TWI705518B - A substrate processing apparatus, and a substrate processing method - Google Patents
A substrate processing apparatus, and a substrate processing method Download PDFInfo
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
以高精度調整載置於載置台之基板的位置。 The position of the substrate placed on the stage is adjusted with high precision.
基板處理裝置(100),具備:辨明部(24),辨明基板(10)的大小;及位置辨明部(28),基於基板(10)的大小,辨明基板(10)的中心點;及旋轉平台(31),載置基板(10);及一組的夾持部(20’),將基板(10)從平面方向予以夾持;夾持部(20’),令位置辨明部(28)辨明出的基板(10)的中心點(O1),移動至旋轉平台(31)的中心點(O3)上。 The substrate processing apparatus (100) is provided with: a discerning part (24) for discerning the size of the substrate (10); and a position discerning part (28) for discerning the center point of the substrate (10) based on the size of the substrate (10); and rotation The platform (31), where the substrate (10) is placed; and a set of clamping parts (20'), which clamp the substrate (10) from the plane direction; the clamping part (20'), the position identification part (28 ) The identified center point (O 1 ) of the substrate (10) is moved to the center point (O 3 ) of the rotating platform (31).
Description
本發明有關基板處理裝置、及基板處理方法。 The present invention relates to a substrate processing apparatus and a substrate processing method.
近年來,要求IC卡、行動電話等電子機器的薄型化、小型化、輕量化等。為了滿足這些要求,針對裝入的半導體晶片也必須使用薄型的半導體晶片。因此,作為半導體晶片的基礎之晶圓基板的厚度(膜厚)雖現狀為125μm~150μm,但據稱次世代的晶片用必須做成25μm~50μm。是故,為了得到上述膜厚的晶圓基板,晶圓基板的薄板化工程係不可或缺。 In recent years, there has been a demand for thinner, smaller, and lighter electronic devices such as IC cards and mobile phones. In order to meet these requirements, thin semiconductor wafers must also be used for the mounted semiconductor wafers. Therefore, although the thickness (film thickness) of the wafer substrate, which is the basis of semiconductor wafers, is currently 125 μm to 150 μm, it is said that the next-generation wafer must be made to 25 μm to 50 μm. Therefore, in order to obtain the wafer substrate with the above-mentioned film thickness, the thinning process of the wafer substrate is indispensable.
晶圓基板,會因薄板化而強度降低,故為了防止薄板化後的晶圓基板的破損,製造程序中,係藉由接著層將支撐板貼合至晶圓基板的狀態下一面自動搬運,一面在晶圓基板上組裝電路等構造物。 The strength of the wafer substrate is reduced due to thinning. Therefore, in order to prevent damage to the wafer substrate after thinning, during the manufacturing process, the support plate is attached to the wafer substrate by an adhesive layer and is automatically transported on the bottom side. On one side, circuits and other structures are assembled on a wafer substrate.
專利文獻1中記載一種基板的定位裝置,係具備:基板保持部,具有將基板以水平姿勢予以載置之水
平載置面;及基板移載手段,將基板以水平姿勢支撐而令其靜置於基板保持部的水平載置面上;及基板導引手段,和載置於基板保持部的水平載置面上之基板的周邊端面抵接,令基板往水平方向微小移動而將基板定位於規定位置;該基板的定位裝置,其中,基板保持部的水平載置面係受到鏡面處理。
[專利文獻1]日本特開2005-005550號公報(2005年1月6日公開) [Patent Document 1] Japanese Patent Laid-Open No. 2005-005550 (published on January 6, 2005)
專利文獻1記載之基板的定位裝置中,將基板定位至規定位置後,於搬運該基板時,會因施加於基板之振動、或將基板載置於基板保持部後之振動等,而有基板的位置偏離這樣的問題。此外,專利文獻1中,雖有關於令基板往水平方向微小移動之基板導引手段的記載,但悉未揭示藉由基板移載手段將基板搬運至水平載置面上後,以高精度調整載置後的基板的位置。
In the substrate positioning device described in
本發明係有鑑於上述問題點而研發,其目的在於提供一種基板處理裝置及其關連技術,能夠以高精度調整已載置於載置台之基板的位置。 The present invention was developed in view of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus and related technologies that can adjust the position of a substrate placed on a mounting table with high precision.
為解決上述問題,本發明之基板處理裝置,係處理基板之基板處理裝置,其特徵為,具備:辨明部,辨明上述基板的大小;及位置辨明部,基於上述基板的大小,辨明上述基板的中心點;及載置台,載置上述基板;及至少一組的夾持部,將被載置於上述載置台上之上述基板從平面方向予以夾持;上述夾持部,令上述位置辨明部辨明出的上述基板的中心點,移動至上述載置台的中心點上。 In order to solve the above-mentioned problems, the substrate processing apparatus of the present invention is a substrate processing apparatus for processing substrates, and is characterized by comprising: a discerning part that discerns the size of the substrate; and a position discerning part that discerns the substrate based on the size of the substrate The center point; and the mounting table for placing the above-mentioned substrate; and at least one set of clamping parts for clamping the above-mentioned substrate placed on the above-mentioned mounting table from the plane direction; the above-mentioned clamping part, the above-mentioned position identification part The discerned center point of the substrate is moved to the center point of the mounting table.
