CN107785327B - Electronic component mounting substrate, electronic device, and electronic module - Google Patents

Electronic component mounting substrate, electronic device, and electronic module Download PDF

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Publication number
CN107785327B
CN107785327B CN201710716548.XA CN201710716548A CN107785327B CN 107785327 B CN107785327 B CN 107785327B CN 201710716548 A CN201710716548 A CN 201710716548A CN 107785327 B CN107785327 B CN 107785327B
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Prior art keywords
electronic component
electrode
insulating base
component mounting
substrate
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CN201710716548.XA
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Chinese (zh)
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CN107785327A (en
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村上健策
森山阳介
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Kyocera Corp
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Kyocera Corp
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    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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Abstract

The substrate (1) for mounting electronic components comprises: an insulating base body (11) having a rectangular shape in plan view, the insulating base body having a first main surface (11a) and a second main surface (11b) opposed to the first main surface (11a), the insulating base body (11) being open at the first main surface (11a) and having a recessed portion (12); a band-shaped metal layer (13) provided on a side wall of the recess (12); and an electrode (14) provided from the bottom surface of the recessed portion (12) to the inside of the insulating base (11), wherein an end portion (14a) of the electrode (14) is provided inside the insulating base (11), and the end portion (14a) has an inclined portion inclined toward the second main surface (11 b).

Description

Electronic component mounting substrate, electronic device, and electronic module
Technical Field
The invention relates to an electronic component mounting board, an electronic device, and an electronic module.
Background
Conventionally, an electronic component mounting board and an electronic device in which an electronic component is mounted on a main surface of an insulating base are known (for example, see patent document 1).
In such an electronic component mounting board, the insulating base body has a recessed portion and an electrode provided on a bottom surface of the recessed portion.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2006-049551
Problems to be solved by the invention
However, in recent years, electronic devices have been increasingly sophisticated and miniaturized, and the size of electrodes provided on the bottom surface of the recessed portion has also been reduced. If the end of the electrode is extended into the insulating base in order to increase the bonding strength between the electrode and the insulating base, for example, a gap is easily provided between the insulating layers constituting the insulating base around the electrode, and there is a concern that the airtightness of the side wall of the recess portion may be reduced.
Disclosure of Invention
Means for solving the problems
According to one aspect of the present invention, an electronic component mounting substrate includes: an insulating base body having a rectangular shape in a plan view, a first main surface, and a second main surface opposite to the first main surface, the insulating base body being open to the first main surface and having a recessed portion; a metal layer in a band shape provided on a side wall of the recess portion; and an electrode provided from a bottom surface of the recessed portion to an inside of the insulating base, an end portion of the electrode being provided inside the insulating base, the end portion having an inclined portion inclined toward the second main surface side.
According to one aspect of the present invention, an electronic device includes the electronic component mounting board having the above-described configuration and an electronic component mounted on the electronic component mounting board.
According to one aspect of the present invention, an electronic module includes: a module substrate having connection pads; and an electronic device having the above structure, which is connected to the connection pad via solder.
Effects of the invention
An electronic component mounting board according to an aspect of the present invention includes: an insulating base body having a rectangular shape in a plan view, a first main surface, and a second main surface opposite to the first main surface, the insulating base body being open at the first main surface and having a recessed portion; a band-shaped metal layer disposed on a sidewall of the recess; and an electrode provided from the bottom surface of the recessed portion to the inside of the insulating base body, an end portion of the electrode being provided inside the insulating base body, the end portion having an inclined portion inclined toward the second principal surface side. According to the above configuration, the electronic component mounting board can be formed as follows: by providing the inclined portion at the end of the electrode to reduce the thickness of the electrode and embedding the electrode in the second main surface side of the insulating base, for example, it is possible to suppress the occurrence of a void between insulating layers constituting the insulating base around the electrode, suppress a decrease in airtightness around the electrode inside the insulating base, and suppress a decrease in airtightness around the recessed portion.
In the electronic device according to one aspect of the present invention, an electronic device having excellent long-term reliability can be formed by the electronic component mounting board having the above-described configuration and the electronic component mounted on the electronic component mounting board.
In the electronic module according to one aspect of the present invention, the electronic module having the above-described structure including the module substrate having the connection pad and the connection pad connected to the connection pad via the solder can be formed to have excellent long-term reliability.
