JP4772730B2 - Multiple wiring board, wiring board, and electronic device - Google Patents

Description

  In the present invention, the upper surface is divided into a plurality of wiring substrate forming regions, and a plurality of wiring substrates are obtained by dividing each wiring substrate forming region into a plurality of wiring substrates, and each wiring substrate forming region is divided. The present invention relates to a wiring board separated into individual pieces and an electronic device on which electronic components are mounted.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators are made of metal powder metallization such as tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is comprised by arrange | positioning the wiring conductor which consists of.

  An electronic device is formed by mounting an electronic component on such a wiring board and electrically connecting each electrode of the electronic component to a corresponding wiring conductor through electrical connection means such as solder or bonding wire. Is done. In addition, the electronic component mounted on the wiring board is covered and sealed with a lid made of metal, ceramics, glass, or the like, or a potting resin, if necessary.

  Such a wiring board has become thin and extremely small with a size of several mm square or less in accordance with recent demands for thinning and miniaturization of electronic devices. In order to make the thin and small wiring board easy to handle, and to improve the production efficiency of the wiring board and the electronic device using the wiring board, there are a large number of wiring board forming regions that become the wiring board. The circuit board is manufactured in the form of a so-called multiple wiring board that is arranged vertically and horizontally at the center of a large-area mother board.

  Such a multiple wiring board is prepared by preparing a ceramic green sheet for a mother board, printing a metallized paste for a wiring conductor on the ceramic green sheet at a predetermined position, and if necessary, a plurality of ceramic green sheets After being laminated, it is manufactured by firing at a high temperature.

  Then, after a plurality of electronic components are mounted on each wiring board forming region of the wiring board, a large number of electronic devices are manufactured at the same time by dividing the mother board into the wiring board forming regions. As a method of dividing the mother board into individual wiring board forming regions, a method of dividing a plurality of wiring boards by forming a dividing groove at the boundary of the wiring board forming region and bending along the dividing groove. Is used. Such a dividing groove can be formed by making a notch for the dividing groove in advance at a predetermined position on the ceramic green sheet for the mother substrate.

  In recent years, a wiring board having a horizontally extending region such as a flange on the outer periphery of the wiring board, such as a wiring board for mounting an image pickup device, has been proposed. Accordingly, there is a tendency to obtain a plurality of wiring boards (for example, see Patent Document 1).

JP 2001-28431 A

  In the multi-layer wiring board in which a plurality of wiring board forming areas having a horizontal extending area that becomes a flange on the outer periphery are arranged, there is no member that supports the extending area on the lower surface portion of the extending area, Moreover, since the thickness is thinner than other regions, if a cut for a dividing groove is made from the upper surface side into such an overhang region, the overhang region is directed toward the lower surface due to stress at the time of forming this cut. It sometimes deformed.

  The present invention has been devised in view of the above-described problems, and an object of the present invention is to provide a plurality of wiring board forming regions that are partially provided with regions having different thicknesses and capable of suppressing deformation in the wiring substrate forming region. The object is to provide a single-piece wiring board.

  The multi-sided wiring board of the present invention is a multi-sided wiring board in which a top surface is divided into a plurality of wiring board forming regions and a plurality of wiring substrates can be obtained by dividing each wiring substrate forming region. And a first substrate having a dividing groove formed along the outer edge of each wiring board forming region, and projecting downward from the lower surface of the first substrate at a distance from the dividing groove inside each wiring substrate forming region. The projecting portion extends across the dividing groove and is in contact with the lower surface of the first substrate along the dividing groove, and can be peeled off from the lower surface of the first substrate in each wiring board forming region. And a contact portion to be pasted.

  In addition, preferably, it further includes a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from above, and the contact portion is a surface of the non-formation area that is in contact with the first substrate. It is characterized in that at least a part of is stuck so as not to be peeled off.

  The multi-sided wiring board of the present invention is a multi-sided wiring board in which a top surface is divided into a plurality of wiring board forming regions and a plurality of wiring substrates can be obtained by dividing each wiring substrate forming region. A first substrate having a dividing groove formed along an outer edge of each wiring substrate forming region, a second substrate disposed opposite to the first substrate so as to face the first substrate, Between the first and second substrates, the inner side of the wiring board forming region is spaced from the dividing groove, and both ends in the thickness direction are sandwiched between the first and second substrates, and the first and second substrates, It straddles the dividing groove and is brought into contact with the lower surface of the first substrate and the upper surface of the second substrate along the dividing groove, and the lower surface of the first substrate and the second substrate in each wiring board forming region. Affixed to the top surface in a peelable manner That is characterized in that it comprises a contact portion.

  In addition, preferably, it further includes a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from above, and the contact portion is a surface of the non-formation area that is in contact with the first substrate. It is characterized in that at least a part of is stuck so as not to be peeled off.

  In addition, preferably, it further has a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from above, and the contact portion is a part of the surface to be attached to the first substrate in the non-formation area At least a part and at least a part of a surface to be affixed to the second substrate in the non-formation region are affixed so as not to be peeled off.

  Preferably, the contact portion is provided over the entire length direction along the outer edge of the wiring board formation region.

  The wiring board of the present invention is obtained by dividing one multiple-wiring board of the present invention along the dividing groove.

  The electronic device of the present invention includes the wiring board of the present invention and an electronic component mounted on the wiring board.

  The multi-sided wiring board of the present invention is a multi-sided wiring board in which a top surface is divided into a plurality of wiring board forming regions and a plurality of wiring substrates can be obtained by dividing each wiring substrate forming region. And a first substrate having a dividing groove formed along the outer edge of each wiring board forming region, and projecting downward from the lower surface of the first substrate at a distance from the dividing groove inside each wiring substrate forming region. The projecting portion straddles the dividing groove and is in contact with the lower surface of the first substrate along the dividing groove, and is attached to the lower surface of the first substrate so as to be peelable in each wiring board forming region. And a contact part. Therefore, in the area where the first substrate in the wiring board formation region is not in contact with the protruding portion, the contact portion serves as a pedestal to support the first substrate, so that the first substrate along the outer edge of each wiring board formation region In the step of forming the cut for the dividing groove on the upper surface of the first substrate, it is possible to prevent the region of the first substrate that is not in contact with the protruding portion of the wiring substrate formation region from being deformed. Moreover, since this contact part can be peeled with respect to the 1st board | substrate, a contact part can be easily peeled from the wiring board used as a product. Therefore, deformation of the first substrate is suppressed, and a wiring substrate having an excellent outer shape can be formed favorably.

