JP5052470B2 - Multi-cavity wiring board, wiring board and electronic device - Google Patents

Description

  In the present invention, a plurality of wiring board regions, each of which is a wiring board for mounting electronic components, are arranged vertically and horizontally in the central portion of the mother board, and a plurality of dividing grooves are formed at the boundary of the wiring board area. The present invention relates to a wiring board, a wiring board obtained by dividing the wiring board, and an electronic device in which an electronic component is mounted on the wiring board and a lid is bonded.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators are made of metal powder metallization such as tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by arranging a wiring conductor made of

  Such a wiring board is usually formed with a recess for accommodating an electronic component. And while accommodating an electronic component in such a recessed part of a wiring board, each electrode of an electronic component is electrically connected to each corresponding wiring conductor via electrical connection means, such as solder and a bonding wire, and metal The electronic device is manufactured by sealing the electronic component by bonding the lid with a lid made of ceramic, glass, resin, or the like so as to close the recess.

  The lid is bonded to the wiring board by a sealing material such as resin, for example. In order to increase the bonding strength between the wiring board and the lid, a wiring board is known in which a groove filled with a sealing material is formed on the upper surface of the wiring board around the recess. Such a groove has, for example, a frame-like portion (side wall portion) surrounding the recess on the upper surface of the wiring board, extending from the outer peripheral end to the inner peripheral end (opening width is substantially the same as the width of the side wall portion), and a cross-section. The shape is V-shaped (see, for example, Patent Document 1).

Further, the size of the wiring board has been reduced with the recent demand for downsizing of electronic devices. In order to efficiently manufacture a plurality of wiring boards, it is performed by dividing a multi-piece wiring board. The multi-cavity wiring board has a plurality of wiring board regions arranged vertically and horizontally at the center of a large-area mother board, and divided grooves for dividing each wiring board area are formed vertically and horizontally. . And a some wiring board is obtained by bending a mother board | substrate and dividing | segmenting along a division | segmentation groove | channel.
JP 2006-41456 JP

  However, the groove of the conventional wiring board has an opening width that is about the same as the width of the side wall, and the groove is formed by cutting the upper surface of the side wall in the thickness direction over the entire circumference. It was not easy to form a groove in each small wiring board region after manufacturing the substrate.

  In addition, even when a multi-piece wiring board having a recess and a groove is formed in each wiring board region, there is a problem that if the wiring board is divided along the dividing groove, burrs and chips are likely to occur. It was. For example, if the groove is formed deeper than the depth of the split groove on the same main surface as the split groove, the stress at the time of splitting tends to concentrate on the bottom of the groove. This is because the mother board is likely to be divided starting from the bottom. Further, even if a crack is generated starting from the bottom of the dividing groove, the crack is likely to progress toward the groove in the course of progressing from the bottom of the dividing groove to the opposing main surface. Furthermore, since the opening width of the groove is about the same as the width of the side wall portion, there is an acute angle between the outer edge of the divided wiring board and the groove, and this portion is likely to be chipped due to collision between the wiring boards. Met.

  Thus, if there are burrs or chips on the wiring board, it becomes impossible to firmly seal the wiring board and the lid by filling the groove with a sealing material, or based on the outer edge of the wiring board. When mounting an electronic component on a wiring board or mounting an electronic device on an external electric circuit board based on the outer edge of the electronic device mounting the electronic component on the wiring board, the mounting cannot be performed with high accuracy. There was a problem.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and its purpose is to provide a wiring board when dividing a multi-piece wiring board having a groove for joining a lid on one main surface. An object of the present invention is to provide a multi-cavity wiring board that can reduce burrs and chips generated. Another object of the present invention is to provide a wiring board obtained from a multi-piece wiring board and an electronic device using the wiring board.

In the multi-piece wiring board of the present invention, a plurality of wiring board regions each having a concave portion at the center are arranged on one main surface of a mother board in which a plurality of wiring board regions are arranged vertically and horizontally. in patterning wiring board, wherein between said recess and said dividing grooves on one main surface of the base substrate, narrower than this period width, is provided with a shallower groove than the depth of the depth and the dividing groove of the recess The groove is characterized by being continuous along the dividing groove between the adjacent wiring board regions .

