TWI469840B - A substrate processing apparatus and a substrate processing method - Google Patents

Description

Substrate processing apparatus and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for irradiating laser light with an edge of the film surface of a substrate to be processed on a film surface of the substrate, and processing the laser beam.

The present application claims priority to Japanese Patent Application No. 2008-291064, the entire disclosure of which is hereby incorporated by reference.

Heretofore, there has been known a substrate processing apparatus which is provided with a laser irradiation apparatus that irradiates laser light to a film surface having a substrate and a substrate to be processed provided on a film surface of the substrate; a pedestal that supports only the peripheral portion of the substrate to be processed, and a holding mechanism that supports the film surface of the substrate to be processed placed on the pedestal to hold the substrate to be processed in a flat state, and has a plurality of holding mechanisms A substrate supporting portion having a pin shape (refer to Japanese Laid-Open Patent Publication No. 2001-111078 and JP-A-2002-280578).

However, when the film surface is supported by the substrate supporting portion of the pin shape as in the prior art, there is a possibility that the film surface is adversely affected by the pressing force of the substrate supporting portion. Further, it is difficult to hold the enlarged substrate to be processed on one side, and the substrate to be processed is deflected, and the processing accuracy of the film surface is deteriorated. In particular, when the edge portion of the film surface is processed, the substrate to be processed is supported only by the inner film surface, and the adverse effect on the film surface is further increased.

The present invention has been made in view of the above points, and an object thereof is to provide a substrate processing apparatus and a substrate processing method using the substrate processing apparatus, which can reliably prevent a substrate to be processed without adversely affecting a film surface The deflection increases the processing precision of the film surface.

In the substrate processing apparatus of the present invention, the edge of the film surface of the substrate to be processed including the substrate and the film surface of the substrate is processed, and the film surface is placed on the other side of the substrate. An adsorption holding portion that adsorbs and holds the substrate to be processed from one side; a laser irradiation device that irradiates the laser beam; and a laser moving portion that moves the laser irradiation device; and irradiates the laser beam from the laser irradiation device While the laser irradiation device is moved, the edge portion of the film surface in the substrate to be processed held by the adsorption holding portion is processed.

Further, the substrate processing apparatus of the present invention may further include: locating and positioning one of the pair of substrates to be processed; and the adsorption holding portion sucking and holding the substrate to be processed sandwiched by the positioning portion from one side; After the substrate to be processed is held by the adsorption holding portion, the substrate to be processed is released.

Further, the substrate processing apparatus of the present invention may further include a rotation driving unit that rotates the substrate to be processed by rotating the adsorption holding unit, and the laser beam is irradiated from the laser irradiation device while the laser beam is irradiated from the laser irradiation device. The irradiation device moves in a specific direction to process one edge of the substrate to be processed, and then, after the substrate is rotated by the rotation driving unit, the laser beam is irradiated from the laser irradiation device while the laser beam is irradiated The radiation irradiation device moves in the specific direction described above, and processes the other edge portion of the substrate to be processed.

In the substrate processing apparatus as described above, the lower end of the laser irradiation device may be located closer to the side than the end portion of the adsorption holding portion.

In the substrate processing apparatus of the present invention, the adsorption holding unit may include an abutting portion that abuts against the substrate to be processed, and a plurality of adsorption portions that are provided in the surface of the abutting portion, and the abutting portion may include a metal plate and a resin sheet disposed under the metal plate.

In the substrate processing method of the present invention, the edge portion of the film surface including the substrate and the substrate to be processed on the film surface of the substrate is processed, and the film holding surface is located on the substrate by the adsorption holding portion. a step of adsorbing and holding the substrate to be processed from one side in a state of one side; a step of irradiating the laser light from the laser irradiation device; and a step of moving the laser irradiation device in a horizontal direction by the laser moving portion; Further, while irradiating the laser light from the laser irradiation device, the laser irradiation device is moved to process the edge portion of the film surface in the substrate to be processed held by the adsorption holding portion.

In the substrate processing method of the present invention, the substrate to be processed may be adsorbed and held from one side after being sandwiched by the positioning portion, and then the substrate to be processed may be released by the positioning portion.