  Further, even when an electronic component or the like is mounted on a region of the first substrate that is not in contact with the protruding portion in the wiring substrate formation region, the contact portion serves as a pedestal to support the first substrate. Deformation in a region not in contact with the protruding portion in the region can be suppressed.

  In addition, preferably, it further includes a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from above, and the contact portion is a surface of the non-formation area that is in contact with the first substrate. At least a part of is stuck so as not to be peeled off. For this reason, the contact portion is unlikely to be unintentionally peeled off during the manufacturing process, and thus the first substrate can be favorably supported by the contact portion.

  The multi-sided wiring board of the present invention is a multi-sided wiring board in which a top surface is divided into a plurality of wiring board forming regions and a plurality of wiring substrates can be obtained by dividing each wiring substrate forming region. A first substrate having a dividing groove formed along an outer edge of each wiring substrate forming region, a second substrate disposed opposite to the first substrate so as to face the first substrate, and each wiring substrate Inside the formation region, while being separated from the split groove, the both ends in the thickness direction are sandwiched between the first and second substrates, and the split groove is straddled between the first and second substrates, In addition, it is in contact with the lower surface of the first substrate and the upper surface of the second substrate along the dividing groove, and is detachably attached to the lower surface of the first substrate and the upper surface of the second substrate in each wiring substrate forming region. Abutting portion to be included. Accordingly, the contact portion serves as a pedestal and supports the first substrate and the second substrate in the region not in contact with the sandwiching body in the wiring substrate forming region, and therefore the first substrate along the outer edge of each wiring substrate forming region. In the step of forming the cut for the dividing groove on the upper surface of the substrate, it is possible to suppress deformation of the region of the wiring board formation region that is not in contact with the sandwiching body. In addition, since the contact portion can be peeled off from the first substrate and the second substrate, the contact portion can be easily peeled off from the wiring substrate as a product. As a result, deformation of the first substrate is suppressed, and a wiring substrate having an excellent outer shape can be formed satisfactorily.

  In addition, when an electronic component or the like is mounted on a region of the first substrate that is not in contact with the sandwiching body in the wiring substrate formation region, the contact portion serves as a base and supports the first substrate and the second substrate. The deformation of the first substrate in the region not in contact with the sandwiching member of the formation region can be suppressed.

  In addition, preferably, it further includes a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from above, and the abutting portion includes at least one of the surfaces abutting on the first substrate in the non-formation area A part is stuck so that it cannot be peeled off. From this, the contact portion is unlikely to fall out unintentionally during the manufacturing process, and therefore, the region that is not in contact with the sandwiched body in the wiring board formation region can be favorably supported by the contact portion.

Preferably, it further includes a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from the upper surface, and the abutting portion is at least of a surface to be attached to the first substrate in the non-formation area At least a part of the surface to be attached to the second substrate in a part and the non-formation region is pasted so as not to be peeled off.
From this, the contact portion is less likely to come off unintentionally during the manufacturing process, and the region where the contact portion is not in contact with the sandwiched body of the wiring board forming region can be better supported.

  Preferably, the contact portion is provided over the entire length direction along the outer edge of the wiring board formation region. From this, the contact part can more reliably support the protruding part in the wiring board forming area or the area not in contact with the sandwiching body in the length direction, and therefore, the deformation of the first board can be suppressed more favorably. it can.

  Since the wiring board of the present invention is obtained by dividing the above-mentioned multiple-taken wiring board along the dividing groove, deformation can be suppressed and a wiring board having an excellent outer shape can be obtained.

  Since the electronic device of the present invention includes the wiring board described above and the electronic component mounted on the wiring board, the deformation is suppressed, and the electronic device is mounted on the wiring board having an excellent outer shape. An electronic device with excellent reliability can be obtained.

  Hereinafter, with reference to the drawings, a multiple wiring board 20 according to an embodiment of the present invention will be described. FIG. 1 is a plan view showing a multi-cavity wiring board 20 according to an embodiment of the present invention, and FIG. 2A is a bottom view showing the multi-cavity wiring board 20, and FIG. FIG. 3 is a bottom view showing the multi-piece wiring board 20 in a state in which the contact portion 6 is removed from the multi-piece wiring board 20, and FIG. 3 (a) is viewed from the section line III-III in FIG. FIG. 3B is an enlarged cross-sectional view of a main part of section A in FIG. 3A, and FIG. 4 is a cross-sectional view taken along the section line IV-IV in FIG. FIG. 3 is a cross-sectional view of a plurality of wiring boards 20 as seen. In these drawings, reference numeral 1 denotes a first substrate, reference numeral 2 denotes a protruding portion, reference numeral 3 denotes a dividing groove, reference numeral 4 denotes a wiring board forming region, reference numeral 5 denotes a wiring conductor, and reference numeral 6 denotes a contact portion. Further, in the present embodiment, the thickness direction of the multiple wiring board 20 is described as the vertical direction Z, the vertical direction one is described as the upper Z1, and the vertical direction other is described as the lower Z2.

  The multiple wiring substrate 20 of the present invention is a multiple wiring substrate 20 in which the upper surface is divided into a plurality of wiring substrate forming regions 4 and a plurality of wiring substrates can be obtained by dividing each wiring substrate forming region 4. The first substrate 1 having the dividing grooves 3 formed along the outer edge of each wiring board forming region 4 on the upper surface 1a, and the first substrate 1 spaced apart from the dividing grooves 3 on the inner side of each wiring substrate forming area 4. A protrusion 2 projecting downward Z2 from the lower surface 1b of one substrate 1 and the dividing groove 3 are straddled and abutted against the lower surface 1b of the first substrate 1 along the dividing groove 3, and each wiring board is formed. The region 4 includes a contact portion 6 that is detachably attached to the lower surface 1 b of the first substrate 1.

