JP2020102584A - Circuit board and electronic component - Google Patents

Abstract

To provide a circuit board and an electronic component that are effective for improving reliability of connection to an external wring board.SOLUTION: A circuit board 100 comprises: a wiring board 10 that has a mounting part for an electronic element 200 on a top face, has a junction electrode 11 on an under surface, and side-face conductors 12 on side faces; and lead terminals 20 that are joined to the joint electrode 11 with solder materials 30. The lead terminals 20 each have a joint terminal part 21 joined to the joint electrode 11, an extension part 22 extending outward from the joint terminal part 21 along the under surface of the wiring board 10, a curved part 23 bent upward outside the extension part 22 and curved to extend downward beyond the extension part 22, and a connection terminal part 24 extending outward from an outer end of the curved part. A top face of th extension part 22 and the side-face conductor 12 are joined by the solder material 30.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a circuit board including lead terminals and an electronic component.

There is an electronic component in which electronic elements such as a semiconductor element and a sensor element are mounted on a circuit board. As the circuit board, one having a lead terminal as a connection terminal with an external circuit is used. The lead terminals are arranged along the outer edge of the rectangular substrate and are joined to the wiring on the surface of the substrate with a brazing material (see, for example, the ceramic substrate of Patent Document 1 and Patent Document 2).

In such a circuit board, improvement in connection reliability such as electrical connection to an external electric circuit (wiring board) is required. On the other hand, there are some which are provided with a curved lead terminal in order to reduce thermal stress between the lead terminal and the external circuit board and suppress solder breakage at the joint between the lead terminal and the external circuit (for example, Patent Document 1). See 3).

JP, 2016-219809, A JP 61-276244A JP, 9-246452, A

The semiconductor device described in Patent Document 3 is a resin mold type, and since the lead terminals are embedded in the resin, attention is paid to reducing the stress on the solder at the joint with the external circuit. However, in the ceramic substrate of Patent Document 1 and the semiconductor device of Patent Document 2, even if the curved lead terminal as in Patent Document 3 is used, the lead terminal bonded to the surface of the ceramic substrate may be peeled off. This is because miniaturization of the lead terminal (that is, reduction of the bonding area between the terminal electrode and the external electric circuit) is progressing along with the miniaturization of electronic components.

A circuit board according to one aspect of the present disclosure includes a wiring board having an electronic element mounting portion on an upper surface, a bonding electrode on a lower surface, and a side conductor on a side surface, and being bonded to the bonding electrode with a brazing material. A lead terminal, the lead terminal being joined to the joining electrode; an extending portion extending outward from the joint end along the lower surface of the wiring board; An upper surface of the extending portion, which has a bending portion that bends upward and curves outside the portion and extends below the extending portion, and a connecting end portion that extends outward from an outer end of the bending portion. And the side surface conductor are joined by the brazing material.

An electronic component according to one aspect of the present disclosure includes the circuit board having the above configuration and an electronic element.

According to the circuit board of one aspect of the present disclosure, since the lead terminal is bonded not only to the lower surface of the wiring board but also to the side surface, the bonding area can be increased even with a small lead terminal. It becomes a circuit board that can obtain a small-sized electronic component having excellent connection reliability.

According to the electronic component of one aspect of the present disclosure, including the circuit board having the above configuration,
Since the bonding strength between the lead terminal and the wiring on the wiring board is excellent, a small electronic component having excellent reliability can be obtained.

It is a perspective view which shows an example of a circuit board and an electronic component. 1A is a top view of the electronic component shown in FIG. 1, FIG. 1B is a sectional view taken along line BB of FIG. 1A, and FIG. It is a perspective view which shows another example of a circuit board and an electronic component. (A) is a top view of the electronic component shown in FIG. 3, (b) is a sectional view taken along the line BB of (a), and (c) is a bottom view. It is a perspective view which shows another example of a circuit board and an electronic component. (A) is a top view of the electronic component shown in FIG. 5, (b) is a sectional view taken along line BB of (a), and (c) is a bottom view. (A)-(c) is each sectional drawing which expands and shows the principal part of another example of a circuit board.

