JP2714556B2 - Circuit board dividing mold driving method and circuit board dividing apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board dividing mold driving method and a circuit for taking a plurality of individual circuit boards from one board and dividing the plurality of circuit boards into individual circuit boards. The present invention relates to a substrate dividing device.

[0002]

2. Description of the Related Art Conventionally, as a method of dividing a so-called multiple circuit board into individual circuit boards, there is a method of punching individual circuit boards at once using a high-pressure press device. Also, a V-shaped groove is formed at a predetermined dividing line of the substrate,
In some cases, the sheet is made to be easily broken, and is divided at the V-groove portion at the time of division. Further, there is a device in which perforations are formed along a dividing line, and the substrate is folded at the perforations to divide the circuit board into individual circuit boards as in the case of the V-groove.

[0003]

In the case of the above-mentioned prior art press, since a relatively large punch and a die are used to punch and separate the divided portions at a time, a large force is required for the press. There has been a problem that the size of the apparatus is increased and the punches and dies are also large. Furthermore, the device is large, the gap between the punch and the die is relatively large, the positioning accuracy of the two is poor, the divided cross section is rough, and the substrate is liable to crack. In particular, the step of individually dividing each circuit board is after soldering, and unnecessary stress acts on the board and the attached parts at the time of this press division, which causes a reduction in the electrical reliability of the circuit board. there were. Further, there is a problem that the above-described V-groove can be used only when the divided portion is linear, and the formation of the V-groove is difficult to control the depth and is relatively expensive. Also, in the case of division by perforation, the punched part of the perforation must be lengthened and the bridge part shortened in order to facilitate the work of breaking the substrate, so that the division part in the middle of the work process There is a problem that it is easily broken. Conversely, if the bridge portion is lengthened, it will not be broken exactly along the perforations, resulting in poor division. Further, there is a problem that the cross section of the perforated line is not clear and can be used only for a linearly divided portion.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and provides a circuit board dividing mold driving method and a circuit board dividing apparatus capable of dividing a circuit board with high accuracy, accuracy, and neatness. The purpose is to provide.

[0005]

According to the present invention, a plurality of circuit board regions are formed on a single board, and when the board is divided into individual circuit boards, an upper mold and a lower mold are used. At least one of the substrate dividing molds is held in a state movable in the horizontal direction, and the substrate is formed by the upper mold and the lower mold.
For each punching operation, a guide post for positioning the upper mold and the lower mold is inserted into the positioning hole,
After the relative positioning of the upper mold and the lower mold is made,
The position of the mold that can be moved in the horizontal direction is used as the mounting member for the mold.
Fixed, then punching out a predetermined position of the substrate,
Release the position of the mold before punching the next substrate.
This is a method for driving a circuit-substrate-dividing mold, which is capable of moving in a horizontal direction by removing the same.

According to another aspect of the present invention, an upper mold and a lower mold are provided for dividing a plurality of circuit boards, each having a plurality of circuit boards formed on a single board, into individual circuit boards. It has a pair of mounting members each holding a mold and a lower mold, and a clamp device for fixing each of the dies to the mounting member, and a positioning device provided on one of the upper mold and the lower mold. fitting the above guide posts provided in the guide post and the other to carry out
A positioning hole for positioning the upper mold and the lower mold relative to each other to control the clamping and unclamping operations of the clamping device, and When the upper mold and the lower mold approach each other for each punching operation, one of the split molds including the upper mold and the lower mold is held in a horizontally movable state, and the guide post is Up
The position of the mold movable in the horizontal direction after being inserted into the serial positioning hole is fixed relative to the mounting member,
Punching a predetermined position on the substrate, and punching the next substrate
Moving horizontally to release the position of the mold prior to come
A circuit board dividing device provided with a control device for controlling the clamp device so as to be free . Also, the pair of mounting
A positioning post is provided on one of the members, and
The positioning post is inserted to position the pair of mounting members.
A positioning hole for performing the fixing is formed .

