JP2015141933A - Wiring board and electronic device - Google Patents

Wiring board and electronic device Download PDF

Info

Publication number
JP2015141933A
JP2015141933A JP2014012501A JP2014012501A JP2015141933A JP 2015141933 A JP2015141933 A JP 2015141933A JP 2014012501 A JP2014012501 A JP 2014012501A JP 2014012501 A JP2014012501 A JP 2014012501A JP 2015141933 A JP2015141933 A JP 2015141933A
Authority
JP
Japan
Prior art keywords
insulating base
wiring board
external electrode
electronic device
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014012501A
Other languages
Japanese (ja)
Inventor
信伍 前畑
Shingo Maehata
信伍 前畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2014012501A priority Critical patent/JP2015141933A/en
Publication of JP2015141933A publication Critical patent/JP2015141933A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board and an electronic device capable of miniaturization.SOLUTION: A wiring board 1 includes: an insulation substrate 2 having a side surface; and an external electrode 3 provided from the side surface of the insulation substrate 2 to the lower surface. The external electrode 3 has a plurality of protrusions 3 protruding to the inside of the insulation substrate 2 in the thickness direction of the insulation substrate 2.

Description

本発明は、例えば電子部品が搭載される配線基板およびそれを用いた電子装置に関するものである。   The present invention relates to, for example, a wiring board on which electronic components are mounted and an electronic device using the wiring board.

従来、例えば半導体素子，センサ素子，容量素子または圧電振動子等の電子部品を搭載するために用いられる配線基板として一般的なものは、直方体状等の絶縁基体の主面（通常は上面）に電子部品の搭載部が設けられており、絶縁基体の側面から下面にかけて配線導体（外部電極）が設けられている。配線基板を含む電子装置をろう材によって外部回路基板に接合する場合、この外部電極が外部電極部分となる。   Conventionally, for example, a general wiring board used for mounting electronic components such as a semiconductor element, a sensor element, a capacitor element, or a piezoelectric vibrator is formed on the main surface (usually the upper surface) of an insulating base such as a rectangular parallelepiped. An electronic component mounting portion is provided, and a wiring conductor (external electrode) is provided from the side surface to the lower surface of the insulating base. When an electronic device including a wiring board is joined to an external circuit board by a brazing material, the external electrode becomes an external electrode portion.

特開平５−183066号公報Japanese Patent Laid-Open No. 5-183066

しかしながら、近年、電子装置への小型化の要求に伴い、絶縁基体に設けられる外部電極が小さくなってきており、電子装置を外部回路基板にろう材を介して実装した場合に、取り扱い時の外力等により、電子装置が外部回路基板から剥がれる方向の応力が発生すると、絶縁基体と外部電極との密着強度が小さく、外部電極が配線基板から剥がれる可能性が高くなっていた。   However, in recent years, with the demand for miniaturization of electronic devices, the external electrodes provided on the insulating base have become smaller, and when the electronic device is mounted on an external circuit board via a brazing material, external force during handling is reduced. For example, when a stress is generated in a direction in which the electronic device is peeled from the external circuit board, the adhesion strength between the insulating base and the external electrode is small, and the possibility that the external electrode is peeled off from the wiring board is high.

本発明の一つの態様による配線基板は、側面を有する絶縁基体と、該絶縁基体の前記側面から下面にかけて設けられた外部電極とを有し、該外部電極が前記絶縁基体の内部に突出している突出部を前記絶縁基体の厚み方向に複数有している。   A wiring board according to an aspect of the present invention includes an insulating base having a side surface and an external electrode provided from the side surface to the bottom surface of the insulating base, and the external electrode protrudes into the insulating base. A plurality of protrusions are provided in the thickness direction of the insulating base.

本発明の他の態様によれば、電子装置は、上記構成の配線基板と、配線基板に搭載された電子部品とを備えている。   According to another aspect of the present invention, an electronic device includes the wiring board having the above-described configuration and an electronic component mounted on the wiring board.

本発明の一つの態様による配線基板は、側面を有する絶縁基体と、絶縁基体の側面から下面にかけて設けられた外部電極とを有し、外部電極が絶縁基体の内部に突出している突出部を絶縁基体の厚み方向に複数有していることによって、取り扱い時の外力等により、電子装置が外部回路基板から剥がれる方向の応力が発生したとしても、絶縁基体の厚み方向に複数設けられ、絶縁基体の内部に突出している外部電極の突出部によって、取り扱い時の外力等により発生する応力が分散されて、外部電極が絶縁基体から剥がれにくいものとすることができる。   A wiring board according to one aspect of the present invention includes an insulating base having a side surface and an external electrode provided from the side surface to the bottom surface of the insulating base, and the external electrode insulates a protruding portion protruding inside the insulating base. By having a plurality in the thickness direction of the substrate, even if a stress in a direction in which the electronic device is peeled off from the external circuit board is generated due to an external force during handling, a plurality of devices are provided in the thickness direction of the insulation substrate. By the protruding portion of the external electrode protruding inside, the stress generated by an external force or the like during handling is dispersed, and the external electrode can be made difficult to peel off from the insulating substrate.

本発明の他の態様によれば、電子装置は、上記構成の配線基板を備えていることによって、小型化と高密度化が可能となる電子装置を提供することができる。   According to another aspect of the present invention, an electronic device can be provided with an electronic device that can be reduced in size and increased in density by including the wiring board configured as described above.

