JP2013077739A - Wiring board, electronic device provided with the wiring board, and electronic module device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which has high mounting reliability, an electronic device, and an electronic module device.SOLUTION: A wiring board has an insulating substrate 3 in which a recess 1a for accommodating an electronic component E is formed, and a plurality of electrodes 2 formed on a bottom face 1c of the recess. A part of a side wall 1b of the recess is inclined, and an angle formed by a part of the side wall 1b of the recess and the bottom face 1c of the recess is an acute angle.

Description

  The present invention relates to, for example, a wiring board on which electronic components are mounted, and an electronic device and an electronic module device including the wiring board.

  Conventionally, an electronic device in which electronic components such as a capacitor, a coil, and a resistor are mounted on a wiring board via a brazing material such as solder is known.

  For example, in an imaging apparatus that is applied to a digital camera, an optical sensor, or the like in which an image sensor such as a CCD type or a CMOS type is mounted on a wiring board, the image sensor is mounted on the wiring board and the image sensor is mounted by a lens fixing member A lens is arranged on the top, the imaging element is sealed by the lens and a lens fixing member, and electronic components such as a capacitor and a resistor are mounted around the imaging element. Such an imaging apparatus converts light (image) input to the light receiving portion of the imaging element mounted on the wiring board into an electrical signal by the imaging element, and connects the connection member such as a bonding wire and the wiring conductor of the wiring board. And it outputs to the external circuit etc. in a digital camera via an external terminal. In order to reduce the area of the imaging device by reducing the area of the imaging device, the imaging device is disposed so as to close the recess on the upper surface of the wiring substrate, and the recess is formed on the upper surface of the wiring substrate. 2. Description of the Related Art A plurality of electronic parts such as capacitors, coils, and resistors for processing an electric signal from an image sensor are mounted on the bottom surface via a brazing material such as solder.

JP 2004-335533 A

  However, in an electronic device in which a plurality of electronic components such as capacitors, coils, and resistors are mounted, when the electronic components such as capacitors, coils, and resistors are mounted via a brazing material such as solder in a recess provided in the wiring board. There may be a phenomenon in which electronic components rise. When the above phenomenon occurs, it becomes impossible to electrically connect the electronic component and a semiconductor element such as a CCD type image sensor or a CMOS type image sensor mounted around the wiring board, and an electric signal from the semiconductor element is processed. There is a problem that the electronic device cannot output a normal signal.

  In addition, for example, in an imaging device, when an electronic component is mounted on the bottom surface of a recess provided on the upper surface of a wiring board, the electronic component that occurs when the above phenomenon occurs contacts the imaging device mounted on the upper portion. As a result, there is a problem that the image sensor is damaged.

  The present invention has been devised in view of the above problems of the prior art, and an object thereof is to provide a wiring board, an electronic device, and an electronic module device with high mounting reliability.

A wiring board according to an aspect of the present invention includes an insulating substrate and a plurality of electrodes formed on the insulating substrate. The insulating substrate has a recess in which an electronic component is accommodated. The recess has a plurality of electrodes formed on the bottom surface thereof. A part of the side wall of the recess is inclined. The angle formed by a part of the side wall of the recess and the bottom surface of the recess is an acute angle.

  According to another aspect of the present invention, an electronic device includes the wiring board having the above-described configuration and an electronic component mounted on the wiring board.

  According to another aspect of the present invention, an electronic module device includes the electronic device configured as described above and an electronic device mounted on the electronic device.

  In the wiring board according to one aspect of the present invention, the electronic component is formed into the concave portion by inclining a part of the side wall of the concave portion so that an angle formed by a part of the side wall of the concave portion and the bottom surface of the concave portion is an acute angle. When mounting, even if an electronic component is about to occur, the electronic component is effectively prevented by the side wall of the concave part, and wiring with high mounting reliability of the electronic component It becomes a substrate.

  According to another aspect of the present invention, the first electrode is formed on the bottom surface along the side wall of the concave portion that is partially inclined, and the size of the first electrode is the second size in plan view. When the electronic component is mounted in the recess, it is the side wall side of the recess that is partly inclined when the electronic component is mounted in the recess. The rise of the electronic component is surely effectively prevented by the side wall of the concave portion that is partially inclined, so that the wiring board with higher mounting reliability of the electronic component is obtained.

