TWI705518B - A substrate processing apparatus, and a substrate processing method - Google Patents

Abstract

The position of the substrate placed on the stage is adjusted with high precision.

The substrate processing apparatus (100) is provided with: a discerning part (24) for discerning the size of the substrate (10); and a position discerning part (28) for discerning the center point of the substrate (10) based on the size of the substrate (10); and rotation The platform (31), where the substrate (10) is placed; and a set of clamping parts (20'), which clamp the substrate (10) from the plane direction; the clamping part (20'), the position identification part (28 ) The identified center point (O ₁ ) of the substrate (10) is moved to the center point (O ₃ ) of the rotating platform (31).

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method.

In recent years, there has been a demand for thinner, smaller, and lighter electronic devices such as IC cards and mobile phones. In order to meet these requirements, thin semiconductor wafers must also be used for the mounted semiconductor wafers. Therefore, although the thickness (film thickness) of the wafer substrate, which is the basis of semiconductor wafers, is currently 125 μm to 150 μm, it is said that the next-generation wafer must be made to 25 μm to 50 μm. Therefore, in order to obtain the wafer substrate with the above-mentioned film thickness, the thinning process of the wafer substrate is indispensable.

The strength of the wafer substrate is reduced due to thinning. Therefore, in order to prevent damage to the wafer substrate after thinning, during the manufacturing process, the support plate is attached to the wafer substrate by an adhesive layer and is automatically transported on the bottom side. On one side, circuits and other structures are assembled on a wafer substrate.

Patent Document 1 describes a positioning device for a substrate, which is provided with a substrate holding portion having water for placing the substrate in a horizontal position. Flat placement surface; and substrate transfer means to support the substrate in a horizontal posture so that it is placed on the horizontal placement surface of the substrate holding part; and substrate guiding means and the horizontal placement placed on the substrate holding part The peripheral end surface of the substrate on the surface abuts, causing the substrate to move slightly in the horizontal direction to position the substrate at a predetermined position; in the substrate positioning device, the horizontal placement surface of the substrate holding portion is mirror-finished.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2005-005550 (published on January 6, 2005)

In the substrate positioning device described in Patent Document 1, after the substrate is positioned to a predetermined position, when the substrate is transported, there may be a substrate due to vibration applied to the substrate or vibration after the substrate is placed on the substrate holding portion. The position deviates from such a problem. In addition, although Patent Document 1 describes a substrate guiding means that allows the substrate to move slightly in the horizontal direction, it does not disclose that the substrate is transferred to a horizontal mounting surface by a substrate transfer means and then adjusted with high precision. The position of the substrate after placement.

The present invention was developed in view of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus and related technologies that can adjust the position of a substrate placed on a mounting table with high precision.

In order to solve the above-mentioned problems, the substrate processing apparatus of the present invention is a substrate processing apparatus for processing substrates, and is characterized by comprising: a discerning part that discerns the size of the substrate; and a position discerning part that discerns the substrate based on the size of the substrate The center point; and the mounting table for placing the above-mentioned substrate; and at least one set of clamping parts for clamping the above-mentioned substrate placed on the above-mentioned mounting table from the plane direction; the above-mentioned clamping part, the above-mentioned position identification part The discerned center point of the substrate is moved to the center point of the mounting table.

In addition, the substrate processing method of the present invention is a substrate processing method for processing substrates, which is characterized by including: a position identification process to identify the center point of the substrate; and a placement process to place the substrate on a mounting table; and The clamping process is to clamp the substrate placed on the mounting table from the plane direction by at least one set of clamping parts; and to move the process so that the center of the substrate identified in the process can be identified by the position The point is moved to the center point of the mounting table by the clamping part of the above group.

According to the present invention, it is possible to provide a substrate processing apparatus and its related technology, which can adjust the position of the substrate relative to the mounting table with high accuracy.

100‧‧‧Substrate processing equipment

10‧‧‧Substrate

20, 20’, 40, 50‧‧‧Clamping part

22, 42‧‧‧First arm (clamping part)

23, 51‧‧‧Second arm (clamping part)

26, 27, 52, 53‧‧‧Cam follower (first rotating part, clamping part)

43, 44‧‧‧Cam follower (second rotating part, clamping part)

24‧‧‧Identification Department

25, 25a, 25b‧‧‧Drive part (clamping part)

28‧‧‧Location Identification Department

31‧‧‧Rotating Platform (Mounting Table)

32‧‧‧EBR nozzle (liquid supply part)

33‧‧‧Washing cup (cup)

62‧‧‧Transport robot (Transport Department)

[Fig. 1] An explanatory diagram of a schematic configuration of a substrate processing apparatus 100 according to Embodiment 1 of the present invention.

[Fig. 2] An explanatory diagram of the schematic configuration of a position identifying device 61 included in the substrate processing apparatus 100 according to Embodiment 1 of the present invention.

Fig. 3 is an explanatory diagram of the schematic configuration of a cleaning device 66 included in the substrate processing apparatus 100 according to the first embodiment of the present invention.