The first substrate 1 and the protrusion 2 are made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body. For example, in the case of an aluminum oxide sintered body, a suitable organic solvent and solvent are added to and mixed with raw material powder such as alumina (Al ₂ O ₃ ) to form a slurry, and this is made into a conventionally known doctor blade. A ceramic green sheet (ceramic green sheet) is obtained by forming a sheet using a method or a calender roll method, and then a suitable punching process is applied to the ceramic green sheet, and multiple sheets are laminated as necessary. It is manufactured by baking at a high temperature (about 1500 ° C. to about 1800 ° C.). Moreover, the 1st board | substrate 1 and the protrusion part 2 are integrated by laminating | stacking the ceramic green sheet for the 1st board | substrate 1, and the ceramic green sheet for the protrusion part 2, and baking at high temperature. Lamination of these ceramic green sheets can be performed by applying pressure and pressure bonding. In addition, in order to improve the adhesiveness between each ceramic green sheet, you may laminate | stack in the state which apply | coated the binder to the surface of each ceramic green sheet, and softened the surface of the ceramic green sheet.

  The protrusion 2 is located inside a wiring board formation region 4 to be described later in at least one direction of the outer edge. 2 to 4 show an example in which the protruding portion 2 has a quadrangular prism shape, and a pair of opposing side surfaces parallel to the vertical direction Z are located inside the wiring board forming region 4. . Note that the protruding portion 2 may be positioned inside the wiring board forming region 4 on all four side surfaces parallel to the vertical direction Z. Further, the protrusion 2 is not limited to a quadrangular cross section perpendicular to the up-down direction Z, and depending on the purpose, a polygonal shape such as a triangular shape or a trapezoidal shape, a circular shape, a semicircular shape, a semielliptical shape, etc. It may be formed into a shape such as a shape having a circular arc shape, or may be a shape other than those described above.

  A plurality of wiring board forming regions 4 are formed and arranged in the center of the wiring board 20, and a wiring conductor 5 is formed in each wiring board forming region 4. The wiring conductor 5 functions as a conductive path for electrically connecting an electronic component mounted in the wiring board formation region 4 to an external electric circuit board, and is made of a metal powder metallization such as tungsten, molybdenum, copper, or silver. The metalized paste for the wiring conductor 5 is printed and applied to the ceramic green sheet for the first substrate 1 or the protruding portion 2 by printing means such as a screen printing method, and fired together with the ceramic green sheet for the first substrate 1 and the protruding portion 2. By doing so, it is deposited on the upper and lower surfaces of each region. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as necessary to a main component metal powder, and mixing and kneading them by a kneading means such as a ball mill. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate after firing.

  Further, the wiring conductor 5 formed on the surface and inside of the wiring board forming region 4 is electrically connected by a through conductor penetrating the first substrate 1 or the protruding portion 2 as necessary. Such a through conductor is formed by a punching method using a die or punching or laser processing or the like on the ceramic green sheet for the first substrate 1 or the projecting portion 2 prior to the printing and application of the metallized paste for forming the wiring conductor 5. A through hole for the through conductor is formed by the method, and the metalized paste for the through conductor is filled in the through hole by a printing means such as a screen printing method, and this is filled with the ceramic for the first substrate 1 and the protruding portion 2. It forms in each area | region by baking with a green sheet. The metallized paste for the through conductor is produced in the same manner as the metallized paste for the wiring conductor 5, but is adjusted to a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  Further, the non-formed region 8 is formed as a non-product portion in a region outside the wiring substrate forming region 4 in the multi-piece wiring substrate 20. This non-formation area 8 can be used as an area for facilitating the manufacture and conveyance of the multi-piece wiring board 20, and is used for positioning and fixing when processing or carrying the multi-piece wiring board 20. be able to. In addition, the non-formation region 8 is made of a conductive material and, if necessary, a plating conduction pattern layer for depositing a plating layer on the wiring conductor 5, or a wiring board on a side surface of a portion to be a wiring board A through hole for forming the wiring conductor 5 for connecting to the external circuit board is formed on the side surface of the substrate.

  In addition, the portion exposed to the outer surface of each wiring board formation region 4 of the wiring conductor 5 is coated with a metal having excellent corrosion resistance such as nickel (Ni) or gold (Au), so that the wiring conductor 5 is oxidized. Corrosion can be effectively prevented, and the bonding between the wiring conductor 5 and the electronic component, the electrical connection of the wiring conductor 5 with the Au wire, the solder bump, and the like, and the bonding between the wiring conductor 5 and the external circuit board are strong. Can be. Therefore, a portion of the wiring conductor 5 exposed on the outer surface of each wiring board forming region 4 is electrolytically plated with a Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm. It is sequentially deposited by the method and electroless plating method.

  The dividing grooves 3 are formed on the upper surface 1 a of the first substrate 1 along the outer edge of each wiring board forming region 4. The dividing grooves 3 function to enable easy and accurate execution of bending when a plurality of wiring boards 20 are bent to form a plurality of wiring boards described later. As shown in FIG. 4, when the protruding portion 2 overlaps the outer edge of the wiring board forming region 4, the dividing groove 3 passes through the first substrate 1 in the vertical direction Z, and depends on the thickness of the protruding portion 2. Alternatively, it may be formed to reach the protruding portion 2. Further, the dividing groove 3 may be provided on the lower surface side of the protruding portion 2. As shown in FIG. 4, the same applies to the case where the projecting portion 2 comes into contact with a contact portion 6 to be described later, and the dividing groove 3 is formed so as to reach the projecting portion 2 and the contact portion 6. It doesn't matter. Further, the dividing groove 3 may be provided on the lower surface side of the protruding portion 2 and the contact portion 6. Further, the dividing groove 3 is formed so that both ends thereof are separated from the outer periphery of the first substrate as necessary. The width W of the opening portion of the dividing groove 3 formed in the first substrate 1 and the projecting portion 2 is about 0.05 to 1 mm, and the depth H is about 0.05 to 2 mm. 2 to 4, the division line 7 that divides the wiring board 20 along the dividing groove 3 into each wiring board forming region 4 is indicated by a broken line. Further, in FIG. 2A, in order to make it easy to understand the position of the outer edge of each wiring board formation region 4, the position of the planned dividing line 7 is shown through a contact portion 6 described later.

