JP4812516B2 - Multiple wiring board - Google Patents

Description

  In the present invention, a plurality of wiring board regions are formed in which a plurality of wiring board regions each serving as a wiring substrate for accommodating electronic components are arranged in the central portion of the mother board, and each wiring board region is divided. The present invention relates to an electronic component storage package that has been separated into pieces and an electronic device on which the electronic component is mounted.

  2. Description of the Related Art Conventionally, wiring boards (electronic component storage packages) for mounting electronic components such as semiconductor elements and crystal resonators are made of tungsten on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by disposing a wiring conductor made of metal powder metallization such as molybdenum.

  A recess for mounting electronic components is formed on the upper surface of the wiring board, and an electronic component is mounted on the bottom of the recess, and each electrode of the electronic component has electrical connection means such as solder and bonding wires. After being electrically connected to the wiring conductor, the electronic component is covered and sealed with a lid made of metal or ceramics or potting resin, whereby an electronic device is manufactured.

  By the way, with the recent demand for downsizing of electronic devices, such wiring boards have become extremely small with a size of several mm square or less. In order to make such a small wiring board easy to handle and to improve the efficiency of manufacturing a wiring board and an electronic device using the wiring board, a large number of wiring boards that become wiring boards are used. It is manufactured in the form of a so-called multi-cavity wiring board in which the regions are arranged vertically and horizontally in the center of a large-area mother board.

  In such a multi-cavity wiring board, for example, a plurality of wiring board regions each having wiring conductors are vertically and horizontally arranged at the center of a substantially square flat-plate mother board, and at least one of the mother boards Divided grooves that divide each wiring board region are formed vertically and horizontally on this surface. Then, before or after the electronic components are mounted on each wiring board area, the mother board is bent along the dividing grooves and divided into wiring board areas, so that a large number of wiring boards and electronic devices can be obtained. Are manufactured simultaneously and intensively.

  Such a multi-piece wiring board is prepared by, for example, preparing a ceramic green sheet for a mother board, printing a metallized paste for a wiring conductor on the ceramic green sheet, and, if necessary, a plurality of ceramic green sheets. After the sheets are laminated, a cut for a dividing groove is made on at least one surface by a cutting blade such as a cutter blade or a mold, and the sheet is fired at a high temperature.

In addition, when dividing the mother board, a dummy area is formed on the outer periphery of the mother board in order to reduce the possibility of burrs and chips on the wiring board and to improve the shape of the recesses in the wiring board area. Then, a dummy recess is formed in the dummy region so as to face the recess of the wiring board region with a dividing groove interposed therebetween.
JP 2001-284494 A

  However, recent miniaturization of electronic devices, that is, miniaturization of wiring boards, has resulted in narrowing of the gap between the dividing groove and the dummy recess. When an external force is applied to the mother board during transportation or mounting of electronic components, or when a notch for dividing grooves is formed in the ceramic green sheet for the mother board, between adjacent recesses In some cases, stress concentrates on the end portion of the formed dividing groove, and a crack is generated from the end portion of the dividing groove toward the dummy recess. For this reason, inadvertent cracking may occur in the mother board, or it may not be possible to apply a force to a predetermined position of the mother board when dividing, and it may be divided well along the dividing groove. It had a problem that it could not be done.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and the object thereof is to reduce inadvertent cracking of the mother board and to satisfactorily divide the mother board along the dividing grooves. The object is to provide a multiple wiring board.

The wiring board arrangement region according to one aspect of the present invention is a wiring board array region in which a plurality of wiring substrate regions having recesses are arranged in the center of a mother substrate formed by firing a plurality of laminated ceramic green sheets. And a dummy recess array region that is located outside the wiring substrate array region and in which a plurality of dummy recesses are arrayed, and a dividing groove formed between the adjacent wiring substrate regions, and in plan view, The dividing groove includes an extending portion extending between the adjacent dummy recesses toward the outermost virtual line segment located on the outermost side among the virtual line segments contacting both of the adjacent dummy recesses. In addition, the distance from the extended portion to the dummy concave portion in the direction orthogonal to the extended portion is gradually increased from the wiring board array region toward the outermost virtual line segment. so That.

