JP6441696B2 - Wiring board, electronic device and electronic module - Google Patents

Wiring board, electronic device and electronic module Download PDF

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JP6441696B2
JP6441696B2 JP2015015634A JP2015015634A JP6441696B2 JP 6441696 B2 JP6441696 B2 JP 6441696B2 JP 2015015634 A JP2015015634 A JP 2015015634A JP 2015015634 A JP2015015634 A JP 2015015634A JP 6441696 B2 JP6441696 B2 JP 6441696B2
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insulating substrate
wiring board
electronic device
main surface
external circuit
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JP2016139770A (en
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光幸 小松
光幸 小松
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

本発明は、半導体素子または発光素子等の電子部品を搭載するための配線基板、電子装置および電子モジュールに関するものである。   The present invention relates to a wiring board, an electronic device, and an electronic module for mounting an electronic component such as a semiconductor element or a light emitting element.

従来、電子部品が搭載されて電子装置に組み込まれる配線基板は、電子部品の搭載領域を含む主面を有する絶縁基板と、絶縁基板の主面に平面視で隣り合うようにして複数設けられた端子電極と、絶縁基板の主面および内部に端子電極と接続される配線導体とを有している。   2. Description of the Related Art Conventionally, a plurality of wiring boards on which electronic components are mounted and incorporated into an electronic device have been provided in plural so as to be adjacent to the main surface of the insulating substrate in plan view, and the insulating substrate having a main surface including a mounting area for the electronic components. It has a terminal electrode and a wiring conductor connected to the terminal electrode on the main surface and inside of the insulating substrate.

特開2001−168511号公報Japanese Patent Laid-Open No. 2001-168511

しかしながら、電子装置の高機能化に伴い、配線基板の大型化、高放熱化が進んできている。長期間繰り返し使用していると、配線基板と外部回路基板とが剥がれてしまいやすくなることが懸念される。   However, with the increase in functionality of electronic devices, the size of wiring boards and the increase in heat dissipation have been advanced. When used repeatedly for a long period of time, there is a concern that the wiring board and the external circuit board may be easily peeled off.

本発明の一つの態様による配線基板は、絶縁基板と、該絶縁基板の主面に平面視で隣り合うようにして複数設けられた端子電極とを有しており、前記絶縁基板の主面には、前記端子電極の間に、平面視で細長い形状の凹部が、長手方向が不規則な方向となるように設けられており、不連続な曲線となっている。
A wiring board according to one aspect of the present invention includes an insulating substrate and a plurality of terminal electrodes provided adjacent to the main surface of the insulating substrate in plan view, and the main surface of the insulating substrate is provided on the main surface of the insulating substrate. Is provided with an elongated concave portion in plan view between the terminal electrodes so that the longitudinal direction is an irregular direction, and has a discontinuous curve .

本発明の他の態様による電子装置は、上記構成の配線基板と、配線基板に搭載された電子部品とを有している。   An electronic device according to another aspect of the present invention includes a wiring board having the above configuration and an electronic component mounted on the wiring board.

本発明の他の態様による電子モジュールは、上記の電子装置と、端子電極と接続される外部回路基板と、電子装置と外部回路基板との間に、繊維状の凹部に充填するように配置された接合補強材とを有する。   An electronic module according to another aspect of the present invention is disposed so as to fill a fibrous recess between the electronic device described above, an external circuit board connected to a terminal electrode, and the electronic device and the external circuit board. And a joining reinforcing material.

本発明の一つの態様による配線基板によれば、絶縁基板と、絶縁基板の主面に平面視で隣り合うようにして複数設けられた端子電極とを有しており、絶縁基板の主面には、端子電極の間に、平面視で細長い形状の凹部が、長手方向が不規則な方向となるように設けられており、不連続な曲線となっていることから、配線基板と外部回路基板とを接合材により接合する際に、絶縁基板と外部回路基板との間に接合補強材を配置すると、凹部内に良好に充填させて係止するとともに、平面視で、細長い形状で長手方向が不規則な方向となった凹部内の接合補強材にかかる応力を分散することができるので、配線基板と外部回路基板との実装信頼性を高めることができる。 The wiring board according to one aspect of the present invention includes an insulating substrate and a plurality of terminal electrodes provided adjacent to the main surface of the insulating substrate in plan view, and the main surface of the insulating substrate. Is provided with an elongated concave portion in plan view between the terminal electrodes so that the longitudinal direction is an irregular direction, and is a discontinuous curve. When the joint reinforcing material is disposed between the insulating substrate and the external circuit board, the recess is satisfactorily filled and locked, and has a long and narrow shape in plan view. Since it is possible to disperse the stress applied to the bonding reinforcing material in the concave portion which has become an irregular direction, it is possible to improve the mounting reliability between the wiring board and the external circuit board.