A circuit board and an electronic component according to an embodiment of the present disclosure will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing an example of a circuit board and an electronic component. 2A is a top view of the electronic component shown in FIG. 1, FIG. 2B is a cross-sectional view taken along line BB of FIG. 2A, and FIG. 2C is a bottom view. .. FIG. 3 is a perspective view showing another example of the circuit board and the electronic component. 4A is a top view of the electronic component shown in FIG. 3, FIG. 4B is a sectional view taken along line BB of FIG. 4A, and FIG. 4C is a bottom view. FIG. 5 is a perspective view showing another example of the circuit board and the electronic component. 6A is a top view of the electronic component shown in FIG. 5, FIG. 6B is a cross-sectional view taken along line BB of FIG. 6A, and FIG. 6C is a bottom view. .. 7(a) to 7(c) are sectional views showing enlarged main parts of another example of the circuit board. Note that, in FIGS. 1 to 7, the bonding electrodes 11, the side surface conductors 12, and the connection electrodes 13 are shaded in a dot shape so as to be easily distinguished from others. Further, the distinction between upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the circuit board, the electronic component, etc. are actually used.

The circuit board 100 has a mounting portion for mounting the electronic element 200 on an upper surface, a bonding electrode 11 on a lower surface, and a wiring board 10 having a side surface conductor 12 on a side surface, and is bonded to the bonding electrode 11 with a brazing material 30. A lead terminal 20 which is provided, and the lead terminal 20 extends outward along the lower surface of the wiring board 10 from the joining end portion 21 joined to the joining electrode 11. An extending portion 22, a bending portion 23 that bends upward on the outside of the extending portion 22, bends, and extends below the extending portion 22, and a connecting end portion 24 that extends outward from the outer end of the bending portion. The upper surface of the extending portion 22 and the side surface conductor 12 are joined by the brazing material 30.

The wiring board 10 is one in which wiring is provided on the insulating substrate 15. The wiring includes a connection electrode 13 provided on the mounting portion of the electronic element 200 on the upper surface, a bonding electrode 11 provided on the lower surface, and an internal wiring 14 arranged inside the insulating substrate 15 and connecting these. The connection electrode 13 is electrically connected to the electrode 201 of the electronic element 200 by the connection member 210. Further, the wiring board 10 is provided with the side surface conductors 12 on the side surfaces (side surfaces of the insulating board 15). The insulating substrate 15 is a basic part of the circuit board 100, and functions as an electrical insulator for electrically arranging the circuit conductors such as the plurality of bonding electrodes 11 and the lead terminals 20 with each other. The insulating substrate 15 is, for example, a portion that functions as a base body for mounting and fixing the electronic element 200.

The lead terminal 20 is bonded to the bonding electrode 11 on the lower surface of the wiring board 10 with a brazing material 30. The lead terminal 20 includes a joining end portion 21, an extending portion 22 that extends from the joining end portion 21 to the outside of the wiring board 10 along the lower surface of the wiring board 10, and bends and curves upward outside the extending portion 22. The curved portion 23 extends below the extending portion 22 and the connecting end portion 24 is bent at the outer end of the curved portion and extends outward from the outer end. The lead terminals 20 are also joined to the side surface conductors 12 of the wiring board 10 by the brazing material 30. The upper surface of the extending portion 22 and the side surface conductor 12 are joined by the brazing material 30. The lead terminal 20 functions as a conductor that connects the wiring (bonding electrode 11) of the wiring board 10 and an external circuit board. Further, it also has a function of alleviating thermal stress generated between the wiring board 10 and an external circuit board to improve the mounting reliability of the circuit board 100.