  Further, the multi-piece substrate of the present invention is characterized in that, in the above configuration, the groove is provided closer to the recess than the dividing groove.

  The wiring board of the present invention is characterized in that the multi-piece wiring board having the above configuration is divided along the dividing groove.

The wiring board according to the present invention is characterized in that, in the above-described configuration, the one main surface has the recess, and the groove reaching the side surface facing both ends between the recess and the outer side. .

  The electronic device according to the present invention is characterized in that an electronic component is mounted on the bottom surface of the concave portion of the wiring board having the above-described configuration, and a lid is joined so as to cover the concave portion.

  According to the multi-cavity wiring board of the present invention, a groove that is narrower than the width between the recesses on one main surface of the mother board and the division grooves and shallower than the depths of the depressions and the division grooves is provided. Therefore, the stress when the mother board is bent and divided is more likely to be concentrated at the bottom of the dividing groove than at the bottom of the groove, so that the mother board can be prevented from being divided starting from the bottom of the groove. it can. Also, since the bottom of the split groove is deeper than the bottom of the groove, the bottom of the groove is not located between the bottom of the split groove and the other main surface, so cracks that originated from the bottom of the split groove In the middle of traveling toward the other main surface side, the traveling toward the groove side is suppressed. Therefore, since the mother substrate can be favorably divided along the dividing grooves, the possibility of occurrence of burrs and chips on the wiring substrate obtained by the division can be reduced.

  Further, according to the multi-cavity wiring board of the present invention, in the above configuration, when the groove is provided closer to the recessed portion than the divided groove, the position of the fulcrum is displaced with respect to the divided groove in the step of dividing the mother board. Even if it is, the groove is provided at a position closer to the recess apart from the dividing groove, so that the division starting from the bottom of the groove is suppressed, and the possibility of occurrence of burrs and chips on the wiring board is reduced. can do.

  Further, according to the multi-cavity wiring board of the present invention, in each of the above configurations, when the groove is continuous along the dividing groove between the adjacent wiring board regions, the groove extends in a straight line extending over the plurality of wiring substrate regions. Therefore, the groove can be easily formed by using a cutter blade or the like, and the area of the groove in the corner of the upper surface of the side wall portion of the divided wiring board can be increased.

  According to the wiring board of the present invention, since the multi-cavity wiring board having the above configuration is divided along the dividing groove, the occurrence of burrs and chips on the outer edge of the wiring board is reduced. In addition, since the opening width of the groove is narrower than the width of the side wall, there is a thickness between the outer edge of the divided wiring board and the groove, and this part is difficult to be chipped due to collision between the wiring boards. Thus, the outer edge of the wiring board can be well recognized by an image recognition device or the like, and the electronic component can be mounted on the wiring board with the outer edge of the wiring board as a reference with good positional accuracy.

  Further, according to the wiring board of the present invention, the multi-piece wiring board having the above configuration is divided along the dividing groove, and on one main surface, between the recess and the recess and the outer side, Since both ends of the grooves reach the side surfaces facing each other, the area of the grooves at the corners of the wiring board is increased in a top view, and the amount of sealing material at the corners can be increased. The bonding strength between the lid and the lid can be improved.

  In the electronic device according to the present invention, an electronic component is mounted on the bottom surface of the concave portion of the wiring board having the above-described configuration, and a lid is joined so as to cover the concave portion. Is reduced, so that the sealing material can be satisfactorily filled in the groove to firmly bond the wiring board and the lid, and the outer edge of the electronic device can be recognized well by an image recognition device or the like, The electronic device can be mounted on the external electric circuit board with reference to the outer edge of the electronic device with good positional accuracy.

A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings.
FIG. 1A is a plan view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIG. 1B is a cross-sectional view showing a cross section taken along line AA of FIG. It is. FIG. 2A is an enlarged plan view showing a portion A of FIG. 1A, and FIG. 2B is a sectional view showing an enlarged portion A of FIG. is there. 3A is a plan view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIG. 3B is a cross-sectional view showing a cross section taken along the line AA of FIG. It is. 4A is an enlarged plan view showing an A part of FIG. 3A, and FIG. 4B is an enlarged sectional view showing an A part of FIG. 3B. is there. FIG. 5 is an enlarged cross-sectional view showing a main part of another example of the multi-cavity wiring board according to the present invention, similar to FIGS. 2B and 4B. 1 to 5, 1 is a mother board, 1a is a wiring board region, 2 (2x, 2y) is a dividing groove, 2a (2ya) is a second dividing groove, 3 is a recess, and 4 (4x, 4y) is It is a groove. Although not shown in these drawings, wiring conductors are formed on the surface and inside of each wiring board region 1a. 2A and 4A are plan views, the hatching is provided in the dividing grooves 2 (2x, 2y) and the grooves 4 (4x, 4y) so as to be easily recognized.