本発明の他の態様によれば、電子装置は、上記構成の配線基板と、電子部品とを含んでいることから、電子部品と外部回路基板との実装信頼性を高めて長期信頼性に優れたものとすることができる。   According to another aspect of the present invention, since the electronic device includes the wiring board having the above-described configuration and the electronic component, the mounting reliability between the electronic component and the external circuit board is improved and the long-term reliability is excellent. Can be.

本発明の他の態様によれば、電子モジュールは、上記構成の電子装置と、端子電極と接続される外部回路基板と、電子装置と外部回路基板との間に、凹部に充填するように配置された接合補強材とを有することから、電子部品と外部回路基板との実装信頼性を高めて長期信頼性に優れたものとすることができる。   According to another aspect of the present invention, an electronic module is disposed so as to fill a recess between the electronic device having the above configuration, an external circuit board connected to the terminal electrode, and the electronic device and the external circuit board. Therefore, the mounting reliability between the electronic component and the external circuit board can be improved and the long-term reliability can be improved.

（ａ）は、本発明の第１の実施形態における電子装置を示す平面図、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 1st Embodiment of this invention, (b) is a bottom view of (a). 図１（ａ）のＡ−Ａ線における縦断面図である。It is a longitudinal cross-sectional view in the AA line of Fig.1 (a). （ａ）は、図１（ｂ）のＡ部における要部拡大下面図であり、（ｂ）は図２の要部拡大縦断面図である。(A) is a principal part expanded bottom view in the A section of FIG.1 (b), (b) is a principal part enlarged longitudinal cross-sectional view of FIG. 図１における電子装置を用いた外部回路基板に実装した電子モジュールを示す要部拡大縦断面図である。FIG. 2 is an enlarged longitudinal sectional view showing a main part of an electronic module mounted on an external circuit board using the electronic device in FIG. 1. （ａ）は、本発明の第２の実施形態における電子装置を示す平面図、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 2nd Embodiment of this invention, (b) is a bottom view of (a). 図５（ａ）のＡ−Ａ線における縦断面図である。It is a longitudinal cross-sectional view in the AA line of Fig.5 (a). （ａ）は、図５（ｂ）のＡ部における要部拡大下面図であり、（ｂ）は図６の要部拡大縦断面図である。(A) is a principal part expanded bottom view in the A section of FIG.5 (b), (b) is a principal part expanded longitudinal cross-sectional view of FIG. （ａ）は、本発明の第３の実施形態における電子装置を示す平面図、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 3rd Embodiment of this invention, (b) is a bottom view of (a). 図８（ａ）のＡ−Ａ線における縦断面図である。It is a longitudinal cross-sectional view in the AA line of Fig.8 (a). （ａ）は、図８（ｂ）のＡ部における要部拡大下面図であり、（ｂ）は図９の要部拡大縦断面図である。(A) is the principal part expanded bottom view in the A section of FIG.8 (b), (b) is a principal part expanded longitudinal cross-sectional view of FIG.

本発明のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。   Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

（第１の実施形態）
本発明の第１の実施形態における電子装置は、図１〜図４に示された例のように、配線基板１と、配線基板１の上面に設けられた電子部品２とを含んでいる。電子装置は、例えば電子モジュールを構成する外部回路基板５上に実装される。 (First embodiment)
The electronic device according to the first embodiment of the present invention includes a wiring board 1 and an electronic component 2 provided on the upper surface of the wiring board 1 as in the example shown in FIGS. The electronic device is mounted on an external circuit board 5 that constitutes an electronic module, for example.

本実施形態における配線基板１は、図１〜図４に示された例のように、絶縁基板11と、絶縁基板11の主面に平面視で隣り合うようにして複数設けられた端子電極12とを有している。配線基板１は、絶縁基板11の主面および内部に設けられ、端子電極12に電気的に接続された配線導体13を有している。絶縁基板11の主面には、端子電極12の間に、平面視で細長い形状の凹部14が、長手方向が不規則な方向となるように設けられている。また、図１〜図４において、電子装置は、仮想のｘｙｚ空間内に設けられており、以下便宜的に「上方向」とは仮想のｚ軸の正方向のことをいう。なお、以下の説明における上下の区別は便宜的なものであり、実際に配線基板１等が使用される際の上下を限定するものではない。   The wiring board 1 according to the present embodiment includes an insulating substrate 11 and a plurality of terminal electrodes 12 provided adjacent to the main surface of the insulating substrate 11 in plan view, as in the example illustrated in FIGS. And have. The wiring substrate 1 has a wiring conductor 13 provided on the main surface and inside of the insulating substrate 11 and electrically connected to the terminal electrode 12. On the main surface of the insulating substrate 11, between the terminal electrodes 12, an elongated concave portion 14 in a plan view is provided so that the longitudinal direction is an irregular direction. 1 to 4, the electronic device is provided in a virtual xyz space, and the “upward direction” hereinafter refers to the positive direction of the virtual z-axis for convenience. In addition, the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the wiring board 1 or the like is actually used.

