KR102243720B1 - Apparatus for etching substrates - Google Patents

Abstract

Disclosed is a top-down substrate etching apparatus. The top-down substrate etching apparatus according to the present invention comprises: a vacuum chamber in which an etching process for a substrate is performed; a stage unit disposed inside the vacuum chamber and having a chucking unit for chucking the substrate loaded into the vacuum chamber; a laser unit having a laser scanner which penetrates a lower wall of the vacuum chamber through a chamber through hole formed in the lower wall of the vacuum chamber and performs irradiation of a laser beam onto the substrate in the vacuum chamber to perform an etching process; and a scanner moving unit which supports the laser scanner, is connected to the vacuum chamber, seals the inside of the vacuum chamber, and moves the laser scanner in an up/down direction so that the laser scanner can approach and can be separated from the substrate. Therefore, the top-down substrate etching apparatus can shorten the focal length of the laser scanner, thereby reducing the size of a laser beam.

Description

Top-down substrate etching apparatus {Apparatus for etching substrates}

The present invention relates to a top-down substrate etching apparatus, and more particularly, to a top-down substrate etching apparatus capable of reducing a beam size of a laser beam by shortening a focal length of a laser scanner.

With the rapid development of information and communication technology and the expansion of the market, flat panel displays are in the spotlight as display devices.

Such flat panel display devices include a liquid crystal display, a plasma display panel, and an organic light emitting diode display.

Among them, the OLED display has a fast response speed, lower power consumption than a conventional liquid crystal display (LCD), light weight, and the point that it can be made ultra-thin because it does not require a separate back light device. It has very good advantages such as high luminance, so it is attracting attention as a next-generation display device.

Organic light-emitting diode displays can be divided into passive PMOLED and active AMOLED depending on the driving method. In particular, AMOLED is a self-luminous display, which has the advantage of having faster response speed than conventional displays, natural color sense, and low power consumption. In addition, when AMOLED is applied to a film rather than a substrate, the technology of a flexible display can be implemented.

These OLED displays are made into products through a pattern formation process, an organic thin film deposition process, an etching process, an encapsulation process, and a bonding process in which the substrate on which the organic thin film is deposited and the substrate that has undergone the sealing process are attached. Can be produced.

Meanwhile, among various processes, the etching process is a process of obtaining a desired shape by physically or chemically etching, that is, etching an unnecessary portion of the surface of the substrate.

In the etching process, as in semiconductors, various physical or chemical methods are used, one of which is an etching method using a laser. A method of etching a substrate by a laser has been widely adopted in recent years because it has a simpler structure and can reduce an etching time compared to other methods.

1 is a configuration diagram of a general top-down substrate etching apparatus. As shown in FIG. 1, in the case of a general top-down substrate etching apparatus, a substrate G to be etched is disposed on an upper portion, and a laser module 10 that irradiates a laser beam to a lower portion of the substrate G ) Is arranged.

The substrate G is disposed inside the vacuum chamber, while the laser module 10 is disposed outside the vacuum chamber, and a laser beam is irradiated onto the substrate G at that position. At this time, a transparent chamber window 20 through which the laser beam passes is interposed on the wall surface of the vacuum chamber in which the laser module 10 is disposed.

Accordingly, when the laser module 10 located outside the chamber window 20 irradiates a laser beam, the laser beam passes through the chamber window 20 and is irradiated to the substrate G, thereby It will etch unnecessary parts.

However, in the top-down substrate etching apparatus according to the prior art, the focal length is long due to the long distance between the substrate G and the laser module 10, thereby reducing the beam size of the laser beam to a predetermined size or less. There is a problem that cannot be done.

That is, in the top-down substrate etching apparatus according to the prior art, since the beam size cannot be reduced to a predetermined size or less, it is difficult to perform fine etching.

Korean Patent Application Publication No. 10-2007-0013776, (2008.08.13.)

Accordingly, a problem to be solved by the present invention is to provide a top-down substrate etching apparatus capable of reducing a beam size of a laser beam by shortening a focal length of a laser scanner.

According to an aspect of the present invention, there is provided a vacuum chamber in which an etching process is performed on a substrate; A stage unit disposed inside the vacuum chamber and including a chucking portion for chucking the substrate loaded into the vacuum chamber; A laser scanner that penetrates the lower wall of the vacuum chamber through a chamber through hole formed in the lower wall of the vacuum chamber and performs the etching process by irradiating a laser beam to a substrate in the vacuum chamber. A laser unit having a; And supporting the laser scanner, being connected to the vacuum chamber to seal the interior of the vacuum chamber, and moving the laser scanner in an up/down direction so that the laser scanner can be approached and separated from the substrate. A top-down substrate etching apparatus including a scanner moving unit to move to may be provided.

The scanner moving unit includes: a moving plate portion for a scanner that supports the laser scanner and moves in an up/down direction; A plate moving part connected to the moving plate part for the scanner and moving the moving plate part for the scanner; And a sealing part connected to the moving plate part for the scanner and the vacuum chamber, and shielding the laser scanner from the inside of the vacuum chamber.

