JP2011103404A - Substrate dividing device and method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate dividing device that can lower production costs and can divide a substrate with high precision, and to provide a method of manufacturing an electronic component. <P>SOLUTION: The substrate dividing device includes first to third pressing units 31 to 33, and divides the substrate 1 stuck on a spread film 2 into individual electronic components in accordance with a division groove 12 formed in the substrate 1. The first pressing unit 31 presses the substrate 1 in accordance with the division groove 12. Further, the second and third pressing units 32 and 33 simultaneously press the substrate 1 with equal pressure P2 and P3 along the division groove 12 in a direction opposite from a pressing direction of the first pressing unit 31 at positions S2 and S3 at an equal distance (d) on both sides across the division groove 12. Consequently, the substrate 1 is bent at the division groove 12 as a fulcrum, and balanced uniform pressure is applied to both sides with the division groove 12 as a center. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate dividing apparatus and an electronic component manufacturing method.

  With the spread of small electronic devices equipped with wireless communication functions such as cellular phones and netbook personal computers, the demand for high-frequency electronic components such as filters used in these devices is increasing.

  In the manufacturing process of electronic components, individual electronic components are obtained by dividing a sheet-like laminated substrate on which a predetermined circuit pattern is printed into a plurality of pieces. Therefore, this division method greatly affects the quality and yield of electronic components.

  As a dividing method, for example, in Patent Document 1, dividing grooves are formed in advance on both surfaces of the substrate, and the end of the dividing table for placing the substrate and the fixing pressing portion are aligned with the dividing grooves. Discloses a technique of pressing and splitting a substrate by sandwiching the substrate and pressing a dividing blade (blade).

  However, according to this method, since the dividing grooves are formed on both surfaces of the substrate, the number of processes is large compared to the case where the dividing grooves are formed only on one surface, which is disadvantageous in terms of production cost. Also, if the dividing groove is formed only on one surface and the dividing is performed, the other end side is pressed while holding the one end of the substrate, so that it is influenced by the bending of the substrate, and is not regulated from the dividing groove. Cracks may occur in the direction, and a defect may occur at the edge of the substrate.

  Also, unlike this, there can be a method in which both sides of the dividing groove are supported from below by a separate dividing table, and the dividing blade is pressed against the dividing groove from above the substrate to divide the substrate. In order to support the substrate over the entire surface, the pressure by the dividing blade is dispersed when the substrate is divided in the vicinity of the end portion, and the same problem may occur.

JP-A-2005-45024

  An object of the present invention is to provide a substrate dividing apparatus and a method for manufacturing an electronic component that can reduce a production cost and can divide a substrate with high accuracy.

  In order to solve the above-described problems, a substrate dividing apparatus according to the present invention includes a first pressing portion, a second pressing portion, and a third pressing portion, and is attached to a stretched film. The substrate is divided into pieces of electronic components according to the dividing grooves formed on the substrate.

  The first pressing portion presses the substrate according to the dividing groove. Further, the second pressing portion and the third pressing portion are respectively arranged at the equidistant positions on both sides of the dividing groove in the direction opposite to the pressing direction of the first pressing portion. And simultaneously pressing the substrate with the same pressure.

  According to the substrate dividing apparatus according to the present invention, the first pressing portion presses the substrate according to the dividing groove, while the second and third pressing portions are respectively the first pressing portions on both sides of the dividing groove. Since the substrate is pressed in the direction opposite to the pressing direction of the part, the substrate is bent with the dividing groove as a fulcrum. In addition, the second and third pressing portions press the substrate at the same distance along the dividing groove at the same distance from the dividing groove at the same pressure. Pressure will be applied.

  Therefore, the substrate dividing apparatus according to the present invention can generate a cross section in the thickness direction from the dividing groove without causing the above-described cracks and defects, and can divide the substrate with high accuracy.

  At this time, if there is at least one dividing groove, the substrate can be divided starting from that, so there is no need to form dividing grooves on both sides of the substrate. Therefore, the board | substrate division | segmentation apparatus which concerns on this invention can reduce the manufacturing process of an electronic component, and can reduce production cost.

  In addition, since the substrate dividing apparatus according to the present invention supports the entire substrate by the film and does not require support by the dividing table, the substrate can be divided with high accuracy regardless of the position on the substrate.

  On the other hand, the method for manufacturing an electronic component according to the present invention divides a substrate attached to a stretched film into pieces according to a dividing groove formed on the substrate.