  In the multiple wiring board according to the present invention, the extending portion of the dividing groove further extends to the outermost virtual line segment or extends to a position exceeding the outermost virtual line segment. It is characterized by this.

  The multiple wiring board according to the present invention is characterized in that the dividing groove is formed after the concave portion and the dummy concave portion are formed.

  In the multiple wiring substrate of the present invention, the distance between the dividing groove and the dummy recess becomes wider toward the end of the dividing groove due to the above configuration. The mechanical strength of this area can be maintained, and the possibility of cracks occurring from the end of the dividing groove toward the dummy recess can be reduced. As a result, inadvertent cracking of the mother board can be reduced, and the mother board can be favorably divided along the dividing grooves.

  In addition, since the distance from the extended part to the dummy concave part gradually increases and the mechanical strength of the mother board around the extended part gradually changes, the force locally changes greatly around the edge of the dividing groove. Thus, the possibility of cracks occurring at the ends of the dividing grooves can be reduced more favorably.

  Preferably, in the multiple wiring substrate of the present invention, the extending part of the dividing groove extends to the outermost virtual line segment or extends to a position exceeding the outermost virtual line segment. . With the above configuration, the end portion of the split groove where stress is likely to concentrate is positioned closer to the outer peripheral side of the mother substrate than the adjacent dummy concave portion region, and the mechanical strength is low and easily deformed from the end portion of the split groove. The area between adjacent dummy recesses can be kept away, and the possibility of cracks occurring at the ends of the dividing grooves can be further reduced.

  Further, when dividing the mother substrate, since no dummy recess is formed in the region from the end of the dividing groove located on the extension line of the dividing groove to the outer periphery of the mother substrate, the crack from the end of the dividing groove is It becomes easy to proceed favorably from the end of the dividing groove to the outer periphery of the mother substrate, and the mother substrate can be well divided along the dividing groove.

  Furthermore, preferably, in the multi-cavity wiring board of the present invention, since the dividing groove is formed after forming the concave portion and the dummy concave portion, the dummy concave portion reduces deformation of the concave portion in the wiring board region, and Since the division grooves formed between the concave portions or the dummy concave portions can be favorably formed in a predetermined region and a predetermined shape of the mother substrate, the mother substrate can be favorably divided along the division grooves.

  Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing an example of an embodiment of a multiple wiring board according to the present invention, and FIG. 2 is a cross-sectional view taken along line X-X ′ in FIG. 1. In these drawings, 101 is a mother board, 102 is a wiring board area, 103 is a wiring board arrangement area, 104 is a depression, 105 is a dummy depression arrangement area, 106 is a dummy depression, 107 is a dividing groove, 108 is a wiring conductor, A -A 'is the outermost virtual line segment.

  The multiple wiring substrate of the present invention has a wiring substrate array region 103 in which a plurality of wiring substrate regions 102 having recesses 104 are arrayed at the central portion of the mother substrate 101, and this wiring substrate array A dummy recess array region 105 in which a plurality of dummy recesses 106 are arrayed is provided outside the region 103. A dividing groove 107 is formed between the adjacent wiring board regions 102, and the dividing groove 107 includes an extending portion 107 ′ that extends between the adjacent dummy recesses 106.

  The base substrate 101 is an electrically insulating ceramic material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. It functions as a base material for manufacturing a large number of small wiring boards simultaneously. Then, electronic components (not shown) such as semiconductor elements, resistors, and capacitors are accommodated in the recesses 104 of each small wiring board.

  If the mother substrate 101 is made of, for example, an aluminum oxide sintered body, an organic binder, solvent, plasticizer, and dispersing agent suitable for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. The ceramic slurry obtained by adding and mixing, etc. is formed into a sheet shape by using a conventionally known sheet forming method such as a doctor blade method, and then a ceramic green sheet is obtained. It is manufactured by laminating a plurality of sheets and baking them at a high temperature (about 1500 to 1800 ° C.).