  The dividing groove 3 is formed by pressing a cutter blade or a die having a V-shaped cutting edge against a ceramic green sheet for the first substrate 1 or the projecting portion 2 to make a cut. It is formed in a lattice shape on the upper surface of the ceramic green sheet for one substrate 1. Then, before or after the electronic component is mounted on each wiring board forming region 4 of the multi-piece wiring board 20, each wiring board is formed by bending the multi-piece wiring board 20 along the dividing groove 3. A plurality of small wiring boards are formed by dividing each region 4.

  In the multi-layer wiring board 20 of the present embodiment, the contact portion 6 straddles the dividing groove 3 and is in contact with the lower surface 1b of the first substrate 1 along the dividing groove 3, and each wiring board. In the formation region 4, the first substrate 1 is affixed to the lower surface 1 b so as to be peelable. Note that “peelable” means that it can be easily peeled off from the first substrate by physical means such as peeling or vibration as compared with the protruding portion 2. It is illustrated as a peelable region 6a. In addition, it is not restricted to a physical means, You may peel using another means. For this reason, the contact portion 6 serves as a pedestal and supports the first substrate 1 in the region of the first substrate that is not in contact with the protruding portion 2 in the wiring substrate forming region 4. In the step of forming a cut for the dividing groove 3 on the upper surface of the ceramic green sheet for the first substrate 1 and the step of firing the ceramic green sheet for the first substrate 1, along the wiring substrate forming region 4 of the first substrate It can suppress that the area | region which is not in contact with this protrusion part 2 deform | transforms. Moreover, since this contact part 6 can be peeled with respect to the lower surface 1b of the 1st board | substrate 1, the contact part 6 can be easily peeled from the wiring board used as a product. Therefore, deformation of the first substrate 1 is suppressed, and a wiring board having an excellent outer shape can be formed favorably.

  Further, even when an electronic component or the like is mounted on a region of the first substrate 1 that is not in contact with the protruding portion 2 in the wiring substrate forming region 4, the contact portion 6 serves as a pedestal and supports the first substrate 1. Further, it is possible to suppress deformation such as bending due to the weight of the electronic component or the like in a region not in contact with the protruding portion in the wiring board forming region 4. It should be noted that the same effect as described above can also be obtained when components other than electronic components are mounted. For example, even when a lid, a lens folder, or the like is mounted on a region of the first substrate 1 provided in the outer peripheral region of the wiring substrate forming region 4 that is not in contact with the protruding portion 2 in the wiring substrate forming region 4. Similarly to the above, it is possible to suppress deformation in a region of the first substrate 1 that is not in contact with the protruding portion 2 of the wiring substrate forming region 4.

  The contact portion 6 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, and the first substrate 1 or the protruding portion described above. Produced in the same way as 2. The abutting portion 6 should be such that the force for joining the first substrate 1 and the abutting portion 6 in the peelable region 6a is lower than the force for joining the first substrate 1 and the protruding portion 2. Good. For example, when the ceramic green sheet for the first substrate 1 and the ceramic green sheet for the contact portion 6 are laminated, the ceramic green sheet for the first substrate 1 and the ceramic green sheet for the protruding portion 2 are laminated. The pressure may be lower than the pressure, or the pressure may be substantially not applied. In addition, when the ceramic green sheet for the first substrate 1 and the ceramic green sheet for the protruding portion 2 are laminated, a binder is applied to the surface of the ceramic green sheet so as to contact the ceramic green sheet for the first substrate 1. When laminating the ceramic green sheet for the portion 6, the adhesive may be lowered to facilitate peeling without applying the binder. A partial region of the ceramic green sheet for the protruding portion 2 may be used as the ceramic green sheet for the contact portion 6. That is, a region overlapping with the dividing groove 3 and the periphery thereof may be provided as the contact portion 6 in the ceramic green sheet for the protruding portion 2. For example, by providing a through hole in the ceramic green sheet for the projecting portion 2 by punching or the like, these regions can be divided with the through hole as a boundary. 6 can be formed in a state of being easily separated from each other. When the ceramic green sheet for the first substrate 1 and the ceramic green sheet for the projecting portion 2 are laminated, a necessary region among the regions used as the contact portion 6 can be peeled as described above. Can be stacked. In this case, the ceramic green sheets for the contact portion 6 and the protruding portion 2 do not have to be individually stacked on the ceramic green sheet for the first substrate 1, and the contact portion 6 and the protruding portion are not required. Since the part 2 consists of the same sheet | seat, the height of the up-down direction Z of the protrusion part 2 and the contact part 6 can be formed equal.

  Note that the width and length of the contact portion 6 located in the wiring board formation region 4 are the thickness of the first substrate 1 and the width of the region not in contact with the protruding portion 2 (depth from the outer edge of the wiring board formation region 4). ) And length (the length of the edge of the outer edge of the wiring board formation region 4) may be appropriately selected in order to suppress the deformation. Further, as shown in FIG. 3, the contact portion 6 may be separated from the protruding portion 2.