Drawings
Fig. 1 (a) is a plan view showing an electronic device according to a first embodiment of the present invention, and (b) is a bottom view of (a).
Fig. 2 is a plan view showing the inside of an electrode of the electronic component mounting board in fig. 1.
Fig. 3 (a) is a longitudinal sectional view of the electronic device shown in fig. 1 (a) taken along line a-a, (B) is a longitudinal sectional view of the electronic device shown in fig. 1 (a) taken along line B-B, and (C) is an enlarged longitudinal sectional view of a main portion of part C of (a).
Fig. 4 is a vertical cross-sectional view showing an electronic module in which the electronic device in fig. 1 is mounted on a module substrate.
Fig. 5 (a) is a plan view showing an electronic device according to a second embodiment of the present invention, and (b) is a bottom view of (a).
Fig. 6 is an internal plan view showing an electrode of the electronic component mounting board in fig. 5.
Fig. 7 (a) is a longitudinal sectional view of the electronic device shown in fig. 5 (a) taken along line a-a, and (b) is an enlarged longitudinal sectional view of a main portion of the electronic device shown in part C.
Fig. 8 (a) is a plan view showing another example of the electronic device according to the first embodiment of the present invention, and (b) is a bottom view of (a).
Fig. 9 (a) is a plan view showing another example of the electronic device according to the first embodiment of the present invention, and (b) is a bottom view of (a).
Fig. 10 (a) is a vertical cross-sectional view taken along line a-a of the electronic device shown in fig. 9 (a), and (b) is an enlarged vertical cross-sectional view of a main portion of part C of (a).
Description of the figures
1. substrate for mounting electronic component
11. insulating base
11 a. first main face
11 b.second main face
11c insulating layer
12. concave part
13. metal layer
14. electrode
14 a. end
14 b. inclined part
15. Wiring conductor
16. Chamber
2. electronic component
3. connecting member
4. lid
5. substrate for module
51. connection pad
6 solder
Detailed Description
Several illustrative embodiments of the invention are described with reference to the accompanying drawings.
(first embodiment)
As shown in fig. 1 to 4, an electronic device according to a first embodiment of the present invention includes an electronic component mounting board 1 and an electronic component 2 mounted on the electronic component mounting board 1. As shown in fig. 4, the electronic device is connected to, for example, a module substrate 5 constituting an electronic module using solder 6.
The electronic component mounting board 1 of the present embodiment includes: an insulating base body 11 having a rectangular shape in plan view, the insulating base body 11 having a first main surface 11a and a second main surface 11b opposed to the first main surface 11a, the insulating base body 11 being open at the first main surface 11a and having a recessed portion 12; a metal layer 13 in a band shape provided on a side wall of the concave portion 12; and an electrode 14 provided from the bottom surface of the concave portion 12 to the inside of the insulating base 11. The wiring conductor 15 is provided on the surface and inside the insulating base 11. The insulating substrate 11 has a cavity 16 opened to the first main surface 11 a. The end 14a of the electrode 14 is provided inside the insulating base 11. The end portion 14a of the electrode 14 has an inclined portion 14b inclined toward the second main surface 11 b. In fig. 1 to 4, the upward direction refers to the positive direction of the imaginary z-axis. The upper and lower differences in the following description are for convenience of description, and are not limited to the upper and lower differences in the case of using the electronic component mounting board 1 or the like.
In the example shown in fig. 1 to 3, the electronic component mounting board 1 of the first embodiment includes: two recessed portions 12 that are open on the first main surface 11a and the side surfaces of the insulating base 11; and a cavity 16, which is provided between the two concave portions 12 and opens at the first main surface 11 a. In the example shown in fig. 1 to 3, the insulating base 11 in the electronic component mounting board 1 according to the first embodiment is formed of four insulating layers 11c, the recess 12 is provided in the first insulating layer on the first main surface 11a side, and the cavity 16 is provided in the first to third insulating layers 11c on the first main surface 11a side. The electrode 14 is provided on the surface of the second insulating layer 11c on the first main surface 11a side, that is, on the bottom surface of the recessed portion 12.