（ａ）は本発明の実施形態における配線基板を示す縦断面図であり、（ｂ）は、（ａ）の配線基板の一部を示す要部拡大斜視図であり、（ｃ）は（ａ）の配線基板の一部を示す要部拡大平面透視図である。(A) is a longitudinal cross-sectional view which shows the wiring board in embodiment of this invention, (b) is a principal part expansion perspective view which shows a part of wiring board of (a), (c) is (a) It is a principal part expansion plane perspective view which shows a part of wiring board of FIG. （ａ）は、本発明の実施形態における配線基板の他の例を示す縦断面図であり、（ｂ）、（ｃ）は、（ａ）の配線基板の一部を示す要部拡大平面透視図である。(A) is a longitudinal cross-sectional view which shows the other example of the wiring board in embodiment of this invention, (b), (c) is principal part expansion plane perspective which shows a part of wiring board of (a). FIG. （ａ）〜（ｃ）は、本発明の実施形態における配線基板の他の例の一部を示す要部拡大上面透視図である。(A)-(c) is a principal part expansion upper surface perspective view which shows a part of other example of the wiring board in embodiment of this invention. （ａ）、（ｂ）は、本発明の実施形態における配線基板の他の例の一部を示す要部拡大斜視図である。(A), (b) is a principal part expansion perspective view which shows a part of other example of the wiring board in embodiment of this invention.

以下、本発明の例示的な実施形態について図面を参照して説明する。   Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings.

図１〜４を参照して本発明の実施形態における電子装置について説明する。本実施形態における電子装置は、配線基板１と、配線基板１に搭載された電子部品11とを含んでいる。   An electronic device according to an embodiment of the present invention will be described with reference to FIGS. The electronic device according to the present embodiment includes a wiring board 1 and an electronic component 11 mounted on the wiring board 1.

配線基板１は、絶縁基体２と外部電極３とを有している。   The wiring board 1 has an insulating base 2 and external electrodes 3.

絶縁基体２は、側面を有している。   The insulating base 2 has a side surface.

絶縁基体２は、上面に半導体素子等の電子部品11を搭載するための搭載部を有し、例えば、酸化アルミニウム質焼結体，ムライト質焼結体，炭化珪素質焼結体，窒化アルミニウム質焼結体，窒化珪素質焼結体，ガラスセラミックス焼結体等の電気絶縁性セラミックスまたはフェライトの焼結体から成る略四角形の絶縁層を複数上下に積層して形成されている。なお、絶縁基体２が凹部を有し、凹部の底面に電子部品11を搭載するための搭載部を有するようにしてもよい。   The insulating base 2 has a mounting portion for mounting an electronic component 11 such as a semiconductor element on its upper surface. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride material It is formed by laminating a plurality of substantially rectangular insulating layers made of a sintered body of an electrically insulating ceramic such as a sintered body, a silicon nitride sintered body, a glass ceramic sintered body or a ferrite, or a sintered body of ferrite. Note that the insulating base 2 may have a recess and a mounting portion for mounting the electronic component 11 on the bottom surface of the recess.

絶縁基体２は、例えば酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウムの粉末に酸化珪素・酸化マグネシウム・酸化カルシウム等の焼結助剤を添加し、さらに適当な有機バインダ・溶剤等を添加混合して泥漿物を作るとともに、この泥漿物をドクターブレード法またはカレンダーロール法を採用することによってグリーンシート（生シート）とし、しかる後、このグリーンシートに適当な打ち抜き加工を施して略四角形状に加工するとともにこれを複数枚積層し、焼成することによって製作される。   If the insulating substrate 2 is made of, for example, an aluminum oxide sintered body, a sintering aid such as silicon oxide, magnesium oxide, or calcium oxide is added to the aluminum oxide powder, and an appropriate organic binder, solvent, etc. Is added to the mixture to make a mud, and the mud is made into a green sheet (raw sheet) by adopting the doctor blade method or the calender roll method, and then the green sheet is subjected to an appropriate punching process. It is manufactured by processing into a square shape and laminating and firing a plurality of these.

