JP2003197801A - Package for receiving electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To permit the easy and correct recognition of the outer peripheral recognition place of an insulation base body and permit the mounting of an electronic component and a lid body by a picture recognizing device after accurately aligning them upon aligning the electronic component and the lid body even when there are burrs on the outside surfaces of the insulation base bodies of an electronic component package manufactured from the mother base board for multiple molding through chocolate breaks. <P>SOLUTION: The outside surfaces of the insulation base body 1 are provided with a broken-out sections along the whole periphery of a ceramic layer except the upper end or upper and lower ends among the outside surfaces of the insulation base bodies 1 while notches 5, formed by remaining the upper end ceramic layer, are formed on the neighboring two outside surfaces. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an electronic component storage package for storing electronic components such as a solid-state image sensor, and more particularly, to a method for firing a multi-cavity substrate. The present invention relates to a package for storing electronic components obtained by dividing into individual substrates by a so-called chocolate break. 2. Description of the Related Art Conventionally, an electronic component housing package (hereinafter, referred to as an electronic component package) for housing electronic components such as a semiconductor element and a piezoelectric vibrator has, for example, an electronic component housed in a central portion of an upper surface. An insulating base having a plurality of metallized wiring conductors extending from the inside of the recess to the lower surface via the outer surface, and a metal, ceramic, or the like joined to cover the electronic component on the insulating base. And a lid body. The bottom surface of the concave portion of the insulating base forms a mounting portion on which electronic components are mounted, and a portion of the metallized wiring conductor extending from the side surface to the lower surface of the insulating base is an external connection connected to an external electric circuit board. Conductors are formed. After mounting and fixing the electronic component on the mounting portion of the insulating base and electrically connecting each electrode of the electronic component to the metallized wiring conductor in the concave portion, the upper surface of the insulating base is covered with the cover so as to cover the concave portion. By joining the body, it becomes an electronic device as a product. The size of such electronic component packages has recently become extremely small, on the order of several mm square, with the miniaturization of electronic devices. In this case, a plurality of regions serving as an insulating substrate are integrally formed in a large-area ceramic green sheet laminate serving as a mother substrate for the insulating substrate after firing, by arranging the regions vertically and horizontally and on the laminate. Dividing grooves are formed on the lower surface to divide them into regions to be the respective insulating bases, and a plurality of packages obtained by firing these are divided (chocolate breaks) along the dividing grooves to obtain a large number. 2. Description of the Related Art Intensive production of individual products (many individual production) is performed. On the other hand, in such a relatively small-sized electronic component package, when the electronic component is mounted or the lid is attached, the mounting position of the electronic component and the mounting position of the lid are accurately determined. In order to manage, an automatic machine using an image recognition device is used. At this time, since there is no space on the upper surface of the insulating base, it is difficult to provide a recognition mark as a reference for aligning the electronic component and the lid. Image recognition is performed on the part separated from the
It is common practice to position the electronic components and the lid based on this. [0006] However, as described above, an insulating substrate obtained by chocolate breaking along a dividing groove on a mother substrate in which a large number of regions serving as insulating substrates are integrally arranged and formed. Then, when the mother substrate is divided into individual insulating bases along the division grooves, the division grooves reach the upper surface side or the lower surface side where the division grooves are formed, although the division is accurately performed along the division grooves. Since the mother substrate is divided by breaking at an intermediate portion between the upper surface and the lower surface which are not formed, burrs protruding from the division groove by about 50 μm are likely to occur. When such burrs are generated, when the image recognition device attempts to recognize the outer periphery of the insulating base, the outer periphery including the burrs is recognized as the outer periphery of the insulating base. It becomes impossible to accurately recognize the outer periphery of the base. For this reason, there have been problems that the electronic component cannot be accurately mounted at a correct position, and the lid cannot be accurately attached to the outer peripheral portion of the upper surface of the insulating base so as to cover the concave portion. In addition, focusing the image recognition apparatus only on the precisely divided outer periphery of the upper surface of the insulating base and recognizing the outer periphery requires a certain depth in the depth of focus of the image recognition apparatus. In the case of an insulating substrate, it has been difficult to accurately recognize the outer periphery thereof. Also, it is not practical to remove the burrs by polishing the side surfaces of the respective insulating bases after the division, which is very time-consuming and time-consuming, which increases the number of manufacturing steps, and is not practical. In the case of a material having hardness, it is difficult in terms of processing technology. Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to provide an insulating base for an electronic component package manufactured by a chocolate break from a mother board for multi-piece production. Even if there are burrs on the outer surface, the image recognition device can easily and accurately recognize the recognition points on the outer periphery of the insulating base when aligning the electronic components and the lid, thereby accurately positioning the electronic components and the lid. It is an object of the present invention to provide an object which can be attached by being aligned. An electronic component package according to the present invention is formed by laminating a plurality of ceramic layers, has a mounting portion on which an electronic component is mounted on an upper surface, and has an external connection conductor on an outer surface. An electronic component storage package that has a substantially rectangular parallelepiped insulating base formed with a component, mounts the electronic component on the mounting portion, and seals the electronic component by joining a lid to an upper surface of the insulating base. In the insulating substrate, a portion of the ceramic layer other than the upper or lower ceramic layer of the outer surface has a fractured surface over the entire circumference, and at least two outer surfaces adjacent to each other. A notch formed by cutting out the ceramic layer at the upper end thereof. According to the electronic component package of the present invention, the portion of the ceramic layer other than the upper and lower ceramic layers on the outer surface of the insulating base has a fractured surface over the entire circumference, and at least two adjacent portions are formed. Since the notch is formed by cutting out the upper outer layer leaving the upper ceramic layer, even if burrs occur on the fractured surface, burrs are formed at the portion where the notch was formed. When viewed from above, the portion of the notch that is not recognized and is recognized is recognized as a straight side. Therefore, if the outer surface of the insulating base above the notch is recognized by the image recognition device,
The outer periphery of the original insulating base can be accurately and easily recognized. As a result, the electronic components and the lid can be accurately aligned and attached. Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view showing an example of an embodiment of an electronic component package according to the present invention, wherein 1 is an insulating base, and 2 is a lid. These constitute a container for housing the electronic component 3. The insulating substrate 1 of the present invention is mainly made of aluminum oxide sintered body, aluminum nitride sintered body, mullite sintered body, silicon carbide sintered body, silicon nitride sintered body, glass ceramics or the like. It is a substantially rectangular parallelepiped made of ceramics, and a concave portion 1a for accommodating an electronic component 3 such as a semiconductor element or a piezoelectric vibrator is formed on the upper surface thereof.
The electronic component 3 is adhered and fixed to the bottom surface of a through an adhesive such as an epoxy resin. The insulating substrate 1 is manufactured from a so-called multi-piece mother board. Specifically, a plurality of regions serving as the insulating base 1 are arranged vertically and horizontally on the wide-area ceramic green sheet laminate serving as a mother substrate for the insulating base 1 after firing, and are integrally formed. By making cuts on the upper surface or upper and lower surfaces with a cutter blade or a press die, divided grooves are formed to divide the regions to be the respective insulating bases 1 and then fired to make the insulating bases 1 vertically and horizontally in the mother substrate. An aggregate formed integrally with a plurality of pieces is obtained, and a chocolate break is performed on the aggregate along the dividing groove, whereby a large number of pieces are simultaneously and intensively manufactured. A plurality of metallized wiring conductors 4 made of metallized metal powder such as tungsten, molybdenum, copper, silver, etc. are formed on the insulating substrate 1 from the inside of the concave portion 1a to the side surface. The metallized wiring conductor 4 is
a functions as a conductive path for electrically connecting each electrode of the electronic component 3 mounted on the electronic component 3 to an external electric circuit.
Each electrode of the electronic component 3 is electrically connected to a portion in the area a through a bonding wire or the like, and an external connection conductor 4a is formed in a portion extending from the outer surface to the lower surface of the insulating base 1. It is electrically connected to the wiring conductor of the electric circuit board. When the metallized wiring conductor 4 is made of, for example, metallized tungsten powder, a metallized paste obtained by adding and mixing an appropriate organic binder, solvent, plasticizer, dispersant and the like to the tungsten powder is mixed with a known screen printing method. By printing and applying a desired pattern on a ceramic green sheet serving as a mother substrate for the insulating substrate 1 and firing this together with the ceramic green sheet serving as a mother substrate for the insulating substrate 1, the outer surface from the inside of the concave portion 1a is removed. Formed over the lower surface. The metallized wiring conductor 4 has a nickel plating layer having a thickness of about 1 to 10 μm
It is preferable to sequentially apply a gold plating layer having a thickness of about μm to effectively prevent the metallized wiring conductor 4 from being oxidized and corroded, and to form a wiring between the metallized wiring conductor 4 and the bonding wire and the external electric circuit board. Good connection with the conductor can be achieved. The lid 2 is made of an iron-nickel-cobalt alloy, ceramic, or the like, and is fixed to the insulating base 1 with a bonding material such as a resin. On the outer surface of the insulating substrate 1, a cut surface 1b corresponding to the inner surface of a dividing groove formed in a mother substrate for manufacturing the insulating substrate 1 is formed on the upper or lower ceramic layer.
