JP2014165315A - Electronic element mounting substrate and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic element mounting substrate and an electronic device which can be made compact.SOLUTION: An electronic element mounting substrate 1 comprises: an insulation substrate 11 including a frame part; a plurality of connection terminals 12 provided on a top face of a frame part 11a; and a plurality of via conductors 13 provided in a vertical direction in the inside of the frame part 11a, electrically connected to the plurality of connecting terminals 12 and exposed from the insulation substrate 11 on a wall surface of the frame part 11a. In a plan view, width dimensions of adjacent via conductors 13 in a direction parallel to the wall surface among the plurality of via conductors 13 are different, and a via conductor 13 with a smaller width dimension between the adjacent via conductors 13 has a depth length larger than that of the via conductor 13 with a larger width dimension between the adjacent via conductors.

Description

The present invention relates to an imaging device such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, and an LED (Light Emitting Diode).
The present invention relates to an electronic device mounting substrate and an electronic device on which a light emitting device such as) is mounted.

  2. Description of the Related Art Conventionally, an electronic device in which an image sensor such as a CCD type or a CMOS type and a light emitting element such as an LED are mounted on an electronic element mounting substrate is known. As such an electronic device, one having an electronic element mounting substrate having a frame portion and an electronic element mounted on the inner side of the frame portion or on the upper surface of the frame portion is known (for example, , See Patent Document 1). The electronic element mounting substrate has a via conductor inside the frame portion. With the recent miniaturization of electronic devices, the width of the frame portion of the insulating base is becoming narrower, and a configuration in which the via conductor is exposed from the insulating base on the wall surface of the frame has been proposed.

JP 2006-201427

  However, if the via conductor is exposed from the insulating substrate on the wall surface of the frame portion, the via conductor may be peeled off from the insulating substrate, and the bonding strength between the via conductor and the insulating substrate is secured while the electronic device mounting board is secured. It was difficult to achieve further miniaturization.

  An electronic element mounting substrate according to an aspect of the present invention includes an insulating base including a frame portion, a plurality of connection terminals provided on an upper surface of the frame portion, and a vertical direction in the frame portion. A plurality of via conductors are electrically connected to the plurality of connection terminals and exposed from the insulating base on the wall surface of the frame portion. In plan view, the width dimension in the direction parallel to the wall surface of adjacent via conductors among the plurality of via conductors is different, and the via conductor having the smaller width dimension among adjacent via conductors Of these, the depth length is larger than the via conductor having the larger width dimension.

  An electronic device according to another aspect of the present invention includes the electronic element mounting substrate having the above-described configuration and an electronic element mounted on the electronic element mounting substrate.

  The substrate for mounting an electronic device according to one aspect of the present invention has different width dimensions in the direction parallel to the wall surfaces of adjacent via conductors among the plurality of via conductors in plan view, and the width of the adjacent via conductors. The via conductor having a smaller dimension has a greater depth than the via conductor having a larger width dimension among neighboring via conductors. Thus, for example, when heat is generated when the electronic element is mounted or when the electronic element is operated, the possibility that the via conductor is peeled off from the insulating base can be reduced, and the electronic element mounting substrate can be further downsized.

  According to another aspect of the present invention, an electronic device includes an electronic device mounting board having the above-described configuration, and an electronic device mounted on the electronic device mounting board and electrically connected to a plurality of connection terminals. By having it, the size can be reduced.

