CN112103228A - Substrate transfer head - Google Patents

Substrate transfer head Download PDF

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Publication number
CN112103228A
CN112103228A CN201911182537.3A CN201911182537A CN112103228A CN 112103228 A CN112103228 A CN 112103228A CN 201911182537 A CN201911182537 A CN 201911182537A CN 112103228 A CN112103228 A CN 112103228A
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CN
China
Prior art keywords
substrate
edge
unit
gas
transfer head
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Granted
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CN201911182537.3A
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Chinese (zh)
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CN112103228B (en
Inventor
朴鲁贤
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Top Engineering Co Ltd
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Top Engineering Co Ltd
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Publication of CN112103228B publication Critical patent/CN112103228B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Abstract

A substrate transfer head of an embodiment of the present invention includes: an adsorption member configured to adsorb the unit substrates divided from the mother substrate; a first scrap pressing section comprising: a plurality of push rods arranged to correspond to an area occupied by the rim charge positioned around the unit substrate; a push plate provided with a plurality of push rods; and a push plate driver for moving the push plate in such a manner that the plurality of push rods pressurize the rim charge; and a second scrap pressing portion including: a gas injection nozzle configured to inject gas toward an edge portion of the unit substrate to pressurize the edge trim; and a gas supply source configured to supply a gas to the gas injection nozzle, either one of the first and second edge pressurization units may be configured to pressurize the edge before the unit substrate is adsorbed by the adsorption member or while the unit substrate is adsorbed by the adsorption member, and the other one of the first and second edge pressurization units may be configured to pressurize the edge remaining at the edge of the unit substrate adsorbed by the adsorption member.

Description

Substrate transfer head
Technical Field
The present invention relates to a substrate transfer head configured to transfer a unit substrate divided from a mother substrate.
Background
In general, various types of panels, semiconductor substrates, and the like used for displays are manufactured using unit substrates cut into predetermined sizes from a mother substrate made of a brittle material.
In order to cut the mother substrate into unit substrates, a scribing process is performed in which a scribing wheel made of a material such as diamond is pressed against the mother substrate, and then the scribing wheel is moved along a virtual scribe line to be cut into the mother substrate to form a scribe line on the mother substrate. Also, a breaking process, i.e., pressing the mother substrate along the scribe lines, is performed to divide the mother substrate into the unit substrates. Thereafter, a substrate transfer process is performed, that is, a unit substrate divided from the mother substrate by the breaking process is taken and transferred to a subsequent process.
When the mother substrate is divided into unit substrates, there is a rim charge (dummy portion, broken portion) which is a portion that is not actually used for product removal at least one edge portion of the unit substrate. Such an edge should be separated from the unit substrate, but may remain in an adhered state at the edge portion of the unit substrate for various reasons.
Disclosure of Invention
The invention aims to provide a substrate transfer head which can reliably separate edge scraps from the edge parts of unit substrates so as to prevent the edge scraps from remaining on the edge parts of the unit substrates.
A substrate transfer head of an embodiment of the present invention for achieving the above object includes: an adsorption member configured to adsorb the unit substrates divided from the mother substrate; a first scrap pressing section comprising: a plurality of push rods arranged to correspond to an area occupied by the rim charge positioned around the unit substrate; a push plate provided with a plurality of push rods; and a push plate driver for moving the push plate in such a manner that the plurality of push rods pressurize the rim charge; and a second scrap pressing portion including: a gas injection nozzle configured to inject gas toward an edge portion of the unit substrate to pressurize the edge trim; and a gas supply source configured to supply a gas to the gas injection nozzle, wherein one of the first and second edge pressurization units may be configured to pressurize the edge before the unit substrate is adsorbed by the adsorption member or while the unit substrate is adsorbed by the adsorption member, and the other of the first and second edge pressurization units may be configured to pressurize the edge remaining at the edge of the unit substrate adsorbed by the adsorption member.
The substrate transfer head according to an embodiment of the present invention may further include an edge sensor disposed at one side of the suction member and detecting whether an edge exists at an edge portion of the unit substrate sucked to the suction member.
The gas injection nozzle may be disposed to be inclined with respect to a vertical axis orthogonal to the surface of the unit substrate so as to inject the gas toward the edge trim in a direction in which the edge trim is spaced apart from the unit substrate.
The substrate transfer head according to an embodiment of the present invention may further include a nozzle rotator that rotates the gas injection nozzle about a horizontal axis orthogonal to a vertical axis orthogonal to the unit substrate to adjust an inclination angle of the gas injection nozzle with respect to the vertical axis.
The substrate transfer head according to an embodiment of the present invention may further include a gas temperature regulator that regulates a temperature of the gas supplied from the gas supply source to the gas injection nozzle.
The gas supply source may supply the gas to the gas injection nozzle while periodically changing the pressure of the gas.
The substrate transfer head according to an embodiment of the present invention includes an edge-trim pressurizing unit that applies a pressurizing force to an edge trim around the unit substrate in a second direction opposite to the first direction when the unit substrate is moved by suction in the first direction, so that the edge trim can be more easily and reliably separated from the edge portion of the unit substrate, thereby preventing the edge trim from remaining on the edge portion of the unit substrate. Therefore, the unit substrate can be prevented from being transferred to the subsequent process in a state where the edge of the unit substrate remains. In addition, the problem that the leftover remaining at the edge of the unit substrate falls to an undesired place in the process of transferring the unit substrate to the subsequent process can be prevented.