According to the circuit board 100 of the present disclosure, the lead terminal 20 is not bonded to the upper surface on which the electronic element 200 is mounted, but is arranged below the lower surface and bonded to the lower surface and the side surface. Therefore, it is not necessary to enlarge the wiring board 10 in order to provide a region for joining the lead terminals 20 to the outside of the mounting portion of the electronic element 200, and thus the circuit board 100 can be downsized. Further, since the lead terminal 20 has the shape having the curved portion 23, the thermal stress generated between the circuit board 100 and the external circuit board due to the deformation of the curved portion 23 is relieved. Therefore, the stress applied to the joint between the lead terminal 20 and the wiring board 10 and the stress applied to the joint between the lead terminal 20 and the external circuit board are reduced, and the mounting reliability can be improved. Since the lead terminal 20 is bonded not only to the lower surface of the wiring board 10 but also to the side surface (side surface conductor 12), the bonding area can be increased even for a small lead terminal 20. Therefore, even if the lead terminal 20 is small on the small circuit board 100, the possibility that the lead terminal 20 is peeled off from the wiring board 10 can be reduced. As a result, the circuit board 100 can be obtained in which the electronic component 300 having a small size and excellent connection reliability can be obtained.

In the electronic component 300 of the example shown in FIGS. 1 and 2, the wiring board 10 has a flat insulating substrate 15. The electrode 201 of the electronic element 200 fixed to the upper surface of the wiring board 10 is electrically connected to the connection electrode 13 of the wiring board 10 by a bonding wire as the connection member 210. The lead terminal 20 has the same width from the joining end portion 21 to the connecting end portion 24. The width of the joining electrode 11 is larger than the width of (the joining end portion 21 of) the lead terminal 20 and longer than the length of the joining end portion 21 of the lead terminal 20. Then, a fillet portion of the meniscus-shaped brazing material 30 is formed from the side surface of the lead terminal 20 to the bonding electrode 11. Since the width and the length of the bonding electrode 11 are larger than the width and the length of the bonding end portion 21 of the lead terminal 20, the bonding strength of the lead terminal 20 to the bonding electrode 11 is higher.

In the electronic component 300 of the example shown in FIGS. 3 and 4, the insulating substrate 15 of the wiring board 10 has a recess 15a on the upper surface, and the electronic element 200 is mounted on the bottom of the recess 15a. Also in this example, the electrode 201 of the electronic element 200 is electrically connected to the connection electrode 13 of the wiring board 10 as a connection member 210 by a bonding wire. The side surface conductor 12 is in a form in which the conductor is embedded in the groove on the side surface of the insulating substrate 15. The width of the joining end portion 21 of the lead terminal 20 is larger than the portion from the extending portion 22 to the connecting end portion 24. The large width of the joining end portion 21 increases the joining area between the joining end portion 21 and the joining electrode 11 to increase the joining strength. Even if the width of the lead terminal 20 is increased over the entire length (total length) from the joining end portion 21 to the connecting end portion 24, the joining strength between the joining end portion 21 and the joining electrode 11 is increased. However, when the width of the curved portion 23 becomes large, the curved portion 23 becomes difficult to be deformed, and the function of alleviating the above-mentioned thermal stress deteriorates. Therefore, in the lead terminal 20, the width of the joint end portion 21 can be made larger than the width of the curved portion 23. Thereby, the bonding strength of the lead terminal 20 to the wiring board 10 can be increased without reducing the stress relaxation function of the curved portion 23. In this case as well, the width and length of the bonding electrode 11 can be made larger than the width and length of the bonding end portion 21.

In the electronic component 300 of the example shown in FIGS. 5 and 6, the insulating substrate 15 of the wiring board 10 has a recess 15a on the upper surface, and the electronic element 200 is mounted on the bottom of the recess 15a. In this example, the electrode 201 of the electronic element 200 is electrically connected to the connection electrode 13 of the wiring board 10 by using, for example, solder or a conductive adhesive as the connection member 210. While the grooves of the examples shown in FIGS. 3 and 4 are provided from the lower surface to the upper surface of the insulating substrate 15, the grooves of this example are provided only from the lower surface of the insulating substrate 15 to the middle in the thickness direction. Has not been done.