1 is a plan perspective view showing an electronic device according to a first embodiment of the present invention. (A) is a longitudinal cross-sectional view in the AA line of the electronic device shown by FIG. 1, (b) is a longitudinal cross-sectional view in the BB line of the electronic device shown in FIG. (A) is the enlarged view of the C section shown by FIG. 1, (b) is the top view which looked at the C section shown by (a) from the D direction. (A) is an enlarged view of the E section shown in FIG. 3, and (b) is an enlarged view of the F section shown in FIG. It is a plane perspective view which shows the modification of the electronic device in the 1st Embodiment of this invention shown by Fig.3 (a). It is a plane perspective view which shows the modification of the electronic device in the 1st Embodiment of this invention shown by Fig.3 (a). It is a plane perspective view which shows the modification of the electronic device in the 1st Embodiment of this invention shown by Fig.3 (a). (A) is a plane perspective view which shows the electronic device in the 2nd Embodiment of this invention shown by FIG. 1, (b) is a longitudinal cross-sectional view in the AA of (a).

  Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
The electronic device according to the first embodiment of the present invention includes an electronic element mounting substrate 1 and an electronic element 2 mounted on the electronic element mounting substrate 1 as in the example shown in FIGS. Have.

  The electronic element mounting substrate 1 is provided in the vertical direction in the frame 11a, the insulating base 11 including the frame 11a and the base 11b, the plurality of connection terminals 12 provided on the upper surface of the frame 11a. A plurality of via conductors 13 electrically connected to the plurality of connection terminals 12, and a wiring conductor 14 provided in and on the surface of the base portion 11b and electrically connected to the plurality of via conductors 13. ing. 1 and 2, the electronic device is provided in a virtual xyz space, and for the sake of convenience, the “upward direction” means the positive direction of the virtual z axis.

  As in the example shown in FIGS. 1 and 2, the insulating base 11 has a base 11 b having a top surface including the mounting region of the electronic element 2 and having a rectangular plate shape in plan view. And a frame portion 11a which is provided on the base portion 11b and has a frame shape so as to surround the mounting region of the electronic element 2. The insulating base 11 functions as a support for supporting the electronic element 2, and the electronic element 2 is bonded and fixed on the mounting region at the center of the upper surface of the base 11b.

  The insulating substrate 11 is an electrical insulator such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic sintered body. A plurality of substantially rectangular insulating layers made of plastics such as epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin, or fluororesin such as tetrafluoroethylene resin. Is formed.

The plurality of connection terminals 12 are provided on the upper surface of the frame portion 11a of the insulating base 11, and are electrically connected to the respective electrodes of the electronic element 2 by connection members 3 such as bonding wires. When the insulating base 11 is made of an electrically insulating ceramic, the connection terminal 12 is made of metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu).

  When the insulating base 11 is made of resin, the connection terminal 12 is made of copper (Cu), gold (Au), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo) or titanium ( Ti) and metallic materials such as alloys thereof.

  1 and 2, the connection terminal 12 is provided so as to cover the upper surface of the via conductor 13 from the upper surface of the frame portion 11a to the upper surface of the via conductor 13, and is electrically connected to the via conductor 13. It is connected.

  As shown in the example shown in FIGS. 1 and 2, the via conductor 13 has a shape obtained by dividing a part of a circle, such as a semicircular shape in plan view, and is separated from the insulating substrate 11 on the wall surface of the frame portion 11a. Exposed. The via conductor 13 is made of the same material as the connection terminal 12 used when the insulating base 11 is made of an electrically insulating ceramic when the insulating base 11 is made of an electrically insulating ceramic. Further, when the insulating base 11 is made of resin, the via conductor 13 is made of the same material as the connection terminal 12 used when the insulating base 11 is made of resin.

  The via conductors 13 have different width dimensions in the direction parallel to the wall surfaces of the adjacent via conductors 13 among the plurality of via conductors 13 in the plan view as in the example shown in FIGS. 1 and 2. Here, the width dimension is the largest portion of the width parallel to the wall surface of the via conductor 13. The first via conductor 13a having the smaller width dimension among the adjacent via conductors 13 has a greater depth than the second via conductor 13b having the larger width dimension among the adjacent via conductors 13. With such a configuration, the bonding area between the first via conductor 13a having a small width dimension and the insulating substrate 11 can be increased, so that the bonding strength between the first via conductor 13a having a small width dimension and the insulating substrate 11 can be increased. As a result, the possibility that the via conductor 13 is peeled off from the insulating base 11 can be reduced, and the electronic element mounting substrate 1 can be downsized.