この絶縁基体２の側面から下面にかけて設けられた外部電極３が設けられており、また外部電極３に電気的に接続され、電子部品11が搭載される上面から側面、下面にかけて、ビアホール導体、スルーホール導体等の貫通導体を含む配線導体４が被着形成されている。外部電極３および配線導体４は、絶縁基体２が電気絶縁性セラミックスから成る場合には、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），金（Ａｕ），銀（Ａｇ）または銅（Ｃｕ）等のメタライズから成り、絶縁基体２用のセラミックグリーンシートに外部電極３および配線導体４用の導体ペーストをスクリーン印刷法等によって所定形状で印刷して、セラミックグリーンシートと同時に焼成することによって、絶縁基体２の所定位置に形成される。内部導体のうち、セラミックグリーンシートを厚み方向に貫通する貫通導体は、導体ペーストを印刷することによってセラミックグリーンシートに形成した貫通孔を充填しておけばよい。このような導体ペーストは、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），金（Ａｕ），銀（Ａｇ），銅（Ｃｕ）等の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基体２との接合強度を高めるために、ガラス、セラミックスを含んでいても構わない。なお、外部電極３は絶縁基体２の側面に設けた切り欠き部２ａの内面に設けられていてもよい。この場合、絶縁基体２の側面が切り欠き部２ａを含む構成となる。   An external electrode 3 provided from the side surface to the bottom surface of the insulating base 2 is provided, and is electrically connected to the external electrode 3 and from the top surface to the side surface and the bottom surface on which the electronic component 11 is mounted. A wiring conductor 4 including a through conductor such as a hole conductor is deposited. When the insulating base 2 is made of an electrically insulating ceramic, the external electrode 3 and the wiring conductor 4 are made of tungsten (W), molybdenum (Mo), manganese (Mn), gold (Au), silver (Ag) or copper ( Cu) and the like, and a conductive paste for the external electrode 3 and the wiring conductor 4 is printed on the ceramic green sheet for the insulating substrate 2 in a predetermined shape by a screen printing method or the like and fired simultaneously with the ceramic green sheet. The insulating base 2 is formed at a predetermined position. Of the internal conductors, the through conductor that penetrates the ceramic green sheet in the thickness direction may be filled with a through hole formed in the ceramic green sheet by printing a conductor paste. Such a conductive paste is kneaded by adding an appropriate solvent and binder to a metal powder such as tungsten (W), molybdenum (Mo), manganese (Mn), gold (Au), silver (Ag), copper (Cu). By adjusting the viscosity, it is adjusted to an appropriate viscosity. In order to increase the bonding strength with the insulating substrate 2, glass or ceramics may be included. The external electrode 3 may be provided on the inner surface of the notch 2a provided on the side surface of the insulating base 2. In this case, the side surface of the insulating substrate 2 includes the cutout portion 2a.

本実施形態の配線基板１においては、外部電極３は絶縁基体２の内部に突出している突出部３ａを絶縁基体２の厚み方向に複数有している。   In the wiring board 1 of the present embodiment, the external electrode 3 has a plurality of protruding portions 3 a protruding in the insulating base 2 in the thickness direction of the insulating base 2.

突条部が厚み方向に延びた形状のものであると、取り扱い時の外力等により、電子装置が外部回路基板から剥がれる方向の応力が発生した場合に、電子装置が外部回路基板から剥がれる方向の応力を分散させるものがなく、外部電極が配線基板から剥がれる可能性が高いものとなってしまうが、上述のように、外部電極３が絶縁基体２の内部に突出している突出部３ａを絶縁基体２の厚み方向に複数有していることによって、電子装置が外部回路基板に接合された例えば電子モジュールの取り扱い時の外力等により、電子装置が外部回路基板から剥がれる方向の応力が発生したとしても、絶縁基体２の厚み方向に複数設けられ、絶縁基体２の内部に突出している外部電極３の突出部３ａによって、取り扱い時の外力等により発生する応力が分散されて、外部電極３が絶縁基体２から剥がれにくいものとすることができる。   If the protruding portion has a shape extending in the thickness direction, when the stress in the direction in which the electronic device is peeled off from the external circuit board is generated due to external force during handling, the electronic device is peeled off from the external circuit board. There is nothing to disperse the stress, and there is a high possibility that the external electrode will be peeled off from the wiring board. However, as described above, the protruding portion 3a in which the external electrode 3 protrudes into the insulating base 2 is used as the insulating base. Even if stress is generated in the direction in which the electronic device is peeled off from the external circuit board due to, for example, external force when the electronic device is bonded to the external circuit board, for example, when the electronic apparatus is bonded to the external circuit board. A plurality of protrusions 3a of the external electrode 3 provided in the thickness direction of the insulating base 2 and protruding inside the insulating base 2 can reduce stress generated by external force during handling. Has been, external electrodes 3 can be made difficult to peel off from the insulating base 2.

なお、突出部３ａは絶縁基体２の側面から50μｍ以上の長さを内部に突出させていると、取り扱い時の外力等により、電子装置が外部回路基板から剥がれる方向の応力が発生したとしても、絶縁基体２の厚み方向に複数設けられ、絶縁基体２の内部に絶縁基体２の側面から50μｍ以上の長さを突出させている外部電極３の突出部３ａによって、取り扱い時の外力等により発生する応力が効果的に分散されて、外部電極３が絶縁基体２から剥がれるのを抑制されたものとすることができる。   Note that if the protruding portion 3a has a length of 50 μm or more protruding from the side surface of the insulating base 2 to the inside, even if stress is generated in the direction in which the electronic device is peeled off from the external circuit board due to external force during handling, etc. A plurality of protrusions 3a are provided in the thickness direction of the insulating base 2 and protrude from the side surface of the insulating base 2 by a length of 50 μm or more to the inside of the insulating base 2 due to an external force during handling. The stress can be effectively dispersed to prevent the external electrode 3 from being peeled off from the insulating base 2.

