CN113305396B

CN113305396B - Welding clamping tool for chip-level circuit board

Info

Publication number: CN113305396B
Application number: CN202110870034.6A
Authority: CN
Inventors: 肖飞雨
Original assignee: Sichuan SIP Electronic Technology Co Ltd
Current assignee: Sichuan SIP Electronic Technology Co Ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2021-10-29
Anticipated expiration: 2041-07-30
Also published as: CN113305396A

Abstract

The utility model provides a welding centre gripping frock for chip level circuit board, includes: clamping component and compress tightly the subassembly. The clamping assembly comprises a base, wherein the top surface of the base is provided with two accommodating grooves which are rotationally symmetrical and used for accommodating the circuit board; the lateral wall of the accommodating groove is respectively provided with a first sliding block and a second sliding block pressing circuit board. The compressing assembly is hinged above one end of the base, and the other end of the base is provided with a buckle seat. The pressing assembly comprises a supporting plate, a pressing plate and a sliding part, the supporting plate and the pressing plate are hinged to the base along the same axis, the sliding part penetrates through the supporting plate in the vertical direction, the pressing plate is located above the supporting plate and the sliding part, and a first elastic element is arranged between the sliding part and the pressing plate. The bottom of the sliding component is provided with a first ejector rod and a second ejector rod. When the supporting plate is contacted with the buckle seat, the first ejector rod and the second ejector rod are both vertical to the base. The clamp plate is provided with a rotatable buckle, and the buckle seat is provided with a bayonet. The product can be quickly positioned, clamped and loosened; the clamping is stable and reliable.

Description

Welding clamping tool for chip-level circuit board

Technical Field

The invention belongs to the technical field of chip-level circuit board welding processes, and particularly relates to a welding clamping tool for a chip-level circuit board.

Background

Compared with a conventional circuit board, the chip-scale circuit has a smaller board volume and higher integration level, and a plurality of electronic components, such as a power supply control device, a switch control device, a capacitance device and the like, are generally required to be integrated on a smaller circuit board substrate. Such chip-scale circuit boards usually include a carrier, a substrate and various devices, and the components are usually connected by high temperature soldering. In the production process, all parts need to be fixed by adopting a clamp so as to ensure the production consistency.

The existing welding clamp is realized by various screws in the processes of part assembling, part taking, clamping and loosening, and the operation is complicated; the use efficiency is low; and the consistency of pressing force is difficult to ensure, so that the welding quality of products has certain difference, and the production consistency is poor.

Disclosure of Invention

In order to solve the defects of the prior art, the invention provides a welding clamping tool for a chip-level circuit board, which can quickly position, clamp and loosen a product; the pressing force is stable and consistent, and the consistency of the product quality is improved.

In order to realize the purpose of the invention, the following scheme is adopted:

the utility model provides a welding centre gripping frock for chip level circuit board, the circuit board is the L type, and the circuit board includes support plate, base plate and a plurality of device that set gradually by supreme down.

Above-mentioned welding centre gripping frock includes: clamping component and compress tightly the subassembly.

The clamping assembly comprises a base, wherein the top surface of the base is provided with two rotationally symmetrical accommodating grooves which are of an L-shaped structure and used for accommodating the circuit board; two adjacent long side walls of holding tank are equipped with first slider and second slider respectively for with the adjacent two outer wall contact of L type circuit board, from the side compress tightly circuit board.

The compressing assembly is hinged above one end of the base, and the other end of the base is provided with a buckle seat.

The pressing assembly comprises a supporting plate, a pressing plate and a sliding part, the supporting plate and the pressing plate are hinged to the base along the same axis, the sliding part penetrates through the supporting plate in the vertical direction, the pressing plate is located above the supporting plate and the sliding part, and a first elastic element is arranged between the sliding part and the pressing plate.

The bottom of the sliding component is provided with a plurality of first ejector rods and a plurality of second ejector rods corresponding to the accommodating grooves, and the first ejector rods and the second ejector rods are movably arranged along the direction perpendicular to the bottom surface of the sliding component.

