KR101479944B1 - Centering apparatus of glass and organic material depositing system including the same - Google Patents

Centering apparatus of glass and organic material depositing system including the same Download PDF

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Publication number
KR101479944B1
KR101479944B1 KR1020130120266A KR20130120266A KR101479944B1 KR 101479944 B1 KR101479944 B1 KR 101479944B1 KR 1020130120266 A KR1020130120266 A KR 1020130120266A KR 20130120266 A KR20130120266 A KR 20130120266A KR 101479944 B1 KR101479944 B1 KR 101479944B1
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South Korea
Prior art keywords
substrate
centering
unit
organic material
block
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KR1020130120266A
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Korean (ko)
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곽호민
남현종
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주식회사 에스에프에이
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Priority to KR1020130120266A priority Critical patent/KR101479944B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Disclosed are a substrate centering device and an organic substance deposition system including the same. According to an embodiment of the present invention, a substrate centering device and an organic substance deposition system including the same includes: a substrate centering unit having a plurality of unit centering units arranged to be apart from each other along an edge portion of a substrate; and a centering operation unit operating the unit centering units to enable the unit centering units to integrally be operated to center the substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate centering device and an organic material deposition system having the substrate centering device,

The present invention relates to a substrate centering device and an organic material deposition system including the substrate centering device, and more particularly, to a substrate centering device capable of aligning the centering of a substrate that is an object of organic material deposition, and an organic material deposition system including the substrate centering device will be.

Recently, display devices have been made larger and higher in quality as transmission media for image information.

Accordingly, various flat panel display devices replacing CRT (Cathode Ray Tube), which have been used in the past, have been developed and popularized.

One of such flat panel display devices has been developed to a level of CRT or higher in terms of image quality, thereby realizing a clear color.

In general, in order to manufacture a flat panel display device such as an OLED (Organic Light Emitting Display), an organic thin film deposition process for depositing organic materials in a predetermined pattern on a substrate such as glass .

The organic material deposition system for performing the organic thin film deposition process evaporates an organic material as an organic thin film material to a substrate and a mask that maintain a bonded state in a vacuum chamber maintaining a vacuum state, Pattern.

That is, in order to precisely mark a marking process for finely marking a unique identification code or the like of the substrate, a cutting process for cutting the substrate, an exposure process for exposing the substrate, and the like in the process of manufacturing the substrate, It is the most basic.

The organic material deposition system typically includes a substrate centering device capable of centering a substrate to be introduced into the vacuum chamber through the robot in a predetermined position.

However, in the conventional substrate centering device, each centering device is individually driven by a motor or a cylinder when the substrate is transferred between the vacuum chambers to center the substrate.

In such a case, when the driving device for driving the centering device is advanced or retracted, it is difficult to balance with each centering device, and the substrate is distorted.

Further, since a plurality of motors and cylinders are required by driving the centering device individually, a large space is required for installing the motor and the cylinder, and there is a problem that the tact time of the transfer tact time increases when the substrate is transferred between the vacuum chambers .

Korean Patent Publication No. 10-2010-0084523 (Bulletin of July 26, 2010)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a substrate centering device capable of operating a plurality of unit centering units integrally with an efficient structure when a substrate is transferred between chambers, and an organic material deposition system including the same .

According to an aspect of the present invention, there is provided a substrate processing apparatus comprising: a substrate centering unit including a plurality of uniting centering units disposed apart from each other along a rim of a substrate; And a centering drive unit for driving the plurality of unit centering units so that the plurality of unit centering units are operated integrally for centering the substrate.

The centering drive unit includes a movable body that is relatively movably coupled to the substrate centering unit and moves and separates the plurality of unit centering units with respect to the substrate as the substrate moving unit moves relative to the substrate centering unit; And a moving body driving unit for driving the moving body.

The moving body includes: a main plate connected to the moving body driving unit and raised and lowered; And a plurality of shafts coupled to the main plate and lifted and lowered in accordance with the rising and falling of the main plate to separate and approach the plurality of unit centering units with respect to the substrate.