  In the example shown in FIGS. 1 (a) and 3 (a), a total of 16 wiring board regions 1a are arranged on the mother board 1 in four vertical and horizontal directions, and in the vertical direction at the boundary of each wiring board region 1a. A dividing groove 2 composed of the dividing grooves 2y and the lateral dividing grooves 2x is formed. In addition, a dummy region is provided in the outer periphery of the central portion in which the 16 wiring board regions 1a are arranged vertically and horizontally, and a dividing groove 2 is also formed at the boundary between the dummy region and the wiring substrate region 1a.

  As shown in the examples shown in FIGS. 1 to 4, the multi-cavity wiring board of the present invention is provided on one main surface of a mother board 1 in which a plurality of wiring board regions 1 a having a recess 3 at the center are arranged vertically and horizontally. In the multi-piece wiring board in which the dividing groove 2 is formed at the boundary of the wiring board region 1a, the width between the concave portion 3 on one main surface of the mother board 1 and the dividing groove 2 is narrower than the width between them. The groove 4 is shallower than the depth d1 and the depth d2 of the dividing groove 2.

  Since the depth d3 of the groove 4 is shallower than the depth d1 of the recess 3 and the depth d2 of the divided groove 2, the stress when dividing the mother substrate 1 by bending is larger than that at the bottom of the groove 4. Therefore, the mother board can be easily divided from the bottom of the dividing groove 2 as a starting point. Further, since the bottom of the split groove 2 is deeper than the bottom of the groove 4, the bottom of the groove 4 is not positioned between the bottom of the split groove 2 and the other main surface. It is suppressed that the crack generated as the starting point proceeds toward the groove 4 while traveling toward the other main surface. Therefore, since the mother substrate 1 can be divided well along the dividing grooves 2, it is possible to reduce the possibility of occurrence of burrs and chips on the wiring substrate obtained by dividing.

  Further, in the multi-piece wiring board of the present invention, in the above configuration, the groove 4 is preferably provided closer to the recess 3 than the dividing groove 2. That is, it is preferable that the distance (W1 shown in FIG. 5) between the dividing groove 2 and the groove 4 is larger than the distance (W2 shown in FIG. 5) between the recess 3 and the groove 4 (W1> W2). In the step of bending and dividing the mother board 1, the position of the fulcrum for bending the mother board 1 may be shifted from the dividing groove 2 by several tens to several hundreds of μm. Even if the position shift of the fulcrum with respect to the dividing groove 2 occurs, the groove 4 is provided at a position near the concave portion 3 that is separated from the dividing groove 2, so that the division starting from the bottom of the groove 4 is performed. It is possible to reduce the possibility that burrs and chips will occur in the wiring board.

  Further, the multi-cavity wiring board of the present invention has a configuration in which the groove 4 continues along the dividing groove 2 between the adjacent wiring board regions 1a and 1a in the above-described configuration, as in the example shown in FIGS. It is preferable. With such a configuration, the groove 4 becomes a straight line extending over the plurality of wiring board regions 1a, so that the groove 4 can be easily formed using a cutter blade, dicing processing, or the like, and the side wall of the divided wiring board The area of the groove | channel 4 in the corner | angular part of a part upper surface can be increased.

  The base substrate 1 is an electrical insulator made of a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. A plurality of wiring board regions 1a, in which wiring conductors made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc. are formed in the central part of the conductive insulating substrate, are arranged vertically and horizontally.

  If the insulating substrate is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, dispersant, etc. are added to ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. The ceramic slurry obtained by mixing is formed into a sheet by adopting a conventionally known sheet forming method such as a doctor blade method to obtain a ceramic green sheet. After that, the ceramic green sheet is appropriately punched and necessary. In accordance with the above, a plurality of these are stacked to produce a formed body to be the mother substrate 1 and fired at a temperature of about 1500 to 1800 ° C. to produce one or a plurality of insulating layers.

