamber window 111 at the position, Process.

The laser unit 120 includes a laser oscillator (not shown) in which the laser beam L is oscillated, a laser converter (not shown) that converts the laser beam L oscillated by the laser oscillator, And a laser processing head 300 that receives the converted laser beam L and irradiates the laser beam L onto the substrate G. [

A laser oscillator (not shown) serves to oscillate the laser beam L, and a laser converter (not shown) is disposed between the laser oscillator 410 and the laser processing head 300, And serves to convert the oscillated laser beam L. The laser converter (not shown) includes a plurality of mirrors.

The laser processing head 300 receives the laser beam L from the laser converter and irradiates the laser beam L onto the substrate G through a window. For convenience of explanation, the configuration of the laser machining head 300 will be described later.

The beam size adjusting unit 130 adjusts the distance between the laser processing head 300 and the substrate G to image the line beam for etching and the spot beam for drilling on the substrate G. [

This beam-size adjusting unit 130 is connected to the laser machining head 300 and controls the head up / down movement to move the laser machining head 300 in a direction in which the laser machining head 300 approaches and separates from the substrate G (131).

2, the head up / down movement unit 131 includes an LM block 132 for a head to which the laser processing head 300 is coupled, A LM guide 133 for a head for guiding the movement of the head-use ELM block 132 and a head LM driver 132 for moving the head-use ELM block 132, ).

In this embodiment, the head-use EL block 132 is connected to the supporting case 320, which will be described later, of the laser processing head 300. The head-use EL block 132 is moved in the vertical direction to adjust the distance between the laser processing head 300 and the substrate G.

The head-use LM driving unit 134 is connected to the head-use ELM block 132, and moves the head-use ELM block 132. The head drive LM drive unit 134 includes a moving nut (not shown) coupled to the laser machining head 300, a ball screw (not shown) engaged with the moving nut, And includes a rotation motor 135.

The ball screw is rotated by the rotation motor 135. The ball nut is moved in the vertical direction along the ball screw by the rotation of the ball screw, and the head-use EL block 132 coupled to the movement nut is moved up and down .

The distance between the processing head and the substrate G is changed by the above-described head-up / down moving part 131, whereby the beam size of the laser beam L, which is formed on the substrate G, do.

When the head up / down movement section 131 moves the laser processing head 300 in the direction away from the substrate G, as shown in Fig. 12, the laser beam L is defocused the laser beam L defocused and imaged on the substrate G has the shape of a line beam used in the etching process. 12 shows a multi-head 310 to be described later provided in the laser processing head 300 for convenience of illustration. Since the multi-head 310 is provided in the laser processing head 300, the multi-head 310 is also moved when the laser processing head 300 moves.

On the other hand, when the head up / down moving part 131 moves the machining head in the direction away from the substrate G, the laser beam L is guided to the substrate G The laser beam L focused and focused on the substrate G has the shape of a spot beam used in the drilling process. 13, the multi-head 310 to be described later provided in the laser machining head 300 is shown for convenience of illustration in the same manner as in Fig.

As described above, the laser drilling and etching apparatus according to the present embodiment adjusts the distance between the laser processing head 300 and the substrate G to adjust the beam size for etching the line beam for etching and the spot beam for drilling The laser drilling process and the etching process for the substrate G can be carried out in one place unlike the conventional technique in which the laser drilling process and the laser etching process are performed in separate equipment by providing the adjusting unit 130, - It has the advantage of reducing print (foot-print), reducing installation cost, and reducing tact time and logistics costs.

The laser processing head 300 irradiates the substrate G with the laser beam L onto the substrate G through the chamber window 111. On the other hand, As shown in FIGS. 3 to 11, the laser processing head 300 includes a plurality of multi heads 310, a supporting case 320 supporting a plurality of multi heads 310, And a head position individual adjustment portion 330 coupled to the case 320 and connected to the multiple heads 310 and individually adjusting the positions of the multi heads 310 with respect to the supporting case 320 .

The multi-head 310 is a portion to which the laser beam L is irradiated. A straight slot 311 is formed in the multi-head 310 so that the laser beam L is irradiated in a linear shape.

In this embodiment, a plurality of the multi-heads 310 are disposed on the supporting case 320 so as to be adjacent to each other. The plurality of multi-heads 310 have the same structure.