此外,本發明之基板處理方法,係處理基板之基板處理方法,其特徵為,包含:位置辨明工程,辨明上述基板的中心點;及載置工程,將上述基板載置於載置台上;及夾持工程,藉由至少一組的夾持部,將被載置於上述載置台上之上述基板從平面方向予以夾持;及移動工程,令上述位置辨明工程中辨明出的上述基板的中心點,藉由上述一組的夾持部而移動至上述載置台的中心點上。 In addition, the substrate processing method of the present invention is a substrate processing method for processing substrates, which is characterized by including: a position identification process to identify the center point of the substrate; and a placement process to place the substrate on a mounting table; and The clamping process is to clamp the substrate placed on the mounting table from the plane direction by at least one set of clamping parts; and to move the process so that the center of the substrate identified in the process can be identified by the position The point is moved to the center point of the mounting table by the clamping part of the above group.
按照本發明,係發揮下述效果,即,能夠提供一種基板處理裝置及其關連技術,能夠以高精度調整基板相對於載置台的位置。 According to the present invention, it is possible to provide a substrate processing apparatus and its related technology, which can adjust the position of the substrate relative to the mounting table with high accuracy.
100‧‧‧基板處理裝置 100‧‧‧Substrate processing equipment
10‧‧‧基板 10‧‧‧Substrate
20、20’、40、50‧‧‧夾持部 20, 20’, 40, 50‧‧‧Clamping part
22、42‧‧‧第一臂(夾持部) 22, 42‧‧‧First arm (clamping part)
23、51‧‧‧第二臂(夾持部) 23, 51‧‧‧Second arm (clamping part)
26、27、52、53‧‧‧凸輪從動件(第一旋動部、夾持部) 26, 27, 52, 53‧‧‧Cam follower (first rotating part, clamping part)
43、44‧‧‧凸輪從動件(第二旋動部、夾持部) 43, 44‧‧‧Cam follower (second rotating part, clamping part)
24‧‧‧辨明部 24‧‧‧Identification Department
25、25a、25b‧‧‧驅動部(夾持部) 25, 25a, 25b‧‧‧Drive part (clamping part)
28‧‧‧位置辨明部 28‧‧‧Location Identification Department
31‧‧‧旋轉平台(載置台) 31‧‧‧Rotating Platform (Mounting Table)
32‧‧‧EBR噴嘴(液體供給部) 32‧‧‧EBR nozzle (liquid supply part)
33‧‧‧洗淨杯(杯) 33‧‧‧Washing cup (cup)
62‧‧‧搬運機器人(搬運部) 62‧‧‧Transport robot (Transport Department)
[圖1]本發明實施形態1之基板處理裝置100的概略構成說明圖。
[Fig. 1] An explanatory diagram of a schematic configuration of a
[圖2]本發明實施形態1之基板處理裝置100所具備的位置辨明裝置61的概略構成說明圖。
[Fig. 2] An explanatory diagram of the schematic configuration of a
[圖3]本發明實施形態1之基板處理裝置100所具備的洗淨裝置66的概略構成說明圖。
Fig. 3 is an explanatory diagram of the schematic configuration of a
[圖4]本發明實施形態2之基板處理裝置所具備的洗淨裝置66’的概略構成說明圖。
[Fig. 4] An explanatory diagram of the schematic configuration of a cleaning device 66' included in a substrate processing apparatus according to
[圖5]本發明實施形態3之基板處理裝置所具備的洗淨裝置66”的概略構成說明圖。
[FIG. 5] A schematic diagram for explaining the schematic configuration of a
利用圖1~3,詳細說明本發明一實施形態(實施形態1)之基板處理裝置100。
1 to 3, the
圖1為本實施形態之基板處理裝置100的概略構成說明圖。圖2為本實施形態之基板處理裝置100所具備的位置辨明裝置61的概略構成說明圖。圖3為本實施形態之基板處理裝置100所具備的洗淨裝置66的概略構成說明圖。