In the example shown in fig. 2, a region overlapping with the inner wall surface of the recessed portion 12 in a top perspective view is shown by a broken line. In the example shown in fig. 2, a region overlapping with a side surface of the through conductor of the wiring conductor 15 in a plan view is shown by a broken line. In the example shown in fig. 2, the regions overlapping the inner edge and the outer edge of the metal layer 13 in a plan view are shown by broken lines. In the example shown in fig. 2, the end portions 14a of the two electrodes 14 overlap the metal layer 13 in a top perspective view.
The insulating substrate 11 has a first main surface 11a (upper surface in fig. 1 to 4), a second main surface 11b (lower surface in fig. 1 to 4), and side surfaces. The insulating substrate 11 is composed of a plurality of insulating layers 11c, and has a recessed portion 12 that opens on the first main surface 11a and that opens on the side surface of the insulating substrate 11. An electrode 14 is provided on the bottom surface of the recessed portion 12, and the electrode 14 is used for connection with a connection pad 51 of the module substrate 5. The insulating substrate 11 has a rectangular plate-like shape when viewed in plan, that is, when viewed from a direction perpendicular to the main surface. The insulating base 11 has a cavity 16 that is open at the first main surface 11a and is adjacent to the recessed portion 12. The insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is fixed to the bottom surface of the cavity 16 by bonding via a connecting member 3 such as a solder bump, a metal bump, or a conductive resin (anisotropic conductive resin or the like).
As the insulating substrate 11, for example, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a silicon nitride sintered body, or a mullite sintered body can be usedOr ceramics such as glass ceramic sintered bodies. In the case of an aluminum oxide sintered body, for example, the insulating substrate 11 is made of aluminum oxide (Al)2O3) Silicon oxide (SiO)2) Raw material powders such as magnesium oxide (MgO) and calcium oxide (CaO) are mixed with an appropriate organic binder and a solvent to prepare a slurry. The slurry is formed into a sheet by a conventionally known blade method, calender roll method, or the like, to produce a ceramic green sheet. Next, the ceramic green sheets are subjected to appropriate punching processing, a plurality of ceramic green sheets are stacked to form a green body, and the green body is fired at a high temperature (about 1600 ℃) to fabricate the insulating base 11.
The recess 12 or the cavity 16 may be formed, for example, by: some of the ceramic green sheets for the insulating substrate 11 are subjected to laser processing, punching processing by a die, or the like, through holes as recesses 12 or cavities 16 are formed in the respective ceramic green sheets, and the ceramic green sheets are stacked on other ceramic green sheets on which the through holes are not formed.
A metal layer 13, an electrode 14, and a wiring conductor 15 are provided on the surface and inside the insulating base 11. The electrodes 14 and the wiring conductors 15 are used to electrically connect the electronic component 2 and the module substrate 5. The metal layer 13 serves as a bonding portion for bonding the lid 4 to the electronic component mounting substrate 1, for example.
The metal layer 13, the electrode 14, and the wiring conductor 15 are metal powders containing tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like as a main component, for example. For example, when the insulating substrate 11 is formed of an aluminum oxide sintered body, a metalized paste obtained by adding and mixing a suitable organic binder, a solvent, and the like to a high-melting-point metal powder such as W, Mo or Mn is applied to the ceramic green sheet for the insulating substrate 11 by screen printing in advance in a predetermined pattern, and is fired simultaneously with the ceramic green sheet for the insulating substrate 11, thereby being formed to cover a predetermined position of the insulating substrate 11. The metal layer 13, the electrode 14, and the wiring conductor 15 are formed, for example, as follows: the metallization pastes for the metal layer 13, the electrodes 14, and the wiring conductors 15 are applied by printing to the ceramic green sheet for the insulating substrate 11 by a printing means such as screen printing, and fired together with the ceramic green sheet for the insulating substrate 11. The through conductor constituting the wiring conductor 15 is formed, for example, as follows: a through hole for a through conductor is formed in the ceramic green sheet for the insulating base 11 by a processing method such as punching processing by a die or a punch, laser processing, or the like, and the through hole is filled with a metalized paste for a through conductor by the printing means and fired together with the ceramic green sheet for the insulating base 11. The metallization paste is prepared by adding an appropriate solvent and a binder to the metal powder and kneading the mixture to adjust the viscosity to an appropriate level. In order to improve the bonding strength with the insulating base 11, glass powder or ceramic powder may be included.
