JP2012096980A - Apparatus for firing ceramic substrate and method for firing ceramic substrate using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for firing a ceramic substrate, and to provide a method for firing a ceramic substrate using the same.SOLUTION: The apparatus for firing a ceramic substrate includes: a firing setter for mounting a ceramic substrate thereon; a firing pressing plate located at an upper part of the ceramic substrate; and ceramic supporting columns which are arranged between the firing setter and the firing pressing plate so that a certain interval may be formed between the firing pressing plate and the ceramic substrate and each has a thickness shrinkage during firing larger than that of the ceramic substrate. When a large ceramic substrate is fired under pressure, the ceramic substrate is fired without causing warp by using the ceramic columns each having a shrinkage higher than that of the ceramic substrate and the firing pressing plate.

Description

  The present invention relates to a ceramic substrate firing apparatus and a ceramic substrate firing method using the same, and more specifically, a ceramic substrate firing apparatus capable of firing a large ceramic substrate without causing warpage, and a ceramic using the same. The present invention relates to a substrate baking method.

  Recently, as the trend toward miniaturization in the electronic component area has gradually strengthened and persisted, small modules and substrates have been developed through the refinement, fine patterning and thinning of electronic components.

  However, when a commonly used printed circuit board (PCB) is used for a miniaturized electronic component, the size is reduced, the signal loss in a high frequency region, and the reliability is reduced at high temperature and high humidity. Such drawbacks occurred.

  In order to overcome such drawbacks, a substrate using ceramic and glass is used instead of a PCB substrate.

  Since a multilayer ceramic substrate using ceramic-glass can realize a circuit having a three-dimensional structure and form a cavity, it has high design flexibility and can incorporate elements having various functions.

  In addition, it has the advantage that non-shrinkable firing in the planar direction is possible using a sacrificial constraining layer, etc., and its application is expanded to large area substrates etc. with improved dimensional accuracy to improve quality and production efficiency. Research continues.

  However, since a large area substrate is easily deformed due to non-uniform shrinkage of the substrate during firing, and the deformation of the substrate leads to a decrease in yield, there is a method that can fire a large area substrate without causing warpage. It has been demanded.

  The present invention provides a ceramic substrate firing apparatus capable of firing a large ceramic substrate without causing warpage, and a ceramic substrate firing method using the same.

  According to an embodiment of the present invention, a firing setter for mounting a ceramic substrate, a firing pressure plate positioned on the ceramic substrate, and a fixed interval between the firing pressure plate and the ceramic substrate. A ceramic substrate firing apparatus including a ceramic support disposed between the firing setter and the firing pressure plate and having a thickness shrinkage ratio larger than that of the ceramic substrate upon firing.

  The ceramic support has a height higher than a thickness of the ceramic substrate in a calcination process, and has a height lower than a thickness of the ceramic substrate in a firing process.

  The ceramic substrate may be spaced apart from the firing pressure plate in the calcination process step, and may be in contact with the firing pressure plate in the firing process step.

  The calcination step may be performed at a temperature range below 500 ° C.

  The firing process step may be performed at a temperature range of 500 ° C. or higher.

  The ceramic support may be made of the same material as the ceramic substrate.

  The ceramic support may be made of a material having a lower melting point than the ceramic substrate.

  The firing pressure plate may be made of the same material as the firing setter.

  The firing pressure plate may be made of a material having a higher density than the firing setter.

  The ceramic struts can be positioned along each side of the fired setter, can be located at each corner, respectively, are located on opposite sides of the fired setter, and two or more ceramic substrates Each can be further located between.

  Meanwhile, according to another embodiment of the present invention, a step of providing a firing setter, a ceramic substrate, and a firing pressure plate, a step of providing a ceramic column having a larger thickness shrinkage ratio during firing than the ceramic substrate, The ceramic support and the firing pressure plate are disposed on the firing setter so that the ceramic substrate is positioned on the firing setter, and a constant interval is provided between the firing pressure plate and the ceramic substrate. A method of firing a ceramic substrate comprising the steps of:

  According to the present invention, the large ceramic substrate can be fired without causing warp by firing the large ceramic substrate using the ceramic support and the firing pressure plate having a larger shrinkage than the ceramic substrate.