  The wiring conductor includes a wiring conductor layer disposed between the surface of the insulating base and the insulating layer, and a through conductor that electrically connects the wiring conductor layers that pass through the insulating layer and are positioned above and below. The wiring conductor layer is formed by printing and applying a metallized paste for the wiring conductor layer on a ceramic green sheet for the mother board 1 by printing means such as a screen printing method, and baking it together with the generated shape for the mother board 1. Prior to the printing and application of the metallized paste for forming the wiring conductor, the through conductor has a through hole for the through conductor formed on the ceramic green sheet for the mother substrate 1 by a punching method using a die or punching or a processing method such as laser processing. It is formed by filling the through hole with a metallized paste for a through conductor by a printing means such as a screen printing method, and firing it together with the formed body to be the mother substrate 1. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as required to the metal powder of the main component and mixing and kneading by a kneading means such as a ball mill, a three roll mill, a planetary mixer or the like. Further, glass or ceramic powder may be added in order to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate after firing. The metallized paste for through conductors is adjusted to have a higher viscosity than the metallized paste for wiring conductor layers, which is suitable for filling, depending on the type and amount of organic binder or organic solvent.

  In addition, the metal which is excellent in corrosion resistance, such as nickel and gold | metal | money, is adhered to the exposed surface of a wiring conductor as needed. As a result, corrosion of the wiring conductor can be effectively suppressed, the wiring conductor and the electronic component are fixed, the wiring conductor and the bonding wire are joined, and the wiring conductor and the wiring conductor of the external electric circuit board are connected. Can be strengthened. Further, for example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor by an electrolytic plating method or an electroless plating method. The

  The dividing groove 2 is formed at the boundary of each wiring board region 1 a on one main surface of the mother board 1. The vertical cross-sectional shape of the dividing groove 2 may be V-shaped, U-shaped, or quadrangular, but if it is V-shaped as in the examples shown in FIGS. 1 to 5, the mother substrate 1 is bent. When breaking along the dividing groove 2, the bottom of the dividing groove 2 has a shape in which stress is likely to concentrate.

  Further, as in the example shown in FIG. 5, the second divided groove 2a (2ya in the vertical direction in FIG. 5) is also formed on the other main surface of the mother board 1 at the boundary of the wiring board region 1a. Is preferred. Since the crack starting from the bottom of the second dividing groove 2a on the other main surface side is generated, the mother substrate 1 can be divided along the boundary of the wiring board region 1a more accurately on both main surfaces.

  When the second dividing groove 2a is provided on the other main surface in this way, the bottom of the dividing groove 2 on the one main surface side is deeper than the bottom of the groove 4, and the second dividing groove 2a on the other main surface side. Therefore, cracks are likely to progress from the bottom of the second split groove 2a on the other main surface side toward the bottom of the split groove 2 on the one main surface side. Further, in the manufacturing process of the multilayer wiring board, a positional shift of about several tens to several hundreds μm may occur between the dividing groove 2 on the one main surface side and the second dividing groove 2a on the other main surface side. However, as described above, if the groove 4 is provided at a position near the recess 3 separated from the split groove 2 on the one main surface side, the distance between the second split groove 2a and the groove 4 is increased. The progress of cracks from the two divided grooves 2a to the groove 4 side is suppressed, and the possibility of occurrence of burrs and chips on the wiring board can be reduced.

  The depth of the dividing groove 2 is set as appropriate depending on the material of the insulating base, and is formed to be about 50 to 70% of the thickness of the mother substrate 1. By doing in this way, while being divided | segmented favorably, it becomes a multi-piece wiring board by which the mother board 1 does not break carelessly. In addition, when the 2nd division groove 2a is formed in the other main surface of the mother substrate 1, the sum total of the depth of the division groove 2 and the depth of the 2nd division groove 2a is the thickness of the above-mentioned mother substrate 1. It forms so that it may become a ratio to.

  When the opening width of the dividing groove 2 on the one main surface of the mother board 1 is about 0.05 to 1.0 mm, it can be divided satisfactorily, each wiring board region 1a is not reduced, and wiring is formed when the dividing groove 2 is formed. It is preferable because the substrate region 1a is not greatly deformed.