[0007]

In the circuit board dividing apparatus according to the present invention, the positioning of the upper mold and the lower mold is accurately performed by the guide post for each punching operation. There is no displacement between the dies, the punching accuracy is high, and the cross section of the punched circuit board is also clean.

[0008]

An embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 2 and 3, a circuit board dividing apparatus according to this embodiment includes a punch 10 having a stepped upper mold and a punch plate 12 to which a normal columnar punch 11 is attached. , 11 are inserted and die 14 as a lower die for punching substrate 13. The punch plate 12 is fixed to the upper die holder 15, and the die 14 is fixed to the lower die holder 16. A guide post 18 for positioning is protruded from the corner of the upper die holder 15 toward the die 14, and the guide post 1 is provided on the die 14 and the lower die holder 16.
Positioning holes 19 and 20 are formed through which the holes 8 are inserted and positioned.

After punching a substrate 13 which is a workpiece by punches 10 and 11, the upper die holder 15
When 0 and 11 rise, the circuit board is
A stripper 22 that is separated from the motor 11 is attached via a coil spring 23. Therefore, the stripper 22
The lower surface is located slightly below the distal ends of the punches 10, 11, and is relatively retractable at the base ends of the punches 10, 11 at the time of punching by a coil spring 23.

In the die 14, punch holes 24, 25 are formed at locations corresponding to the punches 10, 11, and the lower die holder 16 communicates with the punch holes 24, 25 to form the punch holes 24, 25. An escape space 21 having a larger width and inner diameter is formed. Then, the punches 10 and 11 and the punched holes 24 and 25 of the die 14 are formed.
Is formed with an accuracy of 1/100 mm or less. The length of the punches 10 and 11 is
At the lowest position where 0 and 11 are inserted into the die 14, the tip of the shortest punch is also set to a length that is located in the escape space 21.

As shown in FIG. 3B, the punch 10 is formed in, for example, three stages in the punching direction, and each of the punch pieces 10a, 10b, 10c has a substrate difference with a delay of the step difference. 13 is punched out. Each punch piece 1
The cutting edges 0a to 10c have arc-shaped concave portions 27 formed therein. This prevents a horizontal force from acting on the substrate 13 at the time of punching, and allows the tip of the punch 10 to be easily inserted into the substrate 13.
Furthermore, since the punch 10 is divided into three, the punching force is reduced to one third. And each punch piece 1
0a to 10c are provided integrally, and the punch plate 12
It is fixed to.

As shown in FIG. 4, the substrate 13 has a circuit board 26 on which electronic elements are mounted.
At the corners of the circuit board 26 and the like, a dividing long hole 28 for dividing the circuit board 26 is formed. A space between the long slots 28 is a punched portion 29. The punched portion 29 is a bridge portion connecting the circuit board 26 and the board 13, and is formed to be relatively long so that the circuit board 26 is not separated during a predetermined work process. The long punched portion 29 of the punched portion is formed by the stepped punch 1 described above.
It is punched by 0. Therefore, the number of steps and the size of the punch pieces of the stepped punch 10 are set by the length of the punched portion 29.

Press device 3 for driving punches 10 and 11
Reference numeral 0 denotes a movable member 33 of an air cylinder device 32 to which an attachment member 31 to which the upper die holder 15 is attached is attached as shown in FIGS. And the upper die holder 15
Are air cylinders 3 provided on both sides of the mounting member 31.
6 is held by a clamping device 38 whose clamping and unclamping operations are controlled. This clamping device 3
Numeral 8 holds the upper die holder 15 so that it can be fixed and released. The mounting member 31 is provided so as to be freely lowered by the air cylinder device 32 while holding the upper die holder 25. Further, the base portion 34 is provided with a mounting member 39 of the lower die holder 16, and the clamp device 40 of the mounting member 39 is driven by the air cylinder 42 to fix and release the lower die holder 16. keeping. Further, positioning posts 37 for the mounting members 31 and 39 are provided at the four corners of the mounting member 31, and positioning holes 43 into which the positioning posts 37 are inserted are formed in the mounting member 39. Further, below the mounting member 39, a chute 35 for discharging chips from the punched substrate is mounted. The press device 30 is provided with a control device 44 for controlling the air cylinder device 32 and each of the air cylinders 36, 42, and the like, and performs operations described later. In addition, since the press device 30 of this embodiment uses the punch 10 divided into the punch pieces 10a to 10c, the press device 30 may be relatively small, and the thrust of the press may be around 3 tons.