  The wiring board array area 103 is formed by arranging a plurality of wiring board areas 102 in the center of the mother board 101. Each wiring board region 102 is formed as a plurality of wiring boards by dividing along a dividing groove 107 described later, and each wiring board region 102 includes a concave portion 104 in which an electronic component is accommodated and a wiring conductor 108. Is formed.

  Such concave portions 104 are formed by forming through holes for the concave portions 104 in some of the ceramic green sheets for the mother substrate 101 by a punching method using a die or punching or a processing method such as laser processing. It is formed in a predetermined area of each wiring board area 102 by laminating with a sheet.

  The wiring conductor 108 functions as a conductive path for electrically connecting an electronic component housed in the recess 104 to an external electric circuit board, and is made of metal powder metallization such as tungsten, molybdenum, copper, silver, A metallized paste for the wiring conductor 108 is printed on the ceramic green sheet for the mother substrate 101 by printing means such as a screen printing method, and fired together with the ceramic green sheet for the mother substrate 101 to cover the upper and lower surfaces of each region. It is formed. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as necessary to a main component metal powder, and mixing and kneading them by a kneading means such as a ball mill, a three-roll mill, or a planetary mixer. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate after firing.

  Further, the wiring conductors 108 formed on the upper surface and the lower surface are electrically connected by through conductors that penetrate the mother board 101. Such penetrating conductors are used for penetrating conductors by a punching method using a die or punching or a processing method such as laser processing on a ceramic green sheet for the base substrate 101 prior to the printing and application of the metallized paste for forming the wiring conductor 108. The through hole for the through conductor is filled with the metallized paste for the through conductor by a printing means such as a screen printing method and fired together with the ceramic green sheet for the mother substrate 101. Formed in each region. The metallized paste for the through conductor is prepared in the same manner as the metallized paste for the wiring conductor 108, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  The dummy recess array area 105 is a non-product part located outside the wiring board array area 103 of the mother board 101, and is an area for facilitating the manufacture and transportation of the mother board 101. In the dummy recess array region 105, a plating conduction pattern for depositing a plating layer on the wiring conductor 108 and a wiring conductor 108 for connecting to an external circuit board (not shown) are formed on the side surface of the wiring board. A through hole is formed. The dummy recess array region 105 is used as an auxiliary role for forming the wiring board on the mother board 101, and serves as a positioning and fixing area when the mother board 101 is processed or transported.

  A plurality of dummy recesses 106 are arranged in the dummy recess array region 105 so as to face the recesses 104 of each wiring board region 102 with a division groove 107 described later interposed therebetween. The dummy recess 106 reduces the possibility of burrs or chips occurring in the wiring substrate when the mother substrate 101 is divided, or the shape of the recess 104 in the wiring substrate region 102 is good when forming the dividing groove 107 described later. It acts as something to make things.

  Such dummy recesses 106 are formed by forming through holes for the dummy recesses 106 in some of the ceramic green sheets for the mother substrate 101 by a punching method such as a die or punching or a processing method such as laser processing. It is formed in a predetermined area of the concave array area 105.

  In addition, it is preferable to form the length of the side of the recessed part 104 and the dummy recessed part 106 which oppose on both sides of the division | segmentation groove | channel 107 mentioned later to the respectively substantially same length. As a result, when a cut for a later-described split groove 107 is formed in the ceramic green sheet for the mother substrate 101, the force applied to the ceramic green sheet for the mother substrate 101 is applied to both the concave portion 104 side and the dummy concave portion 106 side. By favorably dispersing, the deformation of the concave portion 104 in the wiring board region 102 is small. Therefore, by dividing along the dividing groove 107, a wiring board having an excellent shape of the recess 104 can be obtained.

  Furthermore, it is more preferable that the concave portion 104 and the dummy concave portion 106 facing each other with the division groove 107 to be described later are formed so that the distance from the division groove 107 is the same distance. When the mother substrate 101 is divided along the dividing groove 107, the force applied to the dividing groove 102 is easily evenly distributed between the concave portion 104 side and the dummy concave portion 106 side. This can reduce the possibility of occurrence of burrs and chips on the wiring board.

