JP5460002B2 - Multi-cavity wiring board, wiring board and electronic device - Google Patents

Description

  In the present invention, a plurality of wiring board regions, each of which is a wiring board for mounting electronic components, are arranged vertically and horizontally in the central portion of the mother board, and a plurality of dividing grooves are formed at the boundary of the wiring board area. The present invention relates to a wiring board, a wiring board obtained by dividing the wiring board, and an electronic device in which electronic components are mounted on the wiring board.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators are made of metal powder metallization such as tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by arranging a wiring conductor made of

  Such a wiring board has been reduced in size in accordance with the recent demand for miniaturization of electronic devices. In order to efficiently manufacture a plurality of wiring boards, a plan view is shown in FIG. Such a so-called multi-piece wiring board is manufactured by dividing it. In the multi-cavity wiring board, a plurality of wiring board regions 1a serving as wiring boards are arranged vertically and horizontally in the center of a large-area mother board 1, and divided grooves 2 (2x, 2y) for dividing each wiring board area 1a. Are formed vertically and horizontally. A plurality of wiring boards can be obtained by dividing the mother board 1 along the dividing grooves 2 (2x, 2y). In addition, in order to efficiently mount electronic components on the wiring board, the electronic components are mounted on each wiring board region 1a of the multi-piece wiring board and then divided.

  In such a multi-piece wiring board, the mother board 1 can be easily divided well along the dividing grooves 2 (2x, 2y), and the whole mother board 1 is inadvertently cracked during handling. In order to suppress, for example, FIG. 10B is a cross-sectional view taken along line AA in FIG. 10A, and FIG. 10C is a cross-sectional view taken along line BB in FIG. In addition, there is known one in which the depth of the dividing groove 2x is changed stepwise from the end side to the center side of the mother substrate 1 (see Patent Document 1).

Such a dividing groove is formed by pressing a V-shaped cutter blade along the outer edge of each wiring board region of the ceramic generation form for the multi-cavity wiring board, and the cross section is against the main surface of the mother board. In many cases, the shape is a V-shape composed of inclined slopes.
JP 2004-119490 A

  However, in order to change the depth of the split groove stepwise (discontinuously) in one V-shaped split groove of the conventional cross section, for example, when the opening width of the split groove is constant, the split groove The inclination angle of the inclined surface of the dividing groove in the deep region (angle between the main surface of the mother substrate and the inclined surface) is smaller than the inclination angle of the inclined surface of the dividing groove in the shallow region of the dividing groove. In addition, when the inclination angles of the slopes of the dividing grooves are all the same and the angle of the bottom is the same, the opening width of the shallow region is reduced. For this reason, when the angle of inclination of the dividing groove is the same, the area where the depth of the dividing groove is shallow has a small opening width, so that the slope of this area protrudes to the inside of the dividing groove. When the opening width is constant, the slope of the shallow region of the dividing groove has a shape protruding inward of the dividing groove with respect to the slope of the deep region of the dividing groove.

  As described above, when a part of the region is formed so as to protrude in the dividing groove, only the protruding portions are separated when the mother substrate is divided by bending both sides of the dividing groove toward the main surface side. Therefore, the corner of the boundary between the deep region and the shallow region of the dividing groove is chipped, especially on the opening side of the wiring board, which is away from the bottom of the dividing groove, which is a fulcrum when dividing. It was easy to occur.

  If the wiring board is chipped, an electronic component is mounted on the wiring board with reference to the outer edge of the wiring board, or the electronic device is mounted on the external electric circuit board with reference to the outer edge of the electronic device having the electronic component mounted on the wiring board. When mounting, there was a problem that the mounting could not be performed accurately.

  The present invention has been devised in view of the above-described problems of the prior art, and its purpose is to provide a wiring board when dividing a multi-cavity wiring board having discontinuously different depths. An object of the present invention is to provide a multi-piece wiring board capable of reducing generated chips. Another object of the present invention is to provide a wiring board and an electronic device obtained by using a multi-piece wiring board.

