KR20200144168A - Substrate transporting head - Google Patents

Abstract

An objective of the present invention is to provide a substrate transport head capable of preventing an end material from remaining on an edge portion of a unit substrate. According to an embodiment of the present invention, the substrate transport head comprises: a suction member configured to suck a unit substrate divided from a base substrate; a first end material pressing unit including a plurality of pushpins arranged to correspond to an area occupied by an end material positioned around the unit substrate, a push plate on which the plurality of pushpins are installed, and a push plate actuator to move the push plate to allow the plurality of pushpins to press the end material; and a second end material pressing unit including a gas spray nozzle configured to spray gas toward the end material to press the end material, and a gas supply source configured to supply gas to the gas spray nozzle. One of the first end material pressing unit and the second end material pressing unit can be configured to press the end material when the suction member sucks the unit substrate or before the suction member sucks the unit substrate. The other one of the first end material pressing unit and the second end material pressing unit can be configured to press the end material remaining on an edge portion of the unit substrate sucked on the suction member.

Description

Substrate transfer head {SUBSTRATE TRANSPORTING HEAD}

The present invention relates to a substrate transfer head configured to transfer a unit substrate divided from a mother substrate.

In general, various types of panels and semiconductor substrates used in displays are manufactured using a unit substrate cut to a predetermined size from a mother substrate made of a brittle material.

In order to cut the mother substrate into a unit substrate, a scribing wheel made of a material such as diamond is pressed against the mother substrate, and then the scribing wheel is moved along the virtual cutting line to be cut to the mother substrate. A scribing process of forming a scribing line is performed. In addition, a braking process of dividing the mother substrate into unit substrates by pressing the mother substrate along the scribing line is performed. Then, a substrate transfer process is performed in which the unit substrate divided from the mother substrate is picked up by the braking process and transferred to a subsequent process.

When the mother substrate is divided into a unit substrate, at least one edge portion of the unit substrate has an end material (dummy, cullet) that is not actually used in a product and is discarded. Such a single material must be separated from the unit substrate, but may remain attached to the edge portion of the unit substrate due to various reasons.

An object of the present invention is to provide a substrate transfer head capable of reliably separating an end material from an edge portion of a unit substrate and preventing the end material from remaining at an edge portion of a unit substrate.

A substrate transfer head according to an embodiment of the present invention for achieving the above object includes: an adsorption member configured to adsorb a unit substrate divided from a mother substrate; A plurality of push pins disposed to correspond to an area occupied by an end material positioned around the unit substrate; A push plate on which a plurality of push pins are installed; And a first end material pressing part including a push plate driver for moving the push plate so that the plurality of push pins press the end material. And a gas injection nozzle configured to inject gas toward the end material to pressurize the end material. And a second end material pressurization unit including a gas supply source configured to supply gas to the gas injection nozzle, and any one of the first end material pressurization unit and the second end material pressurization unit is either before the adsorption member adsorbs the unit substrate or is adsorbed. When the member adsorbs the unit substrate, it may be configured to pressurize the end material, and the other of the first end material pressing unit and the second end material pressing unit is configured to press the end material remaining at the edge of the unit substrate adsorbed by the adsorption member. Can be.

The substrate transfer head according to an embodiment of the present invention may further include an end material detection sensor disposed on one side of the adsorption member to detect whether an end material exists at an edge portion of the unit substrate adsorbed by the adsorption member.

The gas injection nozzle may be installed to be inclined with respect to a vertical axis orthogonal to the surface of the unit substrate so as to spray gas toward the end material in a direction in which the end material is spaced apart from the unit substrate.

The substrate transfer head according to an embodiment of the present invention may further include a nozzle rotator for adjusting the inclination angle of the gas injection nozzle with respect to the vertical axis by rotating the gas injection nozzle about a horizontal axis perpendicular to a vertical axis perpendicular to the unit substrate. .

The substrate transfer head according to an embodiment of the present invention may further include a gas temperature controller for controlling a temperature of a gas supplied from a gas supply source to a gas injection nozzle.

The gas supply source may supply gas to the gas injection nozzle while periodically changing the pressure of the gas.

A substrate transfer head according to an embodiment of the present invention includes an end material pressing module that applies a pressing force to an end material around the unit substrate in a second direction opposite to the first direction when adsorbing and moving the unit substrate in the first direction, The cut material can be more easily and reliably separated from the edge part of the unit substrate to prevent the cut material from remaining at the edge part of the unit substrate. Accordingly, it is possible to prevent a problem in which the unit substrate is conveyed to a subsequent process while the end material remains at the edge portion of the unit substrate. In addition, during a process in which the unit substrate is transported to a subsequent process, there may be a problem that the cut material remaining at the edge of the unit substrate falls from an unintended place.

