JP2014150107A - Electronic element mounting substrate and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic element mounting substrate which can be made compact, and to provide an electronic device.SOLUTION: The electronic element mounting substrate has an insulation base 2, and a plurality of via conductors 5 provided on the insulation base 2. Each of the plurality of via conductors 5 includes a first conductor 5a, and a second conductor 5b connected with the first conductor 5a and having a width narrower than that of the first conductor 5a. The plurality of via conductors 5 are arranged so that the first conductor 5a and the second conductor 5b are arranged at the same height position in adjacent via conductors 5, some of the second conductors 5b in adjacent via conductors 5 are arranged at the same height position, and the interval of some of the second conductors 5b is larger than the interval of the first conductor 5a and the second conductor 5b in adjacent via conductors 5.

Description

The present invention relates to an imaging device such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, and an LED (Light Emitting Diode).
The present invention relates to an electronic device mounting substrate and an electronic device on which a light emitting device such as) is mounted.

  2. Description of the Related Art Conventionally, an electronic device in which an image pickup element such as a CCD type or a CMOS type and a light emitting element such as an LED are mounted on an insulating substrate is known. As such an electronic device, one having an insulating base having a frame portion and an electronic element mounted on the inner side of the frame portion or the lower surface of the frame portion is known (for example, Patent Documents). 1). An electrode pad is disposed on the upper surface of the insulating substrate.

JP 2006-201427

  In recent years, with the miniaturization of electronic devices, the insulating base of an electronic element mounting substrate has become smaller, and accordingly, the distance between adjacent via conductors has become narrower. Therefore, for example, due to heat generated when the electronic element is mounted or when the electronic element is operated, the electronic element mounting substrate is deformed, and cracks are easily generated between adjacent via conductors.

  An electronic element mounting substrate according to an aspect of the present invention includes an insulating base and a plurality of via conductors provided on the insulating base, and each of the plurality of via conductors includes a first conductor portion and a first conductor. And a second conductor part connected to the conductor part and having a narrower width than the first conductor part. The plurality of via conductors are arranged so that the first conductor portion and the second conductor portion are arranged at the same height in adjacent via conductors, and the second conductor portions of the adjacent via conductors Some of them are arranged at the same height position, and the interval between the part of the penetrating second conductors is larger than the interval between the first conductor part and the second conductor part of the adjacent via conductors.

  According to another aspect of the present invention, an electronic device includes the electronic element mounting substrate having the above-described configuration and an electronic element mounted on the electronic element mounting substrate.

  The electronic element mounting board of the present embodiment has a plurality of via conductors provided on an insulating base, and the via conductors are connected to the first conductor portion and the first conductor portion, and the first conductor. It is formed from the 2nd conductor part which has a width | variety narrower than a part. The via conductors are arranged so that the first conductor portion and the second conductor portion are arranged at the same height in adjacent via conductors, and a part of the second conductor portions of the via conductor is the same height. In addition, the gaps between the second conductor portions are larger than the gap between the first conductor portion and the second conductor portion of the adjacent via conductors. As a result, even if the pitch between adjacent via conductors in the insulating substrate is reduced, a sufficient interval between adjacent via conductors can be ensured, for example, when an electronic element is mounted or when an electronic element is operated. Even when the electronic element mounting substrate is deformed due to heat or the like, it is possible to suppress the occurrence of cracks between adjacent via conductors.

  According to another aspect of the present invention, the electronic device includes the electronic element mounting substrate having the above-described configuration, so that the electronic device can be miniaturized while maintaining reliability.

(A) is a plane perspective view which shows the electronic device in embodiment of this invention, (b) has shown the longitudinal cross-section in the AA of the electronic device shown by Fig.1 (a). (A) is a plane perspective view which shows the board | substrate for electronic element mounting in embodiment of this invention, (b) is a longitudinal cross-sectional view in the AA line of the board | substrate for electronic element mounting shown to Fig.2 (a). Is shown. These show the modification of the longitudinal cross-sectional view of the board | substrate for electronic element mounting in embodiment of this invention. These show the modification of the longitudinal cross-sectional view of the board | substrate for electronic element mounting in embodiment of this invention. These show the modification of the longitudinal cross-sectional view of the board | substrate for electronic element mounting in embodiment of this invention. These show the modification of the longitudinal cross-sectional view of the board | substrate for electronic element mounting in embodiment of this invention. These show the modification of the longitudinal cross-sectional view of the board | substrate for electronic element mounting in embodiment of this invention. (A) is a plane perspective view which shows the modification of the electronic element mounting board | substrate in embodiment of this invention, (b) is in the AA line of the electronic element mounting board | substrate shown by Fig.8 (a). A longitudinal sectional view is shown. (A) is a plane perspective view which shows the electronic device in other embodiment of this invention, (b) has shown the longitudinal cross-sectional view in the AA line of the electronic device shown by Fig.9 (a). .

  Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the electronic device according to this embodiment includes an electronic element mounting substrate 1 and an electronic element 11 mounted on the electronic element mounting substrate 1.

  An electronic element mounting substrate 1 according to the present embodiment includes an insulating base 2 having a frame portion 2a, a plurality of electrode pads 3 provided on the upper surface of the frame portion 2a, and a first conductor portion provided on the frame portion 2a. 5a and a via conductor 5 having a second conductor portion 5b having a width narrower than that of the first conductor portion 5a, and a wiring conductor 6 provided on the insulating base 2.

  The insulating base 2 has, for example, a frame 2a and a base 2b. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body. Body, electrically insulating ceramics such as sintered glass ceramics, or resins (plastics) such as epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin or tetrafluoroethylene resin A plurality of substantially rectangular insulating layers are stacked one above the other.

  The plurality of electrode pads 3 are provided on the upper surface of the frame portion 2a of the insulating base 2. In the example shown in FIG. 1, each electrode pad 3 is electrically connected to each electrode of the electronic element 11 by a bonding wire 11a or the like. . When the insulating base 2 is made of an electrically insulating ceramic, the electrode pad 3 is made of metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu).

The electrode pad 3 is made of copper (Cu), gold (Au) when the insulating base 2 is made of resin.
, Aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), and alloys thereof.

  The electronic element mounting substrate 1 of the present embodiment has a plurality of via conductors 5 electrically connected to each of the plurality of electrode pads 3 on the inner wall surface or inside of the frame portion 2 a of the insulating base 2. . The via conductor 5 includes a first conductor portion 5a and a second conductor portion 5b connected to the upper end or the lower end of the first conductor portion 5a and having a width narrower than that of the first conductor portion 5a. Contains. The first conductor portion 5a and the second conductor portion 5b of the adjacent via conductors 5 are arranged so as to be aligned at the same height, and a part of the second conductor portion 5b of the adjacent via conductor 5 B are lined up at the same height. Further, the second conductor portions 5b are provided such that the distance between the portions B of the second conductor portions 5b is larger than the distance between the first conductor portions 5a and the second conductor portions 5b of the adjacent via conductors 5. As described above, the via conductor 5 is formed of the first conductor portion 5a and the second conductor portion 5b having different widths, and the interval between the adjacent via conductors 5 is increased, for example, the electronic element mounting substrate 1 However, even if the frame portion 2a of the insulating base 2 is reduced in size, it is possible to prevent cracks from occurring between the adjacent via conductors 5.

  The via conductor 5 is made of metallization similar to the electrode pad 3 when the insulating base 2 is made of electrically insulating ceramics. Further, when the insulating base 2 is made of resin, the via conductor 5 is made of a metal material such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium, or an alloy thereof.

  In the example shown in FIG. 1, an electronic element 11 is mounted on the electronic element mounting substrate 1. The electronic element 11 is housed in a recess formed from the frame 2a and the base 2b of the insulating base 2, and is mounted via a plurality of electrode pads 3 provided on the upper surface of the frame 2a and bonding wires 11a. Electronic device. As described above, since the electronic element 11 is mounted on the electronic element mounting substrate 1 of the present invention, even when the electronic device is downsized, cracks due to heat during mounting or operation of the electronic device are less likely to occur. It will be a thing. Therefore, it is possible to obtain a more reliable electronic device.

  In the example shown in FIG. 2, the plurality of via conductors 5 are arranged at different height positions in the adjacent via conductors 5 where the first conductor portions 5 a are different from each other. Thus, the first conductor portions 5a having a width wider than the second conductor portion 5b are not adjacent to each other at the same height position, and the adjacent via conductors 5 are further separated from each other, It is possible to effectively suppress the occurrence of cracks between the via conductors 5.

Further, the difference in height between the first conductor portions 5a of the adjacent via conductors 5 can be suppressed more satisfactorily by providing about 40 μm to 100 μm.

