JP4767120B2 - Multiple wiring board, wiring board, electronic device - Google Patents

Description

  In the present invention, a plurality of wiring board regions are formed in which a plurality of wiring board regions each serving as a wiring substrate for accommodating electronic components are arranged in the central portion of the mother board, and each wiring board region is divided. The present invention relates to a wiring board separated into pieces and an electronic device on which electronic components are mounted.

  2. Description of the Related Art Conventionally, wiring boards (electronic component storage packages) for mounting electronic components such as semiconductor elements and crystal resonators are made of tungsten on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by disposing a wiring conductor made of metal powder metallization such as molybdenum.

  And after an electronic component is mounted on the upper surface of this electronic component storage package, each electrode of the electronic component is electrically connected to the wiring conductor via an electrical connection means such as solder or a bonding wire. The electronic device is manufactured by covering and sealing the electronic component with a lid made of metal or ceramics or potting resin as necessary.

  In such an electronic component storage package, a metallized paste for wiring conductors is printed at a predetermined position on a ceramic green sheet for the electronic component storage package, and a plurality of these are laminated, and then the electronic component storage is performed. The ceramic green sheet laminate is formed by cutting according to the outer shape of the package for use, and the ceramic green sheet laminate is fired at a high temperature.

In a plan view, when the outer shape of the main surface of the electronic component storage package is different from the outer shape of the other main surface, two or more wiring boards having different outer shapes are prepared. A method of forming the substrates by bonding the substrates together with a bonding member or the like is conceivable.
JP 2003-273274 A

  However, since two or more wiring boards having different shapes are joined by the joining member, joining displacement and inclination between the wiring boards may occur. Further, when two wiring boards made of ceramics are to be joined, it is difficult to join them accurately if the positional accuracy is shifted due to warpage or shrinkage between the wiring boards. In particular, in a small electronic device, when such bonding is performed, reliability such as electrical connection between wiring boards may be reduced.

  In addition, when an image pickup device is mounted on such a wiring board and used as an image pickup apparatus, external light is favorably incident on the image pickup device placed on the substrate due to a joining deviation or inclination of the two wiring boards. In some cases, the image could not be captured well.

  The present invention has been devised in view of the above-described problems of the prior art. The object of the present invention is to provide a plurality of wiring boards in which the outer shape of one main surface is different from the outer shape of the other main surface. The object is to provide a single-piece wiring board. Another object of the present invention is to provide a wiring board and an electronic device that are excellent in reliability such as electrical connection.

  The multiple wiring substrate according to the present invention is a multiple wiring substrate in which a plurality of wiring substrate regions are arranged vertically and horizontally at a central portion of a mother substrate formed by laminating a plurality of insulating layers. A first division for dividing the mother board into individual wiring board areas on one main surface and the other main surface of the mother board having a cavity in the thickness direction inside the boundary portion of the wiring board area A line and a second dividing line are formed so as to overlap the cavity part in plan view, and the first dividing line and the second dividing line are in plan view on at least one side of the wiring board region. It is characterized by not overlapping each other.

  Preferably, the first dividing line and the second dividing line do not overlap each other in plan view on the entire circumference of the wiring board region.

  Preferably, the mother board is characterized in that a dummy area is formed around each of the wiring board areas.

  Preferably, in the dummy region, the connecting portion that connects the insulating layer on one main surface side and the insulating layer on the other main surface side has the first dividing line and the second dividing line in a plan view. It is formed in the area | region which does not overlap with.

  Preferably, the connecting portions are distributed and arranged in the mother board in a plan view.

  The wiring board of the present invention is characterized in that the multiple-taken wiring board of the present invention is divided along the first dividing line and the second dividing line.

  The electronic device of the present invention is characterized in that an electronic component is mounted on the wiring board of the present invention.

  According to the multiple wiring substrate of the present invention, there is a cavity in the thickness direction at the boundary of the wiring substrate region of the mother substrate, and the mother substrate is individually provided on one main surface and the other main surface of the mother substrate. The first dividing line and the second dividing line for dividing the wiring board region are formed so as to overlap the cavity part in plan view, and at least one side of the wiring board region has the first dividing line and The second dividing lines do not overlap each other in plan view. With this configuration, when the mother board is divided from the one main surface and the other main surface along the first dividing line and the second dividing line, the cavity from which the division from both main surfaces is formed inside the mother board Therefore, it is possible to form a plurality of wiring boards in which the shape of one main surface and the shape of the other main surface are different from each other in a plan view. It is possible to form a wiring board excellent in reliability such as a general connection with high productivity.