また、図２に示すように、複数の突出部３ａは、絶縁基体２の側面から内部方向に延びた形状の第１の突出部３ａａと絶縁基体２の側面に沿った方向に延びた形状の第２の突出部３ａｂを含んでいてもよい。配線基板１をこのような構成とすることによって、取り扱い時の外力等により、電子装置に絶縁基体２の上面または下面に沿った方向の応力が発生したとしても、取り扱い時の外力等により発生する応力が、絶縁基体２の側面から内部方向に延びた形状の第１の突出部３ａａと絶縁基体２の側面に沿った方向に延びた形状の第２の突出部３ａｂとで効率よく分散されて、外部電極３が絶縁基体２から剥がれるのを効果的に抑制することができる。また、例えば配線導体４の配置により突出部３ａを設ける箇所に制限があったとしても、絶縁基体２の側面から内部方向に延びた形状の第１の突出部３ａａと絶縁基体２の側面に沿った方向に延びた形状の第２の突出部３ａｂを用いることにより、配線導体４の配置を妨げることなく、外部電極３が絶縁基体２から剥がれにくいものとすることができる。なお、第１の突出部３ａａおよび第２の突出部３ａｂは、図２（ｂ）に示すように方形状であってもよいし、図２（ｃ）に示すように半長円状であってもよい。第１の突出部３ａａおよび第２の突出部３ａｂが半長円状の場合は、第１の突出部３ａａおよび第２の突出部３ａｂの絶縁基体２の内部に位置する部分に角がなく、配線導体４の配置をより妨げにくいものとなり、好ましい。   Further, as shown in FIG. 2, the plurality of projecting portions 3 a have a first projecting portion 3 aa extending in the inner direction from the side surface of the insulating base 2 and a shape extending in the direction along the side surface of the insulating base 2. The second protrusion 3ab may be included. By configuring the wiring board 1 in such a configuration, even if a stress in a direction along the upper surface or the lower surface of the insulating base 2 is generated in the electronic device due to an external force or the like during handling, it is generated due to the external force or the like during handling. The stress is efficiently dispersed between the first protrusion 3aa having a shape extending inward from the side surface of the insulating base 2 and the second protrusion 3ab having a shape extending in the direction along the side face of the insulating base 2. The external electrode 3 can be effectively prevented from peeling off from the insulating base 2. For example, even if there is a restriction on the location where the protruding portion 3a is provided due to the arrangement of the wiring conductor 4, the first protruding portion 3aa having a shape extending inward from the side surface of the insulating base 2 and the side surface of the insulating base 2 are provided. By using the second projecting portion 3ab having a shape extending in the vertical direction, the external electrode 3 can be hardly peeled off from the insulating base 2 without hindering the arrangement of the wiring conductor 4. The first projecting portion 3aa and the second projecting portion 3ab may have a rectangular shape as shown in FIG. 2 (b) or a semi-oval shape as shown in FIG. 2 (c). May be. When the first projecting portion 3aa and the second projecting portion 3ab are semi-elliptical, there is no corner in the portion of the first projecting portion 3aa and the second projecting portion 3ab located inside the insulating base 2, This is preferable because the arrangement of the wiring conductor 4 is less likely to be hindered.

また、図３（ａ）に示すように、複数の突出部３ａは、絶縁基体２の側面から内部方向に延びた形状の第１の突出部３ａａ（長さＬ２）を有してもよい。配線基板１をこのような構成とすることによって、例えば配線導体４の配置により、突出部３ａの長さを長くできない等突出部３ａを設ける箇所に制限があったとしても、他の箇所に長さの長い突出部３ａが設けられるため、絶縁基体２と各突出部３ａとが密着している面積全体を大きいものとすることができるため、絶縁基体２と突出部３ａを含む外部電極３との密着強度が大きいものとなり、外部電極３が絶縁基体２から剥がれるのを効果的に抑制することができる。   As shown in FIG. 3A, the plurality of protrusions 3 a may have first protrusions 3 aa (length L <b> 2) having a shape extending inward from the side surface of the insulating base 2. By configuring the wiring board 1 in such a configuration, even if there is a restriction on the location where the protruding portion 3a cannot be increased due to, for example, the arrangement of the wiring conductor 4, the length of the other portion is long. Since the long projecting portion 3a is provided, the entire area where the insulating base 2 and each projecting portion 3a are in close contact with each other can be increased. Therefore, the external electrode 3 including the insulating base 2 and the projecting portion 3a Therefore, it is possible to effectively prevent the external electrode 3 from being peeled off from the insulating base 2.

