JPS61134207A - Breaking device for substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a substrate breaking device, and particularly to a device for breaking a substrate such as a ceramic substrate such as a thermal head in which a large number of heating resistors are arranged in a line in a dividing groove. This is something that is meant to be divided accurately along the lines.

[Conventional technology]

For example, as a method of dividing a substrate made of ceramic or the like along the grooves, there is a method described in Japanese Patent Application Publication No. 5G-60.
The method proposed in No. 766 is to attach the ridges of a substrate cutter to a flat surface through an elastic body to break the substrate. However, in recent years, a large number of heat generating resistors are arranged in a line, which has been actively developed, and the break length of ceramics etc. has become noticeably longer, from 9A4 size (lIlOfl) to M8 size (297g). -110766
The method of breaking small substrates in the C@ manufacturing process, as proposed in
Normally you break manually, just in case.

In the manual breaking method, bring your fingertips as close as possible to the dividing groove at the edge of the ceramic substrate, apply pressure to your fingertips to break at the dividing groove, and use a glass cutter to break the glass. It was a break method that divided the parts according to the points.

[Problem that the invention seeks to solve]

In the conventional manual breaking method, it is necessary to apply all the force with the fingertips near the dividing groove and use a glass cutter to divide the glass after cutting. This not only limits the number of pieces that can be done, but also requires a lot of skill. However, there was a problem in that it required a lot of work and was not suitable for mass production. Thermal heads are getting bigger and bigger - Thermal heads are getting higher resolution or higher functionality (higher cost) is achieved by mounting drive IC chips, diode chips, etc. on the board. This breaking work is a work that is located after several work processes, and mistakes in the breaking work (defective products) can cause great losses.

This invention was made to solve the above-mentioned problems, and it is possible to reliably divide even a long board along the dividing groove, and also to mount drive IC chips, diode chips, etc. on the board. The purpose of this invention is to obtain a breaking device that can be divided without damaging the mounting part of a thermal head or the like.

[Means for solving problems]

In the board breaking device according to the present invention, the base plate of the receiver is inclined so that the splitting groove is line-symmetrically cut, and the board dividing groove is positioned above the branching member of this inclined surface with a forceps. Then, the bending force is concentrated on the dividing groove of the substrate by vacuum suction from the above-mentioned inclined surface, and in this vacuum suctioned state, a plunger bin is used to bend the substrate from the opposite side of the dividing groove at the end of the substrate, that is, from the surface of the thermal head substrate. Applying a shock,
The substrate is broken by creating a crack in the dividing groove.

[Effect]

In the substrate breaking device of the present invention, the vicinity of the dividing groove is bent by vacuum suction from the inclined surface, and the effect of the notch of the dividing groove is combined to cause concentration of bending stress.

When a light impact is applied to the plunger pin in the attracted state where bending stress is concentrated to generate a crack, the crack propagates along the dividing groove and breaks into the substrate.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) is a stand, with sloped surfaces (11, 12) arranged in a V-shape, a branch line (la) formed in a straight line, and the sloped surfaces (11, 12) each have suction. recess for (
lla, 12a) are provided. Also, a steep slope (11
, 12) are sheets (11b, 12t+) made of elastic material.
) are attached to the suction windows 11a', 12a') communicating with the suction recesses (lla, 12a), and the receiver is provided on the back surface of the thermal head board 12). A positioning bin (la) is provided for positioning the dividing groove (51a) (z) above the branch line (1a).
A heating resistor (2b) and a drive IC chip (2C) are provided on the surface. (31 is an air cylinder, which is engaged with a plunger pin (b) that slides under air control and is disposed perpendicular to the branch line (la).

In the above configuration, first of all, the thermal head board (2) is placed in contact with the positioning pin of the stand Il+, and the thermal head board (2) is placed above the branch line (1a) of the stand (1). Set the dividing groove (la) t on the back side of 21.

Next, the receiver is the suction recess (lla) of the fi+ stand.

12a) f Sheet (lit) by vacuum side
.

The thermal head substrate (21) is vacuum-adsorbed through the suction windows (tta', At the same time, this bending stress is compounded by the notch effect of the dividing fi (2a). In this state, the air cylinder (31) is actuated and the plunger is When the pin e11) is lowered, the surface of the thermal head board (2), that is, the dividing groove (
8a), where the bending stress is most concentrated, a light impact is applied to the back surface, which causes a crack in the thickness direction of the thermal head board (2) from the bottom of the dividing groove (2a) (the bending stress is resolved). At the same time, division 1 (2a) occurs.
), the crack, that is, the location where the bending stress is relieved, propagates (the propagation speed is a constant determined by the material) and the thermal head substrate (21) propagates.

〔Effect of the invention〕

As described above, according to the present invention, the receiver has a structure in which the stand is made into an inclined surface and vacuum suction is carried out from each inclined surface. Therefore, concentrated bending stress can be easily generated in the dividing groove of the substrate. This has the effect of allowing accurate breaking along the dividing groove by applying a light impact to the plunger pin.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing a substrate breaking device according to an embodiment of the present invention, and FIG. 2 is a side view showing the vacuum suction state of FIG. 1. l1l--One receiver is a stand, (la)--One branch line, (11,
12) -m-slanted surface, +21--thermal head board, (2a)-m-dividing groove, +31--air cylinder, c(n--plunger bin, the same reference numerals in the figures are the same) , or a corresponding portion.

Claims (1)

[Claims] In a breaking device for a substrate in which a dividing groove is provided in advance to be divided into a plurality of substrates, a pedestal having a V-shaped inclined surface so as to be line symmetrical with respect to the dividing groove of the substrate; A suction part provided on the slope of the pedestal and a plunger pin that applies an impact from above to the branch line formed by the slope of the pedestal, and the suction part applies bending stress to the dividing groove of the board. A circuit board breaking device characterized in that stress is concentrated and stress is propagated in this state by a light impact of the plunger pin.