The moving plate part for the scanner may include a moving plate main body to which the moving part for the plate is coupled; And a transmission window coupled to the moving plate body and through which the laser beam passes.

The movable plate body includes a plate body having a plurality of cut-out holes; And a pocket portion connected to the plate body portion and forming an insertion groove communicating with the cut-out hole.

The pocket portion may include a side wall portion for a pocket portion coupled to the plate body portion; And a bottom wall portion for a pocket portion coupled to the side wall portion for the pocket portion and in which a window arranging hole in which the transmission window is disposed is formed.

The plate moving part may include a pressure shaft part for a scanner that penetrates through a lower wall of the vacuum chamber and is coupled to the moving plate part for the scanner; And a pressure shaft moving driver for a scanner connected to the pressure shaft portion for the scanner and disposed outside the vacuum chamber, and moving the pressure shaft portion for the scanner up/down.

The scanner pressure shaft movement driving unit, the scanner for the scanner LM block (LM block) to which the pressure shaft for the scanner is coupled; An LM guide for a scanner guiding the movement of the scanner LM block; And a driving unit for a scanner LM block connected to the scanner LM block and moving the scanner LM block.

The sealing portion may include a scanner bellows tube having an upper end portion coupled to the moving plate portion for the scanner, a lower portion portion coupled to the lower wall of the vacuum chamber, and having a variable length.

The scanner moving unit may further include a lens unit supported by the moving plate unit for the scanner and focusing the laser beam.

A substrate tray unit connected to the vacuum chamber and supporting the substrate and moving the substrate in a direction of a chucking unit, wherein the substrate tray unit is a non-active area contact type in contact with an inactive area provided on the substrate It may include a substrate tray unit.

The inactive area contact type substrate tray unit includes: a substrate support module disposed inside the vacuum chamber and supporting the substrate; And an up/down moving module for a support module connected to the substrate support module and moving the substrate support module up/down with respect to the chucking part.

The substrate support module includes: a support module frame part supported by the up/down moving module; And a substrate contact portion connected to the support module frame portion and contacting the inactive region of the substrate.

The support module frame portion includes: a horizontal bar portion for mounting a plurality of contact portions, to which the substrate contact portions are coupled, and disposed to be spaced apart from each other; A plurality of vertical bar portions coupled to each of the horizontal bar portions for mounting the contact portions and disposed to be spaced apart from each other; And a coupling horizontal bar portion coupled to the vertical bar portion and coupled to the up/down moving module.

The up/down moving module for the support module includes: a pressure shaft for a tray unit coupled to the frame of the support module through a lower wall of the vacuum chamber; And a moving drive part for a shaft for a tray unit connected to the pressure shaft for the tray unit, disposed outside the vacuum chamber, and moving the pressure shaft for the tray unit up/down.

Embodiments of the present invention include a scanner moving unit that is connected to the vacuum chamber to seal the interior of the vacuum chamber and moves the laser scanner in the up/down direction so that the laser scanner can be approached and separated from the substrate. By providing, it is possible to shorten the focal length of the laser scanner, thereby reducing the beam size of the laser beam.

1 is a configuration diagram of a general top-down substrate etching apparatus.
2 is a schematic diagram illustrating a top-down substrate etching apparatus according to an embodiment of the present invention.
3 is a diagram illustrating the laser unit and the scanner moving unit of FIG. 2.
FIG. 4 is a diagram illustrating a cross section taken along line AA of FIG. 2.
5 is an enlarged view of part'B' of FIG. 4.
6 is a diagram illustrating the substrate of FIG. 2.
7 is a front view of the substrate tray unit of FIG. 2.
8 is a side view of the substrate support module of FIG. 7.
9 is a plan view of the substrate support module of FIG. 7.
10 is an operational state diagram of the substrate tray unit of FIG. 7.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the implementation of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing a preferred embodiment of the present invention with reference to the accompanying drawings. However, in describing the present invention, a description of a function or configuration that is already known will be omitted in order to clarify the gist of the present invention.

Meanwhile, the substrate described below may be a glass substrate for an OLED display.

FIG. 2 is a schematic diagram of a top-down substrate etching apparatus according to an embodiment of the present invention, FIG. 3 is a view showing the laser unit and the scanner moving unit of FIG. 2, and FIG. 4 is a line AA of FIG. 5 is an enlarged view of a portion'B' of FIG. 4, FIG. 6 is a view showing the substrate of FIG. 2, and FIG. 7 is a front view of the substrate tray unit of FIG. 2, 8 is a side view of the substrate support module of FIG. 7, FIG. 9 is a plan view of the substrate support module of FIG. 7, and FIG. 10 is an operation state diagram of the substrate tray unit of FIG. 7. In FIG. 2, the illustration of the stage moving unit 170 is omitted for convenience of illustration.

