TW201608305A - Method for manufacturing liquid crystal display panel - Google Patents

Abstract

The present invention provides a method for manufacturing a liquid crystal display panel, which allows performance of a breaking step without turning over a cell substrate and comprises: forming a trench line TL in a first primary surface SF1 of a first brittle substrate 11, the trench line TL being formed in a state of no cracking; laminating the first brittle substrate 11 and a second brittle substrate 12 in a manner that the first primary surface SF 1 of the first brittle substrate 11 and a third primary surface SF3 of the second brittle substrate 12 face each other; forming a cracking line CL by allowing cracking of the first brittle substrate 11 to extend in a thickness direction along the trench line TL; forming a cracking line CL in the fourth primary surface SF4 of the second brittle substrate 12; breaking the first and second brittle substrates 11, 12 by applying a load, in a localized manner, to a second primary surface SF2 of the first brittle substrate 11 and bending the first brittle substrate 11 and the second brittle substrate 12.

Description

Liquid crystal display panel manufacturing method

The present invention relates to a method of fabricating a liquid crystal display panel.

In the method of manufacturing a liquid crystal display (LCD) panel, it is necessary to break a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and then the substrate is separated along the scribe line. The scribe line can be formed by mechanically processing the substrate using the tip end. A plastically deformed trench is formed on the substrate by displacing the cutter on the substrate while forming a vertical crack immediately below the groove. Thereafter, a stress imparting called a cracking step is performed. The crack is completely progressed in the thickness direction by the cracking step, thereby breaking the substrate.

Patent Document 1 exemplifies a method of manufacturing a panel product. According to this example, first, a glass substrate having a structure in which a first substrate and a second substrate are bonded is prepared. A scribe line is formed on each of the front and back surfaces of the glass substrate. The glass substrate is divided by pressing the cracked rod on the front and back surfaces of the glass substrate.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-161674

According to the technique described in the above publication, it is necessary to press the one surface and the other surface of the glass substrate (cell substrate) with the rupture rod. Therefore, in order to perform processing on the other side after processing one surface, it is necessary to invert the unit substrate.

The present invention has been made in order to solve the above problems, and its purpose is to provide A method of manufacturing a liquid crystal display panel capable of performing a cracking step without inverting a unit substrate.

The method of manufacturing a liquid crystal display panel of the present invention has the following steps.

Preparing a first brittle substrate having a first main surface and a first main surface The second main surface opposite to the main surface has a thickness direction perpendicular to the first main surface. A second brittle substrate having a third main surface and a fourth main surface opposite to the third main surface is prepared.

The tip end of the blade is pressed against the first main surface of the first brittle substrate. By having pressed The tip end of the blade slides on the first main surface of the first brittle substrate, and plastic deformation occurs on the first main surface of the first brittle substrate, thereby forming a first groove line having a groove shape. The first groove line is formed immediately below the first groove line, and the first brittle substrate is formed in a state in which the first brittle substrate is continuously connected in a direction intersecting the first groove line, that is, in a non-crack state.

After the first groove line is formed, the first main surface and the second surface of the first brittle substrate The first brittle substrate and the second brittle substrate are bonded to each other so that the third main surface of the brittle substrate faces. The first brittle substrate and the second brittle substrate are bonded to each other such that the first groove line formed on the first brittle substrate at least partially covers the second brittle substrate.

After the first brittle substrate and the second brittle substrate are bonded to each other, The groove line extends the crack of the first brittle substrate in the thickness direction to form a first crack line. By the first crack line, the first brittle substrate is continuously connected in the direction immediately intersecting with the first groove line, and the first brittle substrate is continuous in the direction intersecting the first groove line.

A second crack line is formed on the fourth main surface of the second brittle substrate.

The first one is applied locally on the second main surface of the first brittle substrate to make the first The brittle substrate and the second brittle substrate are bent, thereby being separated along the first crack line and the second crack line, respectively The first brittle substrate and the second brittle substrate.

According to the present invention, the first brittle substrate and the second brittle substrate are broken. It is carried out by application of a load on the second main surface of the first brittle substrate. Thereby, in the cracking step, it is not necessary to invert the unit substrate having the first brittle substrate and the second brittle substrate. According to this, the breaking step can be performed more easily.

11‧‧‧CF substrate (brittle substrate)

12‧‧‧TFT substrate (brittle substrate)

20‧‧‧Liquid layer

21‧‧‧ Sealing Department

51, 51v‧‧‧ blade front end

60‧‧‧ platform

61‧‧‧breaking mat

71‧‧‧crack

72‧‧‧Break the roller

101‧‧‧LCD panel (liquid crystal display panel)

AL‧‧‧Auxiliary line

CL‧‧‧crack line

ED1‧‧‧ side (1st side)

ED2‧‧‧ side (2nd side)

N1‧‧‧ position (1st position)

N2‧‧‧ position (2nd position)

SF1, SF3‧‧‧ inside (main surface)

SF2, SF4‧‧‧ outside (main surface)

SL‧‧ scribe

TL‧‧‧ trench line

PP, PPv‧‧‧ protrusion

PS, PSv‧‧‧ side

Fig. 1(A) is a perspective view schematically showing a configuration of a liquid crystal display panel in accordance with a first embodiment of the present invention; and Fig. 1(B) is a schematic cross-sectional view taken along line IB-IB of Fig. 1(A).

Fig. 2 is a flow chart schematically showing a method of manufacturing the liquid crystal display panel of Fig. 1.

FIG. 3(A) is a cross-sectional view along line IIIA-IIIA (FIG. 4) of the first step of the substrate scribing method in the method of manufacturing a liquid crystal display panel according to the first embodiment of the present invention; FIG. (B) is a schematic end view of the second step along the line IIIB-IIIB (Fig. 5); Fig. 3(C) is a schematic view of the third step along the line IIIC-IIIC (Fig. 6) Fig. 3(D) is a schematic end view showing the fourth step along the line IIID-IIID (Fig. 7).

FIG. 4 is a plan view schematically showing a first step of the substrate scribing method in the method of manufacturing the liquid crystal display panel in the first embodiment of the present invention.

FIG. 5 is a plan view schematically showing a second step of the substrate scribing method in the method of manufacturing the liquid crystal display panel in the first embodiment of the present invention.

FIG. 6 is a plan view schematically showing a third step of the substrate scribing method in the method of manufacturing a liquid crystal display panel according to the first embodiment of the present invention.

Fig. 7 is a view schematically showing the manufacture of a liquid crystal display panel in the first embodiment of the present invention; A plan view of the fourth step of the substrate scribing method in the method.

FIG. 8(A) is a plan view schematically showing a configuration of a groove line formed in a substrate scribing method in a method of manufacturing a liquid crystal display panel according to Embodiment 1 of the present invention; FIG. 8(B), The end view of the configuration of the crack line is schematically shown.

FIG. 9(A) is a plan view schematically showing a first step of the substrate cracking method in the method for manufacturing a liquid crystal display panel according to the first embodiment of the present invention, and FIG. 9(B) is a view schematically showing The end view of the second step along line IXB-IXB (Fig. 12).

Fig. 10(A) is a front view schematically showing a state in which the load application in Fig. 9(A) is performed by a split rod; Fig. 10(B) is a line XB- along the line of Fig. 10(A) A schematic cross-sectional view of XB.