Drawings
Fig. 1 is a plan view schematically showing a substrate cutting device provided with a substrate transfer head of a first embodiment of the present invention.
Fig. 2 is a side view schematically showing a substrate cutting apparatus provided with a substrate transfer head of a first embodiment of the present invention.
Fig. 3 is a diagram schematically showing a substrate transfer head of the first embodiment of the present invention.
Fig. 4 is a diagram schematically showing the bottom of the base member of the substrate transfer head of the first embodiment of the present invention.
Fig. 5 is a diagram briefly showing the bottom of a pusher plate of the substrate transfer head of the first embodiment of the present invention.
Fig. 6 is a diagram schematically showing a pusher and a pusher of the substrate transfer head according to the first embodiment of the present invention.
Fig. 7 to 10 are diagrams for explaining the operation of the substrate transfer head according to the first embodiment of the present invention.
Fig. 11 is a diagram schematically showing a substrate transfer head of a second embodiment of the present invention.
Fig. 12 and 13 are diagrams for explaining the operation of the substrate transfer head according to the second embodiment of the present invention.
Fig. 14 is a diagram schematically showing a substrate transfer head of a third embodiment of the present invention.
Fig. 15 is a diagram schematically showing a substrate transfer head of a fourth embodiment of the present invention.
Fig. 16 is a diagram schematically showing a substrate transfer head of a fifth embodiment of the present invention.
Fig. 17 is a diagram schematically showing a substrate transfer head of a sixth embodiment of the present invention.
Fig. 18 is a diagram schematically showing a substrate transfer head of a seventh embodiment of the present invention.
Fig. 19 is a diagram schematically showing the bottom of a base member of a substrate transfer head of a seventh embodiment of the present invention.
Fig. 20 is a diagram schematically showing another example of the substrate transfer head according to the seventh embodiment of the present invention.
Fig. 21 is a view schematically showing the bottom of a base member of another example of a substrate transfer head according to a seventh embodiment of the present invention.
Description of the reference numerals
70. 170, 270, 370, 470, 570, 770: an edge material pressurizing assembly; 71. 771: pushing the plate; 72. 772: a push rod; 175. 275, 375, 475, 575, 775: a gas injection nozzle; 176. 276, 376, 476, 576, 776: a gas supply source.
Detailed Description
Hereinafter, a substrate transfer head according to an embodiment of the present invention will be described with reference to the drawings.
First, a substrate cutting apparatus including a substrate transfer head according to a first embodiment of the present invention will be described with reference to fig. 1 to 2.
Referring to fig. 1 and 2, a direction in which the mother substrate S to be subjected to the substrate cutting process is transferred is defined as a Y-axis direction, and a direction intersecting the direction in which the mother substrate S is transferred (Y-axis direction) is defined as an X-axis direction. Also, a direction perpendicular to an X-Y plane on which the mother substrate S is placed is defined as a Z-axis direction. The term "scribe line" means a groove and/or a crack formed on the surface of the mother substrate S so as to extend in a predetermined direction. Also, the term dicing scribe line means a virtual line on which a scribe line is to be formed.
As shown in fig. 1 and 2, the substrate cutting apparatus may include a scribing unit 30, a first table 10, a second table 20, a substrate transfer unit 40, and a substrate transfer unit 50.
The first table 10 is disposed on an upstream side of the scribing unit 30 in a transfer direction of the mother substrate S. The first table 10 functions to support the mother substrate S during the movement of the mother substrate S toward the scribing unit 30. In addition, the first table 10 can function to support the mother substrate S in a process of forming the scribing line on the mother substrate S. For example, the first table 10 may be constituted by a belt 11. The belt 11 may be supported by a plurality of pulleys 12. At least one of the plurality of pulleys 12 may be a driving pulley that provides a driving force to rotate the belt 11.
The second table 20 is disposed at a downstream side of the scribing unit 30 in the transfer direction of the mother substrates S. The second table 20 functions to receive and support the mother substrate S on which the scribing lines are formed by the scribing unit 30. In addition, the second table 20 can function to support the mother substrate S in a process of forming the scribing line on the mother substrate S. For example, the second table 20 may be constituted by a belt 21. The belt 21 may be supported by a plurality of pulleys 22. At least one of the plurality of pulleys 22 may be a driving pulley that provides a driving force to rotate the belt 21.
The scribing unit 30 is configured to form a scribe line in the X-axis direction and/or the Y-axis direction on the mother substrate S. The scribing unit 30 includes a frame 31 extending in the X-axis direction and a scribing head 32 provided on the frame 31 so as to be movable in the X-axis direction. The scribing head 32 is provided with a scribing wheel 34. The scribing wheel 34 may be mounted to the scribing head 32 via a wheel frame 33.
The scribing head 32 may be configured to be movable in the X-axis direction with respect to the frame 31. For this purpose, the frame 31 may be provided with an X-axis moving mechanism such as an actuator using pneumatic or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism. The X-axis moving mechanism can provide a driving force for moving the scribing head 32 in the X-axis direction.
The scribing head 32 is relatively moved in the X-axis direction with respect to the mother substrate S in a state where the scribing wheel 34 presses the surface of the mother substrate S, so that a scribe line can be formed in the X-axis direction on the surface of the mother substrate S. In addition, the mother substrate S is moved in the Y-axis direction by the substrate transfer unit 40 in a state where the scribing wheel 34 presses the surface of the mother substrate S, so that a scribe line can be formed in the Y-axis direction on the surface of the mother substrate S.
