JP6110927B2 - Multilayer ceramic capacitor - Google Patents

Description

  The present invention relates to a multilayer ceramic capacitor, and more particularly to a multilayer ceramic capacitor that can effectively prevent the occurrence of cracks.

  When producing a multilayer ceramic capacitor, usually a step of preparing a ceramic green sheet, a step of printing a conductive paste on the ceramic green sheet in a desired pattern to form an internal electrode layer, and an internal electrode layer A plurality of ceramic green sheets formed by stacking and pressure bonding to produce a laminate block, cutting the produced laminate block to a predetermined size, and producing a green chip, A process of firing an unsintered chip to obtain a chip body, a process of applying a conductive paste to both end faces of the chip body and baking to form an external electrode, and nickel, tin, etc. on the external electrode A multilayer ceramic capacitor is produced by the process of plating the metal.

  However, when producing a multilayer ceramic capacitor in this way, it is difficult to overlap and pressure-bond a large number of ceramic green sheets so that adjacent internal electrodes face each other accurately. Since the internal electrodes on the adjacent ceramic green sheets are not accurately opposed to each other, there is a problem that the capacity of the capacitor cannot be sufficiently increased.

  Therefore, for example, Japanese Patent Application Laid-Open No. 2011-23707 (Patent Document 1) prints an internal electrode conductive paste on the entire surface excluding the vicinity of at least one side of a substantially rectangular ceramic green sheet. After forming and laminating a number of ceramic green sheets on which internal electrodes are formed, a laminated body block is formed, and a high pressure is applied to the laminated body block, crimping and cutting to the required size, and then the internal electrodes are exposed. A ceramic body that is a part called a side margin is formed on both side surfaces of the laminated body block by coating or the like to produce a ceramic green chip, and after the binder removal treatment is performed on the ceramic green chip, firing is performed. Thus, a method of manufacturing a multilayer ceramic capacitor is proposed.

JP 2011-23707 A

  Thus, when producing a multilayer ceramic capacitor, the ceramic body is densely formed outside the side surface side end portion of the internal electrode. Therefore, for example, when mounting a multilayer ceramic capacitor on a substrate in a high temperature atmosphere by solder reflow, the thermal expansion coefficient of the metal forming the internal electrode is different from the thermal expansion coefficient of the ceramic body. There has been a problem that cracks are likely to occur in the multilayer ceramic capacitor due to the generated stress.

  Not only the method disclosed in Japanese Patent Application Laid-Open No. 2011-23707 (Patent Document 1) but also a multilayer ceramic capacitor manufactured by a known method has the same problem.

  Accordingly, an object of the present invention is to provide a multilayer ceramic capacitor that can effectively prevent the occurrence of cracks.

An object of the present invention is to provide a laminate block in which ceramic dielectric layers and internal electrodes are alternately stacked, a pair of cover layers stacked above and below the laminate block, the laminate block, and the pair of pairs. In a multilayer ceramic capacitor having a ceramic body formed on both side surfaces of a cover layer and a pair of external electrodes electrically connected to the internal electrode, between the side surface side end of the internal electrode and the ceramic body A space is formed, the internal electrode layer contains nickel as a conductor material, the ceramic dielectric layer and the ceramic body contain magnesium, and the magnesium content contained in the ceramic body is the ceramic dielectric layer It is configured to be higher than the magnesium content in the said side surface side end metal oxides, metal and Is achieved by a multilayer ceramic capacitor, characterized in that it is formed by a material selected from the group consisting of the following phases.

  According to the present invention, the thermal expansion coefficient of the metal constituting the internal electrode is different from the thermal expansion coefficient of the ceramic body located outside the side surface side end portion of the internal electrode. Even if the expansion and contraction amount of the body is different, the difference between the expansion and contraction amount of the internal electrode and the ceramic body is absorbed by the space portion formed between the side end portion of the internal electrode and the ceramic body, Even when the multilayer ceramic capacitor is exposed to a high temperature atmosphere as in solder reflow, it is possible to effectively prevent cracks from occurring in the multilayer ceramic capacitor.

  Further, according to the present invention, since the space is formed between the side surface side end portion of the internal electrode and the ceramic body, the metal constituting the internal electrode is oxidized, so that the volume thereof is increased. Further, it is possible to effectively prevent a short circuit between adjacent internal electrode layers.

  In the present invention, the side surface side end portion of the internal electrode is formed of a material selected from the group consisting of an oxide, a metal, and a secondary phase.

  According to the present invention, it is possible to form a space portion having a desired shape and size outside the side surface side end portion of the internal electrode.

  In the present invention, the internal electrode preferably contains nickel, a nickel alloy, or a mixture thereof as a conductor material.