The moving body may further include a moving plate coupled to one end of the shaft.

The moving body driving unit may be any one of a motor and a cylinder provided in an organic material deposition chamber for depositing an organic substance.

Wherein the uniting centering unit comprises: a centering block having a through hole for the shaft to move up and down; And a movable body that moves away from and approaches the substrate in association with the rising and falling of the shaft.

The centering block includes: a body having the through-hole formed therein; And a guide bar standing up from the bottom wall of the body.

Wherein the movable body is relatively movable along the guide bar and is coupled to the guide bar and is raised and lowered according to the upward and downward movement of the shaft; And a centering module that is spaced apart and approaches the substrate as the bushes ascend and descend.

The centering module includes a drive link, one end of which is hinged to the bush, and rotates when the bush is lifted and lowered; And an LM guide unit hinged to the other end of the driving link to linearly move the driving link.

The LM guide unit includes an LM block (LM block) hinged to the other end of the driving link and slidable in the left and right direction according to the rotation of the driving link; And an LM rail for guiding the LM block to linearly move.

The centering module may include a roller unit coupled to the LM block and contacting the substrate when the LM block approaches the substrate to center the substrate.

Wherein the roller unit includes a bracket to which the LM block is coupled, the long hole being formed so as to adjust the gap with the substrate; And a roller mounted on the bracket for centering in a rolling contact with the substrate.

According to another aspect of the present invention, there is provided an organic light emitting display comprising: an organic material deposition chamber for depositing an organic material on a substrate; A substrate holding device provided in the organic material deposition chamber to support the substrate; And a substrate centering device provided in the organic material deposition chamber for centering the substrate loaded in the organic material deposition chamber.

Embodiments of the present invention can provide a centering device capable of reducing the tact time and improving the mass productivity by integrally operating a plurality of unit centering units as an efficient structure when the substrate is transferred between the chambers And an organic material deposition system having the same can be provided.

1 is an enlarged perspective view of a unit centering unit.
2 is a front view in which the substrate centering device is decentered;
3 is a front view in which the substrate centering device is centered;
4 is a plan view of an organic material deposition system including a substrate centering device, which is an embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

FIG. 3 is a front view of the centering device, and FIG. 4 is a sectional view of a substrate centering device according to an embodiment of the present invention. Referring to FIG. FIG. 2 is a plan view of an organic material deposition system.

Hereinafter, the structure and operation of the substrate centering device 10 will be described first, and the organic material deposition system 1 will be described later.

1 to 4, a substrate centering apparatus 10 according to an embodiment of the present invention includes a substrate centering unit 100 and a centering drive unit 200.

First, as shown in FIG. 1, a substrate centering unit 100 includes a plurality of unit centering units 100a that are spaced apart from each other along a rim of a substrate.

For reference, in the embodiment of the present invention, a substrate refers to a flat panel display device such as a plasma display panel (PDP), a liquid crystal display (LCD), and an organic light emitting display (OLED) FPD, Flat Panel Display), a semiconductor wafer, a glass for a photomask, and the like.

Hereinafter, the organic light emitting display device OLED will be described as an example of a substrate for convenience of explanation, but it should be understood that the scope of the present invention is not limited thereto.

First, the unit centering unit 100a includes a centering block 110 and a movable main body 120. [

In the centering block 110, a through hole is formed so that the shaft 213, which will be described later, passes through the centering block 110 and moves up and down.

The centering block 110 includes a body 111 on which a through hole is formed and a guide bar 113 standing up from the bottom wall of the body 111.

The guide bar 113 serves to guide the bush 121 to be described later when it is slid.

The guide bars 113 according to the embodiment of the present invention are arranged standing from the bottom wall of the body 111 in parallel with each other as shown in detail in FIG. 1, but have different numbers, shapes and arrangement structures And it is to be understood that the scope of the present invention is not limited thereto.

On the other hand, the movable main body 120 moves away from and approaches the substrate in association with the rising and falling of the shaft 213.

That is, when the shaft 213 is raised, the movable main body 120 is spaced apart from the substrate, and when the shaft 213 is lowered, the movable main body 120 approaches the substrate.