  The dividing groove 107 is formed on the upper surface of the mother substrate 101 along the outer edge of each wiring board region 102 and includes an extending portion 107 ′ extending to the dummy recess array region 105. When the mother board 101 is bent to form a plurality of small wiring boards, the dividing groove 107 acts to make the bending easy and accurate, and both ends thereof are separated from the outer periphery of the mother board 101. Is formed. The width of the opening of the dividing groove 107 that appears on the surface of the mother substrate 101 is about 0.05 to 1 mm, and the depth is about 0.05 to 2 mm.

  Such a dividing groove 107 is formed on the upper surface of the mother board 101 by pressing a cutter blade or a die having a V-shaped cutting edge against a ceramic green sheet for the mother board 101 to make a cut. It is formed in a shape. When the mother substrate 101 is produced by laminating a plurality of ceramic green sheets, the cut is made after producing a laminated body in which a plurality of ceramic green sheets are laminated. The mother board 101 is divided into a plurality of wiring boards by bending the mother board 101 along the dividing grooves 107 before and after mounting electronic components on each wiring board region 102 of the mother board 101. The

  In the present invention, the dividing groove 107 is adjacent to the outermost virtual line segment AA ′ located on the outermost side among the virtual line segments in contact with both of the adjacent dummy concave portions 106 in a plan view. And the distance from the extending portion 107 ′ to the dummy recessed portion 106 in the direction orthogonal to the extending portion 107 ′ is from the wiring board array region 103. As it goes toward the outermost imaginary line segment AA ′, it gradually increases.

  The virtual line segment in contact with both of the adjacent dummy concave portions 106 indicates a line segment in contact with both corners or sides of the adjacent dummy concave portion 106. Of these virtual line segments, the dividing groove 107 is included. Alternatively, the imaginary line segment where the intersection with the extending portion 107 ′ obtained by extending the dividing groove 107 in the outer peripheral direction of the mother substrate 101 is the outermost periphery of the mother substrate 101 is referred to as the outermost imaginary line segment AA ′. Further, being orthogonal to the extending portion 107 ′ of the dividing groove 107 formed between the adjacent dummy concave portions 106 means orthogonal to the extending direction of the extending portion 107 ′. In the drawing, the outermost virtual line segment A-A ′ is shown extended to the outside of the mother board 101 for convenience.

  With the above-described configuration, the interval between the dividing groove 107 and the dummy recess 106 becomes wider toward the end of the dividing groove 107, so that the gap between the end of the dividing groove 107 and the dummy recess 106 in the mother substrate 101 is increased. The mechanical strength of the region can be maintained, and the possibility of cracks occurring from the end of the dividing groove 107 toward the dummy recess 106 can be reduced. As a result, inadvertent cracking of the mother substrate 101 can be reduced, and the mother substrate 101 can be favorably divided along the dividing grooves 107.

  Further, since the distance from the extended portion 107 ′ to the dummy concave portion 106 gradually increases and the mechanical strength of the mother substrate 101 around the extended portion 107 ′ gradually changes, around the end of the dividing groove 107, It is possible to reduce the possibility that cracks are generated at the end portions of the divided grooves 107, and to reduce the possibility that the force is greatly changed locally.

  In the above-described case, the dummy recess 106 may be formed in a shape such as a polygonal shape such as a triangular shape or a trapezoidal shape, or a shape having an arc shape such as a semicircular shape or a semielliptical shape. The distance from the dividing groove 107 may be formed so as to gradually increase toward the outermost virtual line segment AA ′.

  Further, as shown in FIG. 3, if the shape of the dummy recess 106 is made arcuate, the corners of the dummy recess 106 are reduced, so that cracks or the like occur in the mother board 101 starting from the corners of the dummy recess 106. This is more preferable because it can reduce the possibility of occurrence and prevent the mother substrate 101 from being carelessly cracked.