1 is a plan view schematically showing a substrate cutting apparatus in which a substrate transfer head according to a first embodiment of the present invention is installed.
2 is a side view schematically illustrating a substrate cutting apparatus in which a substrate transfer head according to a first embodiment of the present invention is installed.
3 is a schematic view of a substrate transfer head according to a first embodiment of the present invention.
4 is a view schematically showing a bottom portion of a base member of a substrate transfer head according to a first embodiment of the present invention.
5 is a view schematically showing the bottom of the push plate of the substrate transfer head according to the first embodiment of the present invention.
6 is a schematic view of a push plate and a push pin of a substrate transfer head according to a first embodiment of the present invention.
7 to 10 are views for explaining the operation of the substrate transfer head according to the first embodiment of the present invention.
11 is a schematic diagram of a substrate transfer head according to a second embodiment of the present invention.
12 and 13 are views for explaining the operation of the substrate transfer head according to the second embodiment of the present invention.
14 is a schematic diagram of a substrate transfer head according to a third embodiment of the present invention.
15 is a schematic diagram of a substrate transfer head according to a fourth embodiment of the present invention.
16 is a diagram schematically showing a substrate transfer head according to a fifth embodiment of the present invention.
17 is a schematic diagram of a substrate transfer head according to a sixth embodiment of the present invention.
18 is a diagram schematically showing a substrate transfer head according to a seventh embodiment of the present invention.
19 is a view schematically showing a bottom portion of a base member of a substrate transfer head according to a seventh embodiment of the present invention.
20 is a diagram schematically showing another example of a substrate transfer head according to a seventh embodiment of the present invention.
21 is a view schematically showing a bottom portion of a base member according to another example of a substrate transfer head according to a seventh embodiment of the present invention.

Hereinafter, a substrate transfer head according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First, a substrate cutting apparatus including a substrate transfer head according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 2.

1 and 2, the direction in which the mother substrate S in which the substrate cutting process is to be performed is transferred is defined as the Y-axis direction, and the direction crosses the direction in which the mother substrate S is transferred (Y-axis direction). Is defined as the X-axis direction. In addition, a direction perpendicular to the X-Y plane on which the mother substrate S is placed is defined as the Z-axis direction. In addition, the term scribing line means a groove and/or crack formed to extend in a predetermined direction from the surface of the mother substrate S. In addition, the term “to be cut line” refers to a virtual line on which a scribing line is to be formed.

1 and 2, the substrate cutting apparatus includes a scribing unit 30, a first stage 10, a second stage 20, a substrate transfer unit 40, and a substrate transfer. It may include a unit 50.

The first stage 10 is disposed on the upstream side of the scribing unit 30 in the transport direction of the mother substrate S. The first stage 10 serves to support the mother substrate S while the mother substrate S moves toward the scribing unit 30. In addition, the first stage 10 may serve to support the mother substrate S in the process of forming a scribing line on the mother substrate S. For example, the first stage 10 may be configured as a belt 11. The belt 11 may be supported by a plurality of pulleys 12. At least one of the plurality of pulleys 12 may be a driving pulley that provides a driving force to rotate the belt 11.

The second stage 20 is disposed on the downstream side of the scribing unit 30 in the transport direction of the mother substrate S. The second stage 20 serves to accommodate and support the mother substrate S on which the scribing line is formed by the scribing unit 30. In addition, the second stage 20 may serve to support the mother substrate S in the process of forming a scribing line on the mother substrate S. For example, the second stage 20 may be configured as a belt 21. The belt 21 may be supported by a plurality of pulleys 22. At least one of the plurality of pulleys 22 may be a driving pulley that provides a driving force to rotate the belt 21.

The scribing unit 30 is configured to form a scribing line in the X-axis direction and/or the Y-axis direction on the mother substrate S. The scribing unit 30 includes a frame 31 extending in the X-axis direction and a scribing head 32 installed on the frame 31 so as to be movable in the X-axis direction. The scribing head 32 has a scribing wheel 34. The scribing wheel 34 may be mounted on the scribing head 32 through the wheel holder 33.

The scribing head 32 may be configured to be movable in the X-axis direction with respect to the frame 31. To this end, the frame 31 may be provided with an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or an X-axis moving mechanism such as a ball screw mechanism. The X-axis movement mechanism may provide a driving force to move the scribing head 32 in the X-axis direction.

In a state where the scribing wheel 34 presses the surface of the mother substrate S, the scribing head 32 is moved in the X-axis direction relative to the mother substrate S, so that the mother substrate ( A scribing line may be formed on the surface of S) in the X-axis direction. In addition, the mother substrate S is moved in the Y-axis direction by the substrate transfer unit 40 while the scribing wheel 34 presses the surface of the mother substrate S. A scribing line may be formed on the surface in the Y-axis direction.

In this way, when a scribing line is formed in the X-axis direction and/or Y-axis direction on the surface of the mother substrate S by the scribing wheel 34, the crack formed in the scribing line is formed on the mother substrate S As it proceeds to the inside of, the mother substrate S is divided into the unit substrate S1 along the scribing line, or even by a small force, the mother substrate S is the unit substrate S1 along the scribing line. It can be in a state that can be divided into.

As another example, although not shown, a braking unit that applies a predetermined pressing force to the mother substrate S along the scribing line so that the mother substrate S is divided along the scribing line is a scribing unit 30 And the present invention is applicable to a configuration provided between the second stage 20.

On the other hand, when the mother substrate S is divided into a plurality of unit substrates S1, at least one edge portion of the unit substrate S1 has an end material S2 that is not actually used in a product and is discarded.

The scribing wheel 34 may be mounted on the wheel holder 33 so as to be rotatable about the Z axis. Accordingly, the cutting edge of the scribing wheel 34 may be parallel to the X-axis direction or parallel to the Y-axis direction.