In the substrate processing method of the present invention, one of the edge portions of the substrate to be processed may be processed by irradiating the laser beam from the laser irradiation device while moving the laser beam in a specific direction. The rotation drive unit rotates the substrate to be processed, and then irradiates the laser light from the laser irradiation device while moving the laser irradiation device in the specific direction to process the other edge portion of the substrate to be processed.

According to the invention, in the state in which the substrate is positioned above the film surface, the substrate is adsorbed and held from above by the adsorption holding portion, and the edge portion of the film surface is treated by the laser light irradiated from the laser irradiation device, so that the film is not applied. The surface adversely affects the deflection of the substrate to be processed, and the processing accuracy of the film surface can be improved.

Hereinafter, embodiments of the substrate processing apparatus and the substrate processing method of the present invention will be described with reference to the drawings. Here, Fig. 1 to Fig. 11 are views showing an embodiment of the present invention.

The substrate processing apparatus is for processing the edge portions 61a and 61b (see FIG. 1) of the film surface 61 in the substrate 60 to be processed having the glass substrate (substrate) 62 and the film surface 61 provided on the glass substrate 62. Further, as the substrate 60 to be processed as described above, for example, a substrate for a thin film solar cell can be cited.

As shown in FIG. 1 and FIG. 3 (a) and (b), the substrate processing apparatus includes a substrate 60 that is held and held from above (one side) in a state in which the glass substrate 62 is located above (on one side of) the film surface 61. The adsorption holding unit 10 (see FIG. 1); the laser irradiation device 20 that irradiates the laser light L (see FIG. 1); and the laser moving unit 22 that moves the laser irradiation device 20 in the horizontal direction (refer to FIG. 3(a) ( b)). 3(a) is a plan view of the substrate processing apparatus of the present embodiment as seen from above, and FIG. 3(b) is a side view of the substrate processing apparatus as seen from the side.

Here, the substrate processing apparatus moves the laser irradiation device 20 in a specific direction while irradiating the laser beam L from the laser irradiation device 20 to process the substrate 60 to be processed held by the adsorption holding portion 10. The edge portions 61a and 61b of the film surface 61 are configured as described above (see FIGS. 6(a) and (b) and FIG. 7).

Further, Fig. 6(a) is a plan view showing the upper side of the range of the edge portions 61a and 61b to be processed by the substrate processing apparatus of the present embodiment, and Fig. 6(b) is a side view showing the movement of the laser irradiation device 20. In addition, Fig. 7 is an upper plan view showing an enlarged state of the edge portions 61a and 61b of the film surface 61 by the substrate processing apparatus of the present embodiment. Further, the symbol S in Fig. 7 indicates the laser spot of the laser light L irradiated from the edge portions 61a and 61b of the film surface 61 from the laser irradiation device 20.

Further, the adsorption holding unit 10 is configured to suck and hold the substrate 60 to be processed which is sandwiched by the positioning portions 5s and 5l (described later) from above (see FIGS. 4(a) and 4(b)). The positioning portions 5s and 5l are configured to hold the substrate 60 to be processed by the adsorption holding unit 10 and then release the substrate 60 to be processed.

Further, as shown in FIG. 1, a rotation driving unit 15 that rotates the substrate to be processed 60 by rotating the adsorption holding unit 10 is provided on the upper portion of the adsorption holding unit 10. In the present embodiment, the rotation driving unit 15 is provided on the upper portion of the adsorption holding unit 10. However, the present invention is not limited thereto. For example, the laser irradiation unit 20 and the laser moving unit 22 may be used. The state of rotation with respect to the adsorption holding portion 10.

Further, as shown in FIG. 1 and FIG. 3(b), the lower end of the laser irradiation device 20 is located above the upper end of the adsorption holding portion 10 (on the side closer to the end portion), and is configured to be even in the adsorption holding portion. When the rotation driving unit 15 rotates, the adsorption holding unit 10 does not collide with the laser irradiation device 20.