  In particular, according to the present invention, since the ceramic support is thicker than the ceramic substrate before firing, a debinder passage is ensured during calcination, and the shrinkage rate of the ceramic support is larger than the ceramic substrate during firing, so the firing pressure plate is a ceramic substrate. By pressing the ceramic substrate, the ceramic substrate is fired without causing warpage.

1 is a perspective view schematically showing an apparatus for firing a ceramic substrate according to an embodiment of the present invention. It is sectional drawing which shows a calcination process among the ceramic substrate baking processes by other embodiment of this invention. It is sectional drawing which shows a baking process among the ceramic substrate baking processes by other embodiment of this invention. 6 is a flowchart of a ceramic substrate firing process according to another embodiment of the present invention. It is a graph which shows the thickness shrinkage | contraction rate for every temperature of a ceramic substrate and a ceramic support | pillar. 1 is a layout view of an apparatus for firing a ceramic substrate according to an embodiment of the present invention. 1 is a layout view of an apparatus for firing a ceramic substrate according to an embodiment of the present invention. 1 is a layout view of an apparatus for firing a ceramic substrate according to an embodiment of the present invention.

  Embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description, and elements denoted by the same reference numerals in the drawings are the same elements.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view schematically showing an apparatus for firing a ceramic substrate according to an embodiment of the present invention.

  According to one embodiment of the present invention, a firing setter 1 for mounting the ceramic substrate 2, a firing pressure plate 3 positioned above the ceramic substrate 2, and between the firing pressure plate 3 and the ceramic substrate 2. A ceramic substrate firing apparatus including a ceramic support column 4 disposed between the firing setter 1 and the firing pressure plate 3 so as to be spaced apart from each other and having a thickness shrinkage ratio larger than that of the ceramic substrate 2 during firing. 10 is provided.

  A conventional large-area multilayer ceramic substrate using ceramic-glass has a problem that the substrate is likely to be deformed due to non-uniform shrinkage of the substrate during firing.

  In order to improve this, conventionally, a method of firing by sandwiching a multilayer ceramic substrate between porous ceramic fired bodies formed with a large number of through-holes penetrating the front and back surfaces has been used.

  However, when the multilayer ceramic substrate is fired by the above method, since there is about 15 to 70% of the region covering the surface of the ceramic substrate in spite of the formation of the through-hole, the binder removal is disturbed. This becomes worse as the thickness of the ceramic substrate increases.

  An apparatus 10 for firing a ceramic substrate according to an embodiment of the present invention includes a firing setter 1, a firing pressure plate 3, and a ceramic column 4 having a contraction rate larger than that of the ceramic substrate 2 in order to solve the above problems.

  The ceramic substrate 2 and the ceramic support 4 may be made of the same material, and the ceramic support 4 may be made of a material having a lower melting point than the ceramic substrate 2 in order to increase the shrinkage rate.

  Further, according to an embodiment of the present invention, the ceramic support 4 is an unsintered fired support, and is thicker than the ceramic substrate 2 in order to secure a debinding path from the ceramic substrate 2 in the calcination step before firing. (Z-axis height is higher).

  FIG. 4 is a graph showing the thickness shrinkage rate for each temperature of the ceramic substrate and the ceramic support.

  Referring to FIG. 4, both the ceramic substrate 2 and the ceramic support column 4 do not exhibit shrinkage behavior before 500 ° C., which is a calcining completion section.

  Therefore, since the unsintered ceramic support column 4 supports the fired pressure plate 3 in a state where the thickness is thicker than the ceramic substrate 2, the ceramic substrate 2 and the fired pressure plate 3 do not come into contact with each other, and a debinding path is secured. The calcination process is performed in the finished state.

  After the calcination step is completed, the sintering shrinkage behavior starts around 700 ° C.

  In the apparatus for firing a ceramic substrate 10 according to an embodiment of the present invention, since the Z-axis shrinkage rate of the ceramic support 4 is larger than the Z-axis shrinkage rate of the ceramic substrate 2, the thickness reduction amount of the ceramic support 4 during sintering shrinkage is This is much larger than the thickness reduction amount of the ceramic substrate 2.