The metal layer 13 is provided in a band shape on the side wall between the recess 12 and the cavity 16. In the example shown in fig. 1, the metal layer 13 is provided in a frame shape so as to surround the chamber 16. The metal layer 13 is used for bonding to the lid 4, or bonding to a frame or other member such as a metal.
The electrode 14 is led out at the bottom surface of the concave portion 12, and an end portion 14a of the electrode 14 extends to the inside of the insulating base 11, that is, the electrode 14 is provided from the bottom surface of the concave portion 12 to the inside of the insulating base 11. The electrode 14 of the first embodiment is used as, for example, an external electrode connected to the connection pad 51 of the module substrate 5. When the length of the electrode 14 extending into the insulating base 11, that is, the length of the electrode 14 overlapping the insulating base 11 in a plan view is 50 μm or more, the strength of the electrode 14 provided on the bottom surface of the recessed portion 12 can be improved satisfactorily. As shown in fig. 2, when the electrode 14 is provided so as to extend into the insulating base 11 so as to overlap with the side walls of the three sides of the recessed portion 12 in a plan view, the strength of the electrode 14 can be further improved.
As shown in fig. 2 and 3, the end portion 14a of the electrode 14 is provided inside the insulating base 11, and has an inclined portion 14b inclined toward the second main surface 11 b. With such a configuration, the electronic component mounting board 1 can be formed as follows: the electronic component mounting board 1 can suppress, for example, a void from being formed between the insulating layers 11c of the insulating base 11 around the electrode 14, suppress a decrease in airtightness around the electrode 14 inside the insulating base 11, and suppress a decrease in airtightness around the recessed portion 12.
The tip end side of the inclined portion 14b is inclined toward the second main surface 11b side with respect to the bottom surface of the recessed portion 12 in the insulating base 11, and the tip end of the inclined portion 14b is positioned toward the second main surface 11b side with respect to the bottom surface of the recessed portion 12 in a vertical cross-sectional view. The length of the overlap with the insulating base 11 is preferably 30% or less of the width of the side wall between the concave portion 12 and the cavity 16.
Such an inclined portion 14b may be formed as follows: a recessed portion is provided in advance in a ceramic green sheet which is a bottom surface of the recessed portion 12 so that an end portion thereof is inclined, and a metallization paste for applying the electrode 14 is printed on the recessed portion. In addition, when the interval between the first main surface 11a of the insulating base 11 and the bottom surface of the recessed portion 12 (the depth of the recessed portion 12) is small, the following may be formed: ceramic green sheets on which the metallization paste for the metal layer 13 is printed and ceramic green sheets on which the metallization paste for the electrode 14 is printed are prepared, the ceramic green sheets are laminated so that the metallization paste for the metal layer 13 and the metallization paste for the electrode 14 are close to each other in a plan view, and then pressure is applied to these ceramic green sheets from both main surfaces to embed them on the ceramic green sheet side which becomes the bottom surface of the recessed portion 12. In this way, the electronic component mounting board 1 can be formed as follows: the electrode 14 at the inclined portion 14b can be formed with a small thickness and a high density, and the tip of the inclined portion 14b is embedded in the second main surface 11b side of the insulating base 11, so that the airtightness of the electrode inside the insulating base 11 and the area around the electrode 14 can be improved, and the decrease in airtightness around the recessed portion 12 can be suppressed.
The end portion 14a of the electrode 14 is located in a region overlapping with the metal layer 13 in a top perspective view. If the overlapping width of the metal layer 13 and the electrode 14 is 50% or less of the width of the metal layer 13 in a plan view, when pressure is applied to the ceramic green sheet from both main surfaces, the pressure can be transmitted to the end portion 14a of the electrode 14 well, and the electrode can be embedded in the ceramic green sheet side which is the bottom surface of the recessed portion 12 more well.
The surfaces of the metal layer 13, the electrodes 14, and the wiring conductors 15 exposed from the insulating base 11 are coated with a metal plating layer by an electroplating method or an electroless plating method. The metal plating layer is made of a metal having excellent corrosion resistance and connectivity with the connecting member 3, such as nickel, copper, gold, or silver, and is formed by sequentially coating a nickel plating layer having a thickness of about 0.5 to 5 μm and a gold plating layer having a thickness of about 0.1 to 3 μm, or sequentially coating a nickel plating layer having a thickness of about 1 to 10 μm and a silver plating layer having a thickness of about 0.1 to 1 μm. This can effectively suppress corrosion of the metal layer 13, the electrode 14, and the wiring conductor 15, and can also make the connection between the wiring conductor 15 and the connecting member 3 such as a bonding wire, the connection between the electrode 14 and the connection pad 51 for connection formed on the module substrate 5, and the connection between the metal layer 13 and the lid 4 firm.