When the bottom surface of the supporting plate, which is far away from one end of the hinge shaft, is contacted with the top surface of the buckle seat, the supporting plate is parallel to the base, and the first ejector rod and the second ejector rod are perpendicular to the base at the moment but are not contacted with the substrate and the device.

The one end that the articulated shaft was kept away from to the clamp plate is equipped with rotatable buckle, and the bayonet socket has been seted up to the buckle seat, and when the buckle bottom was connected in the bayonet socket, the clamp plate was parallel with the base, and first ejector pin compresses tightly in the base plate this moment, and the second ejector pin compresses tightly in the device.

Furthermore, the sliding component comprises a guide plate and a cover plate, the cover plate is arranged above the guide plate, the first ejector rod and the second ejector rod vertically penetrate through the guide plate, and second elastic elements are arranged between the bottom surface of the cover plate and the top surfaces of the first ejector rod and the second ejector rod.

Furthermore, four corners of the cover plate are provided with flanges, and the top surface of the supporting plate corresponds to the flanges and is provided with a limiting groove.

Furthermore, a third elastic element is arranged between the limiting groove and the flange.

Further, the cover plate is divided into two corresponding accommodating grooves, the top of each cover plate is correspondingly provided with the first elastic elements with the same number, and each cover plate independently presses one circuit board.

Furthermore, the sliding component is provided with a guide rod which vertically penetrates through the supporting plate.

Further, be equipped with spacing arm-tie between clamp plate and the backup pad, the clamp plate is located in the rotation of spacing arm-tie one end, and the other end has the bar hole to connect in the backup pad through the bar hole.

Furthermore, the one end that the articulated shaft was kept away from to the backup pad has seted up the draw-in groove, and the buckle seat top surface corresponds the draw-in groove and is equipped with the lug, and when the backup pad was parallel with the base, lug and draw-in groove cooperation.

Furthermore, the first sliding block and the second sliding block are controlled to move through the eccentric wheel so as to compress or loosen the side face of the circuit board, and the two sides of the base corresponding to the rotating handle of the eccentric wheel are provided with limiting blocks.

The invention has the beneficial effects that:

1. the invention is divided into two parts to clamp each part of the circuit board, firstly, a carrier plate and a substrate of the circuit board are placed by utilizing a containing groove, and the carrier plate and the substrate are quickly locked by utilizing an eccentric wheel structure so as to ensure the positions of the carrier plate and the substrate; then, the first ejector rod and the second ejector rod of the compressing assembly are used for compressing different devices respectively, so that the position accuracy of various devices is ensured. The pressure plate not only serves to provide the primary compression force to the movable member, but also serves to provide a locking connection between the compression assembly and the clamping assembly.

2. The dismounting is convenient and fast. The compressing assembly is integrally hinged with the clamping assembly, so that the compressing assembly is conveniently separated from the whole compressing assembly, and the circuit board is conveniently placed and taken out after welding. Meanwhile, the clamping component is matched with the rotating connection between the pressing component and the clamping component to prevent the first ejector rod and the second ejector rod from pressing devices of the circuit board in the rotating process, so that a sliding part penetrating the first ejector rod and the second ejector rod is slidably penetrated in the supporting plate, and the supporting plate and the buckle seat are used for positioning to determine the overall relative position between the pressing component and the clamping component; and the third elastic element is utilized to support the sliding part on the supporting plate, so that the first ejector rod and the second ejector rod are always kept at a preset distance from the devices before the pressing plate is pressed tightly, and then the first ejector rod and the second ejector rod are vertically pressed to each device of the circuit board through the pressure of the pressing plate, so that the first ejector rod and the second ejector rod are prevented from contacting the devices in the rotating process, and the position accuracy of the devices on the substrate is prevented from being influenced.