Fig. 11(A) is a front view schematically showing a state in which the load application in Fig. 9(A) is performed by a rupture rod; Fig. 11(B) is a line XIB- along the line of Fig. 11(A) A schematic cross-sectional view of the XIB.

Fig. 12 is a schematic plan view corresponding to Fig. 9(B).

Fig. 13(A) is an end view showing a first step in the first comparative example, and Fig. 13(B) is an end view showing the second step.

Fig. 14(A) is an end view showing a first step in the second comparative example; Fig. 14(B) is an end view showing the second step; and Fig. 14(C) is a third step thereof. End view.

Fig. 15(A) is a plan view schematically showing the first step of the method for manufacturing a liquid crystal display panel according to the second embodiment of the present invention along the line XVA-XVA (Fig. 16); Fig. 15(B), The end view of the second step along the line XVB-XVB (Fig. 17) is schematically shown; and Fig. 15(C) is a schematic view of the third step along the line XVC-XVC (Fig. 18). Fig. 15(D) is a plan view schematically showing the fourth step along the line XVD-XVD (Fig. 19); Fig. 15(E) is a schematic view showing the fifth step. An end view along the line XVE-XVE (Fig. 20).

FIG. 16 is a plan view schematically showing a first step of the method of manufacturing the liquid crystal display panel in the second embodiment of the present invention.

Fig. 17 is a plan view schematically showing a second step of the method of manufacturing the liquid crystal display panel in the second embodiment of the present invention.

FIG. 18 is a plan view schematically showing a third step of the method of manufacturing the liquid crystal display panel in the second embodiment of the present invention.

FIG. 19 is a plan view schematically showing a fourth step of the method of manufacturing the liquid crystal display panel in the second embodiment of the present invention.

FIG. 20 is a plan view schematically showing a fifth step of the method of manufacturing the liquid crystal display panel in the second embodiment of the present invention.

Fig. 21 is a flow chart schematically showing a method of manufacturing a liquid crystal display panel in accordance with a third embodiment of the present invention.

Fig. 22 (A) is a plan view schematically showing an end face along the line XXIIA-XXIIA (Fig. 23) of the first step of the method for manufacturing a liquid crystal display panel according to the third embodiment of the present invention; and Fig. 22(B). The end view of the second step along the line XXIIB-XXIIB (Fig. 24) is schematically shown; Fig. 22(C) is a schematic view of the third step along the line XXIC-XXIIC (Fig. 25). Fig. 22(D) is a plan view schematically showing the fourth step along the line XXIID-XXIID (Fig. 26); Fig. 22(E) is a schematic view showing the fifth step. An end view along the line XXIIE-XXIIE (Figure 27).

FIG. 23 is a plan view schematically showing a first step of the method of manufacturing the liquid crystal display panel in the third embodiment of the present invention.

Fig. 24 is a plan view schematically showing a second step of the method of manufacturing the liquid crystal display panel in the third embodiment of the present invention.

Fig. 25 is a plan view schematically showing a third step of the method of manufacturing the liquid crystal display panel in the third embodiment of the present invention.

FIG. 26 is a plan view schematically showing a fourth step of the method of manufacturing the liquid crystal display panel in the third embodiment of the present invention.

FIG. 27 is a plan view schematically showing a fifth step of the method of manufacturing the liquid crystal display panel in the third embodiment of the present invention.

FIG. 28 is a flow chart schematically showing a method of manufacturing a liquid crystal display panel in a modification of the third embodiment of the present invention.

Fig. 29 is a plan view schematically showing a step along the line XXIX-XXIX (Fig. 30) of a step of manufacturing a liquid crystal display panel in a modification of the third embodiment of the present invention.

FIG. 30 is a plan view schematically showing a step of a method of manufacturing a liquid crystal display panel in a modification of the third embodiment of the present invention.

Fig. 31 is a flow chart schematically showing a method of manufacturing a liquid crystal display panel in accordance with a fourth embodiment of the present invention.

FIG. 32(A) is a cross-sectional view along line XXXIIA-XXXIIA (FIG. 33) of the first step of the method for manufacturing a liquid crystal display panel according to Embodiment 4 of the present invention; FIG. 32(B), The end view of the second step along the line XXXIIB-XXXIIB (Fig. 34) is schematically shown; Fig. 32(C) is a schematic view of the third step along the line XXXIIC-XXXIIC (Fig. 35) FIG. 32(D) schematically shows an end view along the line XXXIID-XXXIID (FIG. 36) of the fourth step; and FIG. 32(E) schematically shows the fifth step thereof. An end view along line XXXIIE-XXXIIE (Fig. 37).

Figure 33 is a view schematically showing the manufacture of a liquid crystal display panel in Embodiment 4 of the present invention. A top view of the first step of the method.

Fig. 34 is a plan view schematically showing a second step of the method of manufacturing the liquid crystal display panel in the fourth embodiment of the present invention.

35 is a plan view schematically showing a third step of the method of manufacturing the liquid crystal display panel in the fourth embodiment of the present invention.

Fig. 36 is a plan view schematically showing a fourth step of the method of manufacturing the liquid crystal display panel in the fourth embodiment of the present invention.

37 is a plan view schematically showing a fifth step of the method of manufacturing the liquid crystal display panel in the fourth embodiment of the present invention.

Fig. 38 is a flow chart schematically showing a method of manufacturing a liquid crystal display panel in a modification of the fourth embodiment of the present invention.

Fig. 39 is a plan view schematically showing a step along the line XXXIX-XXXIX (Fig. 40) of a step of manufacturing a liquid crystal display panel in a modification of the fourth embodiment of the present invention.

Fig. 40 is a plan view schematically showing a step of a method of manufacturing a liquid crystal display panel in a modification of the fourth embodiment of the present invention.

Fig. 41 is a flow chart schematically showing a method of manufacturing a liquid crystal display panel in accordance with a fifth embodiment of the present invention.

Fig. 42(A) is a side view schematically showing a configuration of an apparatus used in a method of manufacturing a liquid crystal display panel according to a sixth embodiment of the present invention; and Fig. 42(B) is a view of Fig. 42(A) The viewpoint of the arrow XIIIB is a plan view schematically showing the configuration of the tip end of the blade.

43(A) is a plan view schematically showing a first step of the method for manufacturing a liquid crystal display panel in the sixth embodiment of the present invention, and FIG. 43(B) is a plan view schematically showing the second step. Figure.

FIG. 44(A) is a plan view schematically showing a first step of a method of manufacturing a liquid crystal display panel according to a first modification of the sixth embodiment of the present invention, and FIG. 44(B) is a view schematically showing the second step. Top view of the steps.

Fig. 45 is a plan view schematically showing a method of manufacturing a liquid crystal display panel according to a second modification of the sixth embodiment of the present invention.

Fig. 46 is a plan view schematically showing a method of manufacturing a liquid crystal display panel according to a third modification of the sixth embodiment of the present invention.

Fig. 47 is a plan view schematically showing a first step of the method of manufacturing the liquid crystal display panel in the seventh embodiment of the present invention.

Fig. 48 is a plan view schematically showing a second step of the method of manufacturing the liquid crystal display panel in the seventh embodiment of the present invention.

Fig. 49 is a plan view schematically showing a third step of the method of manufacturing the liquid crystal display panel in the seventh embodiment of the present invention.