Further, as shown in FIG. 2( a ), the adsorption holding unit 10 has an abutting portion 11 that abuts against the substrate 60 to be processed, and a plurality of adsorption portions 12 that are provided in the surface of the abutting portion 11 . Further, in the present embodiment, the abutting portion 11 has a metal plate 14 and a resin sheet 13 provided on the lower surface of the metal plate 14.

Further, as shown in FIGS. 3(a) and 3(b), one of the transport unit 1 for transporting the substrate to be processed 60 is provided on the upstream side of the laser irradiation device 20 and the laser moving unit 22. Further, in the vicinity of the transport unit 1, a pair of positioning portions 51 that are positioned to sandwich the substrate 60 in the transport direction and that are positioned to sandwich the substrate 60 in the direction orthogonal to the transport direction are provided. 5s.

Next, the effect of the present embodiment thus constituted will be described. Further, in Figs. 8(a) to 8(e) used for the description, which will be described later, only one laser irradiation device 20 and the laser moving portion 22 are shown for simplification of the drawing, but this embodiment is as shown in Fig. 3 (a). One of the pair of laser irradiation devices 20 and the laser moving portion 22.

First, the substrate to be processed 60 to be processed is transported by the transport unit 1 (see FIG. 3(a) and (b)). Then, when the substrate to be processed 60 is transported to a specific position, the transport unit 1 is stopped, whereby the transport of the substrate to be processed 60 is stopped. At this time, the glass substrate 62 is placed above the film surface 61, and the conveyance unit 1 is in contact with the portion of the film surface 61 from which the laser light L to be described later is removed.

Then, the pair of positioning portions 51 l are positioned to sandwich the substrate 60 to be processed in the transport direction, and the pair of positioning portions 5 s are positioned to sandwich the substrate 60 to be aligned in the direction orthogonal to the transport direction (see the figure). 3(a)(b) and Figure 4(a)).

Then, the substrate to be processed 60 sandwiched by the positioning portions 5s and 5l is sucked and held from above by the adsorption holding portion 10 (see FIGS. 4(a) and 4(b)). Then, after the substrate 60 to be processed is held by the adsorption holding portion 10, the substrate 60 to be processed is released from the positioning by the positioning portions 5s, 51. Therefore, when the substrate to be processed 60 is adsorbed and held by the adsorption holding portion 10, the offset of the substrate to be processed 60 against the adsorption holding portion 10 can be prevented.

More specifically, first, the positioning of the substrate 60 to be processed is performed by the positioning portions 5s and 5l (see FIG. 5(a)), and then, after the substrate 60 to be processed is released (see FIG. 5(b)), When the substrate to be processed 60 is sucked and held upward (see FIG. 5( c )), when the substrate 60 to be processed is adsorbed and held by the adsorption holding unit 10 , there is a possibility that the substrate 60 to be processed is displaced from the adsorption holding unit 10 .

In this regard, according to the present embodiment, after the substrate 60 to be processed is held by the adsorption holding unit 10, the substrate 60 to be processed is released from the positioning by the positioning portions 5s and 51 (refer to FIG. 4(a)(b). Therefore, when the substrate to be processed 60 is adsorbed and held by the adsorption holding portion 10, the substrate to be processed 60 can be prevented from being displaced from the adsorption holding portion 10, and the substrate to be processed 60 can be positioned at the correct position with respect to the adsorption holding portion 10.

When the substrate to be processed 60 is held by the adsorption holding unit 10 as described above, the substrate 60 to be processed is transferred to the laser processing position by the adsorption holding unit 10 (see FIG. 3(b)).

Next, the laser irradiation unit 22 is moved in the horizontal direction by the laser moving unit 22 (see FIGS. 6(a) and (b) and FIG. 8(a) and (b). Then, at this time, the laser light L is irradiated from the laser irradiation device 20. By irradiating the laser light L from the laser irradiation device 20, the laser irradiation device 20 is moved in the X direction (specific direction) to process one edge portion 61a of the film surface 61 of the substrate 60 to be processed.

In this embodiment, the movement of the laser irradiation device 20 moves in the X direction and then moves in the positive direction of the Y direction (inside the substrate to be processed 60 orthogonal to the X direction), and then changes. It moves in the direction opposite to the direction in the X direction (see Fig. 7 and Fig. 8(a)(b)). Further, by appropriately repeating such movement, one edge portion 61a of the substrate 60 to be processed can be processed in a desired range.

