KR102296394B1 - Apparatus for etching substrates - Google Patents

Abstract

A substrate etching apparatus is disclosed. A substrate etching apparatus according to the present invention includes a vacuum chamber in which an etching process is performed on a substrate having a deposition film formed on one surface therein, and a chucking unit disposed inside the vacuum chamber and chucking a substrate loaded into the vacuum chamber a stage unit, and a laser unit positioned outside the vacuum chamber and irradiated with a laser beam to the substrate in the vacuum chamber to perform an etching process on the deposition film, but disposed on the opposite side of one surface of the substrate .

Description

Apparatus for etching substrates

The present invention relates to a substrate etching apparatus, and more particularly, to a substrate etching apparatus capable of preventing contamination of an optical system by particles generated in a substrate etching process.

With the rapid development of information and communication technology and the expansion of the market, a flat panel display is in the spotlight as a display device.

Such flat panel display devices include a liquid crystal display, a plasma display panel, an organic light emitting diode display, and the like.

Among them, the organic light emitting diode display (OLED display) has a fast response speed, lower power consumption than a conventional liquid crystal display (LCD), light weight, and can be made ultra-thin because there is no need for a separate backlight device, It has very good advantages such as high luminance, so it is in the spotlight as a next-generation display device.

Organic light emitting diode display (OLED display) can be divided into passive type PMOLED and active type AMOLED according to the driving method. In particular, AMOLED is a self-luminous display, which has a faster response speed than conventional displays, natural colors, and low power consumption. In addition, when AMOLED is applied to a film rather than a substrate, it becomes possible to realize the technology of a flexible display.

Such an organic light emitting diode display (OLED display) is a product through a pattern forming process, an organic thin film deposition process, an etching process, an encapsulation process, and a bonding process for attaching the substrate on which the organic thin film is deposited and the substrate that has undergone the encapsulation process. can be produced

Meanwhile, among various processes, the etching process is a process of obtaining a desired shape by etching, ie, etching, an unnecessary part on the surface of the substrate by a physical or chemical method.

As with semiconductors, various physical or chemical methods are used for the etching process, and one of them is an etching method using a laser. The etching method of the substrate by the laser has a simple structure and can reduce the etching time compared to other methods, and has been widely adopted in recent years.

FIG. 1 is a block diagram of a general substrate etching apparatus, and FIG. 2 is a view of a state in which particles are loaded on the protective window in FIG. 1 .

As shown in these figures, in the case of a general substrate etching apparatus, a substrate G to be etched is disposed on the upper portion, and a laser beam is applied to a deposition film (not shown) formed on the lower surface of the substrate G. It has a structure in which the irradiating laser module 10 is disposed.

While the substrate G is disposed inside the vacuum chamber, the laser module 10 is disposed outside the vacuum chamber, and a laser beam is irradiated to the substrate G at that position. At this time, a transparent chamber window 20 through which the laser beam passes is interposed on the wall of the vacuum chamber in which the laser module 10 is disposed.

Accordingly, when the laser module 10 positioned outside the chamber window 20 irradiates a laser beam, the laser beam passes through the chamber window 20 and is irradiated to the deposition film (not shown) on the lower surface of the substrate G, thereby forming a deposition film ( (not shown), a preset portion to be etched is etched.

On the other hand, when the etching process is performed through such a top-down substrate etching apparatus, since the substrate G is disposed on the upper portion and the laser beam is irradiated to the upper substrate G, particles that are peeled off from the substrate G and fall (particle, P) is generated, and the particles P separated from the substrate G by gravity are loaded on the chamber window 20 .

At this time, as the etching process continues, the amount of particles (P) dropped and loaded into the chamber window 20 inevitably increases. When the amount is increased, the refraction of the laser beam occurs due to the particles P, and as a result, the change with time of the laser beam is induced, so that the etching position of the substrate G is not properly etched and accumulated in the chamber window 20 The particle P absorbs the energy of the laser beam and drops the energy density of the actual etching site, thereby reducing the efficiency of the etching process.