3. Two circuit boards can be produced simultaneously, and the two circuit boards provide pressure through independent cover plates, so that mutual influence is avoided, and each circuit board has more stable pressing force.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

Fig. 1 shows an overall configuration diagram of the present application.

Fig. 2 shows the configuration of the clamping assembly.

Fig. 3 shows a connection and driving structure of the first slider and the second slider.

Fig. 4 shows an enlarged view at a in fig. 3.

Fig. 5 shows an exploded view of the structure of the hold-down assembly.

Fig. 6 shows a structural view of the slide member.

Fig. 7 shows a state diagram of the soldering jig when the circuit board is placed.

Figure 8 shows a cross-sectional view of the hold-down assembly along the axis of the third elastic element.

Fig. 9 shows an enlarged view at B in fig. 8.

Fig. 10 shows a schematic view of the state when the support plate is just in contact with the catch seat.

Fig. 11 shows a state diagram when the substrate and the device are pressed.

Fig. 12 shows a schematic diagram of a circuit board clamped by the present application.

The labels in the figure are: the device comprises a carrier plate-1, a substrate-2, a device-3, a clamping component-10, a base-11, a containing groove-111, a first sliding block-12, a second sliding block-13, a clamping seat-14, a bayonet-141, a bump-142, an eccentric wheel-15, a limiting seat-16, a pressing component-20, a supporting plate-21, a limiting groove-211, a pressing plate-22, a first elastic element-23, a clamping button-24, a limiting pulling plate-25, a third elastic element-26, a sliding part-30, a first ejector rod-31, a second ejector rod-32, a guide plate-33, a cover plate-34, a flange-341, a second elastic element-35 and a guide rod-36.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present invention and simplifying the description. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

A welding clamping tool for a chip-level circuit board is shown in figure 12, wherein the circuit board is L-shaped, the circuit board comprises a carrier plate 1, a base plate 2 and a plurality of devices 3 which are sequentially arranged from bottom to top, the projection profiles of the carrier plate 1 and the base plate 2 are the same, and the devices 3 comprise a high-power switch, a capacitor, a power supply and the like.

As shown in fig. 1, the welding clamping tool includes: a clamping assembly 10 and a hold-down assembly 20.

Specifically, as shown in fig. 2 and 3, the clamping assembly 10 includes a base 11, and two holding grooves 111 are formed in the top surface of the base 11 and are rotationally symmetric, so as to save space, so that a set of clamping tool can simultaneously weld two circuit boards, and the holding grooves 111 are in an L-shaped structure and used for placing the circuit boards; two adjacent long side walls of the accommodating groove 111 are respectively provided with a first slider 12 and a second slider 13, which are used for contacting with two adjacent outer walls of the L-shaped circuit board and pressing the circuit board from the side.

Specifically, as shown in fig. 1, the pressing component 20 is hinged above one end of the base 11, and the other end of the base 11 is provided with a buckle seat 14;

specifically, as shown in fig. 5, the pressing assembly 20 includes a supporting plate 21, a pressing plate 22 and a sliding component 30, the supporting plate 21 and the pressing plate 22 are hinged to the base 11 along the same axis, the sliding component 30 penetrates through the supporting plate 21 along the vertical direction, the pressing plate 22 is located above the supporting plate 21 and the sliding component 30, and a first elastic element 23 is arranged between the sliding component 30 and the pressing plate 22;

specifically, as shown in fig. 4 and 5, a plurality of first push rods 31 and a plurality of second push rods 32 are respectively disposed at positions corresponding to the accommodating grooves 111 at the bottom of the sliding member 30, and the first push rods 31 and the second push rods 32 are movably disposed along a direction perpendicular to the bottom surface of the sliding member 30;

specifically, as shown in fig. 11, when the bottom surface of the end of the supporting plate 21 away from the hinge shaft contacts the top surface of the snap seat 14, the supporting plate 21 is parallel to the base 11, and the first lift pin 31 and the second lift pin 32 are perpendicular to the base 11 but do not contact the substrate 2 and the device 3.

