JP2005123508A - Method of manufacturing laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated ceramic component by which the problem caused by a cutting step performed in a ceramic laminate separating step is dissolved in the manufacturing process of a laminated electronic component. <P>SOLUTION: A vanishing layer which is destroyed by fire at the time of baking an electronic component is formed in advance in each sheet, so that the vanishing layers may continue and pass through a laminate from the top surface to the bottom surface when the sheets are laminated upon another. The laminate is separated by performing the same baking as that performed in the baking step of the electronic component on the laminate in this state. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic component, particularly an electronic component using as an example a so-called multilayer ceramic formed by stacking ceramics. More specifically, the present invention relates to a method for manufacturing a multilayer electronic component, which is a method for individually separating the electronic components. Specific examples of the multilayer ceramic electronic component described here include a multilayer ceramic capacitor, a multilayer ceramic inductor, an LC composite component incorporating these, an EMC-related component, and the like.

  In recent years, with the miniaturization and rapid spread of electronic devices such as mobile phones, there is a need for higher-density mounting and higher performance for electronic components used therefor. In particular, multilayer ceramic electronic components used as passive elements are required to be small and highly functional by thinning and multilayering in order to meet such demands, and manufacturing methods that can meet such demands. Consideration is required.

  A conventional manufacturing method used for manufacturing the above-described ceramic multilayer electronic component, for example, a multilayer ceramic capacitor having an electrode formed therein, and disclosed in, for example, Patent Document 1 or Patent Document 2 as a technology that can meet these requirements. There is a so-called metal-ceramic integrated firing technique. Here, this metal-ceramic integrated firing technique will be briefly described. In this technique, first, a plurality of electrodes are formed simultaneously on the surface of a so-called ceramic green sheet using a conductive paste made of metal powder and an organic binder.

  Subsequently, a plurality of simple ceramic green sheets, ceramic green sheets after electrode formation, and the like are laminated to obtain a ceramic laminate. These electrodes serve as internal electrodes of the finished ceramic multilayer electronic component. Furthermore, the said ceramic laminated body is pressurized in the thickness direction, and the adhesiveness between green sheets is improved. The laminated body that has been brought into close contact is cut, separated, or the like into a predetermined size to form individual chips. A ceramic multilayer electronic component can be obtained by appropriately forming external electrodes on the outer surface of the obtained chip or the chip after the obtained chip is sintered.

JP 2001-110661 A JP 2001-85264 A JP 2002-134352 A JP 2002-270459 A

  The above-described cutting process of cutting the chip from the laminate is performed using various blades such as a so-called rotating blade and a lifting blade (see Patent Document 3). The ceramic green sheet or the conductive paste contains an organic binder or the like. For this reason, it has so-called stickiness, and a load applied to the blade at the time of cutting is larger than that at the time of cutting a simple sheet-like member. Therefore, it is usually difficult to increase the cutting speed in the cutting step, and it is also difficult to shorten the time required for the step.

  Patent Document 4 discloses an example of a method for shortening the cutting time. In this method, a space is formed in advance for the cut portion of the laminated body, and the laminated body is cut so as to connect the intermittently continuous space at the time of cutting. However, the positional accuracy of the stacked sheets in the laminated body is usually not so high, and thus the above-described space exists in a state where the position is slightly shifted in the extending direction of each sheet.

  At the time of cutting, when there are many spaces slightly deviated from the cutting direction with respect to the tip of the blade, for example, due to an increase in partial distortion applied to the object to be cut or blade tip shake due to the discontinuous space The possibility of chipping, breakage, etc. increases. Therefore, when the laminate is cut by the method disclosed in this document, it seems that it is actually difficult to increase the cutting speed to some extent in order to reduce distortion, suppress chipping, and the like. In addition, there is always a possibility that the laminate is damaged by the dynamic load received from the blade due to the presence of the cutting step.