Fig. 50 is a plan view schematically showing a method of manufacturing a liquid crystal display panel according to a second modification of the seventh embodiment of the present invention.

Fig. 51 (A) is a plan view schematically showing a first step of the method for producing a liquid crystal display panel in the eighth embodiment of the present invention, and Fig. 51 (B) is a plan view schematically showing the second step.

Fig. 52(A) is a plan view schematically showing a first step of the method for manufacturing a liquid crystal display panel in the ninth embodiment of the present invention, and Fig. 52(B) is a plan view schematically showing the second step.

Fig. 53 is a plan view schematically showing a method of manufacturing a liquid crystal display panel according to a modification of the ninth embodiment of the present invention.

Fig. 54(A) is a side view schematically showing a configuration of an apparatus used in a method of manufacturing a liquid crystal display panel in accordance with a tenth embodiment of the present invention; and Fig. 54(B) is a view of Fig. 54(A) The viewpoint of the arrow LIVB schematically shows a plan view of the configuration of the tip end of the blade.

Hereinafter, embodiments of the present invention will be described based on the drawings. In the following figures, the same or corresponding parts are denoted by the same reference numerals, and the description will not be repeated.

(Embodiment 1)

1(A) and (B), the LCD panel 101 of the present embodiment includes a CF (filter) substrate 11 (first brittle substrate in the present embodiment) and a TFT (thin film transistor) substrate 12 (this). The second brittle substrate in the embodiment, the sealing portion 21, and the liquid crystal layer 20.

The CF substrate 11 has an inner surface SF1 (first main surface in the present embodiment) and an opposite outer surface SF2 (second main surface in the present embodiment) as a main surface. The CF substrate 11 has a thickness direction DT perpendicular to the inner surface SF1. The CF substrate 11, specifically, a glass substrate, has a filter, a black matrix, and an alignment film (not shown). The TFT substrate 12 has an inner surface SF3 (the third main surface in the present embodiment) and an opposite outer surface SF4 (the fourth main surface in the present embodiment) as a main surface. The TFT substrate 12 has a thickness direction DT perpendicular to the inner surface SF3. The TFT substrate 12 is specifically a glass substrate and has wiring, an active element, an electrode, and an alignment film (not shown).

The CF substrate 11 and the TFT substrate 12 face each other with the inner faces SF1 and SF3 The molds are bonded to each other via the sealing portion 21. The liquid crystal layer 20 is disposed in the gap between the inner surfaces SF1 and SF3, and is sealed by the sealing portion 21. The inner surface SF3 of the TFT substrate 12 has a portion covered by the liquid crystal layer 20 or the sealing portion 21. Further, the inner surface SF3 may have an exposed terminal region SF3e. The terminal region SF3e can be used to connect the TFT substrate 12 to external wiring.

Next, with respect to the substrate scribing method in the manufacturing method of the LCD panel 101, It is explained below.

Referring to Fig. 3 (A) and Fig. 4, a CF substrate 11 is prepared (Fig. 2: step S11). here At this time, the CF substrate 11 is a substrate (mother substrate) including a plurality of regions cut out for obtaining a plurality of final products. Next, the tip end of the blade is pressed against the inner surface SF1 of the CF substrate 11 (FIG. 2: Step S12). Plastic deformation is generated on the inner surface SF1 of the CF substrate 11 by sliding the tip end of the pressed blade on the inner surface SF1 of the CF substrate 11, thereby forming a groove line TL having a groove shape (FIG. 2: Step S13) ).

Referring to FIG. 8(A), the trench line TL of the CF substrate 11 is obtained in a crack-free state. The way is formed. The so-called crack-free state is in the direction immediately adjacent to the groove line TL, in the direction of the direction in which the groove line TL extends (the direction perpendicular to the section shown in Fig. 8(A)), and the substrate (CF in the figure) The substrate 11) is continuously connected. In the crack-free state, although the groove line TL resulting from the plastic deformation is formed, the crack along the groove line TL is not formed. According to this, even if a force other than the bending moment is simply applied to the substrate as in the conventional breaking step, the breaking along the groove line TL is less likely to occur. Therefore, the cracking step along the groove line TL is not performed in the crack-free state.

Referring to Fig. 3 (B) and Fig. 5, a TFT substrate 12 is prepared (Fig. 2: step S21). in At this point, the TFT substrate 12 includes a base of a plurality of regions cut out for obtaining a plurality of final products. Board (mother substrate). Next, the tip end of the blade is pressed against the outer surface SF4 of the TFT substrate 12 (FIG. 2: Step S22). Plastic deformation is generated on the outer surface SF4 of the TFT substrate 12 by sliding the tip end of the pressed blade on the outer surface SF4 of the TFT substrate 12, thereby forming a groove line TL having a groove shape (FIG. 2: step S23).

Referring to FIG. 3(C) and FIG. 6, next, the inner surface SF1 of the CF substrate 11 is used. The CF substrate 11 and the TFT substrate 12 are bonded to each other with the inner surface SF3 of the TFT substrate 12 facing each other (FIG. 2: Step S40). Thereby, the unit substrate 10 of the laminated body of the CF substrate 11 and the TFT substrate 12 is obtained. The trench line TL formed on the CF substrate 11 is covered by the TFT substrate 12. In the present embodiment, the trench line TL formed on the CF substrate 11 is partially covered by the TFT substrate 12. In other words, the groove line TL formed on the inner surface SF1 of the CF substrate 11 is partially exposed.

Referring to Fig. 3(D) and Fig. 7, next, along the groove line TL of the CF substrate 11 and the TFT substrate 12, a crack line CL which is a line extending from the crack is formed on the substrate (Fig. 2: Step S60). The formation of the crack line CL is performed by stretching the crack of the substrate in the thickness direction along the groove line TL.

Referring to Fig. 8(B), the crack line CL is cut immediately below the groove line TL, and the CF substrate 11 is in a direction perpendicular to the direction in which the groove line TL extends (the cross section shown in Fig. 8(B)). The direction of intersection is continuously connected by DC. The so-called "continuous connection" here, in other words, is not connected by crack interruption. Further, as described above, in the state in which the continuous connection is cut, the portions of the substrate may be in contact with each other via the crack of the crack line CL. The same applies to the TFT substrate 12.

The formation of the crack line CL of the CF substrate 11 is started by applying a stress such as a buckling of the internal stress in the vicinity of the groove line TL to the CF substrate 11 at the end portion of the exposed groove line TL. . The application of stress, for example, can be repeated by forming the groove line TL It is carried out by application of external stress generated by blade tip pressing or heating by laser irradiation or the like. Thereby, the portion exposed from the trench line TL of the CF substrate 11 is spread toward the portion covered by the TFT substrate 12 along the trench line TL. The same applies to the TFT substrate 12.

Next, the unit substrate 10 on which the above scribing step has been performed (Fig. 3(D)) The breaking step is explained below.

Referring to FIG. 9(A), the surface of the CF substrate 11 which is not formed with the crack line CL is formed. The unit substrate 10 is placed on the cracking mat 61 attached to the stage 60 so that the surface SF2 is exposed.