  In this manufacturing method, the substrate is pressed in a predetermined direction according to the dividing groove, and at the equidistant positions on both sides of the dividing groove, in the direction opposite to the predetermined direction, along the dividing groove. By simultaneously pressing the substrate with the same pressure, the substrate is divided into the pieces.

  Since the electronic component manufacturing method according to the present invention has the same configuration as that of the above-described substrate dividing apparatus, the same effect is obtained.

  As described above, according to the present invention, it is possible to provide a substrate dividing apparatus and an electronic component manufacturing method capable of reducing the production cost and dividing the substrate with high accuracy.

It is a flowchart which shows the manufacturing process of an electronic component. It is a top view of a board | substrate. It is sectional drawing of a part of board | substrate. It is an oblique view of the substrate after scribe. It is sectional drawing of a part of board | substrate after scribe. It is a block diagram of the board | substrate division | segmentation apparatus based on this invention. The effect of the substrate dividing apparatus will be described. It is an electron micrograph which shows the cross section of the electronic component obtained after the division | segmentation. It is an electron micrograph which shows the cross section of the electronic component obtained after the division | segmentation. The board | substrate area | region used as a division | segmentation test object is shown. The result of a division test is shown. The result of a division test is shown.

  FIG. 1 is a flowchart showing a manufacturing process of an electronic component. The substrate targeted by the present invention requires the dividing step St4 in order to obtain an electronic component as a final product, and representative examples thereof include a ceramic green sheet laminated substrate or an alumina multilayer substrate. Electronic components obtained from such a substrate include not only capacitors and inductors, but also high-frequency filters, antenna modules for cellular phones, duplexers, and the like. In the following embodiments, a laminated substrate of ceramic green sheets, that is, a laminated body of LTCC will be described as an example.

  The manufacturing process of the electronic component is roughly divided into a stacking process St1, a scribe process St2, a firing process St3, and a dividing process St4.

  The stacking step St1 is a step of stacking a plurality of green sheets on which circuit patterns such as through holes and electrodes are formed and printed, and pressing them by a process such as isostatic pressing to obtain a substrate. The scribing step St2 is a step of forming a dividing groove along the dividing line of the substrate by laser scribing. The firing step St3 is a step of firing the substrate. The cutting step St4 is a step to which the present invention is applied, and is a step of obtaining an electronic component by dividing the laminate into pieces according to the dividing grooves using a substrate dividing apparatus. This will be specifically described below.

  FIG. 2 is a plan view of the substrate obtained through the stacking process St1. The substrate 1 is a collective substrate formed by arranging a plurality of electronic components 11 vertically and horizontally. The electronic component 11 has two pairs of external terminal electrodes T1, T2 facing each other on each surface. The external terminal electrodes T1 and T2 are bottom surface terminal electrodes for connecting the electronic component 11 to the substrate. For example, one external terminal electrode T1 is an input terminal and an output terminal for signals, and the other external terminal electrode T2 is used. Is a ground terminal.

  Divided lines Lx and Ly serving as reference lines when the electronic component 11 is separated into pieces are set on the substrate 1. Here, the dividing line Lx is a line parallel to the X axis shown in the drawing, and the dividing line Ly is a line parallel to the Y axis shown in the drawing. The interval between the division lines Lx and Ly is appropriately set according to the size of the electronic component 11.

  FIG. 3 is a partial cross-sectional view of the substrate along the line III-III in FIG. The substrate 1 has a layered structure in which a plurality of green sheets L are stacked. The green sheet L has a thickness of approximately 20 to 40 (μm), and the number of stacked layers is appropriately determined according to the design of the electronic component 11. The green sheet L contains a glass component, a ceramic component, a binder component, a plasticizer, an organic solvent, and the like.

  On the surface of each green sheet L, external electrodes T1, T2 and internal electrodes T3 having a predetermined pattern are formed by thin film formation techniques such as sputtering and vapor deposition, printing, plating, or a combination thereof. By forming the internal electrode T3, for example, a capacitor component and an inductor component are created inside the electronic component 11.

  Further, through holes H having a predetermined pattern are formed in the thickness direction of each green sheet L by punching with a punching machine and filling with a conductive paste. The through hole H has a diameter of about 100 (μm), and may be formed, for example, to connect the external electrodes T1 and T2 and the internal electrode T3 as shown in FIG. It may be formed as a part.

  In the scribing process St2, the dividing grooves are formed along the dividing lines Lx and Ly of the substrate 1 by laser scribing. FIG. 4 is an oblique view of the substrate 1 after scribing, and FIG. 5 is a partial cross-sectional view of the substrate 1 after scribing.