Multiple patterning wiring board of the present invention, spanning a plurality of the wiring substrate area division groove provided on a boundary of the plurality of wiring boards region definitive within one main surface of the mother substrate arranged vertically and horizontally with a portion of the boundary in multiple patterning wiring board having a recess disposed corresponding to each of the plurality of wiring substrate regions as, the dividing grooves are different discontinuous depth from the one main surface, first
And a second region having a depth deeper than the first region, and the first region is configured by a first inclined surface inclined with respect to the one main surface in a longitudinal sectional view . In the longitudinal sectional view , the second region has the same opening width as the first region and the same inclination angle as the first slope in the longitudinal cross-sectional view . the first slope is provided on the one main surface side, a second inclined surface having a smaller angle of inclination than the first inclined surface provided on the bottom side, a V-shape, in plan view, the The second region is provided so as to cross the concave portion, and a discontinuous portion having a depth due to the first region and the second region corresponding to each of the plurality of wiring board regions is the concave portion. And the depth of the dividing groove in the first region is the recess. Shallower than the depth, the depth of the second region of the dividing groove is characterized in that deeper than the depth of the recess.

  The wiring board of the present invention is characterized in that the multi-piece wiring board having the above configuration is divided along the dividing groove.

  The electronic device of the present invention is characterized in that an electronic component is mounted on the wiring board having the above-described configuration.

According to the multi-cavity wiring board of the present invention , the first region and the second region have the first slope that is the same continuous surface on the opening side, and the second region The second inclined surface on the bottom side is positioned so as to be recessed (outside) from the bottom of the first region . Further, in plan view, the second region is provided so as to cross the concave portion, and a discontinuous portion having a depth due to the first region and the second region corresponds to each of the plurality of wiring board regions. The depth in the first region of the dividing groove is shallower than the depth of the recess, and the depth in the second region of the dividing groove is deeper than the depth of the recess. Therefore , when the mother substrate is divided by bending both sides toward the one main surface with the dividing groove as the center, both the first region and the second region are in surface contact with each other at the same time. It is possible to suppress the force from concentrating on only one of the second region and the second region, and it is possible to reduce chipping generated in the wiring board.

  Further, according to the wiring board of the present invention, since the multi-piece wiring board having the above configuration is divided along the dividing grooves, the occurrence of chipping is reduced at the outer edge portion of the wiring board. Thus, the outer edge of the wiring board can be well recognized by an image recognition device or the like, and the electronic component can be mounted on the wiring board with the outer edge of the wiring board as a reference with good positional accuracy.

  Further, according to the electronic device of the present invention, since the electronic component is mounted on the wiring board having the above-described configuration, the occurrence of overhang is reduced on the outer edge portion of the electronic device. The electronic device can be well recognized by a recognition device or the like, and the electronic device can be mounted on the external electric circuit board with reference to the outer edge of the electronic device with good positional accuracy.

  A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings.

FIG. 1A is a plan view as a reference example for explaining a multi-piece wiring board of the present invention, and FIG. 1B is a cross-sectional view showing a cross section taken along line AA of FIG. FIG. 1C is a cross-sectional view showing a cross section taken along line B-B in FIG. FIG. 2A is an enlarged plan view showing a portion A of FIG. 1A, and FIG. 2B is a sectional view showing an enlarged portion A of FIG. FIG. 2C is an enlarged cross-sectional view of a portion A in FIG. 1 and 2, 1 is a mother board, 1a is a wiring board area, 2 (2x, 2y) is a dividing groove, 2x1, 2y1 is a first area, 2x2, 2y2 is a second area, and 3 is a first area. The slope 4 is a second slope.
Although not shown in these drawings, wiring conductors are formed on the surface and inside of each wiring board region 1a.

  In the example shown in FIG. 1A, a total of 64 wiring board regions 1a are arranged on the mother board 1 in the vertical and horizontal directions, and the dividing grooves 2y in the vertical direction and the horizontal dividing grooves 2y are arranged at the boundaries of the wiring board regions 1a. A dividing groove 2 composed of a dividing groove 2x in the direction is formed. In addition, a dummy region is provided in the outer periphery of the central portion where 64 wiring board regions 1a are arranged vertically and horizontally, and a dividing groove is also formed at the boundary between the dummy part and the wiring substrate region 1a. The vertical dividing groove 2y and the horizontal dividing groove 2x are both located in the center from the end of the dividing groove 2 to the second wiring board region 1a from the outer edge of the mother board 1. The first region 2x1,2y1 having a depth d1 from the one main surface of the mother substrate 1 and the second region 2x2 having a depth d2 deeper than the first region 2x1,2y1 inside the region. , 2y2.