Further, while the width of the groove in the example shown in FIGS. 3 and 4 is about the same as the width of the lead terminal 20, the groove in this example has a width of (the joining end portion 21 of) the lead terminal 20. The width is about the same as the width of the larger bonding electrode 11. Furthermore, the side surface conductor 12 does not fill the groove, and is in the form of a film adhered to the inner surface of the groove. Then, as in the example shown in FIGS. 3 and 4, the width of the joining end portion 21 of the lead terminal 20 is larger than the width of the bending portion 23. Further, in this example, the width of the extending portion 22 on the joint end 21 side is also large and is the same as the width of the joint end 21. As described above, the lead terminal 20 may have a width from the joining end portion 21 to the extending portion 22 that is larger than the width of the bending portion 23. Since not only the joint strength between the joint end portion 21 and the joint electrode 11 but also the joint strength between the extending portion 22 and the side surface conductor 12 can be increased, the stress relaxation function of the curved portion 23 is not reduced and the lead terminal 20 of the lead terminal 20 is not reduced. The bonding strength to the wiring board 10 can be further increased. Further, since the radius of curvature of the fillet portion formed between the side surface conductor 12 and the upper surface of the extending portion 22 becomes large, it becomes easy to relax the stress in this portion.

Furthermore, in the lead terminals 20 of the examples shown in FIGS. 3 and 4, the width of the connection end portion 24 is larger than the width of the curved portion 23. As a result, the bonding strength of the lead terminal 20 to the external circuit board can be increased without reducing the stress relaxation function of the curved portion 23. Therefore, the circuit board 100 can obtain the electronic component 300 having high mounting reliability.

In the circuit board 100 of the example shown in FIGS. 1 to 6, the bonding electrode 11 and the side surface conductor 12 are connected. In the examples shown in FIGS. 1 and 2 and the examples shown in FIGS. 5 and 6, the bonding electrode 11 and the side surface conductor 12 are integrated and are continuous from the lower surface to the side surface of the insulating substrate 15. The bonding electrode 11 is a part of the wiring that constitutes the circuit in the wiring board 10, while the side surface conductor 12 is bonded to the lead terminal 20 (the extended portion 22 thereof) with the brazing material 30 to thereby form the wiring board 10. This is for improving the bonding strength between the lead terminal 20 and the lead terminal 20. Therefore, the bonding electrode 11 and the side surface conductor 12 do not necessarily have to be connected. The example shown in FIG. 7A is a form in which the bonding electrode 11 and the side surface conductor 12 of the examples shown in FIGS. 1 and 2 are separated. In the example shown in FIG. 7B, the side surface conductor 12 (groove) of the example shown in FIGS. 3 and 4 is formed only from the upper surface of the insulating substrate 15 to the middle in the thickness direction, and the bonding electrode 11 and the side surface conductor 12 are formed. It is a form in which and are divided. The example shown in FIG. 7C is a form in which the bonding electrode 11 and the side surface conductor 12 of the examples shown in FIGS. 5 and 6 are separated.

On the other hand, like the circuit board 100 of the example shown in FIGS. 1 to 6, the side surface conductor 12 can be the circuit board 100 electrically connected to the bonding electrode 11. As a result, the bonding area on the wiring board 10 side is increased and the bonding strength is increased. Further, since the electrode electrically connected to the outside of the wiring board 10 is composed of the side surface conductor 12 and the joint electrode 11, the brazing filler metal 30 is the wiring of the wiring board 10 (the joint electrode 11, the side surface conductor 12 and the connection electrode 13). ), the portion of the brazing material 30 which becomes the conductive path becomes large and the resistance becomes small. Therefore, as the circuit board 100, the resistance of the conductive path from the connection electrode 13 to the lead terminal 20 is small.

As in the example shown in FIGS. 1 to 7, the electronic component 300 includes the circuit board 100 and the electronic element 200 as described above. According to such an electronic component 300, since the bonding strength between the lead terminal 20 and the wiring (bonding electrode 11) on the wiring substrate 10 is excellent, the electronic component 300 becomes a highly reliable small electronic component.