  The dividing groove 12 is formed by cutting the substrate 1 by irradiating a laser a plurality of times along the dividing lines Lx and Ly. As for the size of the dividing groove 12, as shown in FIG. 5, the width of the dividing groove 12 is W (μm), the depth of the dividing groove 12 is D (μm), and the thickness of the substrate 1 is T (μm). In this case, it is preferable to set W: D = 1: 6 and D: T = 1: 3. In the present embodiment, the dividing grooves 12 are provided on only one surface of the substrate 1, but the present invention is not limited to this, and the dividing grooves 12 may be provided on both surfaces to make the dividing process easier.

  Thus, if the dividing grooves 12 are formed along the dividing lines by laser scribing before firing, not only can the time required for forming the dividing grooves 12 be shortened compared to the method of forming the dividing grooves after firing. The dividing groove 12 can be formed sufficiently deep. Therefore, the occurrence of cracks, peeling, etc. can be reduced in the dividing process, and the yield of products can be improved.

  Furthermore, it is preferable to use a laser having a wavelength higher than the absorption rate of the ceramic component and the glass component for the laser scribe. Thereby, the laser transmits the ceramic component and the glass component, is absorbed by the binder component, and can form the dividing groove 12 with high accuracy. As such a laser, for example, a green laser having a wavelength of 532 (nm) can be employed.

  Next, the substrate dividing apparatus according to the present invention will be described. FIG. 6 is a block diagram of a substrate dividing apparatus according to the present invention.

  The substrate dividing apparatus includes a first pressing portion 31, a second pressing portion 32, and a third pressing portion 33. In the dividing step St4, the substrate 1 attached to the stretched film 2 is attached. The electronic component 11 is divided into individual pieces according to the dividing grooves 12 formed on the substrate 1.

  The substrate 1 is attached to the film 2 prior to the dividing process. As this film 2, for example, a sheet made of polyvinyl chloride or polyester coated with an adhesive can be used. Since the substrate 1 is affixed to the film 2, the pieces of the electronic component 11 obtained after the division are maintained in an aligned state on the film 2.

  The film 2 is held in a stretched state in the horizontal direction by a pair of opposing holding portions 61 and 62. As the holding parts 61 and 62, for example, an apparatus provided with a roller mechanism for winding the film 2 can be used. The holding parts 61 and 62 give the film 2 tension enough to allow the pressing parts 31 to 33 to sufficiently press the substrate 1.

  The pressing portions 31 to 33 press the substrate 1 and are typically blades. The first pressing portion 31 is a fixed type, and is fixed in a state where the front end is in contact with the lower surface of the film 2 by the fixing portion 41 below the film 2. The tip of the first pressing portion 31 is located immediately below the dividing groove 12.

  On the other hand, the second and third pressing portions 32, 33 are movable, and are attached to the respective shafts 42, 43 above the film 2, and the shafts 42, 43 can be moved up and down in the vertical direction K. As shown, the cylinder mechanisms 52 and 53 are assembled. The cylinder mechanisms 52 and 53 move the shafts 42 and 43 up and down by controlling internal hydraulic pressure or pneumatic pressure.

  Further, the substrate dividing apparatus places the film 2 at a position where the specific dividing lines Lx and Ly match the dividing target lines of the pressing portions 31 to 33 so that the dividing process can be sequentially performed according to the dividing lines Lx and Ly. A transport mechanism for transporting is provided. However, on the contrary, the pressing portions 31 to 33 may include a moving mechanism that moves in accordance with the division lines Lx and Ly.

  FIG. 7 shows the effects of the substrate dividing apparatus. First, the cylinder mechanisms 52 and 53 respectively lower the second and third pressing portions 32 and 33 at a predetermined speed to the vicinity of the surface on which the dividing grooves 12 of the substrate 1 are formed. Press against the surface at a slow speed. In this way, by changing the speed in the middle, it is possible to suppress the vibration generated when the pressing portions 32 and 33 contact the substrate 1 while shortening the time required for the division process.

  The second and third pressing portions 32 and 33 respectively apply the same pressure P2 and P3 to the substrate 1 along the dividing groove 12 at the same distance d at positions S2 and S3 on both sides of the dividing groove 12 respectively. Press. On the other hand, the first pressing portion 31 presses the substrate 1 by pressing against the lower surface of the film 2 when the second pressing portion 32 and the third pressing portion 33 press the substrate 1 (in the drawing). (See symbol P1).

