JP2004079945A - Ceramic electronic component aggregate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic electronic component aggregate capable of eliminating such a trouble as concentration of stress, or the like, due to difference of shrinkage between the central region and the outer circumferential region of a substrate when it is fired. <P>SOLUTION: A plurality of lattice-like breaking grooves 2 are formed in the major surface of a ceramic electronic component aggregate 1, and a plurality of electronic components 5 are fabricated in a plurality of regions sectioned by these breaking grooves 2. Marginal regions 7 sectioned by the breaking grooves 2 are provided around the regions where the electronic components 5 are disposed. Two through holes 8 are made in each section partitioned by the breaking grooves 2 in the marginal region 7. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a ceramic electronic component assembly, and more particularly, to a ceramic electronic component assembly from which a plurality of electronic components are taken out by being divided along break grooves.
[0002]
[Prior art]
As shown in FIG. 4, the conventional ceramic electronic component assembly 51 is obtained, for example, by firing a laminate formed by stacking a plurality of ceramic green sheets. A plurality of break grooves 52 are formed in a grid on the main surface of the ceramic electronic component assembly 51. Before the ceramic electronic component assembly 51 is fired, the break grooves 52 are usually formed with a dicing saw or a cutting blade so as to have a certain depth.
[0003]
Desired electronic components 55 are arranged in a plurality of regions defined by the plurality of break grooves 52. Then, a plurality of electronic components 55 can be taken out from the ceramic electronic component assembly 51 by dividing the ceramic electronic component assembly 51 along the break grooves 52.
[0004]
[Problems to be solved by the invention]
However, in general, in the firing step for obtaining the ceramic electronic component assembly 51, there is a problem that the shrinkage during firing differs between the central region and the outer peripheral region (margin region) of the ceramic electronic component assembly 51. That is, the contraction of the outer peripheral region of the ceramic electronic component assembly 51 is generally larger than the contraction of the central region. Therefore, a stress is generated due to a difference in contraction between the central region and the outer peripheral region of the ceramic electronic component assembly 51, and the stress is concentrated in the break grooves 52 in the outer peripheral region of the ceramic electronic component assembly 51, and a substrate crack occurs here. .
[0005]
Further, in the manufacturing process after firing, mechanical stress is applied to the ceramic electronic component assembly 51, and the ceramic electronic component assembly 51 may be undesirably cracked starting from the break groove 52 in the outer peripheral region. .
[0006]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a ceramic electronic component assembly that can eliminate problems such as stress concentration caused by a difference in shrinkage between a substrate central region and a peripheral region during firing.
[0007]
Means and action for solving the problem
In order to achieve the above object, the ceramic electronic component assembly according to the present invention is configured such that a plurality of break grooves arranged in a lattice are provided on a main surface, and a plurality of break grooves are divided along the plurality of break grooves. A ceramic electronic component assembly from which the electronic component is taken out, wherein a margin region defined by the break groove is arranged at an edge of the ceramic electronic component assembly, and at a position away from the break groove in the margin region. And a mechanical strength weak portion is provided. Examples of the weak mechanical strength portion include a through hole and a groove provided in the margin area.
[0008]
With the above configuration, the stress generated during firing is not concentrated on the break groove, but is distributed and loaded on the mechanical strength fragile portion of the through hole or groove, so that cracking of the ceramic electronic component assembly is suppressed. Further, even if mechanical stress or the like is applied in the processing operation after the firing step, the stress is not concentrated on the break groove, but is dispersed also in the mechanical strength fragile portion, so that cracking of the ceramic electronic component assembly is suppressed. .
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a ceramic electronic component assembly according to the present invention will be described with reference to the accompanying drawings.
[0010]
[First Embodiment, FIGS. 1 and 2]
As shown in FIG. 1, the ceramic electronic component assembly 1 is obtained by firing a laminate formed by stacking a plurality of ceramic green sheets.