The scribing head 32 may be configured to be movable in the Z-axis direction with respect to the frame 31. To this end, the frame 31 may be provided with an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a Z-axis moving mechanism such as a ball screw mechanism. The Z-axis movement mechanism may provide a driving force to move the scribing head 32 in the Z-axis direction.

As the scribing head 32 moves in the Z-axis direction with respect to the frame 31, the scribing wheel 34 may be pressed against the mother substrate S or separated from the mother substrate S. In addition, by controlling the degree of movement of the scribing head 32 in the Z-axis direction, the pressing force applied by the scribing wheel 34 to the mother substrate S may be adjusted. By moving the scribing head 32 in the Z-axis direction, the cutting depth (penetration depth) of the scribing wheel 34 to the mother substrate S can be adjusted.

The substrate transfer unit 40 is configured to transfer the mother substrate S to the scribing unit 30 by gripping the trailing end of the mother substrate S, which is the rear end in the transfer direction of the mother substrate S. . The substrate transfer unit 40 is connected to the clamp module 41 configured to hold the trailing end of the mother substrate S supported on the first stage 10 and is connected to the clamp module 41 in the X-axis direction. It may include an extended support 42, a guide rail 43 connected to the support 42 and extending in the Y-axis direction. Between the support 42 and the guide rail 43, an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided. Therefore, as the support 42 is moved in the Y-axis direction by the linear movement mechanism while the clamp module 41 grips the trailing end of the mother substrate S, the mother substrate S is transferred in the Y-axis direction. Can be. At this time, the first stage 10 may stably support the mother substrate S while moving in synchronization with the movement of the clamp module 41. The clamp module 41 may press and hold the upper and lower surfaces of the mother substrate S at the trailing end of the mother substrate S. As another example, the clamp module 41 may be configured to have a vacuum hole connected to a negative pressure source to adsorb the upper or lower surface of the mother substrate S.

The substrate transfer unit 50 is configured to transfer the unit substrate S1 supported on the second stage 20 to a subsequent process.

The substrate transfer unit 50 includes a substrate transfer head 60, a support frame 52, a head moving module 53, and a head lifting module 54.

The support frame 52 is configured to support the substrate transfer head 60 so that the substrate transfer head 60 is movable in the Y-axis direction.

The head movement module 53 is configured to move the substrate transfer head 60 along the support frame 52 in the Y-axis direction. The head lifting module 54 is configured to move the substrate transfer head 60 in the Z-axis direction. As the head movement module 53 and the head lifting module 54, an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be applied.

On the other hand, although not shown, the substrate transfer unit 50 is an actuator operated by pneumatic or hydraulic pressure to move the substrate transfer head 60 in the X-axis direction, a linear motor operated by electromagnetic interaction, or a ball It may further include a linear movement mechanism such as a screw mechanism.

According to this configuration, the substrate transfer head 60 may move in the X-axis direction and/or the Y-axis direction to be positioned above the unit substrate S1 to be carried out, and the substrate transfer head 60 is in the Z-axis direction. Move to and can adsorb the unit substrate S1.

As shown in Figs. 3 to 6, the substrate transfer head 60 according to the first embodiment of the present invention is configured to hold and transfer the unit substrate S1.

The substrate transfer head 60 includes a base member 61 and a lift member 62.

The base member 61 and the lift member 62 are connected to each other. A predetermined space is provided between the base member 61 and the lift member 62. The lift member 62 is connected to the head lifting module 54. Accordingly, the base member 61 and the lift member 62 can be moved together in the Z-axis direction by the head lifting module 54.

The lower portion of the base member 61 may have a shape corresponding to the shape of a region including an area occupied by one unit substrate S1 and an area occupied by the end material S2 around one unit substrate S1. have.

The base member 61 is provided with a plurality of adsorption members 63. The plurality of adsorption members 63 may be disposed in an area corresponding to an area occupied by one unit substrate S1. The plurality of adsorption members 63 are connected to the negative pressure source 82. The plurality of adsorption members 63 may be configured to adsorb the unit substrate S1 by negative pressure acting in the negative pressure source 82.

The substrate transfer head 60 may further include an end material pressing module 70 configured to press the end material S2 mounted on the second stage 20 (belt 21).

The end material pressing module 70 includes a push plate 71, a plurality of push pins 72, and a push plate driver 73.

The push plate actuator 73 may be configured as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. The push plate driver 73 is connected to the push plate 71 and is configured to move the push plate 71 in the Z-axis direction.

The push plate 71 may have a shape corresponding to a shape of a region including one unit substrate S1 and an end material S2 around it.

The plurality of push pins 72 are provided on the lower surface of the push plate 71 (the surface facing the unit substrate S1 and the end material S2). The plurality of push pins 72 extend from the lower surface of the push plate 71 in the Z-axis direction. The plurality of push pins 72 are disposed in an area corresponding to the area occupied by the end material S2. The plurality of push pins 72 are disposed along the outer periphery of the region occupied by the plurality of adsorption members 63. That is, the plurality of push pins 72 are disposed along the periphery of the area occupied by the unit substrate S1.

The base member 61 is formed with a plurality of through holes 612 respectively corresponding to the plurality of push pins 72. The plurality of push pins 72 pass through the plurality of through holes 612, and thus, the lower ends of each of the plurality of push pins 72 may be exposed to the outside toward the mother substrate S.

