JPS61139406A - Breaking device for substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a circuit board breaking device, and particularly to a T-dividing groove for a ceramic substrate such as a thermal head in which a large number of heating resistors are arranged in a row. It is related to things that can be performed and divided well.

[Conventional technology]

As a method of dividing a substrate made of ceramic or the like provided with dividing grooves along its skin, for example, Japanese Patent Application Laid-Open No. 50-6076
As proposed in Publication No. 6, the planar support is made by placing an elastic body on a stand, abutting the elastic body on top of it with the dividing groove on the back side, and inserting the back side of the dividing groove through the elastic body. I rarely tried to break the board by connecting it to the edge of the board cutter. However, in recent years, there have been many developments in the size of A4 size (210tm) to A3 size (297tm) in which multiple heating resistors are arranged in a row.
– and the longer break lengths of ceramics, etc. are noticeable.
The breaking method for small substrates in the IC manufacturing process, as proposed in the above-mentioned Japanese Patent Application Laid-open No. 50-60766''i!f, is not a breaking method with high accuracy and good yield;
Usually, the break was done manually.

In the manual breaking method, bring your fingertips as close as possible to the dividing groove at the edge of the ceramic substrate, apply force to the edge of the material so as to break it at the dividing groove, and then cut it with the glass cutter. It was a breaking method that divided the glass in the same way as breaking glass.

[Problem that the invention seeks to solve]

In the conventional manual breaking method, it is necessary to apply force with the tip of a finger near the dividing groove and use a glass knife to break the glass after the work. There was a problem in that it was a work that required a lot of time, and it was not suitable for mass production.

In addition, thermal heads are becoming larger and larger, thermal heads are becoming higher in resolution, and IC chips for drives are added to the radix.
For thermal heads etc. that are equipped with diode chips etc. to achieve high functionality (high cost), this breaking work is
This work is located after the picking process, and making a mistake in the breaking process (defective product) is a rare cause of large losses. Furthermore, the above-mentioned larger size increases its breaking force, and it can be used not only manually but also with the
The method disclosed in Japanese Patent No. 60766 also had the problem of increasing the size of the break device.

This invention was made in order to solve the above-mentioned problems, and even when a long board is used, it is difficult to divide the board into one piece due to the excessively applied load.
The purpose of the present invention is to obtain a break device that can be divided reliably at θ, and also capable of dividing a thermal head, etc., which has drive IC chips, diode chips, etc. mounted on the board, without damaging the mounted components. do.

[Flat Film for Solving Problems] The substrate breaking device according to the present invention tilts the stand so that it is symmetrical with respect to the dividing groove, and also aligns the center of the dividing groove in the longitudinal direction. This is because cracks occur in the pressing bar and the dividing groove, which are freely rotatable about an axis perpendicular to the dividing groove in the part and whose ridgeline is placed above the branch line on the slope of the pedestal. A punch is installed, and the board is pressed and clamped between the branch line on the inclined surface of the pedestal and the ridgeline of the pressing bar with the dividing groove on the branch line side, and a light impact is applied with a plunger pin to perform the dividing process. This was an attempt to break with the substrate by creating a crack in the groove.

[Effect]

The board breaking device according to the present invention includes a pressing bar, -
As the substrate bends and deforms, the contact area between the inclined surface and the substrate approaches the branch line of the inclined surface, narrowing the bending deformation area span and dividing the dividing groove. As a result of the notch effect of the groove, surrounding stress (pressure ME force is generated on the skin on the pressure bar side, and tensile stress is generated on the skin on the white side of the receiver) is concentrated. When a light impact is applied to the plunger pin in the pressed state where this bending stress is concentrated and a crack is generated in the dividing groove (tensile stress side), the turtle 5! is propagated along the dividing groove, and the substrate is broken regardless of the length of the dividing groove.

Embodiment of the Invention] Hereinafter, an embodiment of the invention will be described with reference to the drawings. 1st
In the figure, (υ is a stand and a V-shaped inclined surface (
11) and (12) are arranged and a branch line (1a) is formed in a straight line.
is formed. Sheets (lla) and (12a) made of elastic material are attached to the inclined surfaces (11) and (12), and the dividing grooves (2a) provided on the back surface of the themed head board (2) are used to branch out the above! (la) Positioning pins (llb, 1ie) for upward positioning are provided. A plurality of heating resistors (2c) are arranged on the surface of the thermal head base & (2), and a drive IC chip (2b) is mounted thereon. (3) is a pressure bar,
Its one end (tip) protrudes in a V-shape and is provided with a ridge line (3a) finished to a predetermined radius), and a line parallel to the ridge line (3a) is provided at the center of the length of this 82 line (3a). A hole (3b) perpendicular to the direction and a guide hole (3b) perpendicular to the vertical direction.
31) and the ridge line (3a) of the guide hole (31) is partially cut out and a 7'L cutout (31a) is provided.(1
3) is a guide pin, which is attached to the ridgeline (
3a), the receiver is inserted into the sliding support above the branch line (1a) of the stand (1). (4) is a support shaft, which rotatably engages with the hole (3b) of the suppression bar (3), and this support shaft (4) is installed in the arm block (5)K. (6
) is a plunger pin that is slidably fitted into the guide hole (31) of the press bar (3), and its tip (6a) is tapered and fits into the notch of the press bar (3). (31
a) is configured to protrude above the ridgeline (3a).