  Further, compared to the case where the width of either one or both of the adjacent via conductors is reduced, the electrical resistance value of either one or both of the adjacent via conductors 5 becomes smaller, or the via conductor 5 has a frame. Dropping from the body 2 can be suppressed. The size of the second conductor portion 5b is preferably set to about 20% to 80% of the size of the first conductor portion 5a in plan view.

If the via conductor 5 is exposed on the inner wall surface of the frame portion 2a of the insulating base 2, the exposed surface is covered with a plating layer such as Ni or Au for preventing oxidation like the electrode pad 3 and the wiring conductor 6. This is preferable because the electrical resistance value of the via conductor 5 can be lowered. In addition, since the via conductor 5 can be biased and arranged on the inner wall surface side of the frame portion 2 to reduce the proportion of the via conductor 5 in the frame portion 2a, the wiring conductor provided in the insulating base 2 can be reduced. 6 can be facilitated, and the electronic element mounting substrate can be miniaturized and the wiring density can be increased. Further, in the plan view, the via conductor 5 is arranged to be biased toward the inner wall surface side of the frame portion 2, so that the connection region of the electrode pad 3 with the bonding wire 11 a is more outside the frame body 2 than the via conductor 5. It can be widely formed on the wall surface side, and the electrode pad 3 and the bonding wire 11a can be connected well.

  In addition, in the insulating base 2, for example, a frame conductor 2a and a base 2b are provided with a wiring conductor 6 that is electrically connected to the via conductor 5 and led out to the lower surface of the base 2b. The wiring conductor 6 penetrates the internal wiring electrically connected to the via conductor 5, the frame portion 2 a and the base portion 2 b in the thickness direction, and the through-conductor electrically connected to the internal wiring and the base portion 2 b An external terminal is provided on the lower surface and electrically connected to the through conductor. As a result, the electrode pad 3 is electrically connected to the external circuit 21 via the via conductor 5 and the wiring conductor 6. The wiring conductor 6 is made of metallization similar to the electrode pad 3 when the insulating base 2 is made of electrically insulating ceramics. Further, in the configuration described above, the wiring conductor 6 is provided so as to be led out to the lower surface of the insulating base 2, but may be provided so as to be led out to the side surface or the upper surface of the insulating base 2, for example.

  The wiring conductor 6 is made of metallization similar to the electrode pad 3 when the insulating base 2 is made of electrically insulating ceramics. Further, when the insulating base 2 is made of resin, the wiring conductor 6 is made of a metal material such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium and alloys thereof.

  In the example shown in FIG. 3, the first conductor portion 5 a is formed so as not to straddle the center N in the height direction of the frame portion 2 a of the insulating base 2. This suppresses an increase in the volume difference between the adjacent via conductors 5 as compared with the case where only one of the first conductor portions 5a of the adjacent via conductors 5 is increased. An increase in the difference in electrical resistance value can be suppressed.

  In the example shown in FIG. 4, the insulating layer 4 forming the frame 2 a of the insulating base 2 is line symmetric at the center N in the height direction of the frame 2 a. Further, adjacent via conductors 5 are provided so as to have the same shape when inverted. Thus, by equalizing the amount of metallization forming the via conductor 5 between the upper surface and the lower surface of the frame portion 2a, heat due to heat generated when the electronic element is mounted or heat generated when the electronic element is operated. Shrinkage and thermal expansion can be made equal between the upper surface side and the lower surface side of the frame portion 2a, and deformation of only a part of the frame portion 2a can be reduced to further reduce the occurrence of cracks. Furthermore, it is easy to make the electrical resistance values of the respective via conductors 5 equal. When the insulating base 2 is formed of an electrically insulating ceramic, the amount of metallization for forming the via conductors 5 on the upper surface side and the lower surface side of the frame portion 2a is made equal, so that the frame portion 2a during the manufacturing process is made. It becomes possible to reduce the deformation.

  In the example shown in FIG. 5, the second conductor portion 5 b is provided at the same height as the connection portion between the adjacent first conductor portion 5 a and the second conductor portion 5 b, in the thickness direction. The via conductors 5 connected to each other have a land 6a provided for good connection, and the land 6a is narrower than the width of the first conductor portion 5a in a longitudinal sectional view. As a result, even if the second conductor 5b is made thin in order to widen the distance between the first conductor 5a and the second conductor 5b, the land 6a can prevent the second conductor 5b from While making electrical connection favorable, it can suppress that a short circuit generate | occur | produces between the 1st conductor part 5a and the 2nd conductor part 5b. The land 6 a is formed from the same material and method as the electrode pad 3.