また、図３（ｂ）に示すように、複数の突出部３ａは、絶縁基体２の側面に沿った方向に延びた形状の第２の突出部３ａｂ（長さＷ２）を有してもよい。配線基板１をこのような構成とすることによって、例えば配線導体４の配置により、突出部３ａの絶縁基体２の
外縁に沿った方向の長さを長くできない等突出部３ａを設ける箇所に制限があったとしても、他の箇所に絶縁基体２の外縁に沿った方向の長さの長い突出部３ａが設けられるため、取り扱い時の外力等により、電子装置に絶縁基体２の外縁に沿った方向の応力が発生したとしても、取り扱い時の外力等により発生する応力の方向では、絶縁基体２と突出部３ａとが密着している部分が長いものとなり、絶縁基体２と突出部３ａを含む外部電極３との密着強度が大きいものとなって、外部電極３が絶縁基体２から剥がれるのを効果的に抑制することができる。また、突出部３ａの絶縁基体２の内部方向の長さが短くても、絶縁基体２の側面に沿った方向に延びた形状の第２の突出部３ａｂを有しているため、絶縁基体２と突出部３ａとが密着している面積が大きいものとなり、絶縁基体２と突出部３ａを含む外部電極３との密着強度が大きいものとなって、外部電極３が絶縁基体２から剥がれるのを効果的に抑制することができる。 Further, as shown in FIG. 3B, the plurality of protrusions 3a may have a second protrusion 3ab (length W2) having a shape extending in a direction along the side surface of the insulating base 2. . By configuring the wiring board 1 in such a configuration, for example, due to the arrangement of the wiring conductor 4, there is a restriction on the location where the protruding portion 3 a is provided such that the length of the protruding portion 3 a in the direction along the outer edge of the insulating base 2 cannot be increased. Even if it exists, since the projection part 3a having a long length in the direction along the outer edge of the insulating base 2 is provided at another place, the direction along the outer edge of the insulating base 2 is caused in the electronic device by an external force during handling. In the direction of the stress generated by an external force or the like during handling, the portion where the insulating base 2 and the protruding portion 3a are in close contact with each other is long, and the outside including the insulating base 2 and the protruding portion 3a It is possible to effectively prevent the external electrode 3 from being peeled off from the insulating base 2 due to the high adhesion strength with the electrode 3. Even if the length of the protruding portion 3a in the inner direction of the insulating base 2 is short, the insulating base 2 has the second protruding portion 3ab extending in the direction along the side surface of the insulating base 2. And the protruding portion 3a are in close contact with each other, the adhesion strength between the insulating substrate 2 and the external electrode 3 including the protruding portion 3a is increased, and the external electrode 3 is peeled off from the insulating substrate 2. It can be effectively suppressed.

また、図３（ｃ）に示すように、外部電極３は、絶縁基体２の内部に突出している突出部３ａを絶縁基体２の外縁に沿った方向にも複数有していてもよい。配線基板１をこのような構成とすることによって、取り扱い時の外力等により、電子装置に絶縁基体２の外縁に沿った方向の応力が発生したとしても、絶縁基体２の外縁に沿った方向にも複数設けられ、絶縁基体２の内部に突出している外部電極３の突出部３ａによって、取り扱い時の外力等により発生する応力が分散されて、外部電極３が絶縁基体２から剥がれにくいものとすることができる。   Further, as shown in FIG. 3C, the external electrode 3 may have a plurality of protruding portions 3 a protruding inside the insulating base 2 in the direction along the outer edge of the insulating base 2. By configuring the wiring board 1 as described above, even if a stress in the direction along the outer edge of the insulating base 2 is generated in the electronic device due to an external force during handling, the wiring board 1 is moved in the direction along the outer edge of the insulating base 2. Also, a plurality of protrusions 3a of the external electrode 3 protruding inside the insulating base 2 are used to disperse the stress generated by external force during handling and the external electrode 3 is difficult to peel off from the insulating base 2. be able to.

また、図４に示すように、外部電極３は、絶縁基体２に設けた切り欠き部２ａの内面に設けられていてもよい。配線基板１をこのような構成とすることによって、絶縁基体２と外部電極３とが密着している面積を大きいものとすることができるため、絶縁基体２と外部電極３との密着強度が大きいものとなり、外部電極３が絶縁基体２から剥がれるのを効果的に抑制することができる。なお、切り欠き部２ａは、図４（ａ）に示すように絶縁基体２の下面から側面途中まで設けられ、上面を貫通しない形状であってもよいし、図４（ｂ）に示すように絶縁基体２の上面から下面を貫通する形状であってもよい。切り欠き部２ａが絶縁基体２の下面から側面途中まで設けられ、上面を貫通せず、絶縁基体２の上面を同じサイズの方形状とすると、電子部品11の搭載部をより大きいものとすることが可能となり、好ましい。また、取り扱い時に外力が加わっても、外力による応力が絶縁基体２の上面側で分散し、切り欠き部２ａの内面に設けた外部電極３が欠け等のないものとなり、好ましい。   As shown in FIG. 4, the external electrode 3 may be provided on the inner surface of the notch 2 a provided in the insulating base 2. By configuring the wiring board 1 in such a configuration, the area where the insulating base 2 and the external electrode 3 are in close contact with each other can be increased, so that the adhesive strength between the insulating base 2 and the external electrode 3 is high. As a result, the external electrode 3 can be effectively prevented from being peeled off from the insulating substrate 2. In addition, the notch 2a may be provided from the lower surface to the middle of the side surface of the insulating base 2 as shown in FIG. 4A, and may have a shape that does not penetrate the upper surface, or as shown in FIG. 4B. The insulating base 2 may have a shape penetrating from the upper surface to the lower surface. If the cutout portion 2a is provided from the lower surface of the insulating base 2 to the middle of the side surface, does not penetrate the upper surface, and the upper surface of the insulating base 2 has a rectangular shape of the same size, the mounting portion of the electronic component 11 is made larger. Is possible and preferable. Further, even when an external force is applied during handling, the stress due to the external force is dispersed on the upper surface side of the insulating base 2, and the external electrode 3 provided on the inner surface of the cutout portion 2a is preferably not chipped.

なお、電子部品11は、配線基板１の上面に搭載されている。電子部品11の搭載方法は、はんだによる接続、フリップチップ接続、ワイヤボンディング等であり、図１においてははんだによる接続構造が示されている。   The electronic component 11 is mounted on the upper surface of the wiring board 1. The electronic component 11 is mounted by solder connection, flip chip connection, wire bonding, or the like. FIG. 1 shows a solder connection structure.

