CN103282317A - Method for dividing brittle material substrate - Google Patents
Method for dividing brittle material substrate Download PDFInfo
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- CN103282317A CN103282317A CN2011800056247A CN201180005624A CN103282317A CN 103282317 A CN103282317 A CN 103282317A CN 2011800056247 A CN2011800056247 A CN 2011800056247A CN 201180005624 A CN201180005624 A CN 201180005624A CN 103282317 A CN103282317 A CN 103282317A
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- Prior art keywords
- laser beam
- line
- delineation line
- brittle substrate
- intersection area
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
A first scribe line (52a) comprising a perpendicular crack (53a) and a second scribe line (52b) comprising a perpendicular crack (53b) are formed by laser beam (LB) irradiation and the spray of a cooling medium from a cooling nozzle (37). The second scribe line (52b) is again irradiated with the laser beam (LB) to extend the perpendicular crack (53b), and a substrate (50) is fractured at the second scribe line (52b). Next, the intersection point region between a fracture line (54) and the first scribe line (52a) is covered with a glass plate (61) and water droplets (62). Then, the first scribe line (52a), except for the intersection region, is again irradiated with the laser beam (LB) to extend the perpendicular crack (53a), and the substrate (50) is fractured at the first scribe line (52a). This suppresses the occurrence of splintering at the point of intersection in a case where a brittle material substrate is fractured in two intersecting directions using a laser.
Description
Technical field
The invention relates to brittle substrate irradiating laser light beam the method for brittle substrate being cut off along two directions that cross one another.
Background technology
In the past, as the cut-off method of brittle substrates such as glass substrate or ceramic substrate, be to make the break bar equipressure switch through moving and form to delineate after the line, apply the method that external force is cut off substrate along the delineation line from vertical direction.
Usually, in the occasion of using break bar to carry out the delineation of brittle substrate, the mechanical type stress of brittle substrate being given with break bar is easy to generate the defective of substrate, and the breaking of above-mentioned defective that result from when fractureing etc. can generation.
At the problems referred to above, use method that laser cuts off brittle substrate practicability in recent years.This method be with laser beam to substrate irradiation and with substrate be heated to melt temperature less than after, by with the cooling medium with the substrate cooling and make aforesaid base plate produce thermal stresses, make slight crack former from the surface of substrate in the approximate vertical direction with this thermal stresses.Using the cut-off method of the brittle substrate of laser beam with this is to utilize thermal stresses, so can not make the direct contact substrate of instrument, the face of cutting off becomes less level and smooth face such as break, and keeps the intensity of substrate.
In addition, for example in the also motion method of using laser in two directions that cross one another brittle substrate to be cut off of patent documentation 1.This motion method is to brittle substrate irradiating laser light beam and after forming the 1st slight crack of hemisection state, form equally the 2nd slight crack of the hemisection state that the 1st slight crack is intersected by the irradiation of laser beam, secondly to the 1st slight crack and the 2nd slight crack irradiating laser light beam and do not cut the person entirely once again.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2001-130921 communique
Summary of the invention
[problem that the invention desire solves]
Yet, as above-mentioned motion method to the 1st slight crack and the 2nd slight crack irradiating laser light beam and when brittle substrate cut entirely, may the generation of breaking partly be arranged at the intersection point of the 1st slight crack and the 2nd slight crack once again.If at the intersection point of the brittle substrate that becomes the bight after cutting off the generation of breaking is arranged partly, the cullet that the dimensional precision of the brittle substrate after cutting off can reduce and take place adheres to etc. substrate surface and becomes the reason of problem.
The present invention be Given this plant in the past problem and the person of being, its purpose is to be provided at the method that the occasion of using laser in two directions that cross one another brittle substrate to be cut off suppresses the generation of breaking of intersection point part.
[solving the means of problem]
According to the present invention, a kind of cut-off method of brittle substrate is provided, comprise: the 1st delineation line that is constituted by vertical slight crack that will cross one another and the 2nd step that forms at brittle substrate of delineation line, laser beam is relatively moved shine simultaneously and make aforementioned vertical slight crack stretching, extension and delineate line and the 2nd with the 1st and delineate the step that line cuts off aforesaid base plate along the 1st delineation line and the 2nd delineation line, it is characterized in that:
Laser beam irradiation amount toward the intersection area of the 1st delineation line and the 2nd delineation line is reduced than the laser beam irradiation amount beyond the intersection area.