[0011]
On the main surface of the ceramic electronic component assembly 1, a plurality of break grooves 2 are formed in a lattice shape. The electronic component 5 is formed in a plurality of regions defined by the break grooves 2. In FIG. 1, the illustration of the wiring pattern and the like of the electronic component 5 is omitted. The electronic component 5 is arranged at the center of the ceramic electronic component assembly 1. Capacitors, inductors, resistors, delay lines, and the like are formed inside each electronic component 5, and chip components such as capacitors, inductors, diodes, and ICs are mounted on the surface of the electronic component 5 as necessary. A filter, a high-frequency switch, and a high-frequency module are configured.
[0012]
A margin region 7 defined by the break groove 2 is arranged around an edge of the ceramic electronic component assembly 1, that is, around a region where the electronic component 5 is arranged. In the margin area 7, two through holes 8 are arranged for each section partitioned by the break groove 2. Each through hole 8 is a rectangular hole having a size of 0.2 mm square to 5 mm square, and is provided at a position apart from the break groove 2 so as not to cover the break groove 2. The distance d2 (see FIG. 2) between the through hole 8 and the edge of the ceramic electronic component assembly 1 may be 0 mm to 2 mm, and the through hole 8 may cover the edge of the ceramic electronic component assembly 1.
[0013]
In the case of the first embodiment, the thickness of the ceramic electronic component assembly 1 is 1.0 mm, and the size of the electronic component 5 is 7.5 mm × 6 mm. Then, as shown in FIG. 2, the width W1 of the margin region 7 is 6 mm, the width W2 of the break groove 2 is 0.2 mm, its depth is 0.4 mm, the size of the through hole 8 is 1 mm square, and The distance d1 between the two through holes 8 is 2 mm, and the distance d2 between the through hole 8 and the edge of the ceramic electronic component assembly 1 is 0.3 mm.
[0014]
Such a ceramic electronic component assembly 1 is produced, for example, as follows. A plurality of ceramic green sheets are prepared, and a required wiring pattern is formed on a predetermined ceramic green sheet by a printing method or the like. When a via hole is formed, a through hole is provided in the ceramic green sheet, and the through hole is filled with a conductive paste.
[0015]
Next, a plurality of ceramic green sheets are stacked and pressed together to form a laminate. On the main surface of the laminate, a break groove 2 having a certain depth is formed in a lattice shape using a dicing saw, a cutting blade or the like. Further, a rectangular through hole 8 is formed in the outer peripheral portion of the laminate by a method such as laser or press punching.
[0016]
Thereafter, the laminate is fired to obtain the ceramic electronic component assembly 1. At this time, since the ceramic electronic component assembly 1 has the weak mechanical strength portion, that is, the through hole 8 in the margin region 7, the stress generated at the time of firing does not concentrate on the break groove 2, but is also distributed to the through hole 8. And be loaded. As a result, cracking of the ceramic electronic component assembly 1 during firing can be prevented.
[0017]
For example, when ten break grooves 2 cross one side of the ceramic electronic component assembly 1, the stress generated due to the difference in contraction between the outer peripheral region (margin region 7) and the central region of the ceramic electronic component assembly 1 is: It is dispersed in ten break grooves 2. However, if a through hole 8 is formed between two adjacent break grooves 2, the stress generated due to the difference in shrinkage is also dispersed in the through hole 8, so that the stress per break groove is reduced. Will be alleviated. The stress applied to the through hole 8 is absorbed by the portion of the margin region 7 which is thinned by the formation of the through hole 8.
[0018]
Furthermore, even if mechanical stress is applied to the ceramic electronic component aggregate 1 in the manufacturing process after firing, the ceramic electronic component aggregate 1 of the first embodiment has the through holes 8 in the margin region 7, Mechanical stress is distributed and applied not only to the break grooves 2 but also to the through holes 8. As a result, cracking of the ceramic electronic component assembly 1 can be prevented.
[0019]
A plurality of electronic components 5 are taken out from the ceramic electronic component assembly 1 by folding and dividing the ceramic electronic component assembly 1 thus obtained along the breaking groove 2 with a roller or the like. Before performing such division, it is preferable that, for example, the electrodes formed on the surface of the electronic component 5 be plated, bonded, or mounted with chip components.