  Moreover, the position to be actually cut may be difficult to specify due to the positional deviation between the sheets that occurs at the time of lamination. Therefore, it is necessary to correct misalignment in various forms (for example, the method disclosed in Patent Document 4 described above) and countermeasures. In addition, in consideration of the positional deviation between the sheets, it is necessary to form a laminate with a sufficient margin with respect to this portion so that an electrode or the like is not included in the portion removed by the cutting process. In order to efficiently form electronic components, reduction of the margin is also required.

  Further, in the cutting step, it is necessary to perform processing such as washing and drying on each chip after the completion of the step, and in this case, it is necessary to surely remove the influence of the liquid agent used for washing. Further, for example, when the cutting step is performed before the baking treatment, the sheet is cut in a state where the adhesiveness of each sheet is low, and there is a possibility of causing damage to the laminate such as delamination between layers. Moreover, when the cutting process is performed after firing, the strength of the chip after firing is usually high, and it is not easy to increase the cutting speed. Furthermore, when the cutting blade is worn, it is necessary to adjust the cutting speed and replace the blade. Therefore, it is desirable to eliminate various processes related to the cutting process in the chip manufacturing process that requires firing.

  The present invention has been made in view of the above problems, and a method for separating a chip from a laminated body without performing a cutting process using a blade or the like and reducing a process accompanying separation of the laminated body. It is intended to provide. That is, the present invention makes it possible to separate chips without applying an external force to the stacked body, and enables chip separation from the stacked body without causing deformation, breakage, dropout, etc. of the chip. is there.

  In order to solve the above-described problems, a manufacturing method according to the present invention manufactures a multilayer electronic component obtained by laminating a plurality of ceramic green sheets including a ceramic green sheet having at least an electrode layer, and undergoing a firing treatment. In the method, a layer made of a material different from the material constituting the electronic component is formed in a state of penetrating the ceramic green sheet around each region constituting the multilayer electronic component after lamination in each ceramic green sheet. After laminating a plurality of ceramic green sheets, the layers made of different materials are burned out by heating until the electronic component is fired, and the laminated body of the plurality of ceramic green sheets is made into individual laminated electronic components. And a step of separating.

  In the above-described manufacturing method, the different material is preferably a material that can be burned out by a baking process or a material that can be burned out by a binder removal process performed before the baking process. Further, the different material is a positive resist or a negative resist, and the layer made of the different material is preferably formed by exposure and development before the ceramic green sheet is formed. The ceramic green sheet described above is a generic term for a ceramic sheet formed from a so-called ceramic and an organic binder, and a ceramic sheet in which various layers such as electrodes are formed on the ceramic sheet.

  In order to solve the above problems, a method for manufacturing a multilayer electronic component according to the present invention is a method for manufacturing a multilayer electronic component in which a predetermined number of layers are stacked, and the multilayer electronic component in each layer It is characterized by including a step of forming a part made of a material that can be lost by a debinding process or a baking process applied to the laminated body around a region where a part of the layer is formed.

  According to the present invention, at the time of separation, no cutting process using a blade or the like is performed on the laminate. Therefore, there is no chip internal distortion, chipping, burrs, deformation, chip dropping, etc., which are inevitably present as problems of the prior art requiring a cutting process. Further, as described above, it has been difficult to determine the cutting position in the cutting step, but in the present invention, since there is no cutting step, such positioning is not necessary.

  Further, when the cutting process is performed, it is necessary to secure a cutting area by securing a margin that does not affect the chip. However, in the present invention, the vanishing layer corresponding to the conventional cutting area only needs to be continuous between the sheets, and it is not necessary to ensure a wide cutting area with a margin as described above. In the separation, the vanishing layer is selectively burned away by heat applied to the chip in a normal chip baking process or a binder removal process for removing the binder from the chip, and the chip is removed. That is, the chips are separated by performing various heating processes that are performed until the normal baking process is completed on the chip, and at the same time, a normal baking process can be performed. Therefore, it is possible to greatly reduce the processes related to the separation of the laminate. Note that the debinding process described here refers to a process of heating the laminated body or the like at a temperature lower than that during actual firing in order to reduce the organic binder or the like contained in the green sheet, for example.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 schematically shows a manufacturing process of an electronic component according to an embodiment of the present invention. In step 1, a ceramic green sheet 13 made of only a ceramic layer and a ceramic green sheet 15 having an electrode layer 5 formed on the ceramic layer are laminated. The ceramic green sheet 13 has a plurality of regions 13a which are portions for forming individual chips, and the disappearing layer 3 is formed around these regions. The ceramic green sheet 15 is a part for forming individual chips, and has a plurality of regions 15 a each having the electrode layer 5, and the disappearing layer 7 is formed around these regions.