As described above, when one edge portion 61a of the substrate 60 to be processed is processed, the substrate 60 to be processed is rotated by the rotation driving unit 15 (see FIG. 8(c)), and then the laser beam is irradiated from the laser irradiation device 20 L, while the laser irradiation device 20 is moved in the X direction, the other edge portion 61b of the substrate 60 to be processed is processed (see Fig. 8 (d) (e)). Therefore, the moving distance of the laser irradiation device 20 can be shortened as much as possible, and the processing efficiency can be improved.

More specifically, when a device that does not rotate the substrate 60 to be processed by the rotation driving portion 15 is used, as shown by arrows A ₁ to A ₈ in FIG. ₉ , the laser irradiation device 20 must be moved, and the laser irradiation device 20 The moving distance becomes longer and the processing efficiency becomes worse.

On the other hand, according to the present embodiment, since the substrate to be processed 60 is rotated by the rotation driving unit 15, the moving distance of the laser irradiation device 20 can be shortened as much as possible, and the processing efficiency can be improved (refer to Fig. 8(a)-(( e)).

According to the present embodiment, the glass substrate 62 of the substrate to be processed 60 is sucked and held from above by the adsorption holding portion 10 in a state where the glass substrate 62 is positioned above the film surface 61. Therefore, the film surface 61 located below does not need to be borrowed. The substrate support portion of the pin shape is pressed by (as in the prior art). According to the present embodiment, since the glass substrate 62 can be held by the adsorption holding portion 10 in a wide range other than the portion through which the laser light L is transmitted, the deflection of the substrate 60 to be processed can be surely prevented.

As described above, according to the present embodiment, the film surface 61 is not adversely affected, and the deflection of the substrate 60 to be processed can be surely prevented, and the processing accuracy of the film surface 61 can be improved.

In other words, according to the prior art, in order to prevent (largening) the deflection of the substrate 60 to be processed, it is necessary to support the film surface 61 by the plurality of pin-shaped substrate supporting portions, so that the possibility of adversely affecting the film surface 61 becomes high. On the other hand, in order to prevent the film surface 61 from being adversely affected, only the portion (small range) of the film surface 61 removed by the laser light L is supported, and the substrate to be processed 60 is largely deflected.

On the other hand, in the state in which the glass substrate 62 is positioned above the film surface 61, the glass substrate 62 of the substrate 60 to be processed is adsorbed and held from above, and the glass substrate 62 can be held by the adsorption holding portion 10. The portion other than the portion through which the light L is transmitted (see FIG. 8(b) and (e)) does not adversely affect the film surface 61, and the deflection of the substrate 60 to be processed can be surely prevented.

In the present embodiment, the lower end of the laser irradiation device 20 is located above the upper end of the adsorption holding unit 10 (see FIGS. 1 and 3(b)), even when the adsorption holding portion 10 is rotated. When the driving unit 15 rotates, the adsorption holding unit 10 does not collide with the laser irradiation device 20, so that the horizontal direction of the adsorption holding unit 10 can be expanded as much as possible, and the deflection of the substrate 60 to be processed can be more reliably prevented. .

Further, since the abutting portion 11 has the metal plate 14 and the resin sheet 13 provided under the metal plate 14 (see FIG. 2(a)), the adsorption holding portion 10 itself can be prevented by the metal plate 14 having high rigidity. The resin sheet 13 is prevented from being scratched by the resin sheet 13, or is displaced when the substrate 60 is rotated.

More specifically, as shown in FIG. 2(b), when the contact portion 11 does not have the metal plate 14 and only the resin member 13' is included, the resin sheet 13 can prevent the substrate to be processed 60 from being scratched or The processing substrate 60 is displaced at the time of rotation, but the adsorption holding portion 10 itself is also likely to be deflected.