Of course, if a lot of particles P are loaded on the chamber window 20, open the vacuum chamber and clean the chamber window 20, but in this case, the cleaning operation is very inconvenient and, in particular, since the etching process must be stopped, productivity There is a problem with this falling.

Republic of Korea Patent Publication No. 10-2007-0013776, (2008.08.13.)

Accordingly, an object of the present invention is to provide a substrate etching apparatus capable of preventing particles generated in the substrate etching process from affecting the etching process.

According to an aspect of the present invention, there is provided a vacuum chamber in which an etching process is performed on a substrate having a deposition film formed on one surface thereof; a stage unit disposed inside the vacuum chamber and having a chucking unit for chucking the substrate loaded into the vacuum chamber; and a laser unit positioned outside the vacuum chamber and irradiating a laser beam to the substrate in the vacuum chamber to perform an etching process on the deposition layer, and disposed opposite to one surface of the substrate A substrate etching apparatus comprising a may be provided.

The deposition layer may be formed on a lower surface of the substrate, the chucking unit may chuck an upper surface of the substrate, and the laser unit may be disposed in an upper region of the vacuum chamber.

A beam passing hole through which the laser beam passes may be formed in the chucking part.

It is disposed inside the vacuum chamber, and further includes a stage moving unit for supporting the stage unit and moving the stage unit, wherein the stage unit is connected to the stage moving unit and includes a stage frame part for supporting the chucking unit. may include more.

Further comprising a substrate tray unit connected to the vacuum chamber, supporting the substrate and moving the substrate in the direction of the chucking part, wherein the substrate tray unit is in contact with an inactive region provided on the substrate. It may include a substrate tray unit.

The inactive area contact type substrate tray unit may include: a substrate support module disposed inside the vacuum chamber and supporting the substrate; and an up/down movement module for a support module connected to the substrate support module and configured to move the substrate support module up/down with respect to the chucking unit.

The substrate support module includes: a support module frame part supported by the up/down moving module; and a substrate contact portion connected to the support module frame portion and contacting the inactive region of the substrate.

The support module frame unit may include: a horizontal bar unit to which the substrate contact unit is coupled and a plurality of contact units mounted to be spaced apart from each other; a plurality of vertical bar portions coupled to the horizontal bar portions for mounting the respective contact portions and disposed to be spaced apart from each other; And it is coupled to the vertical bar portion, the up / down (up / down) may include a horizontal bar for coupling to which the module is coupled.

The support module frame part may further include a connecting horizontal bar part disposed between the contact part mounting horizontal bar part and the coupling horizontal bar part and connected to the vertical bar parts.

A plurality of the substrate contact portions may be provided, and the plurality of substrate contact portions may be disposed to be spaced apart from each other according to a predetermined spacing.

The up/down moving module for the support module includes: a pressure shaft part coupled to the support module frame part through a lower wall of the vacuum chamber; And it is connected to the pressure shaft portion and disposed outside the vacuum chamber, it may include a movement driving unit for the shaft for moving the pressure shaft up / down (up / down).

The moving drive unit for the shaft, LM block (LM block) to which the pressure shaft unit is coupled; an LM guide for guiding the movement of the LM block; and a driving unit connected to the LM block and configured to move the LM block.

At least a portion of the inactive region may be disposed in a central region of the substrate.

It is disposed in the lower region of the vacuum chamber, and through a window provided in the vacuum chamber for aligning the non-active area contact type substrate tray unit and the substrate, the non-active area contact type substrate tray unit and the substrate It may further include a camera unit for aligning the image.

It is disposed inside the vacuum chamber, and may further include a shield portion to shield the inner wall of the vacuum chamber and to which particles generated by the etching process are attached.

In embodiments of the present invention, a laser unit that is located outside the vacuum chamber and irradiates a laser beam to the substrate in the vacuum chamber to perform an etching process on the deposition film formed on one surface of the substrate is disposed on the opposite side of the one surface of the substrate, so that the substrate It is possible to prevent particles generated by the etching process from moving toward the laser unit, thereby preventing the particles from affecting the etching process.

