JP2007059443A - Wiring board for taking a plurality of boards - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board for taking a plurality of wiring boards capable of taking a plurality of wiring boards excellent in mountability on an electronic component or packaging ability onto an external electric circuit board by inhibiting a warpage. <P>SOLUTION: The wiring board X1 for taking the plurality of wiring boards has a first region 10a consisting of a plurality of matrix sections 11 and a second region 10b surrounding the first region 10a. Sections 11a located at least four corners among the plurality of sections 11 of the first region 10a constitute disposable margins A together with the second region 10b, and remaining sections 11b constitute wiring board parts B each including a wiring conductor 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plurality of wiring board having a wiring board part composed of a plurality of sections each having a wiring conductor and a surplus part surrounding the wiring board part.

  2. Description of the Related Art Conventionally, a wiring board serving as a mounting board for electronic components such as semiconductor elements generally has a structure in which an electronic component mounting portion is provided on the main surface of an insulating base on which wiring conductors are formed. Such a wiring board is usually a rectangular plate having a length of one side of about several millimeters, and is manufactured from a so-called multiple-wiring wiring board. Such a multiple wiring substrate is disclosed in Patent Document 1, for example.

FIG. 3 is a plan view showing a conventional multiple-wiring wiring board 90. The plurality of wiring board 90 has a wiring board part 91 and a discarding part 92. The wiring board portion 91 includes a plurality of sections 91a constituting the wiring board in a matrix. A wiring conductor 93 is provided in each of the sections 91a. The wiring conductor 93 is electrically connected to an electrode of an electronic component mounted at one end thereof, and is electrically connected to an external electric circuit at the other end thereof, whereby the electronic component and the electric circuit are electrically connected. It is for aiming at electrical conduction. The disposal part 92 is provided so as to surround the wiring board part 91, and is a part having a function for facilitating the handling of the wiring board 90 for taking plural pieces.
Japanese Patent Laid-Open No. 1999-54886

  However, in the multi-wiring wiring board 90, the ceramic green sheet constituting the main body of the wiring board portion 91 and the conductor paste constituting the wiring conductor 93 have different shrinkage rates at the time of firing. Stress is generated between the two due to the rate difference. Since this stress tends to increase as the section 91a located at the outer peripheral portion of the wiring board portion 91, the wiring board 90 for multiple-taken tends to be warped along the outer peripheral portion. As described above, when the plurality of wiring board 90 itself is warped, the wiring board obtained by dividing the wiring board portion 91 into the respective sections 91a is also warped. It may be difficult to properly mount the wiring board on the external electric circuit board. In particular, in recent years, since the density of wiring conductors has been increasing in order to cope with higher functionality and diversified functions of electronic components, the stress caused by the shrinkage rate difference between the ceramic green sheet and the conductor paste Tends to become larger, and the problem of warping as described above has become prominent.

  The present invention has been conceived under such circumstances, and by suppressing the occurrence of warping, a wiring board excellent in mountability of electronic parts and mountability on an external electric circuit board is obtained. It is an object of the present invention to provide a wiring board for taking out plural pieces.

  The wiring board for multi-cavity according to the present invention has a first area composed of a plurality of matrix-like sections, and a second area surrounding the periphery of the first area, and among the plurality of sections of the first area The sections located at least at the four corners constitute a surplus part together with the second region, and the remaining sections constitute a wiring board part having a wiring conductor.

  Preferably, the surrendering unit includes a section adjacent to the section located at the four corners in the row direction or the column direction. Here, "a section adjacent to the four corners in the row direction or the column direction" means a section adjacent to the four corners in the row direction, or a section adjacent to the four corners in the column direction. It is meant that any one of these is included, and therefore both may be included.

  In the multiple wiring substrate according to the present invention, it is not necessary to provide the wiring conductor in at least the four corners among the plurality of sections in the first region. For this reason, the stress caused by the difference in shrinkage rate between the constituent of the main body of the wiring board (for example, ceramic green sheet) and the constituent of the wiring conductor (for example, conductor paste) is concentrated at the four corners of the first region. Can be relaxed. Therefore, in this multiple wiring substrate, it is possible to suppress the occurrence of warping due to the concentration of the stress at the four corners of the first region. That is, the wiring board taken out from the multiple wiring board is excellent in mountability of electronic components and mountability on an external electric circuit board.