FIG. 1 is an explanatory diagram of a schematic configuration of a
如圖1所示,基板處理裝置100,具備位置辨明裝置61、搬運機器人(搬運部)62、及洗淨裝置66。此外,基板處理裝置100,具備供搬運機器人62移動用
之搬運部走行路63、旋轉器64、及烘烤板65。此外,基板處理裝置100,具備控制各裝置的動作之控制部(未圖示)。
As shown in FIG. 1, the
本發明一實施形態之基板處理裝置100,雖無限定,但典型而言能夠合適地用來進行用以除去形成於基板10的周緣部分之接著層11之處理,即所謂EBR(Edge Bead Removal:邊緣球狀物移除)處理(圖3的(a)~(c))。此外,本實施形態之基板處理裝置100,可構成透過接著層11將基板10與支撐該基板10之支撐體予以貼附之貼附系統(未圖示)的一部分。
Although the
如圖2(a)所示,位置辨明裝置61,具備載置基板10之平台21、及具備第一臂22與第二臂23而成之夾持部20(另一組的夾持部)。在此,第一臂22,具備辨明基板10的大小之辨明部24。
As shown in FIG. 2(a), the
如圖2(a)所示,基板10,雖無限定,但典型而言能夠使用矽晶圓基板。此外,基板10,亦可為由陶瓷基板、薄膜基板、撓性基板等任意材質所構成之基板。此外,在基板10,例如亦可組裝有積體電路或金屬凸塊等構造物。另,雖無限定,但本實施形態之基板處理裝置100中,進行處理之基板的俯視時之形狀為圓形。
As shown in FIG. 2(a), the
平台21,為設計成將從位置辨明裝置61的外部搬入而來之基板10的底面部之內周部分予以支撐,而載置該基板10之台。平台21能夠藉由驅動部(未圖示),於圖2(a)所示之Z方向令其上下移動。如此一來,平台21便能在第一臂22與第二臂23之間搬運基板10。另,基板10,是以其中心點大致配置於平台21的中心點附近之方式被載置於平台21上。
The
夾持部20,具備用來夾持基板10之第一臂22及第二臂23、及求出基板10的中心點之位置辨明部28。
The
如圖2(a)所示,第一臂22,具備辨明部24、及驅動部(未圖示),具有能夠和基板10的外周端部抵接之抵接面22a。
As shown in FIG. 2( a ), the
辨明部24,係設計成當夾持部20夾持了基板10時,偵測施加於第一臂22之力。此外,辨明部(距離辨明部)24,係設計成在偵測到力之前能夠辨明第一臂22於X方向移動之距離。
The
第二臂23,具備驅動部25,雖能沿著X方向移動,但在夾持基板10之前,會被固定在位置辨明裝置61內的規定位置。此外,第二臂23,具備凸輪從動件(第一旋動部)26及27,凸輪從動件26及27能夠以垂
直於X-Y平面之軸為中心而旋動。另,凸輪從動件,例如較佳是由不鏽鋼等金屬來形成。
The
說明夾持部20的動作。如圖2(a)所示,藉由第一臂22而移動之基板10的外周端部,當僅和凸輪從動件26抵接的情形下,凸輪從動件26會因與基板10之摩擦而於X-Y平面朝順時針旋動。藉此,如圖2(b)所示,第二臂23,會誘導該基板10而使得基板10的外周端部和凸輪從動件27抵接。此外,雖未圖示,但當基板10的外周端部僅和凸輪從動件27抵接的情形下,凸輪從動件27會因與基板10之摩擦而於X-Y平面朝逆時針旋動。藉此,第二臂23,會誘導基板10而使得基板10的外周端部和凸輪從動件26抵接。
The operation of the clamping
也就是說,凸輪從動件26及27,當夾持部20夾持了基板10時,會誘導該基板10以便將基板10的外周端部抵接至凸輪從動件26及凸輪從動件27雙方。如此一來,於X-Y平面,在垂直通過將凸輪從動件26與凸輪從動件27予以連結之線段A的中間點A1之線段C上,能夠配置基板10的中心點O1(圖2(b))。故,基板處理裝置100,能夠僅藉由以夾持部20夾持基板10這一動作,便將基板10的中心點O1配置於規定的軸線上。也就是說,能夠基板10的中心點O1配置於Y軸方向上的規定座標。
That is, the
在此,辨明部24,設有當具備作為基準之大小的基板10S(圖2(b)中以雙點鏈線表示)的中心點被
配置於平台21的中心點O2上,而第一臂22於X方向移動時,辨明應偵測到對基板10S施加之力的位置之機構。因此,辨明部24,能夠辨明當第一臂22於X方向移動時,應偵測到對基板10S施加之力的位置與實際偵測到對基板10施加力的位置之差,即距離R。此距離R,相當於辨明部24所偵測出的實際的基板10的直徑與作為基準之基板10S的直徑之差。位置辨明部28,基於距離R,求出基板10的實際直徑,而求出配置於線段C上之基板10的中心點O1於X軸方向之座標。如此一來,於位置辨明裝置61,便辨明基板10的大小、及X-Y平面上之中心點O1的位置。
Here, the discriminating
另,夾持部20,亦可為下述構成,即,由凸輪從動件26及27、以及第一臂22與基板10的外周端部之接點的座標,來辨明基板10的大小、及中心點O1。
In addition, the clamping
其後,如圖2(c)所示,夾持部20,在夾持了基板10的狀態下,於X方向移動,藉此,會令基板10移動而使得基板10的中心點O1被配置於平台21的中心點O2上。其後,於圖2(c)所示狀態下,平台21例如藉由透過減壓部將基板10予以吸附保持之吸附部(未圖示),而將基板10的內周部予以吸附保持。接下來,第一臂22與第二臂23,以於X方向彼此遠離之方式移動,藉此解除基板10的夾持。接下來,平台21,在將基板10的內周部予以吸附保持的狀態下,將該基板10從夾持部20之間於Z方向抬起,遞交至搬運機器人62的手部
62a。
Thereafter, as shown in FIG. 2(c), the clamping