As shown in FIGS. 2 to 10, the top-down substrate etching apparatus according to the present embodiment includes a vacuum chamber 110 in which an etching process is performed on a substrate, and a vacuum chamber 110 is disposed inside the vacuum chamber 110, and A stage unit 120 having a chucking unit (not shown) for chucking a substrate loaded into the chamber 110, and connected to the stage unit 120 to support the stage unit 120 and the stage unit 120 The stage moving unit 170 for moving the unit 170 and the chamber through-hole 111 formed in the lower wall of the vacuum chamber 110 are moved into the interior of the vacuum chamber 110, and a laser beam ( A laser unit 160 including a laser scanner 161 that performs an etching process by irradiating a laser beam), and a vacuum chamber ( A scanner moving unit 180 that seals the interior of 110 and moves the laser scanner 161 in the up/down direction so that the laser scanner 161 can be approached and separated from the substrate, and a vacuum chamber A substrate tray unit 130 connected to 110 and supporting a substrate and moving the substrate in a chucking portion (not shown), and disposed in the lower region of the vacuum chamber 110 and between the substrate tray unit 130 and the substrate. An alignment camera unit (not shown) for imaging the substrate tray unit 130 and the substrate through an observation window (not shown) provided in the vacuum chamber 110 for alignment, and an alignment camera unit (not shown). City) and a control unit (not shown) electrically connected to the stage unit 120.

The substrate of this embodiment is a multi-faceted substrate in which a plurality of panel cells (cells G1) are provided. The panel cell G1 is a portion on which a deposition film is formed, and is a portion manufactured into a display panel through an etching process.

In the substrate according to the present exemplary embodiment, as shown in FIGS. 6 and 10, an inactive region G2 surrounding a plurality of panel cells G1 disposed to be spaced apart from each other is disposed. The inactive region G2 is a portion removed after taking the panel cell G1 from the substrate. In this embodiment, the inactive region G2 is disposed in the central region of the substrate as well as the edge region of the substrate.

The vacuum chamber 110 is a box-type structure as shown in FIG. 2 and forms a place in which an etching process for a substrate is performed. An entrance gate T through which a substrate enters and exits is provided on one wall surface of the vacuum chamber 110.

A chamber through hole 111 is formed in the lower wall of the vacuum chamber 110 of the present embodiment. As the laser scanner 161 moves in a direction close to the substrate through the chamber through-hole 111, the distance between the laser scanner 161 and the substrate is shortened and the focal length is shortened. The beam size can be reduced (because the beam size is proportional to the laser's wavelength and focal length).

Meanwhile, the stage unit 120 is disposed inside the vacuum chamber 110. The stage unit 120 is connected to a chucking unit (not shown) for attaching a substrate loaded into the vacuum chamber 110 and a chucking unit (not shown) for alignment. An alignment unit (not shown) to be moved and a gripper unit (not shown) connected to the chucking unit (not shown) and pressing the edge region of the substrate with the chucking unit (not shown) to hold the substrate.

The chucking part (not shown) is disposed in the lower end area of the stage unit 120 to contact the upper surface of the substrate.

In this embodiment, an electrostatic chuck (ESC) is used for the chucking unit (not shown), but the scope of the present invention is not limited, and various chucking devices capable of chucking the substrate are used in the chucking unit ( Not shown).

The alignment unit (not shown) is connected to the chucking unit (not shown) to move the chucking unit (not shown) for alignment. Such an alignment unit (not shown) may include an alignment operation element of UVW. The alignment method using the UVW alignment operation element is a known technique frequently used to align two objects in a display manufacturing process, and a detailed description thereof will be omitted.

The gripper part (not shown) is connected to the chucking part (not shown) and grips the substrate by pressing the edge region of the substrate with the chucking part (not shown). The gripper portion (not shown) is moved in the vertical direction to press the edge region of the substrate with a chucking portion (not shown) to hold the substrate. Such a gripper part (not shown) is disposed at a position where it does not interfere with the substrate contact part 148 of the substrate tray unit 130. In addition, the gripper unit (not shown) may be configured to avoid the substrate by moving in a horizontal direction when the substrate tray unit 130 moves the substrate to the chucking unit (not shown) for chucking the substrate.

The stage moving unit 170 is disposed inside the vacuum chamber 110. The stage moving unit 170 supports the stage unit 120 and moves the stage unit 120. In this embodiment, the stage moving unit 170 moves the stage unit 120 in a linear motor manner.

The stage moving unit 170 includes a moving block 171 for a stage to which the stage unit 120 is coupled, a moving block 171 for a stage, and a guide rail for guiding the movement of the moving block 171 for the stage. (Not shown) and a stage driving unit 173 for moving the stage moving block 171 by electromagnetic force. Here, the driving unit 173 for the stage interacts with a first magnetic body (not shown) provided in the moving block 171 for the stage to generate a propulsion force by the electromagnetic force in the moving block 171 for the stage. ) And a second magnetic material (not shown) disposed along the longitudinal direction.

Here, the first magnetic body (not shown) is provided as a permanent magnet and the second magnetic body (not shown) is provided as an electromagnet.