Specifically, the movable body 120 includes a bush 121 and a centering module 123.

The bush 121 is engaged with the guide bar 113 so as to be movable along the guide bar 113.

Therefore, the bush 121 plays a role of rising and falling according to the rising and falling of the shaft 213 connected thereto.

The centering module 123 is spaced apart and approach the substrate as the bushes 121 are lifted and lowered.

That is, when the bushing 121 is lifted, the centering module 123 is separated from the substrate. When the bushing 121 is lowered, the centering module 123 approaches the substrate.

Therefore, for this operation, the centering module 123 includes a drive link 125, an LM guide portion 127, and a roller unit 129.

One end of the drive link 125 is hinged to the bush 121 and rotates when the bush 121 is lifted and lowered.

The LM guide unit 127 is hinged to the other end of the driving link 125 and serves to linearly move the driving link 125.

In detail, the LM guide unit 127 includes an LM block 127a and an LM rail 127b.

The LM block 127a is hinged to the other end of the driving link 125 and slides in the left and right direction according to the rotation of the driving link 125. [

The LM block 127a is provided in a rectangular shape in accordance with the length of each surface of the body 111 and is connected to the LM rail 127b so as to be movable along the LM rail 127b.

That is, the LM rail 127b serves to guide the LM block 127a to linearly move.

Next, the roller unit 129 is coupled to the LM block 127a and serves to center the substrate by contacting the substrate when the LM block 127a approaches the substrate.

Specifically, the roller unit 129 includes a bracket 129a and a roller 129b.

The bracket 129a has a slot formed therein so as to adjust the distance between the substrate and the roller 129a, and is coupled to the LM block 127a.

That is, if the gap between the roller 129b and the substrate is too large, the bracket 129a is coupled with the LM block 127a so that the overlapping portion of the LM block 127a is small.

If the interval between the roller 129b and the substrate is too narrow, the bracket 129a is engaged with the LM block 127a so that the portion overlapping with the LM block 127a.

The roller 129b is mounted on the bracket 129a and is in rolling contact with the substrate and serves to center it.

1, in the embodiment of the present invention, the roller 129b is coupled to the bracket 129a and faces downward. However, the roller 129b may be oriented upwardly and in various directions to center the substrate, It is to be understood that the scope of the rights is not limited in this respect.

On the other hand, the centering drive unit 200 serves to drive a plurality of unit centering units 100a such that a plurality of unit centering units 100a are integrally operated for centering the substrate.

As shown in FIGS. 2 and 3, the centering drive unit 200 includes a moving body 210 and a moving body driving unit 220.

First, the moving body 210 is movably coupled to the substrate centering unit 100. [

That is, as the moving body 210 moves relative to the substrate centering unit 100, the moving body 210 serves to move the plurality of unit centering units 100a toward and away from the substrate.

To this end, the moving body 210 includes a main plate 211 and a plurality of shafts 213.

The main plate 211 is connected to the moving body driving unit 220 and serves to move up and down.

The plurality of shafts 213 are coupled to the main plate 211 and are lifted and lowered according to the upward and downward movement of the main plate 211 to move the plurality of unit centering units 100a away from and approach the substrate It plays a role.

That is, since the plurality of shafts 213 are coupled to one main plate 211, when one main plate 211 is moved up and down, the plurality of shafts 213 are simultaneously moved up and down.

Next, the moving body driving part 220 serves to drive the moving body 210. [

Accordingly, the moving body driving unit 220 may be any one of a motor and a cylinder provided in the organic material deposition chamber 20 for depositing the organic material.

The moving body driving unit 220 is installed in an atmospheric pressure chamber (ATM BOX) provided in the organic substance deposition chamber 20 in this embodiment.

The shapes of the motor and the cylinder may be configured by well-known devices well known in the art, and the description thereof will be omitted.

The moving body 210 may further include a moving plate 215 coupled to one end of the shaft 213.

That is, the moving plate 215 is provided between the shaft 213 and the bush 121 and serves to connect the same.