Hereinafter, an operation of the substrate transfer head 60 according to the first embodiment of the present invention will be described with reference to FIGS. 7 to 10.

As shown in FIG. 7, as the substrate transfer head 60 descends toward the unit substrate S1 by the head lifting module 54, a plurality of adsorption members 63 are placed on the surface of the unit substrate S1. Contact. At this time, the ends of the plurality of push pins 72 may be maintained in a state spaced upward from the plane in which the ends of the plurality of adsorption members 63 are positioned. As another example, the ends of the plurality of push pins 72 may be located on the same plane as the plane in which the ends of the plurality of suction members 63 are located. In this case, as the substrate transfer head 60 descends toward the unit substrate S1, the ends of the plurality of adsorption members 63 contact the surface of the unit substrate S1, and the plurality of push pins 72 The end of the can be in contact with the surface of the end material (S2).

And, as shown in Figure 8, as the push plate 71 is lowered by the push plate driver 73, a plurality of push pins 72 installed on the push plate 71 contact the end material (S2) The cut material S2 is pressed downward.

Further, the negative pressure acts on the plurality of adsorption members 63 by the negative pressure source 82, and accordingly, an upward adsorption force acts on the unit substrate S1.

Accordingly, an adsorption force in a first direction (upward) acts on the unit substrate S1, and a pressing force in a second direction (downward) opposite to the first direction (upward) acts on the end material S2.

And, as shown in FIG. 9, the board|substrate conveyance head 60 is raised by the head lifting module 54. At this time, the push plate 71 descends, and accordingly, a state in which the plurality of push pins 72 continuously press the end material S2 may be maintained. That is, when the plurality of adsorption members 63 rise in the first direction, a state in which the plurality of push pins 72 presses the end material S2 in the second direction may be maintained.

Accordingly, a force in the first direction (adsorption force and force due to the rise of the plurality of adsorption members 63) acts on the unit substrate S1, and a pressing force in the second direction acts on the end material S2. In this way, as forces in opposite directions act on the unit substrate S1 and the end material S2, the end material S2 can be reliably separated from the edge portion of the unit substrate S1.

Then, as shown in FIG. 10, in a state where the end material S2 is separated from the edge portion of the unit substrate S1, the substrate transfer head 60 is raised. In addition, the substrate transfer head 60 may be transferred to a subsequent process while moving horizontally. At this time, the push plate 71 may rise so that the ends of the plurality of push pins 72 are spaced upward from the plane in which the ends of the plurality of adsorption members 63 are positioned, and accordingly, the unit substrate S1 During transport of, a plurality of push pins 72 can be prevented from interfering with other equipment and parts around them.

Substrate transfer head 60 according to the first embodiment of the present invention, when adsorbing and moving the unit substrate (S1) in the first direction, the end material (S2) around the unit substrate (S1) opposite to the first direction By providing the end material pressing module 70 that applies a pressing force in the second direction, the end material S2 is more easily and reliably separated from the edge portion of the unit substrate S1, and the end material S2 ) Can be prevented from remaining. Accordingly, it is possible to prevent a problem in which the unit substrate S1 is conveyed to a subsequent process while the end material S2 remains at the edge portion of the unit substrate S1. In addition, during a process in which the unit substrate S1 is transported to a subsequent process, the end material S2 remaining at the edge of the unit substrate S1 may fall from an unintended location.

Hereinafter, a substrate transfer head 160 according to a second embodiment of the present invention will be described with reference to FIGS. 11 to 13. The same reference numerals are assigned to the same components as those described in the first embodiment, and detailed descriptions thereof will be omitted.

As shown in FIG. 11, the substrate transfer head 160 according to the second embodiment of the present invention includes a base member 161, a plurality of adsorption members 163, and a single material pressing module 170. I can.

The lower portion of the base member 161 may have a shape corresponding to the shape of an area including an area occupied by one unit substrate S1 and an area occupied by the end material S2 around one unit substrate S1. have.

A plurality of adsorption members 163 are installed on the base member 161. The plurality of adsorption members 163 may be disposed in an area corresponding to an area occupied by one unit substrate S1. The plurality of adsorption members 163 are connected to the negative pressure source 182. The plurality of adsorption members 163 may be configured to adsorb the unit substrate S1 by negative pressure acting on the negative pressure source 182.

The end material pressurization module 170 includes a plurality of gas injection nozzles 175 and a gas supply source 176.

The gas supply source 176 is connected to the plurality of gas injection nozzles 175 and is configured to supply gas to the plurality of gas injection nozzles 175.

Meanwhile, the gas supply source 176 may supply gas to the gas injection nozzle 175 at a constant pressure. As another example, the gas supply source 176 may supply gas to the gas injection nozzle 175 while periodically changing the pressure of the gas. In this case, the gas injected from the gas injection nozzle 175 can vibrate the end material S2 while colliding with the end material S2 in the form of a predetermined vibration wave, so that the end material S2 is compared from the unit substrate S1. Can be clearly separated.

The plurality of gas injection nozzles 175 are installed on the lower surfaces of the base member 161 (surfaces facing the unit substrate S1 and the end material S2). The plurality of gas injection nozzles 175 are disposed in an area corresponding to the area occupied by the end material S2. The plurality of gas injection nozzles 175 are disposed along the outer periphery of the region occupied by the plurality of adsorption members 163. That is, the plurality of gas injection nozzles 175 are disposed along the periphery of the area occupied by the unit substrate S1.