The metal plating layer is not limited to nickel plating/gold plating, nickel plating/silver plating, and may be another metal plating layer including nickel plating/gold plating/silver plating, nickel plating/palladium plating/gold plating, or the like.
Further, on the wiring conductor 15 on which the electronic component 2 is mounted, for example, a copper plating layer having a thickness of about 10 to 80 μm may be coated as a metal plating layer on the base layer of the nickel plating layer and the gold plating layer, for example, so that heat of the electronic component 2 can be easily dissipated to the electronic component mounting substrate 1 side through the copper plating layer.
The electronic component 2 can be mounted on the bottom surface of the cavity 16 of the electronic component mounting substrate 1 to produce an electronic device. The electronic component 2 mounted on the electronic component mounting substrate 1 is a semiconductor device such as an IC chip or an LSI chip, a light emitting device, a piezoelectric device such as a quartz resonator or a piezoelectric resonator, various sensors, or the like. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is mounted on the electronic component mounting board 1 as follows: the semiconductor element is fixed to the mounting metal layer by a bonding member such as a low melting point solder or a conductive resin, and then the electrode of the semiconductor element is electrically connected to the wiring conductor 15 via the connecting member 3 such as a bonding wire. Thereby, the electronic component 2 is electrically connected to the electrode 13. In the case where the electronic component 2 is a flip-chip type semiconductor element, for example, the semiconductor element is mounted on the electronic component mounting board 1 as follows: the electrodes of the semiconductor element are electrically and mechanically connected to the wiring conductors 15 via connecting members 3 such as solder bumps, metal bumps, and conductive resins (anisotropic conductive resins). Further, a plurality of electronic components 2 may be mounted on the electronic component mounting substrate 1, or small electronic components such as a resistance element and a capacitance element may be mounted as necessary. The electronic component 2 is sealed by a cover 4 as necessary, and the cover 4 is made of resin, glass, or the like.
For example, as shown in fig. 4, the electrodes 14 of the electronic device according to the present embodiment are connected to the connection pads 51 of the module substrate 5 via the solder 6 to form an electronic module. In the electronic device, as shown in fig. 4, for example, the electrodes 14 arranged on the upper surface side of the electronic component mounting substrate 1 are connected to the connection pads 51 of the module substrate 5.
The electronic component mounting board 1 of the present embodiment includes: an insulating base body 11 having a rectangular shape in plan view, the insulating base body 11 having a first main surface 11a and a second main surface 11b opposed to the first main surface 11a, the insulating base body 11 being open at the first main surface 11a and having a recessed portion 12; a metal layer 13 in a band shape provided on a side wall of the concave portion 12; and an electrode 14 provided from the bottom surface of the recessed portion 12 to the inside of the insulating base 11, wherein an end portion 14a of the electrode 14 is provided inside the insulating base 11, and the end portion 14a has an inclined portion 14b inclined toward the second main surface 11b side. According to the above configuration, the electronic component mounting board can be formed as follows: for example, by providing the inclined portion 14b at the end portion 14a of the electrode 14 to reduce the thickness of the electrode 14 and embedding the electrode 14 on the second main surface 11b side of the insulating base 11, it is possible to suppress a decrease in the airtightness around the electrode 14 and the electrode 14 inside the insulating base 11 and suppress a decrease in the airtightness around the recessed portion 12.
In addition, the side wall of the recessed portion 12 overlaps the inclined portion 14b in a perspective plan view, so that the following electrode 14 can be formed: the inclined portion 14b is formed to have a small thickness and is embedded in the second main surface 11b of the insulating base 11, thereby providing excellent airtightness and excellent bonding strength between the electrode 14 and the insulating base 11.