In this way, when the scribing wheel 34 forms the scribe lines in the X-axis direction and/or the Y-axis direction on the surface of the mother substrate S, the mother substrate S can be divided from the unit substrate S1 along the scribe lines as the cracks formed in the scribe lines progress into the mother substrate S, or the mother substrate S can be divided into the unit substrates S1 along the scribe lines with a small force.
As another example, although not shown, the present invention may be applied to a configuration in which a breaking unit is provided between the scribing unit 30 and the second table 20, the breaking unit applying a predetermined pressure to the mother substrate S along the scribe line to divide the mother substrate S along the scribe line.
On the other hand, if the mother substrate S is divided into the plurality of unit substrates S1, a margin S2, which is a portion that is not actually removed for a product, exists at least one edge portion of the unit substrate S1.
The scribing wheel 34 may be attached to the wheel frame 33 so as to be rotatable about the Z axis. Therefore, the cutting blade of the scribing wheel 34 can be parallel to the X-axis direction or parallel to the Y-axis direction.
The scribing head 32 may be configured to be movable in the Z-axis direction with respect to the frame 31. For this purpose, the frame 31 may be provided with a Z-axis moving mechanism such as an actuator using pneumatic or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism. The Z-axis moving mechanism can provide a driving force for moving the scribing head 32 in the Z-axis direction.
As the scribing head 32 moves in the Z-axis direction relative to the frame 31, the scribing wheel 34 can be pressed against or spaced apart from the mother substrate S. Further, by adjusting the degree of movement of the scribing head 32 in the Z-axis direction, the pressing force applied to the mother substrate S by the scribing wheel 34 can be adjusted. By moving the scribing head 32 in the Z-axis direction, the cutting depth (penetration depth) of the scribing wheel 34 to the mother substrate S can be adjusted.
The substrate transfer unit 40 is configured to transfer the mother substrate S to the scribing unit 30 while holding a rear end portion of the mother substrate S in the transfer direction, i.e., a trailing end of the mother substrate S. The substrate transfer unit 40 may include: a clamp assembly 41 configured to clamp a trailing end of the mother substrate S supported on the first table 10; a support frame 42 connected to the jig assembly 41 and extending in the X-axis direction; and a guide rail 43 connected to the support frame 42 and extending in the Y-axis direction. A linear moving mechanism such as an actuator using pneumatic or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism may be provided between the support frame 42 and the guide rail 43. Therefore, in a state where the chuck unit 41 holds the trailing end of the mother substrate S, the mother substrate S can be transferred in the Y-axis direction as the support frame 42 is moved in the Y-axis direction by the linear movement mechanism. At this time, the first table 10 can stably support the mother substrate S while moving in synchronization with the movement of the chuck assembly 41. The jig assembly 41 can press and hold the top and bottom surfaces of the mother substrate S in the trailing end of the mother substrate S. As another example, the chuck assembly 41 may be configured to include a vacuum hole connected to a negative pressure source and to suck the top surface or the bottom surface of the mother substrate S.
The substrate transfer unit 50 is configured to transfer the unit substrate S1 supported by the second table 20 to a subsequent process.
The substrate transfer unit 50 includes a substrate transfer head 60, a support frame 52, a head moving assembly 53, and a head elevating assembly 54.
The support frame 52 is configured to support the substrate transfer head 60 so that the substrate transfer head 60 can move in the Y-axis direction.
The head moving unit 53 is configured to move the substrate transfer head 60 in the Y-axis direction following the support frame 52. The head lift assembly 54 is configured to move the substrate transfer head 60 in the Z-axis direction. The head moving assembly 53 and the head lifting assembly 54 may be adapted to an actuator operating under pneumatic or hydraulic pressure, a linear moving mechanism such as a linear motor or a ball screw mechanism operating under electromagnetic interaction, or the like.
On the other hand, although not shown, the substrate transfer unit 50 may further include an actuator operating under air pressure or hydraulic pressure, a linear moving mechanism such as a linear motor or a ball screw mechanism operating under electromagnetic interaction, or the like, to move the substrate transfer head 60 in the X-axis direction.
With this configuration, the substrate transfer head 60 can move in the X-axis direction and/or the Y-axis direction to be positioned above the unit substrate S1 to be carried out, and the substrate transfer head 60 can move in the Z-axis direction to suck the unit substrate S1.
As shown in fig. 3 to 6, the substrate transfer head 60 of the first embodiment of the present invention is configured to hold and transfer the unit substrates S1.
The substrate transfer head 60 includes a base member 61 and a lift member 62.
The base member 61 and the lifting member 62 are connected to each other. A predetermined space is provided between the base member 61 and the lift member 62. The lifting member 62 is connected to the head lift assembly 54. Therefore, the base member 61 and the lift member 62 can be moved together in the Z-axis direction by the head lifting assembly 54.
The lower side of the base member 61 may have a shape corresponding to the shape of an area including the area occupied by the one unit substrate S1 and the area occupied by the margin S2 around the one unit substrate S1.
The base member 61 is provided with a plurality of suction members 63. The plurality of adsorption members 63 may be arranged in an area corresponding to an area occupied by one unit substrate S1. The plurality of suction members 63 are connected to a negative pressure source 82. The plurality of suction members 63 may be configured to suck the unit substrates S1 by the negative pressure applied to the negative pressure source 82.