  In the present embodiment, as in the example shown in FIG. 3, in the plan view, the width dimension R1 of the first via conductor 13a is smaller than the width dimension R2 of the second via conductor 13b. The depth length W1 of the conductor 13a is larger than the depth length W2 of the second via conductor 13b, and the first via conductors 13a and the second via conductors 13b are provided alternately. With such a configuration, it is possible to reduce the thermal stress caused by the difference in thermal expansion between the insulating base 11 and the plurality of via conductors 13 from being concentrated on a part of the plurality of via conductors. Can be prevented from peeling off from the insulating substrate 11.

  In the present embodiment, as in the example shown in FIGS. 3 and 4A, the frame portion 11a holds the end portion of the first via conductor 13a on the side close to the wall surface in plan view. 1 holding portion 11c. Since the first via conductor 13a is held by the first holding portion 11c so as to be caught by the insulating base 11, the first via conductor 13a can be more effectively reduced from being peeled off from the insulating base 11. The first holding portion 11c is more preferably 10% (5% on one side) or more of the width R1 of the first via conductor 13a because the first via conductor 13a can be more reliably held.

  In this embodiment, as in the example shown in FIGS. 3 and 4B, the frame portion 11a holds the end portion of the second via conductor 13b on the side close to the wall surface in plan view. 2 holding portions 11d. Since the second via conductor 13b is held by the second holding portion 11d so as to be caught by the insulating base 11, the second via conductor 13b can be more effectively reduced from being peeled off from the insulating base 11. The second holding portion 11d is more preferably 10% (5% on one side) or more of the width R2 of the second via conductor 13b because the second via conductor 13b can be more reliably held.

  The wiring conductor 14 is provided between the upper surface of the base portion 11b and the lower surface of the frame portion 11a, and is electrically connected to the via conductor 13 and penetrates the base portion 11b in the thickness direction. It includes a through conductor 14b electrically connected to 14a and an external terminal 14c provided on the lower surface of the base 11b and electrically connected to the through conductor 14b. As a result, the connection terminal 12 is electrically connected to the external circuit board (not shown) via the via conductor 13 and the wiring conductor 14. When the insulating base 11 is made of electrically insulating ceramic, the wiring conductor 14 is made of the same material as the connection terminal 12 used when the insulating base 11 is made of electrically insulating ceramic. Further, when the insulating base 11 is made of resin, the wiring conductor 14 is made of the same material as the connection terminal 12 used when the insulating base 11 is made of resin.

  Further, the wiring conductor 14 is provided so as to be led out to the lower surface of the insulating base 11 in the above-described configuration, but may be provided so as to be led to the side surface or the upper face of the insulating base 11, for example.

  Next, a method for manufacturing the electronic element mounting substrate 1 of the present embodiment will be described.

The insulating base 11 is made of an electrically insulating ceramic such as an aluminum oxide (Al ₂ O ₃ ) -based sintered body, and has a frame portion 11a and a base portion 11b, for example. When the insulating base 11 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al ₂ O ₃ ), silica (SiO ₂ ), magnesia (MgO) as a sintering aid is added to the Al ₂ O ₃ powder. Alternatively, powder such as calcia (CaO) is added, and an appropriate binder, solvent, and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for multi-piece production is obtained by a conventionally known forming method such as a doctor blade method or a calender roll method.

  Using such a ceramic green sheet, the electronic element mounting substrate 1 is manufactured by the following steps (1) to (6).