As shown in FIG. 1 and FIG. 2, a large number of pieces in which a dividing groove 2 is formed at the boundary of the wiring board region 1 on one main surface of the mother board 1 in which a plurality of wiring board regions 1 a are arranged vertically and horizontally. In the wiring substrate, the dividing groove 2 has the first regions 2x1, 2y1 and the second regions 2x2, 2y2 which are deeper than the first regions 2x1, 2y1 and have different depths from one main surface. The first regions 2x1 and 2y1 are V-shaped with a first inclined surface 3 whose cross section is inclined with respect to one main surface, and the second regions 2x2 and 2y2 have a first cross-section The first inclined surface 3 having the same opening width as that of the regions 2x1 and 2y1 and having the same inclination angle as that of the first inclined surface 3 is provided on one main surface side, and the first inclination surface 3 has a smaller inclination angle than the first inclined surface 3 on the bottom side. and a second inclined surface 4, Ru V-shaped der.

  Due to such a configuration, the first regions 2x1, 2y1 and the second regions 2x2, 2y2 have the first slope 3 which is the same continuous surface on the opening side, The second slope 4 on the bottom side of the second regions 2x2 and 2y2 is positioned so as to be recessed (outside) from the bottom of the first regions 2x1 and 2y1, so that both sides of the second groove 2 are centered on the dividing groove 2. When the mother board 1 is divided by being bent toward the main surface side, the first slopes 3 of the first regions 2x1, 2y1 and the second regions 2x2, 2y2 are both in surface contact with each other at the same time. , 2y1 or the second region 2x2, 2y2 can be prevented from concentrating force only on one of the regions, and chipping generated on the wiring board can be reduced.

As an example in which the dividing groove 2 has regions where the depths from the one main surface are discontinuously different, there are examples as shown in FIGS. FIG. 3A is a plan view showing an example of an embodiment of a multi-piece wiring board according to the present invention, and FIG. 3B is a diagram obtained by dividing the multi-piece wiring board of FIG. It is a perspective view of the wiring board obtained in this way. 4A is a cross-sectional view showing a cross section taken along the line AA of FIG. 3A, and FIG. 4B is a cross-sectional view showing a cross section taken along the line BB of FIG. FIG.4 (c) is sectional drawing which shows the CC line cross section of Fig.3 (a). 5A is an enlarged plan view showing an A portion of FIG. 3A, and FIG. 5B is an enlarged sectional view showing an A portion of FIG. 4A. FIG. 5C is a cross-sectional view showing an enlarged portion A of FIG. 4C. 3 to 5, 1b is a wiring board obtained by dividing the mother board, 5 is a recess, 5a is a notch, and the other reference numerals are the same as those in FIGS.

  This example is an example of a multi-cavity wiring board for obtaining a wiring board 1b having a notch 5a for mounting an electronic component or the like on the outer side, as in the example shown in FIG. 3B. . In such a multi-piece wiring board, as shown in FIG. 3A, a recess 5 is formed so as to straddle the two wiring board areas 1a and 1a, and the two wiring board areas 1a and 1a are formed. A dividing groove 2x is formed at the boundary so as to cross the recess 5. By bending the mother board 1 along the dividing grooves 2x, the recesses 5 are divided into two parts, which respectively become the notches 5a of the wiring board 1b. If the depth of the dividing groove 2x at this time is uniform, the mother substrate 1 is easily cracked if the depth of the dividing groove 2x is deeper than the recess 5, and conversely if the depth of the recess 5 is shallower than the recess 5, There is a problem that the bottom surface does not break along the boundary line. Therefore, as in the example shown in FIGS. 4 and 5, the depth d2 of the portion (second region 2x2) crossing the recess 5 is deeper than the recess 5, and the depth of the other portion (first region 2x1). The length d1 is preferably shallower than the recess 5. If it does in this way, while the bottom face of the recessed part 5 will be divided | segmented favorably, it will become the multi-piece wiring board by which the mother board 1 does not break carelessly. The vertical dividing groove 2y that does not cross the concave portion 5 has a constant depth, which is about the same depth as the first region 2x1 of the horizontal dividing groove 2x.