The substrate transfer head 60 may further include an edge-trim pressing unit 70, and the edge-trim pressing unit 70 may be configured to press the edge trim S2 mounted on the second table 20 (the belt 21).
The scrap press assembly 70 includes a push plate 71, a plurality of push rods 72, and a push plate driver 73.
The push plate driver 73 may be constituted by a linear moving mechanism such as an actuator using pneumatic or hydraulic pressure, a linear motor or a ball screw mechanism operating under electromagnetic interaction, or the like. The push plate driver 73 is connected to the push plate 71 and moves the push plate 71 in the Z-axis direction.
The pusher 71 may have a shape corresponding to the shape of an area including one unit substrate S1 and its surrounding rim charge S2.
The plurality of push rods 72 are provided on the bottom surface (the surface facing the unit substrate S1 and the trim S2) of the push plate 71. A plurality of push rods 72 extend from the bottom surface of the push plate 71 in the Z-axis direction. The plurality of push rods 72 are arranged in the area corresponding to the area occupied by the rim charge S2. The plurality of push rods 72 are arranged along the outline of the area occupied by the plurality of suction members 63. That is, the plurality of push rods 72 are arranged along the outline of the area occupied by the unit substrate S1.
The base member 61 is formed with a plurality of through holes 612 corresponding to the plurality of push rods 72, respectively. The plurality of push rods 72 pass through the plurality of through holes 612, and thus, the lower ends of the plurality of push rods 72 can be exposed to the outside toward the mother substrate S.
Hereinafter, the operation of the substrate transfer head 60 according to the first embodiment of the present invention will be described with reference to fig. 7 to 10.
As shown in fig. 7, as the substrate transfer head 60 is lowered toward the unit substrates S1 by the head elevating assembly 54, the plurality of suction members 63 contact the surface of the unit substrate S1. At this time, the end portions of the plurality of push rods 72 may be held in a state of being spaced upward from the plane on which the end portions of the plurality of suction members 63 are located. As another example, the ends of the plurality of push rods 72 may be located on the same plane as the plane on which the ends of the plurality of suction members 63 are located. In this case, as the substrate transfer head 60 descends toward the unit substrate S1, the ends of the plurality of adsorbing members 63 can contact the surface of the rim charge S2 while the ends of the plurality of adsorbing members 63 contact the surface of the unit substrate S1.
As shown in fig. 8, as the push plate 71 is lowered by the push plate driver 73, the plurality of push rods 72 provided in the push plate 71 come into contact with the rim charge S2 to press the rim charge S2 downward.
Then, negative pressure is applied to the plurality of suction members 63 by the negative pressure source 82, and a suction force directed upward is applied to the unit substrate S1.
Therefore, the suction force in the first direction (upward) acts on the unit substrate S1, and the pressing force in the second direction (downward) opposite to the first direction (upward) acts on the edge trim S2.
Further, as shown in fig. 9, the substrate transfer head 60 is raised by the head elevating assembly 54. At this time, the push plate 71 is lowered, and thereby, the plurality of push rods 72 can be kept in a state of continuing to press the rim charge S2. That is, when the plurality of suction members 63 rise in the first direction, the plurality of push rods 72 can be maintained in a state of pressing the trimmings S2 in the second direction.
Accordingly, a force (an attraction force and a force caused by the plurality of attraction members 63 rising) in the first direction acts on the unit substrate S1, and a pressing force in the second direction acts on the edge trim S2. In this way, forces in opposite directions act on the unit substrate S1 and the edge trim S2, and the edge trim S2 can be reliably separated from the edge portion of the unit substrate S1.
Then, as shown in fig. 10, the substrate transfer head 60 is raised in a state where the margin S2 is separated from the edge portion of the unit substrate S1. Also, the substrate transfer head 60 can be transferred to a subsequent process while moving horizontally. At this time, the pusher 71 can be raised so that the end portions of the plurality of pushers 72 are spaced upward from the plane on which the end portions of the plurality of suction members 63 are located, whereby the plurality of pushers 72 can be prevented from interfering with other peripheral devices and components when the unit substrate S1 is conveyed.
The substrate transfer head 60 according to the first embodiment of the present invention includes the edge-trim pressurizing unit 70 that applies a pressurizing force to the edge trim S2 around the unit substrate S1 in a second direction opposite to the first direction when the unit substrate S1 is moved by suction in the first direction, so that the edge trim S2 can be more easily and reliably separated from the edge portion of the unit substrate S1, and the edge trim S2 is prevented from remaining on the edge portion of the unit substrate S1. Therefore, it is possible to prevent the unit substrate S1 from being transferred to a subsequent process in a state where the edge of the unit substrate S1 is left with the edge trim S2. In addition, the edge trim S2 remaining at the edge of the unit substrate S1 can be prevented from falling to an undesired place during the transfer of the unit substrate S1 to the subsequent process.
Hereinafter, a substrate transfer head 160 according to a second embodiment of the present invention will be described with reference to fig. 11 to 13. The same components as those described in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 11, the substrate transfer head 160 according to the second embodiment of the present invention may include a base member 161, a plurality of suction members 163, and an edge-trim pressurizing assembly 170.
The lower side of the base member 161 may have a shape corresponding to a shape of an area including an area occupied by one unit substrate S1 and an area occupied by the margin S2 around one unit substrate S1.