次に、本実施形態の配線基板１の製造方法について説明する。   Next, the manufacturing method of the wiring board 1 of this embodiment is demonstrated.

絶縁基体２は、例えば酸化アルミニウム（Ａｌ２Ｏ３）質焼結体からなり、その上面に電子部品11が搭載される搭載部を有している。この絶縁基体２は、主成分が酸化アルミニウム（Ａｌ２Ｏ３）である酸化アルミニウム質焼結体から成る場合、Ａｌ２Ｏ３の粉末に焼結助材としてシリカ（ＳｉＯ２），マグネシア（ＭｇＯ），カルシア（ＣａＯ）等の粉末を添加し、さらに適当なバインダ、溶剤および可塑剤を添加し、次にこれらの混合物を混錬してスラリー状となす。その後、従来周知のドクターブレード法等の成形方法によって多数個取り用のセラミックグリーンシートを得る。 The insulating base 2 is made of, for example, an aluminum oxide (Al 2 O 3 ) -based sintered body, and has a mounting portion on which the electronic component 11 is mounted. When the insulating base 2 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al 2 O 3 ), silica (SiO 2 ), magnesia (MgO) is used as a sintering aid for Al 2 O 3 powder. ), Calcia (CaO), etc. are added, and an appropriate binder, solvent and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for obtaining a large number of pieces is obtained by a conventionally known molding method such as a doctor blade method.

このセラミックグリーンシートを用いて、以下の（１）〜（５）の工程により配線基板１が作製される。   Using this ceramic green sheet, the wiring substrate 1 is manufactured by the following steps (1) to (5).

（１）突出部３ａとなる部位、必要に応じて凹部となる部位、切り欠き部２ａとなる部位の打ち抜き金型を用いた打ち抜き工程。   (1) A punching process using a punching die for a portion that becomes the protruding portion 3a, a portion that becomes a concave portion if necessary, and a portion that becomes the notched portion 2a.

（２）絶縁基体２の側面となる部位、切り欠き部２ａとなる部位に形成される外部電極３、外部電極３に接続され、絶縁基体２の内部、上面、側面、下面となる部位に内部導体や貫通導体を含む配線導体４をそれぞれ形成するための導体ペーストの印刷塗布および充填工程。   (2) Connected to the external electrode 3 and the external electrode 3 formed on the side surface of the insulating base 2 and the portion serving as the notch 2a, and inside the insulating base 2 and on the top, side, and bottom surfaces. Print application and filling process of conductor paste for forming wiring conductors 4 including conductors and through conductors, respectively.

（３）各絶縁層となるセラミックグリーンシートを積層してセラミックグリーンシート積層体を作製する工程。   (3) The process of producing the ceramic green sheet laminated body by laminating | stacking the ceramic green sheet used as each insulating layer.

（４）このセラミックグリーンシート積層体を約1500〜1800℃の温度で焼成して、各外部電極３および配線導体４を有する絶縁基体２が複数配列された多数個取り基板を得る工程。   (4) A step of firing the ceramic green sheet laminate at a temperature of about 1500 to 1800 ° C. to obtain a multi-piece substrate in which a plurality of insulating bases 2 each having external electrodes 3 and wiring conductors 4 are arranged.

（５）焼成して得られた多数個取り基板に配線基板１の外縁となる箇所に沿って分割溝を形成しておき、この分割溝に沿って破断させて分割する方法、またはスライシング法等により配線基板１の外縁となる箇所に沿って切断する方法等を用いることができる。なお、分割溝は、焼成後にスライシング装置により多数個取り基板の厚みより小さく切り込むことによって形成することができるが、多数個取り基板用のセラミックグリーンシート積層体にカッター刃を押し当てたり、スライシング装置によりセラミックグリーンシート積層体の厚みより小さく切り込んだりすることによって形成してもよい。   (5) A method in which a dividing groove is formed along a portion serving as the outer edge of the wiring substrate 1 on the multi-piece substrate obtained by firing, and a method of dividing by dividing along the dividing groove, a slicing method, or the like Thus, it is possible to use a method of cutting along a portion that becomes the outer edge of the wiring board 1. The dividing groove can be formed by cutting the multi-cavity substrate smaller than the thickness of the multi-piece substrate after firing, but the cutter blade can be pressed against the ceramic green sheet laminate for the multi-piece substrate, or the slicing device May be formed by cutting smaller than the thickness of the ceramic green sheet laminate.

上述の（２）の工程において、外部電極３は、絶縁基体２用のセラミックグリーンシートに導体ペーストをスクリーン印刷法等によって所定形状で印刷して、絶縁基体２用のセラミックグリーンシートと同時に焼成することによって、複数の絶縁基体２のそれぞれの所定位置に形成される。このような導体ペーストは、タングステン，モリブデン，マンガン，銀または銅等の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、導体ペーストは、絶縁基体２との接合強度を高めるために、ガラス、セラミックスを含んでいても構わない。また、外部電極３は、導体ペーストをセラミックグリーンシートに印刷することによって形成される貫通導体または金属層であっても構わない。   In the above-described step (2), the external electrode 3 is printed with a conductive paste on the ceramic green sheet for the insulating substrate 2 in a predetermined shape by screen printing or the like, and fired simultaneously with the ceramic green sheet for the insulating substrate 2. Thus, the plurality of insulating bases 2 are formed at predetermined positions. Such a conductive paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and a binder to a metal powder such as tungsten, molybdenum, manganese, silver or copper and kneading them. The conductor paste may contain glass or ceramics in order to increase the bonding strength with the insulating substrate 2. The external electrode 3 may be a through conductor or a metal layer formed by printing a conductor paste on a ceramic green sheet.