  Further, it is preferable that the shortest distance from the end of the dividing groove 107 to the dummy recess 106 is longer than the shortest distance from the end of the dividing groove 107 to the outer periphery of the mother substrate 101. As a result, the mechanical strength between the end portion of the dividing groove 107 and the end portion of the mother substrate 101 is made relatively lower than the mechanical strength from the end portion of the dividing groove 107 to the dummy recess 106, When the mother substrate 101 is divided along the dividing groove 107, it is easy to make a crack progress along an extension line of the dividing groove 107, and it becomes easy to divide it satisfactorily.

  Further, it is preferable that adjacent dummy recesses 106 are formed so that the shortest distances from the dividing grooves 107 are the same. Since the force applied to the end of the split groove 107 is easily distributed evenly in the direction of the adjacent dummy recess 106, the force is prevented from being concentrated in the direction of the one dummy recess 106, and the end of the split groove 107 is suppressed. It becomes easy to suppress that a crack generate | occur | produces in a part. Further, when the mother substrate 101 is divided along the dividing groove 107, the force applied to the dividing groove 107 is easily distributed evenly in both directions of the adjacent dummy recesses 106, so that the mother substrate 101 can be divided well along the dividing groove 107. it can.

  Furthermore, it is preferable to form the dummy concave portions 106 adjacent to each other with the dividing groove 107 in the same shape. Since the dummy recesses 106 are evenly arranged with respect to the dividing grooves 107, the force applied to the end portions of the dividing grooves 107 can be easily distributed evenly in the direction of the adjacent dummy recesses 106, and the ceramic for the mother substrate 101 can be easily distributed. It is possible to suppress deformation of the mother substrate 101 when forming a cut for the dividing groove 107 in the green sheet or firing a ceramic green sheet for the mother substrate 101, and a crack is generated at the end of the dividing groove 107. It becomes easy to suppress this, and when dividing the mother substrate 101, it becomes easy to divide well along the dividing grooves 107.

  Further, as shown in FIG. 4, the extending portion 107 ′ of the dividing groove 107 extends to the outermost virtual line segment AA ′ or to a position exceeding the outermost virtual line segment AA ′. Preferably it is extended. With this configuration, the end portion of the dividing groove 107 where stress is likely to concentrate is positioned closer to the outer peripheral side of the mother substrate 101 than the area between the adjacent dummy recesses 106, and the mechanical strength is lower than the end portion of the dividing groove 107. In addition, the region between the adjacent dummy recesses 106 that are easily deformed can be moved away, and the possibility of occurrence of cracks at the ends of the dividing grooves 107 can be further reduced.

  Further, when the mother substrate 101 is divided, the dummy recess 106 is not formed in the region from the end of the dividing groove 107 located on the extension line of the dividing groove 107 to the outer periphery of the mother substrate 101. The crack from the end portion easily proceeds well from the end portion of the dividing groove 107 to the outer periphery of the mother substrate 101, and the mother substrate 101 can be divided well along the dividing groove 107.

  In addition, when a force is applied from the outside during transportation or mounting of electronic components on the mother board 101, a crack is generated from the end of the dividing groove 107 to the outer periphery of the mother board, and the mother board is carelessly cracked. In order to prevent this, the distance between the end of the dividing groove 107 and the outer periphery of the mother substrate 101 is, for example, 2 mm or more in a mother substrate made of an aluminum oxide sintered body having a thickness of 2 mm or less. preferable.

  Moreover, it is preferable that the dividing groove 107 is formed after the recess 104 and the dummy recess 106 are formed. That is, by forming a cut for the dividing groove 107 along the outer edge of the concave portion 104 in the ceramic green sheet for the mother substrate 101, the dummy concave portion 106 reduces deformation of the concave portion 104 in the wiring substrate region 102, and the concave portion 104. Alternatively, the division grooves 107 formed between the dummy recesses 106 can be favorably formed in a predetermined shape in a predetermined region of the mother substrate, and the mother substrate 101 can be favorably divided along the division grooves 107. Thus, a wiring board having an excellent shape of the recess 104 and the outer edge can be satisfactorily formed.