  The groove 4 is formed between the dividing groove 2 and the recess 3 on one main surface of the mother substrate 1. In the example shown in FIGS. 1 and 2, the shape surrounds the recess 3, and in the examples shown in FIGS. 3 and 4, the shape is along the dividing groove 2, and is continuous between adjacent wiring board regions 1 a and 1 a. is doing. The depth d3 of the groove 4 is set so as to be shallower than the depth d1 of the recess 3 and the depth d2 of the dividing groove 2, and is formed to be about 10 to 40% of the thickness of the mother substrate 1. The cross-sectional shape of the groove 4 is a shape like the example shown in FIG. 3 and FIG. 4, and when formed using a cutter blade, the vertical cross-sectional shape of the bottom portion is V-shaped, It may be a rectangle. In order to make it difficult for cracks to occur at the bottom of the groove 4 when the mother substrate 1 is divided, a U-shape or a square with rounded corners is preferred so that stress does not easily concentrate on the bottom. Such a shape can be obtained by forming the groove 4 with a laser.

  Further, the angle of the bottom when the cross-sectional shape of the groove 4 is V-shaped is preferably larger than the angle of the bottom of the divided groove 2. To make it easier to prevent the mother substrate 1 from cracking starting from the bottom of the groove 4 and to make it easier to fill the groove 4 with the sealing material when the lid is joined to the wiring substrate. For example, it is formed at an angle of about 20 to 90 degrees.

  Moreover, it is preferable that the mother board 1 has a dummy area | region in the outer peripheral part of the center part in which the some wiring board area | region 1a was arranged vertically and horizontally. The dummy area is an area for facilitating the manufacture and transportation of the multi-piece wiring board. Using the dummy area, the generated shape to be the mother board 1 and the positioning when the multi-piece wiring board is processed or carried. Can be fixed. Further, if both end portions of the dividing groove 2 are formed so as to be positioned in a dummy region between the wiring substrate region 1a arranged on the outermost periphery and the outer peripheral portion of the generated shape to be the mother substrate 1, This is preferable because it is possible to prevent the mother substrate 1 from being carelessly broken by a force applied from the outside during conveyance of the substrate 1. A dummy region may be provided between the plurality of wiring board regions 1a. In this case, the dividing groove 2 having the above structure is formed between the wiring board region 1a and the dummy region.

  Further, the groove 4 is symmetrical with respect to the dividing groove 2 even when the recess 3 is provided at a position shifted from the center of the wiring board region 1a, that is, as in the example shown in FIG. It is preferable that the distance W1 between each of the pair of grooves 4 and 4 facing each other with the dividing groove 2 and the dividing groove 2 is the same. In this way, the distance from the dividing groove 2 to the groove 4 becomes substantially equal, and when the mother substrate 1 is divided along the dividing groove 2, stress is applied substantially evenly on both sides of the dividing groove 2, The possibility of occurrence of burrs or chips on the wiring board can be further reduced. In the case where a dummy region is formed around the wiring substrate region 1a, the groove 4 is also formed in the dummy region, and the groove 4 formed in the wiring substrate region 1a and the groove 4 formed in the dummy region are formed. It is preferable that they are provided symmetrically across the dividing groove 2.

  The dividing groove 2 and the groove 4 are formed by pressing a cutter blade or a mold on the generated shape to be the mother substrate 1 or by laser processing or dicing on the generated shape to be the mother substrate 1 or the fired mother substrate 1. It can be formed by applying.

  6 to 9 are enlarged sectional views showing an example of a process for manufacturing the multi-cavity wiring board of the present invention. 6 to 9, 1 ′ is a generated feature to be the mother substrate 1, 2 y ′ is a cut formed in the generated feature 1 ′ to be the dividing groove 2 y, and 3 ′ is a recess 3. A recess formed in the feature 1 ′, 4y ′ is a notch formed in the generated feature 1 ′ to be a groove 4y, 5 is a cutter blade for forming the notch 2y ′, and 6 is a notch 4y. 'Cutter blade for forming. 6 to 9 show, in the process of manufacturing the multi-cavity wiring board of the present invention as in the example shown in FIG. 3, the generated shape 1 ′ has a notch 2y ′ to be a divided groove 2y and a notch 4y to be a groove 4y. The process of forming 'with a cutter blade is shown.