  Preferably, since the first dividing line and the second dividing line do not overlap each other in plan view on the entire circumference of the wiring board region, the mother board is formed by the first dividing line and the second dividing line. When divided, it is possible to form a plurality of wiring boards in which the shape of one main surface and the shape of the other main surface are different in the entire circumferential direction in an integrated state, and the shape is excellent and the reliability of electrical connection etc. A wiring board having excellent properties can be formed with high productivity.

  Preferably, the mother board is formed with a dummy area around each wiring board area. By using this dummy area, the wiring board areas are arranged on one main surface side or the other main surface side. Compared to the case where the wiring boards are adjacent to each other, the outer shape of the wiring board can be processed in directions other than the directions of the first dividing line and the second dividing line while the wiring board is arranged on the mother board. The outer shape of one main surface of the wiring board or the outer shape of the other main surface can be efficiently formed into a different shape.

  Preferably, in the dummy region, the connecting portion connecting the insulating layer on the one main surface side and the insulating layer on the other main surface side does not overlap the first dividing line and the second dividing line in plan view. Therefore, when the mother board is manufactured or handled, the mother board is held by the connecting portion to reduce the possibility of deformation or cracking around the gap, and the mother board is predetermined. It can be formed in a good shape. Therefore, it is possible to satisfactorily form a wiring board having a different outer shape on one main surface and an outer shape on the other main surface, which can be favorably divided by the first dividing line and the second dividing line. .

  Further, when the mother board is divided by the first dividing line and the second dividing line, the dividing can be favorably performed without being interrupted by the connecting portion.

  In addition, preferably, since the connecting portions are distributed and arranged in the mother board in a plan view, it is possible to reduce the possibility that the mother board is deformed or distorted when the mother board is manufactured. Since it can be satisfactorily formed into a predetermined shape, when dividing the mother board, it can be favorably divided by the first dividing line and the second dividing line, the outer shape of one main surface and the other main surface A wiring board having a different external shape can be formed satisfactorily.

  Since the wiring board of the present invention is formed by dividing the multiple wiring board of the present invention along the first dividing line and the second dividing line, the outer shape on one main surface side and the other main surface side are formed. A wiring board excellent in reliability such as an integrated electrical connection having a different external shape can be obtained.

  In addition, it is possible to mount an electronic component by utilizing the difference between the outer shape on the one main surface side and the outer shape on the other main surface side, or to join a metal member or the like, so that a small electronic device is obtained. be able to.

  Since the electronic device of the present invention has the electronic component mounted on the wiring board of the present invention, the electronic device having excellent reliability such as electrical connection in which the shape on the one main surface side and the shape on the other main surface side of the wiring substrate are different. It can be a device.

  Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 (a) is a plan view on one main surface showing an example of an embodiment of a multi-cavity wiring board of the present invention, and FIG. 1 (b) is a multi-cavity wiring board of FIG. 1 (a). It is a top view in the other main surface. FIG. 2 is a cross-sectional view taken along line A-A ′ of FIG. In these figures, 101 is a mother board, 102 is a wiring board region, 103 is a cavity, 104 is a first dividing line, 105 is a second dividing line, and 106 is a wiring conductor.

  The base substrate 101 is an electrically insulating ceramic material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. It functions as a base material for manufacturing a large number of small wiring boards simultaneously. Then, electronic components (not shown) such as semiconductor elements, resistors, and capacitors are mounted on the upper surface of each small wiring board.

  If the mother substrate 101 is made of, for example, an aluminum oxide sintered body, an organic binder, solvent, plasticizer, and dispersing agent suitable for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. The ceramic slurry obtained by adding and mixing, etc. is formed into a sheet shape by using a conventionally known sheet forming method such as a doctor blade method, and then a ceramic green sheet is obtained. It is manufactured by laminating at least three of them and baking them at a high temperature (about 1500 to 1800 ° C.). FIG. 2 shows an example in which the mother substrate 101 is formed of three layers of insulating layers 101a, 101b, and 101c.