And a cutout portion 5 formed by cutting out at least two adjacent outer surfaces apart from the external connection conductor 4a while leaving the upper end ceramic layer. Further, a portion of the ceramic layer other than the upper and lower ceramic layers on the outer surface has a fractured surface formed by being divided along the division groove of the mother substrate over the entire circumference. Since the notch 5 is formed as described above, when the mother substrate for manufacturing the insulating substrate 1 is divided along the dividing groove, the insulating substrate 1 corresponding to the notch 5 is formed.
No burrs are formed on the outer side surface, and when viewed from above, it becomes a linear side portion. Further, even when the thickness of the insulating base 1 is large, the thickness of the outer periphery to be recognized becomes thinner in the portion where the notch portion 5 is formed, so that the influence of the depth of focus of the image recognition device is affected. It becomes smaller and can be accurately recognized. Therefore, the insulating base 1 at a position corresponding to the notch 5
When the outer surface of the electronic component 3 and the lid 2 are recognized from above by an image recognition device and used as a reference for alignment, the electronic component 3 and the lid 2 can be accurately aligned and attached. Since the notch 5 is formed at least at a position separated from the external connection conductors 4a on the two outer surfaces adjacent to each other, the notch 5 is formed in the external connection conductor 4a when the position is recognized by the image recognition device. The position can be recognized accurately without erroneous recognition of the image recognition device due to reflection of the deposited plating layer or the like. Such cutouts 5 are formed in the ceramic green sheets for the mother substrate for manufacturing the insulating base 1, except for the ceramic green sheet for the uppermost layer. A through hole for forming the cutout 5 is formed at the boundary of the ceramic green sheet, and a cut for the dividing groove is formed on the upper surface of the ceramic green sheet laminate in which these ceramic green sheets are laminated, as compared with the uppermost ceramic green sheet. It is formed on the outer surface of the insulating substrate 1 by forming the mother substrate obtained by firing the laminated body along the dividing groove. The notch 5 has a depth of 0.05 to 1.
It is preferable that the width is 0 mm and the width is 0.2 to 5.0 mm. When the depth of the notch 5 is less than 0.05 mm, a through-hole for forming the notch 5 having such a depth is formed in the ceramic green sheet for the mother substrate for manufacturing the insulating base 1. When the thickness exceeds 1.0 mm, the strength of the insulating base 1 above the notch 5 tends to be low. Notch 5
Is smaller than 0.2 mm, it tends to be difficult to accurately recognize the outer periphery of the upper surface of the insulating substrate 1 corresponding to the notch 5 by the image recognition device. The provision of the wide concave portion 5 tends to increase the size of the insulating base 1 unnecessarily. Thus, according to the electronic component package of the present invention, the semiconductor element 3 is bonded and fixed in the concave portion 1a of the insulating base 1 with an adhesive such as brazing material, glass, resin, or the like. The electrode is electrically connected to the metallized wiring conductor 4 via a bonding wire or the like, and thereafter, the lid 2 is joined to the upper surface of the insulating base 1, and the electronic device is placed inside the container including the insulating base 1 and the lid 2. An electronic device as a final product is obtained by housing the components 3 in an airtight manner. It should be noted that the present invention is not limited to the above embodiment, and that various changes can be made without departing from the spirit of the present invention. As described above, according to the present invention, the insulating substrate has a ceramic layer portion other than the uppermost or lowermost ceramic layer on the outer surface of the insulating substrate having a fractured surface over the entire circumference, and at least two adjacent layers are provided. Notches formed by cutting out the outer ceramic surface leaving the upper end of the ceramic layer, even if burrs occur on the fractured surface, burrs are formed at the portions where the notches are formed. When viewed from above, the portion of the notch that is not recognized and is recognized is recognized as a straight side. Therefore, if the outer surface of the insulating base above the cutout is recognized by the image recognition device, the original outer periphery of the insulating base can be accurately and easily recognized. As a result, the electronic components and the lid can be accurately aligned and attached.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an example of an embodiment of an electronic component package according to the present invention. [Description of References] 1: Insulating base 2: Lid 3: Semiconductor element 4: Metallized wiring conductor 4a: External connection conductor 5: Notch

Claims (1)

Claims: 1. A plurality of ceramic layers are laminated,
An upper surface has a mounting portion on which the electronic component is mounted, and has an approximately rectangular parallelepiped insulating base having an external connection conductor formed on the outer surface. The electronic component is mounted on the mounting portion and an upper surface of the insulating base is provided. An electronic component housing package for sealing the electronic component by joining a lid to the insulating substrate, wherein the insulating base has a portion of the ceramic layer other than the ceramic layer at the upper end or upper and lower ends of the outer surface. A notch portion having a fractured surface over the entire circumference and having a cutout formed by cutting out at least the two outer surfaces adjacent to each other without leaving the uppermost ceramic layer. package.