Hereinafter, the operation of the substrate centering device 10 will be described with reference to Figs. 2 to 3. Fig.

For convenience of explanation, the left side of the two unit centering units 100a shown in Fig. 2 will be described with reference to the left side.

The moving body driving unit 20 operates to raise the main plate 211. [

When the main plate 211 is lifted, the plurality of shafts 213 coupled to the main plate 211 simultaneously rise.

The plurality of shafts 213 pass through the centering block 110 in which the through holes are formed to push up the moving plate 215.

The moving plate 215 is engaged with the bush 121 and is connected to the shaft 213. When the moving plate 215 rises, the bush 121 also rises.

Thus, the bush 121 slides along the guide bar 113 to be raised.

Thus, when the bush 121 is lifted, one end of the drive link 125 hinged to the bush 121 is lifted.

Since the other end of the drive link 125 is connected to the LM block 127a, the LM block 127a is moved to the left.

Therefore, the LM block 127a slides to the left side of the wall 111 of the body 111 along the LM rail 127b, so that the roller unit 129 is separated from the substrate, and the centering of the substrate is released.

3, when the main plate 211 is lowered, the plurality of shafts 213 coupled to the main plate 211 are simultaneously lowered.

Then, the plurality of shafts 213 pull down the moving plate 215, so that the bush 121 coupled to the moving plate 215 slides along the guide bar 113 and descends.

The other end of the drive link 125 hinged to the bush 121 is moved to the other end of the drive link 125 such that the LM block 127a moves along the LM rail 127 toward the wall surface side of the body 111 In the rightward direction.

Then, the roller unit 129 coupled with the LM block 127a is brought close to the substrate.

Accordingly, the roller 129b of the roller unit 129 comes into rolling contact with the substrate to perform a centering operation.

If the distance between the roller 129b and the substrate is too long or narrow, the engagement position of the bracket 129a can be appropriately adjusted as described above in order to adjust it.

As described above, the substrate centering apparatus 10 according to the present embodiment can operate a plurality of unit centering units 100a integrally with an efficient structure.

Hereinafter, the structure and operation of the organic material deposition system 1 including the substrate centering device 10 according to an embodiment of the present invention will be described.

4, the organic material deposition system 1 includes an organic material deposition chamber 20, a substrate support apparatus (not shown), and a substrate centering apparatus 10. As shown in FIG.

The organic material deposition chamber 20 is a vacuum chamber for forming a vacuum atmosphere therein, and serves to deposit an organic material on the substrate.

A substrate supporting apparatus (not shown) is provided in the organic material deposition chamber 20 to support the substrate.

The organic material deposition chamber 20 and the substrate holding device (not shown) may be formed by applying a technique known in the art, so that a detailed description of the constitution will be omitted in the embodiment of the present invention.

The substrate centering device 10 is provided in the organic material deposition chamber 20 and serves to center the substrate loaded into the organic material deposition chamber 20 by the operation as described above.

Although the eight unit centering units 100a are in rolling contact with the substrate in the embodiment of the present invention, a plurality of unit centering units 100a may be appropriately selected and arranged, and the scope of the present invention is not limited thereto. I will do it.

As described above, according to the related art, since the driving unit is provided outside the chamber and the plurality of motors or the cylinders individually driven are used, the space for installing the motors or the cylinders is insufficient and the operation time is long. There is a problem in that the logistics tact time for transferring the product is also increased.

However, according to the embodiment of the present invention, the atmospheric pressure box is provided in the organic material deposition chamber 20, the moving body driving unit 220 is installed thereon, and the substrate centering device 10 is coupled to the main plate 211 A plurality of unit centering units 100a are integrally operated, thereby reducing the time required for the logistics and reducing the space occupied by the units.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: substrate centering unit 110: centering block
120: movable body 200: centering drive unit
210: moving body 220: moving body driving part
10: substrate centering device 1: organic material deposition system

Claims (13)