Since the linear laser beam L having a long length can be irradiated through the linear slots 311 formed in the multiple heads 310, even when the multi-heads 310 are arranged as in the present embodiment, Laser processing can be performed without moving the head 310. Therefore, the tact time can be remarkably reduced as compared with the prior art. In the case of this embodiment, three multi-heads 310 are applied, but the number of multi-heads 310 may be two, or may be four or more, so that the scope of the present invention is not limited to the number of the multi-heads 310.

The supporting case 320 serves to support a plurality of the multi-heads 310 integrally. The supporting case 320 includes a side wall plate 321 having a wide opening portion 322 and a rear wall plate 321 on which a plurality of structures constituting the head position individual adjusting portion 330, 323 and a pair of side plates 324 which are cross-connected to the side wall plate 321 and the rear wall plate 323 and form both sides. Unlike the side wall plate 321 and the rear wall plate 323, the side plate 324 can be formed in a stepped shape.

On the other hand, the head position individual adjustment unit 330 individually adjusts the positions of the multi heads 310 with respect to the supporting case 320.

The head position individual adjustment unit 330 includes a tilting adjustment unit 340 for adjusting the tilting degree of the multi head 310 with respect to the supporting case 320 and a tilting degree adjustment unit 340 for adjusting the tilting degree of the multi head 310 with respect to the supporting case 320. [ And a height adjustment unit 350 for adjusting the height.

When the laser processing head 300 is equipped with the tilting degree adjusting unit 340 and the height adjusting unit 350 as shown in the present embodiment, It is possible to easily adjust the position, that is, the working distance, which can lead to an improvement in the laser processing quality.

First, the tilting degree adjusting unit 340 controls the tilting degree of the multi-head 310 with respect to the supporting case 320.

In this embodiment, the tilting degree adjusting unit 340 is applied as a mechanical tilting degree adjusting unit 340 operated by a manual operation.

The tilting degree adjusting unit 340 includes a pair of first and second tilting adjustment bolts 341 and 342 which are disposed as a pair for each of the multi heads 310 and are spaced from each other and rotatably coupled to the supporting case 320 ).

The first and second tilting adjustment bolts 341 and 342 are disposed in a pair so as to be spaced apart from each other with respect to one multi-head 310 as shown in FIGS. The first and second tilting adjustment bolts 341 and 342 are disposed across the rear wall plate 323 of the supporting case 320.

At the exposed ends of the first and second tilting degree adjusting bolts 341 and 342, the folding hook 343 for the handle is engaged. The grip folding ring 343 is a means for manually operating the first and second tilting adjustment bolts 341 and 342 without a separate tool.

When the first tilting degree adjusting bolt 341 shown in the right side of FIG. 17 is rotated and advanced, the right side of the multi-head 310 is moved toward the left side by the advance amount of the first tilting degree adjusting bolt 341 It can be tilted. On the contrary, if the first tilting adjustment bolt 341 shown in the left side is rotated and advanced, the left side of the multi-head 310 can be tilted with respect to the right side by the advance amount of the second tilting adjustment bolt 342. The inclined state of the multi-head 310 can be adjusted by controlling the tilting. Thus, the linearity of the linear slot 311 provided on the multi-head 310 can be easily controlled.

Next, the height adjuster 350 adjusts the height of the multi-head 310 with respect to the supporting case 320.

In this embodiment, the height adjusting part 350 is also applied to the mechanical type height adjusting part 350, which is operated mechanically by a manual operation like the tilting degree adjusting part 340.

7, Fig. 10 and Fig. 11, the height adjusting portion 350 includes a rail block 351 coupled to the multi-head 310 and having a rail groove 352 formed on one side thereof, A rail flange 353 coupled to the supporting case 320 and the other to the rail groove 352 of the rail block 351 to guide the height movement of the multi head 310, And a block pusher 360 for pressing the rail block 351 such that the rail block 351 is moved along the longitudinal direction of the rail flange 353. [

The rail block 351 is a structure that is coupled to the multi-head 310 as best shown in FIG. That is, the rail block 351 forms a body with the multi-head 310.

When the rail block 351 is moved along the vertical direction, a rail flange 353 is provided so as to be guided. One side of the rail flange 353 is connected to the supporting case 320 and the other side of the rail flange 353 is coupled to the rail groove 352 of the rail block 351 in a rail manner to guide the height movement of the multi head 310. For stable guidance, rail flanges 353 are provided in pairs to guide both sides of the rail block 351.