  Here, since the 1st press part 31 is hold | maintained just under the division groove 12, it will press the board | substrate 1 according to the division groove 12 (refer code | symbol S1). In addition, the second and third pressing portions 32 and 33 press the substrate 1 in the direction opposite to the pressing direction of the first pressing portion 31.

  Thus, according to the substrate dividing apparatus according to the present invention, the first pressing portion 31 presses the substrate 1 according to the dividing groove 12, while the second and third pressing portions 32 and 33 are respectively divided grooves. Since the substrate is pressed in the opposite direction to the pressing direction of the first pressing portion 31 on both sides of the substrate 12, the substrate 1 is bent with the dividing groove 12 as a fulcrum. Further, the second and third pressing portions 32 and 33 are pressed at the same pressure P2 and P3 along the dividing groove 12 at the positions S2 and S3 equidistant from the dividing groove 12 at the positions S2 and S3. A balanced and uniform pressure is applied to both sides around the groove 12.

  Therefore, the substrate dividing apparatus according to the present invention can generate a cross section in the thickness direction from the dividing groove 12 without causing the above-described cracks and defects, and can divide the substrate 1 with high accuracy.

  8 and 9 are electron micrographs showing a cross section of the electronic component obtained after the division. Here, the cross sections shown in FIGS. 8 and 9 are orthogonal to each other, and the size of the cross section shown in FIG. 8 is 0.25 (mm) × 0.65 (mm). The size of the cross section shown is 0.25 (mm) × 0.50 (mm). As can be understood from the photograph, the cross section has no cracks or defects and is a highly accurate rectangle.

  In addition, since the substrate dividing apparatus according to the present invention can split the substrate 1 with at least one dividing groove 12 as a starting point, it is not necessary to form the dividing grooves 12 on both surfaces of the substrate 1. . Therefore, the board | substrate division | segmentation apparatus which concerns on this invention can reduce the manufacturing process of an electronic component, and can reduce production cost.

  However, if the dividing groove 12 is formed on the lower surface of the substrate 1, unlike the present embodiment, the first pressing portion 31 is located above the substrate 1, and the second and third pressing portions 32 and 33 are disposed on the film 2. Even if it is provided below, it is possible to easily perform the dividing process. In this case, the first pressing portion 31 is pressed against the upper surface of the substrate 1, and the second and third pressing portions 32 and 33 are pressed against the lower surface of the film 2. After all, if the above-described effects can be obtained, the arrangement of the first pressing portion 31, the second and third pressing portions 32, 33, and the selection of the surface on which the dividing groove 12 is formed are There are no restrictions.

  Next, the result of the division test in the corner area of the substrate 1 using the substrate dividing apparatus according to the present invention will be described.

  FIG. 10 shows a substrate region to be subjected to the division test. In the division test, the substrate 1 is divided into 77 × 80 (pieces) pieces by the board dividing apparatus, and the sizes of nine pieces a to f obtained from the four corner regions LU, LD, RU, and RD, respectively. Is to measure.

  Referring to the reference numerals in the figure, first, the size of the substrate 1 is Dx = 60 (mm), Dy = 50 (mm), and the thickness T is 0.25 (mm). The size of the margin provided at the end of the substrate 1 is Mx = 4.975 (mm) and My = 5 (mm). The specified size of the piece is Kx = 0.65 (mm) and Ky = 0.50 (mm).

  The dividing grooves 12 are formed on both surfaces of the substrate 1, and the sizes thereof are both width W = 20 (μm) and depth D = 80 (μm). The laser used to form the dividing groove 12 has a wavelength of 1.06 (μm) and an output of 9 (W). Then, using this laser, laser scribing was performed on both surfaces of the substrate 1 at a speed of 40 (mm / sec).

  Moreover, as the press parts 31-33 with which a board | substrate division | segmentation apparatus is equipped, the blade of SKS3 steel material of thickness 10 (mm) and length 150 (mm) was used. Further, pressing is performed by adding the second and third pressing portions 32, 33 to 140 (N) to the substrate 1 and pushing the substrate 1 downward by 0.2 (mm) at a speed of 10 (mm / sec). went.

  11 and 12 show the results of this division test. Specifically, FIG. 11 shows measured values of the length Kx of the pieces a to f for the corner regions LU, LD, RU, and RD, and FIG. 12 shows the other length Ky of the pieces a to f. The measured value is shown.

  Table 1 below shows the maximum value, the minimum value, and the average value of the lengths Kx and Ky of the pieces a to f for each corner region LU, LD, RU, and RD.