Further, when the band-shaped metal layer 13 and the inclined portion 14b overlap each other in a perspective top view, when the distance between the first main surface 11a of the insulating base 11 and the bottom surface of the recessed portion 12 (the depth of the recessed portion 12) is small, the ceramic green sheets on which the metalized paste for the metal layer 13 is printed and the ceramic green sheets on which the metalized paste for the electrode 14 is printed are prepared, the ceramic green sheets are stacked so that the metalized paste for the metal layer 13 and the metalized paste for the electrode 14 are close to each other in a top view, and then pressure is applied to these ceramic green sheets from both main surface sides, the electronic component mounting substrate 1 as follows can be formed: the electrode 14 at the inclined portion 14b can be formed with a small thickness and a high density, and the tip of the inclined portion 14b is embedded in the second main surface 11b side of the insulating base 11, so that the airtightness of the electrode inside the insulating base 11 and the area around the electrode 14 can be improved, and the decrease in airtightness around the recessed portion 12 can be suppressed.
If the overlap W between the metal layer 13 and the inclined portion 14b in a plan view is equal to or greater than the distance H between the metal layer 13 and the electrode 14 in the thickness direction of the insulating base 11 in a vertical cross-sectional view (W ≧ H), when pressure is applied to these ceramic green sheets from both principal surfaces, pressure can be transmitted well from the metal layer 13 to the end of the electrode 14, the electrode 14 at the inclined portion 14b can be formed with a small thickness and high density, and the tip of the inclined portion 14b can be buried well in the second principal surface 11b side of the insulating base 11.
Further, if the thickness of the insulating layer 11c on the first main surface 11a side of the electrode 14 is smaller than the thickness of the insulating layer 11c on the second main surface 11b side of the electrode 14 as in the example shown in fig. 3, when pressure is applied to these ceramic green sheets from both main surface sides, the pressure can be transmitted from the metal layer 13 to the end of the electrode 14 more favorably, and the tip of the inclined portion 14b of the electrode 14 can be embedded favorably in the second main surface 11b side of the insulating base 11.
As shown in the example of fig. 2, the strip-shaped metal layer 13 and the inclined portion 14b are overlapped in a strip shape along the side wall of the recessed portion 12, whereby the electronic component mounting board 1 can be formed as follows: the end portion 14a of the electrode 14 has the inclined portion 14b along the side wall of the recessed portion 12 in a band shape, and the entire end portion 14a of the electrode 14 is formed at a high density so that the thickness of the electrode 14 is thin, and can be embedded in the second main surface 11b side of the insulating base 11, so that the airtightness of the electrode inside the insulating base 11 and the area around the electrode 14 can be improved, and the decrease in airtightness around the recessed portion 12 can be suppressed.
In this case, when the length L1 of the metal layer 13 in a band shape is longer than the length L2 of the recessed portion 12 (L1 > L2) as in the example shown in fig. 2, the entire end portion 14a of the electrode 14 can be formed at high density so as to be thinner than the thickness of the electrode 14 and embedded in the second main surface 11b side of the insulating base 11 more effectively.
Further, when the length L1 of the metal layer 13 in a band shape and the length L3 of the electrode 14 are longer than the length L2 of the recessed portion 12 (L1 > L2 and L3 > L2), the entire end portion 14a of the electrode 14 can be formed at high density so that the thickness of the electrode 14 is thin in the entire range of the side wall between the recessed portion 12 and the chamber 16, and the electrode 14 can be embedded on the second main surface 11b side of the insulating base 11, and therefore the electronic component mounting substrate 1 can be formed in which the airtightness between the electrode inside the insulating base 11 and the electrode 14 can be improved and the airtightness around the recessed portion 12 can be suppressed from being lowered. It should be noted that, when the length L3 of the electrode 14 is longer than the length L1 of the strip-shaped metal layer 13 (L3 > L1), pressure can be applied uniformly along the metal layer 13 when the ceramic green sheet is pressed from both main surfaces, which is preferable.
In addition, when the region of the inclined portion 14b is included in the region of the side wall of the recessed portion 12 in a top perspective view, the electrode 14 having excellent airtightness and excellent bonding strength with the insulating base 11 can be formed by making the thickness of the inclined portion 14b thin and embedding it well on the second main surface 11b side of the insulating base 11.