In the method of driving the circuit board dividing mold according to this embodiment, the substrate 13 is set on the die 14 attached to the lower mold holder 16, the lower mold holder 16 is set on the attaching member 39, and the clamping device 40 is set. To fix in place.
Thereafter, under the control of the control device 44 of the press device 30,
The mounting member 31 holding the upper die holder 15 is lowered.
At this time, the clamp device 38 is shifted from the clamp state shown in FIG. 7 to the unclamped state shown in FIG.
5 is held so as to be movable in the horizontal direction. And
The mounting member 31 is lowered, and the positioning post 37 is inserted into the positioning hole 43 as shown in FIG.
9 is regulated. From this state, after the guide post 18 is inserted into the positioning hole 19 as shown in FIG. 10, the clamp device 38 is clamped to fix the upper die holder 15 to the mounting member 31. Thus, the positions of the upper die holder 15 and the lower die holder 16 are accurately set.

Thereafter, the punches 10 and 11 punch the substrate 13. At this time, first, the stripper 22 comes into contact with the substrate 13, and the coil spring 2
3 are compressed, and as shown in FIG.
Punches out a predetermined punching portion 29 of the substrate 13. At this time, the punching portion 29 having a long distance is punched by the punch 10, and the punch 10 is
The punched portion 29 of the substrate 13 is punched in the order of b and 10c. The punched pieces 13a of the substrate punched by the punches 10 and 11 are, as shown in FIG.
Holes 24 and 25 of the die 14 are formed by the tip of the die 11.
, Falls into the escape space 21 and is discharged through the chute 35. In this dividing step, as shown in FIG. 6, after various electronic elements 36 are attached to the front and back surfaces of the circuit board 26, the circuit board 26 is divided into individual circuit boards 26.

When the upper die holder 15 rises after the punching, even if the punches 10 and 11 rise, the stripper 22 holds the substrate 13 by the coil spring 23, and the punches 10 and 11 And the stripper 22 is moved away from the substrate 1 only during the stroke of the coil spring 23.
After pressing 3, the stripper 22 moves up together with the upper die holder 15. Therefore, the substrate 13 is not lifted by being caught by the punches 10 and 11.

According to this embodiment, the positioning between the upper die holder 15 and the lower die holder 16 is performed by first inserting the positioning posts 37 for positioning the mounting members 31 and 39 into the positioning holes 43. The positions of the attachment members 31 and 39 are accurately adjusted.
After the upper die 15 is inserted into the positioning holes 19 and 20 of the lower die holder 16 and the lower die holder 16, the upper die holder 15 is fixed by the clamp device 38.
The position between the die and the die 14 is set accurately, and accurate and reliable punching is possible.

Further, since the positioning can be performed accurately, the clearance between the punches 10 and 11 and the punched holes 24 and 25 of the die 14 can be reduced to 1/100 mm or less, which not only has high dimensional accuracy but also has high dimensional accuracy. The blank 13a of the substrate 13 does not enter between the punched holes 24 and 25 and the punches 10 and 11, and the blank 13a can be completely released into the escape space 21 and discharged. In addition, the shear surface of the substrate 13 can be made extremely clean. Especially,
The substrate 13 for the circuit board 26 is provided with glass fiber as a core material.
Entering the gap between the holes 0 and 11 and the punched holes 24 and 25 shortens the life of the punches 10 and 11 and the die 14 and is not preferable. In particular, when the side walls of the punched holes 24, 25 of the die are thin, unnecessary stress is applied at the time of punching due to the debris or the like, which causes the accuracy of the punched holes 24, 25 to decrease.
This can be reliably prevented.