1 is a block diagram of a general substrate etching apparatus.
FIG. 2 is a view of a state in which particles are loaded on the protection window in FIG. 1 .
3 is a diagram schematically illustrating a substrate etching apparatus according to an embodiment of the present invention.
FIG. 4 is a view showing a cross-section taken along line AA of FIG. 3 .
FIG. 5 is a perspective view illustrating the stage unit of FIG. 3 .
6 is a plan view of FIG. 5 .
FIG. 7 is a view showing the substrate of FIG. 3 .
8 is a front view of the substrate tray unit of FIG. 3;
9 is a side view of the substrate support module of FIG. 8 .
10 is a plan view of the substrate support module of FIG. 9 .
11 is an operation state diagram of the substrate tray unit of FIG.
12 is an operation state diagram illustrating an etching process by the laser unit of FIG. 3 .

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing preferred embodiments of the present invention with reference to the accompanying drawings. However, in describing the present invention, a description of a function or configuration already known will be omitted in order to clarify the gist of the present invention.

Meanwhile, the substrate described below may be a glass substrate for an organic light emitting diode display (OLED display).

3 is a view schematically showing a substrate etching apparatus according to an embodiment of the present invention, FIG. 4 is a view showing a cross-section taken along line AA of FIG. 3, and FIG. 5 is a view showing the stage unit of FIG. It is a perspective view, Fig. 6 is a plan view of Fig. 5, Fig. 7 is a view showing the substrate of Fig. 3, Fig. 8 is a front view of the substrate tray unit of Fig. 3, and Fig. 9 is a side view of the substrate support module of Fig. 8 10 is a plan view of the substrate support module of FIG. 9 , FIG. 11 is an operation state diagram of the substrate tray unit of FIG. 8 , and FIG. 12 is an operation state diagram illustrating the etching process by the laser unit of FIG. 3 .

In FIG. 3, a part of the stage moving unit 170 has been deleted for convenience of illustration.

3 to 12 , the substrate etching apparatus according to the present embodiment includes a vacuum chamber 110 in which an etching process is performed on a substrate having a deposition film formed on one surface therein, and the interior of the vacuum chamber 110 . The stage unit 120 disposed in the vacuum chamber 110 and having a chucking part 121 for chucking the substrate loaded into the vacuum chamber 110, and the stage unit 120 disposed inside the vacuum chamber 110 and supporting the stage unit 120, The stage moving unit 170 for moving the stage unit 120 and the vacuum chamber 110 are located outside the vacuum chamber 110 and irradiate a laser beam onto the substrate in the vacuum chamber 110 to form the deposition film. A laser unit 160 disposed on the opposite side of one surface of the substrate and a substrate tray unit 130 connected to the vacuum chamber 110 to support the substrate and move the substrate in the direction of the chucking unit 121 . and a shield unit 180 to shield the inner wall of the vacuum chamber 110 and to which particles generated by the etching process are attached.

A deposition film (not shown) is formed on the lower surface of the substrate of this embodiment. In addition, the substrate of this embodiment is a multi-faceted substrate on which a plurality of panel cells (cells, G1) on which a deposition film (not shown) is deposited is provided. The panel cell G1 is a part manufactured as a display panel through an etching process.

7 and 11 , an inactive region G2 surrounding a plurality of panel cells G1 spaced apart from each other is disposed on the substrate according to this embodiment. The inactive region G2 is a portion removed after taking the panel cell G1 from the substrate. In the present embodiment, the inactive region G2 is disposed not only in the edge region of the substrate, but also in the central region of the substrate.

The vacuum chamber 110 is a box-shaped structure as shown in FIG. 3 , and forms a place in which an etching process for a substrate is performed. An entrance gate T through which the substrate is entered is provided on one wall surface of the vacuum chamber 110 .