At this, making toward the 1st delineation line and the 2nd laser beam irradiation amount of delineating the intersection area of line is the more satisfactory below 50% of intersection area laser beam irradiation amount in addition.
In addition, by the output of control laser beam, past the 1st delineation line and the 2nd laser beam irradiation amount of delineating the intersection area of line are reduced also can.In addition, the intersection area of the 1st delineation line and the 2nd being delineated line covers with the lining member that laser beam is absorbed or reflects, and makes toward the laser beam irradiation amount minimizing of aforementioned intersection area and also can.In addition, the intersection area of the 1st delineation line and the 2nd being delineated line covers with the liquid that laser beam is absorbed or reflects, and makes toward the laser beam irradiation amount minimizing of aforementioned intersection area and also can.
In addition, aforementioned intersection area is to have the regional more satisfactory of width below the 5mm at the intersection point of delineating line from the 1st delineation line and the 2nd respectively toward relatively move direction upstream side and the downstream side of laser beam.
In addition, the 1st delineation line and the 2nd delineation line are to aforesaid base plate laser beam to be relatively moved to shine simultaneously, with aforesaid base plate be heated to be melt temperature less than after, afterwards aforesaid base plate is blowed the cooling medium with cooling, to form more satisfactory by the thermal stresses that produces at aforesaid base plate.
[effect of invention]
According to the cut-off method of brittle substrate of the present invention, can be in the generation of breaking that when two directions that cross one another are cut off brittle substrate, suppresses the intersection point part.Whereby, the dimensional precision of the brittle substrate after cutting off upwards and especially suppresses to result from the problem of cullet.
Description of drawings
Fig. 1 is the generalization figure that shows one of the chopping up apparatus can implement cut-off method of the present invention example.
Fig. 2 is the figure of the operational stage of explanation laser grooving and scribing.
Fig. 3 is the block diagram that shows one of cut-off method of the present invention example.
Fig. 4 shows toward the irradiation dose of the intersection area of laser beam LB to adjust example and figure in the laser radiation amount of intersection area.
Fig. 5 shows toward the irradiation dose of the intersection area of laser beam LB to adjust example and figure in the laser radiation amount of intersection area.
Fig. 6 is the figure of the example of the occasion that shows that the member that will be covered toward the irradiation dose adjustment of the intersection area of laser beam LB carries out.
Fig. 7 is the figure that shows the example of the occasion that will carry out with liquid toward the irradiation dose adjustment of the intersection area of laser beam LB.
[main element nomenclature]
Embodiment
Though below be described in more detail at the cut-off method of brittle substrate of the present invention, the present invention is not limited to these and implements kenel.
Fig. 1 is the generalization figure that shows one of the chopping up apparatus can implement cut-off method of the present invention example.In the chopping up apparatus of Fig. 1, pallet 11 possess to paper vertical direction (Y-direction) movably sliding platform 12, on the sliding platform 12 the left and right directions (directions X) of figure movably pedestal 19, be located at the rotating mechanism 25 on the pedestal 19, mounting, to be fixed in the brittle substrate 50 of being located at the rotation platform 26 on this rotating mechanism 25 be to move freely in horizontal plane by these mobile means.
In addition, pedestal 19 is to prop up movably to be held on sliding platform 12 every both a pair of guide members 21 of set a distance configured in parallel.In addition, but between a pair of guide member 21, be provided with abreast by the ball screw 22 of forward and backward with motor 23 with a pair of guide member 21.In addition, establish ball nut 24 in the bottom surface of pedestal 19.This ball nut 24 is screwed together in ball screw 22.By ball screw 22 forward or reverse, ball nut 24 moves at directions X, and pedestal 19 moves at directions X on a pair of guide member 21 with ball nut 24 whereby.
Establish rotating mechanism 25 at pedestal 19.In addition, establish rotation platform 26 at this rotating mechanism 25.For the brittle substrate 50 that cuts off object is fixed with vacuum adsorption on rotation platform 26.Rotating mechanism 25 makes rotation platform 26 around the central shaft rotation of vertical direction.