Next, the CF substrate 11 is applied on the outer surface SF2 by locally applying a load. And the TFT substrate 12 is bent. Specifically, the load is sequentially applied to the fractured portions B0 to B2 on the outer surface SF2. The cracked portion B0 overlaps with the crack line CL of each of the CF substrate 11 and the TFT substrate 12 in a plan view, whereby the CF substrate 11 and the TFT substrate 12 are formed along the crack line CL of each of the CF substrate 11 and the TFT substrate 12. Break. The cracked portion B1 overlaps only the crack line CL of the CF substrate 11 in a plan view, whereby the CF substrate 11 is broken along the crack line CL of the CF substrate 11. The cracked portion B2 overlaps only the crack line CL of the TFT substrate 12 in a plan view, whereby the TFT substrate 12 is separated along the crack line CL of the TFT substrate 12.

Referring to Figures 10(A) and (B), the crack line CL can be completed by using the split rod 71. The body applies a load LD. In this case, the division along the entire crack line CL is performed substantially simultaneously. Referring to Figures 11 (A) and (B), the load LD may be applied by using a split roller 72. In this case, the break along the crack line CL is gradually performed along with the travel PR of the splitting roller 72 of the rotation RT on the outer surface SF2.

Referring to FIG. 9(B) and FIG. 12, as described above, as step S90 (FIG. 2), the edge is along The crack line CL of the CF substrate 11 breaks the CF substrate 11 and, in addition, along the TFT substrate 12 The crack line CL breaks the TFT substrate 12. That is, the breaking step of the unit substrate 10 is performed.

Referring again to FIG. 1(B), next, by using the CF substrate 11 and the TFT substrate A liquid crystal layer 20 is formed by injecting liquid crystal into the gap between the twelve. By the above manner, a plurality of LCD panels 101 can be obtained from one unit substrate 10 (Fig. 9(A)).

Next, the first comparative example will be described. Referring to Figures 13(A) and (B), The CF substrate 11 and the TFT substrate 12 are bonded to each other. Next, the scribe lines SL are formed on the outer surfaces SF2 and SF4 of the CF substrate 11 and the TFT substrate 12. The score line SL can be formed by a well-known typical scribing technique and has a line of vertical cracks formed during scoring. That is, the score line SL includes a crack line. Next, the CF substrate 11 and the TFT substrate 12 are separated along the scribe line SL. At this time, in the division of the scribe line SL along the CF substrate 11, it is necessary to apply L1 to the load on the outer surface SF4 of the TFT substrate 12, and in the division along the scribe line SL along the TFT substrate 12, It is necessary to apply L2 to the load on the outer surface SF2 of the CF substrate 11. Therefore, the unit substrate 10 must be reversed in the cracking step.

In contrast, according to the present embodiment, load application is as described in FIG. 9(A). It is performed only on the outer surface SF2 of the CF substrate 11. According to this, it is not necessary to invert the unit substrate 10. Thereby, the breaking step can be performed more easily. For example, the device that can be used in the cracking step can be simplified. In addition, the time required for the cracking step can be shortened.

Next, a second comparative example will be described. Referring to FIGS. 14(A) and 14(B), the CF substrate 11 on which the scribe line SL is formed and the TFT substrate 12 on which the scribe line SL is formed are separately prepared. Referring to Fig. 14(C), the CF substrate 11 and the TFT substrate 12 are bonded to each other. Thereafter, the CF substrate 11 and the TFT substrate 12 are separated along the scribe line SL in the same manner as in FIG. 9(A). In the present comparative example, the CF substrate 11 and the TFT substrate are formed after the scribe line SL with the vertical crack is formed. 12 is attached, and therefore, the crack of the scribe line SL is unintentionally extended in the thickness direction, and at least one of the CF substrate 11 and the TFT substrate 12 is easily broken off earlier than the intended time. . As a result, it will be difficult to continue the manufacturing steps of the LCD panel 101 (Fig. 1(B)).

On the other hand, according to the present embodiment, the position at which the CF substrate 11 is cut off is restricted. The line is formed in a groove line TL having no crack immediately below it (Fig. 8(A)). The crack line CL (Fig. 8(B)) used as the direct start of the division is formed after the formation of the groove line TL. Thereby, after the formation of the trench line TL and before the formation of the crack line CL, the breaking position of the CF substrate 11 is restricted by the groove line TL and the crack line CL is not formed, so that it is in a stable state in which breakage is unlikely to occur ( No cracking state). In this steady state, the TFT substrate 12 is placed on the line of the trench line TL of the CF substrate 11, that is, the position at which the CF substrate 11 is restricted from being cut. Thereafter, the crack line CL which is used as the direct opening end of the breaking is formed by stretching the crack along the groove line TL. Thereby, the crack line CL can also be formed at the position covered by the TFT substrate 12. As described above, in the work relating to the bonding of the CF substrate 11 and the TFT substrate 12, the CF substrate 11 can be prevented from being unintentionally broken, and the portion of the CF substrate 11 covered by the TFT substrate 12 can be prevented. , set the line for the break along it.

In addition, similarly, in the work related to bonding, the TFT base can be avoided. The board 12 is unintentionally broken, and can also be provided on a portion of the TFT substrate 12 covered by the CF substrate 11 to be cut along the line.

Further, the step of forming the crack line CL in the present embodiment is similar to the conventional method. The breaking steps are essentially different. The cracking step causes the crack that has formed to be further extended in the thickness direction. On the other hand, the step of forming the crack line CL in the present embodiment has a change from the crack-free state obtained by the formation of the groove line TL to the state having the crack. The The change is caused by the opening of the internal stress in the crack-free state. In the state of the plastic deformation at the time of formation of the groove line TL and the magnitude or directivity of the internal stress generated by the formation of the groove line TL, the rotation of the rotary blade is used, and the tip of the blade is used as in the present embodiment. The case of sliding is different, and in the case of using the sliding of the tip end of the blade, cracks can be easily generated in a wide scribe condition. Further, for the opening of the internal stress, a certain beginning is necessary, and as described above, the crack on the groove line TL due to the external stress application acts as such an opening. Details of a preferred method of forming the trench line TL and the crack line CL will be described below.

(Embodiment 2)

15(A) to 15(E) are cross-sectional views schematically showing first to fifth steps of the manufacturing method of the liquid crystal display panel 101 (Figs. 1(A) and (B)) of the present embodiment. The cross sections of Figs. 15(A) to (E) are along the line XVA-XVA (Fig. 16), line XVB-XVB (Fig. 17), line XVC-XVC (Fig. 18), and line XVD-XVD (Fig. 19). And line XVE-XVE (Figure 20). Further, in the present embodiment, unlike the first embodiment, the TFT substrate 12 corresponds to the first brittle substrate, and the CF substrate 11 corresponds to the second brittle substrate. Further, the inner surface SF3 corresponds to the first main surface, the outer surface SF4 corresponds to the second main surface, the inner surface SF1 corresponds to the third main surface, and the outer surface SF2 corresponds to the fourth main surface.

In the present embodiment, the groove line TL of the TFT substrate 12 is formed on the inner surface SF3 (FIG. 15(A)), and the groove line TL of the CF substrate 11 is formed on the outer surface SF2 (FIG. 15(B)). . Thereby, the crack line CL of the TFT substrate 12 is formed on the inner surface SF3, and the crack line CL of the CF substrate 11 is formed on the outer surface SF2 (FIG. 15(D)). The cracking method itself in step S90 (Fig. 2) is substantially the same as Fig. 9(A) of the first embodiment, but the load application is not performed on the outer surface SF2. It is done on the outside SF4.