The base member 161 is provided with a plurality of suction members 163. The plurality of adsorption members 163 may be arranged in an area corresponding to the area occupied by one unit substrate S1. The plurality of suction members 163 are connected to a negative pressure source 182. The plurality of suction members 163 may be configured to suck the unit substrates S1 by the negative pressure applied to the negative pressure source 182.
The scrap pressing assembly 170 includes a plurality of air injection nozzles 175 and a gas supply 176.
The gas supply source 176 is connected to the plurality of gas injection nozzles 175 and configured to supply gas to the plurality of gas injection nozzles 175.
On the other hand, the gas supply source 176 can supply gas to the gas injection nozzle 175 at a constant pressure. As another example, the gas supply source 176 can supply gas to the gas injection nozzle 175 while periodically changing the gas pressure. In this case, the gas injected from the gas injection nozzle 175 can vibrate the edge trim S2 while colliding with the edge trim S2 in the form of a predetermined vibration wave, and thus the edge trim S2 can be more reliably separated from the unit substrate S1.
The plurality of air injection nozzles 175 are provided on the bottom surface (the surface facing the unit substrate S1 and the edge trim S2) of the base member 161. The plurality of air injection nozzles 175 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of air injection nozzles 175 are arranged along the outline of the area occupied by the plurality of adsorption members 163. That is, the plurality of gas injection nozzles 175 are arranged along the outline of the area occupied by the unit substrate S1.
Hereinafter, the operation of the substrate transfer head 160 according to the second embodiment of the present invention will be described with reference to fig. 12 and 13.
As shown in fig. 12, as the substrate transfer head 160 descends toward the unit substrate S1, the plurality of suction members 163 contact the surface of the unit substrate S1.
Then, a negative pressure is applied to the plurality of suction members 163 by the negative pressure source 182, and a suction force directed upward is applied to the unit substrate S1. At this time, as the gas is supplied from the gas supply source 176 to the plurality of gas injection nozzles 175, the gas is injected from the plurality of gas injection nozzles 175 toward the rim charge S2.
Therefore, the suction force in the first direction (upward) acts on the unit substrate S1, and the pressing force in the second direction (downward) opposite to the first direction (upward) acts on the edge trim S2.
As shown in fig. 13, the plurality of suction members 163 are raised as the substrate transfer head 160 is raised. At this time, the gas is continuously injected toward the rim charge S2 from the plurality of gas injection nozzles 175.
Accordingly, a force (an attraction force and a force raised by the plurality of attraction members 163) in the first direction acts on the unit substrate S1, and a pressing force in the second direction acts on the edge trim S2. In this way, forces in opposite directions act on the unit substrate S1 and the edge trim S2, and the edge trim S2 can be reliably separated from the edge portion of the unit substrate S1.
The substrate transfer head 160 according to the second embodiment of the present invention includes the edge-trim pressurizing unit 170 for applying a pressurizing force to the edge trim S2 around the unit substrate S1 in a second direction opposite to the first direction when the unit substrate S1 is moved by suction in the first direction, so that the edge trim S2 can be more easily and reliably separated from the edge portion of the unit substrate S1, and the edge trim S2 is prevented from remaining on the edge portion of the unit substrate S1. Therefore, it is possible to prevent the unit substrate S1 from being transferred to a subsequent process in a state where the edge of the unit substrate S1 is left with the edge trim S2. In addition, the edge trim S2 remaining at the edge of the unit substrate S1 can be prevented from falling to an undesired place during the transfer of the unit substrate S1 to the subsequent process.
Hereinafter, a substrate transfer head 260 according to a third embodiment of the present invention will be described with reference to fig. 14. The same components as those described in the first and second embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 14, the substrate transfer head 260 according to the third embodiment of the present invention may include a base member 261, a plurality of suction members 263, and an edge-trim pressurizing assembly 270.
The lower side of the base member 261 may have a shape corresponding to a shape of an area including an area occupied by one unit substrate S1 and an area occupied by the margin S2 around one unit substrate S1.
The base member 261 is provided with a plurality of suction members 263. The plurality of adsorption parts 263 may be arranged in an area corresponding to an area occupied by one unit substrate S1. The plurality of suction members 263 are connected to a negative pressure source 282. The suction members 263 may be configured to suck the unit substrate S1 by the negative pressure applied to the negative pressure source 282.
The scrap pressing assembly 270 includes a plurality of air injection nozzles 275 and a gas supply 276.
The gas supply source 276 is connected to the plurality of gas injection nozzles 275, and configured to supply gas to the plurality of gas injection nozzles 275.
The plurality of air injection nozzles 275 are provided on the bottom surface (the surface facing the unit substrate S1 and the edge trim S2) of the base member 261. The plurality of air injection nozzles 275 are arranged in the region corresponding to the region occupied by the rim charge S2. The plurality of air injection nozzles 275 are arranged along the outline of the area occupied by the plurality of adsorption parts 263. That is, the plurality of gas injection nozzles 275 are arranged along the outline of the area occupied by the unit substrate S1.
The gas spray nozzles 275 may be disposed to be inclined with respect to a vertical axis orthogonal to the surface of the unit substrate S1. In particular, the gas spray nozzles 275 may be arranged obliquely with respect to the vertical axis such that the outlets of the gas spray nozzles 275 face the outer side of the edge portions of the unit substrates S1. This makes it possible to inject gas toward the edge trim S2 in the direction in which the edge trim S2 is spaced from the unit substrates S1. As a result, a resultant force of the pressing force in the second direction (downward) and the pressing force in the direction in which the edge S2 is spaced from the unit substrate S1 can act on the edge S2.
