KR20080007834A - System and method for scribing substrate - Google Patents

Abstract

A system and a method for cutting a substrate are provided to inhibit the enlargement of the system size and to cut the substrate effectively. A first lower stage(10) supports an original substrate for performing a cutting work at the lower portion. An upper scribe module(20) is arranged at the upper area of the first lower stage, forms a predetermined upper scribe line to the upper plate of the original substrate, and cuts off the original substrate. An upper stage(30) moves relatively to the first lower stage and supports the cut original substrate at the upper portion. A lower scribe module(40) is arranged at the lower area of the upper stage, forms a predetermined lower scribe line to the lower plate of the original substrate, and cuts off the original substrate. The first lower stage and the upper stage are relatively moved on a predetermined work line formed along the cut work progress direction of the original substrate. The upper stage is arranged highly compared to the first lower stage.

Description

Substrate cutting system and its method {System and method for Scribing substrate}

1 is a schematic perspective view of a general LCD substrate (unit substrate).

FIG. 2 is a plan view of a large-area original substrate for forming the unit substrate of FIG. 1.

3 is a perspective view of a substrate cutting apparatus according to an embodiment of the present invention.

4 is a plan view of FIG. 3.

5 is a view showing the operation of the upper scribe module region.

6 is a view illustrating an operation of a lower scribe module region.

7 is a flow chart of a substrate cutting method according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

1: Original board 3a ~ 3d: Dummy board

8: unit substrate 10: first lower stage

20: upper scribe module 21: upper horizontal axis

23: upper scriber 25: upper line observation

30: upper stage 40: lower scribe module

41: lower horizontal axis 43: lower scriber

45: lower line observation section 50: discharge section

52: crushing unit 60: second lower stage

70: divider 71: moving bar

72: distribution head 75: trans conveyor

85: inverter 86: inverted axis

87: reverse conveyor 90: takeout conveyor

The present invention relates to a substrate cutting system and a method thereof, and more particularly, it is possible to cut the substrate more effectively while preventing the height of the system from being increased and the size of the system as a whole. The present invention relates to a substrate cutting system and a method thereof, by which in-line cutting can be performed in-line, thereby reducing the tact time and further improving productivity.

The substrate includes a flat panel display (FPD) used as an image display device including a semiconductor substrate. FPD substrates include liquid crystal display (LCD) substrates, plasma display panel (PDP) substrates, and organic light emitting diodes (OLED) substrates.

Among them, the LCD substrate refers to a liquid crystal (Liquid Crystal) is injected between the two glass (Glass). Although LCD substrates have the disadvantage of slow response speed and relatively high cost, LCD substrates have advantages over PDP substrates in terms of resolution because they are produced by semiconductor processes. Therefore, it is recently attracting attention as a next generation display device such as a monitor of a mobile phone, a computer, and a television.

The LCD substrate will be described in more detail with reference to FIGS. 1 and 2 as follows.

1 is a schematic perspective view of a general LCD substrate (unit substrate), Figure 2 is a plan view of a large area substrate for forming the unit substrate of FIG.

As shown in these drawings, one LCD substrate (hereinafter referred to as unit substrate 8) shown in FIG. 1 is a glass top plate which is bonded by partially contacting each other in a state where liquid crystal is injected therein ( 8a, CF, Color Filter) and lower plate (8b, TFT, Thin Film Transistor), and upper and lower polarizers that are coupled to the exposed surface of the upper plate (8a) and the lower plate (8b), respectively, to impart optical characteristics at the corresponding positions ( Polarizer Film, not shown).

The upper plate 8a forming the image of the color is formed smaller in area than the lower plate 8b. Therefore, a pad portion P (Pad Portion), which is a portion where the upper plate 8a does not overlap, is present on the upper surface of the lower plate 8b. The pad portion P is combined with an IC driver as a means for controlling the unit substrate 8, and a flexible printed circuit (FPC) for connecting the IC driver to a printed circuit board (PCB).

As shown in FIG. 2, the unit substrate 8 is generally formed in a state where the upper plate 1a and the lower plate 1b are joined together, and the large-area original substrate 1 having a large area is divided into several tens of equal parts. After cutting to make the unit substrate 8 of the form as shown in FIG. 1, the IC driver or the like is mounted on the pad portion P of the unit substrate 8 in the module process to be released as a finished product.

Therefore, the manufacturing process of the substrate includes a cutting process for cutting (or scribing) the large-area original substrate 1 into several to several tens of unit substrates 8.