  A plurality of wiring board regions 102 are formed in the center of the mother board 101, and a wiring conductor 106 is formed in each wiring board region 102. The wiring conductor 106 functions as a conductive path for electrically connecting an electronic component mounted on the wiring board region 102 to an external electric circuit board, and is made of metal powder metallization such as tungsten, molybdenum, copper, silver, and the like. The metallized paste for the wiring conductor 106 is printed on the ceramic green sheet for the substrate 101 by printing means such as a screen printing method, and is fired together with the ceramic green sheet for the mother substrate 101 to adhere to the upper and lower surfaces of each region. It is formed. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as necessary to a main component metal powder, and mixing and kneading them by a kneading means such as a ball mill, a three-roll mill, or a planetary mixer. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate after firing.

  In addition, the wiring conductor 106 formed on the surface and inside of the mother board 101 is electrically connected by a through conductor penetrating the mother board 101 as necessary. Such penetrating conductors are used for penetrating conductors by a punching method using a die or punching or a processing method such as laser processing on a ceramic green sheet for the base substrate 101 prior to the printing and application of the metallized paste for forming the wiring conductor 106. The through holes are filled with metallized paste for through conductors by printing means such as a screen printing method, and fired together with the ceramic green sheet for the mother substrate 106 in each region. It is formed. The metallized paste for the through conductor is prepared in the same manner as the metallized paste for the wiring conductor 106, but is adjusted to a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  In the multiple wiring substrate of the present invention, the cavity portion 103 is provided in the thickness direction inside the boundary portion of the wiring substrate region 102 of the mother substrate 101, and one main surface and the other main surface of the mother substrate 101 are provided. In addition, a first dividing line 104 and a second dividing line 105 for dividing the mother board 101 into individual wiring board areas are formed so as to overlap with the cavity 103 in plan view. At least on one side, the first dividing line 104 and the second dividing line 105 are formed so as not to overlap each other in plan view.

  The cavity 103 is formed inside the mother board 101 and becomes an area for good division when the mother board 101 is divided by the first dividing line 104 and the second dividing line 105. Such a cavity 103 can be formed as follows, for example, as shown in FIG. 2, when the mother substrate 101 is made of insulating layers 101a, 101b, and 101c. Among the ceramic green sheets for the insulating layers 101a, 101b, and 101c, a through hole to be the cavity 103 is formed in the ceramic green sheet for the insulating layer 101b by punching or the like, and the ceramic green sheet for the insulating layer 101b is formed. It can be formed by laminating ceramic green sheets for the insulating layers 101a and 101c on both main surfaces and then firing at a high temperature.

  The cavity 103 may be partially formed inside the mother substrate 101, or may be formed in a tunnel shape penetrating in the side surface direction from one side surface to the other side surface of the mother substrate 101. It does not matter.

  The first dividing line 104 and the second dividing line 105 are planned lines for dividing the mother board 101 by the slicing method or the like, and overlap with the cavity 103 in plan view, and also the first dividing line. The line 104 and the second dividing line 105 are formed so as not to overlap each other in plan view. In FIG. 1, the first dividing line 104 and the second dividing line 105 are indicated by broken lines. In this case, the first dividing line 104 and the second dividing line 105 are respectively connected to each wiring board region. Located along the outer edge of 102. For example, after the mother substrate 101 is divided along the second dividing line 105 from the other main surface side, the main substrate 101 is divided along the first dividing line 104 from the one main surface side, whereby the shape on the one main surface side and the other A wiring board having a different shape on the main surface side can be formed.

  Note that the first dividing line 104 and the second dividing line 105 do not overlap here means that the first dividing line 104 and the second dividing line 105 formed in the same direction do not overlap. The first dividing line 104 and the second dividing line 105 formed in the intersecting direction may overlap each other at the intersecting portion. That is, in FIGS. 1 and 2, it is shown that the first dividing line 104a formed in the vertical direction and the second dividing line 105a formed in the vertical direction do not overlap in plan view. Yes.

  With this configuration, in the present invention, when the mother board 101 is divided along the first dividing line 104 and the second dividing line 105 from the one main surface and the other main surface, the division from both main surfaces is performed on the mother board. Since it is divided by reaching the cavity 103 formed inside 101, a plurality of wiring boards having different shapes of the one main surface and the other main surface in plan view are formed in an integrated state. Therefore, it is possible to form a wiring board excellent in shape and reliability such as electrical connection with high productivity.

  As shown in FIG. 3, the mother board 101 may have a recess 107 in which an electronic component is mounted on at least one main surface for each wiring board region 102. In FIG. 3, an insulating layer 101a 'having a recess 107 is stacked on one main surface of the insulating layer 101b, and an insulating layer 101c is stacked on the other main surface of the insulating layer 101b.