  Therefore, the ceramic support 4 that is thicker than the ceramic substrate 2 by a specific size before firing becomes equal to or thinner than the thickness of the ceramic substrate 2 after firing.

  Thereby, the firing pressure plate 3 that did not come into contact with the ceramic substrate 2 before firing comes into contact with the ceramic substrate 2 in the firing process, and firing proceeds in a pressurized state.

  That is, the thickness of the ceramic support 4 is larger than the thickness of the ceramic substrate 2 in the temperature range below 500 ° C., but the thickness of the ceramic support 4 is the same as the thickness of the ceramic substrate 2 in the temperature range of 500 ° C. or more. Or smaller.

  Accordingly, the ceramic substrate 2 and the firing pressure plate 3 are separated from each other in a temperature range of less than 500 ° C., and a debinding path is secured in the calcination process, and the ceramic substrate 2 and the firing pressurizing plate in a temperature range of 500 ° C. or more. The pressure plates 3 come into contact with each other, and pressure firing is possible.

  The fired pressure plate 3 can be made of the same material as the fired setter 1 and can be made of a material having a higher density than the fired setter 1 in order to enhance the flattening effect of the ceramic substrate 2 by pressurization.

  FIG. 2a is a cross-sectional view illustrating a calcination step in a ceramic substrate firing step according to another embodiment of the present invention.

  FIG. 2B is a cross-sectional view illustrating a firing process among ceramic substrate firing processes according to another embodiment of the present invention.

  FIG. 3 is a flowchart of a ceramic substrate firing process according to another embodiment of the present invention.

  Referring to FIGS. 2 a, 2 b and 3, according to another embodiment of the present invention, the firing setter 1, the ceramic substrate 2 and the firing pressure plate 3 are provided (S 1), and the ceramic substrate 2 is fired. Providing a ceramic support column 4 having a large thickness shrinkage rate (S2), positioning the ceramic substrate 2 above the firing setter 1 (S3), firing the pressing plate 3 and the ceramic substrate 2; Placing the ceramic support column 4 between the firing setter 1 and the firing pressure plate 3 so as to have a fixed interval therebetween (S4), and positioning the firing pressure plate 3 above the ceramic support column 4; A ceramic substrate firing method including step (S5).

  In the ceramic substrate firing method according to another embodiment of the present invention, first, a firing setter 1, a ceramic substrate 2, and a firing pressure plate 3 are provided (S1).

  The ceramic substrate 2 is a large-sized and large-sized ceramic substrate for simultaneous low-temperature firing, and the firing setter 1 and the firing pressure plate 3 may be made of the same material, in order to enhance the flattening effect of the ceramic substrate 2 by pressurization. Alternatively, a material having a higher density than the fired setter 1 may be used.

  Next, the ceramic support | pillar 4 with a larger thickness shrinkage rate at the time of baking than the ceramic substrate 2 is provided (S2).

  The ceramic substrate 2 and the ceramic support 4 may be made of the same material, and the ceramic support 4 may be made of a material having a lower melting point than the ceramic substrate 2 in order to increase the thickness shrinkage rate.

  Further, the ceramic support 4 is an unsintered fired support, and is thicker than the ceramic substrate 2 (the height in the Z-axis direction is higher) in order to secure a binder removal path from the ceramic substrate 2 in the calcination step before firing. ) Prepared.

  Next, the ceramic substrate 2 is positioned on the firing setter 1 (S3).

  The step of positioning the ceramic substrate 2 on the firing setter 1 is the same as the firing process of a normal ceramic substrate.

  Next, the ceramic support column 4 is disposed between the firing setter 1 and the firing pressure plate 3 so as to place a fixed interval between the firing pressure plate 3 and the ceramic substrate 2 (S4), The firing pressure plate 3 is positioned above the ceramic support 4 (S5).

  As a result, the ceramic substrate 2 positioned on the upper portion of the firing setter 1 is separated from the firing pressure plate 3 at regular intervals because the firing pressure plate 3 is supported by the ceramic support 4 positioned around the ceramic substrate 2.