  (1) After forming a through hole for the via conductor 13 or the through conductor 14b in the ceramic green sheet, the via conductor 13 which is a via hole conductor formed in a portion to be the wall surface of the frame portion 11a, and the insulating base from the via conductor 13 11. A metal paste printing and coating process for forming the internal wiring 14a and the wiring conductor 14 including the through conductor 14b such as a via-hole conductor, respectively, on the inside and the bottom surface of the wiring 11;

  (2) A punching process or a laser processing process in which a through hole is formed in the ceramic green sheet in order to form the metal paste that becomes the via conductor 13 so as to be exposed from the ceramic green sheet that becomes the frame portion 11a.

  (3) A printing application process in which the metal paste that becomes the connection terminal 12 is printed and formed so as to cover the portion that becomes the upper surface of the metal paste that becomes the via conductor 13 from the upper surface of the ceramic green sheet that becomes the frame portion 11a.

  (4) The process of producing the ceramic green sheet laminated body by laminating | stacking the ceramic green sheet used as each insulating layer.

  (5) A wiring substrate to be an electronic device mounting substrate 1 having a ceramic green sheet laminate fired at a temperature of about 1500 to 1800 ° C. and having a wall surface of the frame portion 11a, connection terminals 12, via conductors 13 and wiring conductors 14. A step of obtaining a multi-piece wiring board in which a plurality of regions are arranged.

  (6) A method in which a dividing groove is formed along a portion serving as the outer edge of the electronic element mounting substrate 1 on the multi-piece wiring board obtained by firing, and a method of breaking and dividing along the dividing groove, or A step of cutting along the outer edge of the electronic element mounting substrate 1 by a slicing method or the like.

  Note that the order of the process (2) and the process (3) may be the first.

  Further, when the conductor that penetrates the ceramic green sheet in the thickness direction is a via hole conductor, the via conductor 13 has a through hole formed in the ceramic green sheet by printing a metal paste for the via conductor 13 by a screen printing method or the like. Filling and forming the through hole for the frame portion 11a so that the via-hole conductor is exposed at the time of punching or laser processing described above, and firing it simultaneously with the ceramic green sheet. The metal paste for the via conductor 13 is produced by the same material and method as the metal paste used for the connection terminal 12. The via conductor 13 may be a through-hole conductor or a metal layer formed by printing a metal paste on a ceramic green sheet.

  In the step (2) described above, in order to form the insulating substrate 11 including the frame portion 11a, a through hole for the frame portion 11a is formed in some of the ceramic green sheets for the insulating substrate 11 by a die and punching. It may be formed by punching or laser processing.

  In the step (3) described above, the connection terminal 12 is formed by printing a metal paste on a ceramic green sheet for the insulating substrate 11 in a predetermined shape by a screen printing method using a mask, etc. By firing at the same time as the sheet, each of the plurality of insulating bases 11 is formed at a predetermined position. Such a metal paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to a metal powder such as tungsten, molybdenum, manganese, silver or copper and kneading them. The metal paste may contain glass or ceramics in order to increase the bonding strength with the insulating substrate 11.

  In the step (6) described above, the dividing groove can be formed by cutting the multi-cavity wiring board smaller than the thickness of the multi-cavity wiring board with a slicing device after firing. You may form by pressing or notching smaller than the thickness of a laminated body with a slicing apparatus.

  In addition, the wiring conductor 14 is printed with a metal paste for the wiring conductor 14 produced by the same material and method as the connection terminal 12 in a predetermined shape by a screen printing method or the like, and then fired simultaneously with the ceramic green sheet, It is formed at a predetermined position on the insulating substrate 11. Of the wiring conductors 14, the through conductors 14b penetrating the ceramic green sheet in the thickness direction may be filled with through holes formed in the ceramic green sheet by printing a metal paste. Such a metal paste is produced by the same material and method as the metal paste used for the via conductor 13.