  Further, it is preferable that the first dividing line 104 and the second dividing line 105 do not overlap each other in plan view on the entire circumference of the wiring board region 102. With this configuration, when the mother board 101 is divided by the first dividing line 104 and the second dividing line 105, a plurality of wiring boards in which the shape of one main surface and the shape of the other main surface are different in the entire circumferential direction, A wiring board that can be formed in an integrated state, has excellent shape, and has excellent reliability such as electrical connection can be formed with high productivity.

  Further, as shown in FIG. 4, the mother board preferably has dummy areas 108 formed around each wiring board area 102. With this configuration, by using the dummy region 108, the first and second main surface sides are arranged in the mother substrate 101 as compared with the case where the wiring substrate regions 102 are adjacent to each other. The external shape of the wiring board can be performed in directions other than the direction of the first dividing line 104 and the second dividing line 105, and the outer shape of the one main surface and the outer shape of the other main surface are further different efficiently. It can be formed into a shape. For example, in FIG. 1, the wiring substrate region 102 is formed adjacent to one main surface side, but in FIG. 4, the dummy region 108 is disposed between the wiring substrate regions 102 on one main surface side and the other main surface side. Is formed.

  In FIG. 4, FIG. 4A is a plan view showing an example of the embodiment of the multiple wiring substrate, and FIG. 4B is a cross-sectional view taken along line BB ′ in FIG. It is sectional drawing. In FIG. 4, for convenience, the dummy region 108 formed on the outer periphery of the mother substrate 101 is described as an outer dummy region 108a, and the dummy region 108 formed between the wiring substrate regions 102 is described as an intermediate dummy region 108b. The outer dummy area 108a is formed as a non-product part on the outer peripheral portion of the mother board 101, and can be used as an area for facilitating the manufacture and transportation of the mother board 101. The mother dummy board 101 is processed or carried. It can be used for positioning and for fixing. In addition, in the outer dummy region 108a, a plating conduction pattern for attaching a plating layer to the wiring conductor 106 and a wiring conductor 106 for connecting to an external circuit board are formed on the side surface of the wiring board as necessary. A through hole is formed. Further, the intermediate dummy region 108b is formed as a non-product part between the wiring substrate regions 102 of the mother substrate 101, and if necessary, a plating conduction pattern for depositing a plating layer on the wiring conductor 106 or a wiring substrate A through hole for forming a wiring conductor 106 for connection to an external circuit board is formed on the side surface.

  In addition, as shown in FIG. 5, when the third dividing line 109 that divides the mother substrate 101 in a direction other than the direction of the first dividing line 104 is formed on one main surface side of the mother substrate 101, It is preferable that the plurality of wiring board regions 102 are arranged so that the third dividing line 109 overlaps a predetermined region of the plurality of wiring board regions 102. In FIG. 5, the third dividing line 109 is indicated by a long chain line. As a result, since the plurality of wiring board regions 102 can be divided by the third dividing line 109 at the same time, the outer shape of each wiring board region 102 can be efficiently formed. For example, on one main surface side, when the mother board 101 is divided along the first dividing line 104 and the third dividing line 109, the outer periphery of the outer dummy region 108a remains so that the mother board 101 is After dividing along the third dividing line 109 by the slicing method or the like, the mother board 101 is divided along the third dividing line 109 by the slicing method or the like, so that each wiring board is separated from the mother board 101 on one main surface side. Region 102 is divided.

  In addition, as shown in FIG. 6, in the dummy region 108, the connecting portion 110 that connects the insulating layer 101a on the one main surface side and the insulating layer 101c on the other main surface side is a first dividing line 104 and It is preferably formed so as not to overlap the second dividing line 105. With this configuration, when the mother board 101 is manufactured or handled, the mother board 101 is held by the connecting portion to reduce the possibility of deformation or cracking around the gap 103, and the mother board 101 is predetermined. Can be favorably divided by the first dividing line 104 and the second dividing line 105, and the outer shape of one main surface and the outer shape of the other main surface are Different wiring boards can be formed satisfactorily.

  Further, when the mother board 101 is divided by the first dividing line 104 and the second dividing line 105, the division can be favorably performed without being interrupted by the connecting portion 110.