搬運機器人(搬運部)62,將藉由位置辨明部28而辨明出中心點O1之基板10,因應處理而搬運至規定的裝置。基板處理裝置100中,搬運機器人62,係將該基板10從位置辨明裝置61往旋轉器64搬運。接下來,將基板10從旋轉器64往烘烤板65搬運。其後,將基板10從烘烤板65往洗淨裝置66搬運。搬運機器人62,於各搬運工程,係藉由手部62a支撐基板10的周緣部分,而搬運該基板10。
The transfer robot (transfer part) 62 transfers the
另,基板處理裝置100,亦可構成為在搬運機器人62將基板10從位置辨明裝置61搬出後之階段,將另一基板搬入至位置辨明裝置61,而辨明該另一基板的大小及中心點。如此一來,便能縮短連續性的基板處理所需之時間。
In addition, the
旋轉器(塗布裝置)64,為在基板10上塗布接著劑之裝置。旋轉器64,係設計成藉由搬運機器人62而供基板10載置,而使得基板10的中心點O1被配置於其中心點上。旋轉器64,令被載置的基板10,例如一面以3000rpm旋轉一面在該基板10上旋轉塗布接著劑。另,基板10的旋轉速度並無特別限定,可因應接著劑的種
類、該基板的大小等而適當設定。此外,對於基板之接著劑的塗布方法,並不限定於旋轉塗布(spin coating),例如亦可藉由浸漬、輥刀、噴霧塗布、狹縫塗布等方法來塗布。
The spinner (coating device) 64 is a device for coating an adhesive on the
此外,旋轉器64,亦可具備洗淨部,係當在基板10上塗布接著劑時,更對該基板塗布用來將附著於基板10的端面或背面之接著劑予以洗淨之洗淨液。如此一來,無需另行設置洗淨接著劑之洗淨裝置,便能一面在基板10上塗布接著劑一面洗淨該基板的端面或背面。故,本實施形態之基板處理裝置100中,能夠省空間化,此外能夠縮短層積體的形成時間。
In addition, the
另,在基板10塗布之接著劑並無限定,例如能夠舉出熱可塑性接著劑、硬化性接著劑等。例如,熱可塑性接著劑中,例如能夠舉出含有丙烯酸系樹脂、苯乙烯系樹脂、馬來醯亞胺(maleimide)系樹脂、碳氫化合物系樹脂、及熱可塑性彈性體(elastomer)等熱可塑性樹脂而成之接著劑。此外,硬化性接著劑中,例如能夠舉出含有具有不飽和雙鍵的化合物、及環氧樹脂等而成之接著劑,且為含有熱聚合起始劑而成之熱硬化性接著劑。在此,具有不飽和雙鍵的化合物中,例如能夠舉出多官能丙烯酸酯等低分子化合物、具有不飽和雙鍵的均聚合物(homopolymer)及共聚合物等。此外,硬化性接著劑,亦可為含有光聚合起始劑來替代熱聚合起始劑而成之光硬化性接著劑。
In addition, the adhesive to be applied to the
烘烤板(加熱裝置)65,為自搬運機器人62接收藉由旋轉器64而塗布了接著劑之基板10,並藉由加熱而在基板10上形成接著層11之裝置。烘烤板65,可藉由安裝熱源,或藉由在天板安裝熱源,來烘烤接著劑。作為熱源的例子,例如能夠舉出溫水加熱器、溫風加熱器、紅外線加熱器、及電熱加熱器等。
The baking plate (heating device) 65 is a device that receives the
如圖3(a)所示,洗淨裝置66,具備旋轉平台(載置台)31、夾持部20’、EBR噴嘴(液體供給部)32及洗淨杯(cup)33。
As shown in Fig. 3(a), the
形成了接著層11之基板10會被搬入至洗淨裝置66。在此,基板10,係藉由搬運機器人62而反覆了對各裝置之搬入、及搬出,因此在被搬入至洗淨裝置66之前,搬運機器人62所支撐之基板10的中心點O1的位置,可能會和實際應被配置之位置產生偏差。然而,洗淨裝置66,藉由具備夾持部20’,能夠將自烘烤板65藉由搬運機器人62搬運而來的基板10的中心點O1的位置,再度調整成適當的位置。
The
旋轉平台31,能夠藉由驅動軸34而於X-Y平面旋
轉。旋轉平台31,例如和減壓部(未圖示)連通,藉此具備能夠將基板10的底面部予以吸附保持之吸附部(未圖示)。更具體而言,旋轉平台,例如可為具備真空夾盤(chuck)及電動機之旋轉夾盤。
The rotating
旋轉平台31,能夠於Z方向上下移動。藉此,旋轉平台31,能夠對於洗淨杯33朝向Z方向在配置於上側之夾持部20’之間載置基板10(圖3(b))。
The rotating
夾持部20’,就具備第一臂22及第二臂23這點而言,和夾持部20相同。此外,夾持部20’,例如具備有線或無線等的通訊部(未圖示),自該通訊部接收位置辨明部28辨明出的基板10的大小及中心點O1的座標之資料。故,夾持部20’,即使不具備如辨明部24般辨明作為標準之基板10’的直徑與基板10的直徑之差之機構,仍能藉由基於由位置辨明部28辨明出的資料,令第一臂22及第二臂23於X方向移動而夾持基板10這一簡易的動作,而將基板10的中心點O1配置於旋轉平台31的中心點O3的上方(圖3(a))。
The clamping
另,夾持部20’的第一臂22,具備驅動部25a來代替辨明部24。此外,夾持部20’的第一臂22,具備驅動部25b來代替驅動部25。驅動部25a,不偵測基板10的直徑與作為基準之基板10S的直徑之差亦即距離R,這點和辨明部24相異。驅動部25a,基於位置辨明裝置61
中的辨明部24辨明出的距離R,令夾持部20’中的第一臂22於X方向朝向第二臂23側移動。如此一來,夾持部20’會夾持基板10,將該基板10的中心點O1配置於旋轉平台的中心點O3的上方。此外,夾持部20’,藉由第一臂22所具備的驅動部25a及第二臂23所具備的驅動部25b,能夠比位置辨明裝置61中的夾持部20以更廣的範圍移動。因此,夾持部20’,於旋轉平台31進行了基板10的中心點O1的對位後,能夠移動至洗淨杯33上方不妨礙EBR噴嘴32的動作之位置(圖3(c))。
In addition, the
另,隨著夾持部20’移動,旋轉平台31於Z方向朝下側移動。藉此,旋轉平台31將基板10搬運至洗淨杯33的內側,開始旋轉。旋轉平台31的旋轉速度,可依基板的大小及材質等而適當設定,較例如較佳為500rpm以上,更佳能夠訂為500rpm以上、3000rpm以下。
In addition, as the clamping portion 20' moves, the rotating