  When the insulating base 11 is made of, for example, a resin, it can be formed by molding by a transfer molding method or an injection molding method using a mold that can be molded into a predetermined shape. Moreover, what impregnated resin to the base material which consists of glass fiber like glass epoxy resin, for example may be used. In such a case, it can be formed by impregnating a substrate made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

Further, the connection terminal 12, the via conductor 13, and the wiring conductor 14 are made of a metal material such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium, or an alloy thereof when the insulating base 11 is made of resin. For example, the copper foil processed into the shape of the wiring conductor is transferred onto a resin sheet made of glass epoxy resin, and the resin sheet on which the copper foil is transferred is laminated and bonded with an adhesive. Further, it is formed by integrating a metal foil or a metal column with an insulating base made of resin, or by depositing the insulating base 11 using a sputtering method, a vapor deposition method, a plating method or the like. The via conductor 13 and the through conductor 14b may be formed on the inner surface of the through hole formed in the resin sheet by printing or plating a metal paste, or may be formed by filling the through hole.

  In order to protect the connection terminal 12, the via conductor 13, and the wiring conductor 14 and prevent oxidation, the exposed surface of the connection terminal 12, the via conductor 13, and the wiring conductor 14 has a Ni plating layer having a thickness of 0.5 to 10 μm and a thickness. A plating layer made of a gold (Au) plating layer having a thickness of 0.5 to 3 μm may be sequentially deposited.

  An electronic device having the electronic device mounting board 1 formed in this way and the electronic device 2 mounted on the base portion 11b located inside the frame portion 11a of the electronic device mounting board 1 is used as an external circuit board. By mounting, the electronic element 2 is electrically connected to the external circuit board via the connection terminal 12, the via conductor 13, and the wiring conductor 14. The electronic element 2 is, for example, a CCD type imaging element or a CMOS type imaging element, a semiconductor element, a light emitting element such as an LED, or the like. Each electrode of the electronic element 2 is electrically connected to the connection terminal 12 of the electronic element mounting substrate 1 by a connection member 3 such as a bonding wire.

  Next, a modified example of the electronic element mounting substrate 1 of the present embodiment will be described.

  In the modification of the present embodiment shown in FIG. 5, the first via conductor 13a has a depth length larger than that of the second via conductor 13b more than the difference in width dimension with the second via conductor 13b. large. That is, the depth length W1 of the first via conductor 13a and the depth length W2 of the second via conductor 13b are larger than the difference between the width R1 of the first via conductor 13a and the width R2 of the second via conductor 13b. The difference H1 is large. By adopting such a configuration, it is possible to more effectively reduce the peeling of the first via conductor 13a, which is more easily peeled off from the insulating base 11 than the second via conductor 13b, from the insulating base 11.

  In the example shown in FIG. 5, the first via conductor 13a has a width dimension R3 smaller than the width dimension R1, and the depth length larger than the depth length W1 of the first via conductor 13a. A third via conductor 13c having a length W3 is further provided. In the example shown in FIG. 5, each of the plurality of via conductors 13 has a depth length corresponding to the width dimension, and the plurality of via conductors 13 have a larger depth length as the width dimension is smaller. . By adopting such a configuration, even if the via conductor 13 has a small width dimension, peeling from the insulating base 11 can be more effectively reduced.

  In the modification of the present embodiment shown in FIG. 6, the width dimension of the plurality of via conductors 13 decreases toward the center of each side of the frame portion 11 a of the insulating base 11. The depth length of the insulating base 11 becomes longer toward the center of each side of the frame portion 11a of the insulating base 11. In the example shown in FIG. 6, five via conductors 13 are provided in a direction parallel to the wall surface of the frame portion 11a. With such a structure, it is possible to further reduce the peeling of the via conductor 13 from the insulating base 11 by increasing the bonding area between the via conductor 13 having a small width dimension and the insulating base 11. For example, when the thermal expansion coefficient of the insulating base 11 is larger than the thermal expansion coefficient of the via conductor 13, the thermal expansion of the via conductor 13 is caused by the heat during operation of the electronic element 2 and the thermal history during mounting of the electronic element 2. When the insulating base 11 expanded larger than the amount contracts, the deformation of the insulating base 11 can be reduced by disposing the via conductors 13 having a large width dimension on the outer peripheral side of each side of the frame portion 11a. As described above, by reducing the deformation of the insulating base 11, it is possible to reduce a decrease in the force with which the insulating base 11 holds the plurality of via conductors 13, so that the peeling of the via conductor 13 can be more effectively reduced.