Therefore, when the plurality of suction members 263 are raised in a state where the plurality of suction members 263 suck the unit substrate S1, a force in the first direction (a suction force and a force raised by the plurality of suction members 263) acts on the unit substrate S1, and a pressing force in the second direction (downward) and a pressing force in a direction where the edge trim S2 is spaced apart from the unit substrate S1 act on the edge trim S2. Therefore, the edge trim S2 can be more reliably separated from the edge portion of the unit substrate S1.
Hereinafter, a substrate transfer head 360 according to a fourth embodiment of the present invention will be described with reference to fig. 15. The same components as those described in the first to third embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 15, a substrate transfer head 360 according to a fourth embodiment of the present invention may include a base member 361, a plurality of adsorption members 363, and an edge-trim pressurizing assembly 370.
The lower portion of the base member 361 may have a shape corresponding to a shape of an area including an area occupied by one unit substrate S1 and an area occupied by the margin S2 around one unit substrate S1.
The base member 361 is provided with a plurality of adsorption members 363. The plurality of adsorption members 363 may be arranged in an area corresponding to an area occupied by one unit substrate S1. The plurality of suction members 363 are connected to a negative pressure source 382. The plurality of suction members 363 may be configured to suck the unit substrate S1 by the negative pressure applied to the negative pressure source 382.
The scrap pressing assembly 370 includes a plurality of gas injection nozzles 375, a gas supply source 376, and a nozzle rotator 377.
The gas supply source 376 is connected to the plurality of gas injection nozzles 375 and configured to supply gas to the plurality of gas injection nozzles 375.
The plurality of air injection nozzles 375 are provided on the bottom surface (the surface facing the unit substrate S1 and the edge trim S2) of the base member 361. The plurality of air injection nozzles 375 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of gas injection nozzles 375 are arranged along the outline of the area occupied by the plurality of adsorption parts 363. That is, the plurality of gas injection nozzles 375 are arranged along the outline of the area occupied by the unit substrate S1.
The gas injection nozzles 375 may be disposed in such a manner that their inclination angles can be adjusted with respect to a vertical axis perpendicular to the surface of the unit substrate S1. By adjusting the inclination angle of the gas injection nozzle 375, the injection direction of the gas injected from the gas injection nozzle 375 can be adjusted. Therefore, the ejection direction of the gas ejected from the gas ejection nozzles 375 can be adjusted according to the shape of the margin S2 remaining on the unit substrate S1, the direction in which the margin S2 should be separated from the unit substrate S1, and the like, and therefore the margin S2 can be more easily and reliably separated from the unit substrate S1.
A nozzle rotator 377 may be connected to the gas injection nozzle 375 to enable automatic adjustment of the inclination angle of the gas injection nozzle 375 to the vertical axis. The nozzle rotator 377 is capable of rotating the gas injection nozzle 375 about a horizontal axis orthogonal to the vertical axis, and adjusting the inclination angle of the gas injection nozzle 375 with respect to the vertical axis. The nozzle rotator 377 may be adapted to a linear moving mechanism connected to the upper end of the gas injection nozzle 375 by a chain or the like, and the linear moving mechanism may be a linear motor or a ball screw mechanism operating under electromagnetic interaction using a pneumatic or hydraulic actuator.
On the other hand, the nozzle rotator 377 may be configured to repeatedly rotate the gas injection nozzle 375 reciprocally while injecting the gas from the gas injection nozzle 375. Accordingly, the vibration can be applied to the edge trim S2 while the jetting direction of the gas jetted from the gas jetting nozzle 375 is repeatedly changed, and thus the edge trim S2 can be more reliably separated from the unit substrate S1.
Hereinafter, a substrate transfer head 460 according to a fifth embodiment of the present invention will be described with reference to fig. 16. The same components as those described in the first to fourth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 16, a substrate transfer head 460 according to a fifth embodiment of the present invention may include a base member 461, a plurality of suction members 463, and a rim charge pressing assembly 470.
The lower portion of the base member 461 may have a shape corresponding to the shape of an area including the area occupied by the one unit substrate S1 and the area occupied by the margin S2 around the one unit substrate S1.
The base member 461 is provided with a plurality of suction members 463. The plurality of suction members 463 may be arranged in an area corresponding to an area occupied by one unit substrate S1. The plurality of suction members 463 are connected to a negative pressure source 482. The plurality of suction members 463 may be configured to suck the unit substrate S1 by the negative pressure acting on the negative pressure source 482.
The scrap pressurization assembly 470 includes a plurality of gas injection nozzles 475, a gas supply 476, and a gas temperature regulator 478.
The gas supply source 476 is connected to the plurality of gas injection nozzles 475 and configured to supply gas to the plurality of gas injection nozzles 475.
The plurality of gas injection nozzles 475 are provided on the bottom surface (the surface facing the unit substrate S1 and the edge trim S2) of the base member 461. The plurality of gas injection nozzles 475 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of gas injection nozzles 475 are arranged along the outline of the area occupied by the plurality of adsorption members 463. That is, the plurality of gas spray nozzles 475 are arranged along the outline of the area occupied by the unit substrate S1.