In particular, when the one substrate 1 as shown in FIG. 2 is cut and manufactured as the unit board 8 as shown in FIG. The scribe line formed on the upper plate 1a and the lower plate 1b of the base plate 1 and cut is inevitably different, and these need to be precisely controlled. For reference, a portion (not shown overlapping with a dotted line) in the solid line in FIG. 2 indicates a position where the upper plate 1a of the base plate 1 is cut, and the portion shown by the dotted line is a portion of the base plate 1. The position at which the lower plate 1b is cut is shown.

The cutting process for the base plate 1 is carried out through a separate system, usually through a cutting system, also called a scriber or scribe device (Scribe Apparatus).

Cutting systems known to date are largely divided into a belt conveyor type and a stage type according to the type supporting the substrate 1.

The belt conveyor type has a short tact time, but due to its structure, the substrate cut out from the large area substrate 1 (hereinafter, referred to as dummy substrates (3a to 3d, dummy dummy)) can be immediately discharged. none. The dummy substrates 3a to 3d refer to portions not hatched in FIG. 2.

Therefore, in the cutting system to which the belt conveyor type is applied, the first substrate 1 is not cut completely but only half is cut, and then the original substrate 1 is finally removed while advancing the crack through heating and cooling processes. It cuts and forms the unit board | substrate 8 with it.

However, in such a case, the dummy substrates 3a to 3d should be continuously transported in a state of being attached to each other without falling from the large-area original substrate 1, but should be completely cut after the heating and cooling process, but the phenomenon of cutting in advance occurs during the transfer. There is a problem that the pad portion P formed in the upper region of the lower plate 8b of the unit substrate 8 on which the IC driver or the like is to be mounted is damaged during the transfer of the substrate 1.

On the other hand, since the stage type does not have a big problem in discharging the dummy substrates 3a to 3d, a scribe line is formed at a desired portion while transferring the original substrate 1, and based on this, a plurality of units are sequentially cut completely. It has a structure for forming the substrate 8.

However, as described above, the base plate 1 is composed of the upper plate (1a) and the lower plate (1b) bonded to each other, the upper plate (1a) and the base of the base plate 1 for the formation of the unit substrate 8 Since the scribe lines formed and cut on the lower plate 1b are different, in the cutting system to which the stage type is applied, one of the upper plate 1a and the lower plate 1b of the base plate 1 is cut off, and then the upper plate 1a is cut. In order to cut the other one of the 1) and the lower board 1b, the means for inverting (turning) the whole board | substrate 1 whole 180 degrees is inevitably required.

However, in the cutting system to which such a stage type is applied, as described above, the large-area original board 1 is inverted entirely for the cutting operation of each of the upper plate 1a and the lower plate 1b of the original board 1. The height of the system is inevitably increased because it is necessary to have a transfer device or a corresponding inversion structure in order to make it possible, and to have a minimum space for the large-area original board 1 to be inverted entirely. There is a problem that (Size) must be huge.

It is an object of the present invention to cut the substrate more effectively while preventing the overall size of the system from increasing due to the height of the system, and in-line cutting of the substrate. The present invention provides a substrate cutting system and method for reducing tact time and further improving productivity.

The above object is, according to the present invention, the first lower stage for supporting the base plate of the cutting target object formed by the upper plate and the lower plate is bonded; An upper scribe module provided in an upper region of the first lower stage to form and cut a predetermined upper scribe line on an upper plate of the substrate supported by the first lower stage; An upper stage movable relative to the first lower stage and supporting the original substrate from which the upper plate is cut; And a lower scribe module provided in a lower region of the upper stage to form and cut a predetermined lower scribe line on a lower plate of the original substrate supported by the upper stage.

Here, each of the first lower stage and the upper stage is relatively movable on a predetermined work line formed along a cutting operation progress direction with respect to the original substrate, and the upper stage is disposed higher than the first lower stage. Can be.

The upper scribe module may include: an upper horizontal axis fixed along a horizontal direction in a longitudinal direction of the work line in a region where the first lower stage is located; And at least one upper scriber coupled to one side of the upper horizontal axis to form the upper scribe line on an upper plate of the original substrate supported and moving on the first lower stage, wherein the upper scribe line is relatively movable on the upper horizontal axis. ) May be included.

The other side of the upper horizontal axis may be further provided with an upper line observation unit for observing the upper scribe line.

The lower scribe module may include: a lower horizontal axis fixed along a horizontal direction in a longitudinal direction of the work line in an area where the upper stage is located; And at least one lower scriber coupled to one side of the lower horizontal axis to form the lower scribe line on a lower plate of the original substrate supported and moving on the upper stage, wherein the lower scriber is relatively movable on the lower horizontal axis. It may include.

The other side of the lower horizontal axis may be further provided with a lower line observation unit for observing the lower scribe line.

It may further include a discharge portion provided in the lower region of the lower scribe module to discharge the dummy substrate (Dummy Substrate) cut off from the original substrate.