  The wiring board 1b according to the present invention is obtained by dividing the multi-piece wiring board having the above-described configuration along the dividing groove 2. Due to such a configuration, the occurrence of chipping is suppressed at the outer edge portion of the wiring board 1b, so that the outer edge of the wiring board 1b can be well recognized by an image recognition device or the like, and an electronic component to the wiring board 1b is obtained. The wiring board 1b can be mounted with good positional accuracy with reference to the outer edge of the wiring board 1b.

  In the electronic device of the present invention, electronic components are mounted on the wiring board 1b having the above-described configuration. Due to such a configuration, since the occurrence of chipping is suppressed at the outer edge of the electronic device, the outer edge of the electronic device can be well recognized by an image recognition device or the like, and the electronic device can be connected to the external electric circuit board. The electronic device can be mounted with good positional accuracy with reference to the outer edge of the electronic device.

  The base substrate 1 is an electrical insulator made of a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. A plurality of wiring board regions 1a, in which wiring conductors made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc. are formed in the central part of the conductive insulating substrate, are arranged vertically and horizontally.

  If the insulating substrate is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, dispersant, etc. are added to ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. The ceramic slurry obtained by mixing is formed into a sheet by using a conventionally known sheet forming method such as a doctor blade method to obtain a ceramic green sheet. After that, the ceramic green sheet is appropriately punched, and if necessary, a plurality of the green sheets are laminated to produce a formed body to be the mother substrate 1 and fired at a temperature of about 1500 to 1800 ° C. Or what consists of a several insulating layer is manufactured.

  The wiring conductor includes a wiring conductor layer disposed between the surface of the insulating base and the insulating layer, and a through conductor that electrically connects the wiring conductor layers that pass through the insulating layer and are positioned above and below. The wiring conductor layer is formed by printing and applying a metallized paste for the wiring conductor layer on a ceramic green sheet for the mother board 1 by printing means such as a screen printing method, and baking it together with the generated shape for the mother board 1. Prior to the printing and application of the metallized paste for forming the wiring conductor, the through conductor has a through hole for the through conductor formed on the ceramic green sheet for the mother substrate 1 by a punching method using a die or punching or a processing method such as laser processing. It is formed by filling the through hole with a metallized paste for a through conductor by a printing means such as a screen printing method, and firing it together with the formed body to be the mother substrate 1. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as required to the metal powder of the main component and mixing and kneading by a kneading means such as a ball mill, a three roll mill, a planetary mixer or the like. Further, glass or ceramic powder may be added in order to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate after firing. The metallized paste for through conductors is adjusted to have a higher viscosity than the metallized paste for wiring conductor layers, which is suitable for filling, depending on the type and amount of organic binder or organic solvent.

  In addition, the metal which is excellent in corrosion resistance, such as nickel and gold | metal | money, is adhered to the exposed surface of a wiring conductor as needed. As a result, corrosion of the wiring conductor can be effectively suppressed, the wiring conductor and the electronic component are fixed, the wiring conductor and the bonding wire are joined, and the wiring conductor and the wiring conductor of the external electric circuit board are connected. Can be strengthened. Further, for example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor by an electrolytic plating method or an electroless plating method. The

  The dividing groove 2 is formed at the boundary of each wiring board region 1 a on one main surface of the mother board 1. As shown in the example shown in FIGS. 1A and 3A, the mother board 1 preferably has a dummy area at the outer periphery of the center where a plurality of wiring board areas 1a are arranged vertically and horizontally. The dummy area is an area for facilitating the manufacture and transportation of the multi-piece wiring board. Using the dummy area, the generated shape to be the mother board 1 and the positioning when the multi-piece wiring board is processed or carried. Alternatively, fixing or the like can be performed. In this case, the dividing groove 2 is also formed at the boundary between the wiring board region 1a and the dummy region. At this time, if both end portions of the dividing groove 2 are formed so as to be positioned in a dummy region between the wiring substrate region 1 a arranged on the outermost periphery and the outer peripheral portion of the mother substrate 1, the mother substrate 1 is transported. It is preferable because the mother substrate 1 can be prevented from being carelessly cracked by an external force applied at times. Further, a dummy region may be provided between the plurality of wiring board regions 1a. In this case, the dividing groove 2 having the above structure is formed at the boundary between the wiring board region 1a and the dummy region.