In the example shown in FIG. 6, the width is increased as the second conductor 5b is separated from the first conductor 5a. The widest width of the second conductor portion 5b is smaller than the width of the first conductor portion 5a. As a result, the distance between the corner portion of the first conductor portion 5a on the side connected to the second conductor portion 5b, which is likely to be the starting point of cracks, and the second conductor portion 5b of the adjacent via conductor 5 is increased. can do. Further, when the second conductive portion 5b and the electrode pad 3 are connected, the second conductive portion 5b at the joint portion is widened, so that the connection between the electrode pad 3 and the via conductor 5 can be satisfactorily performed. . Similarly, the first conductor portion 5a is also separated from the second conductor 5b, so that the width may be increased.

  In the example shown in FIG. 7, the center of the first conductor portion 5a at the left end of the via conductor 5 is arranged so as to be shifted from the center of the second conductor portion 5b. The first conductor portion 5a and the second conductor portion 5b may be arranged eccentrically. Thus, for example, when the via conductor 5 has a role of a signal circuit, the distance between the second conductor portion 5b and the adjacent via conductor 5 within the range of the width of the first conductor portion 5a. Thus, impedance matching can be easily performed.

  In the example shown in FIG. 8, the via conductor 5 is provided inside the frame 2a. In addition, one via conductor 5 of the adjacent via conductor 5 has a first conductor portion 5a on the upper surface and the lower surface side of the frame portion 2a, and the other via conductor 5 is formed in the middle portion of the frame portion 2a. 1 conductor portion 5a. By providing the via conductor 5 in such a shape and making the sum of the volumes of the first conductor portions 5a of one via conductor 5 equal to the volume of the first conductor portion 5a of the other via conductor 5, It is easy to widen the interval between the matching via conductors 5 to suppress the occurrence of cracks and to equalize the electrical resistance values of the adjacent via conductors 5.

  In the example shown in FIG. 9, the electronic element 11 is flip-chip mounted on the upper surface of the frame portion 2a, and the electronic device on which the electronic element 11 is mounted is joined to the external circuit 21 at the same surface height as the electronic element. . Each electrode of the electronic element 11 is electrically connected to the electrode pad 3 by connection terminals 11b such as gold bumps and solder, and the electronic device and the external circuit 21 are joined by a conductive joining material 22 such as solder. When the electronic element 11 is, for example, a CCD image sensor or a CMOS image sensor, light from above the electronic device is received by the electronic element 11. Moreover, it is good also as a more reliable electrical connection using the joining material 22 which consists of resin, such as an epoxy resin, as what is called an underfill in the site | part which carried out the flip chip mounting of the electronic element 11. FIG. For the electrical connection between each electrode of the electronic element 11 and the plurality of electrode pads 3 and the electrical connection between the electronic device and the external circuit 21, the connection terminals 11b such as the above-described gold bump or solder, solder, etc. Instead of using the bonding material 22, a connecting member made of conductive resin (anisotropic conductive resin or the like) may be used. Such an electronic device using the electronic element mounting substrate 1 of the present embodiment is a highly reliable electron that can suppress the generation of cracks due to heat generated when the electronic element is mounted or a product is used. It becomes a device. Further, since the electronic element mounting substrate 1 of the frame portion 2a that does not have the base portion 2b is connected to the external circuit 21 or the like, the thickness can be reduced.

  Next, a method for manufacturing the electronic element mounting substrate 1 of the present embodiment will be described.

The insulating base 2 is made of an electrically insulating ceramic such as an aluminum oxide (Al ₂ O ₃ ) -based sintered body, and has a frame portion 2a and a base portion 2b, for example. When the insulating base 2 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al ₂ O ₃ ), silica (SiO ₂ ), magnesia (MgO) is used as a sintering aid for Al ₂ O ₃ powder. ) Or calcia (CaO) or the like, and further an appropriate binder, solvent and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for multi-piece production is obtained by a conventionally known forming method such as a doctor blade method or a calender roll method.

  Using this ceramic green sheet, the electronic device mounting package 1 is manufactured by the following steps (1) to (6).