Further, when punching is performed at a relatively long interval by the punch 10 as in this embodiment, the punch pieces 10a to 10c punch the punched portions one by one step by step. Even if the thrust of the thirty is relatively small, the punching can be reliably performed, and an air press device can be used. In addition, since the bridge portion can be lengthened, the circuit board 26 does not warp due to heat generated when the electronic element 36 is soldered to the circuit board 26.

Incidentally, the structure of the mounting member and the clamp device of the present invention may be any one that can hold the respective molds or the holders of the molds so as to be able to fix and release the fixing freely.
The shape and the holding mechanism are not limited. In addition, the clamping and unclamping may be repeated after each time, using a lower clamping device, or by positioning the upper and lower mold clamping devices each time.

[0021]

According to the circuit board dividing mold driving method and the circuit board dividing apparatus of the present invention, the positioning of the mold is accurately performed for each punching operation so that a predetermined portion is punched. In addition, it is possible to always perform high-precision and reliable punching without lowering the positioning accuracy due to long-term use and without gradually shifting the aligned position with use.

[Brief description of the drawings]

FIG. 1 is a front view of a circuit board dividing device according to an embodiment of the present invention.

FIG. 2 is a partially cutaway front view of a mold of the circuit board dividing device according to the embodiment.

FIG. 3 is a plan view (A) and a front view (B) showing a mold punch of the circuit board dividing device of this embodiment.

FIG. 4 is a plan view of a circuit board divided by the circuit board dividing device of this embodiment.

FIG. 5 is a longitudinal sectional view showing a use state of the circuit board dividing device of this embodiment.

FIG. 6 is a longitudinal sectional view showing another use state of the circuit board dividing device of this embodiment.

FIG. 7 is a front view showing the operation of the clamp device of the circuit board dividing device of this embodiment.

FIG. 8 is a front view showing the operation of the clamp device of the circuit board dividing device of this embodiment.

FIG. 9 is a partially enlarged front view showing a use state of the circuit board dividing device of this embodiment.

FIG. 10 is a partially enlarged front view showing a use state of the circuit board dividing device of this embodiment.

[Explanation of symbols]

 10, 11 Punch 14 Dice 15 Upper die holder 16 Lower die holder 18 Guide post 19.20, 43 Positioning hole 30 Press device 31, 39 Mounting member 38, 40 Clamping device 44 Control device

Claims (3)

(57) [Claims] 1. A method of forming a plurality of circuit board regions on a single substrate, and dividing the circuit board into individual circuit boards, wherein at least one of a substrate dividing mold comprising an upper mold and a lower mold. It was kept in movable state in a horizontal direction, on the
Each time the substrate is punched by the mold and the lower mold , a guide post for positioning the upper mold and the lower mold is inserted into a positioning hole, and the relative position of the upper mold and the lower mold is adjusted.
After the decision has been made, the position of the mold
Is fixed to the mounting member of the mold.
Punching out a predetermined position on the board, before the next
Release the fixed position of the mold and move freely in the horizontal direction
A method for driving a mold for dividing a circuit board. 2. An upper mold, a lower mold, and an upper mold for dividing a multi-piece board, in which a plurality of circuit boards are formed on a single board, into individual circuit boards. And a pair of mounting members each holding the lower die, a clamp device for fixing each of the dies to the mounting member, and a guide post provided on one of the upper die and the lower die for positioning. And the guide post provided on the other side is fitted with the upper mold and the lower mold.
A positioning hole for performing relative positioning, and a clamp and unclamping operation of the clamp device are controlled.
When the upper mold and the lower mold approach each other for each one punching operation of the substrate, one of the dividing molds including the upper mold and the lower mold is movable in a horizontal direction. holding, together with the guide post to fix the position of the mold movable in the horizontal direction after being inserted into the positioning holes with respect to the mounting member, punching the predetermined position of the substrate, the following
Release the position of the mold before punching the substrate
And a control device for controlling said clamp device so as to be movable in the horizontal direction . 3. A positioning post is provided on one of the pair of mounting members, and a positioning hole is formed in the other of the pair of mounting members for positioning the pair of mounting members. Item 3. The circuit board dividing device according to Item 2.