[0020]
After the above processing steps are completed, formation of external terminals, mounting of a case, measurement of electrical characteristics, and the like are performed on the electronic component 5.
[0021]
[Second embodiment, FIG. 3]
As shown in FIG. 3, the ceramic electronic component assembly 21 is obtained by firing a laminate formed by stacking a plurality of ceramic green sheets.
[0022]
A plurality of break grooves 22 are formed in a grid on the main surface of the ceramic electronic component assembly 21. The electronic component 25 is formed in a plurality of areas defined by the break grooves 22.
[0023]
On the outer peripheral portion of the ceramic electronic component assembly 21, a margin region 27 defined by the break groove 22 is arranged. In the margin area 27, one groove 28 is formed by a dicing saw or the like for each section partitioned by the break groove 22. Each groove 28 is a long groove having a width of 0.05 mm to 3 mm, and is arranged between the break grooves 22 so as not to cover the break grooves 22. The depth of the groove 28 is set to be larger than the depth of the break groove 22. One end of the groove 28 reaches one side of the ceramic electronic component assembly 21.
[0024]
In the case of the second embodiment, the thickness of the ceramic electronic component assembly 21 is 1.0 mm, and the size of the electronic component 25 is 7.5 mm × 6 mm. The width of the margin region 27 is 6 mm, the width of the break groove 22 is 0.2 mm, its depth is 0.4 mm, the length of the groove 28 is 5 mm, the width of the groove 28 is 0.2 mm, and its depth is 0.6 mm.
[0025]
The ceramic electronic component assembly 21 having the above configuration has the same function and effect as the ceramic electronic component assembly 1 of the first embodiment.
[0026]
[Other embodiments]
Note that the ceramic electronic component assembly according to the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the gist. In particular, the shape of the through hole or the groove is arbitrary, and may be a circular hole, a triangular hole, an oval hole, a semicircular hole, a semicircular groove, a triangular groove, an oval groove, or the like. Also, the number of through holes and grooves is arbitrary. Further, the through holes and grooves need not be formed on all four sides on the outer periphery of the ceramic electronic component assembly, but may be formed on at least one side.
[0027]
Further, it is needless to say that the ceramic electronic component assembly is not limited to the multilayer substrate, but may be a single plate.
[0028]
【The invention's effect】
As is apparent from the above description, according to the present invention, the stress generated during firing is not concentrated on the break groove, but is also distributed and loaded on the mechanical strength fragile portion of the through hole or the groove. Cracking of the component assembly can be suppressed. In addition, even if mechanical stress or the like is applied in the processing operation after the firing step, the stress is dispersed not only in the groove for breaking but also in the weak portion of the mechanical strength, so that cracking of the ceramic electronic component assembly can be suppressed. it can.
[Brief description of the drawings]
FIG. 1 is a plan view showing a first embodiment of a ceramic electronic component assembly according to the present invention.
FIG. 2 is a partially enlarged plan view showing an outer peripheral portion of the ceramic electronic component assembly shown in FIG. 1;
FIG. 3 is a plan view showing a second embodiment of the ceramic electronic component assembly according to the present invention.
FIG. 4 is a plan view showing a conventional ceramic electronic component assembly.
[Explanation of symbols]
1, 21 ceramic electronic component assembly 2, 22 break groove 5, 25 electronic component 7, 27 margin area 8 through hole 28 groove

Claims (4)

In a ceramic electronic component assembly, a plurality of break grooves arranged in a lattice are provided on the main surface, and a plurality of electronic components are taken out by dividing along the plurality of break grooves.
A margin region defined by the break groove is arranged at an edge of the ceramic electronic component assembly, and a mechanical strength weak portion is provided at a position of the margin region away from the break groove. Ceramic electronic parts assembly. 2. The ceramic electronic component assembly according to claim 1, wherein the weak mechanical strength portion is a through hole provided in the margin area. 3. 2. The ceramic electronic component assembly according to claim 1, wherein the weak mechanical strength portion is a groove provided in the margin area. 3. The ceramic electronic component assembly according to claim 3, wherein the depth of the groove is larger than the depth of the break groove.

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