On the other hand, in the present embodiment, as shown in FIG. 2(a), the abutting portion 11 has the metal plate 14, and also has the resin sheet 13 provided under the metal plate 14, so that the metal is made of a relatively high rigidity. The plate 14 can prevent the adsorption holding portion 10 from flexing itself, and the resin sheet 13 can prevent the substrate to be processed 60 from being scratched or the substrate 60 to be processed from being displaced during rotation.

As described above, according to the present embodiment, the film surface 61 can be prevented from being adversely affected, and the deflection of the substrate 60 can be surely prevented, and the processing accuracy of the film surface 61 can be improved, and various effects as described above can be obtained. .

However, in the present embodiment, the state in which the portion of the glass substrate 62 that transmits the laser light L is held by the adsorption holding portion 10 is used. However, the present invention is not limited thereto, and at least the film of the holding portion 10 may be adsorbed. The portion corresponding to the edge portion of the surface 61 includes a member that transmits the laser light L, and the adsorption holding portion 10 holds the entire surface of the glass substrate 62. At this time, the deflection of the substrate 60 to be processed can be more reliably prevented.

In addition, although the glass substrate 62 is located on the upper side and the glass substrate 62 is adsorbed and held from the upper side by the adsorption holding unit 10, the present invention is not limited thereto, and as shown in FIG. 10(a)(b). As shown in the figure, the glass substrate 62 is located below the film surface 61, and the glass substrate 62 is adsorbed and held from the lower side by the adsorption holding portion 10.

According to this configuration, it is difficult to transport the substrate 60 by wiring or the like. Therefore, for example, the laser irradiation device 20 is disposed between the pair of transport units 1, and the laser irradiation device 20 can move between the pair of transport units 1. Therefore, the edge portion of the film surface 61 can also be processed (see FIGS. 10(a)(b) and 11). Then, at this time, the substrate 60 to be processed is lifted upward from the transport unit 1, and the substrate 60 that has been lifted upward is appropriately rotated by the rotary drive unit 15.

1. . . Transport department

10. . . Adsorption holding unit

11. . . Abutment

12. . . Adsorption section

13. . . Resin sheet

13'. . . Resin member

14. . . Metal plate

15. . . Rotary drive

20. . . Laser irradiation device

twenty two. . . Laser moving department

5l, 5s. . . Positioning department

60. . . Substrate to be processed

61. . . Membrane surface

61a, 61b. . . Edge

62. . . Substrate

L. . . laser

1 is a side view showing an adsorption holding portion, a rotation driving portion, and a laser irradiation device of a substrate processing apparatus according to an embodiment of the present invention;

2(a) and 2(b) are side cross-sectional views showing the adsorption holding portion and the rotation driving portion of the substrate processing apparatus according to the embodiment of the present invention;

3(a) and 3(b) are a plan view of the substrate processing apparatus according to the embodiment of the present invention as seen from above, and a side view seen from the side;

4(a) and 4(b) are side views showing the timing at which the substrate to be processed is positioned by the positioning portion and the time at which the adsorption holding portion is suction-held in the substrate processing apparatus according to the embodiment of the present invention;

5(a) to 5(c) are side views showing the timing at which the substrate to be processed is positioned by the positioning portion and the time at which adsorption is held by the adsorption holding portion in the substrate processing apparatus according to another example of the embodiment of the present invention. ;

6(a) and 6(b) are plan views showing the upper side of the edge portion of the film surface of the substrate to be processed which are processed by the substrate processing apparatus according to the embodiment of the present invention, and a side view showing the movement of the laser irradiation device;

Figure 7 is a plan view showing an enlarged top view of the edge portion of the film surface of the substrate to be processed by the substrate processing apparatus according to the embodiment of the present invention;

8(a) to 8(e) are plan views showing a state in which the edge portion of the film surface of the substrate to be processed is sequentially processed by the substrate processing apparatus according to the embodiment of the present invention;

FIG. 9 is a plan view showing a state in which the edge portion of the film surface of the substrate to be processed is sequentially processed by the substrate processing apparatus according to another example of the embodiment of the present invention;

10(a) and 10(b) are side views of the substrate processing apparatus according to still another example of the embodiment of the present invention as seen from the side; and

Fig. 11 is a plan view of the substrate processing apparatus according to still another example of the embodiment of the present invention as seen from above.