絶縁基板11は、複数の絶縁層11ａからなり、電子部品２の搭載部を含む上面を有しており、平面視において矩形の板状の形状を有している。絶縁基板11は、電子部品２を支持するための支持体として機能し、上面中央部の搭載部上に電子部品２が樹脂等の接合剤を介して接着され固定される。   The insulating substrate 11 includes a plurality of insulating layers 11a, has an upper surface including a mounting portion for the electronic component 2, and has a rectangular plate shape in plan view. The insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is bonded and fixed to the mounting portion at the center of the upper surface via a bonding agent such as resin.

絶縁基板11の材料は、例えば酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体等のセラミックスである。   The material of the insulating substrate 11 is ceramics such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, and the like.

絶縁基板11は、例えば酸化アルミニウム質焼結体である場合であれば、酸化アルミニウ
ム（Ａｌ２Ｏ３），酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して泥漿物を作製する。この泥漿物を、従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを作製する。次に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、セラミックグリーンシートを必要に応じて複数枚積層して生成形体を形成し、この生成形体を高温（約1600℃）で焼成することによって絶縁基板11が製作される。 If the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc. A suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method. Next, the ceramic green sheet is subjected to an appropriate punching process, and a plurality of ceramic green sheets are laminated as necessary to form a generated shape, and the generated shape is fired at a high temperature (about 1600 ° C.). An insulating substrate 11 is manufactured.

端子電極12は、絶縁基板11の一方主面（図１〜図４では、絶縁基板11の下面）にグリッド状に設けられている。配線導体13は、絶縁基板11の他方主面（図１〜図４では絶縁基板11の上面）および内部に設けられている。配線導体13は、絶縁基板11の他方主面にて、電子部品２とワイヤボンディング等の接続部材３を介して電気的に接続される。配線導体13は、端子電極12に電気的に接続され、配線基板１に搭載された電子部品２と外部回路基板５とを電気的に接続するためのものである。端子電極12は、配線基板１に搭載された電子部品２と外部回路基板５とを電気的に接続するため、または配線基板１と外部回路基板５とを接合するためのものである。配線導体13は、絶縁基板11の表面または内部に設けられた配線層と、絶縁基板11を貫通して上下に位置する配線層同士を電気的に接続する貫通導体とを含んでいる。   The terminal electrodes 12 are provided in a grid on one main surface of the insulating substrate 11 (the lower surface of the insulating substrate 11 in FIGS. 1 to 4). The wiring conductor 13 is provided on the other main surface of the insulating substrate 11 (the upper surface of the insulating substrate 11 in FIGS. 1 to 4) and inside. The wiring conductor 13 is electrically connected to the electronic component 2 via the connection member 3 such as wire bonding on the other main surface of the insulating substrate 11. The wiring conductor 13 is electrically connected to the terminal electrode 12 and is used to electrically connect the electronic component 2 mounted on the wiring board 1 and the external circuit board 5. The terminal electrode 12 is used to electrically connect the electronic component 2 mounted on the wiring board 1 and the external circuit board 5 or to join the wiring board 1 and the external circuit board 5. The wiring conductor 13 includes a wiring layer provided on the surface or inside of the insulating substrate 11, and a through conductor that penetrates the insulating substrate 11 and electrically connects the wiring layers positioned above and below.

端子電極12、配線導体13の材料は、例えばタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ）または銅（Ｃｕ）等を主成分とする金属粉末メタライズである。端子電極12および配線導体13は、は、例えば絶縁基板11用のセラミックグリーンシートに端子電極12、配線導体13用のメタライズペーストをスクリーン印刷法等の印刷手段によって印刷塗布し、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。また、貫通導体は、例えば絶縁基板11用のセラミックグリーンシートに金型またはパンチングによる打ち抜き加工またはレーザー加工等の加工方法によって貫通導体用の貫通孔を形成し、この貫通孔に貫通導体用のメタライズペーストを上記印刷手段によって充填しておき、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。メタライズペーストは、上述の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基板11との接合強度を高めるために、ガラス粉末、セラミック粉末を含んでいても構わない。   The material of the terminal electrode 12 and the wiring conductor 13 is, for example, metal powder metallization mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. The terminal electrode 12 and the wiring conductor 13 are, for example, printed by applying a metallized paste for the terminal electrode 12 and the wiring conductor 13 to a ceramic green sheet for the insulating substrate 11 by a printing means such as a screen printing method. It is formed by firing together with a ceramic green sheet. The through conductor is formed, for example, in a ceramic green sheet for the insulating substrate 11 by a die or punching process by punching or laser processing or the like, and through metal for the through conductor is formed in the through hole. It is formed by filling the paste with the above printing means and firing it together with the ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.