Above rotation platform 26, support platform 31 to support so that separate subtend with rotation platform 26 with the retaining member 33 that hangs down from erecting bed 32.At the break bar of supporting platform 31 to be made as to form on the surface of brittle substrate 50 to trigger slight crack 35, for to the opening (not illustrating) of brittle substrate 50 irradiating laser light beams, for the surface-cooled cooling jet 37 with brittle substrate 50.
Establish laser output device 34 at erecting bed 32.Reflect toward belows with speculum 44 from the laser beam LB of laser output device 34 ejaculations, shine toward the brittle substrate 50 that is fixed on the rotation platform 26 from being formed at the opening of supporting platform 31 by the optical system that remain in the retaining member 33.
In addition, there is the water as the cooling medium to spray with air near the cooling jet 37 the opening of being located at laser beam LB ejaculation of supporting platform 31 toward brittle substrates 50.Position on the brittle substrate 50 of cooling medium ejection is being cut off on the preset lines 51 and the rear side of the irradiation area of laser beam LB (with reference to Fig. 2).
Establish a pair of CCD camera 38,39 of the alignment mark that identification is imprinted at brittle substrate 50 in advance at erecting bed 32.Position skew when detecting the setting of brittle substrate 50 with these a pair of CCD camera 38,39, for example in the amount of the occasion rotation platform 26 rotation-θ of brittle substrate 50 deviation angle θ, the occasion sliding platform 12 of brittle substrate 50 offset Y moves-amount of Y.
In the occasion of in the chopping up apparatus of this kind formation, brittle substrate 50 being cut off earlier with brittle substrate 50 mounting and fix with the attraction means on the rotation platform 26.Afterwards, take the alignment mark of being located at brittle substrate 50 with a pair of CCD camera 38,39, based on shooting data brittle substrate 50 is positioned set position as described above.
Secondly, form the triggering slight crack with 35 pairs of brittle substrates of break bar 50 as described above.Afterwards, penetrate laser beam LB from laser output device 34.Laser beam LB as shown in Figure 2, generally perpendicularly shines the surface of brittle substrate 50 by speculum 44.In addition, the water as the cooling medium is sprayed from cooling jet 37.By to brittle substrate 50 irradiating laser light beam LB, brittle substrate 50 at thickness direction with melt temperature less than heating, brittle substrate 50 is desired thermal expansions, but because of local heating so there is stress under compression to take place centered by the point of irradiation that can't expand.In addition, brittle substrate 50 is to shrink and have tensile stress to take place specifically with water cooling by the surface of brittle substrate 50 at once after heating.By the effect of this tensile stress, be that starting point forms vertical slight crack 53 along cutting off preset lines 51 in brittle substrate 50 to trigger slight crack.
By laser beam LB and cooling jet 37 are relatively moved along cutting off preset lines 51, vertical slight crack 53 stretches and has delineation line 52 to form at brittle substrate 50 afterwards.Be fixed at laser beam LB and cooling jet 37 in the occasion of this example under the state of both allocations by the rotating mechanism 25 of sliding platform 12, pedestal 19, rotation platform 26 and brittle substrate 50 moves.Certainly, it is also harmless under the state that brittle substrate 50 is fixed laser beam LB and cooling jet 37 to be moved.Or make brittle substrate 50 and the both sides of laser beam LB and cooling jet 37 move also harmless.
Secondly, at cut-off method explanation of the present invention.Fig. 3 shows the block diagram of one of cut-off method of the present invention example.Shown in figure (a), by laser beam LB and cooling jet 37 are relatively moved along cutting off preset lines 51, making with not illustrated triggering slight crack is that the vertical slight crack 53a of starting point stretches and has the 1st delineation line 52a to form at brittle substrate 50 in the direction that relatively moves.
Be not particularly limited as laser beam LB as used herein, by material or the thickness of substrate, want the degree of depth etc. of the vertical slight crack that forms suitably to determine to get final product.Brittle substrate is the occasion of glass substrate, uses suitably at the laser beam of bigger wavelength 9～11 μ m of the absorption of glass baseplate surface.
Can enumerate carbon dioxide laser as this kind laser beam.Shot shape as the past substrate of laser beam is more satisfactory at the elongated elliptical shape of the direction that relatively moves of laser beam, and the illumination length L of the direction that relatively moves is the scope of 10～60mm, and irradiating width W is that the scope of 1～5mm is more suitable.