Specifically, as shown in fig. 1 and 11, a rotatable buckle 24 is disposed at one end of the pressing plate 22 away from the hinge shaft, a bayonet 141 is disposed on the buckle seat 14, when the bottom of the buckle 24 is connected to the bayonet 141, the pressing plate 22 is parallel to the base 11, at this time, the first push rod 31 is pressed against the substrate 2, and the second push rod 32 is pressed against the device 3.

Preferably, as shown in fig. 5 and fig. 6, the sliding member 30 includes a guide plate 33 and a cover plate 34, the cover plate 34 is disposed above the guide plate 33, the first lift pin 31 and the second lift pin 32 vertically penetrate the guide plate 33, and a second elastic element 35 is disposed between a bottom surface of the cover plate 34 and top surfaces of the first lift pin 31 and the second lift pin 32 for directly providing pressure to the first lift pin 31 and the second lift pin 32 so that the first lift pin 31 and the second lift pin 32 press the substrate 2 and the device 3.

Preferably, as shown in fig. 5, the cover plate 34 is provided with flanges 341 at four corners, the top surface of the support plate 21 is provided with a limit groove 211 corresponding to the flange 341, and the flanges 341 and the limit groove 211 are matched to limit the distance between the cover plate 34 and the base 11, so as to control the distance between the sliding member 30 and the base 11.

Preferably, as shown in fig. 8 and 9, a third elastic element 26 is disposed between the limiting groove 211 and the flange 341, and is used for controlling the distance between the first push rod 31 and the circuit board and the distance between the second push rod 32 and the circuit board. When the first elastic element 23 applies pressure to the sliding component 30, the third elastic element 26 expands the space between the cover plate 34 and the support plate 21, and the state is shown in fig. 9, and there is a space between the bottom surface of the flange 341 and the top surface of the limiting groove 211, which is the movable stroke length of the sliding component 30 relative to the support plate 21. The distance is also equal to the distance between the first lift pin 31 and the second lift pin 32 and the circuit board when the support plate 21 just contacts the fastener seat 14. The first and second lift pins 31 and 32 are also prevented by this interval from contacting the circuit board during rotation of the support plate 21, thereby avoiding shifting the position of each device 3 during pressing.

Preferably, as shown in fig. 5 and 6, the cover plate 34 is divided into two parts corresponding to the receiving groove 111, each top part is correspondingly provided with the first elastic elements 23 with the same number, each part independently presses one circuit board, and the circuit boards are prevented from being unevenly stressed due to mutual influence when the same cover plate 34 presses two circuit boards.

Preferably, as shown in fig. 1, 5 and 6, the sliding member 30 is provided with a guide bar 36, the guide bar 36 vertically penetrates the support plate 21, and more specifically, the guide bar 36 is provided on the guide plate 33, because the cover plate 34 is provided in two pieces, the guiding performance is relatively poor, and the guide bar 36 is provided to improve the moving accuracy of the sliding member 30 relative to the support plate 21.

Preferably, as shown in fig. 1 and 11, a limiting pulling plate 25 is arranged between the pressing plate 22 and the supporting plate 21, one end of the limiting pulling plate 25 is rotatably arranged on the pressing plate 22, the other end of the limiting pulling plate 25 is provided with a strip-shaped hole and is connected to the supporting plate 21 through the strip-shaped hole, the supporting plate 21 is provided with a screw in a penetrating manner, the screw passes through the strip-shaped hole of the limiting pulling plate 25, the limiting pulling plate 25 is used for limiting the maximum included angle between the pressing plate 22 and the supporting plate 21, and when the angle between the pressing plate 22 and the supporting plate 21 changes, the supporting plate 21 moves along the strip-shaped hole of the limiting pulling plate 25.