The outlet is accessible and spaced apart from the lower scribe module at that location.

The discharge part may further include a crushing part for crushing the dummy substrate.

A second lower stage may be further disposed along the work line, the rear lower stage supporting a plurality of unit substrates formed from the original substrate after the cutting operation is completed by the upper and lower scribe modules. have.

At least one of the first and second lower stages and the upper stage has a plurality of horizontally movable from the plate surface of the stages to support the substrate or the unit substrate supported on the stage to be seated in the stage Lift pins may be further provided.

Vacuum lines may be formed on the plurality of lift pins provided in the upper stage to adsorb the substrate.

The apparatus may further include a distributor provided at an upper region of the second lower stage along the work line to distribute the unit substrates one by one to a predetermined trans conveyor.

The dispenser includes: a moving bar coupled to the work line and movable along the work line; And at least one distribution head which is movable along the movement bar and adsorbs the unit substrates coupled to the movement bar so as to be rotatable relative to the movement bar and the cutting operation is completed.

It may further include an inverter for inverting the upper and lower positions of the unit substrate distributed by the trans conveyor.

The inverter, the inverting axis; And a pair of reverse conveyors that are invertible based on the inversion axis and adsorb the upper and lower surfaces of the unit substrate so that the unit substrate can be inserted therein.

The apparatus may further include a take-out conveyor in which the unit substrate inverted by the inverter is loaded and taken out.

The upper plate and the lower plate of the original board carried into the first lower stage may be TFTs (TFT, Thin Film Transistor) and color filters (CF, Color Filter), respectively, and may be reversed when taken out by the take-out conveyor. have.

The substrate may be a flat panel display (FPD) of any one of a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED).

On the other hand, according to the present invention, a) a step of bringing the base plate of the cutting target object formed by the upper plate and the lower plate is joined to a predetermined work line; b) supporting the loaded base plate from the bottom, and forming a predetermined upper scribe line on the top plate of the base plate and cutting it; And c) supporting the substrate on which the upper plate is cut, from the top, and forming a predetermined lower scribe line on the lower plate of the substrate to cut the substrate.

Here, d) after the step c), the cutting operation is completed may further comprise the step of distributing a plurality of unit substrates formed from the original substrate.

e) inverting the upper and lower positions of the unit substrate after step d); And f) taking out the unit substrate having the upper and lower positions reversed.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

For reference, the substrate to be described below refers to a flat panel display (FPD) substrate including a liquid crystal display (LCD), a plasma display panel (PDP), organic light emitting diodes (OLED), and the like, for convenience of description. For the sake of brevity, these will be referred to as substrates. In addition, as described above, FIG. 1 will be described as a unit substrate 8 and FIG. 2 as an original substrate 1.

3 is a perspective view of a substrate cutting apparatus according to an embodiment of the present invention, FIG. 4 is a plan view of FIG. 3, FIG. 5 is a view illustrating an operation of an upper scribe module region, and FIG. 6 is an operation of a lower scribe module region. 7 is a flowchart of a substrate cutting method according to an embodiment of the present invention.

Referring to these drawings, mainly referring to Figures 3 and 4, the substrate cutting device according to an embodiment of the present invention, the first formed parallel to each other along the direction of the cutting operation for the substrate 1 To the fourth work line W1 to W4, the first lower stage 10, the upper stage 30, and the second lower stage 60, the distributor 70, and the transformer conveyor disposed behind them. 75, a reversing machine 85, and a takeout conveyor 90 are provided.

In addition, the substrate cutting device of the present embodiment, the upper scribe module 20 provided in the upper region of the first lower stage 10, the lower scribe module 40 provided in the lower region of the upper stage 30, the lower scribe module It is provided in the lower region of the 40 is provided with a discharge portion 50 for discharging the dummy substrate (3a ~ 3d, Dummy Substrate) cut off from the base substrate (1).

Through these configurations, the base substrate 1 of FIG. 2 is carried into the first lower stage 10, and then a predetermined cutting operation is performed to form the unit substrate 8 of FIG. 1, and then the take-out conveyor 90. A series of work is taken out.

Therefore, since the in-line of the substrate 1 can be constructed, the tact time can be reduced, and further, the productivity can be improved. Of course, the substrate cutting device of the present embodiment does not need to be equipped with a structure for inverting (overturning) the entire substrate 1 so that the height of the system can be reduced, so that the overall size of the system can be prevented. do.

Prior to the description, the original substrate 1 shown in FIG. 2, the unit substrate 8 shown in FIG. 1, and the cutting direction or the moving direction of the stages 10, 30, and 60 are described.