  In addition, on the surface of the wiring conductor 108 exposed on the surface of the multi-piece wiring board, corrosion prevention of the wiring conductor 108, connection between the electronic component and the wiring conductor 108, separated electronic component storage package and external circuit In order to strengthen the bonding with the substrate, it is preferable to perform plating such as Ni or Au.

The electronic component storage package according to an embodiment is obtained by dividing the multi-piece wiring board described above along the dividing groove 107 into individual pieces. With this configuration, it is possible to obtain a good electronic component storage package that is well divided along the dividing groove and has no burrs or chips on the outer edge.

An electronic device according to an embodiment includes the above-described electronic component storage package and an electronic component mounted on the electronic component storage package. With this configuration, an electronic device in which the electronic component is favorably accommodated in the recess 104 can be obtained.

  Electronic components include semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal vibrators and piezoelectric vibrators, various sensors, etc., and an electronic component storage package in which a multi-piece wiring board is divided along a dividing groove. It may be mounted on a plurality of electronic components mounted on a multi-piece wiring board.

  When the electronic component is a flip-chip type semiconductor element, the electrode of the semiconductor element and the wiring conductor are connected via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). 108, and when the electronic component is a wire bonding type semiconductor element, it is fixed with a bonding material such as glass, resin, brazing material, etc. This is performed by electrically connecting the electrode of the semiconductor element and the wiring conductor 108. When the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor 108 are electrically connected by a conductive resin.

  And an electronic component is sealed as needed. Sealing is performed by covering the electronic component with a sealing resin such as epoxy resin, or a lid made of resin, metal, ceramics, etc. placed so as to cover the electronic component is bonded to glass, resin, brazing material, etc. What is necessary is just to carry out by attaching to an electronic component storage package with an agent.

  The present invention can be variously modified within a range not departing from the gist of the present invention. For example, in FIG. 1, the recess 104 is formed on the upper surface of the mother substrate 101, but the recess 104 may be formed on both main surfaces of the mother substrate 101. Further, the dividing grooves 107 may be formed on both main surfaces of the mother substrate 101. Further, the dummy recesses 106 are formed on each side of the dummy recess array region 105 so as to face the recesses 104 with the dividing grooves 107 interposed therebetween. As shown in FIG. The dummy recesses 106 facing each other with the 107 interposed therebetween may be formed at the corners of the dummy recess array region 105.

It is a top view which shows the example of embodiment of the multiple pick-up wiring board of this invention. It is sectional drawing in the X-X 'line | wire of the multiple pick-up wiring board in FIG. It is a top view which shows the example of embodiment of the multiple pick-up wiring board of this invention. It is a top view which shows the example of embodiment of the multiple pick-up wiring board of this invention. It is a top view which shows the example of embodiment of the multiple pick-up wiring board of this invention.

Explanation of symbols

101 ... Mother board 102 ... Wiring board area 103 ... Wiring board array area 104 ... Recess 105 ... Dummy recess arrangement area 106 ... Dummy recess 107 ... Divided groove 107 '... -Extension part 108 ... wiring conductor AA '... outermost virtual line segment

Claims (3)

A wiring board array region in which a plurality of wiring board regions having recesses are arranged at the center of a mother board formed by firing a plurality of laminated ceramic green sheets ;
A dummy recess array region that is located outside the wiring board array region and in which a plurality of dummy recesses are arrayed;
A split groove formed between the adjacent wiring board regions, and
In plan view, the dividing groove extends between the adjacent dummy recesses toward the outermost virtual line segment located on the outermost side among the virtual line segments in contact with both of the adjacent dummy recesses. Equipped with
And a plurality of distances from the extension part to the dummy recesses in a direction orthogonal to the extension part gradually increase from the wiring board array region toward the outermost virtual line segment. Wiring board.   2. The extending portion of the dividing groove further extends to the outermost virtual line segment or extends to a position exceeding the outermost virtual line segment. Multiple wiring board.   3. The multi-piece wiring board according to claim 1, wherein the dividing groove is formed after the concave portion and the dummy concave portion are formed. 4.

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