Hereinafter, an operation of the substrate transfer head 160 according to the second embodiment of the present invention will be described with reference to FIGS. 12 and 13.

As shown in FIG. 12, as the substrate transfer head 160 descends toward the unit substrate S1, the plurality of adsorption members 163 contact the surface of the unit substrate S1.

Further, the negative pressure acts on the plurality of adsorption members 163 by the negative pressure source 182, and accordingly, an upward adsorption force acts on the unit substrate S1. At this time, as gas is supplied from the gas supply source 176 to the plurality of gas injection nozzles 175, the gas is injected from the plurality of gas injection nozzles 175 toward the end material S2.

Accordingly, an adsorption force in a first direction (upward) acts on the unit substrate S1, and a pressing force in a second direction (downward) opposite to the first direction (upward) acts on the end material S2.

And, as shown in FIG. 13, as the substrate transfer head 160 rises, the plurality of adsorption members 163 rise. At this time, gas is continuously injected from the plurality of gas injection nozzles 175 toward the end material S2.

Accordingly, a force in the first direction (adsorption force and force due to the rise of the plurality of adsorption members 163) acts on the unit substrate S1, and a pressing force in the second direction acts on the end material S2. In this way, as forces in opposite directions act on the unit substrate S1 and the end material S2, the end material S2 can be reliably separated from the edge portion of the unit substrate S1.

Substrate transfer head 160 according to the second embodiment of the present invention, when adsorbing and moving the unit substrate (S1) in the first direction, the end material (S2) around the unit substrate (S1) opposite to the first direction By providing the end material pressing module 170 that applies a pressing force in the second direction, the end material S2 is more easily and reliably separated from the edge portion of the unit substrate S1, and the end material S2 ) Can be prevented from remaining. Accordingly, it is possible to prevent a problem in which the unit substrate S1 is conveyed to a subsequent process while the end material S2 remains at the edge portion of the unit substrate S1. In addition, during a process in which the unit substrate S1 is transported to a subsequent process, the end material S2 remaining at the edge of the unit substrate S1 may fall from an unintended location.

Hereinafter, a substrate transfer head 260 according to a third embodiment of the present invention will be described with reference to FIG. 14. The same reference numerals are assigned to the same components as those described in the first and second embodiments, and detailed descriptions thereof will be omitted.

As shown in Fig. 14, the substrate transfer head 260 according to the third embodiment of the present invention includes a base member 261, a plurality of adsorption members 263, and a single material pressing module 270. I can.

The lower portion of the base member 261 may have a shape corresponding to a shape of an area including an area occupied by one unit substrate S1 and an area occupied by the end material S2 around one unit substrate S1. have.

The base member 261 is provided with a plurality of adsorption members 263. The plurality of adsorption members 263 may be disposed in an area corresponding to an area occupied by one unit substrate S1. The plurality of adsorption members 263 are connected to the negative pressure source 282. The plurality of adsorption members 263 may be configured to adsorb the unit substrate S1 by negative pressure acting on the negative pressure source 282.

The end material pressure module 270 includes a plurality of gas injection nozzles 275 and a gas supply source 276.

The gas supply source 276 is connected to the plurality of gas injection nozzles 275 and is configured to supply gas to the plurality of gas injection nozzles 275.

The plurality of gas injection nozzles 275 are provided on the lower surface of the base member 261 (the surface facing the unit substrate S1 and the end material S2). The plurality of gas injection nozzles 275 are disposed in an area corresponding to the area occupied by the end material S2. The plurality of gas injection nozzles 275 are disposed along the periphery of the region occupied by the plurality of adsorption members 63. That is, the plurality of gas injection nozzles 275 are disposed along the periphery of the area occupied by the unit substrate S1.

The gas injection nozzle 275 may be installed inclined with respect to a vertical axis orthogonal to the surface of the unit substrate S1. In particular, the gas injection nozzle 275 may be installed to be inclined with respect to the vertical axis so that the outlet of the gas injection nozzle 275 faces the outside of the edge portion of the unit substrate S1. Accordingly, gas may be injected toward the end material S2 in a direction in which the end material S2 is spaced apart from the unit substrate S1. Accordingly, the resultant force of the pressing force in the second direction (downward) and the pressing force in the direction in which the end material S2 is separated from the unit substrate S1 may be applied to the end material S2.

Therefore, when the plurality of adsorption members 263 rise while the plurality of adsorption members 263 adsorb the unit substrate S1, the unit substrate S1 has a force in the first direction (adsorption force and a plurality of adsorption members). A force according to the rise of 263) acts, and a pressing force in a second direction (downward) and a pressing force in a direction in which the end material S2 is separated from the unit substrate S1 acts on the end material S2. Accordingly, the end material S2 can be more reliably separated from the edge portion of the unit substrate S1.

Hereinafter, a substrate transfer head 360 according to a fourth embodiment of the present invention will be described with reference to FIG. 15. The same reference numerals are assigned to the same components as those described in the first to third embodiments, and detailed descriptions thereof will be omitted.

As shown in Fig. 15, the substrate transfer head 360 according to the fourth embodiment of the present invention includes a base member 361, a plurality of adsorption members 363, and a single material pressing module 370. I can.