The base substrate 1 shown in FIG. 2 is a matrix for forming the unit substrate 8 shown in FIG. Accordingly, in this embodiment, twelve parts hatched from the original substrate 1 shown in FIG. 2 represent one unit substrate 8 shown in FIG.

In addition, most of the solid lines shown in FIG. 2 (which may not overlap with some dotted lines) indicate positions at which the upper plate 1a of the base plate 1 is cut by the upper scribe module 20. The lower scribe module 40 shows the position at which the lower plate 1b of the base plate 1 is cut. And the remaining parts without the hatching represents the dummy substrate (3a ~ 3d) discharged to the discharge unit (50).

Like the unit substrate 8, the original substrate 1 is composed of an upper plate 1a and a lower plate 1b on which two sheets of glass are bonded.

Usually, in the unit substrate 8 finally placed on the take-out conveyor 90, as shown in FIG. 1, the top plate 8a, which is a color filter CF, faces upward, and the TFT, Thin The lower plate 8b, which is a film transistor, is directed downward, and then taken out in a later step.

However, before the cutting process, the original substrate 1 is brought into the first work line W1 in an inverted state opposite to the unit substrate 8. That is, the first work line W1 is disposed so that the top plate 1a, which is a thin film transistor (TFT), faces upward, and the bottom plate 1b, which is a color filter CF, faces downward. It is carried in and a series of cutting operations are carried out.

In the present embodiment, an example in which one substrate 1 shown in FIG. 2 is cut into a total of 12 unit substrates 8 through a cutting system is illustrated. In this case, the cutting direction or the stage 10, The directions of the first to fourth working lines W1 to W4 which are formed in parallel with each other in relation to the moving directions of the 30 and 60 are in the Y-axis direction and orthogonal to the first to fourth working lines W1 to W4. The direction will be described as the X-axis direction.

Then, hereinafter, the respective components provided in the substrate cutting device will be described sequentially.

The first lower stage 10 is a portion for supporting the loaded substrate 1 and is coupled to the first work line W1 so as to move in the Y-axis direction along the first work line W1. Movement of the first lower stage 10 may be precisely controlled using linear motion or the like.

The first lower stage 10 serves to support the base substrate 1 carried into the first work line W1 thereunder. Accordingly, when the loaded substrate 1 is placed on the first lower stage 10, the lower substrate 1b of the substrate 1 is seated and supported on the upper surface of the first lower stage 10.

In the drawing, the substrate 1 is shown as if it is seated and supported on the upper surface of the first lower stage 10, but the substrate 1 is a plurality of lift pins provided on the plate surface of the first lower stage 10 ( Lift pin (not shown) is mounted on the upper surface of the first lower stage 10.

That is, when the substrate 1 is loaded onto the upper surface of the first lower stage 10 by a separate robot (not shown), the lift pins are up, thereby lowering the substrate (1). 1b) to support the lower surface, and then lift pins are down to allow the substrate 1 to be seated and supported on the upper surface of the first lower stage 10.

Of course, after the substrate 1 is seated on and supported by the upper surface of the first lower stage 10, the substrate 1 is connected to the upper surface of the first lower stage 10 by a separate vacuum line. Is adsorbed on. Thus, the substrate 1 is fixed in position without moving arbitrarily on the upper surface of the first lower stage 10. On the contrary, when the substrate 1 is taken out from the upper surface of the first lower stage 10, the lift pins are up again to lift the substrate 1 to a predetermined height.

Since the structure and operation of the lift pins are equally applied to the second lower stage 60 and the upper stage 30 as well as the first lower stage 10, further description thereof will be omitted. However, the operation of adsorbing the substrate 1 by the upper stage 30 will be described in more detail in the corresponding part.

The upper scribe module 20 is provided in the upper region of the first lower stage 10 to form a predetermined upper scribe line on the upper plate 1a of the base plate 1 supported by the first lower stage 10. It serves to form and cut (see Figure 5).

The upper scribe module 20 includes an upper horizontal axis 21 fixed along the horizontal direction in the longitudinal direction of the first work line W1 in an area where the first lower stage 10 is located, and an upper horizontal axis 21 of the upper horizontal axis 21. It is provided with a plurality of upper scribers (23, Scriber) coupled to one side.

While the first lower stage 10 may be moved in the Y-axis direction on the first work line W1, the upper horizontal axis 21 is fixed at the corresponding position and the upper scriber 23 coupled to the upper horizontal axis 21. ) Is moved.

The other side of the upper horizontal axis 21 is further provided with an upper line observation portion 25 for observing the upper scribe line. The position of the upper scriber 23 on the upper horizontal axis 21 may be determined by the control based on the image observed by the upper line observer 25.