Meanwhile, the laser unit 160 serves to perform an etching process by irradiating a laser beam onto the substrate in the vacuum chamber 110. The laser unit 160 includes a laser oscillator (not shown) in which the laser beam L is oscillated, a laser converter (not shown) for converting the laser beam L oscillated by the laser oscillator (not shown), and a laser It includes a laser scanner 161 that receives the converted laser beam (L) by a converter (not shown) and irradiates the substrate.

In this embodiment, a laser oscillator (not shown) and a laser converter (not shown) are disposed outside the vacuum chamber 110, that is, in a lower area. Since a vacuum is formed inside the vacuum chamber 110, it is not preferable that components other than the substrate are disposed inside the vacuum chamber 110. However, the laser scanner 161 may pass through the chamber through-hole 111 formed in the lower wall of the vacuum chamber 110 and move in a direction close to the substrate. As described above, according to the movement of the laser scanner 161, the distance between the laser scanner 161 and the substrate can be shortened, and accordingly, the beam size of the laser beam can be reduced.

Meanwhile, the scanner moving unit 180 supports the laser scanner 161. The scanner moving unit 180 moves the laser scanner 161 in an up/down direction so that the laser scanner 161 can be approached and separated from the substrate. In addition, the scanner moving unit 180 is connected to the vacuum chamber 110 to seal the interior of the vacuum chamber 110.

The scanner moving unit 180 according to the present embodiment supports the laser scanner 161 and moves in the up/down direction as shown in detail in FIGS. 3 to 5. 181, plate moving parts 187 and 188 connected to the scanner moving plate part 181 and moving the scanner moving plate part 181, the scanner moving plate part 181 and the vacuum chamber ( 110, a sealing part 189 that shields the laser scanner 161 from the inside of the vacuum chamber 110, and a lens part M that is supported by the moving plate part 181 for the scanner and focuses the laser beam Includes.

The laser scanner 161 is coupled to the scanner moving plate part 181. The scanner moving plate portion 181 is moved in an up/down direction. The moving plate part 181 for a scanner according to this embodiment includes a moving plate part main body 182 to which the plate moving parts 187 and 188 are coupled, as shown in FIGS. 3 to 5, and a moving plate part. It is coupled to the body 182 and includes a transmission window 185 through which the laser beam passes.

The moving plate part main body 182 forms a plate body part 183 in which a plurality of cutout holes 183a are formed, and an insertion groove 184c connected to the plate body part 183 and in communication with the cutout hole 183a. It includes a pocket portion 184 to be.

The plate body portion 183 is provided in the shape of a thin disk plate. In this plate body portion 183, a plurality of cut-out holes 183a are disposed to be spaced apart from each other.

The pocket portion 184 is connected to the plate body portion 183. This pocket part 184 forms an insertion groove 184c communicating with the cutout hole 183a. The pocket portion 184 according to the present embodiment includes a sidewall portion 184a for a pocket portion coupled to the plate body portion 183, and a window arrangement in which the transmission window 185 is coupled to the sidewall portion 184a for the pocket portion. It includes a bottom wall portion (184b) for the pocket portion in which the ball (184d) is formed.

The side wall portion (184a) for the pocket portion is coupled to the plate body portion (183). The side wall portion 184a for the pocket portion is provided in the shape of a pipe with an inner hollow and an upper end and an open lower end thereof.

The bottom wall portion 184b for the pocket portion is provided in a circular disk shape. It is coupled to the side wall portion (184a) for the pocket portion to close the lower end of the side wall portion (184a) for the pocket portion. A window arranging hole 184d in which the transmission window 185 is disposed is formed in the side wall portion 184a for the pocket portion.

The transmission window 185 is a window through which a laser beam of a specific wavelength can pass, and forms a place in which the laser beam emitted from the laser scanner 161 is transmitted into the vacuum chamber 110.

The plate moving parts 187 and 188 are connected to the scanner moving plate part 181. These plate moving parts 187 and 188 move the scanner moving plate part 181.

As shown in FIGS. 3 to 5, the plate moving parts 187 and 188 penetrate the lower wall of the vacuum chamber 110 and are coupled to the scanner moving plate part 181 ( 187), the scanner pressure shaft movement driving unit connected to the scanner pressure shaft portion 187, disposed outside the vacuum chamber 110, and moving the scanner pressure shaft portion 187 up/down (188) and a bellows tube (K) for a shaft that surrounds a part of the pressure shaft portion for the scanner 187 and seals the region of the vacuum chamber 110 through which the pressure shaft portion for the scanner 187 passes.

The pressure shaft portion 187 for the scanner passes through the lower wall of the vacuum chamber 110 and is coupled to the moving plate portion 181 for the scanner.

The pressure shaft portion 187 for the scanner passes through the lower wall of the vacuum chamber 110 and is coupled to the plate body portion 183. The pressure shaft portion 187 for the scanner is provided in a shaft shape having a long length as shown in detail in FIGS. 3 to 5. The pressure shaft portion 187 for the scanner is disposed in the vertical direction and penetrates the lower wall of the vacuum chamber 110.

The upper portion of the pressure shaft portion 187 for a scanner according to the present embodiment is disposed inside the vacuum chamber 110, and the lower portion of the pressure shaft portion 187 for a scanner is disposed outside the vacuum chamber 110.