[Fig. 4] An explanatory diagram of the schematic configuration of a cleaning device 66' included in a substrate processing apparatus according to Embodiment 2 of the present invention.

[FIG. 5] A schematic diagram for explaining the schematic configuration of a cleaning device 66" included in a substrate processing apparatus according to Embodiment 3 of the present invention.

<Substrate processing apparatus 100>

1 to 3, the substrate processing apparatus 100 of one embodiment (Embodiment 1) of the present invention will be described in detail.

FIG. 1 is an explanatory diagram of a schematic configuration of a substrate processing apparatus 100 according to this embodiment. FIG. 2 is an explanatory diagram showing a schematic configuration of a position identifying device 61 included in the substrate processing apparatus 100 of this embodiment. FIG. 3 is an explanatory diagram of the schematic configuration of the cleaning device 66 included in the substrate processing apparatus 100 of this embodiment.

As shown in FIG. 1, the substrate processing apparatus 100 includes a position identification device 61, a transfer robot (transfer part) 62, and a cleaning device 66. In addition, the substrate processing apparatus 100 is equipped with a transport robot 62 for moving The conveying part of the traverse 63, the rotator 64, and the baking plate 65. In addition, the substrate processing apparatus 100 includes a control unit (not shown) that controls the operation of each apparatus.

Although the substrate processing apparatus 100 of an embodiment of the present invention is not limited, it can typically be suitably used to remove the adhesive layer 11 formed on the peripheral portion of the substrate 10, which is called EBR (Edge Bead Removal: Edge ball removal) processing (Figure 3 (a) ~ (c)). In addition, the substrate processing apparatus 100 of the present embodiment can constitute a part of an attaching system (not shown) that attaches the substrate 10 and the support that supports the substrate 10 through the adhesive layer 11.

[Position recognition device 61]

As shown in FIG. 2(a), the position identification device 61 includes a platform 21 on which the substrate 10 is placed, and a clamping portion 20 (another set of clamping portions) formed by a first arm 22 and a second arm 23 . Here, the first arm 22 includes a discriminating portion 24 that discriminates the size of the substrate 10.

(Substrate 10)

As shown in FIG. 2(a), the substrate 10 is not limited, but typically a silicon wafer substrate can be used. In addition, the substrate 10 may also be a substrate made of any material such as a ceramic substrate, a thin film substrate, and a flexible substrate. In addition, on the substrate 10, for example, a structure such as an integrated circuit or a metal bump may be assembled. In addition, although not limited, in the substrate processing apparatus 100 of this embodiment, the shape of the substrate to be processed in a plan view is circular.

(Platform 21)

The platform 21 is designed to support the inner peripheral portion of the bottom surface of the substrate 10 carried in from the outside of the position identifying device 61, and to place the substrate 10 thereon. The platform 21 can be moved up and down in the Z direction shown in FIG. 2(a) by a driving part (not shown). In this way, the platform 21 can transport the substrate 10 between the first arm 22 and the second arm 23. In addition, the substrate 10 is placed on the platform 21 such that its center point is approximately arranged near the center point of the platform 21.

[Clamping part 20]

The clamping portion 20 includes a first arm 22 and a second arm 23 for clamping the substrate 10 and a position identifying portion 28 for obtaining the center point of the substrate 10.

As shown in FIG. 2( a ), the first arm 22 includes a discriminating portion 24 and a driving portion (not shown), and has a contact surface 22 a capable of contacting the outer peripheral end of the substrate 10.

The identification part 24 is designed to detect the force applied to the first arm 22 when the clamping part 20 clamps the substrate 10. In addition, the discerning part (distance discerning part) 24 is designed to be able to discern the distance moved by the first arm 22 in the X direction before the force is detected.

The second arm 23 has a drive unit 25 and can move in the X direction, but before clamping the substrate 10, it is fixed at a predetermined position in the position identifying device 61. In addition, the second arm 23 is provided with cam followers (first rotating parts) 26 and 27, and the cam followers 26 and 27 can be vertically Rotate with the axis straight to the X-Y plane as the center. In addition, the cam follower is preferably formed of metal such as stainless steel.

The operation of the clamping unit 20 will be described. As shown in Figure 2(a), when the outer peripheral end of the base plate 10 moved by the first arm 22 is in contact with the cam follower 26 only, the cam follower 26 will contact the base plate 10 Friction and rotate clockwise on the XY plane. Thereby, as shown in FIG. 2( b ), the second arm 23 induces the substrate 10 so that the outer peripheral end of the substrate 10 abuts the cam follower 27. In addition, although not shown, when the outer peripheral end of the base plate 10 only abuts the cam follower 27, the cam follower 27 will rotate counterclockwise on the X-Y plane due to friction with the base plate 10. Thereby, the second arm 23 induces the substrate 10 so that the outer peripheral end of the substrate 10 and the cam follower 26 abut.