Preferably, as shown in fig. 1, fig. 2, fig. 5 and fig. 10, a clamping groove 212 is formed at one end of the supporting plate 21 away from the hinge shaft, a protruding block 142 is disposed on the top surface of the buckle seat 14 corresponding to the clamping groove 212, when the supporting plate 21 is parallel to the base 11, the protruding block 142 is matched with the clamping groove 212, so that the matching position precision between the supporting plate 21 and the base 11 is improved through the matching between the protruding block 142 and the clamping groove 212, the connection stability between the pressing assembly 20 and the clamping assembly 10 is increased, the position deviation of each component of the circuit board during pressing is prevented, and the assembly and welding position precision of the components of the circuit board is improved.

More specifically, as shown in fig. 2 to 4, the first sliding block 12 and the second sliding block 13 are controlled by the eccentric wheel 15 to move so as to press or release the side surface of the circuit board, and the base 11 is provided with a stop block 16 on both sides corresponding to the rotating handle of the eccentric wheel 15 so as to facilitate the rapid operation of the eccentric wheel 15 and achieve precise position control.

The first elastic element 23, the second elastic element 35 and the third elastic element 26 are all springs.

The specific implementation mode is as follows: placing a carrier plate 1 of a circuit board in the accommodating groove 111, then placing a soldering lug, and then placing a substrate 2 above the soldering lug; the rotating eccentric wheel 15 utilizes the first slide block 12 and the second slide block 13 to press the side surfaces of the carrier plate 1 and the substrate 2; a bonding pad is placed over the substrate 2, and then various devices 3 are placed over the bonding pad. The pressing member 20 is rotated so that the support plate 21 is first brought into contact with the holder 14 as shown in fig. 10. At this time, the support plate 21 is parallel to the base 11, the first elastic element 23 has not yet applied pressure to the slide member 30, the third elastic element 26 is in an extended state, and the first lift pin 31 and the second lift pin 32 have a gap with the device 3 and the substrate 2. Then, the pressing plate 22 is rotated continuously to make the pressing plate 22 parallel to the base 11, and as shown in fig. 11, the lower section of the buckle 24 is clamped into the bayonet 141, so that the pressing assembly 20 is buckled with the clamping assembly 10. In the process of making the pressing plate 22 and the base 11 parallel to each other, the pressing plate 22 gradually applies pressure to the sliding member 30 through the first elastic element 23, so that the sliding member 30 moves toward the base plate 11 as a whole until the bottom surface of the flange 341 contacts the top surface of the limiting groove 211. In the process, the first push rod 31 firstly presses the substrate 2, then the second push rod 32 presses the device 3, and the first push rod 31 and the second push rod 32 are both adapted to different extending lengths through the contraction of the second elastic element 35, and meanwhile, the second elastic element 35 is used for applying pressure. The first push bar 31 and the second push bar 32 are both pressed perpendicularly to the direction of the base plate 11 to prevent the device 3 from being moved. Since the substrate 2 and the carrier 1 are already fixed by the clamping assembly 10, the substrate 2 and the carrier 1 do not move when the first lift pins 31 contact the substrate 2. The first lift pins 31 are designed to have the same connection structure as the second lift pins 32, so as to prevent the first lift pins 31 from scratching the surface of the substrate 2. After the clamping tool clamps and fixes all parts of the circuit board, the parts are heated to a preset temperature together, so that the soldering lugs are melted, and welding connection is realized.

The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.

Claims

1. A welding clamping tool for a chip-level circuit board is provided, the circuit board is L-shaped, and comprises a carrier plate (1), a substrate (2) and a plurality of devices (3) which are sequentially arranged from bottom to top; its characterized in that, welding centre gripping frock includes: a clamping assembly (10) and a pressing assembly (20);

the clamping assembly (10) comprises a base (11), two accommodating grooves (111) which are rotationally symmetrical are formed in the top surface of the base (11), and the accommodating grooves (111) are of an L-shaped structure and used for accommodating a circuit board; two adjacent long side walls of the accommodating groove (111) are respectively provided with a first sliding block (12) and a second sliding block (13) which are used for contacting with two adjacent outer walls of the L-shaped circuit board and pressing the circuit board from the side surface;