Further, if the electrode 14 is an external electrode connected to the module substrate 5, the insulating base 11 has a side surface, and the recessed portion 12 is opened at the side surface to serve as a solder reservoir for connecting the external electrode to the module substrate 5 via the solder 6, even if stress is applied to the electrode 14 due to a difference in thermal expansion between the electronic component mounting substrate 1 and the module substrate 5 when the electronic device is used, the connection and airtightness of the electrode 14 are excellent, and a substrate excellent in mounting reliability and airtightness can be formed as the small-sized electronic component mounting substrate 1.
The electronic device of the present embodiment can be formed with excellent long-term reliability by the electronic component mounting board 1 having the above-described configuration and the electronic component 2 mounted on the electronic component mounting board 1.
When the cover 4 is translucent and an optical element such as a light-emitting element is used as the electronic component 2, an opening 52 for transmitting light is provided in the module substrate 5 as shown in fig. 4. Such an opening 52 is formed larger than the electronic component 2 in a plan view.
The electronic module according to the present embodiment includes the module substrate 5 having the connection pads 51 and the electronic device having the above-described structure connected to the connection pads 51 via the solder 6, and thus can be formed into an electronic module having excellent long-term reliability.
The electronic component mounting board 1 according to the present embodiment can be preferably used in a small-sized and high-output electronic device, and the connection reliability of the electronic component mounting board 1 can be improved. For example, when a light-emitting element is used as the electronic component 2, the substrate can be preferably used as a small-sized substrate for mounting the light-emitting element.
(second embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to fig. 5 to 7.
The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment in that the recessed portion 12 also serves as the cavity 16 for mounting the electronic component 2. In the example shown in fig. 6, a region overlapping with the inner wall surface of the recessed portion 12 in a top perspective view is shown by a broken line. In the example shown in fig. 6, a region overlapping with a side surface of the through conductor of the wiring conductor 15 in a plan view is shown by a broken line. In the example shown in fig. 6, the regions overlapping the inner edge and the outer edge of the metal layer 13 in a plan view are shown by broken lines.
In the electronic component mounting board 1 according to the second embodiment, in the example shown in fig. 1 to 3, the insulating base 11 is formed of four insulating layers 11c, the concave portion 12 is provided on the first insulating layer 11c on the first main surface 11a side, and the electrode 14 is provided on the surface of the second insulating layer 11c on the first main surface 11a side.
According to the electronic component mounting board 1 of the second embodiment of the present invention, as with the electronic component mounting board 1 of the first embodiment, the following electronic component mounting board can be formed: for example, by providing the inclined portion 14b at the end portion 14a of the electrode 14 to reduce the thickness of the electrode 14 and embedding the electrode 14 on the second main surface 11b side of the insulating base 11, it is possible to suppress a decrease in the airtightness around the electrode 14 and the electrode 14 inside the insulating base 11 and suppress a decrease in the airtightness around the recessed portion 12.
In the second embodiment, since the electrode 14 is a connection electrode for connecting the electronic component 2 and the recessed portion 12 is the cavity 16 for mounting the electronic component 2 via the connection electrode, the air tightness between the recessed portion 12 (cavity 16) and the side wall of the insulating base 11 can be made excellent, and thus the electronic component mounting substrate 1 excellent in reliability of the electronic component 2 can be formed.
In the electronic component mounting board 1 according to the second embodiment, when the electrode 14 overlaps the metal layer 13 over the entire circumference as in the example shown in fig. 5 to 7, the electrode 14 has the inclined portion 14b that is provided inside the insulating base 11 and inclined toward the second main surface 11b over the entire circumference of the side wall of the recessed portion 12. In this way, since the electrode 14 at the inclined portion 14b can be formed with a small thickness and high density over the entire circumference of the side wall of the recessed portion 12, and the tip of the inclined portion 14b can be embedded in the second main surface 11b side of the insulating base 11, the electronic component mounting substrate 1 can be formed as follows: it is possible to suppress the occurrence of a void between the insulating layers 11c of the insulating base 11 around the electrode 14, suppress a decrease in airtightness around the electrode 14 inside the insulating base 11, and suppress a decrease in airtightness around the recessed portion 12.
According to the electronic component mounting substrate 1 of the second embodiment, the wiring conductor 15 provided on the second main surface 11b side serves as an external electrode connected to the module substrate 5 and is connected to the connection pad 51 of the module substrate 5.