That is, the cam followers 26 and 27, when the clamping portion 20 clamps the substrate 10, will induce the substrate 10 to abut the outer peripheral end of the substrate 10 to the cam follower 26 and the cam follower 27 both sides. In this way, in the XY plane, the center point O _{1 of the} substrate 10 can be arranged on the line segment C perpendicular to the intermediate point A ₁ of the line segment A connecting the cam follower 26 and the cam follower 27 (Figure 2 (b)). Therefore, the substrate processing apparatus 100 can arrange the center point O _{1 of the} substrate 10 on a predetermined axis only by the action of clamping the substrate 10 with the clamping portion 20. That is, the center point O _{1 of the} substrate 10 can be arranged at a predetermined coordinate in the Y-axis direction.

Here, the discriminating portion 24 is provided with a substrate 10S (shown as a double-dot chain line in FIG. 2(b)) with a size as a reference. The center point is arranged on the center point O ₂ of the platform 21, and the first When the arm 22 moves in the X direction, a mechanism for identifying the position where the force applied to the substrate 10S should be detected. Therefore, the discriminating unit 24 can discriminate the distance R between the position where the force applied to the substrate 10S should be detected and the position where the force applied to the substrate 10 is actually detected when the first arm 22 moves in the X direction. This distance R corresponds to the difference between the actual diameter of the substrate 10 detected by the discriminating unit 24 and the diameter of the substrate 10S as a reference. The position identifying unit 28 obtains the actual diameter of the substrate 10 based on the distance R, and obtains the coordinates of the center point O ₁ of the substrate 10 arranged on the line segment C in the X-axis direction. In this way, in the position identifying device 61, the size of the substrate 10 and the position of the center point O ₁ on the XY plane are identified.

In addition, the clamping portion 20 may also have a configuration in which the size of the substrate 10 is identified by the coordinates of the contact points between the cam followers 26 and 27 and the first arm 22 and the outer peripheral end of the substrate 10, And the center point O ₁ .

Thereafter, as shown in FIG. 2(c), the clamping portion 20 moves in the X direction while clamping the substrate 10, thereby moving the substrate 10 so that the center point O _{1 of the} substrate 10 is It is arranged on the central point O ₂ of the platform 21. After that, in the state shown in FIG. 2( c ), the platform 21 adsorbs and holds the inner peripheral portion of the substrate 10 by, for example, a suction part (not shown) that sucks and holds the substrate 10 through a decompression part. Next, the first arm 22 and the second arm 23 move away from each other in the X direction, thereby releasing the clamping of the substrate 10. Next, the platform 21 lifts the substrate 10 in the Z direction from between the clamping parts 20 in a state where the inner peripheral portion of the substrate 10 is sucked and held, and is delivered to the hand 62 a of the transfer robot 62.

[Handling Robot 62]

The transfer robot (transfer part) 62 transfers the substrate 10 whose center point O _{1 has} been identified by the position identification part 28 to a predetermined device in response to processing. In the substrate processing apparatus 100, the transfer robot 62 transfers the substrate 10 from the position identification device 61 to the rotator 64. Next, the substrate 10 is transferred from the spinner 64 to the baking plate 65. After that, the substrate 10 is transported from the baking plate 65 to the cleaning device 66. The transfer robot 62 supports the peripheral portion of the substrate 10 by the hand 62a to transfer the substrate 10 in each transfer process.

In addition, the substrate processing apparatus 100 may also be configured to carry another substrate into the position identification device 61 after the transfer robot 62 unloads the substrate 10 from the position identification device 61 to identify the size and center point of the other substrate . In this way, the time required for continuous substrate processing can be shortened.

[Rotator 64]

The spinner (coating device) 64 is a device for coating an adhesive on the substrate 10. The rotator 64 is designed to be placed on the substrate 10 by the transfer robot 62 so that the center point O _{1 of the} substrate 10 is arranged on the center point. The spinner 64 causes the substrate 10 to be placed to spin-coat the adhesive on the substrate 10 while rotating it at 3000 rpm, for example. In addition, the rotation speed of the substrate 10 is not particularly limited, and can be appropriately set according to the type of adhesive, the size of the substrate, and the like. In addition, the method of applying the adhesive to the substrate is not limited to spin coating. For example, it may be applied by methods such as dipping, roll knife, spray coating, and slit coating.

In addition, the spinner 64 may also be equipped with a cleaning part, which is a cleaning solution used to clean the end surface or back surface of the substrate 10 when the adhesive is applied to the substrate 10 . In this way, it is possible to clean the end surface or the back surface of the substrate while applying the adhesive on the substrate 10 without separately providing a cleaning device for cleaning the adhesive. Therefore, in the substrate processing apparatus 100 of the present embodiment, it is possible to save space, and in addition, it is possible to shorten the time for forming the laminate.

In addition, the adhesive to be applied to the substrate 10 is not limited, and examples thereof include thermoplastic adhesives and curable adhesives. For example, among the thermoplastic adhesives, for example, acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, and thermoplastic elastomers, such as thermoplastics, can be mentioned. Adhesive made of resin. In addition, among the curable adhesives, for example, an adhesive containing a compound having an unsaturated double bond, an epoxy resin, etc., and a thermosetting adhesive containing a thermal polymerization initiator can be cited. Here, among the compounds having an unsaturated double bond, for example, low molecular compounds such as polyfunctional acrylates, homopolymers and copolymers having an unsaturated double bond, and the like can be cited. In addition, the curable adhesive may be a photocurable adhesive containing a photopolymerization initiator instead of the thermal polymerization initiator.