  In the arrangement state described above, the calcination process and the baking process are performed (S6).

  During the calcination process, the ceramic support 4 thicker than the ceramic substrate 2 supports the fired pressure plate 3, and both the ceramic substrate 2 and the ceramic support 4 are before 500 ° C., which is the calcining completion section. Since the shrinkage behavior is not exhibited, a sufficient debinding path for the ceramic substrate 2 is ensured.

  After the calcination step is completed, the sintering shrinkage behavior of the ceramic substrate 2 and the ceramic support column 4 starts around 700 ° C.

  Since the shrinkage rate of the ceramic support 4 is larger than the shrinkage rate of the ceramic substrate 2, the thickness reduction amount of the ceramic support 4 at the time of sintering shrinkage is much larger than the thickness reduction amount of the ceramic substrate 2.

  Therefore, in the ceramic substrate 2 and the firing pressure plate 3 which are separated from each other during the calcination step, the thickness of the ceramic support column 4 supporting the firing pressure plate 3 is much smaller than the thickness of the ceramic substrate 2. As a result, the thickness of the ceramic substrate 2 is the same as or lower than that of the ceramic substrate 2, so that they come into contact with each other.

  Since the firing pressure plate 3 pressurizes the ceramic substrate 2 as described above, firing proceeds, the ceramic substrate is fired without warping.

  Hereinafter, although this invention is demonstrated in detail using a comparative example and an Example, this invention is not restrict | limited by this.

  Table 1 below shows experimental combinations and results for comparing application results of the present invention.

  In Experiment 1, a ceramic substrate having a width × length × thickness of 250 mm × 250 mm × 2 mm was used, and in Experiment 2, a ceramic substrate having a width × length × thickness of 250 mm × 250 mm × 10 mm was used.

  Comparative Example 1 is a case where a firing pressure plate for flattening the substrate is not used, and Comparative Example 2 uses a firing pressure plate and does not use a ceramic support, and the firing pressure plate covers the upper part of the ceramic substrate before firing. This is a case where pressure is applied.

  Example 1 is a case where a fired pressure plate is used and the green ceramic support of the present invention is used.

  In Example 1, the ceramic substrate thickness after firing in Experiment 1 was 1.7 mm, and the ceramic substrate thickness after firing in Experiment 2 was 8.43 mm.

  Referring to the result of Comparative Example 1 in Experiment 1, since no calcined pressure plate was used on the upper part of the ceramic substrate, the amount of residual carbon in the substrate was small, but the degree of substrate warpage was severe and the quality of the large substrate was lowered.

  In Comparative Example 2 in Experiment 1, since the firing pressure plate pressed the upper part before firing the ceramic substrate, the degree of substrate warpage after firing was low, but the amount of residual carbon was large because the binder removal passage was insufficient. It was.

  On the other hand, in Example 1 in Experiment 1, the amount of remaining carbon in the final ceramic substrate was small by providing a debinding passage by separating the firing pressure plate from the ceramic substrate until the ceramic support post-calcination was completed.

  Also, in the sintering shrinkage section, the firing pressure plate presses the ceramic substrate due to the shrinkage of the thickness of the ceramic struts, so the degree of substrate warpage of the final ceramic is low, and both the amount of residual carbon and the substrate warpage are improved. The results are shown.

  In Experiment 2, the same effect was obtained by using the green ceramic support.

  In particular, the thicker the substrate, the thicker the ceramic support and the greater the distance between the ceramic support and the ceramic substrate. The effect also increased.

  Therefore, the effect of securing the binder removal path and the substrate flattening by the ceramic support of the present invention is more effective as the ceramic substrate is thicker.

  5a to 5c are layout views of an apparatus for firing a ceramic substrate according to an embodiment of the present invention.

  The width × length × thickness of the ceramic support 4 and the arrangement method thereof can be freely changed according to the sizes of the firing setter 1 and the ceramic substrate 2, and can be changed, for example, as shown in FIGS. 5a to 5c.

  As shown in FIG. 5a, the ceramic columns 4 may be located along each side of the firing setter 1, and as shown in FIG. 5b, they are located at each corner of the firing setter 1, respectively. Also good.