The insulating substrate 15 of the wiring board 10 is a flat plate having a square shape (square shape or rectangular shape) in a plan view (top view). For example, each side has a rectangular shape with a length of 5 mm to 15 mm, and has a plate shape with a thickness of, for example, 1 mm to 3 mm. Here, the rectangular shape is meant to include not only a strict rectangular shape but also a shape with rounded corners or chamfered. The insulating substrate 15 is formed by stacking a plurality of insulating layers, for example. When the insulating substrate 15 has the concave portion 15a on the upper surface, the concave portion 15a has a rectangular shape with one side of 4 mm to 14 mm mm in plan view, and the depth from the upper surface can be 0.3 mm to 2.5 mm. When the side surface conductor 12 is arranged in the groove provided on the side surface, for example, the length in the thickness direction of the insulating substrate 15 is 0.3 mm to 3 mm, and the width is 0.3 mm to 0.8 mm, The maximum depth from the side surface can be 0.05 mm to 0.5 mm. The cross-sectional shape of the groove in the example shown in FIGS. 3 and 4 is a semicircle, and the cross-sectional shape of the groove in the example shown in FIGS. 5 and 6 is a semi-elliptical shape. Can be a polygon.

The insulating substrate 15 is formed of a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, or a mullite sintered body. Alternatively, it may be formed of a resin material such as an epoxy resin. If the insulating substrate 15 is made of, for example, an aluminum oxide sintered body, it can be manufactured as follows. First, a raw material powder such as aluminum oxide and silicon oxide is molded into a sheet shape together with an appropriate organic binder and an organic solvent to produce a square sheet-shaped ceramic green sheet. After that, the ceramic green sheets are cut into appropriate dimensions and formed into a plurality of laminated ceramic green sheets, and the laminated body is fired at a temperature of 1300° C. to 1600° C. to manufacture the insulating substrate 15. it can. Each of the plurality of fired ceramic green sheets becomes an insulating layer forming the insulating substrate 15. When the insulating substrate 15 has the concave portion 15a on the upper surface and has the groove on the side surface, the ceramic green sheet may be provided with a through hole corresponding to the shape of the concave portion 15a or the groove.

Wiring is provided on the insulating substrate 15. As described above, the wiring includes the connection electrode 13 provided on the mounting portion of the electronic element 200 on the upper surface, the bonding electrode 11 provided on the lower surface, and the internal wiring 14 connecting these inside the insulating substrate 15. .. In the example shown in FIGS. 2 and 4, the internal wiring 14 is a through conductor that penetrates the insulating substrate 15 (insulating layer). In the example shown in FIG. 6, the internal wiring 14 has a conductor layer between insulating layers and a through conductor penetrating the insulating layer.

The side surface conductor 12 is a film-shaped conductor provided on the side surface in the example shown in FIGS. 1 and 2. The side surface conductor 12 of the examples shown in FIGS. 3 and 4 is a conductor that fills the groove, and is a half of the through conductor. The side surface conductor 12 of the examples shown in FIGS. 5 and 6 is a film-shaped conductor which covers and covers the inner surface of the groove.

The wiring of the wiring board 10 and the side surface conductor 12 are formed of, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel or cobalt, or an alloy material containing these metal materials. ing. Such a metal material or the like is provided on the insulating substrate 15 as a metal layer such as a metallized layer or a plated layer.

When the conductor layers of the bonding electrode 11, the connection electrode 13 and the internal wiring 14 are, for example, a metallized layer of tungsten, a metal paste prepared by mixing tungsten powder with an organic solvent and an organic binder serves as an insulating layer. It can be formed by printing on the surface of the ceramic green sheet by a method such as a screen printing method, and then firing the ceramic green sheet at the same time. Further, the through conductor portion of the internal wiring 14, and the side surface conductor 12 as in the example shown in FIGS. 4 and 7B, have through holes previously formed in a ceramic green sheet to be an insulating layer. It can be formed by filling the through holes of the sheet with the above-mentioned metal paste by a method such as a screen printing method and simultaneously firing the same. The side surface conductor 12 as in the example shown in FIGS. 6 and 7C can be formed by applying a metal paste to the inner surface of the through hole. A metal paste may be applied to the inner surface of the through hole after stacking a plurality of ceramic green sheets. The side surface conductor 12 as in the example shown in FIGS. 2 and 7A can be formed by applying a metal paste to the side surface of the laminated body of the ceramic green sheets. The through holes of the ceramic green sheet can be formed by a method such as mechanical drilling or laser processing.