  In a preferred embodiment of the present invention, the internal electrode layer contains nickel as a conductor material, and the magnesium content contained in the ceramic body is higher than the magnesium content contained in the ceramic dielectric layer. ing.

  In a further preferred embodiment of the present invention, the ceramic body contains 1 atomic% to 2 atomic% magnesium and the ceramic dielectric layer contains 0.8 atomic% magnesium.

  In the present invention, the space portion preferably has a width of 0.5 to 1.5 times the thickness of the internal electrode layer, more preferably 0.9 to 1.1 times the width of the internal electrode layer. Has a thickness of

  In the present invention, the space portion preferably has a width of 1 to 10 μm.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the multilayer ceramic capacitor which can prevent generation | occurrence | production of a crack effectively.

FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor according to a first preferred embodiment of the present invention. FIG. 2 is a schematic longitudinal sectional view taken along line AA of the multilayer ceramic capacitor according to the first preferred embodiment of the present invention shown in FIG. FIG. 3 is a schematic cross-sectional view along the line BB of the multilayer ceramic capacitor according to the first preferred embodiment of the present invention shown in FIG. FIG. 4 is a schematic cross-sectional view showing the vicinity of the end of the internal electrode layer of the multilayer ceramic capacitor according to the first preferred embodiment of the present invention shown in FIG. FIG. 5 is a schematic cross-sectional view showing the vicinity of the end of the internal electrode layer of the multilayer ceramic capacitor according to the second preferred embodiment of the present invention . FIG. 6 is a schematic cross-sectional view showing a ceramic green sheet and internal electrode layers formed on the ceramic green sheet in the manufacturing process of the multilayer ceramic capacitor according to the second preferred embodiment of the present invention shown in FIG. .

  FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor according to a first preferred embodiment of the present invention, and FIG. 2 is a schematic longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. FIG. 3 is a schematic longitudinal sectional view taken along line BB of the multilayer ceramic capacitor shown in FIG.

  As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 1 includes a multilayer block 4 in which ceramic dielectric layers 2 and internal electrode layers 3 are alternately stacked, and stacked above and below the multilayer block 4. A pair of cover layers 5, 5, a ceramic body 6 called a side margin formed on both side surfaces of the laminate block, and a pair of external electrodes 7, 7 electrically connected to the internal electrode layer 3 are provided. ing.

  As shown in FIG. 3, the internal electrode layer 3 extending in the lateral direction of the multilayer ceramic capacitor 1 is not exposed on the side surfaces 4 a and 4 b of the multilayer ceramic capacitor 1, and is laminated with the side surface side end of the internal electrode layer 3. Between the side surfaces 4a and 4b of the ceramic capacitor 1, a ceramic body 6 exists.

  FIG. 4 is a schematic cross-sectional view showing the vicinity of the end of the internal electrode layer 3 of the multilayer ceramic capacitor 1 according to the preferred embodiment of the present invention shown in FIG.

  As shown in FIG. 4, the ceramic body 6 exists between the side surface side end portion 3 a of the internal electrode layer 3 and the end surfaces 4 a and 4 b of the capacitor portion 4. In the capacitor 1, space portions 8 are formed between the side surface side end portions 3 a of the multiple internal electrode layers 3 provided in the multilayer body block 4 and the ceramic body 6.

  The space 8 formed in the ceramic body 6 has, for example, a substantially semicircular cross section.

  The multilayer ceramic capacitor 1 having such a configuration can be manufactured, for example, as follows.

  First, a ceramic green sheet to be a ceramic dielectric layer, a conductive paste for forming an internal electrode, a conductive paste for forming an external electrode, and a dielectric paste for forming a ceramic body 6 are prepared. Examples of the dielectric material used for the ceramic green sheet and the dielectric paste include barium titanate, strontium titanate, calcium titanate and calcium zirconate. In addition, the dielectric paste and the conductive paste contain a binder and a solvent. As the binder and the solvent, known binders and solvents can be used. Ni, Cu, Ag, etc. are used as the conductive material used for the conductive paste for forming the internal electrodes and the conductive paste for forming the external electrodes, and Ni, Cu are particularly preferably used. Here, the side surface side end portion 3a of the internal electrode layer 3 may be formed of a material selected from the group consisting of a metal oxide, a metal, and a secondary phase. The conductive paste for forming the external electrode may contain a glass component.

  In this embodiment, among the binder of the ceramic green sheet, the binder of the conductive paste for forming the internal electrode, and the binder of the dielectric paste for forming the ceramic body 6, the binder of the dielectric paste for forming the ceramic body 6 is the most. Each binder is selected so that decomposition starts from a low temperature.

  Next, a conductive paste for forming an internal electrode is applied on the ceramic green sheet by a known printing method such as a screen printing method, and a pattern to be the internal electrode layer 3 is formed.