The scanner pressure shaft movement driving unit 188 is connected to the scanner pressure shaft unit 187. The pressure shaft moving drive unit 188 for the scanner is disposed outside the vacuum chamber 110 to move the pressure shaft unit 187 for the scanner up/down.

The scanner pressure shaft movement driving unit 188 according to the present embodiment is for a scanner that guides the movement of the scanner LM block 188a to which the scanner pressure shaft unit 187 is coupled, and the scanner LM block 188a. It includes an LM guide 188b and a scanner LM block driving unit 188d and 188e connected to the scanner LM block 188a and moving the scanner LM block 188a.

The scanner LM guide 188b guides the movement of the scanner LM block 188a. The scanner LM guide 188b includes a moving block (not shown) coupled to the scanner LM block 188a, and a guide rail (not shown) to which the moving block (not shown) is slidably connected.

The scanner LM block driving units 188d and 188e are connected to the scanner LM block 188a. The scanner LM block driving units 188d and 188e move the scanner LM block 188a. The scanner LM block driving units 188d and 188e according to the present embodiment include a movable nut (not shown) coupled to the scanner LM block 188a, and a scanner ball screw (not shown) engaged with the movable nut (not shown). 188d) and a scanner driving motor 188e that is coupled to the scanner ball screw 188d and rotates the scanner ball screw 188d.

The bellows pipe K for the shaft surrounds a part of the pressure shaft portion 187 for the scanner and seals the area of the vacuum chamber 110 through which the pressure shaft portion 187 for the scanner passes. The bellows pipe K for the shaft prevents the vacuum state of the vacuum chamber 110 from being destroyed during the up/down process of the pressurizing shaft part 187 for the scanner. That is, the bellows pipe K for a shaft of the present embodiment shields the area of the vacuum chamber 110 through which the pressure shaft portion 187 for a scanner passes through an external atmospheric pressure space.

The upper end of the bellows pipe K for the shaft is connected to the outer wall of the vacuum chamber 110 and the lower end is connected to the scanner LM block 188a. This shaft bellows pipe (K) is extended and contracted in length according to the lifting of the scanner LM block (188a). That is, when the scanner LM block 188a rises, the length decreases, and when the scanner LM block 188a descends, the length increases.

The sealing part 189 is connected to the moving plate part 181 for the scanner and the vacuum chamber 110. This sealing part 189 shields the laser scanner 161 from the inside of the vacuum chamber 110. As described above, the top-down substrate etching apparatus according to the present embodiment includes a sealing portion 189 that shields the laser scanner 161 from the inside of the vacuum chamber 110, thereby sealing the inside of the vacuum chamber 110 to the outside. Air can be prevented from flowing into the vacuum chamber 110.

The sealing portion 189 includes a scanner bellows tube 189a whose upper end is coupled to the moving plate portion 181 for the scanner, the lower end is coupled to the lower wall of the vacuum chamber 110 and has a variable length.

The scanner bellows tube 189a prevents the vacuum inside the vacuum chamber 110 from being destroyed during the up/down process of the scanner moving plate part 181. That is, the bellows tube 189a for a scanner according to the present embodiment shields the interior of the vacuum chamber 110 from an external atmospheric pressure space.

The upper end of the scanner bellows tube 189a is coupled to the plate body 183 and the lower end is coupled to the lower wall of the vacuum chamber 110. The length of the bellows pipe 189a for a scanner expands and contracts according to the elevation of the plate body portion 183. That is, when the plate body portion 183 is raised, the length is increased, and when the plate body portion 183 is lowered, the length is reduced.

It is supported by the moving plate part 181 for a scanner to the lens part (M). The lens unit M focuses the laser beam emitted from the laser scanner 161 and passing through the transmission window 185. In this embodiment, the lens unit M is detachably coupled to the pocket unit 184. Accordingly, the lens unit M contaminated with particles generated by the etching process may be replaced with a new lens unit M.

Meanwhile, the substrate tray unit 130 is connected to the vacuum chamber 110. The substrate tray unit 130 supports the substrate and moves the substrate in a chucking portion (not shown). In this embodiment, the substrate tray unit 130 is provided as a non-active area-contact type substrate tray unit 130 that contacts the non-active area G2 provided on the substrate.

Such a non-active area contact type substrate tray unit 130, as shown in detail in FIGS. 7 to 10, is disposed inside the vacuum chamber 110 and supports a substrate, a substrate support module 140, and a substrate support. It is connected to the module 140 and includes an up/down moving module 150 for a support module that moves the substrate support module 140 up/down with respect to the chucking part (not shown). do.

The substrate support module 140 is disposed inside the vacuum chamber 110. Such a substrate support module 140 supports a substrate.

The substrate support module 140 according to the present embodiment includes a support module frame part 141 supported by an up/down moving module, as shown in detail in FIGS. 7 to 10, and a support module frame. It includes a substrate contact portion 148 connected to the portion 141 and in contact with the inactive region G2 of the substrate.