EBR噴嘴(液體供給部)32,係對旋轉平台31上旋轉中的基板10噴射洗淨液(液體),藉此將形成於基板10的周緣部分之接著層11予以溶解除去。從EBR噴嘴32供給洗淨液時的流量及洗淨液的供給時間,可能會因應除去對象的組成、除去對象的厚度、使用的溶劑種類、及除去的程度而相異,但所屬技術領域者能夠輕易研討及決定其最佳條件。
The EBR nozzle (liquid supply unit) 32 sprays a cleaning liquid (liquid) on the
從EBR噴嘴32對基板10噴射之洗淨液,只要能夠將接著層11溶解即可,並無特別限定,但例如能夠使用直鏈狀的碳氫化合物、碳數4至15的分岐狀的碳氫化合物、萜烯(terpene)系溶劑、內酯(lactone)類、酮類、多價醇類、多價醇類的衍生物、環式醚類、酯類、芳香族系有機溶劑等。
The cleaning solution sprayed from the
另,洗淨杯33,係防止從EBR噴嘴32噴射出的洗淨液在洗淨裝置66內飛濺,藉此防止洗淨裝置66受到污染。
In addition, the
本實施形態之基板處理裝置100,能夠將基板10的中心點O1良好地配置於旋轉平台31的中心點O3的上方,因此不會使基板10偏心而能以中心點O1為中心令其良好地旋轉。故,藉由EBR處理,能夠將被除去接著層11而成之露出面10a的寬度,例如在50~100μm這樣的範圍內良好地控制成均一的寬度。
In the
此外,處理之對象亦即基板,當使用例如直徑的基準值為300mm之基板的情形下,就直徑而言個體差異可能有±0.2mm程度的誤差。然而,基板處理裝置100,能夠對基板的每一個體辨明大小、辨明中心點。因此,不受基板的個體差異影響,能夠調整EBR處理所致之基板10的露出面10a的寬度。故,基板處理裝置100,在要求高精度之層積體的製造中能夠良好地使用。
In addition, the object to be processed, that is, the substrate, when, for example, a substrate with a reference value of 300 mm in diameter is used, there may be an error of about ±0.2 mm in individual differences in diameter. However, the
本發明之基板處理裝置,不限定於上述實施形態(實施形態1)。例如,如圖4所示,一實施形態(實施形態2)之基板處理裝置所具備的洗淨裝置66’,於第一臂42,係構成為具備凸輪從動件(第二旋動部)43及44。另,有關驅動部25a及驅動部25b,係和實施形態1的構成相同,因此省略其說明。
The substrate processing apparatus of the present invention is not limited to the above-mentioned embodiment (Embodiment 1). For example, as shown in FIG. 4, a cleaning device 66' included in the substrate processing apparatus of one embodiment (Embodiment 2) is configured to include a cam follower (second rotating portion) in the
夾持部40,具備第一臂42及第二臂23。第一臂42,係構成為具備凸輪從動件(第二旋動部)43及44,來代替第一臂22中的抵接面22a。
The clamping
夾持部40,藉由第一臂42所具備的凸輪從動件43及44的至少一方,令基板10於X方向朝向第二臂23側移動。例如,當基板10的外周端部被抵接至第一臂42的凸輪從動件43,該基板10的外周端部僅被凸輪從動件26推壓的情形下,凸輪從動件26會因與基板10之摩擦而於X-Y平面朝順時針旋動,同時凸輪從動件43朝逆時針旋動。藉此,如圖4所示,夾持部40,藉由凸輪從動件26及凸輪從動件43,會誘導該基板10而使得基板10的外周端部和凸輪從動件27及44抵接。另,例如當被抵接至第一臂42的凸輪從動件44,藉此基板10的外周端部僅被凸輪從動件27推壓的情形下亦同樣地,夾持部40會誘導該基板10而使得基板10的外周端部和凸輪從動件26及43抵接。像這樣,夾持部40,不僅凸輪從
動件26及27,還令凸輪從動件43及44旋動,藉此相較於具備第一臂22之夾持部20的情形,能夠誘導基板10而能夠更順利地夾持。
The clamping
此外,如圖4所示,連結凸輪從動件26及27之線段A、及連結凸輪從動件43及44之線段B彼此為平行,且連結線段A的中間點A1與線段B的中間點B1之線段C,相對於上述線段A及線段B為垂直。像這樣,藉由配置凸輪從動件26及27、以及凸輪從動件43及44,能夠將基板10的中心點O1配置於線段C上。故,夾持部40,如同夾持部20及20’般,藉由夾持基板10,能夠將該基板10的Y方向之座標配置於線段C上。此外,夾持部40,能夠基於藉由位置辨明部28求出的基板10的大小及中心點的座標,而將基板10的中心點配置於旋轉平台31的中心點上。
Further, as shown in FIG. 4, the line segment
在此,凸輪從動件26及27之間的距離,較佳是比凸輪從動件43及44之間的距離還遠。更具體而言,連結凸輪從動件26與基板10的中心點O1之線段D、和連結凸輪從動件27與基板10的中心點O1之線段D’之間所夾的角度θ1,較佳為60°~120°,而連結凸輪從動件43與基板10的中心點O1之線段E、和連結凸輪從動件44與基板10的中心點O1之線段E’之間所夾的角度θ2,較佳為15°~40°左右。如此一來,便能一面藉由第一臂42令基板10朝第二臂23側移動,一面藉由凸輪從動件26及27、以及凸輪從動件43及44來夾持基板10。
Here, the distance between the