The gas temperature regulator 478 may be configured to regulate the temperature of the gas supplied from the gas supply source 476. The gas temperature regulator 478 may be configured to heat the gas using a temperature higher than the peripheral temperature of the substrate transfer head 460. Alternatively, the gas temperature regulator 478 may be configured to use a cooling gas having a temperature lower than the peripheral temperature of the substrate transfer head 460. Therefore, the peripheral temperature may be high or low compared to the unit substrate S1. Therefore, as the gas injected from the gas injection nozzle 475 collides with the edge trim S2, the temperature of the edge trim S2 may become higher or lower than the temperature of the unit substrate S1. Therefore, there is a temperature difference between the edge trim S2 and the unit substrate S1, and the edge trim S2 can be more easily and reliably separated from the edge portion of the unit substrate S1 by the difference in the degree of thermal expansion and thermal contraction based on this temperature difference.
Hereinafter, a substrate transfer head 560 according to a sixth embodiment of the present invention will be described with reference to fig. 17. The same components as those described in the first to fifth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 17, the substrate transfer head 560 according to the sixth embodiment of the present invention may include a base member 561, a plurality of suction members 563, an edge-trim pressurizing assembly 570, and an edge-trim sensing sensor 90.
The lower portion of the base member 561 may have a shape corresponding to a shape of an area including an area occupied by one unit substrate S1 and an area occupied by the margin S2 around one unit substrate S1.
The base member 561 is provided with a plurality of suction members 563. The plurality of suction members 563 may be arranged in an area corresponding to an area occupied by one unit substrate S1. The plurality of suction members 563 are connected to a negative pressure source 582. The plurality of suction members 563 may be configured to suck the unit substrate S1 by the negative pressure applied to the negative pressure source 582.
The scrap pressurization assembly 570 includes a plurality of gas injection nozzles 575 and a gas supply 576.
The gas supply source 576 is connected to the plurality of gas injection nozzles 575 and configured to supply gas to the plurality of gas injection nozzles 575.
The plurality of air injection nozzles 575 are provided on the bottom surface (the surface facing the unit substrate S1 and the edge trim S2) of the base member 561. The plurality of air injection nozzles 575 are arranged in an area corresponding to the area occupied by the rim charge S2. The plurality of gas injection nozzles 575 are arranged along the outline of the area occupied by the plurality of adsorption members 563. That is, the plurality of gas injection nozzles 575 are arranged along the outline of the area occupied by the unit substrate S1.
The edge sensor 90 may be configured to detect whether the edge of the unit substrate S1 has the edge S2. The rim charge sensing sensor 90 may be disposed in plurality along the outline of the area occupied by the plurality of adsorbing members 563. That is, the plurality of edge sensor sensors 90 may be arranged along the outline of the area occupied by the unit substrate S1.
For example, the edge sensor 90 may be configured by an optical sensor (distance sensor) including a light emitting portion and a light receiving portion, and configured to detect whether or not the edge portion of the unit substrate S1 has the edge S2 by detecting whether or not the light emitted from the light emitting portion reaches the light receiving portion after being reflected by the edge S2.
When the plurality of suction members 563 are raised by a predetermined height in a state of sucking the unit substrate S1, the edge sensor 90 can detect whether the edge S2 exists at the edge portion of the unit substrate S1.
The gas supply 576 and the scrap sensing sensor 90 may be controlled by a control unit, not shown. When the scrap S2 is sensed by the scrap sensing sensor 90, the control unit controls the gas supply source 576 such that the gas is injected from the gas injection nozzle 575 or the pressure of the gas injected from the gas injection nozzle 575 is increased. Therefore, the edge trim S2 can be more reliably separated from the edge portion of the unit substrate S1.
Hereinafter, a substrate transfer head 760 according to a seventh embodiment of the present invention will be described with reference to fig. 18 to 21. The same components as those described in the first to sixth embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in fig. 18 and 19, the substrate transfer head 760 according to the seventh embodiment of the present invention may include a base member 761, a lift member 762, and a rim charge pressing assembly 770.
The base part 761 and the lift part 762 may be configured similarly to the base part 61 and the lift part 62 of the first embodiment of the present invention, respectively.
The base member 761 is provided with a plurality of adsorbing members 763. The plurality of adsorption members 763 may be arranged in an area corresponding to an area occupied by one unit substrate S1. The plurality of suction members 763 are connected to a negative pressure source 782. The plurality of suction members 763 may be configured to suck the unit substrate S1 by the negative pressure applied to the negative pressure source 782.
The rim charge pressing assembly 570 may include: a first scrap pressing section having a pusher 771, a plurality of pushrods 772, and a pusher driver 773; and a second scrap pressing section having a plurality of gas injection nozzles 775 and a gas supply source 776.
The push plate 771, the plurality of push rods 772, and the push plate driver 773 may be configured similarly to the push plate 71, the plurality of push rods 72, and the push plate driver 73, respectively, of the first embodiment of the present invention. The plurality of gas injection nozzles 775 and the gas supply source 776 may be configured similarly to the plurality of gas injection nozzles 175 and the gas supply source 176 according to the second embodiment of the present invention, respectively.
The substrate transfer head 760 according to the seventh embodiment of the present invention may further include at least one of the nozzle rotator 377 according to the fourth embodiment of the present invention, the gas temperature regulator 478 according to the fifth embodiment of the present invention, and the edge sensor 90 according to the sixth embodiment of the present invention.