(Baking plate 65)

The baking plate (heating device) 65 is a device that receives the substrate 10 coated with the adhesive by the spinner 64 from the transfer robot 62 and forms the adhesive layer 11 on the substrate 10 by heating. The baking plate 65 can be used to bake the adhesive by installing a heat source or by installing a heat source on the top plate. As examples of the heat source, for example, a warm water heater, a warm air heater, an infrared heater, an electric heater, etc. can be cited.

[Washing device 66]

As shown in Fig. 3(a), the washing device 66 includes a rotating platform (mounting table) 31, a clamping part 20', an EBR nozzle (liquid supply part) 32, and a washing cup 33.

The substrate 10 on which the adhesive layer 11 is formed is carried into the cleaning device 66. Here, the substrate 10 is repeatedly carried in and out of each device by the transfer robot 62. Therefore, before being carried into the cleaning device 66, the position of the center point O ₁ of the substrate 10 supported by the transfer robot 62 , It may deviate from the actual position that should be configured. However, the cleaning device 66, clamping portions provided by 20 ', can be the location from bake plate 65 by the handling robot 62 transported by the center point O 10 substrate _1, re-adjusted to the appropriate position.

(Rotating platform 31)

The rotating platform 31 can be rotated in the X-Y plane by the drive shaft 34 turn. The rotating platform 31 communicates with, for example, a decompression part (not shown), and thereby includes a suction part (not shown) capable of sucking and holding the bottom surface of the substrate 10. More specifically, the rotating platform can be, for example, a rotating chuck equipped with a vacuum chuck and a motor.

The rotating platform 31 can move up and down in the Z direction. Thereby, the rotating platform 31 can place the substrate 10 between the clamping portions 20' arranged on the upper side with respect to the cleaning cup 33 facing the Z direction (FIG. 3(b)).

(Clamping part 20’)

The clamping portion 20 ′ is the same as the clamping portion 20 in that the first arm 22 and the second arm 23 are provided. Further, the clamping portions 20 ', for example, a wired or wireless communication unit (not shown), receives from the communication unit to identify the position of the substrate 28 to identify the size and center point coordinates of the data O 10 _1. Therefore, even if the clamping portion 20' does not have a mechanism for recognizing the difference between the diameter of the substrate 10' as a standard and the diameter of the substrate 10 like the recognizing portion 24, it can still be based on the data recognized by the position recognizing portion 28, The simple action of moving the first arm 22 and the second arm 23 in the X direction to clamp the substrate 10, and the center point O _{1 of the} substrate 10 is arranged above the center point O ₃ of the rotating platform 31 (FIG. 3( a)).

In addition, the first arm 22 of the clamping portion 20 ′ includes a driving portion 25 a instead of the identifying portion 24. In addition, the first arm 22 of the clamping portion 20 ′ includes a driving portion 25 b instead of the driving portion 25. The driving portion 25a does not detect the difference between the diameter of the substrate 10 and the diameter of the substrate 10S as a reference, that is, the distance R, which is different from the discriminating portion 24 in this point. The driving portion 25a moves the first arm 22 in the clamping portion 20' toward the second arm 23 side in the X direction based on the distance R recognized by the recognizing portion 24 in the position recognizing device 61. Thus, the clip portion 20 'will clamp the substrate 10, the substrate 10 is _a center point O of the rotating platform disposed above the center point O _3. In addition, the clamping portion 20' can be moved in a wider range than the clamping portion 20 in the position identifying device 61 by the driving portion 25a of the first arm 22 and the driving portion 25b of the second arm 23 . Therefore, the clamping portion 20 'at the center point O of the rotating platform 10 of the substrate ₁ is 31 bits, can be moved to the upper position of the cleaning cup 33 does not interfere with the operation of EBR nozzle 32 (FIG. 3 (c)) .

In addition, as the clamping portion 20' moves, the rotating platform 31 moves downward in the Z direction. Thereby, the rotating platform 31 conveys the substrate 10 to the inside of the washing cup 33, and starts rotating. The rotation speed of the rotating platform 31 can be appropriately set according to the size and material of the substrate, and is more preferably 500 rpm or more, and more preferably 500 rpm or more and 3000 rpm or less.

(EBR nozzle 32)

The EBR nozzle (liquid supply unit) 32 sprays a cleaning liquid (liquid) on the substrate 10 rotating on the rotating platform 31, thereby dissolving and removing the adhesive layer 11 formed on the peripheral portion of the substrate 10. The flow rate and the supply time of the cleaning liquid when the cleaning liquid is supplied from the EBR nozzle 32 may vary depending on the composition of the object to be removed, the thickness of the object to be removed, the type of solvent used, and the degree of removal, but those in the technical field Can easily discuss and determine the best conditions.