A substrate centering unit having a plurality of uniting centering units spaced apart from each other along a rim of the substrate; And
And a centering drive unit for driving the plurality of unit centering units so that the plurality of uniting centers are integrally operated for centering the substrate,
The centering drive unit includes:
A movable body that is relatively movably coupled to the substrate centering unit and that moves and separates the plurality of unit centering units relative to the substrate as the substrate is moved relative to the substrate centering unit; And
And a moving body driving unit for driving the moving body,
The moving body includes:
A main plate connected to the moving body driving unit and raised and lowered;
And a plurality of shafts coupled to the main plate and raised and lowered in accordance with the rising and falling of the main plate to move the plurality of unit centering units away from and approach the substrate. delete delete The method according to claim 1,
The moving body includes:
And a moving plate coupled to one end of the shaft. The method according to claim 1,
The moving body drive unit includes:
Wherein the substrate centering device is one of a motor and a cylinder provided in an organic material deposition chamber for depositing an organic material. The method according to claim 1,
The unit centering unit includes:
A centering block in which a through hole for raising and lowering the shaft is formed; And
And a movable body that moves away from and approaches the substrate in association with the rising and falling of the shaft. The method according to claim 6,
In the centering block,
A body having the through-hole formed therein; And
And a guide bar standing up from the bottom wall of the body. 8. The method of claim 7,
The movable body includes:
A bush which is relatively movable along the guide bar and is coupled to the guide bar and is raised and lowered in accordance with the upward and downward movement of the shaft; And
And a centering module that is spaced apart and approaches the substrate as the bushes rise and fall. 9. The method of claim 8,
The centering module includes:
A drive link hinged at one end with the bush and pivoted when the bush is lifted and lowered; And
And an LM guide (LM guide) hinged to the other end of the driving link to linearly move the driving link. 10. The method of claim 9,
In the LM guide portion,
An LM block (LM Block) hinged to the other end of the driving link and slidable in the left and right direction according to the rotation of the driving link; And
And an LM rail for guiding the LM block to linearly move. 11. The method of claim 10,
The centering module includes:
And a roller unit coupled to the LM block and contacting the substrate when the LM block approaches the substrate to center the substrate. 12. The method of claim 11,
The roller unit includes:
A bracket to which the LM block is coupled; And
And a roller mounted on the bracket for centering in a rolling contact with the substrate. An organic material deposition chamber for depositing an organic material on a substrate;
A substrate holding device provided in the organic material deposition chamber to support the substrate; And
The organic material deposition system according to any one of claims 1 to 12, wherein the substrate centering device is provided in the organic material deposition chamber and centering the substrate loaded in the organic material deposition chamber.
KR1020130120266A 2013-10-10 2013-10-10 Centering apparatus of glass and organic material depositing system including the same KR101479944B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190050253A (en) * 2017-11-02 2019-05-10 인베니아 주식회사 Multi-align assembly for substrate and multi-align apparatus having the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005517A (en) * 2003-06-12 2005-01-06 Sumitomo Heavy Ind Ltd Alignment apparatus and alignment method
KR100627679B1 (en) * 2005-04-19 2006-09-25 두산디앤디 주식회사 Large-size substrate align apparatus
KR100723336B1 (en) * 2007-03-15 2007-05-30 유진디스컴 주식회사 Ic chip centering device
KR20110137205A (en) * 2010-06-16 2011-12-22 주식회사 에스에프에이 Grip apparatus for substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005517A (en) * 2003-06-12 2005-01-06 Sumitomo Heavy Ind Ltd Alignment apparatus and alignment method
KR100627679B1 (en) * 2005-04-19 2006-09-25 두산디앤디 주식회사 Large-size substrate align apparatus
KR100723336B1 (en) * 2007-03-15 2007-05-30 유진디스컴 주식회사 Ic chip centering device
KR20110137205A (en) * 2010-06-16 2011-12-22 주식회사 에스에프에이 Grip apparatus for substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190050253A (en) * 2017-11-02 2019-05-10 인베니아 주식회사 Multi-align assembly for substrate and multi-align apparatus having the same
KR101991488B1 (en) 2017-11-02 2019-06-20 인베니아 주식회사 Multi-align assembly for substrate and multi-align apparatus having the same

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