端子電極12、配線導体13の絶縁基板11から露出した表面には、ニッケル，金等の耐蝕性に優れる金属めっき層が被着される。端子電極12および配線導体13が腐食することを低減できるとともに、配線導体13と電子部品２との接合、および配線導体13とボンディングワイヤまたは外部回路基板５と端子電極12とを強固に接合できる。例えば、端子電極12および配線導体13の絶縁基板11から露出した表面には、厚さ１〜10μｍ程度のニッケルめっき層と厚さ0.1〜３μｍ程度の金めっき層とが順次被着される。   A surface of the terminal electrode 12 and the wiring conductor 13 exposed from the insulating substrate 11 is coated with a metal plating layer having excellent corrosion resistance, such as nickel or gold. Corrosion of the terminal electrode 12 and the wiring conductor 13 can be reduced, and the wiring conductor 13 and the electronic component 2 can be joined, and the wiring conductor 13 and the bonding wire or the external circuit board 5 and the terminal electrode 12 can be joined firmly. For example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the surface of the terminal electrode 12 and the wiring conductor 13 exposed from the insulating substrate 11.

また、めっき層は、ニッケルめっき層／金めっき層に限られるものではなく、ニッケルめっき層／パラジウムめっき層／金めっき層等を含むその他のめっき層であっても構わない。   The plating layer is not limited to nickel plating layer / gold plating layer, and may be other plating layers including nickel plating layer / palladium plating layer / gold plating layer.

凹部14は、絶縁基板11の一方主面（図１〜図４では、絶縁基板11の下面）に、端子電極12の間に設けられている。凹部14は、接合補強材７を内部に充填させて、電子装置と外部回路基板５との接合を補強するためのものである。ここで、凹部14は、図１〜図３に示された例のように、平面視において、細長い形状で、長手方向が不規則な方向となるように設けられており、非直線状、すなわち不連続な曲線の凹部であり、繊維形状となっている。なお、凹部14は、開口幅は、一定でなくてもよいし、複数の繊維形状が交差した形状の
凹部であっても構わない。凹部14は、電子装置と外部回路基板５との接合を補強するために、グリッド状に設けられた全ての端子電極12の隣接する端子電極12間に設けられていることが好ましく、最外周の端子電極12よりも外側領域の絶縁基板11の主面に設けられていてもよい。 The recess 14 is provided between the terminal electrodes 12 on one main surface of the insulating substrate 11 (the lower surface of the insulating substrate 11 in FIGS. 1 to 4). The recess 14 is used to reinforce the bonding between the electronic device and the external circuit board 5 by filling the bonding reinforcing material 7 therein. Here, as in the example shown in FIGS. 1 to 3, the recess 14 is provided in an elongated shape in a plan view so that the longitudinal direction is an irregular direction. It is a concave part of a discontinuous curve and has a fiber shape. The opening width of the recess 14 may not be constant, or may be a recess having a shape in which a plurality of fiber shapes intersect. In order to reinforce the bonding between the electronic device and the external circuit board 5, the recess 14 is preferably provided between the adjacent terminal electrodes 12 of all the terminal electrodes 12 provided in a grid shape. It may be provided on the main surface of the insulating substrate 11 in a region outside the terminal electrode 12.

このような繊維形状の凹部14は、例えば、表面に繊維形状の凸部を有するゴム板、金属板、樹脂板等の板材、あるいは大きな繊維質を含有した紙やゴム等の緩衝材の上に、端子電極12側を下側に向けて絶縁基板11の生成形体を配置し、絶縁基板11の生成形体の両主面方向に対して50〜100kg/cm2程度の圧力を印加し、絶縁基板11の生成形体の主面に繊維形
状の凹部14となるくぼみをつけておくことにより形成することができる。また、ゴム板、金属板、樹脂板等の板材上に、繊維形状の物質、電極12側を下側に向けた絶縁基板11の生成形体の順に配置し、絶縁基板11の生成形体両主面方向から圧力を印加し、絶縁基板11の生成形体の主面に繊維形状の凹部14となるくぼみをつけておくことにより形成することもできる。 Such a fiber-shaped recess 14 is formed on, for example, a rubber plate having a fiber-shaped protrusion on the surface, a metal plate, a plate material such as a resin plate, or a buffer material such as paper or rubber containing a large amount of fiber. The generated shape of the insulating substrate 11 is arranged with the terminal electrode 12 side facing downward, and a pressure of about 50 to 100 kg / cm 2 is applied to both main surface directions of the generated shape of the insulating substrate 11, 11 can be formed by providing a depression that becomes a fiber-shaped recess 14 on the main surface of the generated shape. In addition, on a plate material such as a rubber plate, a metal plate, a resin plate, and the like, a fibrous material, and the generated shape of the insulating substrate 11 with the electrode 12 side facing down are arranged in this order, and both generated surfaces of the generated shape of the insulating substrate 11 It can also be formed by applying a pressure from the direction and forming a depression that becomes a fiber-shaped recess 14 on the main surface of the generated shape of the insulating substrate 11.