The electronic component mounting board 1 according to the second embodiment can be manufactured by the same manufacturing method as the electronic component mounting board 1 according to the first embodiment.
The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the insulating base 11 may have a rectangular shape having a notch or a chamfer on a side surface or a corner in a plan view.
In the above-described embodiment, the example in which the insulating base 11 is formed of three or four insulating layers 11c is shown, but the insulating base 11 may be formed of two or more insulating layers 11 c.
Further, a heat dissipation substrate, such as a heat dissipation substrate of copper (Cu), copper-tungsten (Cu-W), copper-molybdenum (Cu-Mo), or the like, which is larger than the cavity 16 in a plan view and has higher thermal conductivity than the insulating base 11, may be bonded to the second main surface 11b of the electronic component mounting substrate 1 of the first embodiment to improve heat dissipation to the second main surface 11b side, thereby forming the electronic component mounting substrate 1, the electronic device, and the electronic module having excellent long-term reliability.
As shown in fig. 8, a mounting metal layer 17 may be provided on the bottom surface of the chamber 16. The mounting metal layer 17 is formed on the bottom surface of the cavity 16 by using the same material and method as those of the metal layer 13, the electrode 14, and the wiring conductor 15. The mounting metal layer 17 may be connected to the wiring conductor 15.
As shown in fig. 9 and 10, the electronic component mounting board 1 may include cavities 16(16a, 16b) on both main surfaces of the insulating base 11. In this case, as in the example shown in fig. 9 and 10, if the cavity 16b on the second main surface 11b side does not overlap the end 14a of the electrode 14, that is, the inner wall surface IL of the cavity 16b on the second main surface 11b side is located inward of the end 14a of the electrode 14, when pressure is applied to these ceramic green sheets from both main surfaces, the thickness of the electrode 14 at the inclined portion 14b can be made thin and high-density formed, and the tip of the inclined portion 14b can be embedded in the second main surface 11b side of the insulating base 11.
Further, the electronic component mounting board 1 according to the first embodiment and the electronic component mounting board 1 according to the second embodiment may be combined.
The electronic component mounting board 1 may be fabricated by simultaneously processing a plurality of electronic component mounting boards.

Claims (8)

1. An electronic component mounting board is characterized by comprising:
an insulating base body having a rectangular shape in a plan view, a first main surface, and a second main surface opposite to the first main surface, the insulating base body being open to the first main surface and having a recessed portion;
a metal layer in a band shape provided on a side wall of the recess portion; and
an electrode provided from a bottom surface of the concave portion to an inside of the insulating base body,
an end portion of the electrode is provided inside the insulating base, and the end portion has an inclined portion inclined toward the second main surface side.
2. The substrate for mounting an electronic component according to claim 1, wherein the substrate is a substrate for mounting an electronic component,
a side wall of the concave portion overlaps with the inclined portion in a top perspective.
3. The electronic component mounting board according to claim 1 or 2, wherein the electronic component mounting board further comprises a first substrate having a first surface and a second surface,
the metal layer in a belt shape overlaps the inclined portion in a top view.
4. The electronic component mounting board according to claim 1 or 2, wherein the electronic component mounting board further comprises a first substrate having a first surface and a second surface,
in a top perspective view, a region of the inclined portion is included in a region of a side wall of the recessed portion.
5. The electronic component mounting board according to claim 1 or 2, wherein the electronic component mounting board further comprises a first substrate having a first surface and a second surface,
the electrode is an external electrode connected to the module substrate,
the insulating base body has a side surface,
the recessed portion is open at the side surface, and the recessed portion is a solder reservoir portion to which the external electrode is connected to the module substrate via solder.
6. The electronic component mounting board according to claim 1 or 2, wherein the electronic component mounting board further comprises a first substrate having a first surface and a second surface,
the electrode is a connecting electrode for connecting an electronic component,
the recessed portion is a cavity in which an electronic component is mounted via the connection electrode.
7. An electronic device, comprising:
the substrate for mounting an electronic component according to any one of claims 1 to 6; and
an electronic component mounted on the electronic component mounting board.
8. An electronic module, comprising:
a module substrate having connection pads; and
the electronic device of claim 7, connected to the connection pad via solder.
CN201710716548.XA 2016-08-25 2017-08-18 Electronic component mounting substrate, electronic device, and electronic module Active CN107785327B (en)

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