In addition, the configuration other than the above is based on the configuration of the first embodiment described above. The same or corresponding elements are denoted by the same reference numerals and the description thereof is not repeated.

According to this embodiment, the same effect as that of the first embodiment can be obtained. fruit. Further, according to the present embodiment, the groove surface TL can be disposed on the outer surface SF2 instead of the inner surface SF1 having a complicated structure in which a filter, a black matrix, or the like is disposed. Thereby, the groove line TL of the CF substrate 11 can be stably formed.

(Embodiment 3)

Fig. 21 is a flow chart schematically showing a method of manufacturing the LCD panel 101 (Figs. 1 (A) and (B)) in the present embodiment. 22(A) to (E) are respectively along the line XXIIA-XXIIA (Fig. 23), line XXIIB-XXIIB (Fig. 24), line XXIIC-XXIIC (Fig. 25), line XXIID-XXIID (Fig. 26), and line XXIIE-XXIIE (Figure 27).

Referring to Fig. 22 (A) and Fig. 23, the CF substrate 11 on which the groove lines TL are formed is prepared by the steps S11 to S13 (Fig. 21) similar to those in the first embodiment.

Referring to Fig. 22 (B) and Fig. 24, the TFT substrate 12 is prepared (Fig. 21: step S21). The CF substrate 11 and the TFT substrate 12 are bonded to each other such that the inner surface SF1 of the CF substrate 11 faces the inner surface SF3 of the TFT substrate 12 (FIG. 21: Step S40). Thereby, the unit substrate 10 of the laminated body of the CF substrate 11 and the TFT substrate 12 is obtained. The trench line TL formed on the CF substrate 11 is covered by the TFT substrate 12. In the present embodiment, the trench line TL formed on the CF substrate 11 is partially covered by the TFT substrate 12. In other words, the groove line TL formed on the inner surface SF1 of the CF substrate 11 is partially exposed.

Referring to Fig. 22(C) and Fig. 25, next, a crack line CL is formed along the groove line TL of the CF substrate 11 (Fig. 21: step S61).

Referring to Fig. 22 (D) and Fig. 26, next, a scribe line SL is formed on the outer surface SF4 of the TFT substrate 12 (Fig. 21: step S72). The score line SL, as described above, contains a line (crack line) of a vertical crack formed at the time of scribing. The scribe line SL is formed by displacing the tip end of the blade on the outer surface SF4 of the TFT substrate 12 along the line on which the line is formed.

Referring further to FIGS. 22(E) and 27, in step S90 (FIG. 21), the CF substrate 11 is cut along the crack line CL of the CF substrate 11, and further, the TFT is formed along the scribe line SL of the TFT substrate 12. The substrate 12 is broken. Further, the method of breaking is substantially the same as that of Fig. 9(A).

Referring again to FIG. 1(B), the liquid crystal layer 20 is formed by injecting liquid crystal into the gap between the CF substrate 11 and the TFT substrate 12. By the above manner, a plurality of LCD panels 101 can be obtained from one unit substrate 10 (Fig. 22(D)).

The components other than the above are substantially the same as those of the above-described first embodiment. Therefore, the same or corresponding elements are denoted by the same reference numerals and the description thereof will not be repeated.

According to this embodiment, substantially the same effects as those of the first embodiment can be obtained.

Further, according to the present embodiment, at the time of forming the scribe line SL, the CF substrate 11 and the TFT substrate 12 are bonded to each other, and the crack line CL is further formed on the CF substrate 11. Accordingly, even if the vertical crack of the score line SL is stretched for some reason, the break along the score line SL is unintentionally generated, and in general, it is particularly uncomfortable.

In addition, the scribe line SL of the TFT substrate 12 is not formed on the inner surface SF3 which is often complicated by a TFT or the like, but is formed on the outer surface SF4. Thereby, it can be stabilized The ground line is formed with a score line SL.

Referring to Fig. 28, in a modification of the embodiment, the above-described step S61 and The order of S72 (Fig. 21) can be exchanged. FIG. 29 and FIG. 30 schematically show the configuration at the time when the scribe line SL is formed in step S72.

(Embodiment 4)

Fig. 31 is a flow chart schematically showing a method of manufacturing the LCD panel 101 (Figs. 1 (A) and (B)) in the present embodiment. 32(A) to (E) are respectively along the line XXXIIA-XXXIIA (Fig. 33), line XXXIIB-XXXIIB (Fig. 34), line XXXIIC-XXXIIC (Fig. 35), line XXXIID-XXXIID (Fig. 36), and line XXXIIE-XXXIIE (Figure 37).

Referring to Fig. 32 (A) and Fig. 33, the TFT substrate 12 on which the trench lines TL are formed is prepared by the steps S21 to S23 (Fig. 31) similar to those in the first embodiment.

Referring to Fig. 32 (B) and Fig. 34, a CF substrate 11 is prepared (Fig. 31: Step S11). The CF substrate 11 and the TFT substrate 12 are bonded to each other such that the inner surface SF1 of the CF substrate 11 faces the inner surface SF3 of the TFT substrate 12 (FIG. 31: Step S40). Thereby, the unit substrate 10 of the laminated body of the CF substrate 11 and the TFT substrate 12 is obtained. The trench line TL formed on the TFT substrate 12 is covered by the CF substrate 11. In the present embodiment, the trench line TL formed on the TFT substrate 12 is partially covered by the CF substrate 11. In other words, the groove line TL formed on the inner surface SF3 of the TFT substrate 12 is partially exposed.

Referring to Fig. 32(C) and Fig. 35, next, a crack line CL is formed along the groove line TL of the TFT substrate 12 (Fig. 31: step S62).

Referring to FIG. 32(D) and FIG. 36, next, on the outer surface SF2 of the CF substrate 11. A score line SL is formed (FIG. 31: step S71). The score line SL, as described above, can be formed by a well-known typical scoring technique having a line of vertical cracks formed during scoring.

Referring further to FIG. 32(E) and FIG. 37, as step S90 (FIG. 31), along the line The crack line CL of the TFT substrate 12 breaks the TFT substrate 12, and the CF substrate 11 is cut along the scribe line SL of the CF substrate 11.

Next, the liquid is injected into the gap between the CF substrate 11 and the TFT substrate 12 The liquid crystal layer 20 is formed by crystal formation (Fig. 1 (B)). By the above manner, a plurality of LCD panels 101 (FIG. 1(B)) can be obtained from one unit substrate 10 (FIG. 32(D)).

In addition, the configuration other than the above is due to the configuration of the above-described second embodiment. The same reference numerals are given to the same or corresponding elements, and the description thereof is not repeated.

According to this embodiment, substantially the same effects as those of the first embodiment can be obtained.

Further, according to the present embodiment, at the time of forming the scribe line SL, the CF substrate 11 and the TFT substrate 12 are bonded to each other, and a crack line CL is further formed on the TFT substrate 12. Accordingly, even if the vertical crack of the score line SL is stretched for some reason, the break along the score line SL is unintentionally generated, and in general, it is particularly uncomfortable.