The block pressing portion 360 serves to press the rail block 351 such that the rail block 351 is moved along the lengthwise direction of the rail flange 353. The block pushing portion 360 may include a protruding bracket 361, a seesection member 362, a pivot rotating portion 363, and a pressurizing plunger 364.

The protruding bracket 361 is a structure protruding outward from the outer wall of the supporting case 320, that is, the rear wall plate 323 of the supporting case 320. The seesaw member 362 and the like are mounted in the protruding bracket 361. The protruding bracket 361 is provided with a partition wall 361a.

The seesection member 362 is a rod structure in which one side is disposed in the protruding bracket 361 and the other side is connected to the rail block 351 inside the supporting case 320. The seesection member 362 presses the rail block 351 while seeping through the pivot rotating portion 363. A buffer member 366 is coupled to an end of the seesaw member 362 that is in contact with the rail block 351.

The pivot rotating portion 363 is coupled to the supporting case 320 where the protruding bracket 361 is positioned, and serves to cause the seesection member 362 to perform a seesaw motion. In this embodiment, the pivot rotating portion 363 is formed in a substantially circular shape in cross section and is coupled to the supporting case 320 so as to intersect with the longitudinal direction of the seesection member 362 so as to enable seesaw motion of the seesection member 362 do.

The pressure plunger 364 is rotatably coupled to the partition wall 361a of the protruding bracket 361 and serves to press one end of the seesection member 362. [

11, when the presser plunger 364 is manually operated to press one end of the seesaw member 362, the seesaw member 362 performs a seesaw motion with the pivot rotating portion 363 as an axis, ). Accordingly, the multi-head 310 can be moved downward in the direction of the thick arrow in FIG. 11, and the height of the multi-head 310 can be adjusted by this action. In order to raise the multi-head 310, the multi-head 310 may be forced upward while pressing down.

On the other hand, a fixing member 365 is provided around the pressurizing plunger 364 to fix the operation of the pressurizing plunger 364. The fixing member 365 is provided on the partition wall 361a adjacent to the pressure plunger 364 and serves to fix the position of the seesection member 362. [

In other words, after the pressurizing plunger 364 is operated, the seesection member 362 can be fixed in motion through the fixing member 365 so that the seesaw member 362 is not operated arbitrarily. The fixing member 365 may be a conventional screw.

The use of the laser machining head 300 having the structure and action as described above allows the laser machining to proceed without increasing the tact time even when the large substrate G is applied, have.

On the other hand, the inspection unit 140 is disposed outside the vacuum chamber 110. Since the inside of the vacuum chamber 110 is formed in a vacuum atmosphere as described above, it is not preferable that the configurations other than the substrate G are disposed inside the vacuum chamber 110, As shown in Fig.

The inspection unit 140 includes a flatness inspection module (not shown) for measuring the flatness of the substrate G and a laser processing part disposed adjacent to the flatness inspection module (not shown) And an inspection unit frame unit (not shown) to which a flatness inspection module (not shown) and a processing site inspection module (not shown) are coupled.

Hereinafter, the operation of the laser drilling and etching apparatus according to the present embodiment will be described with reference to Figs. 1 to 13 with reference to Figs. 12 and 13. Fig. 12 and 13, only one multi-head 310 is shown in the laser machining head 300 for convenience of explanation.

The multi head 310 of the laser processing head 300 is moved in the direction in which the multi head 310 approaches and separates from the substrate G and is imaged on the substrate G by the head up / The beam size of the laser beam L is changed.

First, when an etching operation is required for the substrate G, the head up / down moving part 131 moves the multi head 310 in the direction away from the substrate G, And moves it downward.

When the distance between the multi-head 310 and the substrate G is increased, as shown in FIG. 12, the laser beam L defocused and image-formed on the substrate G is deflected And has a shape of a line beam used in an etching process.

When a drilling operation is required for the next substrate G, the head up / down moving unit 131 moves the multi head 310 in a direction in which the multi head 310 approaches the substrate G, To the upper side.

When the distance between the multi-head 310 and the substrate G approaches, as shown in Fig. 13, the laser beam L is focused on the substrate G and is focused on the substrate G, (L) has the shape of a spot beam used in the drilling process.