A chamber window 111 is provided on the upper surface of the vacuum chamber 110 . The chamber window 111 is a window through which a laser beam of a specific wavelength can pass, and a place through which the laser beam from the laser unit 160 disposed outside the vacuum chamber 110 is transmitted into the vacuum chamber 110 . make up In the present embodiment, a plurality of chamber windows 111 may be provided on the upper surface of the vacuum chamber 110 .

The laser unit 160 is disposed outside the vacuum chamber 110 and radiates a laser beam to the substrate in the vacuum chamber 110 through the chamber window 111 provided on the upper surface of the vacuum chamber 110 (照射, irradiation) to perform an etching process.

The laser unit 160 irradiates a laser beam to the substrate in the vacuum chamber 110 through the chamber window 111 to advance the etching process. In this embodiment, the laser unit 160 is disposed outside the vacuum chamber 110 , that is, in the upper region. Since a vacuum is formed inside the vacuum chamber 110 , it is not preferable for components other than the substrate to be disposed inside the vacuum chamber 110 .

Therefore, the laser unit 160 is disposed in the upper region of the vacuum chamber 110, and irradiates a laser beam to the substrate through the chamber window 111 at that position to perform an etching process.

At this time, since the laser unit 160 is disposed on the upper region of the substrate, the laser beam oscillated from the laser unit 160 passes through the beam passing hole 121a formed in the chucking unit 121 and irradiates the lower surface of the substrate. That is, the laser beam oscillated in the upper region of the deposition chamber passes through a beam passing hole 121a to be described later of the chucking unit 121 and passes through the substrate to remove an unnecessary portion of the deposition film (not shown) deposited on the lower surface of the substrate. During the etching process, particles fall to the shield unit 180 .

In the present embodiment, the laser unit 160 emits a laser beam of a specific wavelength that passes through the substrate and etches a deposition film (not shown) deposited on the lower surface of the substrate. An infrared laser is used for the laser unit 160 , and a laser having a wavelength of 750 nm or more is used for the laser unit 160 of this embodiment.

In this embodiment, a plurality of laser units 160 are provided, and each of the plurality of laser units 160 may simultaneously perform an etching operation through respective chamber windows 111 .

Meanwhile, the stage unit 120 is disposed inside the vacuum chamber 110 . The stage unit 120 is connected to the chucking unit 121 for attaching the substrate loaded into the vacuum chamber 110 and the stage moving unit 170 as shown in FIGS. 3 to 6 , and is connected to the chuck. The stage frame part 123 for supporting the king part 121, and an alignment part (not shown) provided on the stage frame part 123 and connected to the chucking part 121 to move the chucking part 121 for aligning. to provide

The chucking part 121 is disposed in the central region of the stage unit 120 and is in contact with the upper surface of the substrate.

In the present embodiment, an electrostatic chuck (ESC) is used for the chucking unit 121 , but the scope of the present invention is not limited thereto, and various chucking devices capable of chucking a substrate are used in the chucking unit 121 of this embodiment. ) can be used as

A beam passing hole 121a through which a laser beam passes is formed in the chucking part 121 according to the present embodiment. As described above, since the laser unit 160 is disposed in the upper region of the vacuum chamber 110 , the chucking unit in order for the laser beam oscillated from the laser unit 160 to reach the lower surface of the substrate chucked in the chucking unit 121 . At 121, a beam passing hole 121a through which a laser beam passes is formed. In the present embodiment, the beam passing hole 121a is provided in plurality as shown in FIG. 6 and is spaced apart from each other.

An alignment part (not shown) is provided in the stage frame part 123 . This alignment unit (not shown) is connected to the chucking unit 121 to move the chucking unit 121 for alignment. Such an alignment unit (not shown) may include an alignment operation element of UVW. The alignment method using such an alignment operation element of UVW is a well-known technique frequently used to align two objects in a display manufacturing process, and a detailed description thereof will be omitted.