  In step 2, the laminated body 1 obtained by laminating the ceramic green sheets 13 and 15 is subjected to a treatment such as applying pressure in the thickness direction thereof to thereby integrate the laminated body 1. By this treatment, the corresponding vanishing layer 3 and vanishing layer 7 in each sheet are continuous, and a vanishing region penetrating in the thickness direction of the laminate 1 is formed. The vanishing layers 3 and 7 are made of a material that burns out at a firing temperature or the like when the chip is fired. By directly performing a baking process or the like on the laminated body 1 shown in Step 2, the disappearing region is burned out as shown in Step 3, and the laminated body 1 is separated as individual chips 1a that are fired.

  As described above, in the present invention, the chip 1a can be easily and easily stressed with respect to the chip by burning out the disappearing layer formed so as to penetrate the laminated body 1 and surround each chip 1a. These can be separated without causing a load.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 2 schematically illustrates the structure of the laminated body and the like in each step with respect to the manufacturing method according to the first embodiment. In addition, the sheet | seat or laminated body etc. which are shown in the figure show the cross section, and the structure which exhibits the same effect as the structure shown in FIG. 1 shall be demonstrated using the same referential mark. In step 1, a ceramic slurry containing powder such as a dielectric is applied on a base material 2 made of, for example, a PET film to form a green sheet 4.

  A groove 4a for forming the disappearing layer 3 is formed on the green sheet 4 (step 2). As a method of forming the groove 4a, various methods such as a laser processing method and a method using a blade can be considered. Further, the green sheet 4 may be provided with photosensitivity, and the groove 4a may be formed by so-called exposure and development processes. If necessary, the formation of the spaces 4b such as lines and holes for forming the electrodes and the like in the chip may be performed simultaneously with the formation of the grooves 4a.

  In step 3, the disappearing material is filled into the groove 4a, and the disappearing layer 3 is formed. The above-described ceramic green sheet 13 is obtained by forming only the groove 4a on the green sheet 4 and peeling and removing the base material 2 from the sheet in which the vanishing layer 3 is formed in the groove 4a. In this embodiment, a material such as wax, resin, resist or the like is used as the disappearing material. In subsequent step 4, filling of the electrode material into the space 4b and formation of the electrode layer 5 are performed by a method such as screen printing. The ceramic green sheet 15 mentioned above is obtained by peeling and removing the base material 2 from the sheet including the electrode layer 5, the disappearing layer 7 (3) and the like.

  The ceramic green sheets 13 and 15 obtained through the steps 1 to 4 are laminated in step 5. After completion of the lamination, in step 6, the laminated body is pressurized in the thickness direction to integrate the individual green sheets 4, the disappearing layers 3, 7 and the like. By this operation, the individual sheets that were independent were integrated to form a disappearing region 3 ′ surrounding the periphery of the chip 1 a having the electrode region 5 ′ and the insulating region 4 ′ and penetrating in the thickness direction of the stacked body 1. The

  In the subsequent step 7, the laminate 1 is subjected to a firing process under substantially the same conditions as the firing process or the like normally performed on the chip. In this embodiment, the disappearing region 3 ′ is made of a material that burns out under the firing conditions, and the disappearing region 3 ′ is burned out and removed by the operation. As a result, the chips 1 are separated from each other, and the state shown in step 8 is obtained. After completion of the separation, external electrodes are formed on the individual chips 1a, and the manufacture of the electronic components is completed.