  FIG. 6 is a perspective view schematically showing an enlarged portion A of FIG. 5A, in which the boundary between the first region 2x1 and the second region 2x2 of the horizontal dividing groove 2x is enlarged. It shows. In the example shown in FIGS. 1 and 2, the boundary between the first regions 2x1, 2y1 and the second regions 2x2, 2y2 is the same.

  The dividing groove 2 has a portion where the depth from one main surface is discontinuously different, but the depth of the dividing groove 2 is discontinuously different from a certain region (the first region 2x1, 2y1 and the first region). 2 shows that the depth of the dividing groove 2 (2x, 2y) changes greatly at the boundary between the regions 2x2 and 2y2. That is, as in the example illustrated in FIGS. 1 to 6, for example, in the lateral dividing groove 2x, the first region 2x1 having a depth d1 and the second region 2x2 having a depth d2 deeper than the depth d1. Are adjacent in the length direction of the dividing groove 2x.

  Further, as in the example shown in FIG. 1 to FIG. 6, the dividing groove 2 has a vertical cross section perpendicular to the length direction of the first regions 2 x 1 and 2 y 1 inclined at an inclination angle θ 1 with respect to the main surface. It is a V-shape comprised of a pair of first slopes 3. The second region 2x2, 2y2 includes a pair of first slopes 3 having the same slope angle θ1 as the slope angle θ1 of the first slope 3 on one main surface side, and the slope angle of the first slope 3 on the bottom side. Since the pair of second inclined surfaces 4 having an inclination angle θ2 smaller than θ1 is provided, the cross-sectional shape thereof is a V shape in which the inclined surface is bent convexly inside the groove. In this way, when the mother substrate 1 is bent and broken along the dividing groove 2, the bottom of the dividing groove 2 has a shape in which stress is likely to concentrate, so that the breaking is easy and accurate.

  Here, since the opening width w1 of the second regions 2x2, 2y2 is the same as the opening width w1 of the first regions 2x1, 2y1, the first regions 2x1, 2y1 and the second regions 2x2, 2y2 is the first slope 3 which is the same continuous surface on the opening side, and the second slope 4 on the bottom side of the second regions 2x2 and 2y2 is more than the bottom of the first regions 2x1 and 2y1. The effect as described above is obtained because it is recessed (outside).

  Further, a second dividing groove (not shown) may be formed on the other main surface side of the mother board 1 at the boundary of the wiring board region 1a. The mother substrate 1 can be divided starting from the bottom of the second dividing groove, and the mother substrate 1 can be divided more accurately along the boundary of the wiring substrate region 1a on both main surfaces.

  The depth of the dividing groove 2 depends on the insulating base material, the length of the second regions 2x2 and 2y2 having a deep depth in one dividing groove 2, and the length of the first regions 2x1 and 2y1 having a small depth. It is set appropriately depending on the ratio. In the case of the example shown in FIGS. 1 and 2, the deep region is formed to be about 55 to 75% of the thickness of the mother substrate 1, and the shallow region is 45 to 65 of the thickness of the mother substrate 1. % Is formed. The average depth in the length direction of the dividing groove 2 between the deep region and the shallow region is formed to be about 50 to 70% of the thickness of the mother substrate 1. By doing in this way, while being divided | segmented favorably, it becomes a multi-piece wiring board by which the mother board 1 does not break carelessly. In addition, when the 2nd division groove is formed in the other main surface side of the motherboard 1, the sum of the depth of the division groove 2 and the depth of the 2nd division groove 2 with respect to the thickness of the motherboard 1 is It is formed to have the above-mentioned depth.