Can enumerate water or alcohol etc. as make the cooling medium of ejection from cooling jet 37.In addition, can not giving dysgenic scope on the brittle substrate after cutting off in use, to add additive such as interfacial agent also harmless.It is more suitable to be generally several ml/min degree as the amount of blowing of cooling off medium.The cooling of the substrate that causes of cooling medium will be from will being to make water more satisfactory with the so-called water jet mode of gas (being generally air) injection with the viewpoint of the substrate chilling of laser beam heating.The cooled region that the cooling medium cause is that toroidal or the elliptical shape of major diameter 1～5mm degree is more satisfactory.In addition, forming distance between the central point of relatively move direction rear and cooled region and heating region that cooled region is the heating region that causes of laser beam, to become several mm～tens of mm degree more satisfactory.
Relative moving speed as laser beam LB and cooling jet 37 is not particularly limited, and is suitably determined to get final product by the degree of depth of the vertical slight crack that goes for etc.Generally more make relative moving speed slow, the vertical slight crack of formation is just all the more dark.Usually, speed of relative movement is hundreds of mm/sec degree.
Though the degree of depth as the vertical slight crack 53a that constitutes the 1st delineation line 52a is not particularly limited, but in order to increase the condition for irradiating laser light beam that brittle substrate is cut off of back step, for example the nargin of relative moving speed or laser output etc. makes to more satisfactory with respect to the degree of depth of substrate thickness more than 25%.
Secondly shown in Fig. 3 (b), by making laser beam LB and cooling jet 37 relatively move to form the 2nd delineation line 52b along the preset lines 51b that cuts off to the 1st delineation line 52a quadrature.Also can enumerate at this as the formation condition of the 2nd delineation line 52b and formation condition the same terms of the 1st delineation line 52a.
Secondly, shown in figure (c), delineate line 52b irradiating laser light beam LB once again along the 2nd.Vertical whereby slight crack 53b stretches in the substrate thickness direction, cuts off brittle substrate 50 and forms and cut off line 54 with the 2nd delineation line 52b.In addition, as long as do not apply the degree of depth that external force is cut off brittle substrate 50 just vertical slight crack 53b extends to, not necessarily to arrive the reverse side of brittle substrate 50.
Though for the illuminate condition that makes the laser beam LB that vertical slight crack 53b stretches in the substrate thickness direction as long as suitably determined by the thickness of brittle substrate 50 or the degree of depth of vertical slight crack 53b etc., form the aforesaid the 2nd illuminate condition when delineating line 52b usually in this also illustration.
Secondly, shown in figure (d), delineate line 52a irradiating laser light beam LB once again along the 1st.Vertical whereby slight crack 53a stretches in the substrate thickness direction, cuts off brittle substrate 50 with the 1st delineation line 52a.The degree of depth of the substrate thickness direction of the vertical slight crack 53a after the stretching, extension and the occasion of vertical slight crack 53b similarly, as long as just extend to and do not apply the degree of depth that external force is cut off brittle substrate 50, not necessarily will arrive the reverse side of brittle substrate 50.
At this, focus on making during irradiating laser light beam LB once again along the 1st delineation line 52a toward the irradiation dose minimizing than other parts of the irradiation dose of the 1st delineation line 52a and the laser beam LB of the intersection area of cutting off line 54.By as above-mentioned making toward the irradiation dose of the 1st delineation line 52a and the laser beam LB of the intersection area of cutting off line 54 irradiation dose than other parts reduce the breaking partly of the intersection point that becomes the bight after effectively suppressing to cut off.Comparatively ideal laser beam irradiation amount in the intersection area is below 50% of laser beam irradiation amount beyond the intersection area, and more satisfactory is below 10%, and better is 0%.
In addition, though be to reduce making during irradiating laser light beam LB once again along the 1st delineation line 52a toward the irradiation dose of the 1st delineation line 52a and the laser beam LB of the intersection area of cutting off line 54 irradiation dose than other parts at the example of above explanation, the irradiation dose toward the laser beam LB of intersection area also can than the irradiation dose minimizing of other parts.Perhaps also can than the irradiation dose minimizing of other parts with make the irradiation dose toward the laser beam LB of intersection area once again during irradiating laser light beam LB along the 2nd delineation line 52b during irradiating laser light beam LB once again along the 1st delineation line 52a.