The upper scriber 23 forms an upper scribe line on the upper holder 23a coupled to the upper horizontal axis 21 and the upper plate 1a of the base substrate 1 supported and moved by the first lower stage 10. The upper cutter 23b is provided. The upper holder 23a is relatively movable on the upper horizontal axis 21.

Therefore, when the upper scribe line is formed on the upper plate 1a of the base plate 1 shown in FIG. 2 to cut only the thickness of the upper plate 1a, the cutting operation in the Y-axis direction is performed. The first lower stage 10 is moved relative to the 23, and the cutting operation in the X-axis direction is performed by the upper scriber 23 having the upper horizontal axis 21 fixed with the first lower stage 10 fixed. Proceeds while moving in the X-axis direction. In this way, a cutting operation for the upper plate 1a of the base plate 1 may be performed.

On the other hand, as shown in Figure 5, even if the cutting operation proceeds to the upper plate (1a) of the base plate 1 and the dummy substrate 3a and the end (dummy) dummy substrate (3b) occurs in the upper plate (1a) Since 1) is supported by the first lower stage 10, the dummy substrate 3a and the end dummy substrate 3b cannot be separated from the original substrate 1. The dummy substrates shown by reference numerals 3a and 3b may be formed together with the dummy substrate 3c and the end dummy substrate 3d generated on the lower plate 1b by the operation of the lower scribe module 40 which will be described later. Separated from 1).

The upper stage 30 is located behind the first lower stage 10. More specifically, the upper stage 30, like the first lower stage 10, is formed in parallel with the first work line W1, and the second work line W2 positioned above the first work line W1. ) Is provided to be movable in the Y-axis direction.

The upper stage 30 serves to adsorb and support the substrate 1 on which the cutting operation for the upper plate 1a is completed by the upper scribe module 20. That is, unlike the first lower stage 10, the upper stage 30 serves to lift the substrate 1 itself by absorbing the upper plate 1a of the substrate 1. Therefore, the upper stage 30 is disposed higher than the first lower stage 10 and is designed to be relatively movable with respect to the first lower stage 10.

Like the first lower stage 10, a plurality of lift pins (not shown) may be provided on the upper stage 30 so that the upper stage 30 may suck up the upper plate 1a of the base plate 1. . However, unlike the first lower stage 10, a plurality of lift pins provided on the upper stage 30 may be provided with a vacuum line (not shown) to suck the substrate 1. .

Accordingly, when the lift pins provided in the first lower stage 10 are raised to raise the substrate 1 from the first lower stage 10 by a certain height, the upper portion of the first lower stage 10 is moved upward. The lift pins of the stage 30 are lowered to contact the upper surface 1a of the base plate 1, and a vacuum is formed through the vacuum line to adsorb the base plate 1. When the base substrate 1 is adsorbed, lift pins of the upper stage 30 are raised, so that the upper plate 1a of the base substrate 1 can be supported by the lower surface of the upper stage 30.

Of course, except for the structure of the lift pin and the backing line, the upper stage 30 itself may be applied as an electrostatic chuck that sucks the substrate 1 by electrical friction. In the process of transferring the substrate 1 from the first lower stage 10 to the upper stage 30, the upper stage 30 may move toward the first lower stage 10, and conversely, the first lower stage ( 10 may move to the upper stage 30 side.

The lower scribe module 40 forms and cuts a predetermined lower scribe line on the lower plate 1b of the electromagnetic wave adsorbed to the upper stage 30 (see FIG. 6).

The lower scribe module 40 has a lower horizontal axis 41 fixed along the horizontal direction in the longitudinal direction of the second work line W2 in the region where the upper stage 30 is located, and on one side of the lower horizontal axis 41. A plurality of lower scribers 43 (Scriber) are combined.

Whereas the upper stage 30 can be moved in the Y-axis direction on the second work line W2, only the lower scriber 43 is fixed at that position and coupled to the lower horizontal axis 41. Is moved.

The other side of the lower horizontal axis 41 is further provided with a lower line observer 45 for observing the lower scribe line. The position of the lower scriber 43 on the lower horizontal axis 41 may be determined by the control based on the image observed by the lower line observer 45.

The lower scriber 43 forms a lower scribe line on the lower holder 43a coupled to the lower horizontal axis 41 and the lower plate 1b of the base substrate 1 supported and moved by the upper stage 30. The cutter 43b is provided. The lower holder 43a is relatively movably coupled to the lower horizontal axis 41.

Therefore, when the lower scribe line is to be formed on the lower plate 1b of the base plate 1 shown in FIG. 2 to cut only the thickness of the lower plate 1b, the cutting operation in the Y-axis direction is performed by fixing the lower The upper stage 30 is moved relative to the 43, and the cutting operation in the X-axis direction is performed by the lower scriber 43 on the lower horizontal axis 41 in the state where the upper stage 30 is fixed. It proceeds while moving to. In this way, the cutting operation for the lower plate 1b of the base plate 1 may be performed.