  Next, a large number of ceramic green sheets not formed with a pattern to be the internal electrode layer 3 are laminated as a lower cover layer, and a large number of ceramic green sheets with a pattern formed thereon are laminated. An unfired mother laminate is formed by laminating a plurality of ceramic green sheets on which no pattern is formed to form an upper cover layer. Next, the unfired mother laminated body is pressed by a hydrostatic pressure press or the like and pressed.

  Next, the unfired mother laminate is cut into a predetermined size to form an unfired ceramic laminate.

  Furthermore, a dielectric paste is applied to the side surface of the ceramic laminate to form the ceramic body 6.

  A binder removal treatment is performed on the unfired ceramic laminate thus produced.

  In the binder removal treatment for the ceramic laminate, the rate of temperature increase is increased within a range in which cracks and delamination do not occur in the ceramic laminate.

  After the binder removal treatment, baking is performed at around 1200 ° C. When the internal electrode is a base metal such as Ni, firing is performed in a reducing atmosphere.

  After firing, a conductive paste for forming an external electrode is applied to the end face where the internal electrode is exposed and baked to form the external electrode. The external electrode is plated as necessary.

  Here, of the binder removal processing, the ceramic green sheet binder, the conductive paste binder for the internal electrode, and the dielectric paste binder for forming the ceramic body 6 are used. Each binder is selected so that the decomposition of the binder starts from the lowest temperature. Therefore, due to the difference in the expansion and contraction behavior of the respective materials, the outer side of the side-side end portion 3a of the internal electrode layer 3 is substantially half-finished. A space 8 having a circular cross section is formed.

  The multilayer ceramic capacitor 1 according to the present embodiment configured as described above is placed in a high-temperature atmosphere for several minutes when the multilayer ceramic capacitor 1 is mounted on a substrate by solder reflow, for example. As a result, the multilayer ceramic capacitor 1 is placed in a high temperature environment exceeding, for example, 275 ° C., so that thermal shock may be applied to the multilayer ceramic capacitor 1. However, since the space portion 8 having a substantially semicircular cross section is formed between the side surface side end portion 3 a of the internal electrode layer 3 and the ceramic body 6, the coefficient of thermal expansion of the metal constituting the internal electrode layer 3. And even if the stress resulting from the difference of the thermal expansion coefficient of the ceramic body 6 generate | occur | produces, it becomes possible to relieve the stress and to prevent that a crack generate | occur | produces in the multilayer ceramic capacitor 1 effectively.

FIG. 5 is a schematic cross-sectional view showing the vicinity of the end of the internal electrode layer of the multilayer ceramic capacitor according to the second preferred embodiment of the present invention .

As shown in FIG. 5, the multilayer ceramic capacitor according to the second preferred embodiment of the present invention has a multilayer block 14 formed by alternately laminating ceramic dielectric layers 12 and internal electrode layers 13 containing nickel. A pair of cover layers 15 and 15 stacked on the top and bottom of the laminate block 14, a ceramic body 16 called side margin formed on both side surfaces of the laminate block 14, and the internal electrode layer 13 And a pair of external electrodes (not shown) connected to.

  As shown in FIG. 5, in the vicinity of the side surface side end portion 13 a of the internal electrode layer 13, an intermediate portion of the internal electrode layer 13 having a composition of (Ni, Mg) O formed by nickel absorbing magnesium. 13b is formed.

  The ceramic body 16 is formed with a space 18 that faces the intermediate portion 13 b of the internal electrode layer 13. Here, the ceramic body 16 contains excessive magnesium as compared with the ceramic dielectric layer 12.

  FIG. 6 is a schematic cross-sectional view of the ceramic green sheet 12 and the internal electrode layer 13 formed on the ceramic green sheet 12 in the manufacturing process of the multilayer ceramic capacitor shown in FIG.

  As shown in FIG. 6, a conductive paste containing nickel is printed on the surface of the ceramic green sheet 12 to form an internal electrode layer 13 containing nickel. On the other hand, on the surface of the ceramic green sheet 12 on which the internal electrode layer 13 is not formed, the step relaxation layer 19 is formed in a pattern complementary to the pattern of the internal electrode layer 13 in order to reduce the step due to the thickness of the internal electrode layer 13. Is formed.

  The step relaxation layer 19 is made of a dielectric material containing 1 atomic% to 2 atomic% of magnesium oxide.

  On the other hand, the dielectric material forming the ceramic green sheet 12 contains about 0.8 atomic% or less of magnesium oxide, which is smaller than the content of magnesium oxide contained in the step relaxation layer 19.