  (1) An electrode pad 3 formed on the upper surface of the frame portion 2a, and a metal paste for forming the first conductor portion 5a, the second conductor portion 5b, and the wiring conductor 6 on the frame portion 2a. A step of printing and applying to the ceramic green sheet, and a step of printing and applying to the ceramic green sheet a metal paste for forming the wiring conductors 6 at predetermined portions of the frame portion 2a and the base portion 2b.

  (2) The ceramic green sheets to be the respective insulating layers of the frame portion 2a are laminated to form the via conductor 5 so that the metal paste of the first conductor portion 5a and the metal paste of the second conductor portion 5b overlap each other. Forming a laminate having a metal paste;

  As in the example shown in FIG. 3, the frame portion 2 a may be composed of three or more insulating layers, and the laminate is formed by being laminated in accordance with the number of insulating layers.

  (3) A punching or laser processing step using a punching die at a portion that becomes the inner wall surface of the frame portion 2a for forming the via conductor 5 so as to be exposed.

  (4) The process of producing the ceramic green sheet laminated body by laminating | stacking the laminated body which laminated | stacked the ceramic green sheet used as the frame part 2a, and the ceramic green sheet used as the base 2b.

  The base 2b may be a laminated body in which a plurality of ceramic green sheets are laminated.

  (5) This ceramic green sheet laminate is fired at a temperature of about 1500 to 1800 ° C., and has insulation having via conductors 5, electrode pads 3, and wiring conductors 6 exposed on the inner wall surfaces of the base portions 2 b and the frame portions 2 a. A step of obtaining a multi-piece substrate in which a plurality of substrates 2 are arranged.

  (6) A method in which a dividing groove is formed along a portion serving as the outer edge of the electronic element mounting substrate 1 on the multi-piece substrate obtained by baking, and the dividing is performed by breaking along the dividing groove, or A step of cutting along the outer edge of the electronic element mounting substrate 1 by a slicing method or the like.

  The dividing grooves can be formed by cutting the multi-cavity substrate smaller than the thickness of the multi-cavity substrate after firing, but the cutter blade is pressed against the multi-cavity substrate generation shape or the slicing device generates the It may be formed by cutting smaller than the thickness.

  In the step (1) described above, the electrode pad 3 and the wiring conductor 6 are printed on the ceramic green sheet for the insulating base 2 in a predetermined shape by a metal paste screen printing method or the like, By baking simultaneously, it forms in each predetermined position of the some insulation base | substrate 2. FIG. Of the wiring conductors 6, the through wiring conductors that penetrate the ceramic green sheet in the thickness direction may be filled with through holes formed in the ceramic green sheet by printing a metal paste. Such a metal paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to a metal powder such as tungsten, molybdenum, manganese, silver or copper and kneading them. The metal paste may contain glass or ceramics in order to increase the bonding strength with the insulating substrate 2.

The via conductor 5 exposed in the frame 2a is filled with the through hole formed in the ceramic green sheet by printing a metal paste for the via conductor 5 by a screen printing method or the like. At the time of stamping or laser processing, a through hole for the frame portion 2a is formed so that the via conductor 5 is exposed, and is fired simultaneously with the ceramic green sheet. In order to increase the bonding strength with the insulating substrate 2, it may be produced by the same method as the above-described metal paste and the metal paste used for the electrode pad 3.

  Further, in the step (3) described above, in order to form the insulating substrate 2 including the frame portion 2a, the frame portion is added to some of the ceramic green sheets for the insulating substrate 2 during the punching or laser processing described above. The through hole for 2a may be formed by a die, punching by punching, laser processing or the like.

  When the insulating substrate 2 is made of, for example, a resin, it can be formed by molding by a transfer molding method or an injection molding method using a mold that can be molded into a predetermined shape. Moreover, what impregnated resin to the base material which consists of glass fiber like glass epoxy resin, for example may be used. In this case, it can be formed by impregnating a substrate made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

  The electrode pad 3 and the wiring conductor 6 are made of copper (Cu), gold (Au), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo) when the insulating base 2 is made of resin. ) Or titanium (Ti) and their alloys. For example, the copper foil processed into the shape of the wiring conductor is transferred onto a resin sheet made of glass epoxy resin, and the resin sheet on which the copper foil is transferred is laminated and bonded with an adhesive. Further, it is formed by integrating a metal foil or a metal column with an insulating base made of resin, or by depositing the insulating base 2 using a sputtering method, a vapor deposition method or a plating method.