6, when the lower plate 1b of the base plate 1 is cut by the thickness of the lower plate 1b by the lower scribe module 40, the upper plate 1a is formed on the lower plate 1b in this process. The dummy substrate 3c partially overlapped with the dummy substrate 3a formed therein, and an end dummy substrate 3d overlapping the end dummy substrate 3b formed on the upper plate 1a are generated. These dummy substrates 3a to 3d fall downward by their own weight or by separate removal means. The discharge substrate 50 is provided so that the falling dummy substrates 3a to 3d may be discharged to one place without being scattered.

Discharge part 50 is provided in the lower region of the lower scribe module 40 to discharge the dummy substrates (3a ~ 3d) cut (cut off) from the base substrate (1). The discharge part 50 forms a hopper shape whose volume is gradually smaller toward the rear end so that the dummy substrates 3a to 3d do not scatter.

While the base plate 1 is in operation in the upper scribe module 20 area, the discharge part 50 does not need to closely approach the lower area of the lower scribe module 40. Therefore, the discharge unit 50 may be provided to be accessible and spaced apart from the lower scribe module 40 in the corresponding position. Such a structure can be easily realized by a cylinder or a combination of a motor and a ball screw.

In addition, the cut out dummy substrates (3a ~ 3d) all have a constant length and area, so that the finely crushed reuse, the discharge unit 50, the shredding unit 52 for crushing the dummy substrates (3a ~ 3d) is further Can be prepared.

The second lower stage 60 is a part for supporting the unit substrates 8 formed by cutting the original substrate 1 by the upper scribe module 20 and the lower scribe module 40 one by one. The second lower stage 60 is also provided to be movable in the Y-axis direction on the third work line W3 forming the same axis as the first work stage W1.

In order for the plurality of unit substrates 8 formed in the upper stage 30 to be transferred to the second lower stage 60, the second lower stage 60 may move toward the upper stage 30, and conversely, the upper stage 30. ) May move to the second lower stage 60 side.

However, referring to the drawing, since the distributor 70 is installed in the upper region of the second lower stage 60, when the upper stage 30 moves to the second lower stage 60, the upper stage 30 is moved. It can be caught in the dispenser 70 and its movement can be constrained. Therefore, in the present exemplary embodiment, the second lower stage 60 is transferred to the upper stage 30 along the third work line W3 to receive the unit substrates 8.

The distributor 70 is coupled to the fourth work line W4 which forms the same axis as the upper portion of the third work line W3, that is, the second work line W2, and moves along the fourth work line W4. A plurality of unit substrates 8, the cutting operation of which is completed to serve to distribute correspondingly to a predetermined trans conveyor (75) one by one.

That is, since the unit substrates 8 formed by cutting from the original substrate 1 are individually managed one by one in a later process, the distributor 70 transfers the plurality of unit substrates 8 placed on the second lower stage 60. It serves to transfer one by one to the conveyor (75).

The distributor 70 is coupled to the fourth working line (W4) and movable bar 71 movable in the Y-axis direction along the fourth working line (W4), and coupled to the moving bar (71) moving bar (71). It is provided with a plurality of dispensing heads 72 that can be moved along) and, of course, rotate and move relative to the moving bar 71 while adsorbing or gripping the unit substrates 8 to the trans conveyor 75.

As described above, since the unit substrates 8 are managed one by one, if one trans conveyor 75 is provided in the cutting system of the present embodiment, one distribution head 72 is also provided on the moving bar 71. However, in the present embodiment, since two trans conveyors 75 are provided to improve productivity, two distribution heads 72 are also provided on the moving bar 71. Their number can be adjusted by design.

On the other hand, in the beginning, the base plate 1 is arranged such that the top plate 1a, which is a TFT (thin film transistor), faces upward, and the bottom plate 1b, which is a color filter CF, faces downward. Since the cutting operation was performed on the first to fourth working lines W1 to W4 in FIG. 4, when the unit substrates 8 distributed by the distributor 70 and placed on the trans conveyor 75 are viewed, color filters CF and Color The upper plate 8a, which is a filter, faces downward, and the lower plate 8b, which is a thin film transistor (TFT), faces upward.

However, for the process control, the unit substrate 8 finally produced, as shown in Figure 1, the top plate 8a, which is a color filter (CF, Color Filter) is facing upward, TFT, Thin (TFT, Thin) The lower plate 8b, which is a film transistor, should face downward.