  Preferably, the connecting portions 110 are arranged in a distributed manner in the mother board 101 in a plan view, thereby reducing the possibility of deformation or distortion of the mother board 101 when the mother board 101 is manufactured. Since the mother substrate 101 can be satisfactorily formed into a predetermined shape, when the mother substrate 101 is divided, it can be favorably divided by the first dividing line 104 and the second dividing line 105. It is possible to satisfactorily form a wiring board in which the outer shape of the main surface and the outer shape of the other main surface are different.

  Such a mother substrate 101 can be manufactured as follows. For example, among the ceramic green sheets for the insulating layers 101a, 101b, and 101c, when punching a through hole that becomes the cavity 103 in the ceramic green sheet for the insulating layer 101b, the connecting portion 110 and the dummy region 108 are formed. The ceramic green sheet for the insulating layer 101b is laminated on both main surfaces of the ceramic green sheet for the insulating layer 101b and then fired at a high temperature. it can. As a result, the connecting portion 110 is sintered and integrated with the insulating layer 101a on one main surface and the insulating layer 101c on the other main surface, and is firmly connected.

  Moreover, it is preferable that the connection part 110 is distributed and arrange | positioned in the mother board | substrate 101 by planar view. With this configuration, it is possible to reduce the possibility that the mother substrate 101 is deformed or distorted when the mother substrate 101 is manufactured, and the mother substrate 101 can be satisfactorily formed into a predetermined shape. The first dividing line 104 and the second dividing line 105 can be favorably divided, and a wiring board having a different outer shape on one main surface and an outer shape on the other main surface can be satisfactorily formed.

  Here, the connection parts 110 being distributed and arranged in the mother board 101 in a plan view means that they are arranged uniformly over the whole mother board 101. With such an arrangement, the wiring board is less likely to be distorted than when the connecting portion 110 is locally present in a part of the mother board 101.

  In addition, on the surface of the wiring conductor 106 exposed on the surface of the multi-piece wiring board, corrosion prevention of the wiring conductor 106, connection between the electronic component and the wiring conductor 106, and connection between the separated wiring board and the external circuit board are provided. In order to strengthen the bonding, it is preferable to perform plating such as Ni or Au.

  The wiring board of the present invention is obtained by dividing the above-described multiple-taken wiring board along the first dividing line 104 and the second dividing line 105. Thereby, it can be set as the wiring board excellent in reliability, such as the integrated electrical connection from which the external shape of the one main surface side differs from the external shape of the other main surface side.

  In addition, it is possible to mount an electronic component by utilizing the difference between the outer shape on the one main surface side and the outer shape on the other main surface side, or to join a metal member or the like, so that a small electronic device is obtained. be able to.

As shown in FIG. 7, the wiring board in the present invention is a wiring board formed by forming a wiring conductor 106 on an insulating board 201 in which a plurality of insulating layers are laminated and integrated. The outer side dimensions of the insulating layer 201a on the surface side and the insulating layer 201c on the other main surface side are larger than those of the insulating layer 201b located between them. With this configuration, an electronic component can be mounted using a difference between the outer shape on one main surface side and the outer shape on the other main surface side, or a metal member or the like can be joined. It can be.

  If the insulating substrate 201 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent, plasticizer, dispersant, etc. are applied to ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. The ceramic slurry obtained by adding and mixing is formed into a sheet shape by using a conventionally known sheet forming method such as a doctor blade method to obtain a ceramic green sheet, and thereafter, the ceramic green sheet is appropriately punched. It is manufactured by laminating at least three of these and firing at a high temperature (about 1500 to 1800 ° C.). Note that FIG. 7 shows an example in which the insulating substrate 201 is formed of three layers of insulating layers 201a, 201b, and 201c.

  Also, the wiring conductor 106 is printed and coated with a metallized paste for the wiring conductor 106 on a ceramic green sheet for the insulating substrate 201 by a printing means such as a screen printing method in the same manner as the above-described multiple-wiring wiring board. It is formed on the surface and inside by firing together with a ceramic green sheet. The wiring conductor 106 is electrically connected by a through conductor that penetrates the insulating substrate 201 as necessary.

  Further, the surface of the wiring conductor 106 exposed on the surface of the insulating substrate 201 is used to prevent corrosion of the wiring conductor 106, to connect the electronic component and the wiring conductor 106, and to the wiring board, as in the case of the multiple wiring board of the present invention described above. In order to strengthen the bonding between the external circuit board and the external circuit board, it is preferable to perform plating such as Ni or Au.