また、絶縁基板11あるいは絶縁基板11の生成形体の主面に、レーザー加工等により、繊維形状の凹部14を形成しても良いが、上述の表面に繊維形状の凸部を有するゴム板、金属板、樹脂板等の板材、あるいは大きな繊維質を含有した紙やゴム等の緩衝材を用いて製作する方が、生産性において好ましい。   In addition, a fiber-shaped concave portion 14 may be formed on the main surface of the insulating substrate 11 or the generated shape of the insulating substrate 11 by laser processing or the like, but a rubber plate or metal having a fiber-shaped convex portion on the surface described above It is preferable in terms of productivity to manufacture using a plate material such as a plate or a resin plate, or a buffer material such as paper or rubber containing large fibers.

配線基板１の主面には、電子部品２が接合されて搭載される。電子部品２は、例えば、加速度センサ素子等のセンサ素子、半導体素子、撮像素子、発光素子等である。また、電子部品２とともにコンデンサまたは抵抗素子等の小型の部品が搭載されていてもよい。電子部品２は、エポキシ樹脂等の接合材によって配線基板１の主面に接合される。また、電子部品２の電極と配線導体13とが、例えばＡｕを主成分とするボンディングワイヤ等の接続部材３を介して電気的に接続される。電子部品２は、必要に応じて、樹脂材料等の封止材４によって封止されている。また、蓋体等によって封止されていてもよい。   An electronic component 2 is bonded and mounted on the main surface of the wiring board 1. The electronic component 2 is, for example, a sensor element such as an acceleration sensor element, a semiconductor element, an imaging element, a light emitting element, or the like. Further, a small component such as a capacitor or a resistance element may be mounted together with the electronic component 2. The electronic component 2 is bonded to the main surface of the wiring board 1 with a bonding material such as an epoxy resin. Further, the electrode of the electronic component 2 and the wiring conductor 13 are electrically connected via a connecting member 3 such as a bonding wire mainly composed of Au. The electronic component 2 is sealed with a sealing material 4 such as a resin material as necessary. Moreover, you may seal with the cover body etc.

本発明の電子装置が、図４に示される例のように、外部回路基板５の接続パッド51に半田ボール等の接合材６を介して接続され、電子装置と外部回路基板５との間にアンダーフィルとして、例えば、エポキシ樹脂等の接合補強材７を電子装置と外部回路基板５との間に配置するとともに、繊維形状の凹部14内に充填させることで、電子モジュールとなる。   As shown in the example shown in FIG. 4, the electronic device of the present invention is connected to the connection pad 51 of the external circuit board 5 via a bonding material 6 such as a solder ball, and between the electronic device and the external circuit board 5. As the underfill, for example, a bonding reinforcing material 7 such as an epoxy resin is disposed between the electronic device and the external circuit board 5 and filled into the fiber-shaped recess 14 to form an electronic module.

本実施形態の配線基板１は、絶縁基板11と、絶縁基板11の主面に平面視で隣り合うようにして複数設けられた端子電極12とを有しており、絶縁基板11の主面には、端子電極12の間に、平面視で細長い形状の凹部14が、長手方向が不規則な方向となるように設けられている。上記構成により、配線基板１と外部回路基板５とを接合する際に、絶縁基板11と外部回路基板５との間に接合補強材７を配置すると、凹部14内に良好に充填させて係止するとともに、平面視で、細長い形状で長手方向が不規則な方向となった凹部14内の接合補強材７にかかる応力を分散することができるので、配線基板１と外部回路基板５との実装信頼性を高めることができる。   The wiring board 1 of the present embodiment has an insulating substrate 11 and a plurality of terminal electrodes 12 provided adjacent to the main surface of the insulating substrate 11 in plan view. Are provided with an elongated recess 14 in a plan view between the terminal electrodes 12 such that the longitudinal direction is irregular. With the above configuration, when the bonding reinforcing material 7 is disposed between the insulating substrate 11 and the external circuit board 5 when the wiring board 1 and the external circuit board 5 are bonded, the recess 14 is satisfactorily filled and locked. In addition, since the stress applied to the joint reinforcing material 7 in the concave portion 14 having an elongated shape and an irregular longitudinal direction in a plan view can be dispersed, the wiring board 1 and the external circuit board 5 can be mounted. Reliability can be increased.