  Moreover, it is preferable that at least one part of the surface which contact | abuts the contact part 6 in the non-formation area | region 8 to the 1st board | substrate 1 is affixed so that peeling is impossible. Thereby, the contact portion 6 is unlikely to be unintentionally peeled off during the manufacturing process, and thus the first substrate 1 can be favorably supported by the contact portion 6. That is, the first substrate 1 and the peelable region 6a may be set in the wiring substrate forming region 4, and the first substrate 1 may not be peeled in the non-forming region 8 outside the wiring substrate forming region 4. In this case, the bonding force of the region extending to the non-forming region 8 to the first substrate 1 may be set higher than that of the peelable region 6a. For example, what is necessary is just to laminate | stack on the 1st board | substrate 1 by the method similar to the protrusion part 2. FIG.

  In the case where the contact portion 6 cannot be peeled in the non-forming region 8, at least about 0.1 mm is laminated on the first substrate 1 from the outer edge of the wiring board forming region 4 to the non-forming region 8 as the peelable region 6 a. Is preferably formed. Thereby, it can suppress that the contact part 6 becomes impossible to peel in the wiring board formation area 4 by the lamination | stacking shift | offset | difference with the 1st board | substrate 1 and the contact part 6. FIG.

  FIG. 5 is a plan view showing a multi-cavity wiring board 30 according to another embodiment of the present invention, and FIG. 6A is a bottom view showing the multi-cavity wiring board 30 shown in FIG. ) Is a bottom view of the multi-piece wiring board 30 in a state in which the contact portion 6 is removed from the multi-piece wiring board 30, and FIG. 7A is viewed from the cutting plane line VII-VII in FIG. 5. FIG. 7B is a cross-sectional view of the multi-piece wiring board 30, and FIG. 7B is an enlarged cross-sectional view of a main part of section B of FIG. 7B.

  The multiple wiring substrate 30 of the present embodiment has a configuration substantially similar to the configuration of the multiple wiring substrate 20 of the above-described embodiment, and the non-formation region 8 is formed between the wiring substrate formation regions 4. The configuration is different. The non-formation regions 8 formed between the respective wiring substrate formation regions 4 are formed as non-product parts between the adjacent wiring substrate formation regions 4, and a plating layer is attached to the wiring conductor 5 as necessary. A through hole for forming the wiring conductor 5 for connecting to the external circuit board is formed on the side surface of the portion to be the wiring board and the plating conduction pattern. In this case, since the contact portion 6 is held between the wiring board formation regions 4, the first substrate 1 can be better supported by the contact portion 6.

  FIG. 8A is a cross-sectional view showing a multiple wiring board 40 according to still another embodiment of the present invention, and FIG. 8B is an enlarged cross-sectional view of the main part of section C in FIG. FIG. In the multiple wiring substrate 40 of the present embodiment, a protruding portion 2a is provided on the upper surface 1a side of the first substrate 1 in addition to the configuration of the multiple wiring substrates 20 and 30 of the above-described embodiments. That is, the 1st board | substrate 1 is located between the protrusion part 2a by the side of the upper surface 1a, and the protrusion part 2b by the side of the lower surface 1b. When the protruding portion 2a is provided on the upper surface 1a side of the first substrate 1, the upper surface of the first substrate 1 is formed when the dividing groove 3 is formed on the lower surface 1b side of the first substrate 1 or when electronic components are mounted. The contact portion 6 may be formed on the 1a side in the same manner as described above.

  In the multiple wiring substrate according to still another embodiment of the present invention, a recess for storing electronic components may be provided in the first substrate 1 or the protruding portion 2 for each wiring substrate formation 4. If the bottom surface of the recess and the upper surface 1a or the lower surface 1b of the first substrate 1 are formed so as to be on the same surface, there is no influence of layer misalignment between layers when mounting electronic components, etc. With reference to the outer side of the first substrate 1, the electronic component can be accurately mounted at a predetermined position in the recess. For example, in a multi-chip wiring board in which the protrusion 2a is provided on the upper surface 1a side of the first substrate 1 and the protrusion 2b is provided on the upper surface 1b side of the first substrate 1, the upper surface 1a of the first substrate 1 is placed on the bottom surface of the protrusion 2a. What is necessary is just to form the said recessed part. Such a recess has a through hole for a recess formed in a ceramic green sheet for the projecting portion 2a by a punching die or the like, and a ceramic green sheet for the first substrate 1 and a ceramic green sheet for the projecting portion 2b. It can be formed by laminating together. In addition, when forming a recessed part in the protrusion part 2b side, what is necessary is just to form so that the bottom face of a recessed part may become the lower surface 1b of the 1st board | substrate 1. FIG.

  FIG. 9A is a cross-sectional view showing a multiple wiring board 50 according to still another embodiment of the present invention, and FIG. 9B is an enlarged cross-sectional view of the main part of section D of FIG. 9A. FIG. In FIG. 9, 9 is a 2nd board | substrate and 10 is a clamping body. Reference numerals 1 to 8 denote members similar to those of the plurality of wiring boards 20, 30, and 40 of the above-described embodiments, and the description thereof may be omitted.

  The multiple wiring substrate 50 according to the present embodiment has a top surface 1a divided into a plurality of wiring substrate forming regions 4 and divided into each wiring substrate forming region 4 to obtain a plurality of wiring substrates. It is the board | substrate 50, Comprising: The 1st board | substrate 1 by which the division | segmentation groove | channel 3 was formed along the outer edge of each wiring board formation area 4 on the upper surface, and the 1st board | substrate 1 and the 1st board | substrate 1 are arrange | positioned at intervals. The sandwiched body 10 that is separated from the dividing groove 3 inside the second substrate 9 and the wiring substrate forming regions 4 and that both end portions in the thickness direction are sandwiched between the first and second substrates 1 and 9. And between the first and second substrates 1 and 9, straddling the dividing groove 3, and being in contact with the lower surface 1 b of the first substrate 1 and the upper surface of the second substrate 9 along the dividing groove 3. The lower surface 1b of the first substrate 1 and the second substrate in each wiring board formation region 4 And a contact portion 6 which is adhered peelably to the upper surface of 9.