  In addition, according to another aspect of the present invention, even if a part of the electronic component is stored so that a part of the inclined side wall is in contact with the side wall of the recessed portion, The rise of the electronic component is more surely prevented by the side wall of the concave portion that is partially inclined, and the electronic device has a higher mounting reliability of the electronic component.

  According to another aspect of the present invention, the electronic device includes the wiring board having the above-described configuration, thereby improving the mounting reliability of the electronic component.

  According to another aspect of the present invention, the electronic module device includes the electronic device configured as described above, thereby improving the mounting reliability of the electronic component.

(A) is a top view which shows an example of embodiment of the electronic device of this embodiment, (b) is sectional drawing which shows the cross section in the AA of the electronic device shown by Fig.1 (a). is there. (A) is a perspective view which shows an example of embodiment of the electronic module apparatus of this embodiment, (b) is a cross section which shows the cross section in the AA of the electronic module apparatus shown by Fig.2 (a). FIG. (A) is a top view which shows the other example of embodiment of the electronic device of this embodiment, (b) is a cross section which shows the cross section in the AA of the electronic device shown by Fig.1 (a). FIG. It is sectional drawing which shows the formation method of the through-hole of the ceramic green sheet in the manufacturing method in the wiring board of this embodiment.

  Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
An electronic device according to a first embodiment of the present invention will be described with reference to FIG. The electronic device in this embodiment includes a wiring board 1 and an electronic component E mounted on the wiring board 1.

  The wiring substrate 1 includes an insulating substrate 3 and a plurality of electrodes 2 formed on the insulating substrate 3.

  The insulating substrate 3 has a recess 1a in which the electronic component E is accommodated.

  The insulating substrate 3 has a concave portion 1a for mounting an electronic component E such as a capacitor, a coil, and a resistor on a top surface via a brazing material such as solder. For example, an aluminum oxide sintered body / mullite sintered body・ Electrically insulating ceramics such as silicon carbide sintered body, aluminum nitride sintered body, silicon nitride sintered body, glass ceramic sintered body, epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin, In addition, a plurality of substantially rectangular insulating layers made of a resin (plastics) such as a fluororesin such as tetrafluoroethylene resin are stacked in a vertical direction.

  If the insulating substrate 3 is made of, for example, an aluminum oxide sintered body, a sintering aid such as silicon oxide, magnesium oxide, calcium oxide is added to the aluminum oxide powder, and an appropriate organic binder, solvent, etc. Is added to and mixed to make a mud, and the mud is made into a green sheet (raw sheet) by adopting the doctor blade method and the calender roll method. It is manufactured by processing into a square shape and laminating and firing a plurality of these.

  Further, when the insulating substrate 3 is made of, for example, a resin, it can be formed by molding by a transfer molding method, an injection molding method, or the like using a mold that can be molded into a predetermined shape. Moreover, what impregnated resin to the base material which consists of glass fiber like glass epoxy resin, for example may be used. In this case, it can be formed by impregnating a substrate made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

  In this insulating substrate 3, a plurality of electrodes 2 are deposited on the bottom surface 1c of the recess, and a wiring including a through conductor such as a via-hole conductor or a through-hole conductor is provided on the upper surface on which an electronic device C such as an image sensor is mounted. A conductor 4 is deposited. The plurality of electrodes 2 and wiring conductors 4 are made of metal powder metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu) when the insulating substrate 3 is made of ceramics. A plurality of electrodes 2 and a conductor paste for wiring conductors 4 are printed in a predetermined shape on a ceramic green sheet for insulating substrate 3 by screen printing or the like, and fired simultaneously with the ceramic green sheet. It is formed at a predetermined position. Of the internal conductors, the through conductor that penetrates the ceramic green sheet in the thickness direction may be filled with a through hole formed in the ceramic green sheet by printing a conductor paste. Such a conductor paste can be appropriately obtained by adding an appropriate solvent and a binder to a metal powder such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), and kneading them. It is produced by adjusting to a proper viscosity. In order to increase the bonding strength with the insulating substrate 3, glass or ceramics may be included.