  3 to 5, when the dividing groove 2 crosses the recessed portion 5, the depth d2 of the dividing groove in the portion crossing the recessed portion 5 is the thickness of the bottom portion of the recessed portion 5 (the recessed portion 5). The depth d1 of the dividing groove 2 in the other part is 50 to 70% of the thickness of the mother board 1. The thickness between the bottom surface of the mother board 1 and the other main surface of the mother board 1 is approximately 50 to 70%. Formed to a degree.

  It should be noted that the vertical division grooves 2y and the horizontal division grooves 2x may have different depths and inclination angles.

  When the opening width of the dividing groove 2 on the one main surface of the mother board 1 is about 0.05 to 1.0 mm, it can be divided satisfactorily, each wiring board region 1a is not reduced, and wiring is formed when the dividing groove 2 is formed. It is preferable because the substrate region 1a is not greatly deformed.

  Further, the opening width w2 of the groove on the bottom side constituted by the second slopes 4 of the second regions 2x2 and 2y2 of the dividing groove 2 (opening width at the boundary between the first slope 3 and the second slope 4). Is preferably 50% or less of the opening width w1 (opening width on one main surface) of the second regions 2x2 and 2y2. In other words, the upper side of the second slope 4 is preferably located at a position deeper than 50% of the depth of the first region 2x1, 2y1. Thereby, when the mother substrate 1 is divided, the first inclined surfaces 3 are easily brought into surface contact with each other over a wide area in the dividing groove 2.

  When the recess 5 is formed, the length of the deep part of the dividing groove 2x depends on the size of the recess 5. In order to divide satisfactorily without the occurrence of burrs or chips below the bottom surface of the recess 5, it is preferable to form the split groove 2x on the bottom surface of the recess 5, and for this purpose, the second of the split groove 2x The length of the region 2x2 is preferably equal to or longer than the length of the recess 5 as in the examples shown in FIGS.

  7 and 8 are cross-sectional views showing an example of a process for manufacturing the multi-cavity wiring board of the present invention. 7 and 8, 1 ′ is a generated shape that becomes the mother substrate 1, and 2x1 ′ and 2x2 ′ are cuts that become the first region 2x1 and the second region 2x2 of the lateral dividing grooves 2x, respectively, 2y1 ′, 2y2 ′ is the first region 2y1 and second region 2y2 of the vertical dividing groove 2y, and 6 (6x (6x1, 6x2, 6x3), 6y (6y1, 6y2, 6y3)) is a cutter blade. is there. These drawings show notches 2 '(2x' (2x1 ', 2x2'), 2y that become the division grooves 2 (2x (2x1, 2x2), 2y (2y1, 2y2)) in the portion shown in FIG. '(2y1', 2y2 ')) is formed in the generated feature 1'.

  The dividing groove 2 is formed as follows, for example. First, as in the example shown in FIG. 7A, the cutter blade 6y1 is pressed against the generated shaped body 1 ′ to be the base substrate 1 to open the first region 2y1 and the second region 2y2 in the longitudinal dividing groove 2y. A notch 2y1 ′ having a depth d1 ′ that becomes the depth d1 after firing is formed on the side. Next, as in the example shown in FIG. 7B, the cutter blade 6y2 having a shape corresponding to the bottom side of the notch 2y2 ′ is pressed against the generated shape 1 ′ from above the notch 2y1 ′ to form the longitudinal dividing groove 2y. By forming the bottom side of the notch 2y2 ′ having the depth d2 ′ that becomes the depth d2 after firing, which becomes the second region 2y2, the notch 2y ′ that becomes the dividing groove 2y is formed. Then, as in the example shown in FIGS. 7C and 7D, the cutter blades 6x1 and 6x2 are pressed against the generated shape 1 ′ in the same manner as the formation of the cut 2y ′, and the first region 2x1 and the first region 2x1 A notch 2x ′ (2 × 1 ′, 2x2 ′) is formed to be a horizontal dividing groove 2x having two regions 2x2.