In addition, the scribe line SL of the CF substrate 11 is not formed by the arrangement of the filter. Most of the inner surface SF1 having a complicated configuration, such as a black matrix, is formed on the outer surface SF2. Thereby, the score line SL can be stably formed.

Referring to Fig. 38, in a modification of the embodiment, the above-described step S62 and The order of S71 (Fig. 31) can be exchanged. FIG. 39 and FIG. 40 schematically show the configuration at the time when the scribe line SL is formed in step S71.

(Embodiment 5)

Fig. 41 is a flow chart schematically showing a method of manufacturing the LCD panel 101 (Figs. 1 (A) and (B)) of the present embodiment. Unlike the second to fourth embodiments, in the present embodiment, the position of the position to be separated is divided into the groove line TL for either of the CF substrate 11 and the TFT substrate 12 (step S13 or S23). And forming with the scribe line SL (step S70). This division method is arbitrary, for example, in the XY orthogonal coordinates of the layout, the groove line TL along the X axis and the scribe line SL along the Y axis are formed. In addition, the order of steps S60 and S70 can also be exchanged.

In addition, the configuration other than the above is the same as the above-described embodiments 2 to 4. The components are substantially the same, and therefore the same or corresponding elements are denoted by the same reference numerals and the description thereof is not repeated.

(Embodiment 6)

A cutting tool having a tip end for use in forming the groove line TL in each of the above embodiments will be described below.

42(A) and (B) show the state in which the blade tip end 51 is pressed against the CF substrate 11. The cutting instrument 50 has a blade front end 51 and a shank 52. The blade tip end 51 is provided with a front end surface SD1 (first surface) and a plurality of surfaces surrounding the front end surface SD1. The plurality of faces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The front end surface SD1, the side surfaces SD2, and SD3 (the first to third surfaces) are oriented in mutually different directions and adjacent to each other. The blade tip end 51 has a vertex of the intersection of the front end surface SD1, the side surfaces SD2, and SD3, and the vertex constitutes the protrusion portion PP of the blade tip end 51. Further, the side faces SD2 and SD3 are formed with ridge lines constituting the side portions PS of the blade tip end 51. The side portion PS is linearly extended from the protrusion PP Stretch. Further, since the side portion PS is a ridge line as described above, it has a convex shape extending in a line shape.

The blade front end 51 is preferably a diamond cusp. That is, the front end 51 of the blade, from the hardness and From the viewpoint of setting the surface roughness to be small, it is preferably made of diamond. More preferably, in terms of crystallography, the front end surface SD1 is a {001} plane, and the side surfaces SD2 and SD3 are respectively a {111} plane. In this case, the side faces SD2 and SD3 have crystal faces which are mutually equivalent in crystallography, although they have different orientations.

In addition, non-single crystal diamonds can also be used, for example, chemical gases can also be used. Polycrystalline diamond synthesized by phase deposition (CVD; Chemical Vapor Deposition). Alternatively, a polycrystalline diamond obtained by sintering graphite or non-graphite carbon in the form of a combination of iron-free elements or the like may be used, or a combination of diamond particles and the like may be used. Sintered diamonds combined with wood.

The shank 52 extends in the axial direction AX. Blade front end 51, preferably front end face SD1 The normal direction is attached to the shank 52 substantially in the axial direction AX.

In order to form the groove line TL using the cutting instrument 50 (Fig. 8(A)), on the CF substrate The inner surface SF1 of the blade 11 presses the projection portion PP and the side portion PS of the blade tip end 51 in the thickness direction DT of the CF substrate 11. Next, the blade tip end 51 is slid on the inner surface SF1 so as to be projected substantially in the direction in which the side portion PS is projected onto the inner surface SF1. Thereby, a groove-like groove line TL which is not accompanied by a vertical crack is formed on the inner surface SF1. Although the groove line TL is generated by plastic deformation of the CF substrate 11, the CF substrate 11 may be slightly cut at this time. Since the cutting only as a scabbard will produce fine fragments, it is preferably as small as possible.

By the sliding of the front end 51 of the blade, the groove line TL and the crack line CL are simultaneously formed. The case (Fig. 8(B)), and the case where only the groove line TL is formed (Fig. 8(A)). Crack line CL, from The groove of the groove line TL is cracked in the thickness direction DT, and extends linearly on the inner surface SF1. According to the method described below, the crack line CL can be formed along the groove line TL after only the groove line TL is formed.

Next, the focus is on the CF substrate 11 (the first in the present embodiment). The breaking method of the brittle substrate) will be described below. In addition, in order to facilitate understanding of the drawings and the description, only the division in one direction (the horizontal direction in each plan view) will be described, but the division can be performed in a plurality of directions as described in the first to fifth embodiments ( For example, the horizontal direction and the vertical direction in each plan view are divided. Further, the same breaking method can be applied to the TFT substrate 12 (the second brittle substrate in the present embodiment). Further, the TFT substrate 12 may be used as the first brittle substrate, and the CF substrate 11 may be used as the second brittle substrate. In addition, the bonding between the CF substrate 11 and the TFT substrate 12 is as described in the first to fifth embodiments, and the illustration thereof is omitted.

Referring to Fig. 43 (A), the CF substrate 11 has a flat inner surface SF1. Around the inner surface The edge of SF1 includes the opposite sides ED1 (first side) and side ED2 (second side). In the example shown in Fig. 43 (A), the edges are rectangular. Accordingly, the sides ED1 and ED2 are sides parallel to each other. Further, in the example shown in FIG. 43(A), the sides ED1 and ED2 are the short sides of the rectangle.

The blade tip end 51 is pressed against the inner surface SF1 at the position N1. The details of position N1 will As described below. Referring to FIG. 42(A), the projection portion PP of the blade tip end 51 is disposed between the side ED1 and the side portion PS on the inner surface SF1 of the CF substrate 11, and the side of the blade tip end 51 is provided. The portion PS is disposed between the protrusion portion PP and the side ED2.

Next, a plurality of groove lines TL (two lines in the drawing) are formed on the inner surface SF1. The formation of the groove line TL is performed between the position N1 (first position) and the position N3. A position N2 (second position) is placed between the positions N1 and N3. Accordingly, the groove line TL is formed at positions N1 and N2. Between, and between positions N2 and N3. The positions N1 and N3 may be arranged to be separated from the edge of the inner surface SF1 of the CF substrate 11, or one or both of them may be located at the edge of the inner surface SF1. The groove line TL formed is separated from the edge of the CF substrate 11 in the former case, and is in contact with the edge of the CF substrate 11 in the latter case. Among the positions N1 and N2, the position N1 is closer to the side ED1, and further, among the positions N1 and N2, the position N2 is closer to the side ED2. Further, in the example shown in FIG. 43(A), the position N1 is close to the side ED1 of the sides ED1 and ED2. The position N2 is close to the side ED2 of the sides ED1 and ED2, but both of the positions N1 and N2 may be located near any one of the sides ED1 or ED2.

When the groove line TL is formed, in the present embodiment, the blade leading end 51 is placed in position. The displacement of N1 to the position N2 is further shifted from the position N2 to the position N3. That is, referring to Fig. 42 (A), the blade leading end 51 is displaced in the direction DA from the side ED1 toward the side ED2. The direction DA corresponds to a direction in which the axial direction AX extending from the blade tip end 51 is projected onto the inner surface SF1. In this case, the blade leading end 51 is dragged onto the inner surface SF1 by the shank 52.