The lower portion of the base member 361 may have a shape corresponding to the shape of a region including an area occupied by one unit substrate S1 and an area occupied by the end material S2 around one unit substrate S1. have.

The base member 361 is provided with a plurality of adsorption members 363. The plurality of adsorption members 363 may be disposed in an area corresponding to an area occupied by one unit substrate S1. The plurality of adsorption members 363 are connected to the negative pressure source 382. The plurality of adsorption members 363 may be configured to adsorb the unit substrate S1 by negative pressure acting on the negative pressure source 382.

The end material pressurization module 370 includes a plurality of gas injection nozzles 375, a gas supply source 376, and a nozzle rotator 377.

The gas supply source 376 is connected to the plurality of gas injection nozzles 375 and is configured to supply gas to the plurality of gas injection nozzles 375.

The plurality of gas injection nozzles 375 are provided on the lower surfaces of the base member 361 (surfaces facing the unit substrate S1 and the end material S2). The plurality of gas injection nozzles 375 are disposed in an area corresponding to the area occupied by the end material S2. The plurality of gas injection nozzles 375 are disposed along the periphery of an area occupied by the plurality of adsorption members 363. That is, the plurality of gas injection nozzles 375 are disposed along the periphery of the area occupied by the unit substrate S1.

The gas injection nozzle 375 may be installed so that its inclination angle can be adjusted with respect to a vertical axis perpendicular to the surface of the unit substrate S1. By adjusting the inclination angle of the gas injection nozzle 375, the injection direction of the gas injected from the gas injection nozzle 375 may be adjusted. Accordingly, the injection direction of the gas sprayed from the gas injection nozzle 375 according to the shape of the end material S2 remaining at the edge of the unit substrate S1, the direction in which the end material S2 should be separated from the unit substrate S1, etc. Can be adjusted, it is possible to more easily and reliably separate the end material (S2) from the unit substrate (S1).

A nozzle rotator 377 may be connected to the gas injection nozzle 375 to automatically adjust the inclination angle of the gas injection nozzle 375 with respect to the vertical axis. The nozzle rotator 377 may rotate the gas injection nozzle 375 about a horizontal axis orthogonal to the vertical axis to adjust the inclination angle of the gas injection nozzle 375 with respect to the vertical axis. As the nozzle rotator 377, a linear movement mechanism connected to the top of the gas injection nozzle 375 through a link, etc. may be applied, and such a linear movement mechanism is operated by an actuator using pneumatic or hydraulic pressure, and electromagnetic interaction. It may be a linear motor or a ball screw mechanism.

Meanwhile, the nozzle rotator 377 may be configured to repeatedly reciprocate the gas injection nozzle 375 while the gas is injected from the gas injection nozzle 375. Accordingly, while the injection direction of the gas injected from the gas injection nozzle 375 is repeatedly changed, vibration can be applied to the end material S2, and accordingly, the end material S2 is more reliably transferred from the unit substrate S1. Can be separated.

Hereinafter, a substrate transfer head 460 according to a fifth embodiment of the present invention will be described with reference to FIG. 16. The same reference numerals are assigned to the same components as those described in the first to fourth embodiments, and detailed descriptions thereof will be omitted.

As shown in Fig. 16, the substrate transfer head 460 according to the fifth embodiment of the present invention includes a base member 461, a plurality of adsorption members 463, and a single material pressing module 470. I can.

The lower portion of the base member 461 may have a shape corresponding to a shape of a region including an area occupied by one unit substrate S1 and an area occupied by the end material S2 around one unit substrate S1. have.

A plurality of adsorption members 463 are installed on the base member 461. The plurality of adsorption members 463 may be disposed in an area corresponding to an area occupied by one unit substrate S1. The plurality of adsorption members 463 are connected to the negative pressure source 482. The plurality of adsorption members 463 may be configured to adsorb the unit substrate S1 by negative pressure acting on the negative pressure source 482.

The end pressurization module 470 includes a plurality of gas injection nozzles 475, a gas supply source 476, and a gas temperature controller 478.

The gas supply source 476 is connected to the plurality of gas injection nozzles 475 and is configured to supply gas to the plurality of gas injection nozzles 475.

The plurality of gas injection nozzles 475 are provided on the lower surfaces of the base member 461 (surfaces facing the unit substrate S1 and the end material S2). The plurality of gas injection nozzles 475 are disposed in an area corresponding to the area occupied by the end material S2. The plurality of gas injection nozzles 475 are disposed along the outer periphery of the region occupied by the plurality of adsorption members 463. That is, the plurality of gas injection nozzles 475 are disposed along the periphery of the area occupied by the unit substrate S1.

The gas temperature controller 478 may be configured to adjust the temperature of the gas supplied from the gas supply source 476. The gas temperature controller 478 may be configured to heat the gas to a temperature higher than the temperature around the substrate transfer head 460. Alternatively, the gas temperature controller 478 may be configured to cool the gas to a temperature lower than the temperature around the substrate transfer head 460. Accordingly, the temperature of the gas injected from the gas injection nozzle 475 may be higher or lower than the temperature around the unit substrate S1. Accordingly, as the gas injected from the gas injection nozzle 475 collides with the end material S2, the temperature of the end material S2 may be higher or lower than the temperature of the unit substrate S1. Therefore, there is a temperature difference between the cut material (S2) and the unit substrate (S1), and due to the difference in the degree of thermal expansion/heat shrinkage due to this temperature difference, the cut material (S2) is more easily and surely from the unit substrate (S1). Can be separated.