The adjustment of the irradiation dose of the laser beam LB of the intersection area of past the 1st delineation line 52a and the 2nd delineation line 52b is that the control of for example output of laser beam is carried out.With the point of irradiation of laser beam with optical system such as cylindrical lens make in the occasion of the elongated elliptical shape of the direction that relatively moves of laser beam shown in Fig. 4 (a), centered by the 1st delineation line 52a and the 2nd delineates the intersection point of line 52b, contain to the set scope of downstream side from the direction upstream side that relatively moves of laser beam LB and to establish the not zone of irradiating laser light beam LB.The irradiation dose of laser beam LB is at this moment shown at Fig. 4 (b).As being understood by Fig. 4 (b), the irradiation dose of laser beam LB is to reduce gradually from common irradiation dose toward the 1st delineation line 52a and the 2nd intersection point of delineating line 52b, after intersection point becomes 0, increases gradually and returns common irradiation dose.As above-mentioned, reduce with the irradiation dose of the laser beam of the intersection area of the 2nd delineation line 52b by making toward the 1st delineation line 52a, suppress the generation of breaking of intersection point in partly.
Zone as the irradiation dose minimizing that makes laser beam LB, that is the intersection area of the 1st delineation line 52a and the 2nd delineation line 52b, be to have the regional more satisfactory of width below the 5mm at the intersection point of delineating line 52b from the 1st delineation line 52a and the 2nd respectively toward relatively move direction upstream side and the downstream side of laser beam LB.
In addition, use mirror polygon or inspection stream mirror, round tube type speculum etc. to scan and make to be the occasion at the elongated elliptical shape of the direction that relatively moves of laser beam, the laser intensity in the point of irradiation to become evenly and also can contain set scope to make the laser radiation amount be 0 at the point of irradiation that makes laser beam LB.Fig. 5 (a) show with the irradiating state of laser beam LB through the time figure that shows of ground.After laser beam LB arrives the 1st delineation line 52a and delineates the intersection area of line 52b with the 2nd, scanning and make laser generation for closing in the intersection area, is unlatching but just make laser generation after going out outside intersection area.Whereby, shown in Fig. 5 (b), can make the irradiation dose of laser beam LB of delineating the intersection area of line 52b toward the 1st delineation line 52a and the 2nd is 0.
Show other the means of irradiation dose of laser beam LB of delineating the intersection area of line 52b toward the 1st delineation line 52a and the 2nd of adjusting at Fig. 6.Be that the means that this figure shows are that the 1st delineation line 52a is covered with lining member 61 with the intersection area of the 2nd delineation line 52b, make the irradiation dose minimizing of laser beam LB of delineating the intersection area of line 52b toward the 1st delineation line 52a and the 2nd.If utilize this means, there is not necessity of the control that laser generation is opened, closed of example as described above, the simple operation of the mounting of the member 61 that can be covered reduces the irradiation dose of laser beam LB.
So long as the member that laser beam LB is absorbed or reflects just is not particularly limited, for example, can enumerate metal sheets such as glass substrate or aluminium, dry ice etc. as the lining member 61 that uses in the present invention.Be to absorb laser beam LB with glass substrate in the occasion of using glass substrate, thus can its material or thickness etc. adjust toward the irradiation dose of the laser beam LB of brittle substrate 50.In addition, be that laser beam LB becomes 0 in the irradiation dose of the past brittle substrate 50 of metal sheet reflection event in the occasion of using metal sheets such as aluminium.
Show that at Fig. 7 adjustment is toward other the means again of the irradiation dose of the laser beam LB of the intersection area of the 1st delineation line 52a and the 2nd delineation line 52b.Be that the means that this figure shows are that the 1st delineation line 52a is covered with liquid 62 with the intersection area of the 2nd delineation line 52b, make the irradiation dose minimizing of laser beam LB of delineating the intersection area of line 52b toward the 1st delineation line 52a and the 2nd.If utilize this means, with above-mentioned example necessity of the control that laser generation is opened, closed of example as described above not similarly, can liquid 62 drip, simple operation such as coating reduces the irradiation dose of laser beam LB.