The plurality of electrodes 2 and wiring conductors 4 are made of a metal material such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium, and alloys thereof when the insulating substrate 3 is made of resin. For example, the copper foil processed into the shape of the wiring conductor is transferred onto a resin sheet made of glass epoxy resin, and the resin sheet on which the copper foil is transferred is laminated and bonded with an adhesive. Of the internal conductors, the through conductors that penetrate the resin sheet in the thickness direction can be deposited on the inner surface of the through holes formed in the resin sheet by conductor paste printing or plating, or by filling the through holes. Good. Further, it is formed by integrating a metal foil or a metal column on an insulating substrate made of a resin, or by depositing the insulating substrate 3 using a sputtering method, a vapor deposition method, a plating method or the like. Note that the external electrode formed on the lower surface of the wiring board 1 for electrical connection with the external circuit board is also formed in the same manner as the electrode 2 described above.

  In the recess 1a, a part of the side wall 1b is inclined, and an angle formed by a part of the side wall 1b of the recess and the bottom surface 1c of the recess is an acute angle.

  A plurality of electrodes 2 are formed on the bottom surface of the recess, and are electrically connected to terminals of an electronic component E such as a capacitor, a coil, and a resistor via a brazing material such as solder.

  The electronic component E is accommodated in the recess 1a. The electronic component E has a plurality of terminals. Each terminal of the electronic component E is electrically connected to each of the plurality of electrodes 2 formed on the bottom surface of the recess through a brazing material such as solder.

  In the wiring board 1 of the present embodiment, the insulating substrate 3 in which the concave portion 1a in which the electronic component E is accommodated, the plurality of electrodes 2 formed on the bottom surface 1c of the concave portion, and a part of the side wall 1b of the concave portion are formed. It is inclined, and an angle formed by a part of the side wall 1b of the recess and the bottom surface 1c of the recess is an acute angle.

  In this way, the electronic component E is mounted in the recess 1a by inclining a part of the side wall 1b of the recess so that an angle formed by a part of the side wall 1b of the recess and the bottom surface 1c of the recess is an acute angle. In this case, even if the Manhattan phenomenon in which the electronic component E rises is generated, the rising of the electronic component E is effectively prevented by the side wall 1b of the recessed portion that is partially inclined. The wiring board 1 according to one aspect can realize an electronic device improved in terms of mounting reliability.

  Next, the manufacturing method of the wiring board 1 of this embodiment is demonstrated.

The insulating substrate 3 is made of, for example, an aluminum oxide (Al ₂ O ₃ ) -based sintered body, and has a recess 1 a in which the electronic component E is accommodated on the upper surface. When the insulating substrate 3 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al ₂ O ₃ ), silica (SiO ₂ ), magnesia (MgO) is used as a sintering aid for Al ₂ O ₃ powder. ), Calcia (CaO), etc. are added, and an appropriate binder, solvent and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for obtaining a large number of pieces is obtained by a conventionally known molding method such as a doctor blade method.

  Using this ceramic green sheet, the wiring substrate 1 is manufactured by the following steps (1) to (5).

  (1) A punching process using a punching die at a portion to be the side wall 1b of the recess.

  (2) Printing of a conductor paste for forming a plurality of electrodes 2 formed on the bottom surface 1c of the recess and a wiring conductor 4 including through conductors such as via-hole conductors and through-hole conductors on the upper surface on which the electronic device C is mounted Application process.

  (3) The process of producing the ceramic green sheet laminated body by laminating | stacking the ceramic green sheet used as each insulating layer.

  (4) A step of cutting and separating the ceramic green sheet laminate into laminates to be the individual insulating substrates 3 and firing them to obtain sintered bodies having the respective recesses 1a.

  (5) A step of depositing a metal plating layer on the surfaces of the plurality of electrodes 2 for protecting the plurality of electrodes 2 to prevent oxidation and facilitating brazing.

  Since this wiring board 1 can be produced in a lump by collecting many of them, it can be manufactured at a lower cost than a semiconductor package of a type in which a metal frame is provided on a ceramic substrate, and has high versatility. .

  In the electronic device of the present embodiment, as shown in FIG. 4, a part of the side wall 1b of the recess is inclined, and an angle formed between a part of the side wall 1b of the recess and the bottom surface 1c of the recess is X degrees. In this case, it is preferable that 70 ≦ X ≦ 85. When X is less than 70, the thickness of the side wall 1b of the concave portion is thin, and therefore, there is a possibility that a defect such as a crack or chipping may occur in the side wall 1b of the concave portion due to an external force when handling the wiring board 1. When X exceeds 85, the side wall 1b of the recess may not sufficiently prevent the electronic component E from rising. In addition, by setting X to the above range, even if the Manhattan phenomenon in which the electronic component E rises is generated, the rising of the electronic component E is effectively prevented by the inclined side wall 1b of the electronic component. Mounting reliability is high.