  Furthermore, an electronic device according to the present invention is obtained by mounting electronic components on the above-described wiring board. As a result, an electronic device having excellent reliability such as electrical connection can be obtained. In the case where the electronic component is an image sensor, external light can be incident on the image sensor placed on the substrate and an image can be captured.

  The above-described electronic components are semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal oscillators and piezoelectric vibrators, imaging elements, various sensors, and the like. It may be mounted on a wiring board divided along 104 and the second dividing line 105, or may be divided after a plurality of electronic devices are mounted on the wiring board.

  When the electronic component is a flip-chip type semiconductor element, the electrode of the semiconductor element and the wiring conductor are connected via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). 106, and when the electronic component is a wire bonding type semiconductor element, it is fixed with a bonding material such as glass, resin, brazing material, etc., and then via a bonding wire. This is performed by electrically connecting the electrode of the semiconductor element and the wiring conductor 106. When the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor 106 are electrically connected by a conductive resin. And an electronic component is sealed as needed. Sealing is performed by covering the electronic component with a sealing resin such as epoxy resin, or bonding a lid made of resin, metal, ceramics, etc. so as to cover the electronic component to glass, resin, brazing material, etc. What is necessary is just to carry out by attaching to an electronic component storage package with an agent.

  The present invention can be variously modified without departing from the gist of the present invention. For example, in the above description, the explanation is given for a multi-wiring board for forming a wiring board in which the outer shape of one main surface and the outer shape of the other main surface are different. You may use for the thing in which the board | substrate area | region was formed, and you may form the wiring board from which the external shape of one main surface differs from the external shape of the other main surface by this. Further, the wiring conductor 106 may be formed as a side conductor that is led out to the side surface of the wiring board and connected to the external circuit board. In addition, when performing the slicing process on the dummy region 108 of the mother substrate 101 so that the first dividing line 104, the second dividing line 105, and the third dividing line 109 can be accurately divided. An alignment mark or the like may be formed.

(A) is a top view in the one main surface which shows the example of embodiment of the multiple picking wiring board of this invention, (b) is a top view in the other main surface of the wiring board of (a). . It is sectional drawing in the A-A 'line of the multiple pick-up wiring board of Fig.1 (a). It is sectional drawing which shows the other example of embodiment of the multiple pick-up wiring board of this invention. (A) is a top view which shows the other example of embodiment of the multiple acquisition wiring board of this invention, (b) is the cross section in the BB 'line of the multiple acquisition wiring board of (a). FIG. It is a top view which shows the other example of embodiment of the multiple pick-up wiring board of this invention. It is sectional drawing which shows the other example of embodiment of the multiple pick-up wiring board of this invention. It is sectional drawing which shows the reference example of the wiring board of this invention.

Explanation of symbols

101 ... Mother board 102 ... Wiring board region 103 ... Cavity 104 ... First dividing line 105 ... Second dividing line 106 ... Wiring conductor 107 ... Recess 108 ..Dummy area 109 ... third dividing line 110 ... connecting portion 201 ... insulating substrate

Claims (7)

  A plurality of wiring board in which a plurality of wiring board regions are arranged vertically and horizontally at a central portion of a mother board formed by laminating a plurality of insulating layers, wherein a thickness direction at a boundary portion of the wiring board region of the mother board The first dividing line and the second dividing line for dividing the mother board into individual wiring board regions are planar on one main surface and the other main surface of the mother board, respectively. A plurality of the first dividing lines and the second dividing lines that do not overlap with each other in plan view on at least one side of the wiring board region. Wiring board.   2. The multiple wiring substrate according to claim 1, wherein the first dividing line and the second dividing line do not overlap each other in a plan view over the entire circumference of the wiring substrate region.   3. The multiple wiring substrate according to claim 1, wherein a dummy region is formed around each of the wiring substrate regions of the mother substrate. 4.   In the dummy region, a connecting portion that connects the insulating layer on the one main surface side and the insulating layer on the other main surface side is a region that does not overlap the first dividing line and the second dividing line in plan view. 4. The multiple wiring substrate according to claim 3, wherein the wiring substrate is formed.   The multi-connection wiring board according to claim 4, wherein the connecting parts are distributed and arranged in the mother board in a plan view.   6. A wiring board obtained by dividing the multi-piece wiring board according to claim 1 along the first dividing line and the second dividing line. Electronic apparatus characterized by mounting the electronic component on a wiring board according to claim 6 Symbol mounting.

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