  The dividing groove 2 and the groove 4 are formed as follows, for example. First, as shown to Fig.6 (a), after preparing the production | generation form 1 'in which recessed part 3' was formed, the cutter blade 5 is pressed on the production | generation form 1 'used as the mother board | substrate 1, and it cuts into the division | segmentation groove | channel 2y 2y ′ is formed. Thereafter, as in the example shown in FIGS. 6B and 6C, the cutter blade 6 is pressed against the generated shape 1 ′ serving as the base substrate 1 to form a cut 4 y ′ serving as the groove 4 y. Then, by firing the generated shaped body 1 ′, the mother substrate 1 in which the divided grooves 2 y and the grooves 4 y are formed is formed. The horizontal dividing grooves 2x and the grooves 4x are formed by the same method as the vertical dividing grooves 2y and 4y.

  In FIG. 6, the notch 4y ′ is formed by dividing the notch 4y ′ formed by sandwiching the notch 2y ′ into two portions. However, as in the example shown in FIG. A cut 4y ′ may be formed simultaneously with 2y ′ in between. By forming the cut 4y ′ at the same time, the formation process of the cut 4y ′ can be simplified, the deformation of the generated shape 1 ′, the deformation of the cut 4y ′, and the like can be reduced, and the groove 4y can be accurately formed. Can be formed. In this case, a cutter blade in which two cutter blades 6 are integrated may be used. In this way, since the cutter blade is thick, the cutter blade 6 is deformed by the stress at the time of forming the cut 4y ′ as compared with the case where the cut 4y ′ is formed by one thin cutter blade 6. Thus, it is possible to reduce changes in the depth, inclination, and the like of the cut 4y ′. Such a cutter blade 6 can be easily manufactured, for example, by bonding two cutter blades together.

  6 and 7, the cut 4 ′ is formed after the cut 2 ′ is formed in the generated feature 1 ′. However, the cut 4 ′ is formed in the generated feature 1 ′ as shown in FIG. After the formation, the cut 2 ′ may be formed. Further, as shown in the example of FIG. 9, the notch 2 'and the notch 4' may be formed simultaneously. For example, as described above, using the cutter blade in which the cutter blade 5 for forming the cut 2 ′ and the cutter blade 6 for forming the cut 4 ′ are integrated, the cut 2 ′ and the cut 4 ′ are formed. You may form simultaneously. By forming the cut 2 'and the cut 4' at the same time, the formation process of the cut 2 'and the cut 4' can be simplified, and the distance between the dividing groove 2 and the groove 4 is controlled with high accuracy. can do.

  As shown in the examples of FIGS. 6 and 7, when the cut 4 y ′ is formed after the cut 2 y ′ is formed in the generated shape 1 ′, the generated shape 1 ′ is generated by the stress when the cut 2 ′ is formed. Can be prevented from being reduced, and the width and depth of the cut 4 'can be suppressed, and the width and depth of the groove 4y can be easily formed with high accuracy. Since the notch 4y ′ is formed shallower than the notch 2y ′, the deformation of the generated shape 1 ′ when forming the notch 4y ′ is smaller than that when forming the notch 2y ′. It is suppressed that the depth of the notch 2 'becomes shallow due to' deformation '. Further, since the stress when forming the cut 4y ′ to be the groove 4y is distributed to the concave portion 3 ′ and the cut 2y ′ to be the divided groove 2y, the generated shape 1 is formed by forming the cut 4y ′ to be the groove 4y. Can be prevented from being deformed and the shape of the recess 3 ′ becoming smaller.

  Further, after forming the notch 2y ′ to be the vertical dividing groove 2y and the notch 2x ′ to be the horizontal dividing groove 2x, the notch 4 ′ (4x ′ and 4y ′) to be the groove 4 (4x and 4y) is formed. You may form in a vertical direction and a horizontal direction, respectively.

  FIG. 10A is a perspective view showing an example of an embodiment of a wiring board according to the present invention, and FIG. 10B is a cross-sectional view showing an example of an embodiment of an electronic apparatus according to the present invention. In FIG. 10, 7 is an electronic component, 8 is a lid, 9 is a sealing material, 10 is a wiring conductor, and 11 is a bonding material. The example shown in FIG. 10A shows an example of a wiring board 1b obtained by dividing the multi-cavity wiring board shown in FIGS.