繊維形状の凹部14は、図３に示される例のように、細長い線状の凹部であることから、絶縁基板11の主面に複数の点状の凹部を点在して設けた場合と比較して、繊維形状の凹部14内に接合補強材７を流動させやすく、充填させやすい。   The fiber-shaped recess 14 is an elongated linear recess as in the example shown in FIG. 3. Compared to the case where a plurality of dotted recesses are provided on the main surface of the insulating substrate 11. Thus, the bonding reinforcing material 7 can easily flow and be filled in the fiber-shaped recess 14.

また、例えば、繊維形状の凹部14は、絶縁基板11の主面に一方方向に直線状の凹部を設けた場合と比較して、剥がれがたくなる。また、絶縁基板11の主面に一方方向、あるいは格子状に直線状の凹部を設けた場合と比較して、端子電極12間に設けられた繊維形状の凹部14により、力がかかる方向が分散されるので、端子電極12と繊維形状の凹部14との間、
あるいは繊維形状の凹部14と絶縁基板11の他方主面との間においてクラック等が発生したり、割れてしまうことを抑制することができるので、絶縁基板11の厚みが薄い配線基板１において好適に使用することができる。 Further, for example, the fiber-shaped recess 14 is less likely to be peeled off than when the linear recess is provided in one direction on the main surface of the insulating substrate 11. In addition, compared to the case where the main surface of the insulating substrate 11 is provided with one-sided or linear concave portions in a lattice shape, the fiber-shaped concave portions 14 provided between the terminal electrodes 12 distribute the direction in which the force is applied Because, between the terminal electrode 12 and the fiber-shaped recess 14,
Alternatively, cracks or the like can be prevented from occurring between the fiber-shaped recess 14 and the other main surface of the insulating substrate 11, so that the insulating substrate 11 is preferably thin in the wiring substrate 1. Can be used.

繊維形状の凹部14の長さは、50〜1000μｍ程度の長さに形成される。繊維形状の凹部14の深さは、５〜50μｍ程度の深さに形成される。図３に示された例のように、縦断面視における繊維形状の凹部14の内面が曲面状であり、かつ繊維形状の凹部14の開口部の幅が繊維形状の凹部14の深さよりも大きいと、繊維形状の凹部14内に接合補強材７を充填させやすい。   The length of the fiber-shaped recess 14 is about 50 to 1000 μm. The depth of the fiber-shaped recess 14 is formed to a depth of about 5 to 50 μm. As in the example shown in FIG. 3, the inner surface of the fiber-shaped recess 14 in the longitudinal sectional view is curved, and the width of the opening of the fiber-shaped recess 14 is larger than the depth of the fiber-shaped recess 14. Then, it is easy to fill the bonding reinforcing material 7 into the fiber-shaped recess 14.

なお、繊維形状の凹部14は、図３に示された例のように、それぞれの繊維形状の凹部14の形状、長さ、開口幅および深さが異なっていても構わない。   The fiber-shaped recesses 14 may have different shapes, lengths, opening widths, and depths of the respective fiber-shaped recesses 14 as in the example shown in FIG.

本実施形態の電子装置は、上記の配線基板１と、配線基板１に搭載された電子部品２とを有していることから、電子装置と外部回路基板５との実装信頼性を向上させて長期信頼性に優れたものとできる。   Since the electronic device according to the present embodiment includes the wiring board 1 and the electronic component 2 mounted on the wiring board 1, the mounting reliability between the electronic device and the external circuit board 5 is improved. Excellent long-term reliability.

本実施形態の電子モジュールは、上記の電子装置と、端子電極12と接続される外部回路基板５と、電子装置と外部回路基板５との間に配置され、繊維形状の凹部14に充填された接合補強材７とを有していることから、電子装置と外部回路基板５との実装信頼性を向上させて長期信頼性に優れたものとできる。   The electronic module of the present embodiment is disposed between the electronic device described above, the external circuit board 5 connected to the terminal electrode 12, the electronic device and the external circuit board 5, and filled in the fiber-shaped recess 14. Since the joint reinforcing material 7 is provided, the mounting reliability between the electronic device and the external circuit board 5 can be improved and the long-term reliability can be improved.

（第２の実施形態）
次に、本発明の第２の実施形態による電子装置について、図５〜図７を参照しつつ説明する。 (Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

本実施形態における電子装置において、上記した第１の実施形態の電子装置と異なる主な点は、絶縁基板11の主面（図５〜図７では下面）に穴15が形成されており、穴15の底面に端子電極12が設けられている点である。   In the electronic device according to the present embodiment, the main difference from the electronic device according to the first embodiment described above is that a hole 15 is formed on the main surface (the lower surface in FIGS. 5 to 7) of the insulating substrate 11. The terminal electrode 12 is provided on the bottom surface of 15.