In the second preferred embodiment of the present invention, a plurality of ceramic green sheets 12 each having an internal electrode layer 13 having a structure as shown in FIG. A laminate block 14 having a ceramic body 16 is formed. When the laminated body block 14 is fired, magnesium oxide is easily absorbed by nickel, and therefore, the magnesium oxide contained in the step relaxation layer 19 constituting the ceramic body 16 is absorbed by the internal electrode 13. In a region between the ceramic body 16 and the internal electrode 13, a space 18 is formed as a trace in which magnesium is absorbed. Here, although the ceramic green sheet 12 also contains magnesium oxide, since the content of magnesium oxide is less than the content of magnesium oxide contained in the step mitigating layer 19, it is contained in the step mitigating layer 19. The magnesium oxide present is selectively absorbed by the internal electrode layer 13, and a space 18 is formed outside the side surface side end portion 13 a of the internal electrode layer 13.

The multilayer ceramic capacitor according to the second preferred embodiment of the present invention thus configured is placed in a high-temperature atmosphere for several minutes when the multilayer ceramic capacitor is mounted on a substrate by, for example, solder reflow. As a result, the multilayer ceramic capacitor is placed in a high temperature environment exceeding, for example, 275 ° C., so that thermal shock may be applied to the multilayer ceramic capacitor. However, the space 18 formed in the ceramic body 16 faces the outside of the side surface side end 13 a of the internal electrode layer 13. Therefore, the stress generated due to the difference between the thermal expansion coefficient of the metal constituting the internal electrode layer 13 and the thermal expansion coefficient of the ceramic body 16 is effectively relieved. Accordingly, it is possible to effectively prevent the occurrence of cracks in the multilayer ceramic capacitor.

Furthermore, according to the present embodiment , the step relaxation layer 19 is formed on the ceramic green sheet 12 in a pattern complementary to the pattern of the internal electrode layer 13 formed on the surface of the ceramic green sheet 12. It is possible to prevent a step from being formed between the surface of the internal electrode layer 13 and the surface of the ceramic green sheet on which the internal electrode layer is not formed. Therefore, the internal electrode layer 13 is formed on the surface. In addition, it is possible to effectively prevent the produced multilayer ceramic capacitor from being deformed by laminating the ceramic green sheets 12 and to effectively prevent the occurrence of delamination.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the invention described in the claims, and these are also included in the scope of the present invention. Needless to say.

  For example, in the first embodiment, the content of magnesium oxide contained in the ceramic body 6 may be larger than the content of magnesium oxide contained in the ceramic dielectric layer 2.

In the second preferred embodiment of the present invention , the binder may be selected so that the decomposition for the step forming layer 19 starts at the lowest temperature.

  Furthermore, in the first embodiment, the external electrode was formed by applying and baking the conductive paste after firing the ceramic laminate, but the conductive paste was applied to the unfired ceramic laminate, The external electrode may be formed simultaneously with the firing of the ceramic laminate.

DESCRIPTION OF SYMBOLS 1 Multilayer ceramic capacitor 2 Ceramic dielectric layer 3 Internal electrode layer 3a Side surface side edge part of internal electrode layer 4 Laminate block 5 Cover layer 6 Ceramic body 7 External electrode 8 Space part 11 Multilayer ceramic capacitor 12 Ceramic dielectric layer (ceramic green) Sheet)
13 Internal Electrode Layer 13a Side End 13b of Internal Electrode Layer Intermediate Part 14 of Internal Electrode Layer Laminate Block 16 Ceramic Body 19 Step Relaxation Layer

Claims (5)

A laminate block in which ceramic dielectric layers and internal electrodes are alternately stacked, a pair of cover layers stacked above and below the laminate block, and formed on both sides of the laminate block and the pair of cover layers In the multilayer ceramic capacitor having the ceramic body and a pair of external electrodes electrically connected to the internal electrode, a space is formed between the side surface side end of the internal electrode and the ceramic body. The internal electrode layer contains nickel as a conductor material, the ceramic dielectric layer and the ceramic body contain magnesium, and the magnesium content contained in the ceramic body is greater than the magnesium content contained in the ceramic dielectric layer. is configured to be higher, selected from the group the side end portion of a metal oxide, metal and secondary phase Multilayer ceramic capacitor, characterized in that it is formed by the material.   2. The multilayer ceramic capacitor of claim 1, wherein the ceramic body contains 1 atomic% to 2 atomic% magnesium, and the ceramic dielectric layer contains 0.8 atomic% magnesium.   3. The multilayer ceramic capacitor according to claim 1, wherein the space portion has a thickness of 0.5 to 1.5 times a thickness of the internal electrode layer.   4. The multilayer ceramic capacitor according to claim 3, wherein the space portion has a width 0.9 to 1.1 times the thickness of the internal electrode layer.   The multilayer ceramic capacitor according to claim 1, wherein the space portion has a width of 1 to 10 μm.

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