The exposed portions of the bonding electrode 11, the side surface conductor 12, the connection electrode 13 and the like on the outer surface are further coated with a plating layer such as nickel and gold on the above metallized layer by a method such as an electrolytic plating method or an electroless plating method. It may be one that has been created. This is to prevent corrosion of wiring and the like and to improve the wettability of the brazing material 30, that is, the bondability.

The lead terminal 20 is made of metal such as copper (Cu), copper alloy, iron-nickel-cobalt (Fe-Ni-Co) alloy, iron-nickel (Fe-Ni) alloy. When an Fe-Ni-Co alloy having a relatively small difference in thermal expansion from the insulating substrate 15 made of ceramic as described above is used, the thermal stress between them is small and the bonding strength is higher.

The lead terminal 20 has, for example, a thickness of 0.1 mm to 0.3 mm, a joint end portion 21 having a length of 1 mm to 5 mm, an extending portion 22 having a length of 0.4 mm to 2 mm, and a curved portion 23 having a length. The length of the connection end portion can be 0.4 mm to 2 mm and 0.7 mm to 3.5 mm. The width of the lead terminal 20 may be, for example, 0.3 mm to 0.8 mm for the curved portion 23, and 0.3 to 1.5 mm for the joint end portion 21, the extending portion 22, and the connection end portion 24. The width of the curved portion 23 is smaller than the widths of other parts. The curved portion 23 bends upward and curves outside the extending portion 22 and extends to the connecting end portion 24 below the extending portion 22. For the curved portion 23, for example, the height from the upper surface of the extending portion 22 to the apex is 0.4 mm to 2 mm, and the height from the upper surface of the connection end portion 24 to the apex is 1.4 mm to 3.5 mm. You can

The lead terminal 20 can be manufactured by punching the metal plate material with a die and bending and bending the metal plate material. It is also possible to perform bending and bending with a die press after processing into a plan view shape by etching. Alternatively, for example, a plurality of lead terminals 20 connected to each other at the connection end portions 24 may be produced, joined to the wiring board 10, and then separated.

In order to improve the wettability of the brazing material 30, a plating film of nickel or the like can be deposited on the surface of the lead terminal 20.

As the brazing material 30 for joining the lead terminal 20 to the wiring board 10, for example, tin-silver-copper (Sn-Ag-Cu) alloy solder, silver-copper (Ag-Cu) alloy solder, or the like can be used. .. By disposing the paste or preform of the brazing material 30 between the lead terminal 20 and the wiring board 10 (the joining end portion 21 and the side surface conductor 12 thereof) and heating, the lead terminal 20 is joined to the brazing material 30 at the joining end. The circuit board 100 may be joined to the portion 21 and the side surface conductor 12.

The electronic element 200 mounted on the circuit board 100 is a semiconductor integrated circuit element such as an IC (Integrated Circuit) or an LSI (Large-Scale Integrated Circuit), and an LED (Light Emitting Diode). Diode), PD (Photo Diode), CCD (Charged-Coupled Device), CMOS
(Complementary Metal-Oxide Semiconductor: Opto-semiconductor element such as Complementary Metal-Oxide Semiconductor), sensor element such as current sensor element or magnetic sensor element, micromachine in which minute electronic mechanical mechanism is formed on the surface of semiconductor substrate, so-called Various electronic elements such as MEMS (Micro electro mechanical systems) elements can be mentioned. Also, a plurality of electronic devices 200 may be mounted, and a plurality of types may be included.