Meanwhile, the stage moving unit 170 is disposed inside the vacuum chamber 110 . The stage moving unit 170 supports the stage unit 120 and moves the stage unit 120 .

In this embodiment, the stage moving unit 170 moves the stage unit 120 by a linear motor method.

The stage moving unit 170 includes a moving block 171 for a stage to which the stage unit 120 is coupled, and a guide rail (not shown) to which the moving block is coupled and for guiding the movement of the moving block 171 for the stage, and , and a driving unit 172 for the stage for moving the moving block 171 for the stage by electromagnetic force. Here, the driving unit 172 for the stage interacts with a first magnetic material (not shown) provided in the moving block 171 for the stage to generate a driving force by electromagnetic force in the moving block 171 for the stage (not shown). ) and a second magnetic body (not shown) disposed along the longitudinal direction.

Here, the first magnetic body (not shown) is provided as a permanent magnet, and the second magnetic body (not shown) is provided as an electromagnet.

The substrate tray unit 130 is connected to the vacuum chamber 110 . The substrate tray unit 130 supports the substrate and moves the substrate in the direction of the chucking unit 121 . In this embodiment, the substrate tray unit 130 is provided as an inactive region contact type substrate tray unit 130 that is in contact with the inactive region G2 provided on the substrate.

The inactive area contact type substrate tray unit 130, as shown in detail in FIGS. 7 to 11, is disposed in the vacuum chamber 110 and supports the substrate support module 140 and the substrate support. It is connected to the module 140 and includes an up/down moving module 150 for a support module that moves the substrate support module 140 up/down with respect to the chucking unit 121 . .

The substrate support module 140 is disposed inside the vacuum chamber 110 . The substrate support module 140 supports the substrate by transferring the substrate inserted into the vacuum chamber 110 .

As shown in detail in FIGS. 7 to 11 , the substrate support module 140 according to this embodiment includes a support module frame part 141 supported by an up/down moving module, and a support module frame. and a substrate contact portion 148 connected to the portion 141 and in contact with the inactive region G2 of the substrate.

The support module frame part 141 is supported by an up/down moving module. As shown in detail in FIGS. 7 to 11 , the support module frame portion 141 includes a plurality of contact portions mounting horizontal bar portions 142 to which the substrate contact portions 148 are coupled and disposed to be spaced apart from each other, and each A plurality of vertical bar parts 143 coupled to the horizontal bar part 142 for mounting the contact part and arranged to be spaced apart from each other, and the vertical bar part 143 coupled to the up/down moving module are combined. The horizontal bar part 144 for the connection, the horizontal bar part 142 for mounting the contact part and the horizontal bar part 145 for connection disposed between the coupling horizontal bar part 144 and connected to the vertical bar parts 143. include

A substrate contact portion 148 is coupled to the horizontal bar portion 142 for mounting the contact portion. As shown in detail in FIGS. 7 to 11 , the horizontal bar part 142 for mounting the contact part is provided in plurality and disposed spaced apart from each other. In the present embodiment, the horizontal bar portion 142 for mounting the contact portion is provided in a bar shape and extended in the X-axis direction.

A plurality of vertical bar portions 143 are provided to be spaced apart from each other. Each of these vertical bar portions 143 is coupled to the horizontal bar portion 142 for mounting the contact portion. In this embodiment, the vertical bar portion 143 is provided in a bar shape and is provided to extend long in the Z-axis direction intersecting the X-axis direction.

The horizontal bar portion 144 for coupling is coupled to the vertical bar portions 143 . The up/down movement module 150 for the support module is coupled to the horizontal bar portion 144 for coupling. In this embodiment, the horizontal bar portion 144 for coupling is provided in a bar shape and is provided to extend long in the Y-axis direction intersecting the X-axis direction and the Z-axis direction.

The horizontal bar part 145 for connection is disposed between the horizontal bar part 142 for mounting the contact part and the horizontal bar part 144 for coupling. The horizontal bar part 145 for such a connection is connected to the vertical bar parts 143 . The horizontal bar portion 145 for connection is provided in a bar shape and is provided to extend long in the Y-axis direction.