  Further, as shown in FIG. 5 c, the ceramic support columns 4 may be positioned on opposite sides of the firing setter 1, and one may be further positioned between two or more ceramic substrates 2.

  The present invention is not limited by the above embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitutions, modifications and changes can be made without departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

1 firing setter 2 ceramic substrate 3 firing pressure plate 4 ceramic support 10 ceramic substrate firing device

Claims (24)

A firing setter for mounting the ceramic substrate;
A firing pressure plate located on top of the ceramic substrate;
Ceramic struts disposed between the firing setter and the firing pressure plate so as to place a fixed interval between the firing pressure plate and the ceramic substrate, and having a larger thickness shrinkage rate during firing than the ceramic substrate,
A ceramic substrate firing apparatus including:   2. The ceramic substrate firing apparatus according to claim 1, wherein the ceramic support has a height higher than a thickness of the ceramic substrate in a calcination step and has a height lower than a thickness of the ceramic substrate in a firing step.   2. The ceramic substrate firing apparatus according to claim 1, wherein the ceramic substrate is spaced apart from the firing pressure plate in a calcination step and is in contact with the firing pressure plate in a firing step.   The ceramic substrate baking apparatus according to claim 2 or 3, wherein the calcination step is performed in a temperature range of less than 500C.   The ceramic substrate firing apparatus according to claim 2 or 3, wherein the firing step is performed in a temperature range of 500 ° C or higher.   The ceramic substrate firing apparatus according to claim 1, wherein the ceramic support is made of the same material as the ceramic substrate.   The ceramic substrate baking apparatus according to claim 1, wherein the ceramic support is made of a material having a melting point lower than that of the ceramic substrate.   The ceramic substrate firing apparatus according to claim 1, wherein the firing pressure plate is made of the same material as the firing setter.   The ceramic substrate firing apparatus according to claim 1, wherein the firing pressure plate is made of a material having a higher density than the firing setter.   The ceramic substrate firing apparatus according to claim 1, wherein the ceramic support is positioned along each side of the firing setter.   The ceramic substrate firing apparatus according to claim 1, wherein the ceramic support is positioned at each corner of the firing setter.   2. The ceramic substrate firing apparatus according to claim 1, wherein the ceramic support pillars are respectively located on opposite sides of the firing setter, and one is further located between two or more ceramic substrates. 3. Providing a firing setter, a ceramic substrate, and a firing pressure plate;
Providing a ceramic column having a larger thickness shrinkage rate during firing than the ceramic substrate;
Positioning the ceramic substrate on top of the firing setter;
Disposing the ceramic strut and the firing pressure plate on the firing setter so as to place a fixed interval between the firing pressure plate and the ceramic substrate;
A ceramic substrate firing method comprising:   The method according to claim 13, wherein the ceramic support has a height higher than a thickness of the ceramic substrate in a calcination step and has a height lower than a thickness of the ceramic substrate in a step of firing.   The ceramic substrate firing method according to claim 13, wherein the ceramic substrate is separated from the firing pressure plate in a calcination step and is in contact with the firing pressure plate in a firing step.   The method according to claim 14 or 15, wherein the calcination step is performed in a temperature range of less than 500C.   The method of firing a ceramic substrate according to claim 14 or 15, wherein the firing step is performed in a temperature range of 500 ° C or higher.   The method according to claim 13, wherein the ceramic support is made of the same material as the ceramic substrate.   The method according to claim 13, wherein the ceramic support is made of a material having a melting point lower than that of the ceramic substrate.   The method according to claim 13, wherein the firing pressure plate is made of the same material as the firing setter.   The method according to claim 13, wherein the firing pressure plate is made of a material having a higher density than the firing setter.   The ceramic substrate firing method according to claim 13, wherein the ceramic support is positioned along each side of the firing setter.   The ceramic substrate firing method according to claim 13, wherein the ceramic support is positioned at each corner of the firing setter.   The ceramic substrate firing method according to claim 13, wherein the ceramic support columns are respectively located on opposite sides of the firing setter, and one is further located between two or more ceramic substrates.

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