The cleaning solution sprayed from the EBR nozzle 32 to the substrate 10 is not particularly limited as long as it can dissolve the adhesive layer 11. For example, linear hydrocarbons and bifurcated carbons with 4 to 15 carbons can be used. Hydrogen compounds, terpene solvents, lactones, ketones, polyvalent alcohols, derivatives of polyvalent alcohols, cyclic ethers, esters, aromatic organic solvents, etc.

In addition, the washing cup 33 prevents the washing liquid sprayed from the EBR nozzle 32 from splashing in the washing device 66, thereby preventing the washing device 66 from being contaminated.

In the substrate processing apparatus 100 of this embodiment, the center point O _{1 of the} substrate 10 can be well arranged above the center point O ₃ of the rotating table 31, and therefore the substrate 10 can be centered on the center point O ₁ without eccentricity. It spins well. Therefore, by the EBR process, the width of the exposed surface 10a from which the adhesive layer 11 is removed can be well controlled to a uniform width in the range of, for example, 50-100 μm.

In addition, the object to be processed, that is, the substrate, when, for example, a substrate with a reference value of 300 mm in diameter is used, there may be an error of about ±0.2 mm in individual differences in diameter. However, the substrate processing apparatus 100 can recognize the size and the center point of each individual substrate. Therefore, the width of the exposed surface 10a of the substrate 10 caused by the EBR process can be adjusted without being affected by individual differences of the substrate. Therefore, the substrate processing apparatus 100 can be used satisfactorily in the manufacture of a laminated body requiring high precision.

<Substrate processing apparatus of Embodiment 2>

The substrate processing apparatus of the present invention is not limited to the above-mentioned embodiment (Embodiment 1). For example, as shown in FIG. 4, a cleaning device 66' included in the substrate processing apparatus of one embodiment (Embodiment 2) is configured to include a cam follower (second rotating portion) in the first arm 42 43 and 44. In addition, the configuration of the drive unit 25a and the drive unit 25b is the same as that of the first embodiment, so the description thereof is omitted.

(Clamping part 40)

The clamping portion 40 includes a first arm 42 and a second arm 23. The first arm 42 is configured to include cam followers (second rotating parts) 43 and 44 instead of the contact surface 22 a in the first arm 22.

The clamping portion 40 moves the substrate 10 toward the second arm 23 side in the X direction by at least one of the cam followers 43 and 44 provided in the first arm 42. For example, when the outer peripheral end of the base plate 10 is abutted to the cam follower 43 of the first arm 42, and the outer peripheral end of the base plate 10 is only pushed by the cam follower 26, the cam follower 26 will Due to the friction with the substrate 10, the cam follower 43 rotates clockwise on the XY plane, while the cam follower 43 rotates counterclockwise. Thereby, as shown in FIG. 4, the clamping portion 40, through the cam follower 26 and the cam follower 43, induces the substrate 10 so that the outer peripheral end of the substrate 10 and the cam followers 27 and 44 abut Pick up. In addition, for example, when the cam follower 44 abuts on the first arm 42 and thereby the outer peripheral end of the substrate 10 is only pushed by the cam follower 27, the clamping portion 40 induces this The base plate 10 is brought into contact with the cam followers 26 and 43 at the outer peripheral end of the base plate 10. Like this, the clamping part 40 not only cam from The moving parts 26 and 27 also cause the cam followers 43 and 44 to rotate, thereby being able to induce the substrate 10 to be clamped more smoothly than in the case of the clamping portion 20 provided with the first arm 22.

Further, as shown in FIG. 4, the line segment A connecting member 26 and the cam follower 27, the cam follower and the connecting member 44 and the line B 43 is parallel to each other, and the intermediate link midpoint of the line segment A and the segment B is A ₁ point B of the line segment C _1, with respect to the line segment A and segment B is vertical. As described above, by the configuration of the cam follower 26 and 27, and the cam followers 43 and 44, the substrate can be the center point O 10 is disposed on _a line segment C. Therefore, the clamping portion 40, like the clamping portions 20 and 20', by clamping the substrate 10, the Y-direction coordinates of the substrate 10 can be arranged on the line segment C. In addition, the clamping part 40 can arrange the center point of the substrate 10 on the center point of the rotating platform 31 based on the size of the substrate 10 and the coordinates of the center point obtained by the position identifying part 28.

Here, the distance between the cam followers 26 and 27 is preferably greater than the distance between the cam followers 43 and 44. More specifically, the angle θ1 between the line segment D connecting the cam follower 26 and the center point O ₁ of the base plate 10 and the line segment D′ connecting the cam follower 27 and the center point O ₁ of the base plate 10, It is preferably 60°~120°, and between the line segment E connecting the cam follower 43 and the center point O ₁ of the substrate 10, and the line segment E'connecting the cam follower 44 and the center point O ₁ of the substrate 10 The clamping angle θ2 is preferably about 15°-40°. In this way, the substrate 10 can be moved toward the second arm 23 side by the first arm 42 and the substrate 10 can be clamped by the cam followers 26 and 27 and the cam followers 43 and 44.