Hereinafter, a substrate transfer head 560 according to a sixth embodiment of the present invention will be described with reference to FIG. 17. The same reference numerals are assigned to the same components as those described in the first to fifth embodiments, and detailed descriptions thereof will be omitted.

As shown in Fig. 17, the substrate transfer head 560 according to the sixth embodiment of the present invention includes a base member 561, a plurality of adsorption members 563, an end material pressing module 570, and an end material It may include a detection sensor 90.

The lower portion of the base member 561 may have a shape corresponding to the shape of a region including an area occupied by one unit substrate S1 and an area occupied by the end material S2 around one unit substrate S1. have.

A plurality of adsorption members 563 are provided on the base member 561. The plurality of adsorption members 563 may be disposed in an area corresponding to an area occupied by one unit substrate S1. The plurality of adsorption members 563 are connected to the negative pressure source 582. The plurality of adsorption members 563 may be configured to adsorb the unit substrate S1 by negative pressure acting on the negative pressure source 582.

The end material pressure module 570 includes a plurality of gas injection nozzles 575 and a gas supply source 576.

The gas supply source 576 is connected to the plurality of gas injection nozzles 575 and is configured to supply gas to the plurality of gas injection nozzles 575.

The plurality of gas injection nozzles 575 are provided on the lower surfaces of the base member 561 (surfaces facing the unit substrate S1 and the end material S2). The plurality of gas injection nozzles 575 are disposed in an area corresponding to the area occupied by the end material S2. The plurality of gas injection nozzles 575 are disposed along the periphery of an area occupied by the plurality of adsorption members 563. That is, the plurality of gas injection nozzles 575 are disposed along the periphery of the area occupied by the unit substrate S1.

The cut-off detection sensor 90 may be configured to detect whether the cut-off material S2 is present at the edge of the unit substrate S1. The end material detection sensor 90 may be disposed in plurality along the outer periphery of the area occupied by the plurality of adsorption members 563. That is, the plurality of cutout detection sensors 90 may be disposed along the outer periphery of the area occupied by the unit substrate S1.

For example, the cut-off detection sensor 90 may be composed of an optical sensor (distance sensor) including a light-emitting part and a light-receiving part, and whether the light emitted from the light-emitting part reaches the light-receiving part after being reflected by the cut-off material S2. By detecting whether or not, it may be configured to detect whether the end material S2 is present in the edge portion of the unit substrate S1.

When the plurality of adsorption members 563 rise to a predetermined height while adsorbing the unit substrate S1, whether the end material detection sensor 90 has an end material S2 at the edge of the unit substrate S1 Can be detected.

The gas supply source 576 and the burnout detection sensor 90 may be controlled by a control unit, not shown. The control unit controls the gas supply source 576 when the cutoff S2 is detected by the cutoff detection sensor 90 so that the gas is injected from the gas injection nozzle 575 or the gas injected from the gas injection nozzle 575 is You can increase the pressure. Accordingly, the end material S2 can be more reliably separated from the edge portion of the unit substrate S1.

Hereinafter, a substrate transfer head 760 according to a seventh embodiment of the present invention will be described with reference to FIGS. 18 to 21. The same reference numerals are assigned to the same components as those described in the first to sixth embodiments, and detailed descriptions thereof will be omitted.

18 and 19, the substrate transfer head 760 according to the seventh embodiment of the present invention includes a base member 761, a lift member 762, and an end material pressing module 770 can do.

The base member 761 and the lift member 762 may be configured identically to the base member 61 and the lift member 62 according to the first embodiment of the present invention.

The base member 761 is provided with a plurality of adsorption members 763. The plurality of adsorption members 763 may be disposed in an area corresponding to an area occupied by one unit substrate S1. The plurality of adsorption members 763 are connected to the negative pressure source 782. The plurality of adsorption members 763 may be configured to adsorb the unit substrate S1 by negative pressure acting in the negative pressure source 782.

The end material pressurization module 770 includes a first end material pressurization unit including a push plate 771, a plurality of push pins 772 and a push plate driver 773, a plurality of gas injection nozzles 775, and a gas supply source ( It may include a second end material pressing unit including 776).

The push plate 771, the plurality of push pins 772, and the push plate driver 773 are provided with a push plate 71, a plurality of push pins 72, and a push plate according to the first embodiment of the present invention. Each of the actuators 73 may be configured identically. The plurality of gas injection nozzles 775 and the gas supply source 776 may be configured identically to the plurality of gas injection nozzles 175 and the gas supply source 176 according to the second embodiment of the present invention.

It is not limited to this configuration, the substrate transfer head 760 according to the seventh embodiment of the present invention, the nozzle rotator 377 according to the fourth embodiment of the present invention, the gas temperature according to the fifth embodiment of the present invention The controller 478 may further include at least one of the disconnection detection sensor 90 according to the sixth embodiment of the present invention.