In the above configuration, first of all, one end of the nurse head board (2) is connected to the positioning pin (11) of the base (1).
b, 11 c) Support 4qll while in contact with
With I(4) almost at the center, the receiver is connected to the branch line (1a) of stand (1).
) A dividing groove (2a) is set on the back surface of the thermal head substrate (2). Next, when the arm block (5) and an air cylinder (not shown) are operated in the direction of arrow A, the press bar (3) is guided by the guide pin (13) and its ridgeline (3a) is aligned with the support of the stand (1). Branch line (1a
) descends from above.

As a result, the ridge line (3a) comes into contact with the opposite surface of the dividing groove (2a), that is, the surface of the thermal head board (2), and the branch line (1a), the dividing groove (2a), and the ridge line (3a) are aligned on the same line. Further, by operating the arm 7" on-link (5) in the direction of arrow A, El <
The chip board (2) starts to curve, the contact part of the ridge line (3a) on the front surface of the 7F board (2) to the thermal is compressed, and the back surface with the dividing groove (2a) is pulled, so-called bending. Stress occurs. This bending stress is applied via the pressure bar (3) rotatably engaged with the support shaft (4), so that the ridge vA (3a) and the thermal head board (2)
It becomes uniform at the contact part. Note that the deformation region span in this state is l. (Status shown in Figure 2) Furthermore, A
When the arm glock (5) is operated in the direction of the arrow, the deformation range span shifts to 11 as shown in Figure 3, and the bottom of the dividing groove (2a) is sharply bent due to the cutting effect of the dividing groove (2a). Concentrate stress (state shown in Figure 3). This third
In the state of the deformation region shown in the figure, when a light impact is applied to one end of the pin (6) with a plunge, the tapered tip of the other end is applied to the part of the thermal head base & (2) where the bending stress is concentrated the most, causing the pin to split. At the same time, a crack (a phenomenon in which bending stress is eliminated) occurs in the thickness direction of the thermal head board (2) from the bottom of the splitting tJ4 (2a).
), the crack, that is, the location where the bending stress is relieved, propagates (the propagation speed is a constant determined by the material), and the thermal head substrate (2) breaks.

In the above-mentioned embodiment, a breaking method using a pressing bar having a ridge line interrupted only at one plunger pin portion was shown, but the same effect can be achieved with a so-called virtual shape with multiple interrupted portions.

Also, if the positioning pin can be adjusted and/or moved,
Of course, boards of different dimensions can be played with the same breaking device.

[Effects of the Invention] As described above, according to the present invention, since the support is constructed with an inclined surface, the deformation region span decreases depending on the amount of descent of the suppression bar, which not only concentrates bending stress but also The notch effect of the groove is further enhanced, and at the same time, since the press bar and the pin support structure are made rotatable, the press shape 1a can generate uniform bending stress over the entire break range. In addition, when this bending stress builds up, a plunger pin VC@I-machi shock is applied to cause the break to occur due to stress propagation, which not only allows a high-precision break to be achieved in the dividing groove, but also ensures a reliable break. There is an effect that the break can be applied to the pattern of the dividing groove, and the Katsura load, that is, the break device can be made light and compact.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing a substrate breaking device according to an embodiment of the present invention, and FIG. 2 is a state of the suppression process shown in FIG. 1. FIG. 3 is an enlarged side view showing the thermal head in FIG. 1 on the verge of breaking. (1)...The receiver is the stand, (10)...The branch line, (11,
12)...Slanted surface, (2)...Thermal head board, (2a)...Dividing groove, (3)...Press bar, (
3a)...Ridge line, (4)...Support shaft, (6)...
Plunger pin In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A breaking device for a board in which a dividing groove is provided in advance to be divided into a plurality of substrates includes a pedestal having a V-shaped inclined surface so as to be line symmetrical with respect to the dividing groove, and this holder. It has a ridge line arranged above the branch line formed by the inclined surface of the stand, and is rotatably engaged with an axis horizontally orthogonal to the branch line at the longitudinal center of the branch line. A circuit board breaking device characterized in that bending stress is concentrated and propagated in the dividing groove of the circuit board by a light impact of a pressing bar that fits together and a plunger pin that is perpendicularly intersecting from above the branch line.