In the modification of the present embodiment shown in FIG. 7, the interval between the plurality of via conductors 13 is a size corresponding to the depth length of the plurality of via conductors 13. That is, in the example shown in FIG. 7, when comparing the first via conductor 13a and the third via conductor 13c, the depth length W3 of the third via conductor 13c is the depth length of the first via conductor 13a. Therefore, the length G2 between the first via conductor 13a and the third via conductor 13c is larger than the length G1 between the first via conductor 13a and the second via conductor 13b. Is also big. Therefore, the width of the insulating base 11 around the via conductor 13 having a small width dimension and a large depth length can be increased. In the example shown in FIG. 7, five via conductors 13 are provided in a direction parallel to the wall surface of the frame portion 11a. With such a structure, for example, when the thermal expansion coefficient of the insulating base 11 is smaller than the thermal expansion coefficient of the via conductor 13, the heat during operation of the electronic element 2 or the thermal history during mounting of the electronic element 2 When the temperature of the thermally expanded via conductor 13 decreases and contracts, the insulating base 11 can hold the via conductor 13, and the via conductor 13 can be prevented from peeling off from the insulating base 11. This is because the deformation amount of the insulating base 11 due to the thermal stress applied from the via conductor 13 to the insulating base 11 when the insulating base 11 and the via conductor 13 are thermally expanded is reduced. This is because the possibility that a large gap is generated between the insulating base 11 and the via conductor 13 when the heat shrinks can be reduced.

  In general, since bonding strength is reduced when bonding wires are bonded to a region overlapping with via conductors 13, bonding wires are bonded to regions that do not overlap via conductors 13 (wire bonding effective region). As in the example shown in FIG. 7, when the interval between the plurality of via conductors 13 is set to a size corresponding to the depth length of the plurality of via conductors 13, the via conductor 13 has a large depth length. An effective area of wire bonding can be secured between the plurality of via conductors 13.

  The electronic element mounting substrate 1 of the present embodiment is provided in the vertical direction in the frame portion 11a, the insulating base 11 including the frame portion 11a, the plurality of connection terminals 12 provided on the upper surface of the frame portion 11a. And a plurality of via conductors 13 that are electrically connected to the plurality of connection terminals 12 and exposed from the insulating base 11 on the wall surface of the frame portion 11a. Of the conductors 13, the width dimension in the direction parallel to the wall surface of the adjacent via conductors 13 is different, and the via conductor 13 having the smaller width dimension among the adjacent via conductors 13 is the width of the adjacent via conductors 13. The depth length is larger than that of the via conductor 13 having a larger dimension. Accordingly, for example, when heat is generated when the electronic element 2 is mounted or when the electronic element 2 is operated, the bonding area between the via conductor 13b having a small width and the insulating base 11 can be increased. Peeling from the insulating substrate 11 can be reduced.

  The electronic device according to the present embodiment includes an electronic element mounting substrate 1 having the above-described configuration, and an electronic element 2 mounted on the electronic element mounting substrate 1 and electrically connected to a plurality of connection terminals 12. Therefore, it is possible to reduce the size.

(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIG.