the pressing component (20) is hinged above one end of the base (11), and the other end of the base (11) is provided with a buckle seat (14);

the pressing assembly (20) comprises a supporting plate (21), a pressing plate (22) and a sliding part (30), the supporting plate (21) and the pressing plate (22) are hinged to the base (11) along the same axis, the sliding part (30) penetrates through the supporting plate (21) along the vertical direction, the pressing plate (22) is located above the supporting plate (21) and the sliding part (30), and a first elastic element (23) is arranged between the sliding part (30) and the pressing plate (22);

a plurality of first ejector rods (31) and a plurality of second ejector rods (32) are arranged at the bottom of the sliding part (30) corresponding to the positions of the accommodating grooves (111), and the first ejector rods (31) and the second ejector rods (32) are arranged in a moving mode along the direction perpendicular to the bottom surface of the sliding part (30);

when the bottom surface of one end of the support plate (21), which is far away from the hinge shaft, is contacted with the top surface of the buckle seat (14), the support plate (21) is parallel to the base (11), and at the moment, the first ejector rod (31) and the second ejector rod (32) are both vertical to the base (11) but are not contacted with the substrate (2) and the device (3);

a rotatable buckle (24) is arranged at one end, away from the hinge shaft, of the pressing plate (22), a bayonet (141) is formed in the buckle seat (14), when the bottom of the buckle (24) is connected to the bayonet (141), the pressing plate (22) is parallel to the base (11), the first ejector rod (31) is pressed on the substrate (2), and the second ejector rod (32) is pressed on the device (3);

the sliding component (30) comprises a guide plate (33) and a cover plate (34), the cover plate (34) is arranged above the guide plate (33), the first ejector rod (31) and the second ejector rod (32) vertically penetrate through the guide plate (33), and second elastic elements (35) are arranged between the bottom surface of the cover plate (34) and the top surfaces of the first ejector rod (31) and the second ejector rod (32).

2. The welding and clamping tool for the chip-scale circuit board as recited in claim 1, wherein the cover plate (34) is provided with flanges (341) at four corners, and the top surface of the support plate (21) is provided with a limit groove (211) corresponding to the flanges (341).

3. The welding and clamping tool for the chip-scale circuit board as recited in claim 2, wherein a third elastic element (26) is arranged between the limiting groove (211) and the flange (341).

4. The welding and clamping tool for the chip-scale circuit board according to claim 1, wherein the cover plate (34) is divided into two parts corresponding to the accommodating groove (111), the first elastic elements (23) with the same number are correspondingly arranged on the top of each part, and each part is independently pressed to form a circuit board.

5. The soldering fixture for chip scale circuit board according to claim 1, wherein the sliding member (30) is provided with a guide rod (36), and the guide rod (36) vertically penetrates the support plate (21).

6. The welding and clamping tool for the chip-scale circuit board according to claim 1, wherein a limiting pulling plate (25) is arranged between the pressing plate (22) and the supporting plate (21), one end of the limiting pulling plate (25) is rotatably arranged on the pressing plate (22), and the other end of the limiting pulling plate is provided with a strip-shaped hole and is connected to the supporting plate (21) through the strip-shaped hole.

7. The welding and clamping tool for the chip-scale circuit board according to claim 1, wherein a clamping groove (212) is formed in one end, away from the hinge shaft, of the supporting plate (21), a protruding block (142) is arranged on the top surface of the clamping seat (14) corresponding to the clamping groove (212), and when the supporting plate (21) is parallel to the base (11), the protruding block (142) is matched with the clamping groove (212).

8. The welding and clamping tool for the chip-scale circuit board according to claim 1, wherein the first sliding block (12) and the second sliding block (13) are controlled to move through an eccentric wheel (15) so as to press or loosen the side face of the circuit board, and two sides of the base (11) corresponding to a rotating handle of the eccentric wheel (15) are provided with limiting blocks (16).