In addition, a position identifying part is provided in the holding part 40, and the holding part 40 is used in a position identifying device, so that the position identifying device can be used well to identify the size and center point of the substrate. Needless to say.

<Substrate processing apparatus of Embodiment 3>

The substrate processing apparatus of the present invention is not limited to the above-mentioned embodiments (Embodiments 1 and 2). For example, as shown in FIG. 5, in the cleaning device 66" included in the substrate processing apparatus of one embodiment (Embodiment 3), the clamping portion 50 is configured to include a first arm 22 and a second arm 51, and a second The arm 51 serves as the first rotating portion other than the cam followers 26 and 27, and is provided with cam followers 52 and 53. Here, the line segment A'connecting the cam follower 52 and the cam follower 53 the intermediate point a _'1, and the based substrate 10 positioned by the substrate 10', the same as the center point of this line segment C connecting the cam follower 26 and the intermediate point a and the cam follower 27 of the line a _1. Also, As for the members having the same function in the above-mentioned embodiment, the same reference numerals are attached, and the description thereof is omitted.

According to the above configuration, by clamping the substrate 10 with the first arm 22 and the second arm 51, not only the size and center point of the substrate 10 can be recognized, but also the substrate 10 can be clamped well as shown by the dotted line in FIG. Substrates 10' with different diameters. In other words, with one clamping portion 50, the size and the center point of the two types of substrates with different diameters can be discerned.

In addition, in the same embodiment, the clamping portion 50 is provided It goes without saying that the position identifying part is used in the position identifying device, so that the position identifying device can be used well for identifying the size and center point of the substrate.

<Substrate processing apparatus of other embodiments>

The substrate processing apparatus of the present invention is not limited to the aforementioned embodiments (Embodiments 1, 2, and 3). For example, the substrate processing apparatus of other embodiments is not limited to the form using the EBR nozzle 32. The substrate processing apparatus, for example, a method of physically cutting or peeling the object to be removed formed on the substrate 10 by using a cutter or a blade, etc., and removing dust under atmospheric pressure EBR processing is performed by the method of removing the object to be removed.

In addition, for example, in the substrate processing apparatus of still another embodiment, the substrate to be processed, for example, may be a support plate (support body). The support plate is used to support the substrate 10 to prevent damage or deformation of the substrate 10 during the process of thinning, transportation, and assembly of the substrate 10. As the material of the support plate, for example, glass, silicon, acrylic resin, etc. can be cited. In addition, the support plate has a circular shape when viewed from above. In addition, the support plate may be configured to supply the peeling liquid from a plurality of through holes provided in the thickness direction, thereby enabling the adhesive layer 11 to swell.

In addition, the support plate may be configured to have a separation layer formed with the separation layer that can be changed in quality by absorbing light on the surface on the side facing the substrate to be supported. The separation layer is a layer that is changed by absorbing light irradiated through the support plate, and is a layer that separates the support plate and the substrate well. Minute For the separation layer, for example, a fluorocarbon film formed by a plasma CVD (chemical vapor deposition) method can be cited. In addition, for example, in the separation layer, the use of a polymer containing a light-absorbing structure in its repeating unit, an inorganic substance, a compound with an infrared-absorbing structure, and reactive silsesquioxane The separation layer formed by silsesquioxane, etc.

According to the substrate processing apparatus of one embodiment, even in such a support plate, the center point of the substrate can be distinguished well, and the substrate can be accurately arranged in the cleaning device. Therefore, it can be used well to remove the adhesive layer and/or separation layer formed on the outer peripheral end of the support plate by EBR treatment. In addition, when a separation layer is formed on the support plate, as a cleaning solution, for example, a first-stage aliphatic amine such as monoisopropanolamine (MIPA), 2-(methylamino)ethanol ( At least one amine selected from the group consisting of secondary aliphatic amines such as MMA), tertiary aliphatic amines such as triethanolamine, and heterocyclic amines such as cyclohexylamine, or solvents containing them, etc. .

In addition, for example, a substrate processing apparatus of yet another embodiment is configured such that in any one of the cleaning devices 66, 66', and 66" shown in FIGS. 3 to 5, the clamping portions 20', 40, 50 is provided with a position recognizing part instead of the position recognizing device 61 shown in Fig. 2. With this, the center point O _{1 of the} substrate 10 can be well recognized in the cleaning device. In addition, the substrate processing apparatus of this embodiment is It can be used well to perform EBR processing on an adhesive layer or a separation layer formed on a substrate whose center point is not previously identified.

<Substrate processing method>

The substrate processing method of the present invention, in one aspect, is a substrate processing method for processing a substrate 10, including: a position identification process for identifying the center point O ₁ of the substrate 10; and placing the substrate 10 on a rotating platform (mounting table) The placement process on 31; and the clamping process in which the substrate 10 placed on the rotating platform 31 is clamped from the plane direction by at least one set of clamping parts 20'; and the position identification process The center point O ₁ of the above-mentioned substrate 10 is moved to the center point O ₃ of the rotating platform 31 by a set of clamping parts 20 ′.