  In addition, the through-holes that are inclined portions in which some of the inner walls are inclined so that a part of the side wall 1b of the recess is inclined are at least one pair of inner walls facing each other of the rectangular through-holes formed in the ceramic green sheet. Is formed so as to spread at an angle θ of 70 to 85 degrees from one main surface of the ceramic green sheet to the other main surface. Thus, the inner wall of the through hole is formed so as to spread at an angle θ of 70 to 85 degrees from one main surface of the ceramic green sheet to the other main surface, so that the inner wall of the through hole is the lower surface of the insulating substrate 2. Can be formed so as to spread outward at an angle θ of 70 to 85 degrees.

  In order to form at least one pair of opposing inner walls of the square through-holes so as to spread from one main surface to the other main surface of the ceramic green sheet at an angle θ of 70 to 85 degrees, FIG. As shown in the cross-sectional view for explaining the method of forming the through hole in (a), a part of the clearance G between the punch 6 and the die 7 of the punching die may be set large. For example, if the thickness of the ceramic green sheet is about 0.5 mm, the partial clearance G of the mold may be about 0.2 to 0.5 mm. By doing so, the angle θ can be set to 70 to 85 degrees. The ceramic green sheets described above may be a stack of a plurality of sheets. Although it is preferable from the viewpoint of productivity that the plurality of ceramic green sheets are punched after being stacked to a thickness corresponding to the depth of the recess 1a, the angle formed by the side wall 1b of the recess and the bottom surface 1c of the recess. In order to make the diameter gradually smaller, after punching each of them at a predetermined angle, the inner walls of the through holes serving as the side walls 1b of the recesses can be formed into a desired shape by stacking them. Such a structure is inferior in productivity as compared with the case where punching is performed after laminating a plurality of ceramic green sheets, but without impairing the effect of the electronic component E being lifted, the ceramic green sheets and the recesses that become the recesses 1a Therefore, it is possible to obtain a highly reliable wiring board.

  In the wiring board 1 of the present embodiment, the electronic component E is formed by inclining a part of the side wall 1b of the concave part so that an angle formed by a part of the side wall 1b of the concave part and the bottom surface 1c of the concave part is an acute angle. When mounting in the recess 1a, even if the Manhattan phenomenon in which the electronic component E rises is generated, the rise of the electronic component E is effectively prevented by the side wall 1b of the recess that is partially inclined. The wiring board 1 according to one aspect of the present embodiment can realize an electronic device with improved mounting reliability.

In addition, the plurality of electrodes 2 includes the first electrode 2a and the second electrode 2b, and the first electrode 2a is formed on the bottom surface 1c along the side wall 1b of the concave portion that is partially inclined. In plan view, the size of the first electrode 2a is smaller than the size of the second electrode 2b. By adopting such a structure, when the electronic component E is mounted in the recess 1a, the electronic component E tends to rise on the side wall 1b side of the recess that is partially inclined. The rising of the electronic component E is effectively prevented by the inclined concave side wall 1b.

  The first electrode 2a may be formed away from the side wall 1b of the recess. Thus, when gold (Au), silver (Ag), or the like is deposited on the surface of the electrode 2 using electrolytic plating, the side wall 1b of the recess is inclined, thereby inhibiting the circulation of the plating solution. In addition, it is possible to avoid the disadvantage that the plating film is not formed well in the vicinity of the side wall 1b of the recess.

  Further, by firing individual laminates cut out from the ceramic green sheet laminate, each electrode 2 and the wiring conductor 4 are fired to be deposited. That is, the plurality of electrodes 2 on the bottom surface 1c of the recess are formed with a thickness of 5 to 10 μm, and the wiring conductor of the input / output terminal to which the electronic device C is electrically connected is formed with a thickness of 5 to 10 μm. Is done.

  Furthermore, in order to protect each electrode 2 and prevent oxidation, and to perform brazing on it easily and firmly, a Ni plating layer having a thickness of 0.5 to 10 μm is formed on the surface of the plurality of electrodes 2. The Ni plating layer and the gold (Au) plating layer having a thickness of 0.5 to 2 μm may be sequentially applied.