  Further, in FIG. 7, in order to form the notches 2x2 ′ and 2y2 ′ to be the second regions 2x2 and 2y2 of the notches 2x ′ and 2y ′ to be the divided grooves 2x and 2y, the notches 2x1 ′ and 2y1 ′ and the notches are formed. Two cutter blades 6x1 and 6y1 for the opening side of 2x2 'and 2y2' and two cutter blades 6x2 and 6y2 for the bottom side of the cuts 2x2 'and 2y2' are used, as in the example shown in FIG. Alternatively, one cutter blade 6x3, 6y3 corresponding to the shape of the cuts 2x ′, 2y ′ may be used.

  FIG. 9A and FIG. 9B are perspective views showing an example of a cutter blade used when manufacturing the multi-cavity wiring board of the example shown in FIGS. It is a cutter blade used for forming a cut 2x 'that becomes a lateral dividing groove 2x having a second region 2x2. FIG. 9A shows a case where two cutter blades are used to form the cut 2x2 ′ to be the second region 2x2, as in the example shown in FIG. 7, and the cut 2x1 ′ and the cut 2x2 ′. The cutter blade 6x1 for the opening side and the cutter blade 6x2 for the bottom side of the cut 2x2 'are shown. FIG. 9B shows a cutter blade 6x3 when one cutter blade is used to form the cut 2x2 'that becomes the second region 2x2 as in the example shown in FIG. In order to form the notches 2y ′ that become the vertical dividing grooves 2y when the multi-cavity wiring board of the example shown in FIGS. 3 to 5 is manufactured, the notches 2x1 ′ and 2x2 ′ in FIG. What is necessary is just to use the same thing as the cutter blade 6x1 for opening sides.

  In the example shown in FIGS. 7 and 8, a plurality of cuts 2y 'are formed simultaneously, but they may be formed one by one. Further, the horizontal cut 2x ′ is formed after the vertical cut 2y ′ is formed, but the reverse order may be used, or both may be performed simultaneously using a mold in which the vertical and horizontal cutter blades are integrally formed. Also good.

  In addition, as shown in FIG. 7, when the cut is formed using two cutter blades 6, the generated shape 1 ′ to be the base substrate 1 is divided into two by the cutter blade 6 to form the cut. The opening width w2 between the pair of second inclined surfaces 4 in the second regions 2x2 and 2y2 is less likely to be smaller due to the elasticity of the generated shape 1 ', compared to the case where the cutting is deeply formed by the cutter blade 6 once. Therefore, the dividing groove 2 can be formed with high accuracy.

  The recessed part 5 should just be the magnitude | size according to the magnitude | size and quantity of electronic components etc. which are mounted there. In addition, the example shown in FIG. 3 is a case where notches 5a are provided on a pair of opposing outer sides of one wiring board 1b, but the number, position, and shape of the notches 5a required are different. The corresponding concave portion 5 may be used. The inner surface of the recess 5 has a wiring conductor to which a terminal of the electronic component is connected.

  The concave portion 5 is formed by laminating a plurality of ceramic green sheets for the mother substrate 1 by forming through holes for the concave portion 5 by a punching method using a die or punching or a processing method such as laser processing. What is necessary is just to produce the production | generation form 1 'which has the recessed part 5' opened.

  Each wiring board region 1a of the mother board 1 may be provided with a so-called cavity for storing electronic components at a position not intersecting with the dividing groove 2 other than the recessed part 5 serving as the notch part 5a. . A seal ring for joining the lid may be formed around each cavity on the one main surface of the mother board 1 in the same manner as the wiring conductor.

  A plurality of wiring boards 1b are produced by dividing such a multi-piece wiring board along the dividing grooves 2, and an electronic device is produced by mounting electronic components on the wiring board 1b. The electronic device may be fabricated by dividing along the dividing grooves 2 after mounting electronic components on each wiring board region 1a of the multi-cavity wiring board.

  Electronic components mounted on the wiring board 1b are semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal oscillators and piezoelectric vibrators, and various sensors.

  For example, when the electronic component is a flip chip type semiconductor element, the electronic component is mounted on the electrode of the semiconductor element via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). This is done by electrically connecting the wiring conductor. Alternatively, for example, when the electronic component is a wire bonding type semiconductor element, the electrode and the wiring conductor of the semiconductor element are electrically connected to each other through a bonding wire after being fixed with a bonding material such as glass, resin, or brazing material. This is done by connecting to. Further, for example, when the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor are electrically connected by a conductive resin. Moreover, you may mount small electronic components, such as a resistive element and a capacitive element, around the electronic component and in the notch part 5a as needed.