So long as the member that laser beam LB is absorbed or reflects just is not particularly limited, for example, water or alcohol etc. use suitably as the liquid 62 that uses in the present invention.Toward adhering to of the liquid 62 of the intersection area of brittle substrate 50 be for example washer etc. drip or coating waits to carry out.Though be as long as suitably determined by the kind of the laser of the size of intersection area, use or output etc. as the adhesion amount of liquid 62, be that the scope of common 0.01mL～0.05mL is more satisfactory in the occasion that makes water.
More than, though be that the 1st delineation line 52a and the 2nd delineation line 52b are respectively formed 1 and substrate is cut off at each example of explanation, large-area brittle substrate 50 with the 1st delineation line 52a and the 2nd delineate line 52b form respectively many cut off again into the occasion cut-off method of the present invention of a plurality of small area substrates also applicable certainly.In addition, cut-off method of the present invention is except the occasion that makes two delineation line quadratures, and is also applicable certainly in the occasion that makes intersection point with the angle of being hoped.
[embodiment]
Use forms many delineation line of mutually orthogonal so that its intersection point becomes 40 in the chopping up apparatus that Fig. 1 shows at the chemical enhanced soda glass substrate of thickness 0.55mm, after cutting off along a side's who forms delineation line irradiating laser light beam and with substrate, at the intersection area mounting sheet glass (5mm*5mm* thickness 0.4mm) of the delineation line that cuts off line and the opposing party.Afterwards, along aforementioned the opposing party's delineation line irradiating laser light beam and substrate is cut off to a plurality of.Cutting off of glass substrate is to use the method that shows at Fig. 3 to carry out.To the results are shown in table 1.In addition, the concrete illuminate condition of laser beam such as following.
(the laser beam irradiation condition that the 1st delineation line 52a forms)
Laser species: carbon dioxide laser
Laser output: 100W
Relative moving speed: 100mm/sec
Laser spots: ellipse
(the laser beam irradiation condition that the 2nd delineation line 52b forms)
Laser species: carbon dioxide laser
Laser output: 120W
Relative moving speed: 200mm/sec
Laser spots: ellipse
(the laser beam irradiation condition that laser fractures)
Laser species: carbon dioxide laser
Laser output: 320W
Relative moving speed: 1500mm/sec
Laser spots: ellipse
Comparative example 1
Not having beyond the mounting sheet glass in intersection area is to make to carry out cutting off of substrate similarly to Example 1.The result is shown together at table 1.
Table 1
" break ": at intersection point the generation of breaking is arranged partly
" intersection point jump ": the direction downstream side that relatively moves from intersection point toward laser beam cuts off line and does not stretch
As being understood by table 1, be good for cutting off at all intersection points among 40 intersection points with respect to the method with embodiment 1, have only 3 intersection points for cutting off well with the cut-off method of comparative example 1, at all the other 37 intersection points the generation of breaking is arranged.
Embodiment 2
(adhesion amount: 0.04mL, diameter 8～10mm) antinode zones are to make to carry out cutting off of substrate similarly to Example 1 beyond adhering to make the water that replaces sheet glass.The result is shown at table 2.In addition, the concrete illuminate condition of laser beam such as following.
(the laser beam irradiation condition that the 1st delineation line 52a forms)
Laser species: carbon dioxide laser
Laser output: 100W
Relative moving speed: 100mm/sec
Laser spots: ellipse
(the laser beam irradiation condition that the 2nd delineation line 52b forms)
Laser species: carbon dioxide laser
Laser output: 130W
Relative moving speed: 180mm/sec
Laser spots: ellipse
(the laser beam irradiation condition that laser fractures)
Laser species: carbon dioxide laser
Laser output: 240W
Relative moving speed: 1500mm/sec
Laser spots: ellipse
Comparative example 2
Not making water droplet adhere in addition in intersection area is to make to carry out cutting off of substrate similarly to Example 2.The result is shown together at table 2.
Table 2
As being understood by table 2, with respect to being good for cutting off at all intersection points among 40 intersection points with the cut-off method that makes the embodiment 2 that water droplet adheres in intersection area, cut-off method with comparative example 2 has only 2 intersection points good for cutting off, and at all the other 38 intersection points the generation of breaking is arranged.
[utilizability on the industry]
Utilize cut-off method of the present invention, can suppress the intersection point generation of breaking partly in the occasion of using laser in two directions that cross one another brittle substrate to be cut off, very useful.