Next, the crack-free state described in the first embodiment is maintained (Fig. 8(A)). After the time of the desire. In the meantime, as described in the first to fifth embodiments, the CF substrate 11 and the TFT substrate 12 (not shown) are bonded together.

Referring to FIG. 43(B), after the groove line TL is formed, the crack of the CF substrate 11 in the thickness direction DT is stretched along the groove line TL from the position N2 toward the side of the position N1 (see the dotted arrow in the drawing). Thereby, the crack line CL is formed. The formation of the crack line CL is started by the auxiliary line AL and the groove line TL crossing each other at the position N2. In its purpose, the auxiliary line AL is formed after the groove line TL is formed. The auxiliary line AL is a general scribe line accompanied by a crack in the thickness direction DT. The method of forming the auxiliary line AL is not particularly limited, but may be as shown in FIG. 43(B). The edge of SF1 is formed as a base point.

In addition, compared to the direction from the position N2 to the position N1, the direction to the slave position N2 In the direction of the position N3, it is difficult to form the crack line CL. That is, the ease of progressing the extension of the crack line CL is directional. Accordingly, the crack line CL is formed between the positions N1 and N2 without being formed between the positions N2 and N3. In the present embodiment, for the purpose of breaking the CF substrate 11 between the positions N1 and N2, the purpose is not to divide the CF substrate 11 between the positions N2 and N3. Accordingly, it is necessary to form the crack line CL between the positions N1 and N2, and on the other hand, it is difficult to form the crack line CL between the positions N2 and N3, which is not a problem.

Next, the CF substrate 11 is broken along the crack line CL. Specifically, for Breaking step. Further, in the case where the crack line CL is completely progressed in the thickness direction DT at the time of formation, the formation of the crack line CL and the breaking of the CF substrate 11 can be simultaneously generated. In this case, the cracking step can be omitted.

The division of the CF substrate 11 is performed by the above method.

Next, in the first to third modifications of the above-described breaking method, the following is Line description.

Referring to Fig. 44(A), the first modification relates to the auxiliary line AL and the groove line TL. The intersection is not sufficient as the beginning of the formation of the crack line CL (Fig. 43 (B)). Referring to Fig. 44(B), by applying an external force to the CF substrate 11 such as a bending moment or the like, the crack in the thickness direction DT is stretched along the auxiliary line AL, and as a result, the CF substrate 11 is separated. Thereby, the formation of the crack line CL starts. Further, in FIG. 44(A), although the auxiliary line AL is formed on the inner surface SF1 of the CF substrate 11, the auxiliary line AL for separating the CF substrate 11 may be formed on the outer surface SF2 of the CF substrate 11. In this case, the auxiliary line AL and the groove line TL are in a planar layout at the position N2 cross each other but not in direct contact with each other. In this case, unlike the first embodiment, it is not necessary to expose the end portion of the groove line TL of the CF substrate 11.

Further, in the first modification, the trench is liberated by the separation of the CF substrate 11 The internal stress of the groove line TL is frustrated, thereby starting the formation of the crack line CL. Therefore, the auxiliary line AL itself may be the crack line CL formed by applying stress to the groove line TL.

Referring to Fig. 45, in the second modification, the inner surface SF1 of the CF substrate 11 will be The blade leading end 51 is pressed at the position N3. When the groove line TL is formed, in the present modification, the blade tip end 51 is displaced from the position N3 to the position N2, and further displaced from the position N2 to the position N1. That is, referring to Fig. 42, the blade leading end 51 is displaced in the direction DB from the side ED2 toward the side ED1. The direction DB corresponds to a direction in which the axial direction AX extending from the blade tip end 51 is projected onto the inner surface SF1. In this case, the blade leading end 51 is advanced on the inner surface SF1 by the shank 52.

Referring to Fig. 46, in the third modification, the blade front end is formed when the groove line TL is formed. The inner surface SF1 of the CF substrate 11 is pressed with a large force at the position N2 as compared with the position N1. Specifically, the position N4 is set to a position between the positions N1 and N2, and when the groove line TL is formed to reach the position N4, the load of the blade tip end 51 is increased. In other words, the load of the groove line TL is increased between the positions N4 and N3 at the end portion of the groove line TL as compared with the position N1. Thereby, the load other than the terminal portion can be alleviated, and the formation of the crack line CL from the position N2 can be easily induced.

According to the present embodiment, the crack line can be formed more reliably from the groove line TL. CL.

Further, unlike the seventh embodiment described below, in the present embodiment, it is formed. At the time of the groove line TL (Fig. 43 (A)), the auxiliary line AL has not yet been formed. According to this, it is not possible to The effect of the auxiliary line AL is more stably maintained in a crack-free state. Further, in the case where the stability in the crack-free state is not a problem, the state of FIG. 43(A) in which the auxiliary line AL is not formed may be replaced, and the state in which the auxiliary line AL is formed in FIG. 43(B) is maintained in a crack-free state. .

(Embodiment 7)

The method of manufacturing the liquid crystal display panel of the present embodiment will be described below with reference to FIGS. 47 to 49.

Referring to Fig. 47, in the present embodiment, the auxiliary line AL is formed before the formation of the groove line TL. The method of forming the auxiliary line AL itself is the same as that of Fig. 43 (B) (Embodiment 6).

Referring to Fig. 48, next, the blade leading end 51 is pressed against the inner surface SF1, and then the groove line TL is formed. The method of forming the groove line TL itself is the same as that of Fig. 43 (A) (Embodiment 6). The auxiliary line AL and the groove line TL cross each other at the position N2. Next, as described in the first to fifth embodiments, the CF substrate 11 and the TFT substrate 12 (not shown) are bonded together.

Referring to Fig. 49, a CF substrate 11 is separated along the auxiliary line AL by applying a general cracking step for generating an external force such as a bending moment to the CF substrate 11. Thereby, the formation of the crack line CL (Fig. 8(B)) is started (refer to the dotted arrow in the figure). Further, in FIG. 47, the auxiliary line AL is formed on the inner surface SF1 of the CF substrate 11, but the auxiliary line AL for separating the CF substrate 11 may be formed on the outer surface SF2 of the CF substrate 11. In this case, the auxiliary line AL and the groove line TL cross each other at the position N2 in the planar layout, but are not in direct contact with each other.

Further, the configuration other than the above is substantially the same as the configuration of the above-described sixth embodiment.

Referring to Fig. 50, in the modification, the blade leading end 51 is formed when the groove line TL is formed. The inner surface SF1 of the CF substrate 11 is pressed with a large force at the position N2 as compared with the position N1. Specifically, the position N4 is set to a position between the positions N1 and N2, and when the groove line TL is formed to reach the position N4, the load of the blade tip end 51 is increased. In other words, the load of the groove line TL is increased between the positions N4 and N3 at the end portion of the groove line TL as compared with the position N1. Thereby, the load other than the terminal portion can be alleviated, and the formation of the crack line CL from the position N2 can be easily induced.

(Embodiment 8)

Referring to Fig. 51(A), in the method of manufacturing a liquid crystal display panel of the present embodiment, the groove line TL which reaches the side ED2 from the position N1 via the position N2 is formed. Next, the crack-free state (Fig. 8(A)) described in the first embodiment is maintained for the desired period of time. In the meantime, as described in the first to fifth embodiments, the CF substrate 11 and the TFT substrate 12 (not shown) are bonded together.