The support module frame part 141 is supported by an up/down moving module. This support module frame portion 141, as shown in detail in Figures 7 to 10, the substrate contact portion 148 is coupled to a plurality of the contact portion mounting horizontal bar portion 142 disposed to be spaced apart from each other, each A combination in which a plurality of vertical bar portions 143 that are coupled to the horizontal bar portion 142 for mounting the contact portion and are arranged to be spaced apart from each other, and that are coupled to the vertical bar portion 143 and that an up/down moving module is coupled The horizontal bar portion 145 for connection is disposed between the horizontal bar portion 144 for mounting and the horizontal bar portion 142 for contact portion mounting and the horizontal bar portion 144 for coupling, and is connected to the vertical bar portions 143. Includes.

The substrate contact portion 148 is coupled to the horizontal bar portion 142 for mounting the contact portion. As shown in detail in FIGS. 7 to 10, the horizontal bar portion 142 for mounting the contact portion is provided in a plurality and disposed to be spaced apart from each other. In this embodiment, the horizontal bar portion 142 for mounting the contact portion is provided in a bar shape and extended in the X-axis direction.

The vertical bar portion 143 is provided in plural and disposed to be spaced apart from each other. Each of these vertical bar portions 143 is coupled to the horizontal bar portion 142 for mounting a contact portion. In this embodiment, the vertical bar portion 143 is provided in a bar shape and extends long in the Z-axis direction crossing the X-axis direction.

The horizontal bar portion 144 for coupling is coupled to the vertical bar portions 143. The horizontal bar portion 144 for coupling is coupled to an up/down moving module 150 for a support module. In this embodiment, the horizontal bar portion 144 for coupling is provided in a bar shape and extended in a Y-axis direction crossing the X-axis direction and the Z-axis direction.

The connecting horizontal bar portion 145 is disposed between the horizontal bar portion 142 for mounting the contact portion and the horizontal bar portion 144 for coupling. The horizontal bar portion 145 for this connection is connected to the vertical bar portions 143. The horizontal bar portion 145 for connection is provided in a bar shape and extends long in the Y-axis direction.

The horizontal bar portion 145 for connection of the present embodiment is disposed between the horizontal bar portion 142 for mounting the contact portion and the horizontal bar portion 144 for coupling, and is coupled to the vertical bar portions 143, so that it is long in the vertical direction. The vertical bar portion 143 having a length is prevented from being inclined or shaking in the vertical bar portion 143.

The substrate contact portion 148 is coupled to the horizontal bar portion 142 for mounting the contact portion. The substrate contact portion 148 is in contact with the inactive region G2 of the substrate. In this embodiment, the substrate contact portion 148 includes a plurality of substrate contact portions 148. The plurality of substrate contacting portions 148 are disposed to be spaced apart from each other according to a predetermined spacing as shown in detail in FIGS. 7 to 10.

As described above, the substrate contact portions 148 according to the present embodiment are disposed to be spaced apart from each other at the upper end of the horizontal bar portion 142 for mounting the contact portions disposed to be spaced apart from each other, so that the inactive region G2 provided in the central region of the substrate By contacting, it is possible to prevent sagging of the central region of the substrate.

Meanwhile, the up/down moving module 150 for the support module is connected to the substrate support module 140. The support module up/down movement module 150 moves the substrate support module 140 up/down with respect to the chucking part (not shown).

In this embodiment, the up/down moving module 150 for the support module is a pressure shaft part for a tray unit that penetrates the lower wall of the vacuum chamber 110 and is coupled to the support module frame part 141 ( 151 and a tray unit shaft connected to the pressure shaft portion 151 for the tray unit, disposed outside the vacuum chamber 110, and moving the pressure shaft portion 151 for the tray unit up/down The bellows for the shaft that surrounds a part of the moving drive unit 153, 154, 155 for the tray unit and the pressure shaft unit 151 for the tray unit and seals the area of the vacuum chamber 110 through the pressurization shaft unit 151 for the tray unit. Includes tube (K).

The pressure shaft portion 151 for the tray unit penetrates the lower wall of the vacuum chamber 110 and is coupled to the horizontal bar portion 144 for coupling. The pressure shaft portion 151 for the tray unit is provided in a shaft shape having a long length as shown in detail in FIGS. 7 to 10. The pressure shaft portion 151 for the tray unit is disposed in a vertical direction and penetrates the lower wall of the vacuum chamber 110.

The upper portion of the pressure shaft portion 151 for the tray unit of the present embodiment is disposed inside the vacuum chamber 110 and the lower portion of the pressure shaft portion 151 for the tray unit is disposed outside the vacuum chamber 110.

The movable drive units 153, 154, and 155 for the shaft for the tray unit are connected to the pressure shaft unit 151 for the tray unit. The tray unit shaft moving drive unit 153, 154, 155 is disposed outside the vacuum chamber 110 to move the tray unit pressurizing shaft unit 151 up/down.