なお、第２の実施形態において、電子部品２は、はんだバンプや金バンプまたは導電性樹脂（異方性導電樹脂等）等の接続部材３を介して、半導体素子の電極と配線導体13とが電気的および機械的に接続されることによって配線基板１に搭載されている。   In the second embodiment, the electronic component 2 includes an electrode of a semiconductor element and a wiring conductor 13 via a connecting member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). It is mounted on the wiring board 1 by being electrically and mechanically connected.

穴15は、図５〜図７に示された例において、縦断面視において内側面が直線状の穴15と形成されているが、内側面が開口側に広がる穴15、もしくは開口側に階段状に広がる穴15であっても構わない。   In the example shown in FIGS. 5 to 7, the hole 15 is formed as a hole 15 having an inner side surface that is linear in a longitudinal sectional view. It may be a hole 15 spreading in a shape.

第２実施形態の配線基板１によれば、第１実施形態の配線基板１と同様に、配線基板１と接合補強材７との接合強度を高めることができ、配線基板１と外部回路基板５との実装信頼性を向上させることができる。   According to the wiring board 1 of the second embodiment, similarly to the wiring board 1 of the first embodiment, the bonding strength between the wiring board 1 and the bonding reinforcing material 7 can be increased, and the wiring board 1 and the external circuit board 5 can be increased. And mounting reliability can be improved.

また、絶縁基板11の生成形体の主面に繊維形状の凹部14となるくぼみを形成する際に、板材または紙が直接端子電極12と接触しづらく、端子電極12に繊維形状の凹部14が形成されることを抑制することができる。   In addition, when forming a recess that becomes a fiber-shaped recess 14 on the main surface of the generated shape of the insulating substrate 11, it is difficult for the plate material or paper to directly contact the terminal electrode 12, and the fiber-shaped recess 14 is formed in the terminal electrode 12. It can be suppressed.

このような穴15は、穴15を構成するセラミックグリーンシートまたはセラミックペーストを、絶縁基板11の生成形体の端子電極12側の主面に設けておくことにより形成することができる。セラミックペーストは、絶縁基板11と実質的に同質のセラミック粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される
。 Such a hole 15 can be formed by providing a ceramic green sheet or ceramic paste constituting the hole 15 on the main surface of the generated shape of the insulating substrate 11 on the terminal electrode 12 side. The ceramic paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to a ceramic powder substantially the same quality as the insulating substrate 11 and kneading.

なお、セラミックペーストを用いた場合には、絶縁基板11の主面に繊維形状の凹部14を形成する場合に、上記圧力を印加して繊維形状の凹部14となるくぼみを良好に形成しやすいので好ましい。   In the case where the ceramic paste is used, when the fiber-shaped recess 14 is formed on the main surface of the insulating substrate 11, it is easy to satisfactorily form the recess that becomes the fiber-shaped recess 14 by applying the pressure. preferable.

また、この場合、図５〜図７に示された例のように、繊維形状の凹部14の深さが、穴15の底面に設けられた端子電極12の穴15の開口部からの深さよりも浅いと、穴15の底面に端子電極12を大きく形成しやすくなる。例えば、平面視において、端子電極12を穴15の径よりも大きくし、絶縁基板11と端子電極12との接合強度を高めることで、配線基板１と外部回路基板５との実装信頼性を向上させることができる。   In this case, as in the example shown in FIGS. 5 to 7, the depth of the fiber-shaped recess 14 is greater than the depth from the opening of the hole 15 of the terminal electrode 12 provided on the bottom surface of the hole 15. If it is shallower, the terminal electrode 12 can be easily formed on the bottom surface of the hole 15. For example, the mounting reliability between the wiring board 1 and the external circuit board 5 is improved by making the terminal electrode 12 larger than the diameter of the hole 15 and increasing the bonding strength between the insulating board 11 and the terminal electrode 12 in plan view. Can be made.

（第３の実施形態）
次に、本発明の第３の実施形態による電子装置について、図８〜図10を参照しつつ説明する。 (Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS.

本実施形態における電子装置において、上記した第１の実施形態の電子装置と異なる主な点は、絶縁基板11の主面（図８〜図10では絶縁基板11の下面）に穴15が形成されており、１つの穴15の底面に複数の端子電極12が設けられている点である。   In the electronic device of this embodiment, the main difference from the electronic device of the first embodiment described above is that a hole 15 is formed in the main surface of the insulating substrate 11 (the lower surface of the insulating substrate 11 in FIGS. 8 to 10). In other words, a plurality of terminal electrodes 12 are provided on the bottom surface of one hole 15.