10. . . Adsorption holding unit

15. . . Rotary drive

20. . . Laser irradiation device

60. . . Substrate to be processed

61. . . Membrane surface

61a, 61b. . . Edge

62. . . Substrate

L. . . laser

Claims (11)

A substrate processing apparatus for processing an edge portion of the film surface including a substrate and a substrate to be processed on a film surface of the substrate, wherein the film processing device includes a transport portion that is located on a lower side of the substrate a state in which the substrate to be processed is transported to the positioning portion, and a pair of positioning portions sandwich and position the substrate to be processed conveyed by the transport portion while the film surface is located below the substrate; a holding portion that sucks and holds the substrate to be processed positioned by the pair of positioning portions from a top side in a state where the film surface is located on a lower side of the substrate; a laser irradiation device that irradiates laser light; and a laser beam a portion that moves the laser irradiation device and that causes the laser beam to be irradiated from the laser irradiation device through the substrate to move the laser irradiation device while passing through the substrate The illuminating treatment is performed on the edge portion of the film surface in the substrate to be processed held by the adsorption holding portion, and the positioning portion is held by the adsorption holding portion After the substrate, releasing the substrate to be processed. The substrate processing apparatus of claim 1, wherein the transport portion abuts only a portion of the film surface that is removed by laser light. The substrate processing apparatus according to claim 1, further comprising a rotation driving unit that rotates the substrate to be processed by rotating the adsorption holding unit. The substrate processing apparatus of claim 3, wherein the laser light is irradiated from the foregoing The projecting device irradiates the laser beam and moves the laser irradiation device in a specific direction to process one edge of the substrate to be processed, and then rotates the substrate to be processed by the rotation driving portion The radiation irradiation device irradiates the laser light, and moves the laser irradiation device in the specific direction to process the other edge portion of the substrate to be processed. The substrate processing apparatus of claim 4, wherein the lower end of the laser irradiation device is located closer to the upper side than the end of the adsorption holding portion. The substrate processing apparatus according to claim 1, wherein the adsorption holding unit includes: an abutting portion that abuts against the substrate to be processed; and a plurality of adsorption portions provided in a surface of the abutting portion; the abutting portion includes a metal plate And a resin sheet disposed under the metal plate. The substrate processing apparatus of claim 1, wherein the adsorption holding portion holds the entire portion other than the portion through which the laser light is transmitted through the substrate. A substrate processing method for processing an edge portion of the film surface including a substrate and a substrate to be processed on a film surface of the substrate, wherein the film portion is disposed under the substrate by the transport portion a step of transporting the substrate to be processed in a side state, and a step of sandwiching and positioning the substrate to be processed carried by the transport portion in a state where the film surface is located on a lower side of the substrate by a pair of positioning portions a step of adsorbing and holding the substrate to be processed positioned by the pair of positioning portions from the upper side in a state where the film surface is located on a lower side of the substrate by the adsorption holding portion; and irradiating the laser light from the laser irradiation device Step; and a step of moving the laser irradiation device in a horizontal direction by a laser moving portion; and moving the laser irradiation device while irradiating the laser beam from the laser irradiation device through the substrate And the edge portion of the film surface in the substrate to be processed held by the adsorption holding portion by laser light irradiation on the substrate; and the positioning portion releases the substrate after the substrate is processed by the adsorption holding portion The substrate to be processed. The substrate processing method according to claim 8, wherein the laser irradiation device irradiates the laser light from the laser irradiation device while moving the laser irradiation device in a specific direction to process one edge of the substrate to be processed, and then, After the substrate to be processed is rotated by the rotation driving unit, the laser beam is irradiated from the laser irradiation device, and the laser irradiation device is moved along the specific direction to process the other edge of the substrate to be processed. . The substrate processing method according to claim 8, wherein the transport portion abuts only a portion of the film surface that is removed by laser light. The substrate processing method according to claim 8, wherein the adsorption holding portion holds the entire portion other than the portion through which the laser light is transmitted through the substrate while the edge portion of the film surface is processed by the laser light of the substrate.