  Referring to FIGS. 11 and 12, the lengths Kx of the pieces a to f are distributed within a range of error ± 0.03 (mm) of a specified value 0.65 (mm), and the length Ky is The error is distributed within a range of error ± 0.03 (mm) of the specified value 0.50 (mm). Therefore, from this result, it is understood that the dividing process in the corner regions LU, LD, RU, and RD is performed with high accuracy using the substrate dividing apparatus according to the present invention.

  As described above, the substrate dividing apparatus according to the present invention supports the entire substrate by the film and does not require support by the dividing table. Therefore, the substrate dividing device can divide the substrate 1 with high accuracy regardless of the position on the substrate 1. it can.

  Next, a method for manufacturing an electronic component according to the present invention will be described with reference to FIG. The method for manufacturing an electronic component according to the present invention divides a substrate 1 attached to a stretched film 2 into pieces according to divided grooves 12 formed on the substrate 1. As already described, at this time, it is desirable to form the dividing grooves 12 using laser scribing.

  In this manufacturing method, the substrate 1 is pressed in a predetermined direction (see reference numeral P1) according to the dividing groove 12, and at positions S2 and S3 at equal distances d on both sides of the dividing groove 12, in the opposite direction of the predetermined direction, By simultaneously pressing the substrate 1 with the same pressures P2 and P3 along the dividing grooves 12, the substrate 1 is divided into individual pieces.

  In addition, these presses (see reference numerals P1 to P3) are respectively performed by the first to third press parts 31 to 33, and the first press part 31 is held at a predetermined position, and the second and second press parts are provided. When the three pressing portions 32 and 33 press the substrate 1, the substrate 1 is pressed against the surface of the film 2. Here, in order to make the dividing process easier, it is desirable that the pressing by the first and second pressing portions 31 and 32 is performed on the surface on which the dividing groove 12 is formed. Moreover, a blade is mentioned as a typical example of the press parts 31-33 as already stated.

  Since the electronic component manufacturing method according to the present invention has the same configuration as that of the above-described substrate dividing apparatus, the same effect is obtained.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

DESCRIPTION OF SYMBOLS 1 Board | substrate 11 Electronic component 12 Dividing groove 2 Film 31-33 1st-3rd press part

Claims (9)

An electronic component comprising a first pressing portion, a second pressing portion, and a third pressing portion, the substrate attached to the stretched film being separated according to the dividing groove formed on the substrate. A substrate dividing device for dividing into pieces,
The first pressing portion presses the substrate according to the dividing groove,
The second pressing portion and the third pressing portion are arranged along the dividing groove in a direction opposite to the pressing direction of the first pressing portion at equidistant positions on both sides of the dividing groove. Simultaneously pressing the substrate with the same pressure,
Substrate dividing device. The substrate dividing apparatus according to claim 1,
The second pressing portion and the third pressing portion press the surface on which the dividing groove is formed.
Substrate dividing device. The substrate dividing apparatus according to claim 1 or 2,
The first pressing portion is held at a predetermined position, and when the second pressing portion and the third pressing portion press the substrate, the first pressing portion presses against the surface of the film or the surface of the substrate. Pressing the substrate,
Substrate dividing device. A substrate dividing apparatus according to any one of claims 1 to 3,
The first pressing part, the second pressing part, and the third pressing part are blades,
Substrate dividing device. A method of manufacturing an electronic component in which a substrate attached to a stretched film is divided into individual pieces according to a division groove formed on the substrate,
While pressing the substrate in a predetermined direction according to the dividing groove,
The substrate is divided into the individual pieces by pressing the substrate simultaneously with the same pressure along the dividing groove in the opposite direction of the predetermined direction at equidistant positions on both sides of the dividing groove.
Manufacturing method of electronic components. It is a manufacturing method of the electronic component according to claim 5,
The pressing at equidistant positions on both sides across the dividing groove is performed on the surface on which the dividing groove is formed.
Manufacturing method of electronic components. It is a manufacturing method of the electronic component according to claim 5 or 6,
The pressing is performed by a blade, respectively.
Manufacturing method of electronic components. It is a manufacturing method of the electronic component according to claim 7,
One of the blades is held in place, and when the other two blades press the substrate, press the substrate by pressing against the surface of the film or the surface of the substrate;
Manufacturing method of electronic components. A method of manufacturing an electronic component according to any one of claims 5 to 8,
Forming the dividing groove using laser scribing;
Manufacturing method of electronic components.