  Example 3 differs from Example 1 in that the vanishing layer 3 is first formed on the substrate 2. This embodiment is considered effective when, for example, a portion corresponding to a large number of chips is provided on a sheet and it is required to efficiently form fine and many disappearing layers. Note that FIG. 3 referred to in the description of the present embodiment shows each process in the same format as in FIG. 2 and the like described above, and the same reference numerals are used for the same configurations as those in the first embodiment. I will explain. In addition, the actual description will be made only for parts different from the first embodiment.

  In this embodiment, in step 1, the disappearing layer 3 made of a resist is applied on the entire surface of the substrate 2. Thereafter, the disappearing layer 3 is subjected to an exposure process using a mask suitable for a portion to be a chip. By performing development processing on the exposed sheet, as shown in step 2, a sheet in which the disappearing layer 3 made of a resist is disposed only at a predetermined position is obtained. The portion from which the vanishing layer 3 has been removed is filled with an insulator in step 3 to form a green sheet 4. By removing the substrate 2 from the sheet, the above-described ceramic green sheet 13 is obtained. A space 4a such as a line or a hole is formed in the green sheet 4 using a laser or the like as necessary (step 4). Note that a material having photosensitivity may be used as the green sheet 4, and the space 4a may be formed by exposure and development processes.

  In subsequent step 5, filling of the electrode material into the space 4b and formation of the electrode layer 5 are performed by a method such as screen printing. The ceramic green sheet 15 mentioned above is obtained by peeling and removing the base material 2 from the sheet including the electrode layer 5, the disappearing layer 7 (3) and the like. Hereinafter, in Steps 6 to 9, Steps 5 to 8 in Example 2 are performed, and the stacked body 1 is separated. Thereafter, an external electrode is further formed for each chip 1a, and the manufacture of the electronic component is completed.

  In the above-described embodiment, the case where the layers are formed in the order of the insulating layer, the electrode layer, and the like is illustrated. It is not limited to. These forming order, forming method, sheet configuration and the like are preferably changed as appropriate according to the characteristics of the chip to be obtained.

It is a figure which shows the outline of the manufacturing process of the electronic component which concerns on the best form for implementing this invention. It is a figure which shows the principal part of the manufacturing process of the electronic component which concerns on the Example of this invention (Example 1). It is a figure which shows the principal part of the manufacturing process of the electronic component which concerns on the Example of this invention (Example 2).

Explanation of symbols

1: Laminate 2: Base material 3, 7: Disappearing layer 4: Green sheet 5: Electrode layer 13, 15: Ceramic green sheet

Claims (5)

A method for producing a multilayer electronic component obtained by laminating a plurality of ceramic green sheets including a ceramic green sheet having at least an electrode layer, and undergoing a firing treatment,
Forming a layer made of a material different from a material constituting the electronic component in a state of penetrating the ceramic green sheet around each region constituting the laminated electronic component after being laminated in each of the ceramic green sheets When,
After laminating the plurality of ceramic green sheets, the layers made of the different materials are burned out in a heating step until the electronic component is fired, and the laminates of the plurality of ceramic green sheets are individually stacked. A method of manufacturing a multilayer electronic component, comprising the step of separating the electronic component.   The method of manufacturing a multilayer electronic component according to claim 1, wherein the different material is a material that can be burned down by the baking treatment.   The method of manufacturing a multilayer electronic component according to claim 1, wherein the different material is a material that can be burned out by a binder removal process performed before the baking process.   4. The different material is a positive resist or a negative resist, and the layer made of the different material is formed by an exposure development process before the ceramic green sheet is formed. A method for producing a multilayer electronic component as described in 1. A method for producing a laminated electronic component comprising a predetermined number of layers laminated,
Forming a portion made of a material that can be eliminated by a debinding process or a baking process applied to the stacked body, around a region where a part of the stacked electronic component is formed in each of the layers. A method for manufacturing a multilayer electronic component.

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