As described above, the laser drilling and etching apparatus according to the present embodiment adjusts the gap between the multi-head 310 and the substrate G to adjust the beam size for forming the etching line beam and the drilling spot beam on the substrate G The laser drilling process and the etching process for the substrate G can be performed in one place, unlike the conventional technique in which the laser drilling process and the laser etching process are performed in separate equipment by providing the unit 130, It has the advantage of reducing footprint, reducing equipment installation costs, and reducing tact time and logistics costs.

Although the embodiment has been described in detail with reference to the drawings, the scope of the scope of the present embodiment is not limited to the above-described drawings and description.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

110: vacuum chamber 111: chamber window
112: Inspection window 120: Laser unit
130: beam size adjustment unit 131: head up / down movement unit
132: EL block for head 133: LM guide for head
134: LM driving part for head 135:
140: inspection unit 300: laser machining head
310: Multihead 311: Straight slot
320: Supporting case 330: Head position individual adjustment part
340: tilting degree adjusting section 341: first tilting degree adjusting bolt
342: Bolt for adjusting the second tilting angle 343: Folding ring for the handle
350: height adjuster 351: rail block
352: rail groove 353: rail flange
360: block pressing portion 361: protruding type bracket
361a: partition wall 362: seat member
363: pivot rotating part 364: pressure plunger
365: Fixing member 366: Buffer member

Claims (13)

A vacuum chamber in which etching and drilling processes are performed on the substrate;
And a laser processing head disposed outside the vacuum chamber and having a laser processing head for irradiating a laser beam onto the substrate through a chamber window provided in the vacuum chamber; And
And a beam size adjusting unit connected to the laser unit and configured to form an etching line beam and a drilling spot beam on the substrate by adjusting an interval between the laser processing head and the substrate,
The laser machining head comprising:
A plurality of multi-heads having linear slots in which the laser beam is irradiated in a linear shape and are arranged in a plurality of adjacently adjacent positions;
A supporting case integrally supporting the plurality of heads; And
And a head position individual adjusting unit coupled to the supporting case and connected to the multi-heads, respectively, for individually adjusting positions of the multi-heads with respect to the supporting case,
The head position individual adjustment unit may include:
A tilting degree adjusting unit for adjusting a tilting degree of the multi-head with respect to the supporting case; And
And a height adjuster for adjusting the height of the multi-head with respect to the supporting case,
Preferably,
A rail block coupled to the multihead and having a rail groove formed on one side thereof;
A rail flange having one side connected to the supporting case and the other side connected to the rail groove of the rail block in a rail-like manner to guide the height movement of the multi-head; And
And a block presser connected to the rail block for pressing the rail block so that the rail block is moved along the longitudinal direction of the rail flange,
Wherein the block-
A protruding bracket protruding outward from an outer wall of the supporting case;
A seesection member having one side disposed in the protruding bracket and the other side connected to the rail block on the inside of the supporting case;
A pivot rotating portion coupled to the supporting case in which the protruding bracket is located to allow the seesection member to seesaw; And
Further comprising a pressurizing plunger rotatably coupled to the protruding bracket and pressing one end of the seesaw member. The method according to claim 1,
Wherein the beam size adjusting unit comprises:
And a head up / down moving part connected to the laser processing head and moving the laser processing head in a direction in which the laser processing head approaches and separates from the substrate. 3. The method of claim 2,
The head-up / down (up / down)
An LM block for a head to which the laser processing head is coupled;
An LM guide for a head for guiding the movement of the head-use EL block; And
And a head L-driver connected to the head-use L-block for moving the head-use L-block. The method of claim 3,
The head-side L-
A moving nut coupled to the laser processing head;
A ball screw engaged with the moving nut; And
And a rotating motor connected to the ball screw for rotating the ball screw. delete delete The method according to claim 1,
The tilting-
And a pair of first and second tilting degree adjusting bolts arranged to be spaced apart from each other and rotatably coupled to the supporting case. 8. The method of claim 7,
Wherein a folding hook for a handle is coupled to an exposed end of the first and second tilting degree adjusting bolts. delete delete delete The method according to claim 1,
The pressurizing plunger is rotatably coupled to a partition formed in the protruding bracket,
Wherein a fixing member for fixing the position of the seesection member is rotatably coupled to the partition wall adjacent to the pressure plunger. The method according to claim 1,
Preferably,
And a cushioning member coupled to an end of the seesection member that is in contact with the rail block.

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