  In the multi-wiring wiring board including the section where the disposal portion is located at the four corners and the section adjacent in the row direction or the column direction, it is not necessary to provide the wiring conductor in the section adjacent to the four corners. Therefore, it is possible to more effectively alleviate the stress concentration on the four corners of the first region. Therefore, in this multiple wiring substrate, the occurrence of warpage due to the concentration of the stress at the four corners of the first region can be more effectively suppressed. That is, the wiring board taken out from the multiple wiring board is excellent in mountability of electronic components and mountability on an external electric circuit board.

  FIG. 1 is a plan view showing a plurality of wiring boards X1 according to the first embodiment of the present invention. The multiple wiring substrate X1 has an insulating base 10 and a wiring conductor 20.

  The insulating base 10 has a first region 10a and a second region 10b and is a substantially rectangular flat plate in plan view. The first region 10 a is composed of a plurality of (in the present embodiment, 100) sections 11 in a matrix and is located in the center of the insulating substrate 10. The plurality of sections 11 are composed of sections 11a located at the four corners and the remaining sections 11b, and wiring conductors 20 are provided in the sections 11b. The shape of the compartment 11 is preferably a quadrangular shape (for example, a square shape or a rectangular shape) suitable for mounting a square plate-shaped electronic component, but is not limited thereto, and the shape of the electronic component to be mounted is not limited thereto. And may be set as appropriate according to the shape of the mounting area on the external electric circuit board to be mounted. The second region 10b is provided so as to surround the first region 10a, and in the present embodiment, has a rectangular frame shape. In addition, as a material which comprises the insulating base | substrate 10, ceramics are mentioned. Ceramics are aluminum oxide sintered bodies (alumina ceramics), aluminum nitride sintered bodies (aluminum nitride ceramics), silicon carbide based sintered bodies (silicon carbide ceramics), and silicon nitride based sintered bodies (silicon nitride ceramics). Glass ceramic sintered body, mullite sintered body, and the like.

  Here, an example of a method for manufacturing the insulating substrate 10 in the case where a glass ceramic sintered body is employed as a material constituting the insulating substrate 10 will be described. First, glass such as borosilicate glass, or raw material powder such as aluminum oxide (alumina) or silicon oxide (silica) is formed into a sheet shape together with an organic solvent, a binder, or the like to produce a plurality of ceramic green sheets. Next, the ceramic green sheet is processed into a predetermined size and shape by cutting or punching the manufactured ceramic green sheet. Next, the processed ceramic green sheets are laminated to a predetermined size and fired at a predetermined firing temperature (for example, 1000 ° C.) in a reducing atmosphere. As described above, the insulating base 10 is manufactured. Note that the insulating base 10 may have a configuration having irregularities on the outer side portion or a rounded corner portion from the viewpoint of prevention of damage at the outer side portion and the corner portion and handling.

  The section 11a and the second area 10b of the first area 10a constitute a surplus part A, and the section 11b of the first area 10a constitutes a wiring board part B.

  The surrendering part A is a part that bears a function for reducing the influence of an external force that acts on the wiring board part B during handling such as transportation, packing, and mounting of electronic components, for example. Handleability can be improved.

  The wiring board part B is a part from which a plurality of wiring boards Ba are taken out by being divided into pieces. Each wiring board Ba is used for applications such as mounting electronic components. Here, examples of electronic components mounted on the wiring board Ba include semiconductor elements including optical semiconductor elements such as CCD and CMOS line sensors and area sensors, piezoelectric elements such as crystal resonators and surface acoustic wave elements, capacitors, and the like. , Resistors and inductors. The wiring board part B may be divided into individual pieces after mounting electronic components.

  Here, an example of a method for dividing the wiring board portion B into a plurality of wiring boards Ba will be described. First, a dividing groove is formed along the boundary between the first region 10 a and the second region 10 b and the boundary between the sections 11. Next, by applying a bending stress to the insulating substrate 10 along the dividing grooves, the insulating base 10 is broken along the dividing grooves. As described above, the plurality of wiring boards Ba are taken out.