The electronic device according to this embodiment differs from the electronic device according to the above-described embodiment in that a through hole having the same size as that of the frame portion 11a is provided in the base portion 11b of the insulating base 11 as in the example shown in FIG. Thus, the insulating base 11 has a through hole connected to the frame portion 11a and the base portion 11b. The electronic element 2 is flip-chip mounted on the upper surface of the through hole, and each electrode of the electronic element 2 is electrically connected to the connection terminal 12 by a connection member 3 such as a gold bump or solder. In the example shown in FIG. 8, when the electronic element 2 is, for example, a CCD image sensor or a CMOS image sensor, light from below the electronic device can be received by the electronic element 2. For example, other electronic components such as a chip capacitor, a resistance element, a semiconductor element, and a light emitting element such as an LED may be mounted on the upper surface or the lower surface of the frame portion 11a. In addition, when a bonding material made of a resin such as an epoxy resin is used as a so-called underfill at a part where the electronic element 2 or the electronic component is flip-chip mounted, the electrical connection can be made more reliable. Note that each electrode of the electronic element 2 or electronic component and the plurality of connection terminals 12 may be electrically connected by a connection member 3 made of a conductive resin (anisotropic conductive resin or the like).

  In addition, this invention is not limited to the example of said embodiment, A various change is possible. For example, in plan view, the via conductor 13 is provided on a region having a linear shape that is in contact with the inner wall surface of the frame portion 11a and substantially perpendicular to the inner wall surface of the frame portion 11a, and on the outer peripheral side of the frame portion 11a. And a region having an arcuate shape. Even if the position of the through hole of the frame portion 11a is shifted, the amount of change in the width at which the via conductor 13 is exposed from the insulating substrate 11 can be reduced.

  In addition, the through hole of the frame portion 11a may have another shape such as a circular shape or a polygonal shape.

1 .... Electronic element mounting board
11 ... Insulating substrate
11a ... Frame
11b ... Base
11c ... 1st holding | maintenance part
11d: Second holding part
12 ... Connection terminal
13 ... Via conductor
13a: First via conductor
13b ... second via conductor
14 ... Wiring conductor
14a ... Internal wiring
14b ... Penetration conductor
14c ... External terminal 2 ... Electronic element 3 ... Connecting member 4 ... External circuit board

Claims (9)

An insulating substrate including a frame;
A plurality of connection terminals provided on an upper surface of the frame portion;
In the frame portion is provided in the vertical direction, is electrically connected to the plurality of connection terminals, and includes a plurality of via conductors exposed from the insulating base on the wall surface of the frame portion,
In plan view, the width dimension in the direction parallel to the wall surface of the adjacent via conductors among the plurality of via conductors is different, and the via conductor having the smaller width dimension among the adjacent via conductors is adjacent to each other. An electronic element mounting board, wherein a depth length is larger than a via conductor having a larger width dimension among the matching via conductors.   2. The plan view according to claim 1, wherein the frame portion includes a first holding portion that holds an end portion of the via conductor having a smaller width dimension on the side close to the wall surface. The electronic element mounting substrate described.   3. The planar portion further includes a second holding portion that holds an end portion on the side closer to the wall surface of the via conductor having the larger width dimension in a plan view. The electronic element mounting substrate described in 1.   The via conductor with the smaller width dimension has a greater depth length than the via conductor with the larger width dimension, more than the difference in width dimension with the via conductor with the larger width dimension. The electronic element mounting substrate according to claim 1, wherein   5. The electronic element mounting substrate according to claim 4, wherein each of the plurality of via conductors has the depth length corresponding to the width dimension. 6.   2. The plurality of via conductors are provided so that via conductors having a smaller width dimension and via conductors having a larger width dimension are alternately arranged. Electronic device mounting board.   2. The width dimension of the plurality of via conductors becomes smaller toward a central portion of each side of the frame portion, and the depth length becomes longer toward a central portion of the frame portion. The electronic element mounting substrate described.   2. The electronic element mounting substrate according to claim 1, wherein a distance between the plurality of via conductors is a size corresponding to the depth length of the plurality of via conductors. An electronic element mounting substrate according to claim 1;
An electronic device comprising: an electronic device mounted on the electronic device mounting board and electrically connected to the plurality of connection terminals.

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