Claims (7)
1. the cut-off method of a brittle substrate, comprise: the 1st delineation line that is constituted by vertical slight crack that will cross one another and the 2nd step that forms at brittle substrate of delineation line, laser beam is relatively moved shine simultaneously and make aforementioned vertical slight crack stretching, extension and delineate line and the 2nd with the 1st and delineate the step that line cuts off aforesaid base plate along the 1st delineation line and the 2nd delineation line, it is characterized in that:
When the 1st delineation line and/or the 2nd delineation line irradiating laser light beam, the laser beam irradiation amount of the intersection area of past the 1st delineation line and the 2nd delineation line is reduced than the laser beam irradiation amount beyond the intersection area.
2. the cut-off method of brittle substrate as claimed in claim 1 is characterized in that wherein,
Making toward the 1st delineation line and the 2nd laser beam irradiation amount of delineating the intersection area of line is intersection area below 50% of laser beam irradiation amount in addition.
3. the cut-off method of brittle substrate as claimed in claim 1 or 2 is characterized in that wherein,
By the output of control laser beam, make toward the 1st laser beam irradiation amount of delineating the intersection area of line and the 2nd delineation line and reduce.
4. the cut-off method of brittle substrate as claimed in claim 1 or 2 is characterized in that wherein,
Lining member with absorption or reflect beams of laser light covers the 1st delineation line and the 2nd intersection area of delineating line, makes toward the laser beam irradiation amount of aforementioned intersection area and reduces.
5. the cut-off method of brittle substrate as claimed in claim 1 or 2 is characterized in that wherein,
Liquid with absorption or reflect beams of laser light covers the 1st delineation line and the 2nd intersection area of delineating line, makes toward the laser beam irradiation amount of aforementioned intersection area and reduces.
6. as the cut-off method of the described brittle substrate of arbitrary claim in the claim 1 to 5, it is characterized in that wherein,
Aforementioned intersection area is the zone that has the width below the 5mm at the intersection point of delineating line from the 1st delineation line and the 2nd toward relatively move direction upstream side and the downstream side of laser beam respectively.
7. as the cut-off method of the described brittle substrate of arbitrary claim in the claim 1 to 6, it is characterized in that wherein,
The 1st delineation line and the 2nd delineation line are that aforesaid base plate is made the laser beam irradiation that relatively moves simultaneously, with aforesaid base plate be heated to be melt temperature less than after, aforesaid base plate is blowed the cooling medium with cooling, to form by the thermal stresses that produces at aforesaid base plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2011/079842 WO2013094059A1 (en) | 2011-12-22 | 2011-12-22 | Method for fracturing brittle material substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103282317A true CN103282317A (en) | 2013-09-04 |
| CN103282317B CN103282317B (en) | 2015-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201180005624.7A Expired - Fee Related CN103282317B (en) | 2011-12-22 | 2011-12-22 | The cut-off method of brittle substrate |
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| Country | Link |
|---|---|
| KR (1) | KR101442067B1 (en) |
| CN (1) | CN103282317B (en) |
| WO (1) | WO2013094059A1 (en) |
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| CN105436712A (en) * | 2015-12-07 | 2016-03-30 | 武汉铱科赛科技有限公司 | Brittle slivering method and system for brittle semiconductor material |
| TWI644872B (en) * | 2014-06-13 | 2018-12-21 | 日商三星鑽石工業股份有限公司 | Cracking device for brittle material substrate |
| CN109873050A (en) * | 2019-02-22 | 2019-06-11 | 北京铂阳顶荣光伏科技有限公司 | Preparation method of solar battery and system |
| CN110465755A (en) * | 2019-07-10 | 2019-11-19 | 阜宁苏民绿色能源科技有限公司 | A method of improving mark point crack |
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| CN109080005B (en) * | 2018-08-20 | 2020-10-02 | 衡阳恒裕轻质保温材料有限责任公司 | High-precision cutting device for aerated concrete blocks |
| TWI681241B (en) * | 2018-12-04 | 2020-01-01 | 友達光電股份有限公司 | Manufacturing method for display device and display device utilized thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103282317B (en) | 2015-12-16 |
| WO2013094059A1 (en) | 2013-06-27 |
| KR20130094173A (en) | 2013-08-23 |
| KR101442067B1 (en) | 2014-09-19 |
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