For example, when the substrate transfer head 760 according to the seventh embodiment of the present invention includes the cut-off detection sensor 90, the control unit is when the cut-off material S2 is detected by the cut-off detection sensor 90 The gas supply source 776 is controlled to allow gas to be injected from the gas injection nozzle 775, or the pressure of the gas injected from the gas injection nozzle 775 is increased, or a plurality of push pins are driven by driving the push plate 771. 772 can be made to pressurize the end material (S2).

Meanwhile, as an example, as shown in FIGS. 18 and 19, a plurality of gas injection nozzles 775 may be disposed outside the plurality of push pins 772. As another example, as shown in FIGS. 20 and 21, a plurality of gas injection nozzles 775 may be disposed inside the plurality of push pins 772. As another example, although not shown, some of the plurality of gas injection nozzles 775 may be disposed outside some of the plurality of push pins 772, and another part of the plurality of gas injection nozzles 775 It may be disposed inside another part of the plurality of push pins 772.

According to the substrate transfer head 760 according to the seventh embodiment of the present invention, any one of the first end material pressing unit and the second end material pressing unit is either before the adsorption member 763 adsorbs the unit substrate S1 or is adsorbed. When the member 763 adsorbs the unit substrate S1, it may be configured to press the end material S2. That is, when the adsorption member 763 adsorbs the unit substrate S1 mounted on the second stage 20, or the unit substrate S1 mounted on the second stage 20 is adsorbed by the adsorption member 763 Immediately before) is adsorbed, any one of the first end material pressing unit and the second end material pressing unit may be configured to press the end material S2 mounted on the second stage 20.

In addition, the other one of the first end material pressing unit and the second end material pressing unit may be configured to press the end material S2 remaining at the edge of the unit substrate S1 adsorbed by the adsorption member 763. That is, when the unit substrate S1 is conveyed (vertically moved and horizontally moved) in a state adsorbed by the adsorption member 763, the other one of the first end material pressing unit and the second end material pressing unit is the unit substrate S1 It may be configured to press the end material (S2) remaining at the edge of the. At this time, when the presence of the cut material S2 at the edge of the unit substrate S1 is detected by the cut material detection sensor 90, the other one of the first cut material pressing part and the second cut material pressing part is the unit substrate ( The end material S2 remaining at the edge portion of S1) can be pressed.

In this way, since the end material S2 can be pressed together by using the push pin 772 and the gas injection nozzle 775, the end material S2 can be more reliably separated from the edge portion of the unit substrate S1. .

The substrate transfer head (60, 160, 260, 360, 460, 560, 760) according to the embodiment of the present invention, when adsorbing and moving the unit substrate (S1) in the first direction, the single material around the unit substrate (S1) By providing the end material pressing module (70, 170, 270, 370, 470, 570, 770) for applying a pressing force in a second direction opposite the first direction to (S2), the end material ( By separating S2) more easily and reliably, it is possible to prevent the end material S2 from remaining at the edge portion of the unit substrate S1. Accordingly, it is possible to prevent a problem in which the unit substrate S1 is conveyed to a subsequent process while the end material S2 remains at the edge portion of the unit substrate S1. In addition, during a process in which the unit substrate S1 is transported to a subsequent process, the end material S2 remaining at the edge of the unit substrate S1 may fall from an unintended location.

Although preferred embodiments of the present invention have been described exemplarily, the scope of the present invention is not limited to such specific embodiments, and may be appropriately changed within the scope described in the claims.

70, 170, 270, 370, 470, 570, 770: single material pressurization module
71, 771: push plate
72, 772: push pin
175, 275, 375, 475, 575, 775: gas injection nozzle
176, 276, 376, 476, 576, 776: gas source

Claims (6)

An adsorption member configured to adsorb the unit substrate divided from the mother substrate;
A plurality of push pins disposed to correspond to an area occupied by an end material positioned around the unit substrate; A push plate on which the plurality of push pins are installed; And a first end material pressing part including a push plate driver for moving the push plate so that the plurality of push pins press the end material. And
A gas injection nozzle configured to inject gas toward an edge portion of the unit substrate to pressurize the end material; And a second end material pressing part including a gas supply source configured to supply gas to the gas injection nozzle,
Any one of the first end material pressing unit and the second end material pressing unit is configured to press the end material before the adsorption member adsorbs the unit substrate or when the adsorption member adsorbs the unit substrate,
The other one of the first end material pressing unit and the second end material pressing unit is configured to press the end material remaining at the edge of the unit substrate adsorbed by the adsorption member. The method according to claim 1,
A substrate transfer head further comprising an end material detection sensor disposed on one side of the adsorption member and detecting whether the end material is present at an edge portion of the unit substrate adsorbed by the adsorption member. The method according to claim 1,
The substrate transfer head, wherein the gas injection nozzle is installed to be inclined with respect to a vertical axis orthogonal to the surface of the unit substrate so as to inject gas toward the end material in a direction in which the end material is spaced apart from the unit substrate. The method according to claim 1,
A substrate transfer head further comprising a nozzle rotator configured to adjust an inclination angle of the gas injection nozzle with respect to the vertical axis by rotating the gas injection nozzle about a horizontal axis perpendicular to a vertical axis perpendicular to the unit substrate. The method according to claim 1,
A substrate transfer head further comprising a gas temperature controller for controlling a temperature of a gas supplied from the gas supply source to the gas injection nozzle. The method according to claim 1,
The gas supply source supplies gas to the gas injection nozzle while periodically changing the pressure of the gas.

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