  The wiring conductor 20 is a member for obtaining electrical continuity between, for example, an electronic component mounted on a wiring board taken out from the plurality of wiring boards X1 and an external electric circuit board on which the wiring board is mounted. Examples of the form of the wiring conductor 20 include a metallized layer shape, a plating layer shape, a vapor deposition layer shape, a metal foil layer shape, and a via shape. Examples of the material constituting the wiring conductor 20 include metal materials such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, and gold.

  Here, an example of a method for forming the wiring conductor 20 when copper is used as the material constituting the wiring conductor 20 will be described. First, a copper paste is kneaded with an organic solvent, a binder, etc. to produce a conductor paste. Next, the produced conductor paste is printed on the ceramic green sheet constituting the insulating substrate 10 by a predetermined printing method (for example, screen printing method). The wiring conductor 20 is formed as described above. In order to selectively form the wiring conductor 20 with respect to the section 11b, for example, a plate-making pattern for printing used when printing a conductor paste constituting the wiring conductor 20 by screen printing is used as the section 11a. The corresponding part may be a non-formed part (part configured not to be printed).

  In the multiple wiring substrate X1 according to the present embodiment, the wiring conductor 20 is not provided in the section 11a of the first region 10a. Therefore, the stress caused by the difference in shrinkage between the material constituting the insulating base 10 (for example, a glass ceramic sintered body) and the material constituting the wiring conductor 20 (for example, copper) is concentrated at the four corners of the first region 10a. You can ease it. Therefore, in the multiple wiring substrate X1, it is possible to suppress the occurrence of warping due to the concentration of the stress at the four corners of the first region 10a. That is, the wiring board Ba taken out from the plurality of wiring boards X1 is excellent in mountability of electronic components and mountability on an external electric circuit board.

  FIG. 2 is a plan view showing a multi-chip wiring board X2 according to the second embodiment of the present invention. The plurality of wiring board X2 are plural in that the separation portion A includes the section 11c adjacent to the section 11a in the row direction or the column direction in addition to the section 11a and the second area 10b of the first region 10a. It differs from the wiring board X1 for taking. Other configurations of the multi-cavity wiring board X2 are the same as those described above for the multi-cavity wiring board X1.

  In the multiple wiring substrate X2 according to the present embodiment, no wiring conductor is provided in the section 11c in addition to the section 11a of the first region 10a. Therefore, it is possible to more effectively alleviate the stress concentration at the four corners of the first region 10a. Therefore, in the multiple wiring substrate X2, it is possible to more effectively suppress the occurrence of warping due to the concentration of the stress at the four corners of the first region 10a. That is, the wiring board Ba taken out from the plurality of wiring boards X2 is more excellent in mountability of electronic components and mountability on an external electric circuit board.

  Although specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  In the multiple wiring substrate X1, the length in the row direction of the section 11a of the first region 10a may be different from the length in the column direction of the section 11a of the first region 10a. Similarly, in the multiple wiring substrate X2, the length in the row direction of the portion where the wiring conductor 20 composed of the sections 11a and 11c of the first area 10a is not formed and the sections 11a and 11c of the first area 10a are formed. The length in the column direction of the part where the wiring conductor 20 is not formed may be different.

  In the multiple wiring board X2, one of the section 11c adjacent to the section 11a in the row direction in the first area 10a or the section 11c adjacent to the section 11a in the first area 10a in the column direction is connected to the wiring conductor. It is good also as the section 11b which has 20.

It is a top view showing the wiring board for multiple acquisition which concerns on the 1st Embodiment of this invention. It is a top view showing the wiring board for multiple acquisition which concerns on the 2nd Embodiment of this invention. It is a top view showing the conventional wiring board for multiple picking.

Explanation of symbols

X1, X2 Plural wiring board A Abandonment part B Wiring board part 10 Insulating base 10a First area 10b Second area 11 Section 11a Section 11b (located at the four corners) Section 11b (Remaining section) Section 20 Wiring conductor

Claims (2)

A first region composed of a plurality of matrix-like sections, and a second region surrounding the first region;
Of the plurality of sections of the first region, at least the sections located at the four corners constitute a surrogate part together with the second area, and the remaining sections each constitute a wiring board part having a wiring conductor. , Multiple wiring board. The wiring board according to claim 1, wherein the discarding portion includes a section adjacent to the section located at the four corners in a row direction or a column direction.

Images