The movable drive unit (153, 154, 155) for a shaft for a tray unit according to the present embodiment includes an LM block (153) for a tray unit to which the pressure shaft unit 151 for a tray unit is coupled, and an LM block for a tray unit. An LM guide (154) for a tray unit that guides the movement of the block 153, and an LM block for a tray unit that is connected to the LM block 153 for a tray unit and moves the LM block 153 for the tray unit. Includes a driving unit 155.

The tray unit LM guide 154 guides the movement of the tray unit LM block 153. The tray unit LM guide 154 includes a moving block (not shown) coupled to the tray unit LM block 153 and a guide rail (not shown) to which the moving block (not shown) is slidably connected. .

The drive unit 155 for the tray unit LM block is connected to the LM block 153 for the tray unit. The drive unit 155 for the tray unit LM block moves the LM block 153 for the tray unit. The drive unit 155 for the tray unit LM block according to the present embodiment includes a moving nut (not shown) coupled to the tray unit LM block 153, and a ball screw for a tray unit engaged with the moving nut (not shown). It includes (155a) and a drive motor (155b) for a tray unit coupled to the ball screw (155a) for the tray unit to rotate the ball screw (155a) for the tray unit.

The bellows pipe K for the shaft surrounds a part of the pressure shaft portion 151 for the tray unit and seals the region of the vacuum chamber 110 through which the pressure shaft portion 151 for the tray unit passes. The bellows pipe K for the shaft prevents the vacuum state of the vacuum chamber 110 from being destroyed during the up/down process of the pressure shaft part 151 for the tray unit. That is, the bellows pipe K for the shaft of the present embodiment shields the area of the vacuum chamber 110 through which the pressure shaft portion 151 for the tray unit passes through the external atmospheric pressure space.

The upper end of the bellows pipe K for the shaft is connected to the outer wall of the vacuum chamber 110 and the lower end is connected to the LM block 153 for the tray unit. This shaft bellows pipe (K) is extended and contracted in length according to the lifting of the tray unit LM block (153). That is, when the tray unit LM block 153 rises, the length decreases, and when the LM block 153 descends, the length increases.

Meanwhile, the alignment camera unit (not shown) is disposed in the lower area of the vacuum chamber 110. Such an alignment camera unit (not shown) is a non-active area contact type substrate tray unit through a window provided in the vacuum chamber 110 for alignment of the substrate with the non-active area contact type substrate tray unit 130 130 and the substrate are imaged.

In the present embodiment, the alignment camera unit (not shown) is at the edge of the substrate or the edge region of the substrate tray unit 130 (for example, for mounting a contact portion) with a marker for a substrate (not shown) provided on the substrate. An image of a tray marker (not shown) provided in the edge area of the horizontal bar part 142) or the non-active area-contact type substrate tray unit 130 is captured.

The control unit (not shown) is electrically connected to the alignment camera unit (not shown) and the stage unit 120. The control unit (not shown) controls the alignment unit (not shown) through information of the alignment camera unit (not shown) to align the non-active area contact type substrate tray unit 130 and the substrate.

In this embodiment, the control unit (not shown) is also electrically connected to the stage moving unit 170, the non-active area contact type substrate tray unit 130, the laser unit 160, and the like.

Hereinafter, the operation of the top-down substrate etching apparatus according to the present embodiment will be described with reference to FIGS. 2 to 10 with a focus on the scanner moving unit 180.

In this embodiment, in order to reduce the beam size of the laser beam, the distance between the laser scanner 161 and the substrate is shortened. In order to shorten the distance between the laser scanner 161 and the substrate, the plate moving parts 187 and 188 are operated to raise the scanner moving plate part 181.

As the scanner moving plate part 181 rises, the laser scanner 161 coupled to the scanner moving plate part 181 also rises, so that the distance between the substrate and the laser scanner 161 is shortened.

The length of the scanner bellows tube 189a increases during the raising of the scanner moving plate part 181. As described above, the length of the scanner bellows tube 189a is changed when the scanner moving plate portion 181 is raised, so that a vacuum atmosphere in the vacuum chamber 110 can be maintained.

As described above, the top-down substrate etching apparatus of the present embodiment is connected to the vacuum chamber 110 to seal the interior of the vacuum chamber 110, and the laser scanner 161 is provided so that the laser scanner 161 can be approached and separated from the substrate. By providing the scanner moving unit 180 that moves in the up/down direction, the focal length of the laser scanner 161 can be shortened, thereby reducing the beam size of the laser beam. I can.

Although the present embodiment has been described in detail with reference to the drawings above, the scope of the present embodiment is not limited to the above-described drawings and description.

As described above, the present invention is not limited to the described embodiments, and it is apparent to those of ordinary skill in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to be within the scope of the claims of the present invention.