The second substrate 9 and the sandwiching body 10 are made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body. In the case of a sintered body, a suitable organic solvent and solvent are added to and mixed with raw material powders such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. At the same time, a ceramic green sheet (ceramic green sheet) is obtained by forming the sheet into a sheet by using a conventionally known doctor blade method, calendar roll method, or the like, and then performing an appropriate punching process on the ceramic green sheet. At the same time, it is manufactured by laminating a plurality of sheets as necessary and firing at a high temperature (about 1500 ° C. to about 1800 ° C.). Further, the first substrate 1 and the second substrate 9 are sandwiched by laminating the ceramic green sheet for the first substrate 1, the ceramic green sheet for the sandwiching body 10, and the second ceramic green sheet and firing them at a high temperature. The body 10 is integrated. Note that these can also be stacked by the same method as described above.

  The sandwiching body 10 in the present embodiment has a quadrangular prism shape, and is located inside the wiring board formation region 4 in at least one direction of the outer edge thereof. Note that the sandwiching body 10 may be positioned inside the wiring board formation region 4 on all four side surfaces parallel to the vertical direction Z. In addition, the sandwiching body 10 is not limited to a quadrangular cross section perpendicular to the up-down direction Z. Depending on the purpose, a polygonal shape such as a triangular shape or a trapezoidal shape, a circular shape, a semicircular shape, a semielliptical shape, etc. It may be formed in a shape such as a shape having a circular arc shape, or may be a shape other than those described above.

  Similarly to the above, the wiring conductor 5 functions as a conductive path for electrically connecting an electronic component mounted in the wiring board formation region 4 to an external electric circuit board, and is made of tungsten, molybdenum, copper, silver, or the like. A metal powder metallized paste is applied to a predetermined region of the ceramic green sheet for the first substrate 1, the second substrate 9, and the sandwiching body 10 by printing means such as a screen printing method. By firing together with the ceramic green sheet for the first substrate 1, the second substrate 9 and the sandwiching body 10, it is deposited on the upper and lower surfaces of each region.

  Further, the wiring conductor 5 formed on the surface and inside of the wiring board forming region 4 is electrically connected by a through conductor penetrating the first substrate 1, the second substrate 9, and the sandwiching body 10 as necessary. . Such a through conductor is formed by punching a ceramic green sheet for the first substrate 1, the second substrate 9, and the sandwiching body 10 by a die or punching prior to printing and application of the metallized paste for forming the wiring conductor 5. A through hole for the through conductor is formed by a processing method such as laser processing, and a metallized paste for the through conductor is filled in the through hole by a printing means such as a screen printing method. It forms in each area | region by baking with the ceramic green sheet for 2 substrates 9 and the clamping body 10. FIG.

  The dividing groove 3 is formed on the upper surface of the first substrate 1 along the outer edge of each wiring board forming region 4. When the sandwiching body 10 overlaps the outer edge of the wiring board forming region 4, the dividing groove 3 is formed to reach the sandwiching body 10 according to the thickness of the first substrate 1, the second substrate 9, and the sandwiching body 10. It doesn't matter. Further, as shown in FIG. 9, the dividing groove 3 may be provided on the lower surface 9 b side of the second substrate 9, and it is formed so as to reach the sandwiching body 10 according to its thickness and the like as described above. It doesn't matter. In addition, what is necessary is just to form according to thickness similarly, when the clamping body 10 and the contact part 6 contact | abut. In FIG. 9 as well, a predetermined dividing line 7 that divides the wiring board 50 into the wiring board forming regions 4 along the dividing grooves 3 is indicated by broken lines. Further, the shape and the width and depth of the opening portions of the dividing grooves 3 are the same as those of the multi-layer wiring boards 20, 30, 40 of the above-described embodiments, and the same method as described above. Can be formed.

  In the present invention, the contact portion 6 straddles the dividing groove 3 between the first and second substrates 1 and 9, and the lower surface 1 b of the first substrate 1 and the first substrate 1 along the dividing groove 3. In addition to being in contact with the upper surface 9 a of the two substrates 9, they are detachably attached to the lower surface 1 b of the first substrate 1 and the upper surface 9 a of the second substrate 9 in each wiring substrate forming region 4. Therefore, in the region where the first and second substrates 1 and 9 in the wiring substrate forming region 4 are not in contact with the sandwiching body 10, the contact portion 6 serves as a pedestal to support the first substrate and the second substrates 1 and 9. Therefore, a step of forming a cut for the dividing groove 3 on the upper surface of the ceramic green sheet for the first substrate 1 along the outer edge of each wiring board forming region 4 and a step of firing the ceramic green sheet for the first substrate 1 In this case, it is possible to prevent the region of the wiring board forming region 4 that is not in contact with the sandwiching body 10 from being deformed. Moreover, since the contact part 6 can be peeled with respect to the 1st board | substrate 1 and the 2nd board | substrate 9, a contact part can be easily peeled from the wiring board used as a product. As a result, deformation of the first substrate 1 is suppressed, and a wiring substrate having an excellent outer shape can be formed favorably. Further, when the dividing groove 3 is formed in the second substrate 9, the deformation of the second substrate 9 is similarly suppressed.

  In addition, when mounting an electronic component or the like in a region of the first substrate 1 that is not in contact with the sandwiching body 10 in the wiring substrate formation region 4, the contact portion 6 serves as a pedestal so that the first substrate 1 and the second substrate 9 can be connected. Since it supports, the deformation | transformation of the 1st board | substrate 1 in the area | region which is not in contact with the clamping body of a wiring board formation area can be suppressed. Further, the same effect can be obtained when an electronic component or the like is mounted on the second substrate 9.

  In addition, the contact part 6 should just be affixed so that it can peel easily from the 1st board | substrate 1 and the 2nd board | substrate 9 compared with the clamping body 10 by a physical means etc. similarly to the above-mentioned. The first substrate 1 and the second substrate 9 are attached by using the same means as described above. Further, as in the case of the protruding portion 2, a partial region of the ceramic green sheet for the sandwiching body 10 may be used as the ceramic green sheet for the contact portion 6. For example, when the ceramic green sheet for the first substrate 1, the ceramic green sheet for the sandwiching body 10, and the ceramic green sheet for the second substrate 9 are stacked, a peelable region among the regions used as the contact portion 6. 6a may be laminated so as to be peelable as described above. Thereby, the effect similar to the above can be acquired.