また、配線導体４は、外部電極３と同様のメタライズから成り、絶縁基体２用のセラミックグリーンシートに配線導体４用の導体ペーストをスクリーン印刷法等によって所定形状で印刷して、セラミックグリーンシートと同時に焼成することによって、絶縁基体２の所定位置に形成される。配線導体４のうち、セラミックグリーンシートを厚み方向に貫通する貫通導体は、導体ペーストを印刷することによってセラミックグリーンシートに形成した貫通孔を充填しておけばよい。このような導体ペーストは、外部電極３に用いた金属ペーストと同様の方法により作製される。   The wiring conductor 4 is made of the same metallization as that of the external electrode 3, and a conductive paste for the wiring conductor 4 is printed on the ceramic green sheet for the insulating substrate 2 in a predetermined shape by a screen printing method or the like. By firing at the same time, the insulating base 2 is formed at a predetermined position. Of the wiring conductors 4, the through conductors that penetrate the ceramic green sheet in the thickness direction may be filled with through holes formed in the ceramic green sheet by printing a conductor paste. Such a conductor paste is produced by the same method as the metal paste used for the external electrode 3.

また、絶縁基体２の表面に露出した外部電極３、配線導体４を保護して酸化防止をするために、外部電極３、配線導体４の露出した表面に、厚さ0.5〜10μｍのＮｉめっき層を
被着させるか、またはこのＮｉめっき層および厚さ0.5〜３μｍの金（Ａｕ）めっき層を
順次被着させるのがよい。 Further, in order to protect the external electrode 3 and the wiring conductor 4 exposed on the surface of the insulating base 2 and prevent oxidation, an Ni plating layer having a thickness of 0.5 to 10 μm is formed on the exposed surface of the external electrode 3 and the wiring conductor 4. The Ni plating layer and the gold (Au) plating layer having a thickness of 0.5 to 3 μm may be sequentially applied.

このようにして形成された配線基板１に、電子部品11が搭載部上に搭載された電子装置を外部回路基板にはんだ等のろう材を介して搭載することで、電子部品11が配線導体４、外部電極３を介して外部回路基板に電気的に接続される。電子部品11は例えば、半導体素子，センサ素子，容量素子または圧電振動子等である。なお、電子部品11の各電極は、は
んだ12、金バンプ、ボンディングワイヤ等の接続端子等により配線基板１の配線導体４に電気的に接続されている。 By mounting the electronic device on which the electronic component 11 is mounted on the mounting portion on the wiring board 1 formed in this way, the electronic component 11 is connected to the wiring conductor 4 by using a soldering material such as solder on the external circuit board. And electrically connected to the external circuit board via the external electrode 3. The electronic component 11 is, for example, a semiconductor element, a sensor element, a capacitive element, a piezoelectric vibrator, or the like. Each electrode of the electronic component 11 is electrically connected to the wiring conductor 4 of the wiring substrate 1 by connection terminals such as solder 12, gold bumps, and bonding wires.

また、電子装置は、上述のはんだ等のろう材を用いる代わりに導電性樹脂から成る接合部材を用いて、外部電極３と外部回路基板の電極パッドとを接続させても構わない。また、異方性導電樹脂等の接合部材を外部回路基板上に配置した後圧着させることで、配線基板１の外部電極３と外部回路基板の電極パッドとを電気的に接続させるとともに、異方性導電樹脂等の接合部材を配線基板１と外部回路基板との間に設けるようにしてもよい。この場合、製造工程が簡略化できるとともに、配線基板１の外部電極３と外部回路基板の電極パッドとの接続のための接合部材と、配線基板１と外部回路基板との間に設ける接合部材とが同一の材料となり、配線基板１と外部回路基板との接合箇所全体における接合強度を均一にすることができるため、電子装置に外力が加わったとしても、外力が局所的に集中しにくいものとなり、応力が分散されやすくなるため、好ましい。   Further, the electronic device may connect the external electrode 3 and the electrode pad of the external circuit board by using a joining member made of a conductive resin instead of using the brazing material such as the solder described above. In addition, the bonding member such as anisotropic conductive resin is placed on the external circuit board and then crimped to electrically connect the external electrode 3 of the wiring board 1 and the electrode pad of the external circuit board. A bonding member such as a conductive conductive resin may be provided between the wiring board 1 and the external circuit board. In this case, the manufacturing process can be simplified, a bonding member for connecting the external electrode 3 of the wiring board 1 and the electrode pad of the external circuit board, a bonding member provided between the wiring board 1 and the external circuit board, Are made of the same material, and the bonding strength at the entire bonding portion between the wiring board 1 and the external circuit board can be made uniform, so that even if an external force is applied to the electronic device, the external force is not easily concentrated locally. , Because stress is easily dispersed.