110: vacuum chamber 111: chamber through hole
120: stage unit 130: substrate tray unit
140: substrate support module 141: support module frame portion
142: horizontal bar portion for mounting the contact portion 143: vertical bar portion
144: horizontal bar portion for coupling 145: horizontal bar portion for coupling
148: substrate contact portion
150: up/down moving module for support module
160: laser unit 161: laser scanner
170: stage moving unit 180: scanner moving unit
181: moving plate part for scanner 182: moving plate part main body
183: plate body portion 183a: cut hole
184: pocket portion 184a: side wall portion for pocket portion
184b: bottom wall portion for pocket portion 184c: insertion groove
184d: window placement hole 185: transmission window
187: pressure shaft portion for the scanner
188: pressure shaft moving drive unit for the scanner
188a: LM block for scanner 188b: LM guide for scanner
188d: scanner ball screw 188e: scanner drive motor
189: sealing portion 189a: scanner bellows tube
M: lens part

Claims (15)

A vacuum chamber in which an etching process is performed on the substrate;
A stage unit disposed inside the vacuum chamber and including a chucking portion for chucking the substrate loaded into the vacuum chamber;
A laser scanner that penetrates the lower wall of the vacuum chamber through a chamber through hole formed in the lower wall of the vacuum chamber and performs the etching process by irradiating a laser beam to a substrate in the vacuum chamber A laser unit having a; And
Supports the laser scanner, is connected to the vacuum chamber to seal the interior of the vacuum chamber, and moves the laser scanner in an up/down direction so that the laser scanner can be approached and spaced apart from the substrate. It includes a scanner moving unit to move,
The scanner moving unit,
A moving plate portion for a scanner that supports the laser scanner and moves in an up/down direction;
A plate moving part connected to the moving plate part for the scanner and moving the moving plate part for the scanner; And
A top-down substrate etching apparatus including a sealing portion connected to the moving plate portion for the scanner and the vacuum chamber, and shielding the laser scanner from the inside of the vacuum chamber. delete The method of claim 1,
The moving plate portion for the scanner,
A moving plate main body to which the plate moving part is coupled; And
A top-down substrate etching apparatus including a transmission window coupled to the moving plate body and through which the laser beam passes. The method of claim 3,
The moving plate part main body,
Plate body portion formed with a plurality of cutout holes; And
A top-down substrate etching apparatus comprising a pocket portion connected to the plate body portion and forming an insertion groove communicating with the cut-out hole. The method of claim 4,
The pocket portion,
A side wall portion for a pocket portion coupled to the plate body portion; And
A top-down substrate etching apparatus including a bottom wall portion for a pocket portion coupled to the side wall portion for the pocket portion and having a window placement hole in which the transmission window is disposed. The method of claim 1,
The moving part for the plate,
A pressure shaft portion for a scanner that penetrates the lower wall of the vacuum chamber and is coupled to the moving plate portion for the scanner; And
A top-down substrate etching apparatus comprising a pressure shaft moving driver for a scanner connected to the pressure shaft for the scanner, disposed outside the vacuum chamber, and moving the pressure shaft for the scanner up/down. The method of claim 6,
The pressure shaft movement driving unit for the scanner,
An LM block for a scanner to which the pressure shaft portion for the scanner is coupled;
An LM guide for a scanner guiding the movement of the scanner LM block; And
A top-down substrate etching apparatus including a driver for a scanner LM block that is connected to the scanner LM block and moves the scanner LM block. The method of claim 1,
The sealing part,
A top-down substrate etching apparatus comprising a scanner bellows tube having an upper end portion coupled to the moving plate portion for the scanner, a lower portion coupled to the lower wall of the vacuum chamber, and having a variable length. The method of claim 1,
The scanner moving unit,
A top-down substrate etching apparatus that is supported on the moving plate for the scanner and further comprises a lens unit for focusing the laser beam. The method of claim 1,
A top-down substrate etching apparatus further comprising a substrate tray unit connected to the vacuum chamber and supporting the substrate and moving the substrate in a chucking portion direction. The method of claim 10,
The substrate tray unit,
A top-down substrate etching apparatus comprising a non-active area-contact type substrate tray unit in contact with a non-active area provided on the substrate. The method of claim 11,
The inactive area contact type substrate tray unit,
A substrate support module disposed inside the vacuum chamber and supporting the substrate; And
A top-down substrate etching apparatus comprising an up/down moving module for a support module connected to the substrate support module and moving the substrate support module up/down with respect to the chucking part. The method of claim 12,
The substrate support module,
A support module frame part supported by an up/down moving module for the support module; And
A top-down substrate etching apparatus including a substrate contact portion connected to the support module frame portion and in contact with the inactive region of the substrate. The method of claim 13,
The support module frame part,
A horizontal bar portion for mounting a plurality of contact portions which are coupled to the substrate contact portions and are disposed to be spaced apart from each other;
A plurality of vertical bar portions coupled to each of the horizontal bar portions for mounting the contact portions and disposed to be spaced apart from each other; And
A top-down substrate etching apparatus including a coupling horizontal bar portion coupled to the vertical bar portion and to which the up/down moving module is coupled. The method of claim 13,
The up/down moving module for the support module,
A pressure shaft portion for a tray unit that penetrates the lower wall of the vacuum chamber and is coupled to the support module frame portion; And
Top-down substrate etching apparatus including a moving drive for a shaft for a tray unit connected to the pressure shaft for the tray unit and disposed outside the vacuum chamber, and for moving the pressure shaft for the tray unit up/down .

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