  The wiring board 1 thus formed houses the electronic component E in the recess 1a and is electrically connected with a solder paste or the like to provide an electronic device.

  Further, the electronic device C having a shape larger than the electronic component E is mounted on the upper surface of the electronic device described above, and the electronic device C and the electronic component E are electrically connected to the wiring conductor 4 using the connecting member 8. The electronic module device is electrically connected via the wiring conductor 1. The electronic device C is a semiconductor element such as a CCD image sensor or a CMOS image sensor. As the connection member 8, for example, a bonding wire made of gold (Au) or the like is used. In addition, for the purpose of protecting the electronic device C and promoting heat dissipation from the electronic device C, the recess 1a may be filled with resin or the like as necessary. Moreover, those resins may serve also for the purpose of fixing the electronic device C.

  In the wiring board 1 of the present embodiment, the electronic component E is formed by inclining a part of the side wall 1b of the concave part so that an angle formed by a part of the side wall 1b of the concave part and the bottom surface 1c of the concave part is an acute angle. Even when the Manhattan phenomenon occurs in the electronic component E when mounted in the recess 1a, the rise of the electronic component E is effectively prevented by the side wall 1b of the recess that is partly inclined. 1 makes it possible to realize an electronic device improved in terms of mounting reliability.

  In the wiring substrate 1 of the present embodiment, the plurality of electrodes 2 include the first electrode 2a and the second electrode 2b, and the first electrode 2a and the second electrode 2b are formed on the bottom surface 1c along the side wall 1b of the recessed portion that is partially inclined. When the first electrode 2a is formed and the size of the first electrode 2a is smaller than the size of the second electrode 2b in plan view, the electronic component E is mounted in the recess 1a. In addition, the electronic component E is intended to be raised at the side wall 1b side of the concave portion that is partially inclined, but the rising of the electronic component E is effectively prevented by the side wall 1b of the concave portion that is partially inclined. Thus, the wiring board 1 can realize an electronic device improved in terms of mounting reliability.

  In the electronic device according to the present embodiment, the electronic component E is housed in the recess 1a and includes the wiring board 1 electrically connected to the plurality of electrodes 2, thereby improving the mounting reliability of the electronic component. .

  In the electronic device of the present embodiment, as shown in FIGS. 1 and 2, the electronic device E is accommodated such that a part of the side wall 1 b of the recessed portion that is inclined and the electronic component E are in contact with each other. Even if the Manhattan phenomenon is about to occur in the component E, the rising of the electronic component E is effectively prevented by the side wall 1b of the concave portion that is partially inclined, and the wiring board 1 is improved in terms of mounting reliability. An electronic device can be realized.

  In the electronic device of this embodiment, the mounting reliability of the electronic component is improved by including the wiring board 1 having the above-described configuration.

  In the electronic module device of the present embodiment, the mounting reliability of the electronic component is improved by including the electronic device having the above configuration.

(Second Embodiment)
An electronic device according to a second embodiment of the present invention will be described with reference to FIG. The electronic device of this embodiment is different from the first embodiment in the structure of the recess. In the first embodiment, a part of the side wall of the recess is inclined, and the angle formed by each of at least one pair of side walls opposed to the recess and the bottom surface of the recess is an acute angle. In the embodiment, in at least one pair of side walls facing each other, the angle formed by one side wall and the bottom surface of the recess is an acute angle, and the angle formed by the other side wall and the bottom surface of the recess is an obtuse angle.

  In the electronic device of this embodiment, a part of the side wall of the recess is inclined, the angle formed by one side wall and the bottom surface of the recess is Y degrees, and the angle formed by the other side wall and the bottom surface of the recess is Z degrees. In this case, it is preferable that 70 ≦ Y ≦ 85 and 95 ≦ Z ≦ 110. When Y is less than 70, the thickness of the side wall 1b of the recess becomes thin, and therefore, there is a possibility that a defect such as a crack or chipping may occur in the side wall 1b of the recess due to an external force when handling the wiring board 1. If Y exceeds 85, the side wall 1b of the recess may not sufficiently prevent the electronic component E from rising. Further, by setting X to the above range, even if the Manhattan phenomenon occurs in the electronic component E, the rising of the electronic component E is effectively prevented by the inclined side wall 1b, and the mounting of the electronic component is prevented. High reliability. When Z is less than 95, when the electronic component E is stored in the recess, the opening of the recess becomes narrow, and it may be difficult to store the electronic component E in the recess. When Z exceeds 110, the size of the concave portion becomes large, and thus there is a possibility that the wiring conductor 4 including a through conductor such as a via-hole conductor or a through-hole conductor cannot be formed at a desired location.