To this end, the rear of the trans conveyor 75 is further provided with an inverter 85 for reversing the upper and lower positions of the unit substrate (8).

The inverter 85 is inverted based on the inverted shaft 86 and the inverted shaft 86, and a pair of upper and lower surfaces of the unit substrate 8 so that the unit substrate 8 can be inserted therein. Reverse Conveyor (87) is provided.

Accordingly, after the unit substrate 8 placed on the trans conveyor 75 is inserted between the pair of reverse conveyors 87, the pair of reverse conveyors 87 are rotated 180 degrees around the inversion shaft 86. When reversed, the position of the unit substrate 8 can be easily changed. That is, as desired, the unit substrate 8 is disposed so that the top plate 8a, which is a color filter CF, faces upward, and the bottom plate 8b, TFT, which is a thin film transistor, faces downward. do.

At the rear of the inverter 85 is provided a take-out conveyor 90 which is loaded with a final unit substrate 8 whose top and bottom positions are reversed through the inverter 85 and taken out in a later process. The take-out conveyor 90 is also provided in the same number on the same axis as the trans conveyor 75. FIG.

A cutting method of cutting the original substrate 1 into a plurality of unit substrates 8 using a substrate cutting system having such a configuration will be briefly described with reference to FIGS. 3, 4, and 7.

First, the substrate 1 is carried to the first work line W1 side (S11) and then placed on the upper surface of the first lower stage 10. In this case, as described above, the upper surface of the first lower stage 10 is received while being down while receiving the base plate 1 while the lift pins provided in the first lower stage 10 are up. Allow it to be seated and supported.

When the original substrate 1 is seated on the upper surface of the first lower stage 10, the upper scribe module 20 and the first lower stage 10 is driven to cut the upper plate 1a of the original substrate 1 This proceeds (S12).

That is, the cutting operation in the Y-axis direction is performed while the first lower stage 10 is moved relative to the fixed upper scriber 23, and the cutting operation in the X-axis direction is performed by the first lower stage 10. In the fixed state, the upper scriber 23 is moved while moving in the X-axis direction on the upper horizontal axis 21.

When the cutting operation on the upper plate 1a of the base plate 1 is completed, the upper stage 30 moves along the second work line W2 and is disposed in the upper region of the first lower stage 10.

Subsequently, when the lift pins provided in the first lower stage 10 rise to raise the substrate 1 from the first lower stage 10 by a certain height, the upper stage moved to the upper position of the first lower stage 10. The lift pins of 30 descend and come into contact with the top plate 1a of the base plate 1, thereby adsorbing the base plate 1 by forming a vacuum through the vacuum line.

When the substrate 1 is adsorbed, the lift pins of the upper stage 30 are raised again, so that the upper plate 1a of the substrate 1 can be supported by the lower surface of the upper stage 30. The upper stage 30 which has absorbed the substrate 1 from above returns to its original position along the second work line W2.

As such, when the substrate 1 is adsorbed to the upper stage 30, the lower scribe module 40 and the upper stage 30 are driven to cut the lower substrate 1b of the substrate 1 (S13). ).

That is, the cutting operation in the Y-axis direction is performed while the upper stage 30 is moved relative to the fixed lower scriber 43, and the cutting operation in the X-axis direction is performed while the upper stage 30 is fixed. The lower scriber 43 proceeds while moving on the lower horizontal axis 41. At this time, the dummy substrates 3a to 3d separated from the original substrate 1 fall and are discharged through the discharge unit 50.

Next, the second lower stage 60 moves down the upper stage 30 along the third work line W3 and receives the unit substrates 8 separated from the upper stage 30. Then it returns to its original position.

After returning to the original position, the unit substrates 8 placed on the second lower stage 60 are distributed to the trans conveyor 75 one by one by the distributor 70 moving along the fourth work line W4 ( S14).

Then, the unit substrate 8 placed on the trans conveyor 75 is inserted between the pair of reverse conveyors 87, and then the pair of reverse conveyors 87 are rotated 180 on the inverted shaft 86 as the axis. By reversing, the position of the upper and lower surfaces of the unit substrate 8 is changed (S15).

Thus, the final unit substrate 8 having the upper and lower positions reversed through the inverter 85 may be taken out in a post process while being loaded on the takeout conveyor 90 (S16).

Thus, according to this embodiment, since the structure for overturning (inverting) the original substrate 1 does not need to be equipped, the height of the system is increased and the overall size of the system can be prevented from being huge. Will be.

In addition, it is possible to cut the base plate 1 more effectively, as well as in-line cutting operations on the base plate 1, thereby reducing the tact time and further improving productivity. It will be possible to improve.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, it is possible to cut the substrate more effectively while preventing the height of the system from being increased overall and the size of the system as a whole. Line can be used to reduce the Tact Time and further improve productivity.