For example, when the substrate transfer head 760 according to the seventh embodiment of the present invention is provided with the edge trim sensing sensor 90, the control unit controls the gas supply source 776 such that the gas is ejected from the gas ejection nozzle 775, or the pressure of the gas ejected from the gas ejection nozzle 775 is increased, or the push plate 771 is driven to pressurize the edge trim S2 when the edge trim S2 is sensed by the edge trim sensing sensor 90.
On the other hand, as shown in fig. 18 and 19, for example, the plurality of jet nozzles 775 may be arranged outside the plurality of push rods 772. As another example, as shown in fig. 20 and 21, the plurality of jet nozzles 775 may be arranged inside the plurality of push rods 772. For example, although not shown, a portion of the plurality of jet nozzles 775 may be disposed outside a portion of the plurality of push rods 772 and another portion of the plurality of jet nozzles 775 may be disposed inside another portion of the plurality of push rods 772.
According to the substrate transfer head 760 of the seventh embodiment of the present invention, any one of the first and second margin pressing parts may be configured to press the margin S2 before the unit substrates S1 are adsorbed by the adsorbing member 763 or while the unit substrates S1 are adsorbed by the adsorbing member 763. That is, the following configurations are possible: when the suction member 763 sucks the unit substrate S1 mounted on the second table 20, or immediately before the suction member 763 sucks the unit substrate S1 mounted on the second table 20, either the first rim charge pressing unit or the second rim charge pressing unit presses the rim charge S2 mounted on the second table 20.
The other of the first and second edge presser units may be configured to press the edge S2 remaining at the edge of the unit substrate S1 adsorbed on the adsorbing member 763. That is, the following configurations are possible: when the unit substrate S1 is conveyed (vertically and horizontally moved) while being adsorbed by the adsorbing member 763, the other of the first and second edge presser presses the edge S2 remaining at the edge of the unit substrate S1. At this time, when the edge sensor 90 senses that the edge of the unit substrate S1 has the edge of the trim S2, the other of the first trim pressure portion and the second trim pressure portion can press the trim S2 remaining on the edge of the unit substrate S1.
In this way, since the edge trim S2 can be pressed by using the push rod 772 and the air jet nozzle 775 together, the edge trim S2 can be more reliably separated from the edge portion of the unit substrate S1.
The substrate transfer head 60, 160, 260, 360, 460, 560, 760 according to an embodiment of the present invention includes the edge bead pressing units 70, 170, 270, 370, 470, 570, 770 that apply a pressing force to the edge bead S2 around the unit substrate S1 in a second direction opposite to the first direction when the unit substrate S1 is moved by being sucked in the first direction, thereby enabling the edge bead S2 to be more easily and reliably separated from the edge portion of the unit substrate S1 and preventing the edge bead S2 from remaining on the edge portion of the unit substrate S1. Therefore, it is possible to prevent the unit substrate S1 from being transferred to a subsequent process in a state where the edge of the unit substrate S1 is left with the edge trim S2. In addition, the edge trim S2 remaining at the edge of the unit substrate S1 can be prevented from falling to an undesired place during the transfer of the unit substrate S1 to the subsequent process.
The preferred embodiments of the present invention have been described as examples, but the scope of the present invention is not limited to the specific embodiments and can be appropriately modified within the scope described in the claims.

Claims (6)

1. A substrate transfer head, comprising:
an adsorption member configured to adsorb the unit substrates;
a first scrap pressing section comprising: a plurality of push rods arranged to correspond to an area occupied by the rim charge positioned around the unit substrate; a push plate provided with the plurality of push rods; and a push plate driver for moving the push plate so that the push rods press the rim charge; and
second rim charge adds splenium includes: a gas injection nozzle configured to inject gas toward an edge portion of the unit substrate to pressurize the edge trim; and a gas supply source configured to supply a gas to the gas injection nozzle,
either one of the first and second edge material pressurizing units is configured to pressurize the edge material before the unit substrates are adsorbed by the adsorbing member or while the unit substrates are adsorbed by the adsorbing member,
the other of the first and second edge pressurization units is configured to pressurize the edge of the unit substrate adsorbed by the adsorbing member.
2. The substrate transfer head of claim 1,
the substrate transfer head further includes an edge sensing sensor disposed at one side of the adsorption part and detecting whether the edge exists at an edge portion of the unit substrate adsorbed to the adsorption part.
3. The substrate transfer head of claim 1,
the gas injection nozzle is disposed to be inclined with respect to a vertical axis orthogonal to the surface of the unit substrate so as to inject a gas toward the edge trim in a direction in which the edge trim is spaced from the unit substrate.
4. The substrate transfer head of claim 1,
the substrate transfer head further includes a nozzle rotator that rotates the gas injection nozzle about a horizontal axis orthogonal to a vertical axis orthogonal to the unit substrate to adjust an inclination angle of the gas injection nozzle to the vertical axis.
5. The substrate transfer head of claim 1,
the substrate transfer head further includes a gas temperature regulator that regulates a temperature of the gas supplied from the gas supply source to the gas injection nozzle.
6. The substrate transfer head of claim 1,
the gas supply source supplies gas to the gas injection nozzle while periodically changing the pressure of the gas.
CN201911182537.3A 2019-06-17 2019-11-27 Substrate transfer head Active CN112103228B (en)

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CN101734849A (en) * 2008-11-05 2010-06-16 细美事有限公司 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same
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