  By dividing the multi-piece wiring board of the present invention as described above along the dividing groove 2, a plurality of wiring boards 1b of the present invention are produced. Then, the electronic component 7 is mounted on the bottom surface of the recess 3 of the wiring board 1b, and the lid 6 is joined so as to cover the recess 3, whereby the electronic device of the present invention is manufactured.

  The wiring board 1b according to the present invention is obtained by dividing the multi-piece wiring board having the above-described configuration along the dividing groove 2. As a result, the occurrence of burrs and chips on the outer edge of the wiring board 1b is reduced, and since the opening width of the groove 4 is narrower than the width of the side wall, the outer edge of the divided wiring board 1b Since there is a thickness between the groove 4 and this part is difficult to be chipped due to collision between the wiring boards 1b during transportation, the outer edge of the wiring board 1b can be recognized well by an image recognition device or the like, and the wiring board 1b It is possible to mount the electronic component 7 on the wiring board 1b with reference to the outer edge of the substrate with good positional accuracy.

  Further, the wiring board 1b of the present invention is obtained by dividing the multi-piece wiring board having the above-described configuration as shown in the example shown in FIGS. 3 and 4 along the dividing groove 2, and is shown in FIG. Like the example shown, it has a concave portion 3 on one main surface, and a groove 4 that extends between the concave portion 3 and the outer side to reach a side surface facing both ends. At this time, the area of the groove 4 at the corner of the wiring board 1b is increased in a top view, and the amount of the sealing material 9 at the corner can be increased, so that the wiring board 1b and the lid 8 are joined at the corner. Strength can be improved. That is, for example, when the wiring board 1b and the lid 8 are joined by the thermosetting resin sealing material 9, the internal pressure in the sealed recess 3 is increased by heating for curing the sealing material 9. Rises and a gap is generated in the sealing material 9 at the corner of the wiring board 1b, so that the thickness of the sealing material 9 at the corner of the wiring board 1b is reduced, and the bonding strength between the wiring board 1b and the lid 8 is reduced. Can be suppressed. In addition, in the corner portion where the thermal stress due to the thermal expansion difference between the wiring board 1b and the lid body 8 increases, the groove 4 has a cross shape, and the bonding area of the sealing material 9 increases and the groove 4 increases. Since the encapsulating material 9 that has entered easily becomes resistance to lateral force, the bonding reliability between the lid 8 and the wiring board 1b is improved.

  In the electronic device of the present invention, the electronic component 7 is mounted on the bottom surface of the concave portion 3 of the wiring board 1b having the above-described configuration, and the lid 8 is joined so as to cover the concave portion 3. 9 can be firmly joined to the wiring board 1b and the lid, and the occurrence of burrs and chips on the outer edge of the electronic device is reduced. Therefore, the electronic device can be mounted on the external electric circuit board based on the outer edge of the electronic device with good positional accuracy.

  The electronic component 7 is a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, various sensors, and the like.

  For example, when the electronic component 7 is a flip chip type semiconductor element, the electronic component 7 is mounted via a bonding material 11 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). Then, it is performed by electrically and mechanically connecting the electrode of the semiconductor element and the wiring conductor 10. An underfill may be injected between the electronic component 7 and the wiring board 1b after bonding by bumps. Alternatively, for example, when the electronic component 7 is a wire bonding type semiconductor element, after being fixed by a bonding material 11 such as glass, resin, brazing material, etc., the electrode of the semiconductor element and the wiring conductor 10 are connected via a bonding wire. Is electrically connected. For example, when the electronic component 7 is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrodes of the piezoelectric element are electrically connected to the wiring conductor by a bonding material 11 such as a conductive resin. . Moreover, you may mount small electronic components, such as a resistive element and a capacitive element, around an electronic component as needed.