The electrical connection between the electrode 201 of the electronic element 200 and the wiring (connection electrode 11) of the circuit board 100 is, as described above, the electrical connection by the wire bonding connection by the connecting member 210 such as the bonding wire, the solder ball or the metal. Electrical and mechanical connection can also be performed by so-called flip chip connection using a bump and a conductive adhesive as the connection member 210. In the case of flip chip connection, an underfill material can reinforce the mechanical connection. In the case of wire bonding connection, the mechanical connection (fixing) of the electronic element 200 to the circuit board 100 is performed by, for example, a low melting point brazing material or adhesive such as solder or, if necessary, electrical conductivity such as a conductive adhesive. It is performed by using a bonding material (not shown).

If the electronic element 200 is, for example, a semiconductor element such as a semiconductor integrated circuit element, various electric signals are exchanged between the electronic element 200 and the electronic circuit (not shown) included in the circuit board 100 and an external circuit board. Then, various processing such as calculation or storage is performed in the semiconductor element (electronic element 200). If the electronic element 200 is a sensor element such as an acceleration sensor element, a physical quantity such as acceleration detected by the sensor element (electronic element 200) is transmitted as an electric signal to the circuit board 100 and an external circuit board. This electric signal is transmitted to the electronic circuit of the circuit board 100 and an external circuit board or another electronic element (not shown) mounted on the circuit board 100 to control the electronic device on which the circuit board 100 is mounted. It is used for processing such as.

In the electronic component 300 of the example shown in FIGS. 1 to 6, the electronic element 200, the connection member 210, and the like are exposed, but the environmental resistance performance can be improved by covering and sealing with the sealing resin. When the wiring substrate 10 (the insulating substrate 15 thereof) has the recess 15a and the electronic element 200 and the connecting member 210 are housed in the recess as in the example shown in FIGS. 3 to 6, the recess 15a is closed. It is also possible to provide a lid to hermetically seal. When the wiring substrate 10 (of which the insulating substrate 15) is a flat plate like the example shown in FIGS. 1 and 2, the electronic element 200 and the connection member 210 are covered with a cap-like lid to hermetically seal them. You can As the lid, for example, one made of resin, metal, ceramics, glass or the like can be used, and can be selected according to the electronic element 200 to be mounted. The lid can be fixed to the upper surface of the wiring board 10 with a bonding material made of resin, glass, metal such as solder or brazing material. The lid and the bonding material can be selected according to the level of hermetic sealing. When a joining material made of a metal such as solder or a brazing material is used, a joining metal film may be provided on the upper surface of the insulating substrate 15 and can be formed in the same manner as the wiring.

10... Wiring substrate 11... Joining electrode 12... Side conductor 13... Connection electrode 14... Internal wiring 15... Insulating substrate 15a... Recess 20... Lead terminal 21... -Joint end portion 22... Extending portion 23... Curved portion 24... Connection end portion 30... Brazing material 100... Circuit board 200... Electronic element 201... Electrode 210 of electronic element ... Connection member 220... Sealing member 300... Electronic component

Claims (6)

A wiring board having an electronic element mounting portion on an upper surface, a bonding electrode on a lower surface, and a side surface conductor on a side surface;
A lead terminal joined to the joining electrode with a brazing material,
Is equipped with
The lead terminal has a joining end joined to the joining electrode, an extending portion extending outwardly from the joining end along the lower surface of the wiring board, and bending and bending upward outside the extending portion. And having a curved portion extending below the extending portion, and a connecting end portion extending outward from the outer end of the curved portion,
A circuit board in which the upper surface of the extending portion and the side surface conductor are joined by the brazing material. The circuit board according to claim 1, wherein the lead terminal has a width at the joint end portion larger than a width at the curved portion. The circuit board according to claim 1, wherein the lead terminal has a width from the joining end portion to the extending portion that is larger than a width of the curved portion. The said lead terminal is a circuit board in any one of Claim 1 thru|or 3 whose width of the said connection end part is larger than the width of the said curved part. The circuit board according to claim 1, wherein the side surface conductor is electrically connected to the bonding electrode. An electronic component comprising the circuit board according to claim 1, and an electronic element.

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