The horizontal bar part 145 for connection of this embodiment is disposed between the horizontal bar part 142 for mounting the contact part and the horizontal bar part 144 for coupling and is coupled to the vertical bar parts 143, so that it is long in the longitudinal direction. It prevents the vertical bar part 143 having a length from being tilted or from being shaken in the vertical bar part 143 .

The substrate contact portion 148 is coupled to the horizontal bar portion 142 for mounting the contact portion. The substrate contact portion 148 is in contact with the inactive region G2 of the substrate. In the present embodiment, a plurality of substrate contact portions 148 are provided. The plurality of substrate contact portions 148 are arranged to be spaced apart from each other according to a predetermined distance, as shown in detail in FIGS. 7 to 11 .

Meanwhile, the up/down moving module 150 for the support module is connected to the substrate support module 140 . The up/down moving module 150 for the support module moves the substrate support module 140 up/down with respect to the chucking unit 121 .

In this embodiment, the up/down moving module 150 for the support module includes a pressure shaft part 151 coupled to the support module frame part 141 through the lower wall of the vacuum chamber 110 and , connected to the pressure shaft unit 151 and disposed outside the vacuum chamber 110, and a moving drive unit for a shaft (153, 154, 155) for moving the pressure shaft unit 151 up/down; It includes a bellows pipe (K) enclosing a portion of the pressure shaft portion 151 and sealing the area of the vacuum chamber 110 through which the pressure shaft portion 151 has passed.

The pressure shaft part 151 penetrates the lower wall of the vacuum chamber 110 and is coupled to the horizontal bar part 144 for coupling. The pressing shaft part 151 is provided in the shape of a shaft having a long length as shown in detail in FIGS. 7 to 11 . The pressure shaft part 151 is disposed in the longitudinal direction and penetrates the lower wall of the vacuum chamber 110 .

The upper end area of the pressure shaft part 151 of this embodiment is disposed inside the vacuum chamber 110 , and the lower end area of the pressure shaft part 151 is disposed outside the vacuum chamber 110 .

The moving drive units 153 , 154 , 155 for the shaft are connected to the pressure shaft unit 151 . The moving driving units 153 , 154 , and 155 for the shaft are disposed outside the vacuum chamber 110 to move the pressure shaft unit 151 up/down.

The movement driving units 153 , 154 , 155 for the shaft according to the present embodiment include an LM block 153 to which the pressure shaft unit 151 is coupled, and an LM guide ( LM block 153 ) for guiding the movement of the LM block 153 . It includes an LM guide, 154 , and a driving unit 155 for an LM block connected to the LM block 153 and moving the LM block 153 .

The LM guide 154 guides the movement of the LM block 153 . The LM guide 154 includes a moving block (not shown) coupled to the LM block 153 and a guide rail (not shown) to which the moving block (not shown) is slidably connected.

The LM block driving unit 155 is connected to the LM block 153 . This LM block driving unit 155 moves the LM block 153 . The driving unit 155 for the LM block according to the present embodiment includes a moving nut (not shown) coupled to the LM block 153 , a ball screw 155a meshed with the moving nut (not shown), and a ball screw 155a ) and includes a driving motor (155b) for rotating the ball screw (155a).

The bellows pipe K surrounds a portion of the pressure shaft unit 151 and seals the area of the vacuum chamber 110 through which the pressure shaft unit 151 passes. This bellows pipe (K) prevents the vacuum state of the vacuum chamber 110 from being destroyed during the up/down process of the pressure shaft part 151 . That is, the bellows pipe (K) of this embodiment shields the area of the vacuum chamber 110 through which the pressure shaft part 151 passes from the external atmospheric pressure space.

The upper end of the bellows pipe K is connected to the outer wall of the vacuum chamber 110 and the lower end is connected to the LM block 153 . The bellows pipe (K) is stretched in length according to the elevation of the LM block (153). That is, when the LM block 153 rises, the length decreases, and when the LM block 153 descends, the length increases.