In addition, the substrate processing method of the present invention may be, in one aspect, the position identification process, which is based on the clamping part 20 of the other group that is different from the clamping part 20' of one group before the placement process. The distance between the clamping parts 20 of the other group when the substrate 10 is held is used to identify the center point of the substrate in the position identification process. In the mobile process, the center point of the substrate identified in the position identification process is determined based on the position O _1, by a set of nip portion 20 'so that it moves to the rotation center point O 31 on the platform _3.

In addition, the substrate processing method of the present invention may also be a position identification process in one aspect, which is a position identification process for identifying the center point O ₁ of the substrate 10 placed on the rotating platform 31, based on the clamping process When the substrate 10 is clamped, the distance between the clamping parts 20 ′ of a group is used to identify the center point O _{1 of the} substrate 10.

In addition, in one aspect, the substrate processing method of the present invention preferably includes a liquid supply process of supplying a cleaning liquid (liquid) to the substrate 10 after the moving process.

In addition, the substrate processing method of the present invention may in one aspect be that the substrate 10 has a circular shape when viewed from above. In the position identification process, the second arm 23 of a set of clamping parts 20' Two cam followers (first rotating parts) that rotate when abutting against the outer peripheral end of the substrate 10 are formed to clamp the substrate 10.

In addition, the substrate processing method of the present invention, in one aspect, can be through the two cam followers (first rotating parts) 26 and 27 and the first of the clamping parts in the clamping process. Two cam followers (second rotating parts) 43 and 44 are provided in the arm 22 so as to face the outer peripheral end of the substrate 10 and rotate when abutting against the outer peripheral end of the substrate 10 to clamp the substrate 10.

In addition, the substrate processing method of the present invention may in one aspect be that the two cam followers 26 and 27 and the two cam followers 43 and 44 are arranged to connect the two cam followers The line segment A of 26 and 27 and the line segment B connecting the two cam followers 43 and 44 are parallel to each other, and the line segment C connecting the middle point of the line segment A and the middle point of the line segment B is relative to the line segment A and the line segment B is vertical. The distance between the two cam followers 26 and 27 is farther than the distance between the two cam followers 43 and 44.

That is to say, each embodiment of the above-mentioned substrate processing apparatus 100, that is, the substrate processing method of the present invention, is based on the above-mentioned embodiment and the description of FIGS. 1 to 5.

The present invention is not limited to the above-mentioned embodiments. Various changes can be made within the scope disclosed in the item, and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included in the technical scope of the present invention.

[Industrial Utilization]

The present invention can adjust the position of the substrate with respect to the mounting table with high accuracy, and therefore can be widely used in the manufacturing field of industrial products, and can be particularly well used in EBR processing when manufacturing semiconductor devices.

10‧‧‧Substrate

10a‧‧‧Showing

11‧‧‧Next layer

20’‧‧‧Clamping part

22‧‧‧First arm (clamping part)

22a‧‧‧Abutment surface

23‧‧‧Second arm (clamping part)

26、27‧‧‧Cam follower (first rotating part, clamping part)

25a, 25b‧‧‧Drive part (clamping part)

31‧‧‧Rotating Platform (Mounting Table)

32‧‧‧EBR nozzle (liquid supply part)

33‧‧‧Washing cup (cup)

34‧‧‧Drive shaft

66‧‧‧Cleaning device

O ₁ 、O ₃ ‧‧‧center point

A‧‧‧line segment

A ₁ ‧‧‧Midpoint

Claims (16)