  Moreover, it is preferable that at least one part of the surface which contact | abuts the contact part 6 in the non-formation area | region 8 to the 1st board | substrate 1 is affixed so that peeling is impossible. For this reason, the contact portion 6 is unlikely to fall out unintentionally during the manufacturing process, and therefore the contact portion 6 favorably supports a region not in contact with the sandwiching body 10 in the wiring board forming region 4. Can do.

  The abutting portion 6 has at least a part of a surface to be attached to the first substrate 1 in the non-formation region 8 and at least a part of a surface to be affixed to the second substrate 9 in the non-formation region 8. It is preferable that it is stuck so as not to peel off. From this, the contact portion 6 is less likely to fall off unintentionally during the manufacturing process, and the region where the contact portion 6 is not in contact with the sandwiching body 10 of the wiring board forming region 4 can be better supported. .

  In a multiple wiring board according to still another embodiment of the present embodiment, a non-formation region 8 may be formed between the wiring substrate formation regions 4. In this case, since the contact portion 6 is held between the wiring board formation regions 4, the first substrate 1 and the second substrate 9 can be better supported by the contact portion 6. . In addition, the abutting portion 6 may be attached such that at least a part of the surface that abuts on the first substrate 1 in the non-formation region 8 cannot be peeled off.

  FIG. 10 is a plan view showing a multiple wiring substrate 60 according to still another embodiment of the present invention, FIG. 11 is a bottom view of the multiple wiring substrate 60, and FIG. FIG. 12 is a cross-sectional view of the multi-layer wiring board 60 as viewed from the section line XII-XII in FIG. 10, and FIG. 12B is an enlarged cross-sectional view of the main part of section E in FIG. In the multiple wiring substrate 60 of the present embodiment, the position of the dividing groove 3 formed on the first substrate 1 side is different from the position of the dividing groove 3 formed on the second substrate 9 side in plan view. ing. In the present embodiment, in the first substrate 1, the wiring substrate forming regions 4 are adjacent to each other with the dividing groove 3 interposed therebetween, and in the second substrate 9, the dividing substrate 3 is interposed between the wiring substrate forming regions 4. An area is provided. In this case, one of the dividing grooves 3 is positioned on the inner side of the wiring board forming region 4 with respect to the position of the other dividing groove 3 (the surface on the second substrate 9 side in FIGS. 10 to 12). A region sandwiched by the dividing grooves 3 between the wiring substrate forming regions 4 on the surface can be used as the non-formed region 8.

  Further, similarly to the above-described embodiment, the first substrate 1, the second substrate 9, and the sandwiching body 10 may be provided with recesses for storing electronic components.

  Moreover, it is preferable that the contact part 6 is provided along the outer edge of the wiring board formation area 4 over the whole length direction. This embodiment can be applied to the multiple wiring substrate 20, 30, 40, 50, 60 of the present embodiment and each of the above-described embodiments. In this case, when the protruding portion 2 or the sandwiching body 10 is located inside the wiring substrate forming region 4 over the entire side of the wiring substrate forming region 4, the contact portion 6 is connected to the protruding portion 2 or the sandwiching portion of the wiring substrate forming region 4. A region that is not in contact with the body 10 can be more reliably supported in the length direction. For example, when the cut for the split groove 3 is formed in the ceramic green sheet for the first substrate 1 or the second substrate 9, the contact portion 6 extends over the length of the region where the cut 3 for the split groove 3 is formed. Will be supported. Therefore, deformation of the first substrate 1 or the second substrate 9 can be suppressed more favorably.

  A wiring board according to an embodiment of the present invention is obtained by dividing the plurality of bird wiring boards 20, 30, 40, 50, 60 of each of the above-described embodiments along the dividing groove 3. For the reasons described above, deformation can be suppressed and a wiring board having an excellent outer shape can be obtained.

  An electronic device according to an embodiment of the present invention includes the above-described wiring board and an electronic component mounted on the wiring board. Accordingly, the electronic device is mounted on the wiring board that is suppressed in deformation and has an excellent outer shape, so that an electronic device with excellent reliability can be obtained. On the above-mentioned wiring board, electronic components realized by semiconductor elements such as IC (Integrated Circuit) chips and LSI (Large Scale Integration) chips, piezoelectric elements such as crystal vibrators and piezoelectric vibrators, various sensors, etc. Is installed.

  Electronic components are provided on the wiring board. When the electronic component is a flip-chip type semiconductor element, the electrode of the semiconductor element and the wiring conductor 7 are connected via a conductive resin such as a solder bump, a gold bump, or an anisotropic conductive resin. Are electrically connected to each other. When the electronic component is a wire bonding type semiconductor element, the electronic component is fixed with a bonding material such as glass, resin, brazing material, etc., and then the electrode of the semiconductor element and the wiring conductor 5 are connected via the bonding wire. This is done by electrical connection. When the electronic unit is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor 5 are electrically connected by a conductive resin.

  If necessary, the lid body is attached to the wiring board and can seal the electronic component together with the wiring board. The lid is made of resin, metal, ceramics, etc., and the lid is attached to the wiring board with an adhesive such as glass, resin, brazing material or the like. For example, a bonding metallization layer (not shown) is formed on the upper surface of the first substrate 1 so as to surround the electronic component mounting portion, and the bonding metallization layer is formed on the lower surface around the concave portion of the lid corresponding to the bonding metallization layer. Similarly, an electronic component can be sealed by forming a metallization layer for bonding and bonding these metallization layers to each other with a brazing material such as an Ag-Cu brazing material. These metallization layers for bonding can be formed on the first substrate and the lid by using the same material and method as those of the wiring conductor 5 described above. In addition, joining with a cover body can be performed similarly even if it is the protrusion part 2, the 2nd board | substrate 9, etc. FIG.