  In addition, in at least one pair of side walls opposed to the concave portion, a part of the inner walls so that an angle formed by one side wall and the bottom surface of the concave portion is an acute angle and an angle formed by the other side wall and the bottom surface of the concave portion is an obtuse angle. In order to form a through-hole that becomes an inclined portion where the slope is inclined, the ceramic green sheet 5 is punched with a punching die as shown in a cross-sectional view for explaining the method of forming the through-hole in FIG. After that, an elastic body such as a mold having a sloping portion or rubber may be pressed. The ceramic green sheet 5 described above may be a stack of a plurality of sheets.

In the wiring substrate 1 of the present embodiment, in at least one pair of opposing side walls of the recess 1a, an angle formed by one side wall and the bottom surface 1c of the recess is an acute angle, and an angle formed by the other side wall and the bottom surface 1c of the recess. When the electronic component E is mounted in the recess 1a due to the obtuse angle, even if the Manhattan phenomenon is to occur in the electronic component E, the rise of the electronic component E is effectively prevented by one side wall of the inclined recess. As a result, the wiring board 1 can realize an electronic device improved in terms of mounting reliability.

  In the wiring substrate 1 of the present embodiment, the plurality of electrodes 2 include the first electrode 2a and the second electrode 2b, and the first surface is formed on the bottom surface 1c along one side wall of the inclined recess. When the electrode 2a is formed, and the size of the first electrode 2a is smaller than the size of the second electrode 2b in plan view, the electronic component E is mounted in the recess 1a. The electronic component E is intended to be raised on one side wall of the inclined recess, but the rising of the electronic component E is effectively prevented by one side wall of the inclined recess, The wiring board 1 can realize an electronic device with improved mounting reliability.

  In the electronic device according to the present embodiment, the electronic component E is housed in the recess 1a and includes the wiring board 1 electrically connected to the plurality of electrodes 2, thereby improving the mounting reliability of the electronic component. .

  In the electronic device according to the present embodiment, as shown in FIG. 3, the electronic component E is accommodated so that one side wall of the inclined concave portion and a part of the electronic component E are in contact with each other. Even if a phenomenon occurs, the rise of the electronic component E is effectively prevented by one side wall of the inclined concave portion, and the wiring board 1 realizes an electronic device with improved mounting reliability. It becomes possible.

  In the electronic device of this embodiment, the mounting reliability of the electronic component is improved by including the wiring board 1 having the above-described configuration.

  In the electronic module device of the present embodiment, the mounting reliability of the electronic component is improved by including the electronic device having the above configuration.

DESCRIPTION OF SYMBOLS 1 ... Wiring board 1a ... Recess 1b ... Side wall 1c ... Recess bottom 2 ... Multiple electrodes 2a ... 1st electrode 2b ... ... Second electrode 3 ... Insulating substrate 4 ... Wiring conductor

Claims (5)

An insulating substrate having a recess for storing electronic components;
A plurality of electrodes formed on the bottom surface of the recess;
A part of the side wall of the recess is inclined, and an angle formed by a part of the side wall of the recess and the bottom surface of the recess is an acute angle. The plurality of electrodes comprises a first electrode and a second electrode;
The first electrode is formed on the bottom surface along the side wall of the concave portion that is partially inclined,
2. The wiring board according to claim 1, wherein the size of the first electrode is smaller than the size of the second electrode in a plan view. The wiring board according to claim 1 or 2,
An electronic device comprising: an electronic component housed in the recess formed on the wiring board and electrically connected to the plurality of electrodes.   The electronic device according to claim 3, wherein the electronic device is accommodated so that a side wall of the concave portion that is partly inclined and a part of the electronic component are in contact with each other. 5. The upper surface of the electronic device according to claim 3, comprising the wiring substrate having a wiring conductor led out from the plurality of electrodes to the upper surface of the insulating substrate, and larger than the electronic component. The electronic device having the shape is mounted, and the electronic device and the wiring conductor led to the upper surface of the insulating substrate are electrically connected,
The electronic module apparatus according to claim 3 or 4, wherein the electronic device and the electronic component are electrically connected via the wiring conductor.

Images