Meanwhile, the shield unit 180 is disposed inside the vacuum chamber 110 . In the present embodiment, the shield unit 180 is disposed below the region where the etching process is performed to shield the lower inner wall of the vacuum chamber 110 .

An etching process by the laser unit 160 is performed on the upper portion of the shield unit 180 , and particles generated by the etching process fall down and are attached to the shield unit 180 .

The shield unit 180 according to the present embodiment, as shown in detail in FIG. The vacuum chamber 110 includes a shield bracket 181 connected to the inner wall of the chamber, and a shield plate 183 detachably coupled to the shield bracket 181 .

The shield plate 183 is provided in a plate shape. Particles generated by the etching process are attached to the shield plate 183 . The shield plate 183 according to the present embodiment is detachably coupled to the shield bracket 181 , so that the shield plate 183 that has reached a predetermined use time or a predetermined number of processes is replaced with a new shield plate 183 . can

In addition, the substrate etching apparatus according to the present embodiment is disposed in the lower region of the vacuum chamber 110 and a vacuum chamber ( An alignment camera unit (not shown) for imaging the substrate supported on the substrate tray unit 130 and the chucking unit 121 through an observation window (not shown) provided in 110), and an alignment camera unit (not shown) and a control unit (not shown) electrically connected to an alignment unit (not shown) of the stage unit 120 .

The alignment camera unit (not shown) is disposed in the lower region of the vacuum chamber 110 . This alignment camera unit (not shown) is a non-substrate tray unit ( The substrate supported by the 130 and the chucking unit 121 are imaged.

In the present embodiment, the alignment camera unit (not shown) captures images of a marker for a substrate (not shown) provided on the edge of the substrate or a substrate and a marker for a chucking unit (not shown) provided in an edge region of the chucking unit 121 .

The control unit (not shown) is electrically connected to the alignment unit (not shown) of the camera unit for alignment (not shown) and the stage unit 120 . The control unit (not shown) aligns the chucking unit 121 to the substrate supported by the substrate tray unit 130 by controlling the alignment unit (not shown) through information of the alignment camera unit (not shown).

In this embodiment, the control unit (not shown) is also electrically connected to the stage moving unit 170 , the inactive area contact type substrate tray unit 130 , the laser unit 160 , and the like.

Hereinafter, the operation of the substrate etching apparatus according to the present embodiment will be described with reference to FIGS. 3 to 12 mainly for the etching process.

As shown in FIG. 12 , a laser beam is oscillated from the laser unit 160 disposed on the upper region of the substrate. This laser beam passes through the beam passage hole 121a of the chucking unit 121 and irradiates the lower surface of the substrate. That is, the laser beam oscillated in the upper region of the vacuum chamber 110 passes through the beam passage hole 121a of the chucking unit 121 and passes through the substrate to etch the deposited film (not shown) deposited on the lower surface of the substrate. etch the part.

The particles generated in the etching process of the laser unit 160 fall downward. The dropped particles are attached to the shield unit 180 .

As described above, the substrate etching apparatus according to the present embodiment is located outside the vacuum chamber 110 and irradiates a laser beam to the substrate in the vacuum chamber 110 to perform an etching process for a deposition film (not shown) formed on the lower surface of the substrate. Since the performing laser unit 160 is disposed on the opposite side of the lower surface of the substrate, it is possible to prevent particles generated by the substrate etching process from moving toward the laser unit 160, thereby preventing the particles from affecting the etching process. can be prevented

Although this embodiment has been described in detail with reference to the drawings above, the scope of the present embodiment is not limited to the drawings and descriptions described above.

As such, the present invention is not limited to the described embodiments, and it is apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, it should be said that such modifications or variations belong to the claims of the present invention.