另,在夾持部40設置位置辨明部,而將該夾持部40於位置辨明裝置中使用,藉此便能將該位置辨明裝置良好地使用用來辨明基板的大小及中心點,這點自不待言。
In addition, a position identifying part is provided in the holding
本發明之基板處理裝置,不限定於上述實施形態(實施形態1及2)。例如,如圖5所示,一實施形態(實施形態3)之基板處理裝置所具備的洗淨裝置66”中,係構成為夾持部50具備第一臂22與第二臂51,第二臂51中作為凸輪從動件26及27以外的第一旋動部,係設有凸輪從動件52及53。在此,連結凸輪從動件52與凸輪從動件53之線段A’的中間點A’1,係位於通過基板10及基板10’的中心點之線段C上,這點和連結凸輪從動件26及凸輪從動件27之線段A的中間點A1相同。另,對於上述實施形態中具有相同功能的構件,係標註相同符號,並省略其說明。
The substrate processing apparatus of the present invention is not limited to the above-mentioned embodiments (Embodiments 1 and 2). For example, as shown in FIG. 5, in the
按照上述構成,藉由以第一臂22與第二臂51夾持基板10,不僅能夠辨明該基板10的大小及中心點,還能夠良好地夾持如圖5中虛線所示這樣和基板10具有相異直徑之基板10’。也就是說,藉由一個夾持部50,能夠辨明直徑彼此相異之二種類的基板的大小及中心點的位置。
According to the above configuration, by clamping the
另,本實施形態中同樣地,在夾持部50設置
位置辨明部,而將該夾持部50於位置辨明裝置中使用,藉此便能將該位置辨明裝置良好地使用用來辨明基板的大小及中心點,這點自不待言。
In addition, in the same embodiment, the clamping
本發明之基板處理裝置,不限定於上述實施形態(實施形態1、2、及3)。例如,其他實施形態之基板處理裝置,不限定於使用EBR噴嘴32之形態。基板處理裝置,例如亦可藉由使用切割機(cutter)或刀(blade)等將形成於基板10上之除去對象以物理方式予以切斷或剝離而除去之方法、及藉由大氣壓下的灰化而將除去對象除去之方法等來進行EBR處理。
The substrate processing apparatus of the present invention is not limited to the aforementioned embodiments (
此外,例如,又另一實施形態之基板處理裝置中,處理之對象亦即基板,例如亦可為支撐板(支撐體)。支撐板,係於基板10的薄化、搬運、組裝等程序時,支撐該基板10以用來防止基板10的破損或變形。作為支撐板的材質,例如能夠舉出玻璃、矽、丙烯酸系樹脂等。另,支撐板,於俯視時之形狀為圓形。另,支撐板,亦可構成為從設於厚度方向之複數個貫通孔供給剝離液,藉此能夠令接著層11膨潤。
In addition, for example, in the substrate processing apparatus of still another embodiment, the substrate to be processed, for example, may be a support plate (support body). The support plate is used to support the
此外,支撐板,亦可構成為形成有分離層,該分離層能夠藉由在和欲支撐之基板相向之側的面吸收光而變質。所謂分離層,係為藉由吸收隔著支撐板照射的光而變質之層,為將支撐板與基板予以良好地分離之層。分 離層,例如能夠舉出藉由電漿CVD(化學氣相沉積)法而成膜之碳氟化物。此外,例如,分離層中,能夠舉出使用在其重複單元(repeating unit)中包含具有光吸收性的結構之聚合體、無機物、具有紅外線吸收性的結構之化合物、及反應性倍半矽氧烷(silsesquioxane)等而形成之分離層。 In addition, the support plate may be configured to have a separation layer formed with the separation layer that can be changed in quality by absorbing light on the surface on the side facing the substrate to be supported. The separation layer is a layer that is changed by absorbing light irradiated through the support plate, and is a layer that separates the support plate and the substrate well. Minute For the separation layer, for example, a fluorocarbon film formed by a plasma CVD (chemical vapor deposition) method can be cited. In addition, for example, in the separation layer, the use of a polymer containing a light-absorbing structure in its repeating unit, an inorganic substance, a compound with an infrared-absorbing structure, and reactive silsesquioxane The separation layer formed by silsesquioxane, etc.