Referring to FIG. 51(B), next between the position N2 and the side ED2, as applied The internal stress near the groove line TL is abruptly liberated. Thereby, the formation of the crack line along the groove line TL is induced.

Specifically, as the application of the stress, the pressed blade tip end 51 is slid on the inner surface SF1 between the position N2 and the side ED2 (the area between the broken line and the side ED2 in the drawing). The slide is made to reach the side ED2. The blade leading end 51 preferably slides in such a manner as to intersect the track of the groove line TL initially formed, and more preferably slides in a manner overlapping the track of the groove line TL initially formed. The length of the re-sliding is, for example, about 0.5 mm.

As a modification, in order to apply a stress between the position N2 and the side ED2, it is also possible to replace the above-mentioned blade front end 51 with the re-sliding, and on the inner surface SF1, at the position N2 and the side ED2. The laser light is irradiated between. By the thermal stress generated thereby, it is also possible to liberate the internal stress of the vicinity of the groove line TL, thereby inducing the start of the formation of the crack line.

Further, the configuration other than the above is the same as the configuration of the above-described sixth embodiment. Roughly the same.

(Embodiment 9)

Referring to Fig. 52(A), in the method of manufacturing a liquid crystal display panel of the present embodiment, the blade tip end 51 is separated from the edge of the inner surface SF1 by moving the blade tip end 51 from the position N1 to the position N2 and then further to the position N3. The groove line TL. The method of forming the groove line TL itself is substantially the same as that of FIG. 43(A) (Embodiment 6).

Next, the crack-free state described in the first embodiment is maintained (Fig. 8(A)). After the time of the desire. In the meantime, as described in the first to fifth embodiments, the CF substrate 11 and the TFT substrate 12 (not shown) are bonded together.

Referring to Fig. 52 (B), the same as Fig. 51 (B) (Embodiment 8 or a modification thereof) is performed. The stress is applied. Thereby, the formation of the crack line along the groove line TL is induced.

Referring to Fig. 53, as a modification of the step of Fig. 52(A), it is also possible to use the groove line TL. In the formation, the blade leading end 51 is displaced from the position N3 to the position N2 and then from the position N2 to the position N1.

Further, the configuration other than the above is the same as the configuration of the above-described sixth embodiment. Roughly the same.

(Embodiment 10)

Referring to Figs. 54(A) and (B), in the above embodiments, the blade tip end 51v may be used instead of the blade tip end 51 (Figs. 42(A) and (B)). The blade tip end 51v has a conical shape having a vertex and a conical surface SC. The projection PPv of the blade tip end 51v is formed by a vertex. The side portion PSv of the tip end of the blade is formed from an imaginary line extending along the conical surface SC (dashed line in FIG. 54(B)). Thereby, the side portion PSv has a convex shape extending in a line shape.

Further, in the above embodiments 6 to 10, the first and second sides of the edge of the substrate Although the short side of the rectangle, the first and second sides may also be the long sides of the rectangle. Further, the shape of the edge is not limited to a rectangle, and may be, for example, a square. Further, the first and second sides are not limited to a straight line, and may be curved. Further, in each of the above embodiments, the main surface of the substrate is flat, but the main surface of the substrate may be curved.

Further, in each of the above embodiments, in order to obtain a plurality of liquid crystal display panels, Alternatively, the unit substrate having one of the brittle substrates may be first divided into a plurality of portions, and then the portions may be further divided, thereby obtaining a plurality of display panels. For example, the unit substrate may be first divided into a portion having a square shape, and then the rectangular portion may be further divided so as to divide the long side thereof, thereby obtaining a plurality of display panels.

Further, in the above-described breaking method, although a brittle substrate which is particularly suitable is used The glass substrate is used, but the brittle substrate is not limited to the glass substrate, and may be, for example, sapphire.

Further, in the above method of manufacturing a liquid crystal display panel, although the pair is on the glass base The board is provided with a CF substrate 11 of a filter, a black matrix and an alignment film, and a trench line is formed with the TFT substrate 12 having wiring, active elements, electrodes and alignment films on the glass substrate, but may be formed on the glass substrate. After the grooved line is formed, processing for arranging the CF substrate 11 or the TFT substrate 12 is performed on the glass substrate.

The present invention can be freely combined with the respective embodiments or appropriately modified, omitted, and the like according to the scope of the invention.

10‧‧‧unit substrate

11‧‧‧CF substrate (brittle substrate)

12‧‧‧TFT substrate (brittle substrate)

21‧‧‧ Sealing Department

CL‧‧‧crack line

SF1, SF3‧‧‧ inside (main surface)

SF2, SF4‧‧‧ outside (main surface)

TL‧‧‧ trench line

Claims (4)

A method of manufacturing a liquid crystal display panel, comprising: preparing a first fragile substrate having a first main surface and a second main surface opposite to the first main surface, and having a step in which the first main surface is perpendicular to the thickness direction; a second brittle substrate having a third main surface and a fourth main surface opposite to the third main surface; and a pressing step of the blade front end Pressing the first main surface of the first brittle substrate; and forming a first groove line, the tip end of the blade pressed by the pressing step is on the first main surface of the first brittle substrate Sliding, plastic deformation is generated on the first main surface of the first brittle substrate, thereby forming the first groove line having a groove shape; and the step of forming the first groove line is 1 immediately below the groove line, the first brittle substrate is obtained in a state in which the first brittle substrate is continuously connected to the first groove line, that is, in a state of no crack, and further includes a bonding step for forming the first After the step of the groove line, the first main surface and the second surface of the first brittle substrate The first brittle substrate and the second brittle substrate are bonded to each other in such a manner that the third main surface of the substrate is opposed to each other; and the bonding step of bonding the first brittle substrate and the second brittle substrate to each other is The first groove line formed on the first brittle substrate is at least partially covered on the second brittle substrate, and further includes a step of forming a first crack line, and the first brittle substrate and the first brittle substrate are provided Second brittle substrate phase After the step of bonding each other, the first crack line is formed by stretching a crack of the first brittle substrate in the thickness direction along the first groove line, and the first crack line is cut by the first crack line Immediately below the first groove line, the first brittle substrate is continuously connected in a direction intersecting the first groove line, and further includes a step of forming a second crack line in the second brittle substrate Forming the second crack line on the fourth main surface; and dividing the first brittle substrate and the second brittleness by locally applying a load on the second main surface of the first brittle substrate The substrate is bent, whereby the first fragile substrate and the second brittle substrate are separated along the first crack line and the second crack line, respectively. The method of manufacturing a liquid crystal display panel according to claim 1, wherein the step of forming the second crack line is performed by bonding the first brittle substrate and the second brittle substrate to each other The tip end of the blade is displaced along the fourth main surface of the second brittle substrate along a line for forming the second crack line. The method of manufacturing a liquid crystal display panel according to claim 1, wherein the step of forming the second crack line includes forming plastic deformation on the fourth main surface of the second brittle substrate to form The step of the second groove line of the groove shape. The method of manufacturing a liquid crystal display panel according to claim 3, wherein the step of forming the second trench line is performed before the step of bonding the first brittle substrate and the second brittle substrate to each other.