A substrate processing apparatus, which is a substrate processing apparatus for processing substrates, is characterized by comprising: a recognizing section for recognizing the size of the substrate; and a position recognizing section for recognizing the center point of the substrate based on the size of the substrate; and a mounting table, Place the above-mentioned substrate; and at least one set of clamping parts for clamping the above-mentioned substrate placed on the above-mentioned mounting table in a planar direction; the above-mentioned set of clamping parts, such that the above-mentioned position discerned by the position recognition part The center point of the substrate is moved to the center point of the mounting table, the substrate processing apparatus is provided with a clamping part of another group different from the clamping part of the above group, and the discriminating part is placed on the mounting table Before the substrate, the size of the substrate is identified based on the distance between the clamping parts of the other group when the clamping parts of the other group clamp the substrate. The substrate processing apparatus described in claim 1 of the patent application, wherein the substrate processing apparatus further includes a conveying section for placing the substrate on the mounting table, and the conveying section is based on the position identified by the position identifying section. At the center of the substrate, the substrate is placed on the mounting table. A substrate processing device, which is a substrate processing device for processing substrates, is characterized by having: A discerning part that discerns the size of the substrate; and a position discerning part that discerns the center point of the substrate based on the size of the substrate; and a mounting table on which the substrate is placed; and at least one set of clamping parts to be placed The substrate on the mounting table is clamped from the plane direction; the clamping part of the above group moves the center point of the substrate recognized by the position recognition part to the center point of the mounting table, the position recognition part , Is a position identification part that identifies the center point of the substrate placed on the mounting table, and the identification part identifies the substrate based on the distance between the clamping parts of the group when the substrate is clamped the size of. The substrate processing apparatus according to any one of claims 1 to 3, further comprising a liquid supply unit that supplies liquid to the substrate whose center point is moved to the center point of the mounting table. A substrate processing apparatus, which is a substrate processing apparatus for processing substrates, is characterized by comprising: a recognizing section for recognizing the size of the substrate; and a position recognizing section for recognizing the center point of the substrate based on the size of the substrate; and a mounting table, Place the above-mentioned substrate; and at least one set of clamping parts for clamping the above-mentioned substrate placed on the above-mentioned mounting table in a planar direction; the above-mentioned set of clamping parts, such that the above-mentioned position discerned by the position recognition part The center point of the substrate is moved to the center point of the mounting table, the shape of the substrate in a plan view is circular, and one of the clamping parts of the above set has a peripheral end portion of the substrate that is arranged opposite to The two first rotating parts will rotate when contacting the outer peripheral end of the substrate. The substrate processing apparatus described in claim 5, wherein the other of the clamping portions of the above-mentioned set is provided with the outer peripheral end portion of the substrate opposed to the outer peripheral end portion of the substrate The two second rotating parts will rotate when connected. According to the substrate processing apparatus described in claim 6, wherein the two first rotating parts and the two second rotating parts are arranged to connect the line segment A of the two first rotating parts , And the line segment B connecting the two second rotating parts are parallel to each other, and the line segment C connecting the middle point of the line segment A and the middle point of the line segment B is perpendicular to the line segment A and the line segment B, the two The distance between the first rotating parts is farther than the distance between the two second rotating parts. The substrate processing apparatus described in any one of items 1 to 3 or 5 to 7 of the scope of patent application, wherein the surface on which the substrate is placed in the mounting table is provided with a device for adsorbing the substrate Adsorption part. The substrate processing apparatus described in any one of items 1 to 3 or 5 to 7 of the scope of patent application, wherein a cup is provided around the outer periphery of the substrate placed on the mounting table , To move the center point of the substrate identified by the position identifying unit to The clamping portion of the set at the center point of the mounting table clamps the substrate above the cup. A substrate processing method, which is a substrate processing method for processing substrates, is characterized by including: a position identification process, identifying the center point of the substrate; and a placing process, placing the substrate on a placing table; and a clamping process, With at least one set of clamping parts, the substrate placed on the mounting table is clamped from the plane direction; and moving the process to make the center point of the substrate identified in the position identification process, by The clamping part of the above group is moved to the center point of the mounting table; in the position identification process, before the mounting process, the clamping part of the other group is different from the clamping part of the above group The distance between the clamping parts of the other group when clamping the substrate is used to identify the center point of the substrate. The substrate processing method according to the 10th patent application, wherein, in the above-mentioned moving process, the center point of the above-mentioned substrate identified in the process is identified based on the position, and the center point of the above-mentioned substrate identified in the process is moved to the above-mentioned On the center point of the mounting table. A substrate processing method, which is a substrate processing method for processing substrates, is characterized by including: a position identification process, identifying the center point of the substrate; and a placing process, placing the substrate on a placing table; and The clamping process is to clamp the substrate placed on the mounting table from the plane direction by at least one set of clamping parts; and to move the process so that the center of the substrate identified in the process can be identified by the position The point is moved to the center point of the mounting table by the above-mentioned set of clamping parts; the position identifying process is a position identifying process for identifying the center point of the substrate placed on the mounting table, based on the above In the clamping process, the distance between the clamping parts of the group when clamping the substrate is used to identify the center point of the substrate. The substrate processing method according to any one of claims 10 to 12 in the scope of patent application, which includes a liquid supply process for supplying liquid to the substrate after the movement process. A substrate processing method, which is a substrate processing method for processing substrates, is characterized by including: a position identification process, identifying the center point of the substrate; and a placing process, placing the substrate on a placing table; and a clamping process, With at least one set of clamping parts, the substrate placed on the mounting table is clamped from the plane direction; and moving the process to make the center point of the substrate identified in the position identification process, by The clamping part of the above group is moved to the center point of the mounting table; the shape of the substrate in a plan view is circular, and in the position identification process, one of the clamping parts of the group is set to When facing the outer peripheral end of the substrate The two first rotating parts that will rotate when the outer peripheral end of the abutting contact, clamp the substrate. The substrate processing method described in claim 14, wherein, in the clamping process, the other one of the two first rotating parts and the clamping part of the group is set to be the same as the above When the outer peripheral end portion of the substrate faces the outer peripheral end portion of the substrate, the two second rotating portions rotate when they abut on the outer peripheral end portion of the substrate to clamp the substrate. According to the substrate processing method described in claim 15, wherein the two first rotating parts and the two second rotating parts are arranged to connect the line segment A of the two first rotating parts , And the line segment B connecting the two second rotating parts are parallel to each other, and the line segment C connecting the middle point of the line segment A and the middle point of the line segment B is perpendicular to the line segment A and the line segment B, the two The distance between the first rotating parts is farther than the distance between the two second rotating parts.

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