  In addition, the through conductor which is a part of the via conductor 5 and the wiring conductor 6 is a metal material such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium, and alloys thereof when the insulating base 2 is made of resin. Consists of. For example, the copper foil processed into the shape of the wiring conductor 6 is transferred onto a resin sheet made of glass epoxy resin, and the resin sheet on which the copper foil is transferred is laminated and bonded with an adhesive. The via conductor 5 penetrating the resin sheet in the thickness direction may be formed on the inner surface of the through hole formed in the resin sheet by printing or plating a metal paste, or may be formed by filling the through hole. Further, it is formed by integrating a metal foil or a metal column with an insulating base made of resin, or by depositing the insulating base 2 using a sputtering method, a vapor deposition method or a plating method.

  Further, in order to protect the electrode pad 3, the via conductor 5, and the wiring conductor 6 and prevent oxidation, the Ni pad having a thickness of 0.5 to 10 μm is formed on the exposed surface of the electrode pad 3, the via conductor 5 and the wiring conductor 6. A plating layer may be deposited, or this Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 to 3 μm may be sequentially deposited.

  An electronic device in which the electronic element 11 is mounted on the inner side or the lower surface of the frame portion 2a on the electronic element mounting substrate 1 thus formed is externally connected via a conductive bonding material 22 such as solder. By mounting on the circuit 21, the electronic element 11 is electrically connected to the external circuit 21 via the electrode pad 3, the via conductor 5, and the wiring conductor 6. The electronic element 11 is, for example, a CCD image sensor or a CMOS image sensor, a semiconductor element, a light emitting element such as an LED, or the like. Each electrode of the electronic element 11 is electrically connected to the electrode pad 3 of the electronic element mounting package 1 by a bonding wire 11a, a gold bump, a connection terminal 11b such as solder, or the like.

The electronic element mounting substrate 1 of the present embodiment has a plurality of via conductors 5 provided on the insulating base 2, and the via conductors 5 are connected to the first conductor portion 5a and the first conductor portion 5a. The second conductor portion 5b has a narrower width than the first conductor portion 5a. The via conductor 5 is arranged so that the first conductor portion 5a and the second conductor portion 5b are arranged at the same height in the adjacent via conductors 5, and the via conductors 5 The portions B are arranged at the same height position, and the distance between the portions B of the second conductor portion 5b is between the first conductor portion 5a and the second conductor portion 5b of the adjacent via conductors 5b. It is characterized by being larger than the interval. As a result, the electronic element mounting substrate 1 is reduced in size, for example, even if the interval between the adjacent via conductors 5 is narrowed, the heat generated between the adjacent via conductors during mounting and the operation of the electronic element 11 may cause a gap between adjacent via conductors. It is possible to suppress the occurrence of cracks.

  According to another aspect of the present invention, the electronic device includes the electronic element mounting substrate 1 having the above-described configuration, so that the electronic device can be downsized while maintaining reliability.

DESCRIPTION OF SYMBOLS 1 ... Electronic device mounting substrate 2 ... Insulation base 2a ... Frame part 2b ... Base part 3 ... Electrode pad 4 ... Insulating layer 5 ... Via conductor 5a ... 1st conductor part 5b ... 2nd conductor part 6 ... Wiring conductor 6a ... Land 11 ... Electronic element 11a ... Bonding wire 11b ... Connection terminal 12 ... Electron Component 21 ... External circuit 22 ... Bonding material

Claims (4)

An insulating substrate;
A plurality of via conductors provided on the insulating substrate;
Each of the plurality of via conductors includes a first conductor portion and a second conductor portion connected to the first conductor portion and having a narrower width than the first conductor portion. And
The plurality of via conductors are arranged such that in the adjacent via conductors, the first conductor portion and the second conductor portion are arranged at the same height position,
A part of the second conductor portions of the adjacent via conductors are arranged at the same height position, and a distance between a part of the second conductor portions is the first of the adjacent via conductors. An electronic element mounting substrate, wherein the distance between the conductor portion and the second conductor portion is larger.   2. The electronic device mounting board according to claim 1, wherein the plurality of via conductors are arranged at different height positions in adjacent via conductors, wherein the first conductor portions are different from each other.   The plurality of via conductors are arranged so that a center of the first conductor portion and a center of the second conductor portion are different from each other in a plan view. Electronic device mounting board. The electronic element mounting substrate according to claim 1;
An electronic device comprising: an electronic device mounted on the electronic device mounting board and electrically connected to the plurality of via conductors.

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