Claims (22)

A first lower stage supporting the original substrate of a cutting target to be formed by joining the upper and lower plates; An upper scribe module provided in an upper region of the first lower stage to form and cut a predetermined upper scribe line on an upper plate of the substrate supported by the first lower stage; An upper stage movable relative to the first lower stage and supporting the original substrate from which the upper plate is cut; And And a lower scribe module provided in a lower region of the upper stage to form and cut a predetermined lower scribe line on a lower plate of the original substrate supported by the upper stage. The method of claim 1, Each of the first lower stage and the upper stage is relatively movable on a predetermined work line formed along a cutting operation progress direction with respect to the original substrate, and the upper stage is disposed higher than the first lower stage. Substrate cutting system. The method of claim 2, The upper scribe module, An upper horizontal axis fixed in a horizontal direction in a longitudinal direction of the work line in an area where the first lower stage is located; And At least one upper scriber coupled to one side of the upper horizontal axis and forming the upper scribe line on an upper plate of the original substrate supported and moving on the first lower stage, wherein the upper scribe line is relatively movable on the upper horizontal axis Substrate cutting system comprising a. The method of claim 3, The other side of the upper horizontal axis substrate cutting system, characterized in that the upper line observation portion for observing the upper scribe line is further provided. The method of claim 2, The lower scribe module, A lower horizontal axis fixed in a horizontal direction in a longitudinal direction of the work line in an area where the upper stage is located; And Coupled to one side of the lower horizontal axis, the lower scribe line is formed on the lower plate of the base plate supported and moved to the upper stage, including at least one lower scriber (Scriber) relatively movable on the lower horizontal axis Substrate cutting system, characterized in that. The method of claim 5, Substrate cutting system, characterized in that the other side of the lower horizontal axis is provided with a lower line observer for observing the lower scribe line. The method of claim 1, And a discharge part provided in a lower area of the lower scribe module and discharging a dummy substrate cut out of the original substrate. The method of claim 7, wherein And the outlet portion is accessible and spaced apart from the lower scribe module at a corresponding position. The method of claim 8, And a shredding part for crushing the dummy substrate in the discharge part. The method of claim 2, And a second lower stage disposed at the rear of the upper stage along the work line and supporting the plurality of unit substrates formed from the original substrate by cutting the completed work by the upper and lower scribe modules. Substrate cutting system. The method of claim 10, At least one of the first and second lower stages and the upper stage has a plurality of horizontally movable from the plate surface of the stages to support the substrate or the unit substrate supported on the stage to be seated in the stage The substrate cutting system, characterized in that the lift pin (Lift Pin) is further provided. The method of claim 11, And a plurality of lift pins provided on the upper stage to form a vacuum line to absorb the substrate. The method of claim 10, And a distributor provided in an upper region of the second lower stage along the work line and distributing the unit substrates corresponding to one-by-one to a predetermined trans conveyor one by one. The method of claim 13, The distributor, A moving bar coupled to the work line and movable along the work line; And And at least one distribution head movable to the moving bar and adsorbing the unit substrates coupled to the moving bar to be rotatable relative to the moving bar to complete the cutting operation. The method of claim 14, And a reverser for reversing the upper and lower positions of the unit substrates distributed by the trans conveyor. The method of claim 15, The inverter, Inverted axis; And And a pair of reverse conveyors that are reversible based on the inverted shaft and adsorb the upper and lower surfaces of the unit substrate so that the unit substrate can be inserted therein. The method of claim 16, And a takeout conveyor to which the unit substrate inverted by the inverter is loaded and taken out. The method of claim 17, The upper and lower plates of the original substrate carried into the first lower stage are TFT, Thin Film Transistor, and Color Filter, respectively. Substrate cutting system, characterized in that the reversed when taken out by the take-out conveyor. The method of claim 1, The substrate is a substrate cutting system, characterized in that the flat panel display (FPD) of any one of a liquid crystal display (LCD), a plasma display panel (PDP) and organic light emitting diodes (OLED). a) bringing the original substrate of the cutting target object formed by joining the upper and lower plates to a predetermined work line; b) supporting the loaded base plate from the bottom, and forming a predetermined upper scribe line on the top plate of the base plate and cutting it; And and c) forming and cutting a predetermined lower scribe line on the lower plate of the original substrate after supporting the original substrate on which the upper plate is cut. The method of claim 20, d) after the step c), the cutting operation is completed, further comprising the step of distributing a plurality of unit substrates formed from the original substrate. The method of claim 21, e) inverting the upper and lower positions of the unit substrate after step d); And and f) taking out the unit substrate having its upper and lower positions reversed.

Images