  And an electronic component is sealed as needed. For sealing, cover the electronic parts with a sealing resin such as epoxy resin, or wire the lid made of resin, metal, or ceramic placed so as to cover the electronic parts with an adhesive such as glass, resin, or brazing material. What is necessary is just to join to a board | substrate.

  The present invention can be variously modified without departing from the gist of the present invention. For example, in the above-described example, one division groove 2 has two depths d1 and d2, but may have three or more depths. In this case, each region deeper than the first region 2x1,2y1 has the same opening width as the opening width of the first region 2x1,2y1, and the same inclination angle as that of the first inclined surface 3 on one main surface side. The first slope 3 may be provided so as to be continuous with the first slope in the first region, and the slope angle of the slope on the bottom side may be made smaller.

(A) is a top view as a reference example for demonstrating the multi-piece wiring board of this invention, (b) is sectional drawing which shows the AA line cross section of (a), (c) is It is sectional drawing which shows the BB line cross section of (a). 1A is an enlarged plan view showing an A part of FIG. 1A, FIG. 1B is an enlarged sectional view showing an A part of FIG. 1B, and FIG. It is sectional drawing which expands and shows the A section of (c). (A) is a top view which shows an example of embodiment of the multi-cavity wiring board of this invention, (b) is a perspective view of the wiring board obtained by dividing | segmenting the multi-cavity wiring board of (a). It is. (A) is sectional drawing which shows the AA line cross section of Fig.3 (a), (b) is sectional drawing which shows the BB sectional view of Fig.3 (a), (c) is FIG.3. It is sectional drawing which shows the CC line cross section of (a). FIG. 4A is an enlarged plan view showing an A portion of FIG. 3A, FIG. 4B is an enlarged plan view showing an A portion of FIG. 4A, and FIG. It is a top view which expands and shows the A section of (c). It is a perspective view which expands and schematically shows the A section of Fig.5 (a). (A)-(d) is sectional drawing which shows an example of the process of manufacturing the multi-piece wiring board of this invention. (A)-(b) is sectional drawing which shows an example of the process of manufacturing the multi-piece wiring board of this invention. (A) And (b) is a perspective view which shows an example of the cutter blade used when manufacturing the multi-piece wiring board of this invention. (A) is a top view which shows an example of the form of the conventional multi-cavity wiring board, (b) is sectional drawing which shows the AA cross section of (a), (c) is (a). It is sectional drawing which shows a BB line cross section.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 1a ... Wiring board area | region 1b ... Wiring board 2 ... Dividing groove 3 ... First slope 4 ... Second slope 5 ... Recess 6 ... Cutter blade

Claims (3)

A plurality of wiring substrate regions each of the plurality of wiring substrate regions so as to extend over a portion of the the divided groove provided on a boundary of the plurality of wiring boards region definitive on one main surface of the mother board which is arranged vertically and horizontally boundary In a multi- cavity wiring board having recesses arranged corresponding to
The dividing groove, wherein the different discontinuous depth from one main surface, and a deep second region depth than the first region and the first region,
In a longitudinal sectional view , the first region is a V-shape configured by a first inclined surface inclined with respect to the one main surface,
In a longitudinal sectional view , the second region has a first inclined surface having the same opening width as the first region on the one main surface and the same inclination angle as the first inclined surface. the one provided on the main surface side, a second inclined surface having a smaller angle of inclination than the first inclined surface provided on the bottom side, Ri V-der,
In plan view, the second region is provided so as to cross the concave portion, and the depth of the first region and the second region corresponding to each of the plurality of wiring board regions is not increased. The continuous part is arranged so as to sandwich the concave part,
The multi- cavity wiring , wherein the depth of the dividing groove in the first region is shallower than the depth of the recess, and the depth of the dividing groove in the second region is deeper than the depth of the recess. substrate.   The wiring board according to claim 1, wherein the multi-cavity wiring board according to claim 1 is divided along the dividing groove.   An electronic device, wherein an electronic component is mounted on the wiring board according to claim 2.

Images