本実施形態の配線基板１は、側面を有する絶縁基体２と、絶縁基体２の側面から下面にかけて設けられた外部電極３とを有し、外部電極３が絶縁基体２の内部に突出している突出部３ａを絶縁基体２の厚み方向に複数有している。これにより、取り扱い時の外力等により、電子装置が外部回路基板から剥がれる方向の応力が発生したとしても、絶縁基体２の厚み方向に複数設けられ、絶縁基体２の内部に突出している外部電極の突出部３ａによって、取り扱い時の外力等により発生する応力が分散されて、外部電極３が絶縁基体２から剥がれにくいものとすることができる。   The wiring board 1 of the present embodiment has an insulating base 2 having side surfaces and an external electrode 3 provided from the side surface to the lower surface of the insulating base 2, and the external electrode 3 protrudes into the insulating base 2. A plurality of portions 3 a are provided in the thickness direction of the insulating base 2. As a result, even if a stress is generated in the direction in which the electronic device is peeled off from the external circuit board due to an external force or the like during handling, a plurality of external electrodes provided in the thickness direction of the insulating base 2 and protruding inside the insulating base 2 The projecting portion 3a disperses the stress generated by an external force or the like during handling, and the external electrode 3 can be made difficult to peel off from the insulating substrate 2.

本発明の他の態様によれば、電子装置は、上記構成の配線基板１を有していることによって、小型化と高密度化が可能となる。   According to another aspect of the present invention, the electronic device includes the wiring board 1 having the above-described configuration, thereby enabling downsizing and high density.

１・・・・・配線基板
２・・・・・絶縁基体
３・・・・・外部電極
３ａ・・・・突出部
３ａａ・・・第１の突出部
３ａｂ・・・第２の突出部
11・・・・・電子部品
12・・・・・はんだ DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Insulation base | substrate 3 ... External electrode 3a ... Projection part 3aa ... 1st projection part 3ab ... 2nd projection part
11 ・ ・ ・ ・ ・ Electronic parts
12 ... Solder

Claims (3)

側面を有する絶縁基体と、
該絶縁基体の前記側面から下面にかけて設けられた外部電極とを備え、
前記外部電極が前記絶縁基体の内部に突出している突出部を前記絶縁基体の厚み方向に複数有していることを特徴とする配線基板。 An insulating substrate having side surfaces;
An external electrode provided from the side surface to the lower surface of the insulating base,
A wiring board comprising a plurality of projecting portions in which the external electrode projects into the insulating base in the thickness direction of the insulating base. 複数の前記突出部は、前記絶縁基体の側面から内部方向に延びた形状の第１の突出部と前記絶縁基体の側面に沿った方向に延びた形状の第２の突出部を含んでいることを特徴とする請求項１に記載の配線基板。   The plurality of protrusions include a first protrusion having a shape extending inward from a side surface of the insulating base and a second protrusion having a shape extending in a direction along the side surface of the insulating base. The wiring board according to claim 1. 請求項１に記載された配線基板と、
該配線基板に搭載された電子部品とを備えていることを特徴とする電子装置。 A wiring board according to claim 1;
An electronic device comprising: an electronic component mounted on the wiring board.
JP2014012501A 2014-01-27 2014-01-27 Wiring board and electronic device Pending JP2015141933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014012501A JP2015141933A (en) 2014-01-27 2014-01-27 Wiring board and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014012501A JP2015141933A (en) 2014-01-27 2014-01-27 Wiring board and electronic device

Publications (1)

Publication Number Publication Date
JP2015141933A true JP2015141933A (en) 2015-08-03

Family

ID=53772133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014012501A Pending JP2015141933A (en) 2014-01-27 2014-01-27 Wiring board and electronic device

Country Status (1)

Country Link
JP (1) JP2015141933A (en)

Similar Documents

Publication Publication Date Title
JP5823043B2 (en) Electronic device mounting substrate, electronic device, and imaging module
JP6096812B2 (en) Electronic device mounting package, electronic device and imaging module
JP5734434B2 (en) Wiring board, electronic device and electronic module
JP6140834B2 (en) Wiring board and electronic device
JP6151572B2 (en) Electronic device mounting substrate and electronic device
JP6039311B2 (en) Wiring board, electronic device and electronic module
JP6408423B2 (en) Package and electronic equipment
JPWO2017188253A1 (en) Electronic component mounting substrate, electronic device and electronic module
JP2007173629A (en) Package for housing electronic part and electronic equipment
JP6121860B2 (en) Wiring board and electronic device
JP5956185B2 (en) Multiple wiring board
JP2004288660A (en) Wiring board
JP2017063093A (en) Wiring board, electronic device, and electronic module
JP2015141933A (en) Wiring board and electronic device
JP6258679B2 (en) Wiring board and electronic device
WO2014046133A1 (en) Package for accommodating electronic part, and electronic device
JP6174327B2 (en) Electronic device mounting substrate and electronic device
JP4986500B2 (en) Laminated substrate, electronic device and manufacturing method thereof.
JP6189755B2 (en) Wiring board and electronic device
JP4791313B2 (en) Wiring board and electronic device
JP2004281470A (en) Wiring board
JP2014007292A (en) Electronic component housing package and electronic device
JP3801935B2 (en) Electronic component mounting board
JP6441696B2 (en) Wiring board, electronic device and electronic module
JP6017994B2 (en) Electronic device mounting substrate and electronic device