按照一實施形態之基板處理裝置,即使在這樣的支撐板中,也能良好地辨明基板的中心點,將基板以高精度配置於洗淨裝置。故,能夠良好地使用用來將形成於支撐板上的外周端部之接著層及/或分離層藉由EBR處理予以除去。另,當支撐板上形成有分離層的情形下,作為洗淨液,例如可使用由單異丙醇胺(MIPA)等的第一級脂肪族胺、2-(甲基胺基)乙醇(MMA)等的第二級脂肪族胺、三乙醇胺等的第三級脂肪族胺、環己胺等的雜環胺所構成之群組中選擇之至少1種胺類,或含有它們的溶劑等。 According to the substrate processing apparatus of one embodiment, even in such a support plate, the center point of the substrate can be distinguished well, and the substrate can be accurately arranged in the cleaning device. Therefore, it can be used well to remove the adhesive layer and/or separation layer formed on the outer peripheral end of the support plate by EBR treatment. In addition, when a separation layer is formed on the support plate, as a cleaning solution, for example, a first-stage aliphatic amine such as monoisopropanolamine (MIPA), 2-(methylamino)ethanol ( At least one amine selected from the group consisting of secondary aliphatic amines such as MMA), tertiary aliphatic amines such as triethanolamine, and heterocyclic amines such as cyclohexylamine, or solvents containing them, etc. .
此外,例如,又另一實施形態之基板處理裝置,係構成為在圖3~5所示之洗淨裝置66、66’及66”的任一者中,於夾持部20’、40、50設有位置辨明部,來代替圖2所示之位置辨明裝置61。藉此,洗淨裝置中,便能良好地辨明基板10的中心點O1。另,本實施形態之基板處理裝置,能夠良好地使用用來對形成於未事先辨明中心點的基板之接著層或分離層進行EBR處理。
In addition, for example, a substrate processing apparatus of yet another embodiment is configured such that in any one of the
本發明之基板處理方法,於一態樣中,係處理基板10之基板處理方法,包含:辨明基板10的中心點O1之位置辨明工程;及將基板10載置於旋轉平台(載置台)31上之載置工程;及藉由至少一組的夾持部20’,將被載置於旋轉平台31上之基板10從平面方向予以夾持之夾持工程;及令位置辨明工程中辨明出的上述基板10的中心點O1,藉由一組的夾持部20’而移動至旋轉平台31的中心點O3上之移動工程。
The substrate processing method of the present invention, in one aspect, is a substrate processing method for processing a
此外,本發明之基板處理方法,於一態樣中可以是,位置辨明工程,係於載置工程前,基於當不同於一組的夾持部20’之另一組的夾持部20夾持基板10時之另一組的夾持部20的彼此之距離,來辨明上述基板的中心點之位置辨明工程,而移動工程中,基於該位置辨明工程中辨明出的上述基板的中心點O1,藉由一組的夾持部20’令其移動至旋轉平台31的中心點O3上。
In addition, the substrate processing method of the present invention may be, in one aspect, the position identification process, which is based on the clamping
此外,本發明之基板處理方法,於一態樣中亦可以是,位置辨明工程,係辨明被載置於旋轉平台31上之基板10的中心點O1之位置辨明工程,基於夾持工程中夾持基板10時之一組的夾持部20’的彼此之距離,來辨明基板10的中心點O1。
In addition, the substrate processing method of the present invention may also be a position identification process in one aspect, which is a position identification process for identifying the center point O 1 of the
此外,本發明之基板處理方法,於一態樣中較佳是,移動工程後,包含對基板10供給洗淨液(液體)之液體供給工程。
In addition, in one aspect, the substrate processing method of the present invention preferably includes a liquid supply process of supplying a cleaning liquid (liquid) to the
此外,本發明之基板處理方法,於一態樣中可以是,基板10的俯視時之形狀為圓形,位置辨明工程中,透過一組的夾持部20’當中的第二臂23中設置成和基板10的外周端部相向之當和上述基板的外周端部抵接時會旋動之二個凸輪從動件(第一旋動部),來夾持基板10。
In addition, the substrate processing method of the present invention may in one aspect be that the
此外,本發明之基板處理方法,於一態樣中可以是,挟持工程中,透過二個凸輪從動件(第一旋動部)26及27、以及一組的夾持部當中的第一臂22中設置成和基板10的外周端部相向之當和上述基板的外周端部抵接時會旋動之二個凸輪從動件(第二旋動部)43及44,來夾持基板10。
In addition, the substrate processing method of the present invention, in one aspect, can be through the two cam followers (first rotating parts) 26 and 27 and the first of the clamping parts in the clamping process. Two cam followers (second rotating parts) 43 and 44 are provided in the
此外,本發明之基板處理方法,於一態樣中可以是,上述二個凸輪從動件26及27、以及二個凸輪從動件43及44係被配置成,連結二個凸輪從動件26及27之線段A、及連結二個凸輪從動件43及44之線段B彼此為平行,且連結上述線段A的中間點與上述線段B的中間點之線段C相對於上述線段A及線段B為垂直,上述二個凸輪從動件26及27之間的距離,比二個凸輪從動件43及44之間的距離還遠。