110: vacuum chamber 120: stage unit
121: chucking part 121a: beam through hole
123: stage frame part
130: non-active area contact type substrate tray unit
140: substrate support module 141: support module frame part
142: horizontal bar portion for mounting the contact portion 143: vertical bar portion
144: horizontal bar portion for coupling 145: horizontal bar portion for connection
148: substrate contact
150: support module for up / down (up / down) moving module
151: pressure shaft portion
153: LM block 154: LM guide
155: LM block drive unit 155a: ball screw
155b: drive motor 160: laser unit
170: stage moving unit 180: shield unit
181: shield bracket 183: shield plate
G1: cell G2: inactive area

Claims (15)

a vacuum chamber in which an etching process is performed on a substrate having a deposition film formed on one surface thereof;
a stage unit disposed inside the vacuum chamber and having a chucking unit for chucking the substrate loaded into the vacuum chamber;
a laser unit positioned outside the vacuum chamber and irradiated with a laser beam to a substrate in the vacuum chamber to perform an etching process on the deposition layer, the laser unit being disposed opposite to one surface of the substrate;
a stage moving unit disposed inside the vacuum chamber, supporting the stage unit and moving the stage unit; and
and a substrate tray unit connected to the vacuum chamber, supporting the substrate and moving the substrate in the direction of the chucking unit,
The deposition film is formed on the lower surface of the substrate,
The chucking unit chucks the upper surface of the substrate,
The laser unit is disposed in the upper region of the vacuum chamber,
A beam passing hole through which the laser beam passes is formed in the chucking part,
The laser beam passes through the beam passing hole and passes through the substrate to etch the deposited film deposited on the lower surface of the substrate,
The stage unit is
It is connected to the stage moving unit, further comprising a stage frame for supporting the chucking unit,
The substrate tray unit,
and a non-active area contact type substrate tray unit in contact with the non-active area provided on the substrate,
The inactive area contact type substrate tray unit,
a substrate support module disposed inside the vacuum chamber and supporting the substrate; and
an up/down moving module for a support module connected to the substrate support module and configured to move the substrate support module up/down with respect to the chucking unit;
The substrate support module,
a support module frame part supported by the up/down moving module; and
and a substrate contact part connected to the support module frame part and in contact with the inactive area of the substrate;
The support module frame portion,
a plurality of horizontal bar portions for mounting the contact portions to which the substrate contact portions are coupled and disposed to be spaced apart from each other;
a plurality of vertical bar portions coupled to the horizontal bar portions for mounting the respective contact portions and disposed to be spaced apart from each other;
a horizontal bar for coupling coupled to the vertical bar and to which the up/down moving module is coupled; and
It is disposed between the horizontal bar part for mounting the contact part and the horizontal bar part for coupling, and includes a horizontal bar part for connection connected to the vertical bar parts,
The substrate contact portion is provided in plurality, and the plurality of substrate contact portions are arranged to be spaced apart from each other according to a predetermined spacing,
The up / down (up / down) moving module for the support module,
a pressure shaft part coupled to the support module frame part through a lower wall of the vacuum chamber; and
It is connected to the pressure shaft portion and is disposed outside the vacuum chamber, and includes a movement driving unit for a shaft that moves the pressure shaft up / down (up / down),
The moving driving unit for the shaft,
LM block to which the pressure shaft portion is coupled;
an LM guide for guiding the movement of the LM block; and
It is connected to the LM block and includes a driving unit for the LM block that moves the LM block,
The inactive area contact type substrate tray unit and the substrate are disposed in the lower area of the vacuum chamber, and through a window provided in the vacuum chamber for aligning the inactive area contact type substrate tray unit and the substrate, the inactive area contact type substrate tray unit and the substrate Further comprising a camera unit for alignment for imaging
The substrate etching apparatus further comprising a shield portion disposed inside the vacuum chamber, shielding the inner wall of the vacuum chamber and to which particles generated by the etching process are attached. delete delete delete delete delete delete delete delete delete delete delete According to claim 1,
At least a portion of the inactive region is disposed in a central region of the substrate. delete delete

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