第３の実施形態の配線基板１によれば、第１実施形態の配線基板１と同様に、配線基板１と接合補強材７との接合強度を高めることができ、配線基板１と外部回路基板５との実装信頼性を向上させることができる。   According to the wiring board 1 of the third embodiment, similarly to the wiring board 1 of the first embodiment, the bonding strength between the wiring board 1 and the bonding reinforcing material 7 can be increased, and the wiring board 1 and the external circuit board can be increased. The mounting reliability with 5 can be improved.

また、図８に示される例のように、穴15および端子電極12が、絶縁基板11の主面外周部に偏倚して配置されている場合、絶縁基板11の主面中央部に複数の繊維形状の凹部14を設けても良く、絶縁基板11の主面中央部に絶縁基板11の主面外周部よりも密集した状態で繊維形状の凹部14を設けても良い。   In addition, when the hole 15 and the terminal electrode 12 are arranged offset on the outer peripheral portion of the main surface of the insulating substrate 11 as in the example shown in FIG. The concave portion 14 having a shape may be provided, or the concave portion 14 having a fiber shape may be provided in the central portion of the main surface of the insulating substrate 11 in a more dense state than the outer peripheral portion of the main surface of the insulating substrate 11.

なお、本発明は上記の実施の形態の例に限定されるものではなく、種々の変更は可能である。例えば、図１〜図10に示された例において、絶縁基板11は、平板形状であるが、上面に、電子部品２が搭載されるキャビティを有した形状であってもよい。   In addition, this invention is not limited to the example of said embodiment, A various change is possible. For example, in the example shown in FIGS. 1 to 10, the insulating substrate 11 has a flat plate shape, but may have a shape having a cavity on which the electronic component 2 is mounted on the upper surface.

また、図１〜図10に示された例において、絶縁基板11の主面に、電子部品２が１つ搭載されているが、複数の電子部品２が搭載される配線基板１であってもよい。また、抵抗素子や容量素子等の小型の電子部品を搭載しても良い。   In the example shown in FIGS. 1 to 10, one electronic component 2 is mounted on the main surface of the insulating substrate 11, but even the wiring substrate 1 on which a plurality of electronic components 2 are mounted. Good. Moreover, you may mount small electronic components, such as a resistive element and a capacitive element.

また、端子電極12は、グリッド状の位置からずれた位置、例えば千鳥格子状に設けても構わない。   The terminal electrode 12 may be provided at a position shifted from the grid-like position, for example, in a staggered pattern.

１・・・配線基板
11・・・絶縁基板
11ａ・・絶縁層
12・・・端子電極
13・・・配線導体
14・・・凹部
15・・・穴
２・・・電子部品
３・・・接続部材
４・・・封止材
５・・・外部回路基板
７・・・接合補強材 1 ... Wiring board
11 ... Insulated substrate
11a ・ ・ Insulating layer
12 ... Terminal electrode
13 ... Wiring conductor
14 ... Recess
15 ... hole 2 ... electronic component 3 ... connecting member 4 ... sealing material 5 ... external circuit board 7 ... joining reinforcement

Claims (4)

絶縁基板と、
該絶縁基板の主面に平面視で隣り合うようにして複数設けられた端子電極とを有しており、
前記絶縁基板の主面には、前記端子電極の間に、平面視で細長い形状の凹部が、長手方向が不規則な方向となるように設けられており、不連続な曲線となっていることを特徴とする配線基板。 An insulating substrate;
A plurality of terminal electrodes adjacent to the main surface of the insulating substrate in plan view;
On the main surface of the insulating substrate, a concave portion having an elongated shape in plan view is provided between the terminal electrodes so that the longitudinal direction is an irregular direction, and has a discontinuous curve. A wiring board characterized by. 前記端子電極は、前記絶縁基板の主面に設けられた穴の底面に形成されていることを特徴とする請求項１に記載の配線基板。 The terminal electrodes, the wiring board according to claim 1, characterized in that it is formed in the bottom surface of the hole provided on the main surface of the front Symbol insulating substrate. 請求項１記載の配線基板と、
前記配線基板に搭載された電子部品とを有していることを特徴とする電子装置。 The wiring board according to claim 1;
An electronic device comprising: an electronic component mounted on the wiring board. 請求項３記載の電子装置と、
前記端子電極と接続される外部回路基板と、
前記電子装置と外部回路基板との間に、前記凹部に充填するように配置された接合補強材とを有することを特徴とする電子モジュール。 An electronic device according to claim 3;
An external circuit board connected to the terminal electrode;
The electronic device and between the external circuit board, an electronic module, wherein the benzalkonium which have a a bonding reinforcing material disposed to fill said recess.
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