In addition, the substrate processing method of the present invention may in one aspect be that the two
也就是說,上述基板處理裝置100的各實施形態亦即本發明之基板處理方法,係以上述實施形態及圖1~5的說明為準。
That is to say, each embodiment of the above-mentioned
本發明並非限定於上述各實施形態,在請求 項所揭示之範圍內可進行各種變更,將相異實施形態中各自揭示之技術手段予以適當組合所得之實施形態,亦包含在本發明之技術範圍內。 The present invention is not limited to the above-mentioned embodiments. Various changes can be made within the scope disclosed in the item, and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included in the technical scope of the present invention.
本發明,能夠以高精度調整基板相對於載置台的位置,因此能夠廣泛利用於工業製品的製造領域,特別是能夠良好地利用於製造半導體裝置時之EBR處理。 The present invention can adjust the position of the substrate with respect to the mounting table with high accuracy, and therefore can be widely used in the manufacturing field of industrial products, and can be particularly well used in EBR processing when manufacturing semiconductor devices.
10‧‧‧基板 10‧‧‧Substrate
10a‧‧‧露出面 10a‧‧‧Showing
11‧‧‧接著層 11‧‧‧Next layer
20’‧‧‧夾持部 20’‧‧‧Clamping part
22‧‧‧第一臂(夾持部) 22‧‧‧First arm (clamping part)
22a‧‧‧抵接面 22a‧‧‧Abutment surface
23‧‧‧第二臂(夾持部) 23‧‧‧Second arm (clamping part)
26、27‧‧‧凸輪從動件(第一旋動部、夾持部) 26、27‧‧‧Cam follower (first rotating part, clamping part)
25a、25b‧‧‧驅動部(夾持部) 25a, 25b‧‧‧Drive part (clamping part)
31‧‧‧旋轉平台(載置台) 31‧‧‧Rotating Platform (Mounting Table)
32‧‧‧EBR噴嘴(液體供給部) 32‧‧‧EBR nozzle (liquid supply part)
33‧‧‧洗淨杯(杯) 33‧‧‧Washing cup (cup)
34‧‧‧驅動軸 34‧‧‧Drive shaft
66‧‧‧洗淨裝置 66‧‧‧Cleaning device
O1、O3‧‧‧中心點 O 1 、O 3 ‧‧‧center point
A‧‧‧線段 A‧‧‧line segment
A1‧‧‧中間點 A 1 ‧‧‧Midpoint
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TW201029101A (en) * | 2008-12-12 | 2010-08-01 | Lam Res Corp | Method and system for centering wafer on chuck |
JP2011258924A (en) * | 2010-05-12 | 2011-12-22 | Tokyo Electron Ltd | Substrate positioning device, substrate processing apparatus, substrate positioning method, and storage medium recording programs |
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JP4226955B2 (en) | 2003-06-13 | 2009-02-18 | 大日本スクリーン製造株式会社 | Substrate positioning device |
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JP4781802B2 (en) * | 2005-12-06 | 2011-09-28 | 東京応化工業株式会社 | Support plate laminating means and laminating apparatus, and support plate laminating method |
JP5243491B2 (en) | 2010-06-18 | 2013-07-24 | 東京エレクトロン株式会社 | Positioning apparatus, substrate processing apparatus, and reference member fixing method |
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TW201029101A (en) * | 2008-12-12 | 2010-08-01 | Lam Res Corp | Method and system for centering wafer on chuck |
TW201203439A (en) * | 2010-05-04 | 2012-01-16 | Hanmi Semiconductor Co Ltd | Method for aligning of semiconductor wafer |
JP2011258924A (en) * | 2010-05-12 | 2011-12-22 | Tokyo Electron Ltd | Substrate positioning device, substrate processing apparatus, substrate positioning method, and storage medium recording programs |
TW201539609A (en) * | 2013-12-23 | 2015-10-16 | Lam Res Corp | Robot with integrated aligner |
TW201546939A (en) * | 2014-05-22 | 2015-12-16 | Applied Materials Inc | Presence sensing and position correction for wafer on a carrier ring |
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