  The lid 8 is a flat plate made of metal, ceramics, glass, resin or the like. Those having a thermal expansion coefficient close to that of the insulating base of the wiring board 1b are preferable. For example, if the insulating base is made of an aluminum oxide sintered body and a lid 8 made of metal is used, Fe—Ni What consists of (iron-nickel) alloy, Fe-Ni-Co (iron-nickel-cobalt) alloy, etc. may be used. When the electronic component 7 is a solid-state image sensor or a light-emitting element, not only a translucent plate material made of glass or resin, but also a translucent lens made of glass or resin, or a lid to which the lens is attached. The body may be the lid 8.

  Moreover, you may enclose resin, such as an epoxy resin and a silicone resin, in the recessed part 3 as needed. For example, when the electronic component 7 is made of a light emitting element, the wavelength of light emitted from the light emitting element may be converted by the phosphor using a resin containing the phosphor.

  As the sealing material 9, a resin material such as an acrylic resin, epoxy resin, phenol resin, cresol resin, silicone resin, polyether amide resin, or the like, such as thermosetting or light curable, low-melting glass is used. be able to. The sealing material 9 may be mixed with dark pigments or dyes such as black, brown, dark brown, dark green, and dark blue as necessary. Thereby, it is possible to block external or internal light from being transmitted through the region of the sealing material 9.

  An electronic device may be manufactured by mounting the electronic component on the bottom surface of the concave portion 3 of each wiring board region 1a of the multi-piece wiring board, joining the lid, and then dividing along the dividing groove 2. .

  The present invention can be variously modified without departing from the gist of the present invention. For example, in the multi-cavity wiring board, the recess 3 and the groove 4 are formed only on one main surface, but the divided groove 2, the recess 3 and the groove 4 may be formed on the other main surface. . In this case, the depth of the groove 4 formed on the other main surface is shallower than the depth of the dividing groove 2 and the recess 3 formed on the other main surface.

(A) is a top view which shows an example of embodiment of the multi-piece wiring board of this invention, (b) is sectional drawing which shows the AA line cross section of (a). (A) is a top view which expands and shows the A section of Fig.1 (a), (b) is sectional drawing which expands and shows the A section of FIG.1 (b). (A) is a top view which shows an example of embodiment of the multi-piece wiring board of this invention, (b) is sectional drawing which shows the AA line cross section of (a). (A) is a top view which expands and shows the A section of Fig.3 (a), (b) is sectional drawing which expands and shows the A section of FIG.3 (b). It is sectional drawing which expands and shows the principal part of the other example of embodiment of the multi-piece wiring board of this invention. (A)-(c) is sectional drawing which shows an example of the process of manufacturing the multi-piece wiring board of this invention, respectively. (A) And (b) is sectional drawing which shows the other example of the process of manufacturing the multi-piece wiring board of this invention, respectively. (A) And (b) is sectional drawing which shows the other example of the process of manufacturing the multi-piece wiring board of this invention, respectively. It is sectional drawing which shows the other example of the process of manufacturing the multi-piece wiring board of this invention. (A) is a perspective view which shows an example of embodiment of the wiring board of this invention, (b) is sectional drawing which shows an example of embodiment of the electronic device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 1a ... Wiring board area | region 1b ... Wiring board 2 ... Dividing groove 3 ... Recess 4 ... Groove 5, 6 ... Cutter blade 7 ... .... Electronic component 8 ... Lid 9 ... Sealing material
10 ... Wiring conductor
11 ... Joint material

Claims (5)

In a multi-cavity wiring board in which a plurality of wiring board regions having a recess in the central portion are arranged in a vertical and horizontal manner on one main surface of the mother board, and a dividing groove is formed at the boundary of the wiring board area, On the other hand, a groove is provided between the concave portion of the main surface and the dividing groove, which is narrower than the width therebetween and shallower than the depth of the concave portion and the depth of the dividing groove, and the groove is adjacent to the wiring board. A multi-piece wiring board characterized by being continuous along the dividing groove between regions .   The multi-cavity wiring board according to claim 1, wherein the groove is provided closer to the recess than the division groove.   The wiring board according to claim 1 or 2, wherein the multi-piece wiring board according to claim 1 is divided along a dividing groove. 4. The wiring board according to claim 3 , wherein the main surface has the recess, and the groove between the recess and the outer side reaches the side surface facing both ends. Electronic components are mounted on the bottom surface of the recessed portion of the wiring board according to claim 3 or claim 4, the electronic apparatus characterized by lid is bonded so as to cover the recess.

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