  In this embodiment, the electronic component is sealed by the lid. However, in still another embodiment of the present invention, the electronic component is covered with a sealing resin such as an epoxy resin, or the electronic component is covered. The electronic parts may be sealed by attaching a lid made of resin, metal, ceramics or the like to the wiring board with an adhesive such as glass, resin, or brazing material. In addition, it is good also as an imaging device which mounts a solid-state image sensor etc. on a wiring board, and also mounts a lens folder etc.

  Note that the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention. FIG. 13A is a cross-sectional view showing a multiple wiring substrate 70 according to still another embodiment of the present invention, and FIG. 13B is an enlarged cross-sectional view of the main part of the section F in FIG. FIG. For example, the dividing groove 3 may reach the contact portion 6 as shown in FIG. In this case, since the 1st board | substrate 1 does not have the remainder to divide | segment, it can suppress that a burr | flash or a chip | tip generate | occur | produces in the outer edge of a wiring board. Further, since the first substrate 1 is already separated by the dividing groove 3 before being divided, it is also possible to divide each wiring board forming region 4 only by peeling the contact portion 6 from the first substrate 1. In this case, it is necessary to maintain a bonding force to such an extent that the first substrate 1 and the peelable region 6a of the contact portion 6 are not easily peeled during the manufacturing process. The case where the second substrate 9 is provided is the same as described above.

It is a top view which shows the multiple pick-up wiring board 20 of one Embodiment of this invention. (A) is a bottom view showing the multi-cavity wiring board 20, and (b) shows the multi-cavity wiring board 20 in a state in which the contact portion 6 is removed from the (a) multi-cavity wiring board 20. It is a bottom view. (A) is sectional drawing of the multiple wiring board 20 seen from the cut surface line III-III of FIG. 1 of FIG. 1, (b) is a principal part expanded sectional view of the section A of FIG. 3 (a). FIG. FIG. 4 is a cross-sectional view of a plurality of wiring boards 20 as viewed from the section line IV-IV in FIG. 1. It is a top view which shows the multiple pick-up wiring board 30 of other embodiment of this invention. (A) is a bottom view showing the multi-cavity wiring board 30, and (b) is a bottom view of the multi-cavity wiring board 30 in a state where the contact portion 6 is removed from the multi-cavity wiring board 30. . (A) is sectional drawing of the multiple pick-up wiring board 30 seen from the cut surface line VII-VII of FIG. 5, (b) is principal part expanded sectional drawing of the section B of FIG. 7 (a). . (A) is sectional drawing which shows the multiple wiring board 40 of further another embodiment of this invention, (b) is a principal part expanded sectional view of the section C of Fig.8 (a). (A) is sectional drawing which shows the multiple wiring board 50 of further another embodiment of this invention, (b) is a principal part expanded sectional view of the section D of Fig.9 (a). It is a top view which shows the multiple pick-up wiring board 60 of further another embodiment of this invention. FIG. 6 is a bottom view showing a multiple wiring board 60. (A) is sectional drawing of the multiple wiring board 60 seen from the cut surface line XII-XII of FIG. 10, (b) is a principal part expanded sectional view of the section E of Fig.12 (a). . (A) is sectional drawing which shows the multiple wiring board 70 of further another embodiment of this invention, (b) is a principal part expanded sectional view of the section H of Fig.13 (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 Protrusion part 3 Dividing groove 4 Wiring board formation area 5 Wiring conductor 6 Contact part 6a Separable area 7 Dividing planned line 8 Non-formation area 9 2nd board | substrate 10 Holding body 20,30,40,50, 60,70 Multiple wiring board

Claims (8)

The upper surface is divided into a plurality of wiring substrate forming regions, and a plurality of wiring substrates in which a plurality of wiring substrates can be obtained by dividing each wiring substrate forming region,
A first substrate having a dividing groove formed along an outer edge of each wiring board formation region on the upper surface;
Inside each wiring board forming region, a protruding portion that protrudes downward from the lower surface of the first substrate apart from the dividing groove;
A contact portion that straddles the division groove and abuts against the lower surface of the first substrate along the division groove and is releasably attached to the lower surface of the first substrate in each wiring board formation region. A multi-wiring circuit board comprising: It further has a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from the upper surface,
The multiple contact wiring board according to claim 1, wherein at least a part of a surface of the abutting portion that abuts on the first substrate in the non-formation region is pasted so as not to be peeled off. The upper surface is divided into a plurality of wiring substrate forming regions, and a plurality of wiring substrates in which a plurality of wiring substrates can be obtained by dividing each wiring substrate forming region,
A first substrate having a dividing groove formed along an outer edge of each wiring board formation region on the upper surface;
A second substrate disposed opposite to the first substrate and spaced from the first substrate;
Inside each wiring board formation region, while being separated from the dividing groove, a sandwiching body provided with both end portions in the thickness direction sandwiched between the first and second substrates,
Between the first and second substrates, straddling the dividing groove, and in contact with the lower surface of the first substrate and the upper surface of the second substrate along the dividing groove, and in each wiring substrate forming region A multiple wiring board comprising a contact portion that is detachably attached to a lower surface of the first substrate and an upper surface of the second substrate. It further has a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from the upper surface,
The multiple contact wiring board according to claim 3, wherein at least a part of a surface of the contact portion that is in contact with the first substrate in the non-formation region is pasted so as not to be peeled off. It further has a remaining non-formation area excluding the wiring board formation area in the entire area when viewed from the upper surface,
At least a part of a surface to be affixed to the first substrate in the non-formation region and at least a part of a surface to be affixed to the second substrate in the non-formation region are affixed to the abutment portion so as not to be peeled off. The wiring board according to claim 3, wherein:   The multiple contact wiring board according to claim 1, wherein the abutting portion is provided along the outer edge of the wiring board forming region over the entire length direction thereof.   A wiring board obtained by dividing a plurality of wiring board according to any one of claims 1 to 6 along a dividing groove. The wiring board according to claim 7;
An electronic device comprising: an electronic component mounted on the wiring board.

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